CN115047079A - Ultrasonic phased array rapid focusing method for multilayer composite board - Google Patents
Ultrasonic phased array rapid focusing method for multilayer composite board Download PDFInfo
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- CN115047079A CN115047079A CN202210986070.3A CN202210986070A CN115047079A CN 115047079 A CN115047079 A CN 115047079A CN 202210986070 A CN202210986070 A CN 202210986070A CN 115047079 A CN115047079 A CN 115047079A
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
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- G—PHYSICS
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- G01N2291/023—Solids
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/028—Material parameters
- G01N2291/0289—Internal structure, e.g. defects, grain size, texture
Abstract
The invention relates to an ultrasonic phased array rapid focusing method for a multilayer composite board, which is characterized in that an incident point R of an ultrasonic beam on the surface of the multilayer composite board is set 1 And obtaining the difference between the theoretical focusing point and the appointed focusing point through simple trigonometric function operation, and appointing the incidence point R again according to the difference 1 The actual incident point R is realized by the mode whether the horizontal coordinate range reaches the specified precision or not 1 And (4) obtaining. Then passes through the actual incident point R 1 The transmission time of the wafer and the relative delay time between the excitation signals of the wafers are obtained by the coordinate calculation, so that the delay excitation of the wafers is realized, and the aim of focusing the ultrasonic beam on a theoretical focus point is fulfilled. Compared with the existing calculation method, the method has the advantages that the ultrasonic beams emitted by the ultrasonic phased array are focused, the calculated amount is greatly simplified, and the focusing efficiency is higher.
Description
Technical Field
The invention relates to a focusing method of an ultrasonic phased array, in particular to a rapid focusing method of the ultrasonic phased array for a multilayer composite board.
Background
The concept of the ultrasonic phased array detection technology comes from the modern phased array radar technology, and the ultrasonic phased array detection technology can control ultrasonic beams to be synthesized by using multi-channel electron beams, so that different focusing or deflection forms of the synthesized beams are realized. The probe of the ultrasonic phased array is composed of a large number of piezoelectric ceramic wafers, and each wafer is independent from each other and can independently complete the transmission and the reception of ultrasonic waves. They are arranged according to a certain form to form a phased array ultrasonic transmitting and receiving array. The theoretical basis of the ultrasonic phased array detection technology is the Huygens Fresnel principle. According to the explanation of the principle, coherent waves can generate interference phenomena in the medium, thereby forming a stable sound field. Therefore, by controlling the time for generating the ultrasonic wave by each wafer in the phased array transducer, the ultrasonic wave can form a stable ultrasonic field, and the excitation pulse time of each wafer is accurately controlled (namely, each wafer is delayed to be de-excited according to a certain focusing algorithm), so that the ultrasonic field can realize the characteristics of focusing or deflection and the like.
At present, in the phased array ultrasonic flaw detection of a common single-layer plate, the system can conveniently calculate the pulse excitation delay time of each wafer through the positions of the wafers and the focus points so as to realize the accurate focusing of an ultrasonic wave array surface. However, in actual flaw detection, in order to protect the expensive phased array probe and change the effective coverage of the sound field of the probe, a wedge block is usually installed on the phased array probe. After the wedge block is additionally arranged, due to the fact that ultrasound refracts between the wedge block and a workpiece, the calculation formula of the excitation pulse time is complex, the direct solving difficulty is high, and the efficiency is low. The system can obtain an incidence point through dichotomy approximation, and then obtain the delay time of each wafer from the incidence point. For another example, the calculation method disclosed in chinese patent publication No. 106383171 entitled transverse wave full-focus ultrasonic imaging detection method for crack defects in steel plate welds is complex and inefficient.
In addition, for the multilayer composite board formed by parallel stacking and pressing of multilayer plates, due to different materials of each layer, ultrasonic waves can be sequentially refracted in each layer, the calculation difficulty of delay time is exponentially increased, for example, from a single-layer board to a k-layer board, and the upper bound of the time complexity of the conventional bisection method is defined by
Directly rise to
Thereby greatly reducing the flaw detection efficiency.
Disclosure of Invention
In order to solve the technical problems, the invention aims to provide a simple ultrasonic phased array rapid focusing method with high focusing efficiency for a multilayer composite board.
