CN117525892A - Multi-beam phased array receiving subarray and receiving subarray laminated assembly - Google Patents
Multi-beam phased array receiving subarray and receiving subarray laminated assembly Download PDFInfo
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- 238000003199 nucleic acid amplification method Methods 0.000 claims description 7
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- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q3/00—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system
- H01Q3/26—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture
- H01Q3/30—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture varying the relative phase between the radiating elements of an array
- H01Q3/34—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture varying the relative phase between the radiating elements of an array by electrical means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
- H01Q15/24—Polarising devices; Polarisation filters
- H01Q15/242—Polarisation converters
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0006—Particular feeding systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q3/00—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system
- H01Q3/26—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture
- H01Q3/28—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture varying the amplitude
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
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Abstract
The application provides a multi-beam phased array receiving subarray and a receiving subarray laminated assembly, which comprises an array surface, a power management device and a logic control circuit, wherein a plurality of antenna radiating units are arranged in the array surface, and the power management device and the logic control circuit are in a vertically stacked installation mode and are all interconnected with the array surface through a microminiature radio frequency connector; the antenna radiation unit is sequentially connected with a low noise amplifier, a primary one-to-two power divider, a sixteen-channel multifunctional chip and a combining network; and through adopting the tile stacking type architecture to stack the multi-beam phased array subarrays, the antenna radiation plate, the synthesis network and the subarray power supply control separation are realized, the antenna radiation plate, the synthesis network and the subarray power supply control separation are respectively integrated on three multi-layer microwave plates, and the standardized and modularized small-scale subarrays are realized.
Description
Technical Field
The application relates to the technical field of phased arrays, in particular to a multi-beam phased array receiving subarray and a receiving subarray laminated assembly.
Background
The multi-beam phased array antenna is the most important antenna form in the current satellite load, has flexible beam control capability and independent control among beams, can serve a plurality of users at the same time, and can also quickly jump among different user terminals. However, the multi-beam phased array channel is large in size, is a matrix of two dimensions of the number of beams and the number of channels, and if the multi-beam phased array channel is not integrated, the complexity, the equipment amount, the volume and the weight of the system are very large, so that the multi-beam phased array channel is almost impossible to use on a satellite-borne platform.
Many phased array antenna products in the market at present are mostly single-beam phased array antennas, and mainly comprise a receiving array surface, a transmitting array surface, an array surface wave control module, a power supply module, a frequency conversion module, an inertial navigation module, an antenna control module and a structural module (comprising an antenna housing). The receiving array surface and the transmitting array surface are respectively provided with a plurality of phased array subarrays, so that single beams can be tracked, but if multiple beams are tracked, more subarrays are needed to be spliced, the volume, weight, cost and power consumption of the system are increased, and the requirements of miniaturization and low power consumption in the 6G era cannot be met.
In addition, the existing single-beam phased array adopts a tile flat plate type architecture at present, and array elements and a feed network are interconnected through metallized through holes on a printed board by utilizing an on-board hybrid packaging technology (Admixture on Board, AOB) technology, so that an antenna, a wave control power supply and a radio frequency receiving assembly are integrally laid out, and are integrated on a microwave multi-layer board at high density. However, for the multi-beam antenna, the integrated integration can not meet the requirements by combining with the analysis of the dual-beam chip, and the problems of large thickness of a network layer of the component and high processing technology difficulty exist.
Disclosure of Invention
The application provides a multi-beam phased array receiving subarray and receiving subarray stack assembly for solve current phased array antenna and if want to satisfy the application scenario of multi-beam, need the multi-phased array subarray splice, bulky, with high costs, the consumption is big, and there is the subassembly network layer thickness big, the problem that the processing technology degree of difficulty is high.
