CN115047079B - Ultrasonic phased array rapid focusing method for multilayer composite board - Google Patents
Ultrasonic phased array rapid focusing method for multilayer composite board Download PDFInfo
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- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
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Abstract
The invention relates to an ultrasonic phased array rapid focusing method for a multilayer composite board, which is characterized in that an incident point R of an ultrasonic beam on the surface of the multilayer composite board is set 1 And obtaining by simple trigonometric function operationThe difference between the theoretical focus point and the designated focus point is used for re-designating the incidence point R 1 The actual incident point R is realized by the mode whether the horizontal coordinate range reaches the specified precision or not 1 And (4) obtaining. Then passes through the actual incident point R 1 The transmission time of the wafer and the relative delay time between the excitation signals of the wafers are obtained by the coordinate calculation, so that the delay excitation of the wafers is realized, and the aim of focusing the ultrasonic beam on a theoretical focus point is fulfilled. Compared with the existing calculation method, the method has the advantages that the ultrasonic beams emitted by the ultrasonic phased array are focused, the calculated amount is greatly simplified, and the focusing efficiency is higher.
Description
Technical Field
The invention relates to a focusing method of an ultrasonic phased array, in particular to a rapid focusing method of the ultrasonic phased array for a multilayer composite board.
Background
The concept of the ultrasonic phased array detection technology comes from the modern phased array radar technology, and the ultrasonic phased array detection technology can control ultrasonic beams to be synthesized by using multi-channel electron beams, so that different focusing or deflection forms of the synthesized beams are realized. The probe of the ultrasonic phased array is composed of a large number of piezoelectric ceramic wafers, and each wafer is independent from each other and can independently complete the transmission and the reception of ultrasonic waves. They are arranged according to a certain form to form a phased array ultrasonic transmitting and receiving array. The theoretical basis of the ultrasonic phased array detection technology is the Huygens Fresnel principle. According to the explanation of the principle, coherent waves can generate interference phenomena in the medium, thereby forming a stable sound field. Therefore, by controlling the time for generating the ultrasonic wave by each wafer in the phased array transducer, the ultrasonic wave can form a stable ultrasonic field, and the excitation pulse time of each wafer is accurately controlled (namely, each wafer is delayed to be de-excited according to a certain focusing algorithm), so that the ultrasonic field can realize the characteristics of focusing or deflection and the like.
At present, in the phased array ultrasonic flaw detection of a common single-layer plate, the system can conveniently calculate the pulse excitation delay time of each wafer through the positions of the wafers and the focus points so as to realize the accurate focusing of an ultrasonic wave array surface. However, in actual flaw detection, in order to protect the expensive phased array probe and change the effective coverage area of the sound field of the probe, a wedge block is usually installed on the phased array probe. After the wedge block is additionally arranged, due to the fact that ultrasound refracts between the wedge block and a workpiece, the calculation formula of the excitation pulse time is complex, the direct solving difficulty is high, and the efficiency is low. The system can obtain an incidence point through dichotomy approximation, and then obtain the delay time of each wafer from the incidence point. For another example, the calculation method disclosed in chinese patent No. 106383171 entitled transverse wave full-focus ultrasonic imaging detection method for crack defects in steel plate welds is complex and inefficient.
In addition, for the multilayer composite board formed by parallel stacking and pressing of multilayer plates, due to different materials of each layer, ultrasonic waves can be sequentially refracted in each layer, the calculation difficulty of delay time is exponentially increased, for example, from a single-layer board to a k-layer board, and the upper bound of the time complexity of the conventional bisection method is defined byDirectly rise toThereby greatly reducing the flaw detection efficiency.
Disclosure of Invention
In order to solve the technical problems, the invention aims to provide a simple ultrasonic phased array rapid focusing method with high focusing efficiency for a multilayer composite board.
