CN117080744A - Flat phased array surface, antenna terminal and electronic equipment - Google Patents
Flat phased array surface, antenna terminal and electronic equipment Download PDFInfo
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- CN117080744A CN117080744A CN202311344927.2A CN202311344927A CN117080744A CN 117080744 A CN117080744 A CN 117080744A CN 202311344927 A CN202311344927 A CN 202311344927A CN 117080744 A CN117080744 A CN 117080744A
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- 238000012545 processing Methods 0.000 claims abstract description 113
- 239000000758 substrate Substances 0.000 claims abstract description 58
- 238000006243 chemical reaction Methods 0.000 claims description 42
- 238000001816 cooling Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 9
- 230000017525 heat dissipation Effects 0.000 claims description 8
- 230000010354 integration Effects 0.000 abstract description 5
- 230000005855 radiation Effects 0.000 description 14
- 238000013461 design Methods 0.000 description 8
- 238000012360 testing method Methods 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
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- 238000005476 soldering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q3/00—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system
- H01Q3/26—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture
- H01Q3/30—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture varying the relative phase between the radiating elements of an array
- H01Q3/34—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture varying the relative phase between the radiating elements of an array by electrical means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/27—Adaptation for use in or on movable bodies
- H01Q1/32—Adaptation for use in or on road or rail vehicles
- H01Q1/3208—Adaptation for use in or on road or rail vehicles characterised by the application wherein the antenna is used
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/42—Housings not intimately mechanically associated with radiating elements, e.g. radome
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
Abstract
The invention discloses a flat phased array surface, an antenna terminal and electronic equipment, which comprise a substrate, a receiving antenna, a transmitting antenna and a signal processing module, wherein the receiving antenna is arranged on the substrate; the signal processing module comprises a radio frequency receiving chip, a radio frequency transmitting chip, a baseband processing chip and a wave control chip; the base plate is used for placing the receiving antenna, the transmitting antenna and the signal processing module; a receiving antenna for receiving a first radio frequency signal; the transmitting antenna is used for transmitting a second radio frequency signal; and the signal processing module is electrically connected with the receiving antenna and the transmitting antenna and is used for processing the first radio frequency signal received by the receiving antenna or outputting the second radio frequency signal to the transmitting antenna. According to the technical scheme, the signal processing module is used for realizing the receiving function and the transmitting function of the radio frequency signals, an independent control module is not required to be added for respectively controlling the receiving antenna and the transmitting antenna, so that the receiving and transmitting functions of the radio frequency signals of the flat phased array surface can be realized, the integration level of the flat phased array surface is improved, and the cost of the flat phased array surface is reduced.
Description
Technical Field
The invention relates to the technical field of radio frequency, in particular to a flat phased array surface, an antenna terminal and electronic equipment.
Background
In recent years, evolution and rising of satellite communication are rapid. The antenna terminal formed by the phased array panel antenna has the characteristics of strong wide-angle scanning and beam agility, is suitable for realizing the functions of high-speed communication and full airspace coverage in an on-board satellite communication system, and has great development potential.
The conventional antenna terminal generally comprises an antenna housing, a flat phased array surface, a beam control system, a frequency converter and a baseband processing system, wherein the flat phased array surface is integrated in the thermal control system, and the beam control system, the frequency converter and the baseband processing system are arranged outside the thermal control system. Therefore, the panel phased array surface, the beam control system, the frequency converter and the baseband processing system all need to be controlled by independent control chips, and an independent power supply module is needed to supply power, and the cable assembly and the connector joint connected by all parts can also bring cost increase, so that the hardware cost is greatly increased, and the installation structure is more complex. Therefore, how to reduce the hardware cost of the antenna terminal is a technical problem to be solved.
Disclosure of Invention
The embodiment of the invention provides a flat phased array surface, an antenna terminal and electronic equipment, which are used for solving the problem of high hardware cost of the existing antenna terminal.
