CN111835376A - High-integration multi-channel tile type T/R assembly and arrangement method - Google Patents
High-integration multi-channel tile type T/R assembly and arrangement method Download PDFInfo
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- CN111835376A CN111835376A CN202010795812.5A CN202010795812A CN111835376A CN 111835376 A CN111835376 A CN 111835376A CN 202010795812 A CN202010795812 A CN 202010795812A CN 111835376 A CN111835376 A CN 111835376A
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0006—Particular feeding systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
- H04B1/401—Circuits for selecting or indicating operating mode
Abstract
The invention discloses a high-integration multi-channel tile type T/R assembly and an arrangement method, wherein the high-integration multi-channel tile type T/R assembly is square, and is surrounded by a bottom plate, a cover plate, a front plate, a rear plate, a left plate and a right plate as walls to form an installation cavity, and the high-integration multi-channel tile type T/R assembly is characterized in that: the bottom plate is provided with n groups of first connectors, each group of first connectors consists of a receiving connector and a transmitting connector, each group of first connectors is perpendicular to the bottom plate, the cover plate is provided with 1 group of second connectors, the second connectors are combined ports for receiving output and transmitting input, the cover plate is provided with through grooves, and three layers are arranged in the installation cavity. The invention integrates a plurality of radio frequency channels to realize miniaturization, can effectively reduce the section height of the active phased array antenna, and the heating device in the T/R component is tightly attached to the heat sink to achieve the purpose of rapid heat conduction.
Description
Technical Field
The invention relates to the field of aerospace, in particular to a high-integration multi-channel tile type T/R assembly, an active phased-array antenna and an arrangement method of the high-integration multi-channel tile type T/R assembly.
Background
Active phased array antennas have been widely used in the military and civilian fields such as radar, communications, and the like. The T/R component is the most key part in the antenna, the radio frequency signal of the traditional brick T/R component is parallel to the component mounting direction, and the brick T/R component has the advantages of simple circuit, mature process and low cost. On one hand, however, with the increase of the working frequency, the array element spacing of the active phased array antenna becomes very small, generally, the array element spacing is about half wavelength of the frequency, when the working frequency is 1GHz, the array element spacing is about 150mm, and when the working frequency is increased to 10GHz, the array element spacing is about 15mm, so that the thickness of the brick assembly is very thin, and even the engineering realization is difficult; on the other hand, the assembly is far away from the cold plate, the heat dissipation path is long, the thermal resistance is large, and the heat dissipation structure is complex. Meanwhile, the longitudinal size of the antenna is determined to be large by the installation mode, so that the section of the whole active antenna is difficult to reduce, and the antenna cannot be applied to active phased array antennas with low section requirements, such as space size limitation, special loading platforms or conformal arrays.
Disclosure of Invention
In view of the above problems, in one aspect, the present invention provides a highly integrated multi-channel tile type T/R assembly, which integrates a plurality of rf channels to achieve miniaturization, and can effectively reduce the profile height of an active phased array antenna, and a heat generating device inside the T/R assembly is tightly attached to a heat sink to achieve the purpose of rapid heat conduction.
A high-integration multi-channel tile-type T/R assembly is square, and is formed by enclosing a bottom plate, a cover plate, a front plate, a rear plate, a left plate and a right plate into a mounting cavity, wherein n groups of first connectors are mounted on the bottom plate, each group of first connectors respectively consists of a receiving connector and a transmitting connector, each group of first connectors is respectively vertical to the bottom plate, 1 group of second connectors are mounted on the cover plate and are combiner ports for receiving output and transmitting input, a through groove is formed in the cover plate, three layers are arranged in the mounting cavity, a microwave printed circuit board, a power amplifier module and a limiting and low-noise amplifier circuit are arranged on the first layer, a multifunctional module is arranged on the second layer, a first switching module is arranged between the first layer and the second layer, an active sub-module is arranged on the third layer, and a second switching module is arranged between the second layer and the third layer, the microwave printed circuit board is respectively connected with the first connector, the power amplifier module and the amplitude limiting and low-noise discharging circuit, the first switching module is connected with the multifunctional module, the multifunctional module is connected with the second switching module, the second switching module is connected with the power dividing module, and the power dividing module is connected with the second connector.