The invention relates to an ultrasonic phased array rapid focusing method for a multilayer composite board, which comprises the steps of attaching an ultrasonic phased array probe with a wedge block at the front end to the surface of the multilayer composite board, and the ultrasonic phased array rapid focusing method for the multilayer composite board further comprises the following steps;
s1, in the section of the multilayer composite board passing through the appointed focus point, taking the direction parallel to the surface of the multilayer composite board as the abscissa direction, and taking the direction vertical to the abscissa as the ordinate direction;
s2, selecting an incidence point R on the boundary line of the wedge block and the multilayer composite board in the section 1 Incident point R 1 Abscissa R of 1x In the range of
And is and
wherein the incident point R 1 For the point of incidence of the ultrasonic beam on the surface of the multilayer composite panel, E x Abscissa of point E of the wafer, F x The abscissa of the designated focus point F;
s3, taking incident point R 1 Has the coordinates of (R) 1x ，R 1y ) Wherein R is 1x =(R min +R max )/2，R 1y The longitudinal coordinate value of the surface of the multilayer composite board is equal to;
s4, according to the coordinate value of the wafer E and the incident point R in the step S3 1 Calculating the incident angle of the ultrasonic beam emitted by the wafer on the surface of the multilayer composite board
；
S5, from the incident angle obtained in the step S4
And calculating the refraction angle of the ultrasonic beam in the first laminate by the law of refraction
；
S6, the incident point R of the ultrasonic beam on the surface of the multilayer composite board in the step S3 1 The angle of refraction obtained in step S5
Calculating the incident point position of the ultrasonic beam on the surfaces of the second layer plate and the Nth layer plate and the refraction angle of the ultrasonic beam in the second layer plate and the Nth layer plate in sequence, wherein the Nth layer plate is a plate layer where the designated focus point is located;
s7, an incident point R of the ultrasonic beam on the surface of the Nth plate obtained in the step S6 N Angle of refraction
And the distance h between the designated focus point F and the surface of the Nth layer plate f Calculating the coordinate of a theoretical focusing point F';
s8, comparing the difference Delta between the specified focus point F and the theoretical focus point F' in the horizontal coordinate direction, wherein,
Δ=F x -
，
is the abscissa of the theoretical focus point F';
if Δ>0, reassigning the incident point R in step S2 1 Range of abscissa
；
If Δ<0, reassigning the incident point R in the step S2 1 Range of abscissa
；
If Δ =0, the incident point R in step S2 is reassigned 1 Range of abscissa
；
If abs (
) When the specified accuracy range is reached, the incident point R selected in step S3 is used 1 The coordinate of the ultrasonic beam is the actual incident point coordinate of the ultrasonic beam on the surface of the multilayer composite board, and the transmission time of the ultrasonic beam from the wafer position to the appointed focus point is calculated;
if abs (
) If the specified precision range is not reached, the incidence point R is used 1 The re-designated abscissa range repeats steps S3 through S8 until abs (S) ((S))
) Reaching the specified precision range;
wherein abs is an absolute value function;
s9, calculating the transmission time of the ultrasonic beams from the wafer position to the appointed focus point of all the wafers in the ultrasonic phased array according to the calculation method of the steps S2 to S8;
s10, acquiring the relative delay time between the pulse excitation signals of the wafers according to the transmission time of each wafer of the ultrasonic phased array;
s11, the ultrasonic phased array wafers are time-delayed and excited by the relative delay time acquired in the step S10 to achieve focusing.
Further, the method for rapidly focusing the ultrasonic phased array for the multilayer composite board of the invention comprises the following steps of sequentially calculating the incident point position of the ultrasonic beam on the surfaces of the second layer board to the Nth layer board and the refraction angle of the ultrasonic beam in the second layer board to the Nth layer board in step S6;
step S61 of obtaining incident point from incident point R n Angle of refraction
And the layer height h of the nth layer plate of the multilayer composite plate n Calculating the incident point R of the ultrasonic beam on the surface of the (n + 1) th layer plate of the multilayer composite plate n+1 ；
Step S62 of obtaining a refraction angle, an incident angle on the surface of the (n + 1) th layer plate by an ultrasonic beam
And calculating the refraction angle of the ultrasonic beam in the (n + 1) th layer plate according to the law of refraction
；
Wherein
=
Where N =1, 2 … … N, N is the nth plate where the specified focus point F is located.