A flat phased array surface comprises a substrate, a receiving antenna, a transmitting antenna and a signal processing module;
the substrate is used for placing the receiving antenna, the transmitting antenna and the signal processing module;
the receiving antenna is used for receiving a first radio frequency signal;
the transmitting antenna is used for transmitting a second radio frequency signal;
the signal processing module is electrically connected with the receiving antenna and the transmitting antenna and is used for processing the first radio frequency signal received by the receiving antenna or outputting the second radio frequency signal to the transmitting antenna;
the signal processing module comprises a radio frequency receiving chip, a radio frequency transmitting chip, a baseband processing chip and a wave control chip;
the radio frequency receiving chip is connected with the receiving antenna and the baseband processing chip;
the radio frequency transmitting chip is connected with the transmitting antenna and the baseband processing chip;
the baseband processing chip is connected with the wave control chip;
the wave control chip is connected with the radio frequency receiving chip, the radio frequency transmitting chip and the baseband processing chip and is used for controlling the radio frequency receiving chip, the radio frequency transmitting chip and the baseband processing chip to work so as to process the first radio frequency signal received by the receiving antenna or output the second radio frequency signal to the transmitting antenna.
Further, the substrate includes a first placement area, a second placement area, and a third placement area;
the first placement area and the second placement area are positioned on the front surface of the substrate, and the third placement area is positioned on the front surface of the substrate and/or the back surface of the substrate;
the receiving antenna is arranged in the first placement area;
the transmitting antenna is arranged in the second placement area;
the signal processing module is arranged in the third placement area.
Further, the signal processing module further comprises a frequency conversion module;
the frequency conversion module is connected with the radio frequency receiving chip, the radio frequency transmitting chip and the baseband processing chip and is used for adjusting the frequencies corresponding to the first radio frequency signal and the second radio frequency signal.
Further, the frequency conversion module is connected with the radio frequency receiving chip, the radio frequency transmitting chip and the baseband processing chip through a strip line or a microstrip line.
Further, a shielding cavity is formed in the substrate, and the frequency conversion module is arranged in the shielding cavity.
Further, the frequency conversion module comprises a first frequency conversion module and a second frequency conversion module;
the first frequency conversion module is connected with the radio frequency receiving chip and the baseband processing chip and is used for adjusting the frequency of the first radio frequency signal;
the second frequency conversion module is connected with the radio frequency transmitting chip and is used for adjusting the frequency of the second radio frequency signal.
Further, the signal processing module further comprises a gateway router, an inertial navigation module and an external interface module;
the gateway router is connected with the wave control chip and used for transmitting gateway data to the wave control chip;
the inertial navigation module is connected with the wave control chip and used for outputting attitude data to the wave control chip;
the external interface module is used for connecting external equipment and receiving external data;
the wave control chip is also used for outputting a wave beam control signal to the radio frequency receiving chip and the radio frequency transmitting chip according to the gateway data, the gesture data and the external data so as to control wave beam pointing.
An antenna terminal comprises an antenna shell and the flat phased array surface; the antenna shell is provided with an accommodating cavity;
the flat phased array surface is arranged in the accommodating cavity.
Further, the antenna shell comprises an antenna housing, a thermal control structure and a rear cover plate which are sequentially arranged from top to bottom;
the accommodating cavity is formed between the antenna housing and the thermal control structure;
a heat dissipation cavity is formed between the thermal control structure and the rear cover plate;
wherein the accommodating cavity is communicated with the heat dissipation cavity; the side wall of the thermal control structure is provided with a first heat dissipation hole communicated with the heat dissipation cavity; the flat phased array surface is arranged in the accommodating cavity; and a cooling fan is arranged in the cooling cavity.
An electronic device comprises the antenna terminal.
