CN115499041A - Client equipment adopting phased array technology - Google Patents
Client equipment adopting phased array technology Download PDFInfo
- Publication number
- CN115499041A CN115499041A CN202211417301.5A CN202211417301A CN115499041A CN 115499041 A CN115499041 A CN 115499041A CN 202211417301 A CN202211417301 A CN 202211417301A CN 115499041 A CN115499041 A CN 115499041A
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- Prior art keywords
- chip
- phased array
- substrate
- millimeter wave
- beam forming
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B7/00—Radio transmission systems, i.e. using radiation field
- H04B7/02—Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas
- H04B7/04—Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas using two or more spaced independent antennas
- H04B7/0408—Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas using two or more spaced independent antennas using two or more beams, i.e. beam diversity
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
Abstract
The invention discloses client equipment adopting a phased array technology, which comprises a substrate, and a millimeter wave antenna, a phased array beam forming chip, an up/down mixer chip, a frequency synthesis chip, an MCU chip, a mobile phone SOC chip, a power supply chip and a communication interface which are arranged on the substrate and are connected in sequence; the phased array beam forming chip is internally provided with a plurality of receiving channels and a plurality of transmitting channels; a low noise amplifier and a phase shifter are arranged in each receiving channel; and the number of the vibrators of the millimeter wave antenna corresponds to the number of receiving channels or transmitting channels in the corresponding phased array beam forming chip. The invention has the advantages that the antenna array of the 5G millimeter wave can be expanded, the transmitting power and the receiving sensitivity are improved, the receiving sensitivity is higher than that of the mobile phone made of the original 5G millimeter wave SOC chip, and the defect of poor signal of the millimeter wave mobile phone can be overcome.
Description
Technical Field
The invention relates to the technical field of electronic equipment and electronic devices, in particular to client equipment adopting a phased array technology.
Background
The main problem faced by the communication technology in the information age is to solve the contradiction between the generation of mass data and the insufficient communication capacity, one of the current major solutions is to introduce a new wireless standard every few years to define new protocols, i.e., more complex modulation schemes, to increase data throughput, and another way to increase bandwidth, the well-known shannon-hartley theorem states that the capacity of a communication system is a linear function of bandwidth, in order to transmit more data quickly, the modulated signal (FBW) can theoretically be extended into a wider frequency range to increase its bandwidth, the current development of wireless communication follows the idea, and the licensed operating frequency band of 5G cellular networks is mainly below 6GHz frequency, the available spectrum bandwidth is limited to a certain extent, so that the data rate is limited, and with the development of higher definition of video shooting (compared with the shooting of jittering videos by mobile phones or live broadcasting) and online movies by cameras, the expansion of the operating spectrum to a higher frequency band is inevitable, thus, the trend requirements can be met, the wireless communication of the millimeter wave frequency band (generally, the electromagnetic wave frequency band of 30GHz to 300 GHz) has the advantages of wide frequency spectrum and strong effective line-of-sight communication capability, can greatly improve the bandwidth and the data transmission rate, and end-to-end delay is reduced, and communication capacity is greatly improved, so that more and more attention is paid and practical application is gradually obtained, more millimeter wave high-end frequency bands (generally, the frequency band is more than 6 GHz) are used, a millimeter wave industrial chain is developed, and generally, it is considered that a fifth generation mobile communication technology (5G) is to deploy a base station of a millimeter wave frequency band, and a mobile phone supporting the millimeter wave frequency band is used, so that data capacity is improved to be more than 10 Gbps.
The other technical route for improving the wireless communication data rate is Wi-Fi, which can be clearly seen, wherein the highest 40MHz bandwidth of Wi-Fi 4, the highest 160MHz bandwidth of Wi-Fi 5 and Wi-Fi6, and the highest 320MHz bandwidth of Wi-Fi7 are achieved, the bandwidth is improved rapidly, the working frequency is improved from 2.4GHz and 5GHz to 6GHz, in addition, the modulation mode is improved from 64 QAM, 256 QAM and 1024 QAM to 4096 QAM, the data rate is further increased, wiFi6 can support 9.6Gbps, the highest download speed of WiFi7 can reach 30Gbps, the highest download speed of 5G millimeter waves is already exceeded, at present, a plurality of mobile phones support Wi-Fi6E, common WiFi6 routers are all 3.6Gbps, the main frequency bands of 1.2Gbps are 2.4GHz and 5.8GHz, and Wi-Fi7 has three frequency bands which are 2.4GHz,5GHz and 6GHz respectively, the higher frequency is, and the three frequency bands can work more rapidly.