The invention relates to an ultrasonic phased array rapid focusing method for a multilayer composite board, which comprises the steps of attaching an ultrasonic phased array probe with a wedge block at the front end to the surface of the multilayer composite board, and the ultrasonic phased array rapid focusing method for the multilayer composite board further comprises the following steps;
s1, in a section of a multilayer composite board passing through a specified focus point, taking a direction parallel to the surface of the multilayer composite board as an abscissa direction and taking a direction vertical to the abscissa as an ordinate direction;
s2, selecting an incident point R on a boundary line of the wedge block and the multilayer composite board in the section 1 Incident point R 1 Abscissa R of 1x In the range ofAnd are each and everyWherein the incident point R 1 For the point of incidence of the ultrasonic beam on the surface of the multilayer composite panel, E x Is the abscissa of point E on the wafer, F x The abscissa of the designated focus point F;
s3, taking an incident point R 1 Has the coordinates of (R) 1x ,R 1y ) Wherein R is 1x =(R min +R max )/2,R 1y The longitudinal coordinate value of the surface of the multilayer composite board is equal to;
s4, according to the coordinate value of the wafer E and the incident point R in the step S3 1 Calculating the incident angle of the ultrasonic beam emitted by the wafer on the surface of the multilayer composite board;
S5, obtaining the incidence angle in the step S4And calculating the refraction angle of the ultrasonic beam in the first laminate according to the law of refraction;
S6, performing ultrasound in the step S3Incident point R of beam on surface of multilayer composite board 1 The refraction angle obtained in the step S5Calculating the incident point position of the ultrasonic beam on the surfaces of the second layer plate and the Nth layer plate and the refraction angle of the ultrasonic beam in the second layer plate and the Nth layer plate in sequence, wherein the Nth layer plate is a plate layer where a designated focus point is located;
s7, the incident point R of the ultrasonic beam on the surface of the Nth layer plate obtained in the step S6 N Angle of refractionAnd the distance h between the designated focus point F and the surface of the Nth layer plate f Calculating the coordinate of a theoretical focusing point F';
s8, comparing the difference delta between the specified focus point F and the theoretical focus point F' in the horizontal coordinate direction, wherein,
If abs() When the specified precision range is reached, the incidence point R selected in the step S3 is used 1 The coordinate of the ultrasonic beam is the actual incident point coordinate of the ultrasonic beam on the surface of the multilayer composite board, and the transmission time of the ultrasonic beam from the wafer position to the appointed focus point is calculated;
if abs () If the specified precision range is not reached, the incidence point R is used 1 Repeating steps S3 to S8 for the re-designated abscissa range until abs: () Reaching the specified precision range;
wherein abs is an absolute value function;
s9, calculating the transmission time from the wafer position to the appointed focus point of the ultrasonic beams emitted by all the wafers in the ultrasonic phased array according to the calculation method of the steps S2 to S8;
s10, acquiring relative delay time between pulse excitation signals of each wafer according to the transmission time of each wafer of the ultrasonic phased array;
and S11, carrying out time delay excitation on each wafer of the ultrasonic phased array by the relative delay time acquired in the step S10 so as to realize focusing.
Further, the ultrasonic phased array rapid focusing method for the multilayer composite board of the invention, in step S6, the method for calculating the incident point position of the ultrasonic beam on the surface of the second layer board to the Nth layer board and the refraction angle of the ultrasonic beam in the second layer board to the Nth layer board in sequence comprises the following steps;
step S61 of obtaining an incidence point from the incidence point R n Angle of refractionAnd the layer height h of the nth layer plate of the multilayer composite plate n Calculating the incident point R of the ultrasonic beam on the surface of the (n + 1) th layer plate of the multilayer composite plate n+1 ;
Step S62 of obtaining a refraction angle, an incident angle on the surface of the (n + 1) th layer plate by the ultrasonic beamAnd calculating the refraction angle of the ultrasonic beam in the (n + 1) th layer plate according to the law of refraction;
Wherein=And N =1,2 … … N, where N is the nth layer plate where the specified focus point F is located.
The ultrasonic phased array rapid focusing method for the multilayer composite board has the advantage that the ultrasonic phased array rapid focusing method for the multilayer composite board is used for setting the incident point R of an ultrasonic beam on the surface of the multilayer composite board 1 And acquiring the difference between the theoretical focusing point and the appointed focusing point through simple trigonometric function operation, and appointing the incidence point R again according to the difference 1 The abscissa range of (a). Then whether the range of the abscissa reaches the specified precision or not realizes the actual incident point R 1 And (4) obtaining. Then passes through the actual incident point R 1 The transmission time of the wafer and the relative delay time between the excitation signals of the wafers are obtained by calculating the coordinates of the ultrasonic probe, so that the delay excitation of the wafers is realized, and the aim of focusing the ultrasonic beam on a theoretical focus point is fulfilled. Compared with the existing calculation method, the method has the advantages that the ultrasonic beams emitted by the ultrasonic phased array are focused, the calculated amount is greatly simplified, and the focusing efficiency is higher.
The above description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood and to embody the technical means in accordance with the content of the description, the embodiments of the present invention are described in detail below.
