CN214957320U - 5G millimeter wave communication module applied to mobile terminal - Google Patents
5G millimeter wave communication module applied to mobile terminal Download PDFInfo
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- CN214957320U CN214957320U CN202120179939.4U CN202120179939U CN214957320U CN 214957320 U CN214957320 U CN 214957320U CN 202120179939 U CN202120179939 U CN 202120179939U CN 214957320 U CN214957320 U CN 214957320U
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Abstract
The application relates to the technical field of communication, and provides a 5G millimeter wave communication module applied to a mobile terminal, which comprises a horizontal beam antenna sub-module and a vertical beam antenna sub-module; the horizontal beam antenna sub-module is connected with the vertical beam antenna sub-module through the transmission line flexible substrate; the bottom of the vertical beam antenna sub-module is also provided with a phased array chip which is connected with the horizontal beam antenna sub-module and the vertical beam antenna sub-module. In the practical application process, the horizontal beam antenna sub-module is attached to and arranged on one plane of the terminal, the transmission line soft substrate bypasses one edge side of the terminal, the vertical beam antenna sub-module is attached to and arranged on the other plane of the terminal, and the horizontal beam antenna sub-module and the vertical beam antenna sub-module which are mutually perpendicular in scanning surface are used for realizing omnidirectional beam coverage, so that the problem that a large installation position needs to be reserved for the mobile terminal due to the fact that a plurality of millimeter wave antenna modules are used is avoided.
Description
Technical Field
The application relates to the technical field of communication, in particular to a 5G millimeter wave communication module applied to a mobile terminal.
Background
Under the conditions of increasingly tense spectrum resources and rapid development of 5G communication technology, the development and utilization of millimeter wave spectrum resources used on satellites and radar military systems become the key point of the fifth-generation mobile communication technology. Millimeter wave (millimeter wave): electromagnetic waves with the wavelength of 1-10 mm are called millimeter waves and are located in the overlapping wavelength range of microwave and far infrared waves, so that the electromagnetic wave has the characteristics of two wave spectrums. The millimeter wave antenna has the advantages of extremely wide bandwidth and narrow beam, and compared with laser, the propagation of millimeter wave is much less affected by weather, so that the millimeter wave antenna can be considered to have all-weather characteristics, and compared with microwave, the millimeter wave components are much smaller in size, so that the millimeter wave system is easier to miniaturize.
And in 2018, 10 months, a minimum new product of a millimeter wave antenna module series facing smart phones and other types of mobile terminals is released, and a 5G new air interface millimeter wave module is fully integrated. The newly introduced millimeter wave antenna module is 25% smaller than the first millimeter wave antenna module of the 7-month transmission part in 2018. A QTM527 millimeter wave antenna module facing an X555G modem and a radio frequency system is introduced in 9 months in 2019, a first global 5G fixed wireless access-oriented full-integrated range-extending millimeter wave solution is provided, and a mobile operator is supported to provide fixed internet broadband services for families and enterprises through 5G network infrastructure.
However, when the 5G millimeter wave antenna is applied to a terminal, because the millimeter wave antenna module can only be placed in a limited space due to the influence of the environment of the whole terminal, the existing millimeter wave antenna module mainly performs one-dimensional beam scanning, and only one-dimensional beam scanning in a horizontal plane or one-dimensional beam scanning in a vertical plane can be achieved. The omnidirectional beam coverage is realized by simultaneously placing 3-4 millimeter wave antenna modules in different directions, so that a larger installation position needs to be reserved for the mobile terminal, which is contrary to the miniaturization development trend of the mobile terminal.
SUMMERY OF THE UTILITY MODEL
In order to set a 5G millimeter wave antenna covered by omnidirectional wave beams on a mobile terminal and ensure that the occupied mounting position of the mobile terminal is smaller so as to adapt to the miniaturization development trend of the mobile terminal, the application provides a 5G millimeter wave communication module applied to the mobile terminal, which comprises a horizontal wave beam antenna sub-module and a vertical wave beam antenna sub-module; the horizontal beam antenna sub-module is connected with the vertical beam antenna sub-module through the transmission line flexible substrate;
the horizontal beam antenna sub-module is arranged on one plane of the terminal in a laminating mode, the transmission line soft substrate bypasses one edge side of the terminal, the vertical beam antenna sub-module is arranged on the other plane of the terminal in a laminating mode, and after the horizontal beam antenna sub-module is arranged in the laminating mode, the arrangement surface of the horizontal beam antenna sub-module is perpendicular to the arrangement surface of the vertical beam antenna sub-module;
the bottom of the vertical beam antenna sub-module is also provided with a phased array chip, and the phased array chip is connected with the horizontal beam antenna sub-module and controls the horizontal beam antenna sub-module to perform beam scanning on the horizontal plane; and the phased array chip is connected with the vertical beam antenna sub-module and controls the vertical beam antenna sub-module to perform vertical beam scanning.