The ultrasonic phased array rapid focusing method for the multilayer composite board has the advantage that the ultrasonic phased array rapid focusing method for the multilayer composite board is used for setting the incident point R of an ultrasonic beam on the surface of the multilayer composite board 1 And obtaining the difference between the theoretical focusing point and the appointed focusing point through simple trigonometric function operation, and appointing the incidence point R again according to the difference 1 The abscissa range of (a). Then whether the range of the abscissa reaches the specified precision or not realizes the actual incident point R 1 And (4) obtaining. Then passes through the actual incident point R 1 The transmission time of the wafer and the relative delay time between the excitation signals of the wafers are obtained by the coordinate calculation, so that the delay excitation of the wafers is realized, and the aim of focusing the ultrasonic beam on a theoretical focus point is fulfilled. Compared with the existing calculation method, the method has the advantages that the ultrasonic beams emitted by the ultrasonic phased array are focused, the calculated amount is greatly simplified, and the focusing efficiency is higher.
The above description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood and to implement the technical means in accordance with the content of the description, the embodiments of the present invention are described in detail below.
Drawings
FIG. 1 is a schematic illustration of the propagation of an ultrasonic beam within a multilayer composite panel;
FIG. 2 is a flow chart of the calculation of the wafer to specified focus transit time;
fig. 3 is a flow chart of the calculation of the relative excitation time.
Detailed Description
The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
Referring to fig. 1 to 3, the ultrasonic phased array fast focusing method for a multilayer composite board of the present embodiment includes a step of attaching an ultrasonic phased array probe having a wedge at a front end to a surface of the multilayer composite board, and further includes the following steps;
s1, in the section of the multilayer composite board passing through the appointed focus point, taking the direction parallel to the surface of the multilayer composite board as the abscissa direction, and taking the direction vertical to the abscissa as the ordinate direction;
in this embodiment, in the probe of the ultrasonic phased array, a plurality of crystals are arranged in a linear array on the cross section, and an ultrasonic beam emitted by each crystal is transmitted in the cross section and refracted by the wedge and the multilayer composite board to reach a focus point at a specified depth.
Wherein, the abscissa direction can be directly selected from the surfaces of the multilayer composite boards, and at the moment, the ordinate of the surfaces of the multilayer composite boards is 0; the origin of coordinates can be arranged at the joint of the bottom corner of the wedge block and the multilayer composite board.
S2, selecting an incidence point R on the boundary line of the wedge block and the multilayer composite board in the section 1 Incident point R 1 Abscissa R of 1x In the range of
And is and
wherein the incident point R 1 For the point of incidence of the ultrasonic beam on the surface of the multilayer composite panel, E x Is the abscissa of point E on the wafer, F x The abscissa of the designated focus point F;
according to the snell's law of refraction, the abscissa of all incident points should be located at the wafer E and the focus point
At a position in between, thus setting the point of incidence R here 1 Abscissa R of 1x Range
。
The coordinates of the wafer E are determined by the installation position of the ultrasonic phased array wafer and the attributes of the wedge block, and specific numerical values of the wafer E can be obtained according to product description, measurement or calculation and stored in a system memory.
The coordinates of the designated focusing point F are designated by a system during detection, the number of the layers of the plate where the system is located can be calculated through the thickness of each layer of the plate of the multilayer composite plate, and the description is omitted here.
S3, taking incident point R 1 Has the coordinates of (R) 1x ，R 1y ) Wherein R is 1x =(R min +R max )/2，R 1y Equal to the surface of the multilayer composite boardThe longitudinal coordinate value of the position;
here, R is 1x Is arranged as (R) min +R max ) 2, i.e. at the point of incidence R 1 Selecting a midpoint thereof as an incident point R within the range of the abscissa 1 The coordinates of (a).