In a first aspect, the present application provides a multi-beam phased array receive subarray comprising: the antenna comprises an array surface, a power management device and a logic control circuit, wherein a plurality of antenna radiating units are arranged in the array surface, and the power management device and the logic control circuit are vertically stacked and are interconnected with the array surface through a microminiature radio frequency connector;
the antenna radiation unit is sequentially connected with a low noise amplifier, a first-stage one-to-two power divider, a sixteen-channel multifunctional chip and a combining network, an initial signal received by the antenna radiation unit passes through the low noise amplifier and then outputs two paths of second signals, the second signals pass through the first-stage one-to-two power divider and then form four paths of independent third signals, two third signals are taken as a group, each group of third signals respectively enter the sixteen-channel multifunctional chip to realize amplification, amplitude modulation phase shift and combination of the third signals, four first beams of waves are output, and the first beams of waves are output into four independent second beams of waves after signal combination through the combining network.
Alternatively, the multi-beam phased array receiving subarrays are adopted in 256 array element scale, and each receiving subarray contains 128 sixteen-channel multifunctional chips.
Optionally, the multi-beam phased array receiving subarray mentioned above, and the antenna radiating unit realizes the switching of the left-right circular polarization of the antenna by configuring the phase difference between channels.
Optionally, as described above, the antenna radiating elements are matched with a 2×2 antenna element rotation layout, and each antenna radiating element is adjusted with a left-hand or a right-hand by rotation phase matching.
Optionally, as described above, a dual feed port is provided between the antenna radiating unit and the low noise amplifier, and the initial signal passes through the dual feed port to form two channels to enter the low noise amplifier.
In a second aspect, the present application provides a receiver sub-array stack assembly comprising: an antenna radiation plate, a synthetic network plate and a subarray power supply control board, wherein the antenna radiation plate, the synthetic network plate and the subarray power supply control board are respectively integrated on three multi-layer microwave boards, and the antenna radiation plate is formed by the array surface of the multi-beam phased array receiving subarray according to any one of the first aspect;
the antenna radiation plate is connected with the composite network plate through a plug and a socket in a signal mode, and the composite network plate is connected with the subarray power supply control panel in a low-frequency interconnection mode through a low-frequency connector in a direct-insertion mode.
Optionally, the antenna radiation plate includes a microstrip antenna and a first digital trace, and the antenna radiation plate adopts a double-point feeding mode and cooperates with a rotary feeding input to realize polarization switching of each antenna radiation unit antenna.
Optionally, the above-mentioned receiving subarray stack assembly, the composite network board includes two layers of one-to-two networks, and a first beam power dividing network, a second digital wiring, a second power wiring, a third beam power dividing network and a fourth beam power dividing network are sequentially arranged between the two layers of one-to-two networks; one layer of the one-to-two network is connected with a multifunctional chip, and the other layer of the one-to-two network is connected with a radio frequency connector.
Optionally, the receiving subarray stack assembly as described above, the power control board includes a third digital wire, a power control chip is disposed on the third digital wire, and the third digital wire is connected with the third power wire.
Optionally, in the receiving sub-array laminated assembly as described above, the composite network board is radio-frequency interconnected with the back-end composite module through a subminiature radio-frequency connector, and is low-frequency interconnected with the main board power supply control module through a direct insertion mode of the low-frequency connector.
The multi-beam phased array receiving subarray and receiving subarray laminated assembly comprises an array surface, a power management device and a logic control circuit, wherein a plurality of antenna radiating units are arranged in the array surface, and the power management device and the logic control circuit are vertically stacked and are interconnected with the array surface through ultra-small radio frequency connectors; the antenna radiation unit is sequentially connected with a low noise amplifier, a first-stage one-to-two power divider, a sixteen-channel multifunctional chip and a combining network, an initial signal received by the antenna radiation unit passes through the low noise amplifier and then outputs two paths of second signals, the second signals pass through the first-stage one-to-two power divider and then form four paths of independent third signals, two third signals are taken as a group, each group of third signals respectively enter the sixteen-channel multifunctional chip to realize amplification, amplitude modulation phase shift and combination of the third signals, four first beams of waves are output, and the first beams of waves are output into four independent second beams of waves after signal combination through the combining network. Through adopting the framework of tile stack formula to pile up the design to multibeam phased array subarray, realized antenna radiation board, synthetic network and subarray power control separation, integrated respectively in three multilayer microwave boards, realized standardized, modularized small-scale subarray.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and together with the description, serve to explain the principles of the application.
Fig. 1 is a schematic diagram of a multi-beam phased array receiving subarray according to an embodiment of the present application.