Preferably, the n sets of first connectors are 4 sets of first connectors.
Preferably, the multi-function module includes the multi-function chips for the multi-function module, the control chip for the multi-function module, and the first LTCC multilayer substrate, the number of which is equal to the number of the channels, and the multi-function chips for the multi-function module and the control chip for the multi-function module are respectively connected to the first LTCC multilayer substrate.
Preferably, the power distribution module includes a driving chip for the power distribution module, 1 control chip for the power distribution module, 1 power supply chip for the power distribution module, and a second LTCC multilayer substrate, where the driving chip for the power distribution module, the control chip for the power distribution module, and the power supply chip for the power distribution module are half of the number of channels, and are respectively connected to the second LTCC multilayer substrate.
Preferably, the first switching module comprises a first metal partition wall, a first hair button carrier unit, a second hair button carrier unit and a third hair button carrier unit are arranged in the first metal partition wall, and hair buttons are respectively arranged on the first hair button carrier unit, the second hair button carrier unit and the third hair button carrier unit.
Preferably, the second switching module comprises a second metal partition wall, a second hair button carrier unit, a third hair button carrier unit and a fourth hair button carrier unit are arranged in the second metal partition wall, and hair buttons are respectively arranged on the second hair button carrier unit, the third hair button carrier unit and the fourth hair button carrier unit.
Preferably, the power amplifier module comprises a power amplifier chip, a power amplifier chip capacitor, a power amplifier chip resistor, a power amplifier chip capacitor and a molybdenum-copper carrier plate, and the power amplifier chip, the power amplifier chip capacitor, the power amplifier chip resistor and the power amplifier chip capacitor are mounted on the molybdenum-copper carrier plate.
Preferably, the amplitude limiting and low-noise discharging circuit is composed of amplitude limiting and low-noise discharging circuit units with the same number as the channels, each amplitude limiting and low-noise discharging circuit unit comprises an amplitude limiting and low-noise amplifier driving chip, an amplitude limiter and a low-noise amplifier, each amplitude limiter and each low-noise amplifier are connected to the microwave printed circuit board, and each amplitude limiting and low-noise amplifier driving chip is connected with the microwave printed circuit board.
In one aspect, the present invention also provides an active phased array antenna.
An active phased-array antenna comprises an active phased-array antenna front end, wherein the active phased-array antenna front end sequentially comprises an antenna array surface layer, a circulator layer, a heat sink layer and a T/R assembly layer from top to bottom, a T/R assembly is arranged in the T/R assembly layer, each array element in the antenna array surface layer is connected with a circulator of the circulator layer, the rest two ports of the circulator are connected with radio frequency receiving and transmitting ports of the T/R assembly in the T/R assembly layer, a liquid cooling heat conduction pipeline is embedded in the heat sink layer, and the T/R assembly is the high-integration tile-shaped multi-channel T/R assembly.
Preferably, the first connector is connected with the circulator, and the power amplifier module is close to the heat sink layer.
On one hand, the invention also provides an arrangement method of the high-integration multi-channel tile type T/R assembly.
A method for arranging high-integration multi-channel tile-type T/R assembly includes dividing said assembly into three layers according to radio frequency signal plane, connecting microwave printed circuit board vertically to first layer, connecting said printed circuit board to power amplification module and amplitude limiting low-noise discharge circuit by gold band or gold wire, connecting said printed circuit board to bottom contact of second layer by first switching module, connecting front contact of said multifunctional module to front contact of power division module by second switching module, sintering power division module and carrier plate on gold cover plate by alloy solder, elastic connecting bottom contact of power division module to conductor in second connector and outputting to port.
