CN210296634U - Multi-channel amplitude-phase processing packaging chip and phased array antenna mechanism - Google Patents
Multi-channel amplitude-phase processing packaging chip and phased array antenna mechanism Download PDFInfo
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- CN210296634U CN210296634U CN201920717733.5U CN201920717733U CN210296634U CN 210296634 U CN210296634 U CN 210296634U CN 201920717733 U CN201920717733 U CN 201920717733U CN 210296634 U CN210296634 U CN 210296634U
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Abstract
The utility model discloses a multichannel amplitude-phase processing packaging chip and phased array antenna mechanism, form multichannel amplitude-phase processing packaging chip by adopting packaging watchcase packaging with multichannel amplitude-phase processing chip on the microwave substrate, thereby realize that a plurality of signals belonging to a plurality of frequency band intervals are respectively independent to carry out amplitude-phase regulation and control processing, power division synthesis processing, amplification processing and the like through a small-volume integrated circuit board, and the multichannel amplitude-phase processing packaging chip has the technical effect of greatly simplifying the laying complexity of a plurality of signal processing circuits; meanwhile, according to the technical scheme in the embodiment of the application, a plurality of basic modules of the phased array antenna, such as the antenna module, the feed network, the multi-channel amplitude-phase processing packaging chip, the radio frequency interface connector and the like, are integrated on one dielectric substrate, and a reasonable and compact layout scheme is adopted, so that the effects of further reducing the weight and the volume of the phased array antenna system are achieved, and the technical effects of improving the integration level and the electrical performance of the phased array antenna are achieved.
Description
Technical Field
The utility model relates to a millimeter wave frequency channel antenna technical field especially relates to a multichannel amplitude and phase is handled and is packaged chip and phased array antenna mechanism.
Background
A conventional phased array antenna system includes an antenna unit, an amplitude and phase modulation unit (amplitude and phase processing unit), an amplification unit, a feed unit, a wave control unit, and the like. The phased array antenna has the advantages that not only are the number of components large, but also the number of various interfaces such as radio frequency interfaces, control interfaces, power supply interfaces and the like are large, but due to the fact that the layout space of the phased array antenna is limited, in the traditional technology, only independent circuit channels can be designed for different signals, and corresponding signal processing work such as amplitude and phase processing, power division processing, frequency modulation processing and the like can be conducted on the signals. Therefore, the traditional phased array antenna has the defects of complex interface layout, complex structure, large volume and weight, high assembly difficulty and high cost, and not only limits the application of the phased array antenna in a limited space environment, but also limits the improvement of the whole electrical performance of the phased array antenna.
Therefore, in the prior art, the layout structure of each component module of the phased array antenna system is complex and unreasonable, and the development of the phased array antenna towards light and high performance is limited, so that the technical problem that the application cost of the phased array antenna is high is solved.
SUMMERY OF THE UTILITY MODEL
The application provides a encapsulation chip and phased array antenna mechanism are handled to multichannel amplitude and phase for it is complicated to solve each subassembly module layout structure that has phased array antenna system among the prior art, and layout structure is unreasonable, has restricted phased array antenna towards the direction development of light-dutyization, high performance, and the application cost that causes phased array antenna from this is in the high technical problem.
The application provides in a first aspect a multi-channel amplitude and phase processing packaged chip, including:
the microwave substrate is internally provided with a feed circuit;
the multi-channel amplitude and phase processing chip is arranged on the surface of the microwave substrate and is electrically connected with the feed circuit, wherein the multi-channel amplitude and phase processing chip can simultaneously carry out power division processing, and/or digital control processing and/or amplification processing on signals in different frequency ranges through a plurality of signal processing channels;
the packaging meter shell is arranged on the microwave substrate and forms a sealed cavity structure with the microwave substrate in an enclosing mode, and the multichannel amplitude-phase processing chip is located in the cavity structure.
Optionally, the package casing is a ceramic material.
Optionally, a plastic packaging layer for wrapping the multi-channel amplitude-phase processing chip is further arranged in the packaging watchcase, wherein the distance between the plastic packaging layer and the packaging watchcase is smaller than or equal to a preset distance, or the plastic packaging layer fills the inside of the cavity structure.
Optionally, the multi-channel amplitude-phase processing chip is configured to implement electrical interconnection between the plurality of signal processing channels and the feed path by using a flip chip bonding process.