The flat phased array surface comprises a substrate, a receiving antenna, a transmitting antenna and a signal processing module; the base plate is used for placing the receiving antenna, the transmitting antenna and the signal processing module; a receiving antenna for receiving a first radio frequency signal; the transmitting antenna is used for transmitting a second radio frequency signal; the signal processing module is electrically connected with the receiving antenna and the transmitting antenna and is used for processing the first radio frequency signal received by the receiving antenna or outputting the second radio frequency signal to the transmitting antenna, and the signal processing module comprises a radio frequency receiving chip, a radio frequency transmitting chip, a baseband processing chip and a wave control chip; the radio frequency receiving chip is connected with the receiving antenna and the baseband processing chip; the radio frequency transmitting chip is connected with the transmitting antenna and the baseband processing chip; the baseband processing chip is connected with the wave control chip; the wave control chip is connected with the radio frequency receiving chip, the radio frequency transmitting chip and the baseband processing chip and is used for controlling the radio frequency receiving chip, the radio frequency transmitting chip and the baseband processing chip to work so as to process the first radio frequency signal received by the receiving antenna or output the second radio frequency signal to the transmitting antenna. Therefore, the receiving antenna, the transmitting antenna and the signal processing module are integrated on the substrate at the same time, and the receiving function of the radio frequency signals and the transmitting function of the radio frequency signals are realized through the signal processing module, so that the receiving and transmitting functions of the radio frequency signals can be realized on the flat phased array surface without adding an independent control module for respectively controlling the receiving antenna and the transmitting antenna, the integration level of the flat phased array surface is improved, and the cost of the flat phased array surface is reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the description of the embodiments of the present invention will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a planar phased array surface in accordance with one embodiment of the invention;
fig. 2 is a schematic diagram of an antenna terminal according to an embodiment of the invention.
In the figure: 1. a planar phased array surface; 11. a substrate; 12. a receiving antenna; 13. a transmitting antenna; 14. a signal processing module; 141. a radio frequency receiving chip; 142. a radio frequency transmitting chip; 143. a baseband processing chip; 144. a wave control chip; 145. a first frequency conversion module; 146. the second frequency conversion module; 147. a gateway router; 148. an inertial navigation module; 149. an external interface module; 2. an antenna housing; 21. a thermal control structure; 22. a back cover plate; 23. a heat radiation fan.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be understood that the present invention may be embodied in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.
In the following description, for the purpose of providing a thorough understanding of the present invention, detailed structures and steps are presented in order to illustrate the technical solution presented by the present invention. Preferred embodiments of the present invention are described in detail below, however, the present invention may have other embodiments in addition to these detailed descriptions.
The present embodiment provides a flat phased array surface 1, as shown in fig. 2, and the flat phased array surface 1 is applied to an antenna terminal. As an example, the antenna terminal includes, but is not limited to, an antenna housing 2 and the planar phased array face 1. Optionally, the antenna housing 2 comprises a radome (not shown), a thermal control structure 21 and a back cover 22. This radome, heat control structure 21 and back shroud 22 set gradually from top to bottom, this heat control structure 21 includes the radiating casing and sets up the baffle in radiating casing inside, form the holding cavity between baffle and the radome, form the radiating cavity between baffle and the back shroud 22, be equipped with the through-hole of intercommunication holding cavity and radiating cavity on the baffle, radiating casing lateral wall is equipped with the first louvre of intercommunication radiating cavity, the flat phased array face 1 sets up and is located the holding cavity on the baffle, still is equipped with radiator fan 23 in this radiating cavity. Further, the heat dissipating fan 23 is disposed on the back cover 22, and a second heat dissipating hole disposed opposite to the heat dissipating fan 23 is disposed on the back cover 22. When the cooling fan 23 works, air circulation can be guaranteed among the accommodating cavity, the cooling cavity and the outside through the through holes in the partition plate and the first cooling holes on the side wall of the cooling shell and/or the second cooling holes in the rear cover plate 22, so that the purpose of cooling the flat phased array surface 1 is achieved.
The present embodiment provides a flat phased array surface 1, as shown in fig. 1, including a substrate 11, a receiving antenna 12, a transmitting antenna 13, and a signal processing module 14; a substrate 11 for placing a receiving antenna 12, a transmitting antenna 13 and a signal processing module 14; a receiving antenna 12 for receiving a first radio frequency signal; a transmitting antenna 13 for transmitting a second radio frequency signal; the signal processing module 14 is electrically connected to the receiving antenna 12 and the transmitting antenna 13, and is configured to process the first radio frequency signal received by the receiving antenna 12, or output the second radio frequency signal to the transmitting antenna 13.