In conclusion, both wireless cellular communication and wireless Wi-Fi connectivity are improving data rates, and 5G millimeter waves are substantially matched with the high-speed data rate of Wi-Fi 6E.
However, not all terminal devices support the new standard, and there is always a problem that when using an old mobile phone, it is difficult for everyone to immediately enjoy the benefit of data rate improvement brought by the new technology, and another problem is that the attenuation of the electromagnetic wave in the millimeter wave frequency band in the air is larger than that of the centimeter wave, the coverage range of each base station becomes smaller, and an important technology of 5G millimeter wave is to use a phased array mode to improve the transceiving distance by using beam forming. Because of cost constraints, there will always be a range where the handset will not be able to serve well in the base station.
Disclosure of Invention
The invention aims to solve the defects in the prior art, and provides a method for designing and manufacturing a client device by using a phased array technology.
In order to achieve the purpose, the invention adopts the following technical scheme:
a client device using phased array technology comprises
A substrate as a mounting carrier;
the phased array beam forming chip is arranged on the substrate;
the millimeter wave antenna is arranged on the substrate, is positioned beside the phased array beam forming chip and is connected with the phased array beam forming chip or is integrated on the phased array beam forming chip;
the up/down mixer chip is arranged on the substrate and connected with the phased array beam forming chip;
the frequency synthesizer chip is arranged on the substrate and is connected with the upper/lower mixer chip;
the mobile phone SOC chip supports the millimeter wave CPE and is arranged on the substrate and connected with the upper/lower mixer chip;
the MCU chip is arranged on the substrate and is connected with the frequency synthesizer chip and the mobile phone SOC chip;
the power supply chip is arranged on the substrate, connected with the mobile phone SOC chip and used for supplying power to the phased array beam forming chip, the up/down mixer chip, the frequency synthesis chip, the mobile phone SOC chip and the independent MCU chip; and
the communication interface is arranged on the substrate and connected with the power chip;
the phased array beam forming chip is internally provided with a plurality of receiving channels and a plurality of transmitting channels; a low noise amplifier and a phase shifter are arranged in each receiving channel;
the number of vibrators of the millimeter wave antenna corresponds to the number of channels in the corresponding phased array beam forming chip;
when receiving signals, the millimeter wave antenna receives radio frequency signals, the radio frequency signals are amplified and phase-adjusted through a receiving channel of the phased array beam forming chip, converted to analog baseband signals through the upper/lower mixer chip, and sent to the SOC chip of the mobile phone after being filtered on the substrate;
when transmitting signals, the SOC chip of the mobile phone converts the data to be transmitted into analog baseband signals, the analog baseband signals are filtered on the substrate, the analog baseband signals are converted into millimeter wave frequency bands by the up/down mixer chip, the millimeter wave frequency bands are amplified by a power amplifier in a transmitting channel of the phased array beam forming chip, and the millimeter wave signals are transmitted by a millimeter wave antenna.
Furthermore, the surface of the substrate is provided with positioning points, and the phased array beam forming chip is attached to the positioning points of the substrate through UV glue.
Further, the millimeter wave antenna is attached to the surface of the substrate through UV glue.
Further, the up/down mixer chip is fixed on the substrate surface by soldering.
Furthermore, the frequency synthesizer chip comprises a phase-locked loop and a voltage-controlled oscillator, and the frequency synthesizer chip is welded on the substrate and provides local oscillation signals for millimeter wave signal processing.
Furthermore, the communication interface is located at an end of the substrate, and the communication interface is a USB interface.
Furthermore, the mobile phone SOC chip adopts a built-in program mode as a hot spot mode, and the frequency synthesizer chip, the up/down mixer chip and the phased array beam synthesis chip all use an independent configuration MCU.
Furthermore, the mobile phone further comprises a 2.4GHz Wi-Fi antenna and a 5.8GHz Wi-Fi antenna, wherein the 2.4GHz Wi-Fi antenna and the 5.8GHz Wi-Fi antenna are printed on the substrate and are connected with the SOC chip of the mobile phone.
Furthermore, the phased array beam forming chip, the millimeter wave antenna and the up/down mixer chip are all provided with M groups and are connected in a one-to-one correspondence manner, wherein M is a positive integer.