Fig. 2 is a schematic diagram of a receiving sub-array stack assembly according to an embodiment of the present application.
Specific embodiments thereof have been shown by way of example in the drawings and will herein be described in more detail. These drawings and the written description are not intended to limit the scope of the inventive concepts in any way, but to illustrate the concepts of the present application to those skilled in the art by reference to specific embodiments.
Detailed Description
Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples are not representative of all implementations consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with some aspects of the present application as detailed in the accompanying claims.
In the related art, a conventional phased array unit is mainly implemented in a discrete form, and an amplitude phase control unit or an amplifying unit is connected through one integrated board. Along with the development of integrated circuit technology, a plurality of amplitude and phase control units are integrated in a single chip and then are interconnected through an integrated board, so that the integration difficulty of the integrated board is greatly reduced, and the cost of the whole array is reduced. Aiming at the requirements of the novel radar detection and communication integrated system on the integration level, the integration requirements on the functional chip become more severe. To increase the number of beams of phased array radar, monolithically integrating more channels can effectively reduce assembly complexity, improve channel consistency, but thereby increase chip integration complexity. The existing single-beam phased array adopts a tile flat plate type architecture at present, and an array element and a feed network are interconnected through a metallized via hole on a printed board by utilizing an on-board hybrid packaging technology (Admixture on Board, AOB) technology, so that an antenna, a wave control power supply and a radio frequency receiving assembly are integrally distributed and integrated on a microwave multilayer board at high density. However, for the multi-beam antenna, the integrated integration can not meet the requirements by combining with the analysis of the dual-beam chip, and the problems of large thickness of a network layer of the component and high processing technology difficulty exist.
Aiming at the technical problems, the embodiment of the application aims at providing a multi-beam phased array receiving subarray and a receiving subarray lamination assembly, and the invention concept is as follows: through adopting the framework of tile stack formula to pile up the design to multibeam phased array subarray, realized antenna radiation board, synthetic network and subarray power control separation, integrated respectively in three multilayer microwave boards, realized standardized, modularized small-scale subarray.
The following describes the technical solution of the present application and how the technical solution of the present application solves the above technical problems in detail with specific embodiments. The following embodiments may be combined with each other, and the same or similar concepts or processes may not be described in detail in some embodiments. Embodiments of the present application will be described below with reference to the accompanying drawings.
Referring to fig. 1, fig. 1 is a schematic diagram of a multi-beam phased array receiving subarray provided in an embodiment of the present application, as shown in fig. 1, including an array plane, a power management device and a logic control circuit, where a plurality of antenna radiating units are disposed in the array plane, and the power management device and the logic control circuit are partially connected to the array plane by a subminiature radio frequency connector in a vertically stacked manner;
the antenna radiation unit is sequentially connected with a low noise amplifier, a first-stage one-to-two power divider, a sixteen-channel multifunctional chip and a combining network, an initial signal received by the antenna radiation unit passes through the low noise amplifier and then outputs two paths of second signals, the second signals pass through the first-stage one-to-two power divider and then form four paths of independent third signals, two third signals are taken as a group, each group of third signals respectively enter the sixteen-channel multifunctional chip to realize amplification, amplitude modulation phase shift and combination of the third signals, four first beams of waves are output, and the first beams of waves are output into four independent second beams of waves after signal combination through the combining network.
In the implementation, the receiving subarray can adopt two multi-beam multifunctional receiving amplitude-phase chips, and the chips integrate 8 low-noise amplification, 8 multifunctional chips and a digital control circuit, so that the functions of amplifying signals of each channel, controlling amplitude-phase and the like can be realized. Further, the receiving subarrays are matched with the 4-group power-division synthesis network, so that the multi-beam architecture of the antenna can be realized.