In a specific embodiment, the substrate 11 is used to house the receiving antenna 12, the transmitting antenna 13 and the signal processing module 14. Specifically, the substrate 11 is a PCB (Printed Circuit Board, printed wiring board, PCB for short), and the substrate 11 is provided with a connection circuit for connecting the receiving antenna 12, the transmitting antenna 13, and the signal processing module 14. Further, the substrate 11 may be provided with other circuits for realizing the planar phased antenna function, which is not limited herein.
In a particular embodiment, the receive antenna 12 includes a receive radiating patch. Alternatively, the radiation receiving patch may be a single patch design, a dual patch design, or a multi-patch design. Wherein, the radiation receiving patches of the multi-patch design are arranged in an array. Similarly, the transmitting antenna 13 includes a transmitting radiation patch. Alternatively, the radiation emitting patch may be a single patch design, a dual patch design, or a multi-patch design. Wherein, the radiation emitting paster of many paster designs is array arrangement. Optionally, the radiation receiving patch or the radiation emitting patch is a sheet metal patch. The metal may be, for example, a metal having good electrical conductivity, such as copper or aluminum. It should be noted that the shape, size and layout of the receiving radiation patch or the transmitting radiation patch may affect the radiation characteristics of the planar phased antenna, and the shape, size and layout of the receiving radiation patch or the transmitting radiation patch may be selected according to practical experience, which is not limited herein.
In one embodiment, the receiving antenna 12 is configured to receive a first radio frequency signal; a transmitting antenna 13 for transmitting a second radio frequency signal; the signal processing module 14 is electrically connected to the receiving antenna 12 and the transmitting antenna 13, and is configured to process the first radio frequency signal received by the receiving antenna 12, or output the second radio frequency signal to the transmitting antenna 13. In this embodiment, when the receiving antenna 12 receives the first rf signal, the signal processing module 14 processes the first rf signal received by the receiving antenna 12, for example, processes such as filtering, amplifying, and analog-to-digital converting the first rf signal, so as to implement receiving the rf signal through the receiving antenna 12. The signal processing module 14 may also output a second radio frequency signal according with the user's requirement to the transmitting antenna 13 according to the user's configuration, so as to implement transmission of the radio frequency signal through the transmitting antenna 13. The present embodiment can realize the reception and transmission of radio frequency signals through the signal processing module 14, the transmitting antenna 13 and the receiving antenna 12.
In the present embodiment, the flat phased array surface 1 includes a substrate 11, a receiving antenna 12, a transmitting antenna 13, and a signal processing module 14; a substrate 11 for placing a receiving antenna 12, a transmitting antenna 13 and a signal processing module 14; a receiving antenna 12 for receiving a first radio frequency signal; a transmitting antenna 13 for transmitting a second radio frequency signal; the signal processing module 14 is electrically connected to the receiving antenna 12 and the transmitting antenna 13, and is configured to process the first radio frequency signal received by the receiving antenna 12, or output the second radio frequency signal to the transmitting antenna 13. Therefore, the receiving antenna 12, the transmitting antenna 13 and the signal processing module 14 are integrated on the substrate 11 at the same time, and the receiving function of the radio frequency signals and the transmitting function of the radio frequency signals are realized through the signal processing module 14, so that the receiving and transmitting functions of the radio frequency signals can be realized by the flat phased array surface 1 without adding independent control modules for respectively controlling the receiving antenna 12 and the transmitting antenna 13, the integration level of the flat phased array surface 1 is improved, and the cost of the flat phased array surface 1 is reduced.
In one embodiment, the substrate 11 includes a first placement area, a second placement area, and a third placement area; the first placement area and the second placement area are positioned on the front surface of the substrate 11, and the third placement area is positioned on the front surface of the substrate 11 and/or the back surface of the substrate 11; a receiving antenna 12 disposed in the first placement area; a transmitting antenna 13 disposed in the second placement area; the signal processing module 14 is disposed in the third placement area.