Compared with the prior art, the invention has the beneficial effects that:
1. the 5G millimeter wave client terminal equipment provided by the invention can expand the antenna array of 5G millimeter waves, improves the transmitting power and the receiving sensitivity, has higher receiving sensitivity than a mobile phone made of the original 5G millimeter wave SOC chip, and can overcome the defect of poor signal of the millimeter wave mobile phone.
2. The user terminal can be installed on a 5G mobile phone or a 4G mobile phone of SUB6GHz, which does not support 5G millimeter waves, so that the old mobile phone can enjoy the high data rate of the 5G millimeter waves, and meanwhile, the user terminal can also be installed on a power bank, and a notebook computer and a tablet personal computer (iPAD) are supported to surf the internet in a hotspot mode, so that the data transmission rate is improved, and the data security risk when free Wi-Fi provided by municipal administration or commercial enterprises is used is reduced.
3. The invention has lower production cost, and the indoor and outdoor use is farther than the receiving and transmitting distance of the common millimeter wave mobile phone, thereby enjoying the high-speed data rate of the millimeter wave and solving the defect of short transmission distance of the millimeter wave, thereby having important value.
Drawings
Fig. 1 is a schematic structural diagram of a client device adopting a phased array technology according to the present invention.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms than those specifically described herein, and it will be apparent to those skilled in the art that many more modifications are possible without departing from the spirit and scope of the invention.
Referring to fig. 1, a client apparatus using phased array technology, whose main body includes a substrate, may be substantially any shape, but for convenience of use, a rectangular design is often used here.
Four phased array beam forming chips (AIP) are arranged on the substrate, the four phased array beam forming chips are distributed on the edge of the substrate in a rectangular shape, four groups of millimeter wave antennas are arranged on the substrate, the four groups of millimeter wave antennas are arranged in a rectangular symmetrical mode, and in addition to the millimeter wave antennas, 2.4GHz Wi-Fi antennas and 5.8GHz Wi-Fi antennas are arranged; four up/down mixer chips, a frequency synthesizer chip, a USB interface, a mobile phone SOC chip and a power supply chip are arranged on the substrate.
The up/down mixer chip includes an up mixer and a down mixer. The frequency mixer is a chip and realizes two functions of up-mixing and down-mixing. And the frequency synthesizer chip provides four local oscillation signals to the four upper/lower mixer chips after power division. The USB interface may employ Type C or similar data and power interfaces. The mobile phone SOC chip and the power supply chip are used by a Customer Premise Equipment (CPE).
The four phased array beam forming chips are attached to the surface of the substrate through UV glue, four locating points are arranged on the substrate, and the four locating points are used for assisting in attaching the phased array beam forming chips. It should be noted that the substrate is integrally plastic-sealed, the shape of the substrate is matched with the shape and size of a target mobile phone, the substrate can also be plastic-sealed according to the shape and size of a charge pal, the mobile phone or the charge pal can be used for taking electricity, and the USB interface can be rigidly connected, namely fixed on the substrate, and can also be connected by a flexible wire.
The mobile phone SOC chip and the power supply chip are connected with the surface of the substrate in a welding mode, the phased array beam forming chip adopts a SiGe process or a silicon-based fully depleted isolation process, a receiving channel and a transmitting channel are arranged in the phased array beam forming chip, a low-noise amplifier and a phase shifter are arranged in the receiving channel, and the number of vibrators of each group of four groups of millimeter wave antennas corresponds to the number of the receiving channel or the transmitting channel of the phased array beam forming chip.
It is worth mentioning that the SOC chip of a general 5G millimeter wave mobile phone supports 4CC carrier aggregation, so that it is more convenient to use four sets of phased array beam forming chips with millimeter wave antennas. If two phased array beam forming chips are adopted, the phased array beam forming chips are distributed at two ends of the substrate; if four phased array beam forming chips are adopted, the four phased array beam forming chips are placed at four corners of the substrate. The phased array beam forming chip is arranged close to the edge, so that the antenna of the handheld device can be prevented from being shielded by hands when the handheld device works. To reduce radiation and prevent interference, the substrate circuit is routed using differential routing. It should be noted that "N" as shown in fig. 1 generally refers to the number of transceiving channels of the phased array beamforming chip, which is usually a multiple of 4, 8 or 4, and theoretically can improve the receiving sensitivity by 6dB or 12dB, and increase the transmitting power by 6dB or 12 dB. The invention does not limit the channel number and the design mode of the phased array beam synthesis chip. And "M" in fig. 1 means that M phased array beamforming chips are connected in parallel.