Compared with the prior art, the invention has the beneficial effects that:
1. the main circuits of the high-integration multi-channel tile type T/R component are positioned in the power amplifier module, the multi-channel module and the power division module, and each module can be independently tested and debugged through a special test clamp, so that the whole component has very good testability and testability.
2. The multi-channel module and the power dividing module are in elastic contact through the switching module, reliable connection of radio frequency signals and control power signals is achieved, disassembly and replacement are convenient, and the T/R assembly is easy to position and maintain due to faults.
3. The whole T/R component integrates four receiving and transmitting channels, the size is only 40mm multiplied by 10mm (no circulator is contained), the multi-channel high-density integration is realized, the component height is reduced to the maximum extent, and the low-profile active phased array antenna can be realized.
4. The assembly realizes high-density stacking of radio frequency devices of three planes by using two LTCC multilayer substrates, the radio frequency power divider is embedded in the substrates, and the problem of mutual interference of signal routing of radio frequency, power supply, digital signals and the like is solved by reasonably dividing multilayer circuits and ground loops.
5. The first switching module, the second switching module, the multifunctional module and the power dividing module are arranged in the aluminum alloy cavity, the inner space of the cavity is divided into a plurality of small closed spaces, the four channels are mutually isolated, and the problem of electromagnetic compatibility among the channels can be effectively solved.
6. The power amplifier module mounting surface is tightly contacted with the heat sink, heat generated by power amplifier work is quickly led out, the temperature of a power amplifier chip and the array surface of the whole active antenna array can be reduced, and the reliability is improved.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
FIG. 1 is a schematic top view of a highly integrated multi-channel tiled T/R assembly of the present invention;
FIG. 2 is a schematic side view of a highly integrated multi-channel tiled T/R assembly of the present invention;
FIG. 3 is a schematic bottom view of the highly integrated multi-channel shingle T/R assembly of the present invention;
FIG. 4 is a schematic cross-sectional view of a highly integrated multi-channel tiled T/R assembly of the present invention;
FIG. 5 is a schematic top view of a multi-function module in a preferred embodiment of the invention;
FIG. 6 is a schematic side view of a multi-function module in a preferred embodiment of the invention;
FIG. 7 is a schematic bottom view of a multi-function module in a preferred embodiment of the invention;
fig. 8 is a schematic top view of a power dividing module in a preferred embodiment of the present invention;
FIG. 9 is a schematic side view of a power distribution module in a preferred embodiment of the invention;
fig. 10 is a schematic bottom view of a power distribution module according to a preferred embodiment of the invention;
FIG. 11 is a schematic structural diagram of a first junction module in a preferred embodiment of the invention;
FIG. 12 is a schematic structural diagram of a second patching module in a preferred embodiment of the invention;
fig. 13 is a schematic diagram of a power amplifier module in a preferred embodiment of the present invention;
FIG. 14 is a schematic diagram of the clipping and low noise discharge circuit in a preferred embodiment of the present invention;
FIG. 15 is a schematic diagram of a clipping and low noise discharge circuit unit in a preferred embodiment of the present invention;
FIG. 16 is a schematic diagram of the RF operation of the highly integrated multi-channel tile T/R assembly of the present invention;
fig. 17 is a schematic diagram of an active phased array antenna according to the present invention.