Wherein the substrate 11 includes a first placement area, a second placement area, and a third placement area that do not overlap each other.
In one embodiment, the first placement area and the second placement area are located on the front surface of the substrate 11. Specifically, the front surface of the substrate 11 is the surface opposite to the radome when the flat phased array surface 1 is placed in the accommodating cavity. The first placement area and the second placement area are positioned on the front surface of the substrate 11, and the receiving antenna 12 is arranged on the first placement area; and a transmitting antenna 13, which is arranged in the second placement area and is convenient for receiving and transmitting radio frequency signals. As shown in fig. 1, the left side in fig. 1 is a view corresponding to the front surface of the substrate 11, and the right side in fig. 1 is a view corresponding to the back surface of the substrate 11.
In a specific embodiment, the third placement area may be located on the front surface of the substrate 11, or may be located on the back surface of the substrate 11, or may be located on a part of the front surface of the substrate 11, and another part of the back surface of the substrate 11. The back surface of the substrate 11 refers to a surface of the substrate 11 opposite to the front surface of the substrate 11. In this embodiment, the signal processing module 14 may be disposed on the front surface of the substrate 11, or may be disposed on the back surface of the substrate 11, or may be partially disposed on the front surface of the substrate 11, or partially disposed on the back surface of the substrate 11, so as to ensure that the receiving antenna 12 and the transmitting antenna 13 are disposed on the front surface of the substrate 11.
In the present embodiment, the substrate 11 includes a first placement area, a second placement area, and a third placement area; the first placement area and the second placement area are positioned on the front surface of the substrate 11, and the third placement area is positioned on the front surface of the substrate 11 and/or the back surface of the substrate 11; a receiving antenna 12 disposed in the first placement area; a transmitting antenna 13 disposed in the second placement area; the signal processing module 14 is disposed in the third placement area, so that the receiving antenna 12 receives the first radio frequency signal, and the transmitting antenna 13 sends the second radio frequency signal.
In one embodiment, as shown in fig. 1, the signal processing module 14 includes a radio frequency receiving chip 141, a radio frequency transmitting chip 142, a baseband processing chip 143, and a waveguide chip 144; a radio frequency receiving chip 141 connected to the receiving antenna 12 and the baseband processing chip 143; a radio frequency transmitting chip 142 connected to the transmitting antenna 13 and the baseband processing chip 143; the baseband processing chip 143 is connected with the wave control chip 144; the wave control chip 144, and the radio frequency receiving chip 141, the radio frequency transmitting chip 142 and the baseband processing chip 143 are used for controlling the radio frequency receiving chip 141, the radio frequency transmitting chip 142 and the baseband processing chip 143 to work.
In one embodiment, a radio frequency receiving chip 141 is coupled to the receiving antenna 12 and the baseband processing chip 143. The rf receiving chip 141 is configured to convert a first rf signal received by the receiving antenna 12 into a first baseband signal. Optionally, the radio frequency receiving chip 141 includes, but is not limited to, a radio frequency amplifier, a low noise amplifier, a mixer, and a filter. The radio frequency receiving chip 141 further transfers the first baseband signal to the baseband processing chip 143 for digital signal processing.
In one embodiment, a radio frequency transmit chip 142 is coupled to the transmit antenna 13 and to the baseband processing chip 143. The rf transmitting chip 142 is configured to convert the second baseband signal into a second rf signal for wireless transmission through the transmitting antenna 13. The second baseband signal is a baseband signal output from the baseband processing chip 143. The radio frequency transmit chip 142 includes, but is not limited to, a radio frequency synthesizer, a modulator, and a power amplifier.
In one embodiment, the baseband processing chip 143 is connected to the waveguide chip 144, and is configured to process a received or to be transmitted digital signal (the first baseband signal or the second baseband signal). The baseband processing chip 143 includes, but is not limited to, a digital signal processor, a modem, and a codec for demodulating the first rf signal received by the rf receiving chip 141 and extracting the original information, or modulating the digital signal to form a second rf signal for transmission by the rf transmitting chip 142.