The multi-beam phased array receiving subarray provided by the embodiment comprises an array surface, a power management device and a logic control circuit, wherein a plurality of antenna radiating units are arranged in the array surface, and the power management device and the logic control circuit are in a vertically stacked installation mode and are all interconnected with the array surface through a microminiature radio frequency connector; the antenna radiation unit is sequentially connected with a low noise amplifier, a first-stage one-to-two power divider, a sixteen-channel multifunctional chip and a combining network, an initial signal received by the antenna radiation unit passes through the low noise amplifier and then outputs two paths of second signals, the second signals pass through the first-stage one-to-two power divider and then form four paths of independent third signals, two third signals are taken as a group, each group of third signals respectively enter the sixteen-channel multifunctional chip to realize amplification, amplitude modulation phase shift and combination of the third signals, four first beams of waves are output, and the first beams of waves are output into four independent second beams of waves after signal combination through the combining network. The multi-beam phased array subarray is designed in a stacking mode by adopting a tile stacking type framework, and the subarray does not contain a power supply control and logic control circuit part, and the power supply control and logic control circuit part is completed by an independent subarray wavecontrol board.
The technical scheme of the multi-beam phased array receiving subarray is described in detail below.
In one possible design, the receiving subarrays are 256 array element size, each containing 128 of the sixteen channel multi-function chips.
It can be understood that the scale of the receiving subarray is 16×16, the subarray adopts 256 array element scale design, the array surface only comprises antenna radiation units, the power management and logic control circuit part adopts a vertical stacking installation mode, and the four directions can be expanded randomly through interconnection of the SSMP and the array surface.
In this embodiment, the receiving subarray of the phased array antenna adopts 256 antenna array elements to form 4 beams in total, in each antenna subarray, a signal input by the antenna is divided into 4 paths through a one-to-two power divider after passing through a low noise amplifier, then a part of the signal can be amplified in sixteen-channel multifunctional chips, each signal can be phase-shifted through an adjustable phase shifter, and after the phase-shifted signal is subjected to equal-time delay routing, the signals are combined in a corresponding combiner to form 4 sub beams after being combined. The adjustable delayer carries out different time delays on all sub-beam signals under the control of the beam controller, so that all beams of each subarray are delayed when being finally combined, and finally 4 sub-beams output by the sixteen-channel multifunctional chip are combined in 4 combiners to form complete 4 second beam waves.
In one possible design, the antenna radiating element implements switching of the left-right circular polarization of the antenna by configuring the phase difference between channels.
It will be appreciated that the principle of circular polarization of an antenna is due to the fact that when an antenna radiates electromagnetic waves, the directions of the electric field vector and the magnetic field vector are not identical, so that the electromagnetic waves rotate during the propagation process. The polarity of the antenna may severely impact the read range of the system, the key to maximizing the read range being to ensure that the polarity of the antenna is aligned with the polarity of the tag. If these do not match, for example, a vertically linearly polarized antenna and a tag with a horizontally linearly polarized antenna, the read range can be severely degraded. Circularly polarized antennas emit waves that continuously rotate between horizontal and vertical planes to provide increased flexibility for applications by allowing tags to be read in multiple directions.
Further, the antenna radiation units are matched with a 2 x 2 antenna unit rotation layout, and the circular polarization performance of the antenna can be optimized more by adjusting the rotation phase matching among the antenna radiation units along with the left rotation or the right rotation.
And on the basis of double feed of the units, a double feed port is arranged between the antenna radiation unit and the low noise amplifier, and the initial signal passes through the double feed port to form two channels to enter the low noise amplifier. Thus, the multi-beam phased array receiving subarray can realize cell double feed.
Fig. 2 is a schematic diagram of a receiving sub-array stack assembly according to an embodiment of the present application. As shown in fig. 2, the assembly of the present embodiment includes: the antenna radiation plate, the synthesis network plate and the subarray power supply control board are respectively integrated on three multi-layer microwave boards, and the antenna radiation plate is composed of the array surfaces of the multi-beam phased array receiving subarrays according to any embodiment; the antenna radiation plate is connected with the composite network plate through a plug and a socket in a signal mode, and the composite network plate is connected with the subarray power supply control panel in a low-frequency interconnection mode through a low-frequency connector in a direct-insertion mode.