Description of reference numerals: a first connector 1, a second connector 2, an elongated through groove 3, a contact 4, a mounting cavity 5, a power amplifier module 6, a power amplifier chip 61, a molybdenum-copper carrier plate 62, a power amplifier chip capacitor 63, a power amplifier patch capacitor 64, a power amplifier chip resistor 65, a limiting and low-noise discharge circuit 7, a limiting and low-noise discharge circuit unit 71, a limiting and low-noise discharge driver chip 711, a limiting device 712, a low-noise discharge 713, a microwave printed circuit chip 8, a multifunctional module 9, a multifunctional chip 91 for a multifunctional module, a control chip 92 for a multifunctional module, contacts 93 on the front and back sides of a substrate, a first LTCC multilayer substrate 94, a first switching module 10, a first metal partition wall 101, a first hair button carrier unit 102, a second hair button carrier unit 103, a third hair button carrier unit 104, a hair button 105, a power dividing module 11, a driving chip 111 for a power dividing module, a control chip 112 for a power dividing module, the power distribution module power supply chip 113, the second LTCC multilayer substrate 114, the second adapter module 12, the second metal partition wall 121, the fourth button carrier unit 122, the carrier plate 13, the cover plate 14, the conductive film 15, the antenna array surface layer 16, the circulator layer 17, the heat sink layer 18, the T/R assembly layer 19, and the liquid cooling heat conduction pipeline 20.
Detailed Description
In the description of the present invention, it should be noted that unless otherwise specifically stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may for example be fixed or indirectly connected through intervening media, or may be interconnected between two elements or may be in the interactive relationship between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. In the description of the present invention, "a plurality" means two or more unless specifically stated otherwise.
The terms "first," "second," "third," "fourth," and the like in the description and in the claims of the present application and in the drawings described above, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are, for example, capable of operation in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The technical solution of the present invention will be described in detail below with specific examples. The following several specific embodiments may be combined with each other, and details of the same or similar concepts or processes may not be repeated in some embodiments.
Referring to fig. 1-4, fig. 1 is a schematic top view of a highly integrated multi-channel tile type T/R assembly provided in this embodiment, fig. 2 is a schematic side view of the highly integrated multi-channel tile type T/R assembly of the present invention, fig. 3 is a schematic bottom view of the highly integrated multi-channel tile type T/R assembly of the present invention, and fig. 4 is a schematic cross-sectional structure of the highly integrated multi-channel tile type T/R assembly of the present invention.
A high-integration multi-channel tile-type T/R component is square, and is formed by enclosing a mounting cavity 5 by a bottom plate, a cover plate 14, a front plate, a rear plate, a left plate and a right plate, wherein 4 groups of first connectors 1 are mounted on the bottom plate, each group of first connectors 1 respectively consists of a receiving connector and a transmitting connector, each group of first connectors 1 is respectively vertical to the bottom plate, 4 groups of first connectors 1 respectively form a channel I, a channel II, a channel III and a channel IV which are mutually independent, 1 group of second connectors 2 are mounted on the cover plate 14, the second connectors 2 are combination ports for receiving output and transmitting input, a strip-shaped through groove 3 is arranged on the cover plate 14, three layers are arranged in the mounting cavity 5, and according to the plane of a radio frequency signal, a microwave printed circuit chip 8, a power amplifier module 6 and a low-amplitude limiting and low-noise discharge circuit 7 are arranged on the first layer, the second layer is provided with a multifunctional module 9, a first switching module 10 is arranged between the first layer and the second layer, a power sub-module 11 is arranged on the third layer, a second switching module 12 is arranged between the second layer and the third layer, the first connector 1 is connected with a microwave printed circuit board 8, the microwave printed circuit board 8 is connected with the power amplifier module 6 and the amplitude limiting and low-noise amplifier circuit 7 through gold bands or gold wires, the microwave printed circuit board 8 is connected with the first switching module 10, the first switching module 10 is connected with a bottom surface contact of the multifunctional module 9, a front surface contact of the multifunctional module 9 is connected to a front surface contact of the power sub-module 11 through the second switching module 12, the power sub-module 11 is installed on a support plate 13, the power sub-module 11 and the support plate 13 are sintered to an aluminum alloy cover plate 14 through an alloy solder, and the bottom surface contact of the power sub-module 11 is elastically connected with an inner conductor of the second connector 2.