Drawings
FIG. 1 is a schematic illustration of the propagation of an ultrasonic beam within a multilayer composite panel;
FIG. 2 is a flow chart of the calculation of the wafer to specified focus transit time;
fig. 3 is a flow chart of the calculation of the relative excitation time.
Detailed Description
The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
Referring to fig. 1 to 3, the ultrasonic phased array fast focusing method for a multilayer composite board of the present embodiment includes a step of attaching an ultrasonic phased array probe having a wedge at a front end to a surface of the multilayer composite board, and further includes the following steps;
s1, in a section of a multilayer composite board passing through a specified focus point, taking a direction parallel to the surface of the multilayer composite board as an abscissa direction and taking a direction vertical to the abscissa as an ordinate direction;
in this embodiment, in the probe of the ultrasonic phased array, a plurality of crystals are arranged in a linear array on the cross section, and an ultrasonic beam emitted by each crystal is transmitted in the cross section and refracted by the wedge and the multilayer composite board to reach a focus point at a specified depth.
Wherein, the abscissa direction can be directly selected from the surfaces of the multilayer composite boards, and at the moment, the ordinate of the surfaces of the multilayer composite boards is 0; the origin of coordinates can be arranged at the joint of the bottom corner of the wedge block and the multilayer composite board.
S2, selecting an incident point R on a boundary line of the wedge block and the multilayer composite board in the section 1 Incident point R 1 Abscissa R of 1x In the range ofAnd is andwherein the incident point R 1 For the point of incidence of the ultrasonic beam on the surface of the multilayer composite panel, E x Is the abscissa of point E on the wafer, F x The abscissa of the designated focus point F;
according to the snell's law of refraction, the abscissa of all incident points should be located at the wafer E and the focus pointAt a position in between, thus setting the point of incidence R here 1 Abscissa R of 1x Range。
The coordinates of the wafer E are determined by the installation position of the ultrasonic phased array wafer and the properties of the wedge block, and specific numerical values can be obtained according to product description, measurement or calculation and stored in a system memory.
The coordinates of the designated focusing point F are designated by a system during detection, the number of the layers of the plate where the system is located can be calculated through the thickness of each layer of the plate of the multilayer composite plate, and the description is omitted here.
S3, taking an incident point R 1 Has the coordinates of (R) 1x ,R 1y ) Wherein R is 1x =(R min +R max )/2,R 1y The longitudinal coordinate value of the surface of the multilayer composite board is equal to;
here, R is 1x Is arranged as (R) min +R max ) 2, i.e. at the point of incidence R 1 Selecting a midpoint thereof as an incident point R within the range of the abscissa 1 The coordinates of (a).
When the abscissa is set on the surface of the multilayer composite board, R 1y =0;
S4, according to the coordinate value of the wafer E and the incident point R in the step S3 1 Calculating the incident angle of the ultrasonic beam emitted by the wafer on the surface of the multilayer composite board;
s5, obtaining the incidence angle in the step S4And the law of refraction, calculating the refraction angle of the ultrasonic beam in the first laminate;
In particular, angle of refraction=arcsin(sinN) where n is the relative refractive index of the first ply, which is determined by the particular type of sheet material.
S6, the incident point R of the ultrasonic beam on the surface of the multilayer composite board in the step S3 1 The refraction angle obtained in step S5Calculating the incident point position of the ultrasonic beam on the surfaces of the second layer plate and the Nth layer plate and the refraction angle of the ultrasonic beam in the second layer plate and the Nth layer plate in sequence, wherein the Nth layer plate is a plate layer where the designated focus point is located;
s7, the incident point R of the ultrasonic beam on the surface of the Nth layer plate obtained in the step S6 N Angle of refractionAnd the distance h between the designated focus point F and the surface of the Nth layer plate f Calculating the coordinate of a theoretical focusing point F';
S8, comparing the difference delta between the specified focus point F and the theoretical focus point F' in the horizontal coordinate direction, wherein,
Here,. DELTA.>0 means F x >I.e. the calculated theoretical focus point is located at the left side of the designated focus point, the actual incident point R 1 The abscissa is necessarily located at the set incident point R 1 Between the abscissa and the abscissa of the designated focus point F, the incident point R set in the next round of calculation is set 1 Range of abscissa。
Similarly, the actual point of incidence R at this time 1 The abscissa is necessarily located between the abscissa of the wafer E and the set incident point R 1 Between the abscissas, hence the incidence point R set in the next calculation round 1 Range of abscissa。
At this time, the actual incident point is set to be R 1 Coincident, thus set, incident point R 1 Range of abscissaAt this time abs: ()=0。
If abs () When the specified precision range is reached, the incidence point R selected in the step S3 is used 1 The coordinate of the ultrasonic beam is the actual incident point coordinate of the ultrasonic beam on the surface of the multilayer composite board, and the transmission time of the ultrasonic beam from the wafer position to the appointed focus point is calculated;
the specific value of the transmission time can be obtained by removing the transmission speed of the ultrasonic beam in the wedge block or a certain layer of composite board, the value of the transmission speed is determined by the type of the medium, and the transmission distance can be calculated by trigonometric theory, which is not repeated herein.