Optionally, the horizontal beam antenna sub-module includes a horizontal radiating patch, a horizontal dielectric substrate, a horizontal antenna metal ground layer, a horizontal soft dielectric substrate, a horizontal feeder line, and a horizontal feeder line metal layer, which are stacked in sequence.
Optionally, the phased array chip is connected to the horizontal radiating patch through the horizontal feeder line.
Optionally, the horizontal radiating patch is a double-layer parasitic antenna unit, and includes two layers of horizontal parasitic patches and a horizontal main radiating patch, which are stacked.
Optionally, the horizontal feeder line is connected to the horizontal radiating patch through a first vertical via hole, and the horizontal feeder line is located at a lower layer of the horizontal radiating patch.
Optionally, the vertical beam antenna sub-module includes a vertical radiating patch, a vertical dielectric substrate, a vertical antenna metal ground layer, a vertical hard dielectric substrate, a control layer, a radio frequency isolation metal layer, a vertical soft dielectric substrate, a vertical feeder line, and a vertical feeder line metal layer, which are stacked in sequence.
Optionally, the phased array chip is connected to the vertical radiating patch through the vertical feeder line.
Optionally, the vertical radiating patch is a double-layer parasitic antenna unit, and includes two layers of vertical parasitic patches and a vertical main radiating patch, which are stacked.
Optionally, the vertical feed line is connected to the vertical radiating patch through a second vertical via hole, and the vertical feed line is located at a lower layer of the vertical radiating patch.
Optionally, the control layer includes a digital circuit, a radio frequency circuit, and a power supply.
According to the technical scheme, the 5G millimeter wave communication module applied to the mobile terminal comprises a horizontal beam antenna sub-module and a vertical beam antenna sub-module; the horizontal beam antenna sub-module is connected with the vertical beam antenna sub-module through the transmission line flexible substrate; the bottom of the vertical beam antenna sub-module is also provided with a phased array chip, and the phased array chip is connected with the horizontal beam antenna sub-module and controls the horizontal beam antenna sub-module to perform beam scanning on the horizontal plane; and the phased array chip is connected with the vertical beam antenna sub-module and controls the vertical beam antenna sub-module to perform vertical beam scanning.
In the practical application process, the horizontal beam antenna submodule is attached to and arranged on one plane of the terminal, the transmission line is arranged on the soft dielectric substrate in a combined mode of the soft dielectric substrate and the hard dielectric substrate to form the transmission line soft substrate, the transmission line soft substrate bypasses one edge side of the terminal, the vertical beam antenna submodule is attached to and arranged on the other plane of the terminal, and after the attachment and the arrangement, the arrangement surface of the horizontal beam antenna submodule is perpendicular to the arrangement surface of the vertical beam antenna submodule. Will through transmission line soft substrate horizontal beam antenna submodule group and perpendicular beam antenna submodule group are connected to set up the transmission line on the connecting wire, make the setting be in the phased array chip of perpendicular beam antenna submodule group bottom can connect and control horizontal beam antenna submodule group to through scanning face mutually perpendicular's horizontal beam antenna submodule group and perpendicular beam antenna submodule group, realize omnidirectional beam and cover, avoid using a plurality of millimeter wave antenna module groups, lead to the problem that mobile terminal need reserve great mounted position.
Drawings
In order to more clearly explain the technical solution of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic view of an installation position of a 5G millimeter wave communication module applied to a mobile terminal according to an embodiment of the present disclosure;
fig. 2 is a schematic side view of an installation position of a 5G millimeter wave communication module applied to a mobile terminal according to an embodiment of the present disclosure;
fig. 3 is an overall schematic diagram of a 5G millimeter wave communication module applied to a mobile terminal according to an embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of a horizontal beam antenna sub-module of a 5G millimeter wave communication module applied to a mobile terminal according to an embodiment of the present disclosure;
fig. 5 is a schematic structural diagram of a vertical beam antenna sub-module of a 5G millimeter wave communication module applied to a mobile terminal according to an embodiment of the present disclosure;
in the figure: the antenna comprises a 1-horizontal beam antenna sub-module, a 11-horizontal radiating sheet, a 12-horizontal feeder, a 13-first vertical through hole, a 2-vertical beam antenna sub-module, a 21-vertical radiating sheet, a 22-vertical feeder, a 23-second vertical through hole, a 3-transmission line flexible substrate and a 4-phased array chip.