A second aspect of the application provides a phased array antenna mechanism comprising:
a multilayer microwave substrate;
an antenna module disposed on one side surface of the multi-layered microwave substrate;
at least two multi-channel amplitude and phase processing packaging chips according to the first aspect, which are arranged on the other side surface of the multilayer microwave substrate opposite to the antenna module;
the feed network is arranged in the inner layer of the multilayer microwave substrate and is respectively connected with the multichannel amplitude-phase processing packaging chip and the antenna module through a vertical through hole arranged in the multilayer microwave substrate;
and the radio frequency interface connector is arranged on the multilayer microwave substrate, is connected with the multichannel amplitude-phase processing packaging chip and the antenna module through the feed network and is used for receiving and transmitting radio frequency signals.
Optionally, the antenna mechanism further comprises:
and the at least two beam control modules are arranged on the multilayer microwave substrate and connected with the feed network, and are used for respectively supplying power to the corresponding multichannel amplitude-phase processing packaging chips and sending out numerical control signals, so that the corresponding multichannel amplitude-phase processing packaging chips control radio-frequency signal beams to generate required phase amplitude in a mode corresponding to the numerical control signals.
Optionally, the feed network comprises:
the power division and synthesis structure is used for performing power division or synthesis on the passed signals to obtain corresponding power-divided multipath signals or synthesized multipath signals.
Optionally, the at least two beam control modules are arranged at the edge of the side of the multi-channel amplitude-phase processing packaged chip in an equidistant manner.
Optionally, the antenna module is a microstrip antenna.
One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:
according to the technical scheme, the multichannel amplitude-phase processing chip is packaged on the microwave substrate by adopting the packaging meter shell to form the multichannel amplitude-phase processing packaging chip, so that amplitude-phase regulation and control processing, power division synthesis processing, amplification processing and the like are respectively and independently performed on a plurality of signals belonging to a plurality of frequency band intervals by using a small-size integrated circuit board, and the technical effect of greatly simplifying the laying complexity of a plurality of signal processing circuits is achieved; meanwhile, according to the technical scheme in the embodiment of the application, a plurality of basic modules of the phased array antenna, such as the antenna module, the feed network, the multi-channel amplitude-phase processing packaging chip, the radio frequency interface connector and the like, are integrated on one dielectric substrate, and a reasonable and compact layout scheme is adopted, so that the effects of further reducing the weight and the volume of the phased array antenna system are achieved, and the technical effects of improving the integration level and the electrical performance of the phased array antenna are achieved.
Drawings
Fig. 1 is a structural diagram of a multi-channel amplitude-phase processing packaged chip according to an embodiment of the present invention;
fig. 2 is a structural diagram of a chip-located surface of a phased array antenna mechanism according to an embodiment of the present invention;
fig. 3 is a structural diagram of a plane where an antenna module of a phased array antenna mechanism according to an embodiment of the present invention is located.
Detailed Description
The application provides a encapsulation chip and phased array antenna mechanism are handled to multichannel amplitude and phase for it is complicated to solve each subassembly module layout structure that has phased array antenna system among the prior art, and layout structure is unreasonable, has restricted phased array antenna towards the direction development of light-dutyization, high performance, and the application cost that causes phased array antenna from this is in the high technical problem.
In order to solve the technical problems, the general idea of the embodiment of the application is as follows:
according to the technical scheme, the multichannel amplitude-phase processing chip is packaged on the microwave substrate by adopting the packaging meter shell to form the multichannel amplitude-phase processing packaging chip, so that amplitude-phase regulation and control processing, power division synthesis processing, amplification processing and the like are respectively and independently performed on a plurality of signals belonging to a plurality of frequency band intervals by using a small-size integrated circuit board, and the technical effect of greatly simplifying the laying complexity of a plurality of signal processing circuits is achieved; meanwhile, according to the technical scheme in the embodiment of the application, a plurality of basic modules of the phased array antenna, such as the antenna module, the feed network, the multi-channel amplitude-phase processing packaging chip, the radio frequency interface connector and the like, are integrated on one dielectric substrate, and a reasonable and compact layout scheme is adopted, so that the effects of further reducing the weight and the volume of the phased array antenna system are achieved, and the technical effects of improving the integration level and the electrical performance of the phased array antenna are achieved.
The technical solutions of the present application are described in detail below with reference to the drawings and specific embodiments, and it should be understood that the specific features in the embodiments and examples of the present application are detailed descriptions of the technical solutions of the present application, and are not limitations of the technical solutions of the present application, and the technical features in the embodiments and examples of the present application may be combined with each other without conflict.