If abs () If the specified precision range is not reached, the incidence point R is used 1 Repeating step S for the reassigned abscissa range3 to S8, up to abs: () Reaching the specified precision range;
wherein abs is an absolute value function;
the specified precision range can be manually set according to the precision requirement of flaw detection, the flaw detection precision is usually less than 0.001mm, and the system can be manually adjusted according to the specific requirement in specific implementation.
S9, calculating the transmission time from the wafer position to the appointed focus point of the ultrasonic beams emitted by all the wafers in the ultrasonic phased array according to the calculation method of the steps S2 to S8;
s10, acquiring relative delay time between pulse excitation signals of each wafer according to the transmission time of each wafer of the ultrasonic phased array;
the calculation of the relative delay time is based on that the ultrasonic beams emitted by each wafer can be stably interfered to form wave fronts with corresponding shapes and focus on the appointed focus point F, and the specific calculation process is a conventional technique in the field, and reference may be made to related documents such as "research on ultrasonic phased array sector scanning detection imaging technology" published by the university of harbinge industry, which is not described herein again.
And S11, carrying out time delay excitation on each wafer of the ultrasonic phased array by the relative delay time acquired in the step S10 so as to realize focusing.
The invention relates to an ultrasonic phased array rapid focusing method for a multilayer composite board, which is characterized in that an incident point R of an ultrasonic beam on the surface of the multilayer composite board is set 1 And acquiring the difference between the theoretical focusing point and the appointed focusing point through simple trigonometric function operation, and appointing the incidence point R again according to the difference 1 The abscissa range of (a). Then whether the range of the horizontal coordinate reaches the specified precision or not is judged, and the actual incident point R is realized 1 And (4) obtaining. Then passes through the actual incident point R 1 The transmission time of the wafer and the relative delay time between the excitation signals of the wafers are obtained by the coordinate calculation, so that the delay excitation of the wafers is realized, and the aim of focusing the ultrasonic beam on a theoretical focus point is fulfilled. Compared with the prior calculation method, byThe method focuses the ultrasonic beams emitted by the ultrasonic phased array, greatly simplifies the calculated amount and has higher focusing efficiency.
Preferably, in step S6, the method for sequentially calculating the incident point position of the ultrasonic beam on the surface of the second to nth plates and the refraction angle of the ultrasonic beam in the second to nth plates comprises the following steps;
step S61 of obtaining an incidence point from the incidence point R n Angle of refractionAnd the layer height h of the nth layer plate of the multilayer composite plate n Calculating the incident point R of the ultrasonic beam on the surface of the (n + 1) th layer plate of the multilayer composite plate n+1 ;
Step S62 of obtaining the angle of refraction, the angle of incidence on the surface of the (n + 1) -th plate by the ultrasonic beamAnd calculating the refraction angle of the ultrasonic beam in the (n + 1) th layer plate according to the law of refraction;
the calculation method of the incident point position and the refraction angle of the ultrasonic beam on the second layer plate to the Nth layer plate is similar, and the second layer plate is taken as an example here.
From the point of incidence R 1 Angle of refractionAnd the layer height h of the first laminate 1 Calculating the incident point R of the ultrasonic beam on the surface of the second layer plate of the multilayer composite plate 2 The method comprises the following steps:
R 2y =R 1y +h 1 ;
angle of incidence on the second laminate surface by ultrasonic beamAnd calculating the refraction angle of the ultrasonic beam in the second laminate by the law of refractionBecause the upper and lower surfaces of each layer of the multilayer composite board are parallel, the multilayer composite board has the advantages of simple structure, low cost and high reliability=;
The calculation method from the third layer plate to the Nth layer plate is similar to that of the first layer plate, and the description is omitted here.