Detailed Description
The 5G millimeter wave antenna covered by the omnidirectional wave beams is arranged on the mobile terminal, and the occupied small installation position of the mobile terminal is ensured, so that the miniaturization development trend of the mobile terminal is adapted. An embodiment of the present application provides a 5G millimeter wave communication module applied to a mobile terminal, and as shown in fig. 1, is a schematic view of an installation position of the 5G millimeter wave communication module applied to the mobile terminal provided in the embodiment of the present application; fig. 3 is a schematic overall view of a 5G millimeter wave communication module applied to a mobile terminal according to an embodiment of the present disclosure. The 5G millimeter wave communication module comprises a horizontal beam antenna sub-module 1 and a vertical beam antenna sub-module 2; the horizontal beam antenna sub-module 1 is connected with the vertical beam antenna sub-module 2 through the transmission line flexible substrate 3; the bottom of the vertical beam antenna sub-module 2 is also provided with a phased array chip 4, the phased array chip 4 is connected with the horizontal beam antenna sub-module 1, and controls the horizontal beam antenna sub-module 1 to perform beam scanning on the horizontal plane; and the phased array chip 4 is connected with the vertical beam antenna sub-module 2 and controls the vertical beam antenna sub-module 2 to perform vertical beam scanning.
In an actual application process, as shown in fig. 2, a schematic side view of an installation position of a 5G millimeter wave communication module applied to a mobile terminal according to an embodiment of the present application is provided. The horizontal beam antenna sub-module 1 is attached to and arranged on a plane of a terminal, a transmission line is arranged on a soft medium substrate through the combination of the soft medium substrate and the hard medium substrate to form the transmission line soft substrate 3, the transmission line soft substrate 3 bypasses the edge side of the terminal, the vertical beam antenna sub-module 2 is attached to and arranged on the other plane of the terminal, and after the attachment and the arrangement, the arrangement surface of the horizontal beam antenna sub-module 1 is perpendicular to the arrangement surface of the vertical beam antenna sub-module 2.
Will through transmission line soft substrate 3 horizontal beam antenna submodule group 1 and perpendicular beam antenna submodule group 2 are connected to set up the transmission line on the connecting line, make the setting be in phased array chip 4 of perpendicular beam antenna submodule group 2 bottom can connect and control horizontal beam antenna submodule group 1 to through horizontal beam antenna submodule group 1 and perpendicular beam antenna submodule group 2 of scanning face mutually perpendicular, realize omnidirectional beam and cover, avoid using a plurality of millimeter wave antenna module groups, lead to the problem that mobile terminal need reserve great mounted position.
Further, in some embodiments of the present application, as shown in fig. 4, a schematic structural diagram of a horizontal beam antenna sub-module of a 5G millimeter wave communication module applied to a mobile terminal is provided in the embodiments of the present application. The horizontal beam antenna sub-module 1 comprises a horizontal radiating sheet 11, a horizontal dielectric substrate, a horizontal antenna metal ground layer, a horizontal soft dielectric substrate, a horizontal feeder line 12 and a horizontal feeder line metal layer which are sequentially stacked.
The horizontal radiating patch 11 is a double-layer parasitic antenna unit, and includes two layers of horizontal parasitic patches and a horizontal main radiating patch which are stacked, but is not limited to the double-layer parasitic antenna unit, and can adopt radiating elements of other forms according to actual design requirements, and the scanning loss of the horizontal radiating patch 11 can be effectively improved by adopting the antenna design of the double-layer parasitic patches.