The four groups of millimeter wave antennas are attached to the surface of the substrate through UV glue, the two groups of millimeter wave antennas are located near the two phased array beam forming chips on the same side, the millimeter wave antennas receive radio-frequency signals, the radio-frequency signals are converted into analog baseband signals through a down mixer in the up/down mixer chip after being amplified and phase-adjusted, and the analog baseband signals are transmitted to the SOC chip of the mobile phone and converted into digital signals after being filtered on the substrate. When transmitting signals, the SOC chip of the mobile phone converts the data to be transmitted into analog baseband signals, after filtering is carried out on the substrate, the millimeter wave frequency band is converted by a down mixer in the up/down mixer chip, amplified by a power amplifier in a transmitting channel of the phased array beam synthesis chip and transmitted by a millimeter wave antenna.
The built-in program of the mobile phone SOC chip (the SOC chip designed for 5G millimeter wave CPE by the mobile phone chip manufacturer) is set to be a hot spot mode, and the frequency synthesizer chip, the up/down mixer chip and the phased array beam synthesis chip all use independent MCU chips (the modification of the program of the mobile phone SOC chip is reduced without direct configuration of the mobile phone SOC chip). It should be noted that if the mobile phone SOC chip uses the baseband mode, the up/down mixer chip uses the I/Q modulator and I/Q demodulator modes, and if the mobile phone SOC chip uses the digital intermediate frequency mode, the up/down mixer chip uses the I/Q mixer mode (I-phase shifted by the 90-degree phase shifter and then Q-phase shifted to output the intermediate frequency).
In the invention, the MCU chip can be internally provided with a program which is communicated with the mobile phone SOC chip, and the mobile phone SOC chip can transmit data to the MCU chip or not transmit the data (if the working frequency band or the gain does not need to be changed). However, the MCU chip is considered to be provided in consideration that the frequency synthesizer chip needs the MCU chip to write the initialization data.
As can be seen from fig. 1, four up/down mixer chips are soldered on the surface of the substrate, and the four up/down mixer chips are distributed on one side of the four phased array beamforming chips in a rectangular shape, the frequency synthesizer chip is composed of a Phase Locked Loop (PLL) and a Voltage Controlled Oscillator (VCO), the frequency synthesizer chip is soldered on the substrate, the frequency synthesizer chip is located at a position lower than the middle of the substrate, a local oscillation signal generated by the frequency synthesizer chip can be subjected to band-pass filtering on the substrate by using an inductor and a capacitor, so as to reduce harmonic components, a frequency multiplier is provided in the up/down mixer chip, so as to reduce the signal amplitude attenuation from the frequency synthesizer chip to the mixer chip, the USB interface is located at the end of the substrate, and the USB interface is Type-C, it should be noted that the USB interface may also be B-5Pin, B-4Pin, B-8Pin-2 × 4, micro USB, or the like. It is worth mentioning that when the wireless network access device is used indoors and outdoors, the wireless network access device is buckled on a SUB-6GHz 5G mobile phone or a charger, and supports a notebook computer and a tablet computer to surf the internet in a Wi-Fi hotspot mode, so that the high-speed data rate of millimeter waves is enjoyed, and the defect of short millimeter wave transmission distance is overcome. For convenience of illustration, the up/down mixer chips of one group are shown in detail in fig. 1 (bottom right), and the other three groups are the same. In addition, the MCU disposed under the frequency synthesizer chip in fig. 1 may be an optional device. Can be used for configuring the transceiving of the millimeter wave antenna; if not, the transmitting and receiving of the millimeter wave antenna can be configured by the SoC chip of the mobile phone.