The above description is only a preferred embodiment of the present invention, which is used to assist those skilled in the art to implement the corresponding technical solutions, and is not used to limit the protection scope of the present invention, which is defined by the appended claims. It should be noted that, for those skilled in the art, on the basis of the technical solution of the present invention, several equivalent improvements and modifications can be made, and these improvements and modifications should also be considered as the protection scope of the present invention. Meanwhile, it should be understood that although the present specification is described in terms of the above embodiments, not every embodiment includes only one independent technical solution, and such description of the specification is only for clarity, and those skilled in the art should make the specification as a whole, and technical solutions of various embodiments may also be appropriately combined to form other embodiments that can be understood by those skilled in the art.
Claims (2)
1. The ultrasonic phased array rapid focusing method for the multilayer composite board comprises the step of attaching an ultrasonic phased array probe with a wedge block at the front end to the surface of the multilayer composite board, and is characterized in that: the ultrasonic phased array rapid focusing method for the multilayer composite board further comprises the following steps;
s1, in a section of a multilayer composite board passing through a specified focus point, taking a direction parallel to the surface of the multilayer composite board as an abscissa direction and taking a direction vertical to the abscissa as an ordinate direction;
s2, selecting an incident point R on a boundary line of the wedge block and the multilayer composite board in the section 1 Incident point R 1 Abscissa R of 1x In the range ofAnd is andwherein the incident point R 1 For the point of incidence of the ultrasonic beam on the surface of the multilayer composite panel, E x Is the abscissa of point E on the wafer, F x The abscissa of the designated focus point F;
s3, taking an incident point R 1 Has the coordinates of (R) 1x ,R 1y ) Wherein R is 1x =(R min +R max )/2,R 1y The longitudinal coordinate value of the surface of the multilayer composite board is equal to;
s4, according to the coordinate value of the wafer E and the incident point R in the step S3 1 Calculating the incident angle of the ultrasonic beam emitted by the wafer on the surface of the multilayer composite board;
S5, obtaining the incidence angle in the step S4And calculating the refraction angle of the ultrasonic beam in the first laminate by the law of refraction;
S6, the incident point R of the ultrasonic beam on the surface of the multilayer composite board in the step S3 1 Coordinates of (2), angle of refraction obtained in step S5Calculating the incident point position of the ultrasonic beam on the surfaces of the second layer plate and the Nth layer plate and the refraction angle of the ultrasonic beam in the second layer plate and the Nth layer plate in sequence, wherein the Nth layer plate is a plate layer where the designated focus point is located;
s7, the incident point R of the ultrasonic beam on the surface of the Nth layer plate obtained in the step S6 N Angle of refractionAnd specifying the distance h between the focus point F and the surface of the Nth layer plate f Calculating the coordinate of a theoretical focusing point F';
s8, comparing the difference delta between the appointed focusing point F and the theoretical focusing point F' in the horizontal coordinate direction, wherein,
If abs () When the specified precision range is reached, the incidence point R selected in the step S3 is used 1 The coordinate of the ultrasonic beam is the actual incident point coordinate of the ultrasonic beam on the surface of the multilayer composite board, and the transmission time of the ultrasonic beam from the wafer position to the appointed focus point is calculated;
if abs () If the specified precision range is not reached, the incidence point R is used 1 Repeating steps S3 to S8 for the reassigned range of abscissas until abs: () Reaching the specified precision range;
wherein abs is an absolute value function;
s9, calculating the transmission time from the wafer position to the appointed focus point of the ultrasonic beams emitted by all the wafers in the ultrasonic phased array according to the calculation method of the steps S2 to S8;
s10, acquiring relative delay time between pulse excitation signals of each wafer according to the transmission time of each wafer of the ultrasonic phased array;
and S11, carrying out time delay excitation on each wafer of the ultrasonic phased array by the relative delay time acquired in the step S10 so as to realize focusing.
2. The ultrasonic phased array rapid focusing method for the multilayer composite board according to claim 1, characterized in that: in the step S6, the method for sequentially calculating the incident point position of the ultrasonic beam on the surfaces of the second layer plate to the Nth layer plate and the refraction angle of the ultrasonic beam in the second layer plate to the Nth layer plate comprises the following steps;
step S61 of obtaining an incidence point from the incidence point R n Angle of refractionAnd the layer height h of the nth layer plate of the multilayer composite plate n Calculating the incident point R of the ultrasonic beam on the surface of the (n + 1) th layer plate of the multilayer composite plate n+1 ;
Step S62 of obtaining the angle of refraction, the angle of incidence on the surface of the (n + 1) -th plate by the ultrasonic beamAnd calculating the refraction angle of the ultrasonic beam in the (n + 1) th layer plate according to the law of refraction,
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