The phased array chip 4 is connected with the horizontal radiation piece 11 through the horizontal feeder line 12. The horizontal feeder 12 is located at the lower layer of the horizontal radiating patch 11, is connected with the horizontal radiating patch 11 through a first vertical via hole 13, and a part of the horizontal feeder 12 is arranged on the transmission line flexible substrate 3, so as to be connected with the phased array chip 4 arranged at the bottom of the vertical beam antenna sub-module 2, thereby providing the integration level of the 5G millimeter wave communication module. In practical applications, the impedance discontinuity problem of the first vertical via 13 may cause impedance mismatch, and the transmission loss is increased S21, and to avoid this problem, in the position design process of the first vertical via 17, an appropriate layout is selected to ensure that there is sufficient headroom around the horizontal radiating patch 11, so as to optimize the impedance mismatch condition caused by the impedance discontinuity of the first vertical via 13.
Further, in some embodiments of the present application, as shown in fig. 5, a schematic structural diagram of a vertical beam antenna sub-module of a 5G millimeter wave communication module applied to a mobile terminal is provided in the embodiments of the present application. The vertical beam antenna sub-module 2 comprises a vertical radiating sheet 21, a vertical dielectric substrate, a vertical antenna metal ground layer, a vertical hard dielectric substrate, a control layer, a radio frequency isolation metal layer, a vertical soft dielectric substrate, a vertical feeder 22 and a vertical feeder metal layer which are sequentially stacked.
The vertical radiating patch 21 is a double-layer parasitic antenna unit, and includes two layers of vertical parasitic patches and a vertical main radiating patch which are stacked, but is not limited to the double-layer parasitic antenna unit, and can adopt other forms of radiating elements according to actual design requirements, and the scanning loss of the vertical radiating patch 21 can be effectively improved by adopting the antenna design through the double-layer parasitic patches.
The phased array chip 4 is connected to the vertical radiating patch 21 through the vertical feeder 22. The vertical feed line 22 is connected to the vertical radiating patch 21 through a second vertical via 23, and the vertical feed line 22 is located at a lower layer of the vertical radiating patch 21. Through the design of the second vertical via hole 23, the vertical beam antenna sub-module 2 is designed in a stacked manner, the high integration of the 5G millimeter wave communication module is ensured, in the practical application process, the impedance mismatch may be caused by the impedance discontinuity problem of the second vertical via hole 23, and the transmission loss S21 is increased.
According to the technical scheme, the embodiment of the application provides a 5G millimeter wave communication module applied to a mobile terminal, which comprises a horizontal beam antenna sub-module 1 and a vertical beam antenna sub-module 2; the horizontal beam antenna sub-module 1 is connected with the vertical beam antenna sub-module 2 through the transmission line flexible substrate 3; the bottom of the vertical beam antenna sub-module 2 is also provided with a phased array chip 4, the phased array chip 4 is connected with the horizontal beam antenna sub-module 1, and controls the horizontal beam antenna sub-module 1 to perform beam scanning on the horizontal plane; and the phased array chip 4 is connected with the vertical beam antenna sub-module 2 and controls the vertical beam antenna sub-module 2 to perform vertical beam scanning.
In the practical application process, the horizontal beam antenna sub-module 1 is attached to and arranged on one plane of the terminal, the transmission line is arranged on the soft dielectric substrate in a combined mode of the soft dielectric substrate and the hard dielectric substrate to form the transmission line soft substrate 3, the transmission line soft substrate 3 bypasses one edge side of the terminal, the vertical beam antenna sub-module 2 is attached to and arranged on the other plane of the terminal, and after the attachment is arranged, the arrangement surface of the horizontal beam antenna sub-module 1 is perpendicular to the arrangement surface of the vertical beam antenna sub-module 2. Will through transmission line soft substrate 3 horizontal beam antenna submodule group 1 and perpendicular beam antenna submodule group 2 are connected to set up the transmission line on the connecting line, make the setting be in phased array chip 4 of perpendicular beam antenna submodule group 2 bottom can connect and control horizontal beam antenna submodule group 1 to through horizontal beam antenna submodule group 1 and perpendicular beam antenna submodule group 2 of scanning face mutually perpendicular, realize omnidirectional beam and cover, avoid using a plurality of millimeter wave antenna module groups, lead to the problem that mobile terminal need reserve great mounted position.
The present application has been described in detail with reference to specific embodiments and illustrative examples, but the description is not intended to limit the application. Those skilled in the art will appreciate that various equivalent substitutions, modifications or improvements may be made to the presently disclosed embodiments and implementations thereof without departing from the spirit and scope of the present disclosure, and these fall within the scope of the present disclosure. The protection scope of this application is subject to the appended claims.