In a specific embodiment, the wave control chip 144, together with the rf receiving chip 141, the rf transmitting chip 142 and the baseband processing chip 143, is used to control the rf receiving chip 141, the rf transmitting chip 142 and the baseband processing chip 143 to work, so as to adjust the phase and the amplitude of each antenna element in the antenna array, so as to achieve the required radiation mode and directivity.
In the present embodiment, the signal processing module 14 includes a radio frequency receiving chip 141, a radio frequency transmitting chip 142, a baseband processing chip 143, and a wave control chip 144; a radio frequency receiving chip 141 connected to the receiving antenna 12 and the baseband processing chip 143; a radio frequency transmitting chip 142 connected to the transmitting antenna 13 and the baseband processing chip 143; the baseband processing chip 143 is connected with the wave control chip 144; the wave control chip 144, and the radio frequency receiving chip 141, the radio frequency transmitting chip 142 and the baseband processing chip 143 are used for controlling the radio frequency receiving chip 141, the radio frequency transmitting chip 142 and the baseband processing chip 143 to work. By integrating the radio frequency receiving chip 141, the radio frequency transmitting chip 142, the baseband processing chip 143 and the wave control chip 144 on the substrate 11, the receiving antenna 12 and the transmitting antenna 13 are controlled respectively without adding an independent control module, so that the receiving and transmitting functions of the flat phased array surface 1 for realizing radio frequency signals can be realized, the integration level of the flat phased array surface 1 is improved, and the cost of the flat phased array surface 1 is reduced.
In one embodiment, the signal processing module 14 further includes a frequency conversion module; the frequency conversion module is connected with the radio frequency receiving chip 141, the radio frequency transmitting chip 142 and the baseband processing chip 143, and is used for adjusting the frequencies corresponding to the first radio frequency signal and the second radio frequency signal.
In this embodiment, the frequency conversion module is integrated to the signal processing module 14, and is connected to the radio frequency receiving chip 141, the radio frequency transmitting chip 142 and the baseband processing chip 143, and is used for adjusting frequencies corresponding to the first radio frequency signal and the second radio frequency signal, so that the planar phased array surface 1 can receive the first radio frequency signal with a higher frequency band and transmit the second radio frequency signal with a higher frequency band.
In one embodiment, the frequency conversion module is connected to the rf receiving chip 141, the rf transmitting chip 142 and the baseband processing chip 143 through a strip line or a microstrip line.
In this embodiment, the frequency conversion module, the rf receiving chip 141, the rf transmitting chip 142 and the baseband processing chip 143 are integrated on the same substrate 11, so that the frequency conversion module, the rf receiving chip 141, the rf transmitting chip 142 and the baseband processing chip 143 can be electrically connected through a strip line or a microstrip line, i.e. the strip line or the microstrip line replaces the rf cable and the rf interface, thereby reducing the loss caused by the rf cable and the rf interface.
In one embodiment, the substrate 11 is provided with a shielding cavity, and the frequency conversion module is disposed in the shielding cavity.
In a specific embodiment, a shielding cavity is arranged on the substrate 11, reflow soldering is adopted around the shielding cavity, and the frequency conversion module is arranged in the shielding cavity, so that the radio frequency signal is ensured not to generate frequency interference on the crystal oscillator.
In one embodiment, as shown in fig. 1, the frequency conversion module includes a first frequency conversion module 145 and a second frequency conversion module 146; the first frequency conversion module 145 is connected with the radio frequency receiving chip 141 and the baseband processing chip 143 and is used for adjusting the frequency of the first radio frequency signal; the second frequency conversion module 146 is connected to the rf transmitting chip 142, and is used for adjusting the frequency of the second rf signal.
In one embodiment, the first frequency conversion module 145 is connected to the rf receiving chip 141 and the baseband processing chip 143, and is configured to down-convert the high-frequency first rf signal to an intermediate-frequency or low-frequency first rf signal, and input the first rf signal to the baseband processing chip 143. The second frequency conversion module 146 is connected to the rf transmitting chip 142, and is configured to up-convert the second rf signal with intermediate frequency or low frequency to the second rf signal with high frequency, and input the second rf signal to the rf transmitting chip 142 for further transmitting through the transmitting antenna 13.