The core principle of the invention is that blind spots can be reduced by improving the transmitting power and receiving sensitivity of the mobile phone, after a 5G millimeter wave base station (including a small base station covered indoors) is deployed in a large scale, a client terminal equipment (CPE) which converts 5G millimeter waves into Wi-Fi is used, so that the mobile phone which does not support 5G millimeter waves can enjoy the high data rate of the 5G millimeter waves, portable equipment such as a notebook computer and a tablet computer can enjoy the high data rate of the 5G millimeter waves, and the potential safety hazard of data using a public Wi-Fi network can be eliminated. In general, when a signal is weak, the wireless communication technology prevents a drop by reducing a data rate, and can better maintain high-speed data transmission by using Customer Premise Equipment (CPE) with higher transmission power and higher receiving sensitivity.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (9)
1. A client device using phased array technology, comprising
A substrate as a mounting carrier;
the phased array beam forming chip is arranged on the substrate;
the millimeter wave antenna is arranged on the substrate, is positioned beside the phased array beam forming chip and is connected with the phased array beam forming chip or is integrated on the phased array beam forming chip;
the up/down mixer chip is arranged on the substrate and connected with the phased array beam forming chip;
the frequency synthesizer chip is arranged on the substrate, is connected with the upper/lower frequency mixer chip and provides local oscillation signals for the upper/lower frequency mixer chip;
the mobile phone SOC chip supports the millimeter wave CPE and is arranged on the substrate and connected with the upper/lower mixer chip;
the MCU chip is arranged on the substrate and is connected with the frequency synthesizer chip and the mobile phone SOC chip;
the power supply chip is arranged on the substrate, connected with the mobile phone SOC chip and used for supplying power to the phased array beam forming chip, the up/down mixer chip, the frequency synthesis chip, the mobile phone SOC chip and the independent MCU chip; and
the communication interface is arranged on the substrate and connected with the power supply chip;
the phased array beam forming chip is internally provided with a plurality of receiving channels and a plurality of transmitting channels; a low noise amplifier and a phase shifter are arranged in each receiving channel;
the number of vibrators of the millimeter wave antenna corresponds to the number of receiving channels or transmitting channels in the corresponding phased array beam forming chip;
when receiving signals, the millimeter wave antenna receives radio frequency signals, the radio frequency signals are amplified and phase-adjusted through a receiving channel of the phased array beam forming chip, converted to analog baseband signals through the upper/lower mixer chip, and sent to the SOC chip of the mobile phone after being filtered on the substrate;
when transmitting signals, the SOC chip of the mobile phone converts the data to be transmitted into analog baseband signals, the analog baseband signals are filtered on the substrate, the analog baseband signals are converted into millimeter wave frequency bands by the up/down mixer chip, the millimeter wave frequency bands are amplified by a power amplifier in a transmitting channel of the phased array beam forming chip, and the millimeter wave signals are transmitted by a millimeter wave antenna.
2. The client device adopting phased array technology as claimed in claim 1, wherein the substrate surface is provided with positioning points, and the phased array beam forming chip is attached to the positioning points of the substrate by UV glue.
3. The client device adopting phased array technology as claimed in claim 1, wherein said millimeter wave antenna is attached to the substrate surface by UV glue.
4. The client device using the phased array technology according to claim 1, wherein the up/down mixer chip is fixed to a surface of the substrate by soldering.
5. The client device using phased array technology as claimed in claim 1, wherein the frequency synthesizer chip comprises a phase locked loop and a voltage controlled oscillator, and the frequency synthesizer chip is soldered on the substrate and provides a local oscillator signal for millimeter wave signal processing.
6. The client device using phased array technology as claimed in claim 1, wherein the communication interface is located at an end of the substrate, and the communication interface is a USB interface.
7. The client device according to claim 1, wherein the SOC chip of the mobile phone adopts a hot spot mode as a built-in program, and the frequency synthesizer chip, the up/down mixer chip, and the phased array beamforming chip all use an MCU with independent configuration.
8. The client device adopting the phased array technology as claimed in claim 1, further comprising a 2.4GHz Wi-Fi antenna and a 5.8GHz Wi-Fi antenna, wherein the 2.4GHz Wi-Fi antenna and the 5.8GHz Wi-Fi antenna are both printed on the substrate and are both connected to the SOC chip of the mobile phone.
9. The method as claimed in claim 1, wherein the phased array beamforming chips, the millimeter wave antennas, and the up/down mixer chips are arranged in M groups and connected in a one-to-one correspondence, where M is a positive integer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202211417301.5A CN115499041A (en) | 2022-11-14 | 2022-11-14 | Client equipment adopting phased array technology |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211417301.5A CN115499041A (en) | 2022-11-14 | 2022-11-14 | Client equipment adopting phased array technology |
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| CN115499041A true CN115499041A (en) | 2022-12-20 |
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| CN202211417301.5A Pending CN115499041A (en) | 2022-11-14 | 2022-11-14 | Client equipment adopting phased array technology |
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| CN206962004U (en) * | 2016-04-26 | 2018-02-02 | 苹果公司 | Device and electronic equipment including phased antenna array |
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