When the abscissa is set on the surface of the multilayer composite board, R 1y =0；
S4, according to the coordinate value of the wafer E and the incident point R in the step S3 1 Calculating the incident angle of the ultrasonic beam emitted by the wafer on the surface of the multilayer composite board
；
Specifically, as can be seen from the arctan function,
=arctan( | R 1x -E x | ÷ |R 1y -E y | )。
s5, from the incident angle obtained in the step S4
And the law of refraction, calculating the refraction angle of the ultrasonic beam in the first laminate
；
In particular, angle of refraction
=arcsin(sin
N) where n is the relative refractive index of the first ply, which is determined by the particular type of sheet material.
S6, the incident point R of the ultrasonic beam on the surface of the multilayer composite board in the step S3 1 The angle of refraction obtained in step S5
And law of refraction, in turnCalculating the incident point position of the ultrasonic beam on the surfaces of the second layer plate and the Nth layer plate and the refraction angle of the ultrasonic beam in the second layer plate and the Nth layer plate, wherein the Nth layer plate is a plate layer where the designated focus point is located;
s7, an incident point R of the ultrasonic beam on the surface of the Nth plate obtained in the step S6 N Angle of refraction
And the distance h between the designated focus point F and the surface of the Nth layer plate f Calculating the coordinate of a theoretical focusing point F';
specifically, let the coordinate of the theoretical focus F' be: (
) Then, then
S8, comparing the difference delta between the specified focus point F and the theoretical focus point F' in the horizontal coordinate direction, wherein,
Δ=F x -
，
is the abscissa of the theoretical focus point F';
if Δ>0, reassigning the incident point R in step S2 1 Range of abscissa
；
Here,. DELTA.>0 means F x >
I.e. the calculated theoretical focus point is located at the left side of the designated focus point, the actual incident point R 1 The abscissa is necessarily located at the set incident point R 1 Between the abscissa and the abscissa of the designated focus point F, the incident point R set in the next round of calculation is set 1 Range of abscissa
。
If Δ<0, reassigning the incident point R in the step S2 1 Range of abscissa
；
Similarly, the actual point of incidence R at this time 1 The abscissa is necessarily located between the abscissa of the wafer E and the set incident point R 1 Between the abscissas, hence the incidence point R set in the next calculation round 1 Range of abscissa
。
If Δ =0, the incident point R in step S2 is reassigned 1 Range of abscissa
；
At this time, the actual incident point is set to be as set R 1 Coincident, thus set, incident point R 1 Range of abscissa
At this time abs: (
)=0。
If abs (
) When the specified accuracy range is reached, the incident point R selected in step S3 is used 1 The coordinate of the ultrasonic beam is the actual incident point coordinate of the ultrasonic beam on the surface of the multilayer composite board, and the transmission time of the ultrasonic beam from the wafer position to the appointed focus point is calculated;
the specific value of the transmission time can be obtained by removing the transmission speed of the ultrasonic beam in the wedge block or a certain layer of composite board, the value of the transmission speed is determined by the type of the medium, and the transmission distance can be calculated by trigonometric theory, which is not repeated herein.
If abs (
) If the specified precision range is not reached, the incidence point R is used 1 The re-designated abscissa range repeats steps S3 through S8 until abs (S) ((S))
) Reaching the specified precision range;
wherein abs is an absolute value function;
the specified precision range can be manually set according to the precision requirement of flaw detection, the flaw detection precision is usually less than 0.001mm, and the system can be manually adjusted according to the specific requirement in specific implementation.
S9, calculating the transmission time of the ultrasonic beams from the wafer position to the appointed focus point of all the wafers in the ultrasonic phased array according to the calculation method of the steps S2 to S8;
s10, acquiring the relative delay time between the pulse excitation signals of the wafers according to the transmission time of each wafer of the ultrasonic phased array;
the calculation of the relative delay time is based on that the ultrasonic beams emitted by each wafer can be stably interfered to form wave fronts with corresponding shapes and focus on the appointed focus point F, and the specific calculation process is a conventional technique in the field, and reference may be made to related documents such as "research on ultrasonic phased array sector scanning detection imaging technology" published by the university of harbinge industry, which is not described herein again.
S11, the ultrasonic phased array wafers are time-delayed and excited by the relative delay time acquired in the step S10 to achieve focusing.