As an example, the first frequency conversion module 145 or the second frequency conversion module 146 includes a frequency conversion chip, a phase-locked loop, and a filter. As a test example, taking the test of transmitting the second radio frequency signal as an example through the vector network device, the intermediate frequency signal of the vector network can be up-converted and output to the radio frequency transmitting chip 142 through the second frequency conversion module 146, then the second radio frequency signal is output through the transmitting antenna 13, and finally returns to the receiving port of the vector network; in order to ensure that the frequencies are the same, the 10MHz reference signal provided by the vector network device needs to be input to the phase-locked loop to control the frequency output of the variable frequency local oscillator, so that the flat phased array surface 1 integrated with the first variable frequency module 145 and the second variable frequency module 146 does not need to be calibrated and tested separately, and can be calibrated and tested directly through the intermediate frequency signal.
In this embodiment, the first frequency conversion module 145 is connected to the rf receiving chip 141 and the baseband processing chip 143, so as to adjust the frequency of the first rf signal; the second frequency conversion module 146 is connected to the rf transmitting chip 142, and is configured to adjust the frequency of the second rf signal, so that the planar phased array surface 1 can receive the first rf signal with the higher frequency band and transmit the second rf signal with the higher frequency band.
In one embodiment, as shown in FIG. 1, the signal processing module 14 further includes a gateway router 147, a inertial navigation module 148, and an external interface module 149; a gateway router 147 connected to the wave control chip 144 for transmitting gateway data to the wave control chip 144; the inertial navigation module 148 is connected with the wave control chip 144 and is used for outputting attitude data to the wave control chip 144; an external interface module 149 for connecting to an external device and receiving external data; the wave control chip 144 is further configured to output a beam control signal to the rf receiving chip 141 and the rf transmitting chip 142 according to the gateway data, the gesture data, and the external data, so as to control the beam direction.
Gateway data refers to data acquired from the gateway router 147. Attitude data refers to data output by inertial navigation module 148. The external data refers to data output from an external device. Illustratively, the external data includes GPS (Global Positioning System, global positioning system, GPS for short).
In a specific embodiment, the wave control chip 144 reads the satellite frequency in the gateway data, reads the latitude and longitude information and the altitude information in the attitude data and the external data, calculates the direction and the frequency of the beam in real time, and controls the frequency conversion module to select a proper local oscillator frequency, the direction and the frequency information, and controls the phase shifter of the radio frequency transmitting chip 142 or the radio frequency receiving chip 141 through the SPI protocol to control the phase distribution of the whole array surface, thereby achieving the purpose of controlling the direction of the beam.
In this embodiment, the signal processing module 14 further includes a gateway router 147, a inertial navigation module 148, and an external interface module 149; the gateway router 147 is connected with the wave control chip 144 and is used for transmitting gateway data to the wave control chip 144; the inertial navigation module 148 is connected with the wave control chip 144 and is used for outputting attitude data to the wave control chip 144; an external interface module 149 for connecting to an external device and receiving external data; the wave control chip 144 is further configured to output a beam control signal to the rf receiving chip 141 and the rf transmitting chip 142 according to the gateway data, the gesture data, and the external data, so as to control the beam direction, thereby achieving the purpose of controlling the beam direction.
The present embodiment provides an antenna terminal, as shown in fig. 2, including an antenna housing 2 and the flat phased array surface 1 in the above embodiment; the antenna housing 2 is provided with a receiving cavity (not shown in the figures); the flat phased array surface 1 is arranged in the accommodating cavity.
In this embodiment, by integrating the antenna housing 2 with the planar phased array surface 1 in the above embodiment, the integration level of the antenna terminal is improved, the hardware cost, the PCB cost and the cable connector cost are reduced, and the assembly and test time of the intermediate frequency test and the test with the radome are reduced.
The embodiment provides an electronic device including the antenna terminal in the above embodiment.
The above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention, and are intended to be included in the scope of the present invention.