The strip-shaped through groove 3 is used for exposing the contact 4 on the bottom surface of the power distribution module, and the external power supply control signal is elastically connected with the contact 4 through the hair button. The cover plate 14 is sealed and welded to the mounting cavity 5 by laser welding at the time of packaging to achieve airtight packaging.
Further, in order to improve heat exchange efficiency and lightweight, the box body is an aluminum alloy box body.
Further, conductive films 15 are disposed between the microwave printed circuit board 8 and the first adaptor module 10, between the first adaptor module 10 and the multifunctional module 9, between the multifunctional module 9 and the second adaptor module 12, and between the second adaptor module 12 and the power dividing module 11.
Further, the connector may be an SMP, SSMP, or glass frit insulator joint, and the present invention is not particularly limited.
Further, referring to fig. 5-7, fig. 5 is a schematic top view of the multifunctional module 7 in a preferred embodiment of the present invention, fig. 6 is a schematic side view of the multifunctional module 7 in a preferred embodiment of the present invention, and fig. 7 is a schematic bottom view of the multifunctional module 7 in a preferred embodiment of the present invention.
In fig. 5 to 7, the multifunction module 9 includes the multifunction chips 91 for multifunction modules, the control chip 92 for multifunction modules, and the first LTCC multilayer substrate 94, the number of which is equal to the number of channels, the multifunction chips 91 for multifunction modules and the control chip 92 for multifunction modules are respectively bonded to the first LTCC multilayer substrate 94 with conductive adhesives, the multifunction chips 91 and the control chip 92 for multifunction modules are cascade-connected with gold wires, and the multifunction chips 91 and the control chip 92 for multifunction modules are cascade-connected with the first LTCC multilayer substrate 94 with gold wires. The contacts 93 on the front and back sides of the first LTCC multilayer substrate 94 are used for elastic connection with the first and second patching modules 10 and 12.
The multi-function chip 91 for multi-function module may be BWM245, or BWM243, NC1517C-812SD or WND004 0048H, and is not particularly limited herein.
Further, referring to fig. 8 to 10, fig. 8 is a schematic top view of the power dividing module 11 in a preferred embodiment of the present invention, fig. 9 is a schematic side view of the power dividing module 11 in a preferred embodiment of the present invention, and fig. 10 is a schematic bottom view of the power dividing module 11 in a preferred embodiment of the present invention.
In fig. 8 to 10, the power distribution module 11 includes a driving chip 111 for the power distribution module, 1 control chip 112 for the power distribution module, 1 power supply chip 113 for the power distribution module, and a second LTCC multilayer substrate 114, where the driving chip 111 for the power distribution module, the control chip 112 for the power distribution module, and the power supply chip 113 for the power distribution module are respectively bonded to the second LTCC multilayer substrate 114 by conductive adhesives, and the chips are cascaded with the second LTCC multilayer substrate 114 by gold wires. The contacts 93 on the front side of the second LTCC multi-layer substrate 114 are used to connect to the second patching module 12 and the contacts on the back side are used to connect to the second connector 2 and the external connectors.
Further, referring to fig. 11, fig. 11 is a schematic structural diagram of the first adaptor module 10 in a preferred embodiment of the present invention.
In fig. 11, the first adaptor module 10 includes a first metal partition wall 101, a first hair button carrier unit 102, a second hair button carrier unit 103, and a third hair button carrier unit 104 are disposed in the first metal partition wall 101, hair buttons 105 are respectively mounted on the first hair button carrier unit 102, the second hair button carrier unit 103, and the third hair button carrier unit 104, the first hair button carrier unit 102, the second hair button carrier unit 103, and the third hair button carrier unit 104 are all made of polytetrafluoroethylene, and the hair button 105 is made of beryllium-copper wire of a cylinder.
Further, referring to fig. 12, fig. 12 is a schematic structural diagram of the second adaptor module 12 in a preferred embodiment of the invention.