In this embodiment, the antenna layers are individually laminated to form a multi-layered antenna radiation board, the network component layers are individually laminated to form a multi-layered composite network board, the power control layer is integrally laminated to form a multi-layered sub-array power control board, the antenna radiation board, the composite network board and the sub-array power control board can be PCB boards, and adjacent two layers can be integrally laminated by LGA or BGA packaging technology to finally form a receiving sub-array laminated assembly, or the antenna radiation board, the composite network board and the sub-array power control board are formed by adopting multi-layered PCB lamination and lamination technology, and the antenna radiation board, the composite network board and the sub-array power control board are soldered by adopting reflow soldering. It should be understood that this is not intended to limit the present embodiment and that the above process may be replaced with other alternatives common in the art.
It can be understood that the layout of the antennas in the receiving subarray stack can refer to the array plane composition of the aforementioned multi-beam phased array receiving subarray, and the feeding structure, polarization design, stack design need to be matched with parameters such as size, polarization, bandwidth, scanning range and the like required by application, and the actual design layer number can be adjusted according to actual situations.
It can be understood that the composite network board can be in radio frequency interconnection with the rear-end composite module through a microminiature radio frequency connector, and can be in low frequency interconnection with the main board power supply control module through a direct insertion mode of a low frequency connector.
According to the receiving subarray laminated assembly provided by the embodiment, the multi-beam phased array subarrays are stacked by adopting a tile stacking type framework, so that the antenna radiation plate, the synthesis network and the subarray power supply are controlled and separated, and are respectively integrated on three multi-layer microwave plates, and the standardized and modularized small-scale subarrays are realized.
The technical scheme of the receiving subarray laminated assembly is described in detail below.
The antenna radiation plate comprises a microstrip antenna and a first digital wiring, adopts a double-point feed mode, and realizes polarization switching of each antenna radiation unit antenna by matching with rotary feed input.
The composite network board comprises two layers of one-to-two networks, and a first beam power dividing network, a second digital wiring, a second power wiring, a third beam power dividing network and a fourth beam power dividing network are sequentially arranged between the two layers of one-to-two networks; one layer of the one-to-two network is connected with a multifunctional chip, and the other layer of the one-to-two network is connected with a radio frequency connector.
And a first structural member is arranged between the antenna radiation plate and the synthetic network plate to form a first structural cavity. The one-to-two power dividers in the one-to-two network layer are all in communication connection with the first digital wiring in the antenna radiation plate, so that signals received by the antenna radiation unit in the antenna radiation plate can enter the one-to-two power dividers, and signals output by the one-to-two power dividers enter the sixteen-channel multifunctional chip again to realize amplification, amplitude modulation phase shift and synthesis of the signals.
It can be understood that the power division network is a multi-port microwave device, one microwave signal is distributed to multiple channels, and the beam power division network forms regular amplitude-phase distribution among different antenna units by phase shifting and power division in the power division network, so as to achieve the purpose of beam forming, and the power division network can be generally designed into a double-sided microstrip PCB structure or a four-layer plate strip line structure.
The power supply control board comprises a third digital wiring, a power supply control chip is arranged on the third digital wiring, and the third digital wiring is connected with a third power supply wiring.
And a second structural member is arranged between the power supply control board and the composite network board to form a second structural cavity. The power supply control board bears the power supply control and logic control of the receiving subarrays, so that the internal structure of the receiving subarrays is simplified, and the problems of large thickness of a component network layer and high processing technology difficulty are solved.
It should be understood that the above-described device embodiments are merely illustrative, and that the device of the present application may be implemented in other ways. For example, the division of the units/modules in the above embodiments is merely a logic function division, and there may be another division manner in actual implementation. For example, multiple units, modules, or components may be combined, or may be integrated into another system, or some features may be omitted or not performed.
In addition, each functional unit/module in each embodiment of the present application may be integrated into one unit/module, or each unit/module may exist alone physically, or two or more units/modules may be integrated together, unless otherwise specified. The integrated units/modules described above may be implemented either in hardware or in software program modules.
In the foregoing embodiments, the descriptions of the embodiments are emphasized, and for parts of one embodiment that are not described in detail, reference may be made to related descriptions of other embodiments. The technical features of the foregoing embodiments may be arbitrarily combined, and for brevity, all of the possible combinations of the technical features of the foregoing embodiments are not described, however, all of the combinations of the technical features should be considered as being within the scope of the disclosure.
Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the application following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the application pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.
It is to be understood that the present application is not limited to the precise arrangements and instrumentalities shown in the drawings, which have been described above, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the application is limited only by the appended claims.
Claims (10)
1. A multi-beam phased array receive subarray, comprising: the antenna comprises an array surface, a power management device and a logic control circuit, wherein a plurality of antenna radiating units are arranged in the array surface, and the power management device and the logic control circuit are vertically stacked and are interconnected with the array surface through a microminiature radio frequency connector;
the antenna radiation unit is sequentially connected with a low noise amplifier, a first-stage one-to-two power divider, a sixteen-channel multifunctional chip and a combining network, an initial signal received by the antenna radiation unit passes through the low noise amplifier and then outputs two paths of second signals, the second signals pass through the first-stage one-to-two power divider and then form four paths of independent third signals, two third signals are taken as a group, each group of third signals respectively enter the sixteen-channel multifunctional chip to realize amplification, amplitude modulation phase shift and combination of the third signals, four first beams of waves are output, and the first beams of waves are output into four independent second beams of waves after signal combination through the combining network.
2. The receiver sub-array of claim 1, wherein said receiver sub-array is 256 array element size, each receiver sub-array comprising 128 of said sixteen channel multi-functional chips.
3. The receiving subarray of claim 1, wherein the antenna radiating elements are configured to switch between right and left circular polarizations of the antenna by way of configuring a phase difference between channels.
4. A receiving subarray according to claim 3, wherein the antenna radiating elements are arranged in a 2 x 2 antenna element rotation configuration, the antenna radiating elements being adjusted with either left or right hand rotation by rotational phase alignment.
5. A receiving subarray according to claim 3, wherein a double feed port is provided between the antenna radiating element and the low noise amplifier, and the initial signal passes through the double feed port to form two channels into the low noise amplifier.
6. A receiver sub-array stack assembly, comprising: the multi-beam phased array receiving subarray array comprises an antenna radiation plate, a synthesis network plate and a subarray power supply control board, wherein the antenna radiation plate, the synthesis network plate and the subarray power supply control board are respectively integrated on three multi-layer microwave boards, and the antenna radiation plate is formed by an array surface of the multi-beam phased array receiving subarray according to any one of claims 1-5;
the antenna radiation plate is connected with the composite network plate through a plug and a socket in a signal mode, and the composite network plate is connected with the subarray power supply control panel in a low-frequency interconnection mode through a low-frequency connector in a direct-insertion mode.
7. The assembly of claim 6, wherein the antenna radiating plate comprises a microstrip antenna and a first digital trace, and wherein the antenna radiating plate adopts a double-point feed mode and cooperates with a rotary feed input to realize polarization switching of each antenna radiating element antenna.
8. The assembly of claim 6, wherein the composite network board comprises a two-layer one-to-two network, between which a first beam power dividing network, a second digital trace, a second power trace, a third beam power dividing network, and a fourth beam power dividing network are sequentially disposed; one layer of the one-to-two network is connected with a multifunctional chip, and the other layer of the one-to-two network is connected with a radio frequency connector.
9. The assembly of claim 6, wherein the power control board comprises a third digital trace having a power control chip disposed thereon, the third digital trace having a third power trace connected thereto.
10. The assembly of claim 6, wherein the composite network board is radio frequency interconnected with the back-end composite module via a subminiature radio frequency connector and is low frequency interconnected with the motherboard power control module via a low frequency connector in-line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311570040.5A CN117525892A (en) | 2023-11-22 | 2023-11-22 | Multi-beam phased array receiving subarray and receiving subarray laminated assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311570040.5A CN117525892A (en) | 2023-11-22 | 2023-11-22 | Multi-beam phased array receiving subarray and receiving subarray laminated assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117525892A true CN117525892A (en) | 2024-02-06 |
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ID=89764114
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311570040.5A Pending CN117525892A (en) | 2023-11-22 | 2023-11-22 | Multi-beam phased array receiving subarray and receiving subarray laminated assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117525892A (en) |
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2023
- 2023-11-22 CN CN202311570040.5A patent/CN117525892A/en active Pending
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