The invention relates to an ultrasonic phased array rapid focusing method for a multilayer composite board, which is characterized in that an incident point R of an ultrasonic beam on the surface of the multilayer composite board is set 1 And obtaining the difference between the theoretical focusing point and the appointed focusing point through simple trigonometric function operation, and appointing the incidence point R again according to the difference 1 The abscissa range of (a). Then whether the range of the horizontal coordinate reaches the specified precision or not is judged, and the actual incident point R is realized 1 And (4) obtaining. Then passes through the actual incident point R 1 The transmission time of the wafer and the relative delay time between the excitation signals of the wafers are obtained by the coordinate calculation, so that the delay excitation of the wafers is realized, and the aim of focusing the ultrasonic beam on a theoretical focus point is fulfilled. Compared with the existing calculation method, the method has the advantages that the ultrasonic beams emitted by the ultrasonic phased array are focused, the calculated amount is greatly simplified, and the focusing efficiency is higher.
Preferably, in step S6, the method for calculating the incident point position of the ultrasonic beam on the surface of the second to nth plates and the refraction angle of the ultrasonic beam in the second to nth plates in sequence comprises the following steps;
step S61 of obtaining incident point from incident point R n Angle of refraction
And the layer height h of the nth layer plate of the multilayer composite plate n Calculating the incident point R of the ultrasonic beam on the surface of the (n + 1) th layer plate of the multilayer composite plate n+1 ；
Step S62 of obtaining a refraction angle, an incident angle on the surface of the (n + 1) th layer plate by an ultrasonic beam
And calculating the refraction angle of the ultrasonic beam in the (n + 1) th layer plate according to the law of refraction
；
Wherein
=
N =1, 2 … … N, where N is the nth layer plate where the designated focus point F is located;
the calculation methods of the incident point position and the refraction angle of the ultrasonic beam on the second layer plate to the Nth layer plate are similar, and the second layer plate is taken as an example.
From the point of incidence R 1 Angle of refraction
And the layer height h of the first laminate 1 Calculating the incident point R of the ultrasonic beam on the surface of the second layer plate of the multilayer composite plate 2 The method comprises the following steps:
R 2x =R 1x +h 1 × tan
,
R 2y =R 1y +h 1 ;
angle of incidence of ultrasonic beam on second layer plate surface
And calculating the refraction angle of the ultrasonic beam in the second laminate by the law of refraction
Because the upper and lower surfaces of each layer of the multilayer composite board are parallel, the multilayer composite board has the advantages of simple structure, low cost and high reliability
=
；
The calculation method from the third layer plate to the Nth layer plate is similar to that of the first layer plate, and the description is omitted here.
The above description is only a preferred embodiment of the present invention, which is used to assist those skilled in the art to implement the corresponding technical solutions, and is not used to limit the protection scope of the present invention, which is defined by the appended claims. It should be noted that, for those skilled in the art, on the basis of the technical solution of the present invention, several modifications and variations can be made equivalent thereto, and these modifications and variations should also be regarded as the protection scope of the present invention. Also, it should be understood that although the present description has been described in terms of the above embodiments, not every embodiment may include only a single embodiment, and such description is for clarity only, and those skilled in the art will recognize that the description is taken as a whole, and that the embodiments may be suitably combined to form other embodiments as will be appreciated by those skilled in the art.