Claims (10)
1. A5G millimeter wave communication module applied to a mobile terminal is characterized by comprising a horizontal beam antenna sub-module (1) and a vertical beam antenna sub-module (2); the horizontal beam antenna sub-module (1) is connected with the vertical beam antenna sub-module (2) through the transmission line flexible substrate (3);
the horizontal beam antenna sub-module (1) is attached to and arranged on one plane of the terminal, the transmission line flexible substrate (3) bypasses one edge side of the terminal, the vertical beam antenna sub-module (2) is attached to and arranged on the other plane of the terminal, and after the attachment and arrangement, the arrangement surface of the horizontal beam antenna sub-module (1) is perpendicular to the arrangement surface of the vertical beam antenna sub-module (2);
the bottom of the vertical beam antenna sub-module (2) is also provided with a phased array chip (4), the phased array chip (4) is connected with the horizontal beam antenna sub-module (1) and controls the horizontal beam antenna sub-module (1) to scan beams on the horizontal plane; and the phased array chip (4) is connected with the vertical beam antenna sub-module (2) and controls the vertical beam antenna sub-module (2) to scan beams in a vertical plane.
2. The 5G millimeter wave communication module applied to the mobile terminal according to claim 1, wherein the horizontal beam antenna sub-module (1) comprises a horizontal radiating plate (11), a horizontal dielectric substrate, a horizontal antenna metal ground layer, a horizontal soft dielectric substrate, a horizontal feeder line (12) and a horizontal feeder line metal layer, which are sequentially stacked.
3. A 5G millimeter wave communication module applied to a mobile terminal according to claim 2, wherein the phased array chip (4) is connected with the horizontal radiation patch (11) through the horizontal feeder line (12).
4. The 5G millimeter wave communication module applied to the mobile terminal according to claim 2, wherein the horizontal radiating patch (11) is a double-layer parasitic antenna unit, and comprises two layers of horizontal parasitic patches and a horizontal main radiating patch which are stacked.
5. The 5G millimeter wave communication module applied to the mobile terminal according to claim 2, wherein the horizontal feed line (12) is connected to the horizontal radiating patch (11) through a first vertical via (13), and the horizontal feed line (12) is located below the horizontal radiating patch (11).
6. The 5G millimeter wave communication module applied to the mobile terminal according to claim 1, wherein the vertical beam antenna sub-module (2) comprises a vertical radiation sheet (21), a vertical dielectric substrate, a vertical antenna metal ground layer, a vertical hard dielectric substrate, a control layer, a radio frequency isolation metal layer, a vertical soft dielectric substrate, a vertical feeder line (22) and a vertical feeder line metal layer, which are sequentially stacked.
7. A5G millimeter wave communication module applied to a mobile terminal according to claim 6, wherein the phased array chip (4) is connected with the vertical radiation sheet (21) through the vertical feed line (22).
8. The 5G millimeter wave communication module applied to the mobile terminal according to claim 6, wherein the vertical radiating patch (21) is a double-layer parasitic antenna unit, and comprises two layers of vertical parasitic patches and a vertical main radiating patch which are stacked.
9. The 5G millimeter wave communication module applied to the mobile terminal according to claim 6, wherein the vertical feed line (22) is connected to the vertical radiating patch (21) through a second vertical via (23), and the vertical feed line (22) is located below the vertical radiating patch (21).
10. The 5G millimeter wave communication module applied to a mobile terminal according to claim 6, wherein the control layer comprises a digital circuit, a radio frequency circuit and a power supply.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202120179939.4U CN214957320U (en) | 2021-01-22 | 2021-01-22 | 5G millimeter wave communication module applied to mobile terminal |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202120179939.4U CN214957320U (en) | 2021-01-22 | 2021-01-22 | 5G millimeter wave communication module applied to mobile terminal |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115499041A (en) * | 2022-11-14 | 2022-12-20 | 深圳芯盛思技术有限公司 | Client equipment adopting phased array technology |
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2021
- 2021-01-22 CN CN202120179939.4U patent/CN214957320U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115499041A (en) * | 2022-11-14 | 2022-12-20 | 深圳芯盛思技术有限公司 | Client equipment adopting phased array technology |
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Inventor after: Li Qinfang Inventor after: Qian Zhanyi Inventor after: Tan Guannan Inventor after: Yu Bin Inventor before: Li Qinfang Inventor before: Qian Zhanyi Inventor before: Yu Bin |
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