The term "and/or" herein is merely an association describing an associated object, meaning that three relationships may exist, e.g., a and/or B, may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.
Example one
Referring to fig. 1, an embodiment of the present application provides a multi-channel amplitude-phase processing packaged chip 10, including:
a microwave substrate 11, wherein a feed path 111 is arranged in the microwave substrate 11;
the multi-channel amplitude and phase processing chip 12 is arranged on the surface of the microwave substrate 11 and is electrically connected with the feed circuit, wherein the multi-channel amplitude and phase processing chip 12 can simultaneously perform power division processing, and/or digital control processing, and/or amplification processing on signals in different frequency ranges through a plurality of signal processing channels;
and the packaging meter shell 13 is arranged on the microwave substrate 11 and forms a sealed cavity structure with the microwave substrate 11 in an enclosing manner, and the multichannel amplitude-phase processing chip 12 is positioned in the cavity structure.
The digital control processing includes signal processing operations that can be performed based on digital control signals, such as amplitude and phase processing, power supply processing, beam control, etc., and in actual operation, a user can select a corresponding digital control processing function according to actual needs.
In the present embodiment, said package case 13 is a ceramic material; or a plastic packaging layer for coating the multi-channel amplitude-phase processing chip 12 is further arranged in the packaging meter shell 13, wherein the distance between the plastic packaging layer and the packaging meter shell 13 is smaller than or equal to a preset distance, or the plastic packaging layer fills the inside of the cavity structure.
In other words, the packaging case 13 can be selected to be seamless packaging or seam packaging according to the actual material. For example, when the package case 13 is made of a plastic material, a plastic package layer may be coated on the surface of the multi-channel web processing chip 12, and the plastic package layer may fill the space between the package case 13 and the multi-channel web processing chip 12, so as to achieve a better electrical isolation in a seamless package manner; when the packaging case 13 is made of ceramic material, a seam packaging mode that a certain gap exists between the packaged multi-channel amplitude-phase processing chip 12 and the packaging case 13 can be adopted, and the material consumption can be reduced on the basis of realizing better electrical isolation. Further, as a preferable mode, the packaging material in the embodiment of the present application may also adopt a ceramic material as the packaging case 13, and at the same time, a plastic packaging layer is still coated on the surface of the multi-channel web-phase processing chip 12 to further improve the isolation of the packaged multi-channel web-phase processing chip 12.
The multi-channel amplitude and phase processing chip 12 is a chip in which a plurality of circuit channels are arranged in one chip, and the circuit channels respectively and correspondingly perform amplitude and phase processing on signals transmitted through the circuit channels. The design of such a chip has been implemented in the prior art (see patent application No. 201710584906.6 entitled "a signal processing circuit"). Of course, the multi-channel amplitude and phase processing chip 12 can perform amplification, frequency modulation, power division, and other processing on the signals besides performing independent amplitude and phase processing on different signals. The user can select the multi-channel amplitude-phase processing chip 12 corresponding to the corresponding frequency band signal for packaging processing according to the requirement. Because a plurality of signals belonging to a plurality of frequency band intervals can be simultaneously and independently subjected to amplitude and phase regulation and control processing, power division synthesis processing, amplification processing and other signal processing operations by one multichannel amplitude and phase processing chip 12, and the selection of integrating the plurality of multichannel amplitude and phase processing chips 12 on one microwave substrate 11 can realize that the plurality of signals belonging to the plurality of frequency band intervals are respectively and independently and simultaneously subjected to amplitude and phase regulation and control processing, power division synthesis processing, amplification processing and the like by one small-size integrated circuit board, the technical effect of greatly simplifying the laying complexity of a plurality of signal processing circuits is achieved, the types and the number of chips in a flat phased array antenna are reduced, the production and application cost is greatly reduced, and the technical effect of simplifying the design of an external circuit is achieved.
It should be noted that, in practical applications, the length and width of the multi-channel web-phase processing chip 12 in the embodiment of the present application may be 6 × 6 mm.
Further, the multi-channel amplitude-phase processing chip 12 realizes that the plurality of signal processing channels are respectively and correspondingly electrically interconnected with the feed path by adopting a flip chip bonding process.