Claims (2)
1. The ultrasonic phased array rapid focusing method for the multilayer composite board comprises the step of attaching an ultrasonic phased array probe with a wedge block at the front end to the surface of the multilayer composite board, and is characterized in that: the ultrasonic phased array rapid focusing method for the multilayer composite board further comprises the following steps;
s1, in the section of the multilayer composite board passing through the appointed focus point, taking the direction parallel to the surface of the multilayer composite board as the abscissa direction, and taking the direction vertical to the abscissa as the ordinate direction;
s2, selecting an incidence point R on the boundary line of the wedge block and the multilayer composite board in the section 1 Incident point R 1 Abscissa R of 1x In the range of
And is and
wherein the incident point R 1 For the point of incidence of the ultrasonic beam on the surface of the multilayer composite panel, E x Is the abscissa of point E on the wafer, F x The abscissa of the designated focus point F;
s3, taking incident point R 1 Has the coordinates of (R) 1x ，R 1y ) Wherein R is 1x =(R min +R max )/2，R 1y The longitudinal coordinate value of the surface of the multilayer composite board is equal to;
s4, according to the coordinate value of the wafer E and the incident point R in the step S3 1 Calculating the incident angle of the ultrasonic beam emitted by the wafer on the surface of the multilayer composite board
；
S5, from the incident angle obtained in the step S4
And calculating the refraction angle of the ultrasonic beam in the first laminate by the law of refraction
；
S6, the ultrasonic beam is incident on the surface of the multilayer composite board at the incident point R in the step S3 1 Coordinates of (d), the refraction angle acquired in step S5
Calculating the incident point position of the ultrasonic beam on the surfaces of the second layer plate and the Nth layer plate and the refraction angle of the ultrasonic beam in the second layer plate and the Nth layer plate in sequence, wherein the Nth layer plate is a plate layer where the designated focus point is located;
s7, an incident point R of the ultrasonic beam on the surface of the Nth plate obtained in the step S6 N Angle of refraction
And specifying the focal points F and NDistance h of the surface of the laminate f Calculating the coordinate of a theoretical focusing point F';
s8, comparing the difference delta between the specified focus point F and the theoretical focus point F' in the horizontal coordinate direction, wherein,
Δ=F x -
，
is the abscissa of the theoretical focus point F';
if Δ>0, reassigning the incident point R in the step S2 1 Range of abscissa
；
If Δ<0, reassigning the incident point R in the step S2 1 Range of abscissa
；
If Δ =0, the incident point R in step S2 is reassigned 1 Range of abscissa of
；
If abs (
) When the specified accuracy range is reached, the incident point R selected in step S3 is used 1 The coordinate of the ultrasonic beam is the actual incident point coordinate of the ultrasonic beam on the surface of the multilayer composite board, and the transmission time of the ultrasonic beam from the wafer position to the appointed focus point is calculated;
if abs: (
) If the specified precision range is not reached, the incidence point R is used 1 The re-designated abscissa range repeats steps S3 to S8,up to abs: (
) Reaching the specified precision range;
wherein abs is an absolute value function;
s9, calculating the transmission time of the ultrasonic beams from the wafer position to the appointed focus point of all the wafers in the ultrasonic phased array according to the calculation method of the steps S2 to S8;
s10, acquiring the relative delay time between the pulse excitation signals of the wafers according to the transmission time of each wafer of the ultrasonic phased array;
s11, the ultrasonic phased array wafers are time-delayed and excited by the relative delay time acquired in the step S10 to achieve focusing.
2. The ultrasonic phased array rapid focusing method for the multilayer composite board according to claim 1, characterized in that: in step S6, a method of sequentially calculating the incident point position of the ultrasonic beam on the surface of the second to nth plates and the refraction angle of the ultrasonic beam in the second to nth plates includes the following steps;
step S61 of obtaining incident point from incident point R n Angle of refraction
And the layer height h of the nth layer plate of the multilayer composite plate n Calculating the incident point R of the ultrasonic beam on the surface of the (n + 1) th layer plate of the multilayer composite plate n+1 ；
Step S62 of obtaining a refraction angle, an incident angle on the surface of the (n + 1) th layer plate by an ultrasonic beam
And calculating the refraction angle of the ultrasonic beam in the (n + 1) th layer plate according to the law of refraction
，
Wherein
=
N =1, 2 … … N, N being the nth layer plate where the specified focus point F is located.
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| CN111855809A (en) * | 2020-07-20 | 2020-10-30 | 大连理工大学 | Crack morphology reconstruction method based on compound mode full focusing |
| CN113049092A (en) * | 2021-03-26 | 2021-06-29 | 中北大学 | Method and system for calculating radiation sound field of ultrasonic array radiator under constraint condition |
| CN113899816A (en) * | 2021-09-10 | 2022-01-07 | 国营芜湖机械厂 | Ultrasonic nondestructive testing device and method for T-shaped composite structure and R-region testing method and device |
| CN114430106A (en) * | 2022-01-05 | 2022-05-03 | 航天恒星科技有限公司 | Sub-array assembly of phased array antenna and phased array antenna |
| CN114674928A (en) * | 2022-03-21 | 2022-06-28 | 大连理工大学 | Method for suppressing blind area in ultrasonic TOFD (time of flight diffraction) detection of thin plate structure based on second-order mode wave |
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