Claims (10)
1. The flat phased array surface is characterized by comprising a substrate, a receiving antenna, a transmitting antenna and a signal processing module;
the substrate is used for placing the receiving antenna, the transmitting antenna and the signal processing module;
the receiving antenna is used for receiving a first radio frequency signal;
the transmitting antenna is used for transmitting a second radio frequency signal;
the signal processing module is electrically connected with the receiving antenna and the transmitting antenna and is used for processing the first radio frequency signal received by the receiving antenna or outputting the second radio frequency signal to the transmitting antenna;
the signal processing module comprises a radio frequency receiving chip, a radio frequency transmitting chip, a baseband processing chip and a wave control chip;
the radio frequency receiving chip is connected with the receiving antenna and the baseband processing chip;
the radio frequency transmitting chip is connected with the transmitting antenna and the baseband processing chip;
the baseband processing chip is connected with the wave control chip;
the wave control chip is connected with the radio frequency receiving chip, the radio frequency transmitting chip and the baseband processing chip and is used for controlling the radio frequency receiving chip, the radio frequency transmitting chip and the baseband processing chip to work so as to process the first radio frequency signal received by the receiving antenna or output the second radio frequency signal to the transmitting antenna.
2. The planar phased array surface of claim 1, wherein the substrate comprises a first placement area, a second placement area, and a third placement area;
the first placement area and the second placement area are positioned on the front surface of the substrate, and the third placement area is positioned on the front surface of the substrate and/or the back surface of the substrate;
the receiving antenna is arranged in the first placement area;
the transmitting antenna is arranged in the second placement area;
the signal processing module is arranged in the third placement area.
3. The flat panel phased array surface of claim 1, wherein the signal processing module further comprises a frequency conversion module;
the frequency conversion module is connected with the radio frequency receiving chip, the radio frequency transmitting chip and the baseband processing chip and is used for adjusting the frequencies corresponding to the first radio frequency signal and the second radio frequency signal.
4. The flat panel phased array surface of claim 3, wherein the frequency conversion module is connected with the radio frequency receiving chip, the radio frequency transmitting chip and the baseband processing chip through a strip line or a microstrip line.
5. The planar phased array surface of claim 3, wherein a shielding cavity is provided on the substrate, and the frequency conversion module is disposed in the shielding cavity.
6. The slab phased array surface of claim 3, wherein the frequency conversion module comprises a first frequency conversion module and a second frequency conversion module;
the first frequency conversion module is connected with the radio frequency receiving chip and the baseband processing chip and is used for adjusting the frequency of the first radio frequency signal;
the second frequency conversion module is connected with the radio frequency transmitting chip and is used for adjusting the frequency of the second radio frequency signal.
7. The flat panel phased array surface of claim 1, wherein the signal processing module further comprises a gateway router, a inertial navigation module, and an external interface module;
the gateway router is connected with the wave control chip and used for transmitting gateway data to the wave control chip;
the inertial navigation module is connected with the wave control chip and used for outputting attitude data to the wave control chip;
the external interface module is used for connecting external equipment and receiving external data;
the wave control chip is also used for outputting a wave beam control signal to the radio frequency receiving chip and the radio frequency transmitting chip according to the gateway data, the gesture data and the external data so as to control wave beam pointing.
8. An antenna terminal comprising an antenna housing and a planar phased array surface as claimed in any one of claims 1 to 7; the antenna shell is provided with an accommodating cavity;
the flat phased array surface is arranged in the accommodating cavity.
9. The antenna terminal of claim 8, wherein the antenna housing comprises a radome, a thermal control structure and a back cover plate arranged in sequence from top to bottom;
the accommodating cavity is formed between the antenna housing and the thermal control structure;
a heat dissipation cavity is formed between the thermal control structure and the rear cover plate;
wherein the accommodating cavity is communicated with the heat dissipation cavity; the side wall of the thermal control structure is provided with a first heat dissipation hole communicated with the heat dissipation cavity; the flat phased array surface is arranged in the accommodating cavity; and a cooling fan is arranged in the cooling cavity.
10. An electronic device comprising an antenna terminal as claimed in claim 8 or 9.
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