Example two
Referring to fig. 2 and fig. 3, a second embodiment of the present application provides a phased array antenna mechanism, including:
a multilayer microwave substrate 21;
an antenna module 22 disposed on a surface of one side of the multi-layer microwave substrate 21, where the antenna module 22 may be a microstrip antenna;
at least two multi-channel amplitude and phase processing packaged chips according to the first embodiment are arranged on the other side surface of the multilayer microwave substrate 21 opposite to the antenna module 22;
a feed network 23, disposed in an inner layer of the multi-layer microwave substrate 21, and connected to the multi-channel amplitude-phase processing packaged chip and the antenna module 22 through a vertical through hole 211 disposed in the multi-layer microwave substrate 21, where the feed network 23 may be a feed path in the first embodiment;
and the radio frequency interface connector 24 is arranged on the multilayer microwave substrate 21, is connected with the multichannel amplitude-phase processing packaging chip and the antenna module 22 through the feed network 23, and is used for receiving and transmitting radio frequency signals.
Meanwhile, the antenna mechanism in the embodiment of the present application further includes:
and at least two beam control modules 25, which are arranged on the multilayer microwave substrate 21 and connected with the feed network 23, and are used for respectively supplying power to the corresponding multi-channel amplitude-phase processing packaged chips and sending out numerical control signals, so that the corresponding multi-channel amplitude-phase processing packaged chips control radio frequency signal beams to generate required phases and amplitudes according to a mode corresponding to the numerical control signals.
And said feeding network 23 comprises:
the power division and synthesis structure 231 is used to perform power division or synthesis on the passed signal to obtain a corresponding power-divided multi-path signal or a synthesized single-path signal.
Further, the at least two beam control modules 25 are arranged at the edge of the side where the multi-channel amplitude-phase processing packaged chip is located in an equidistant manner.
In practical operation, the components of the phased array antenna may be integrated on a dielectric substrate (e.g., a printed circuit board) by using a multilayer printed board process technology, where the components may be the antenna module 22, the multi-channel amplitude and phase processing package chip, the feed network 23 including the power dividing and combining structure 231, the radio frequency interface connector 24, and at least two beam control modules 25, etc., as described above, as long as the components may be supported by the dielectric substrate and constitute the basic components of the phased array antenna system.
The antenna module 22 is used in a phased array antenna to perform a signal receiving or transmitting function, and in order to further reduce the weight and volume of the phased array antenna mechanism, the antenna module 22 is embodied as a radiating patch. The radiation microstrip antenna adopts a standard space design and can be spliced and expanded into phased array antennas with different array element numbers.
The beam control module 25 can supply power to the multi-channel amplitude and phase processing packaged chip, and provide digital control signals of phase regulation and amplitude regulation required by signal beam generation for the multi-channel amplitude and phase processing packaged chip, so as to realize digital control and power supply functions of the phased array antenna.
The rf interface connector 24 is configured to input an rf signal to the phased array antenna mechanism in a signal transmitting state, and output the rf signal from the phased array antenna mechanism to a back-end device in a signal receiving state.
The at least two multichannel amplitude-phase processing chips 12 can simultaneously and independently perform various signal processing functions such as amplitude-phase regulation and control processing, power division synthesis processing, amplification processing and the like on a plurality of signals belonging to a plurality of frequency band intervals.
The functions of wave beam control, amplitude-phase modulation, signal amplification, antenna transmitting and receiving and the like of the phased array antenna system can be realized on one medium substrate through the combined operation of the functional modules.
In order to further improve the layout reasonableness and compactness of the phased-array antenna module 22 on the dielectric substrate, the at least two beam control modules 25 and other back-end processing modules may also be arranged in an equidistant manner at the edge position of the side where the multi-channel amplitude-phase processing package chip is located.
Therefore, the technical scheme in the embodiment of the application can form the multichannel amplitude-phase processing packaged chip by packaging the multichannel amplitude-phase processing chip on the microwave substrate by adopting the packaging shell, so that amplitude-phase regulation and control processing, power division synthesis processing, amplification processing and the like can be respectively and independently performed on a plurality of signals belonging to a plurality of frequency band intervals by using a small-volume integrated circuit board, and the technical effect of greatly simplifying the laying complexity of a plurality of signal processing circuits is achieved; meanwhile, according to the technical scheme in the embodiment of the application, a plurality of basic modules of the phased array antenna, such as the antenna module, the feed network, the multi-channel amplitude-phase processing packaging chip, the radio frequency interface connector and the like, are integrated on one dielectric substrate, and a reasonable and compact layout scheme is adopted, so that the effects of further reducing the weight and the volume of the phased array antenna system are achieved, and the technical effects of improving the integration level and the electrical performance of the phased array antenna are achieved.