In fig. 12, the second adaptor module 12 includes a second metal partition wall 121, a second hair button carrier unit 103, a third hair button carrier unit 104, and a fourth hair button carrier unit 122 are disposed in the second metal partition wall 121, hair buttons 105 are respectively mounted on the second hair button carrier unit 103, the third hair button carrier unit 104, and the fourth hair button carrier unit 122, the second hair button carrier unit 103, the third hair button carrier unit 104, and the fourth hair button carrier unit 122 are all made of polytetrafluoroethylene, and the hair button 105 is made of beryllium copper wire.
Further, referring to fig. 13, fig. 13 is a schematic structural diagram of the power amplifier module 6 in a preferred embodiment of the present invention.
In fig. 13, the power amplifier module 6 includes a power amplifier chip 61, a power amplifier chip capacitor 63, a power amplifier chip resistor 65, a power amplifier chip capacitor 64 and a molybdenum-copper carrier plate 62, the power amplifier chip 61 is eutectic-sintered on the molybdenum-copper carrier plate 62 by using gold-tin alloy, the power amplifier chip capacitor 63, the power amplifier chip resistor 65 and the power amplifier chip capacitor 64 are bonded on the molybdenum-copper carrier plate 62 by using conductive glue, and the chips are cascaded by using gold wires.
Further, referring to fig. 14-15, fig. 14 is a schematic diagram of the amplitude limiting and low noise discharging circuit 7 in a preferred embodiment of the present invention, and fig. 15 is a schematic diagram of the amplitude limiting and low noise discharging circuit unit 71 in a preferred embodiment of the present invention.
In fig. 14 to 15, the amplitude limiting and low noise amplifier circuit 7 is composed of amplitude limiting and low noise amplifier circuit units 71 equal in number to the number of channels, each amplitude limiting and low noise amplifier circuit unit 71 includes an amplitude limiting and low noise amplifier driving chip 711, an amplitude limiter 712 and a low noise amplifier 713, each amplitude limiter 712 and each low noise amplifier 713 are adhered to the wall of the mounting cavity 5 by conductive adhesive, each amplitude limiting and low noise amplifier driving chip 711 is adhered to the microwave printed circuit board 8 by conductive adhesive, and gold wires are used for cascading the chips of the amplitude limiting and low noise amplifier driving chip 711, each amplitude limiter 712 and each low noise amplifier 713 with the microwave printed circuit board 8.
Referring to fig. 16, fig. 16 is a schematic diagram of the rf operation of the highly integrated multi-channel tile type T/R assembly of the present invention.
As can be seen from FIG. 16, the working principle of the highly integrated multi-channel tile type T/R component of the invention is as follows: the received four-channel signal is transferred to the microstrip vertical transition through the first connector 1, enters the amplitude limiter 712 and the low-noise amplifier 713, is transferred to the multifunctional module 9 through the first switching module 10, is transferred to the power division module 11 through the second switching module 12, is transferred to the second connector 2 for output after the four-channel synthesis is completed. The transmitting signal is input from the second connector 2 and transited to the power dividing module 11, is divided into four paths, reaches the multifunctional module 9 through the second switching module 12, then reaches the power amplifier module 6 through the first switching module 10, and finally transits to the first connector 1 and is output to four transmitting channels.
Based on the above. The invention also provides an active phased array antenna.
Referring to fig. 17, fig. 17 is a schematic structural diagram of the highly integrated multi-channel tile type T/R assembly of the present invention installed in the front end of an active phased array antenna array.
An active phased-array antenna comprises an active phased-array antenna front end, the active phased-array antenna front end sequentially comprises an antenna array surface layer 16, a circulator layer 17, a heat sink layer 18 and a T/R assembly layer 19 from top to bottom, a T/R assembly is arranged in the T/R assembly layer 19, each array element in the antenna array surface layer 16 is connected with a circulator of the circulator layer 17, the other two ports of the circulator are connected with radio frequency receiving and transmitting ports of the T/R assembly in the T/R assembly layer 19, the heat sink layer 18 is a metal flat plate, and a liquid cooling heat conduction pipeline 20 is embedded in the heat sink layer 18. The T/R component is the high-integration multi-channel tile type T/R component.
During installation, the first connector 1 is connected with the circulator, the power amplifier module 6 is close to the heat sink layer 18, the distance between the power amplifier module 6 and the heat sink layer 18 is shortened, and heat generated by the T/R component in operation is timely transmitted out.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. The utility model provides a high integrated multichannel tile formula T/R subassembly, this high integrated multichannel tile formula T/R subassembly is square, is enclosed into installation cavity, its characterized in that by bottom plate, apron, front bezel, back plate, left board and right board as the wall: the bottom plate is provided with n groups of first connectors, each group of first connectors consists of a receiving connector and a transmitting connector, each group of first connectors is vertical to the bottom plate, the cover plate is provided with 1 group of second connectors, the second connectors are combiner ports for receiving output and transmitting input, the cover plate is provided with a through groove, three layers are arranged in the installation cavity, the first layer is provided with a microwave printed circuit board, a power amplifier module and a limiting and low-noise discharge circuit, the second layer is provided with a multifunctional module, a first switching module is arranged between the first layer and the second layer, the third layer is provided with an active sub-module, a second switching module is arranged between the second layer and the third layer, the microwave printed circuit board is respectively connected with the first connectors, the power amplifier module and the limiting and low-noise discharge circuit, the first switching module is connected with the multifunctional module, and the multifunctional module is connected with the second switching module, the second switching module is connected with the power distribution module, and the power distribution module is connected with the second connector.
2. The highly integrated multi-channel tile T/R assembly of claim 1, wherein: the n groups of first connectors are 4 groups of first connectors.
3. The highly integrated multi-channel tile T/R assembly according to any one of claims 1 or 2, wherein: the multifunctional module comprises multifunctional chips for the multifunctional modules, control chips for the multifunctional modules and a first LTCC multilayer substrate, wherein the multifunctional chips are equal to the channels in number, and the multifunctional chips for the multifunctional modules and the control chips for the multifunctional modules are connected to the first LTCC multilayer substrate respectively.
4. The highly integrated multi-channel tile T/R assembly according to any one of claims 1-3, wherein: the power distribution module comprises a driving chip for the power distribution module, 1 control chip for the power distribution module, 1 power chip for the power distribution module and a second LTCC multilayer substrate, wherein the driving chip for the power distribution module, the control chip for the power distribution module and the power chip for the power distribution module are half of the number of channels, and the driving chip, the control chip for the power distribution module and the power chip for the power distribution module are respectively connected to the second LTCC multilayer substrate.
5. The highly integrated multi-channel tile T/R assembly according to any one of claims 1-4, wherein: the first switching module comprises a first metal partition wall, a first hair button carrier unit, a second hair button carrier unit and a third hair button carrier unit are arranged in the first metal partition wall, and hair buttons are respectively arranged on the first hair button carrier unit, the second hair button carrier unit and the third hair button carrier unit.
6. The highly integrated multi-channel tile T/R assembly according to any one of claims 1-5, wherein: the second switching module comprises a second metal partition wall, a second hair button carrier unit, a third hair button carrier unit and a fourth hair button carrier unit are arranged in the second metal partition wall, and hair buttons are respectively arranged on the second hair button carrier unit, the third hair button carrier unit and the fourth hair button carrier unit.