While the preferred embodiments of the present application have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all alterations and modifications as fall within the scope of the application.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present application without departing from the spirit and scope of the application. Further, the steps of the methods in the technical solution of the present application may be reversed, and the sequence may be changed while still falling within the scope of the present invention. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations as well.
Claims (9)
1. A multi-channel amplitude and phase processing packaged chip, comprising:
the microwave substrate is internally provided with a feed circuit;
the multi-channel amplitude and phase processing chip is arranged on the surface of the microwave substrate and is electrically connected with the feed circuit, wherein the multi-channel amplitude and phase processing chip can simultaneously carry out power division processing, and/or digital control processing and/or amplification processing on signals in different frequency ranges through a plurality of signal processing channels;
the packaging meter shell is arranged on the microwave substrate and forms a sealed cavity structure with the microwave substrate in an enclosing mode, and the multichannel amplitude-phase processing chip is located in the cavity structure.
2. The multi-channel web-phase processing packaged chip of claim 1, wherein said package casing is a ceramic material.
3. The multi-channel web-phase processing packaged chip as claimed in claim 1, wherein a plastic packaging layer is further disposed in the packaging case for covering the multi-channel web-phase processing chip, wherein the distance between the plastic packaging layer and the packaging case is less than or equal to a preset distance, or the plastic packaging layer fills the inside of the cavity structure.
4. The multi-channel amplitude and phase processing packaged chip as claimed in claim 1, wherein the multi-channel amplitude and phase processing chip employs a flip chip bonding process to achieve electrical interconnection of the plurality of signal processing channels with the feed paths respectively.
5. A phased array antenna mechanism, comprising:
a multilayer microwave substrate;
an antenna module disposed on one side surface of the multi-layered microwave substrate;
at least two multi-channel amplitude and phase processing packaged chips as claimed in any one of claims 1 to 3, arranged on the other side surface of the multi-layer microwave substrate opposite to the antenna module;
the feed network is arranged in the inner layer of the multilayer microwave substrate and is respectively connected with the multichannel amplitude-phase processing packaging chip and the antenna module through a vertical through hole arranged in the multilayer microwave substrate;
and the radio frequency interface connector is arranged on the multilayer microwave substrate, is connected with the multichannel amplitude-phase processing packaging chip and the antenna module through the feed network and is used for receiving and transmitting radio frequency signals.
6. The antenna mechanism of claim 5, further comprising:
and the at least two beam control modules are arranged on the multilayer microwave substrate and connected with the feed network, and are used for respectively supplying power to the corresponding multichannel amplitude-phase processing packaging chips and sending out numerical control signals, so that the corresponding multichannel amplitude-phase processing packaging chips control radio-frequency signal beams to generate required phase amplitude in a mode corresponding to the numerical control signals.
7. The antenna mechanism of claim 5, wherein the feed network comprises:
the power division and synthesis structure is used for performing power division or synthesis on the passed signals to obtain corresponding power-divided multipath signals or synthesized multipath signals.
8. The antenna mechanism as in claim 6, wherein said at least two beam steering modules are arranged in an equidistant manner at edge locations on a side of said multi-channel amplitude and phase processing package chip.
9. The antenna mechanism of claim 5, wherein the antenna module is a microstrip antenna.
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| CN201920717733.5U CN210296634U (en) | 2019-05-17 | 2019-05-17 | Multi-channel amplitude-phase processing packaging chip and phased array antenna mechanism |
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| CN201920717733.5U CN210296634U (en) | 2019-05-17 | 2019-05-17 | Multi-channel amplitude-phase processing packaging chip and phased array antenna mechanism |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110247187A (en) * | 2019-05-17 | 2019-09-17 | 成都天锐星通科技有限公司 | A kind of multichannel width phase processor encapsulation chip and phased array antenna mechanism |
| CN117080744A (en) * | 2023-10-18 | 2023-11-17 | 成都天锐星通科技有限公司 | Flat phased array surface, antenna terminal and electronic equipment |
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2019
- 2019-05-17 CN CN201920717733.5U patent/CN210296634U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110247187A (en) * | 2019-05-17 | 2019-09-17 | 成都天锐星通科技有限公司 | A kind of multichannel width phase processor encapsulation chip and phased array antenna mechanism |
| CN117080744A (en) * | 2023-10-18 | 2023-11-17 | 成都天锐星通科技有限公司 | Flat phased array surface, antenna terminal and electronic equipment |
| CN117080744B (en) * | 2023-10-18 | 2023-12-29 | 成都天锐星通科技有限公司 | Flat phased array surface, antenna terminal and electronic equipment |
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