7. The highly integrated multi-channel tile T/R assembly according to any one of claims 1-6, wherein:
the power amplifier module comprises a power amplifier chip, a power amplifier chip capacitor, a power amplifier chip resistor, a power amplifier patch capacitor and a molybdenum-copper carrier plate, wherein the power amplifier chip, the power amplifier chip capacitor, the power amplifier chip resistor and the power amplifier patch capacitor are arranged on the molybdenum-copper carrier plate; or/and
the amplitude limiting and low-noise discharging circuit is composed of amplitude limiting and low-noise discharging circuit units equal to the number of the channels, each amplitude limiting and low-noise discharging circuit unit comprises an amplitude limiting and low-noise discharging driving chip, an amplitude limiter and a low-noise discharging chip, each amplitude limiter and each low-noise discharging chip are connected to the microwave printed circuit board, and each amplitude limiting and low-noise discharging driving chip is connected with the microwave printed circuit board.
8. The utility model provides an active phased array antenna, including active phased array antenna front end, this active phased array antenna front end from the top down includes antenna array surface layer, circulator layer, heat sink layer and T/R subassembly layer in order, be equipped with the T/R subassembly in the T/R subassembly layer, each array element in the antenna array surface layer is connected with the circulator on circulator layer, the other two ports of circulator are connected with the radio frequency transceiver port of the T/R subassembly in the T/R subassembly layer, the embedded liquid cooling heat conduction pipeline in heat sink layer, its characterized in that: the T/R assembly is a highly integrated multi-channel tiled T/R assembly according to any of claims 1 to 7.
9. The active phased array antenna of claim 8, wherein: the first connector is connected with the circulator, and the power amplifier module is close to the heat sink layer.
10. A method for arranging high-integration multi-channel tile type T/R components is characterized by comprising the following steps: the high-integration multi-channel tile-type T/R component is divided into three layers according to a plane where a radio frequency signal is located, wherein the first layer is a power amplifier and low-noise amplifier layer, the second layer is a multifunctional module layer, the third layer is a power dividing module layer, a first connector is vertically connected with a microwave printed circuit board of the first layer, the microwave printed circuit board is connected with a power amplifier module and a limiting low-noise discharge circuit through a gold belt or a gold wire and then connected to a multifunctional module bottom contact of the second layer through a first switching module, the multifunctional module front contact is connected to a front contact of the power dividing module of the third layer through a second switching module, the power dividing module and a support plate are sintered onto a gold cover plate through alloy solders, and the power dividing module bottom contact is elastically connected with an inner conductor of the second connector and output to a port.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113078490A (en) * | 2021-03-04 | 2021-07-06 | 中国电子科技集团公司第二十九研究所 | Three-dimensional tile type TR (transmitter-receiver) assembly adopting fuzzy buttons |
| CN114243252A (en) * | 2021-12-14 | 2022-03-25 | 中国电子科技集团公司第二十九研究所 | Tile type TR assembly integrated with liquid cooling runner |
| CN114421111A (en) * | 2021-12-14 | 2022-04-29 | 中国电子科技集团公司第二十九研究所 | Three-layer tile type TR (transmitter-receiver) assembly adopting fuzzy buttons |
| CN116545466A (en) * | 2023-07-04 | 2023-08-04 | 成都锐芯盛通电子科技有限公司 | High-power tile type TR component |
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2020
- 2020-08-10 CN CN202010795812.5A patent/CN111835376A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113078490A (en) * | 2021-03-04 | 2021-07-06 | 中国电子科技集团公司第二十九研究所 | Three-dimensional tile type TR (transmitter-receiver) assembly adopting fuzzy buttons |
| CN114243252A (en) * | 2021-12-14 | 2022-03-25 | 中国电子科技集团公司第二十九研究所 | Tile type TR assembly integrated with liquid cooling runner |
| CN114421111A (en) * | 2021-12-14 | 2022-04-29 | 中国电子科技集团公司第二十九研究所 | Three-layer tile type TR (transmitter-receiver) assembly adopting fuzzy buttons |
| CN116545466A (en) * | 2023-07-04 | 2023-08-04 | 成都锐芯盛通电子科技有限公司 | High-power tile type TR component |
| CN116545466B (en) * | 2023-07-04 | 2023-08-29 | 成都锐芯盛通电子科技有限公司 | High-power tile type TR component |
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