CN117498024A - Broadband circularly polarized antenna and antenna array applied to chip-type architecture active phased array - Google Patents
Broadband circularly polarized antenna and antenna array applied to chip-type architecture active phased array Download PDFInfo
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Abstract
A broadband circularly polarized antenna and an antenna array applied to a chip-type structure active phased array belong to the technical field of antennas, and solve the problem that the existing broadband circularly polarized microstrip antenna is not suitable for the chip-type structure active phased array due to narrow bandwidth and poor axial ratio; the antenna comprises: a radio frequency antenna portion, a vertical interconnection portion, and an electromagnetic shielding portion; the radio frequency antenna part adopts a 90-degree phase difference constant-amplitude power division feed network, excites the radiation patch in a slot coupling mode, and meanwhile, a parasitic patch is arranged on the top layer; the vertical interconnection part is composed of a feed network and a vertical transmission conductor and is used for transmitting the bottom layer signal to the upper radio frequency antenna part; the electromagnetic shielding portion separates the radio frequency antenna portion, the vertical interconnect portion, and components in the chip architecture active phased array.
Description
Technical Field
The invention belongs to the technical field of antennas, and particularly relates to a broadband circularly polarized antenna applied to a chip-type structure active phased array and an antenna array.
Background
The increasingly complex battlefield environment and the harsh installation conditions of various carrier platforms provide urgent requirements for the multifunctional and integrated design technology of the radio frequency system, and especially under the development trend of diversification, light weight and modularization of the functions of the weapon platform sensor, the standardized integrated front end with small research volume, light weight and high integration level is imperative. Meanwhile, with the continuous progress of radio frequency/digital integrated circuits and high-density packaging technology, a chip-type active phased array with an integrated active front end as a basic functional module will become a mainstream hardware scheme of a sensor and a communication system.
Under the condition that the transverse size of the chip active phased array is strictly limited, based on the multilayer microwave digital composite substrate lamination interconnection technology, an antenna radiation surface, a radiating plate, a chip transceiver component, a comprehensive feed multifunctional board and the like are compressed and distributed in the direction perpendicular to the array surface, and a large number of connecting cables and wiring harnesses are replaced by elastic interconnection, metallized through holes and the like, so that the chip active phased array is higher in integration level, smaller in volume, lower in profile, lighter in weight, smaller in interconnection loss and higher in reliability.
The antenna is an important component of the chip-type active phased array, and the broadband circularly polarized microstrip antenna in the prior art has the problems of narrow bandwidth, poor axial ratio and the like under the conditions of heavy information quantity and extremely high information transmission rate, and is limited in application in the chip-type active phased array. Therefore, the advantages of the broadband, the circularly polarized microstrip antenna and the microstrip antenna are combined, and the obtained broadband circularly polarized microstrip antenna is wider in application. However, the superposition of the antenna performance is not as simple as the addition of Arabic numbers, and the advantages of the broadband, circular polarization and microstrip antenna are combined, and meanwhile, the technical difficulty exists. For example, the combination of circular polarization and microstrip antennas has the disadvantages of narrow bandwidth, high Q, small power capacity, and large performance impact by the dielectric substrate material.
Disclosure of Invention
The invention is used for solving the problem that the existing broadband circularly polarized microstrip antenna is not suitable for a chip-type structure active phased array due to narrow bandwidth and poor axial ratio.
The invention solves the technical problems through the following technical scheme:
a wideband circularly polarized antenna for use in a chip-architecture active phased array, comprising: a radio frequency antenna part (1), a vertical interconnection part (2) and an electromagnetic shielding part (3); the radio frequency antenna part (1) adopts a 90-degree phase difference constant-amplitude power division feed network, excites a radiation patch in a slot coupling mode, and meanwhile, a parasitic patch is arranged on the top layer; the vertical interconnection part (2) is composed of a feed network and a vertical transmission conductor (4) and is used for transmitting the bottom layer signal to the upper radio frequency antenna part; an electromagnetic shielding portion (3) separates the radio frequency antenna portion, the vertical interconnect portion, and components in the chip architecture active phased array.
Further, the radio frequency antenna part (1) comprises a radio frequency antenna bottom layer (11), a first bonding layer (12), a radio frequency antenna middle layer (13), a second bonding layer (14) and a radio frequency antenna top layer (15) which are sequentially laminated from bottom to top; the first adhesive layer (12) is used for bonding between the bottom layer (11) of the radio frequency antenna and the middle layer (13) of the radio frequency antenna, and the second adhesive layer (14) is used for bonding between the middle layer (13) of the radio frequency antenna and the top layer (15) of the radio frequency antenna.
Further, the radio frequency antenna bottom layer (11) comprises: an antenna grounding plate (111), a first dielectric plate (112) and a 90-degree phase difference constant-amplitude power division feed network (113); the antenna grounding plate (111) is covered on the lower surface of the first dielectric plate (112), through holes are formed in the corners of the antenna grounding plate (111) and the first dielectric plate (112), and the first bonding pads (1131) are covered on the through holes.
Further, the 90 ° phase difference constant amplitude power division feed network (113) includes: the first bonding pad (1131), the first transmission line (1132), the second transmission line (1133), the first L-shaped transmission line (1134), the third transmission line (1135) and the S-shaped transmission line (1136), wherein the transmission lines are copper microstrip lines etched on the upper surface of the first dielectric plate (112); one end of a first transmission line (1132) is connected with a first bonding pad (1131), the other end of the first transmission line (1132) is connected with one end of a second transmission line (1133), the other end of the second transmission line (1133) is connected with one end of a first L-shaped transmission line (1134), one end of a third transmission line (1135) at the other end of the first L-shaped transmission line (1134) is connected, the other end of the third transmission line (1135) is open, one end of an S-shaped transmission line (1136) is connected at the connection point of the first L-shaped transmission line (1134) and the third transmission line (1135), and the other end of the S-shaped transmission line (1136) is open.
Further, the radio frequency antenna middle layer (13) comprises: the radiating patch comprises a first metal layer (131), a second dielectric plate (132), a radiating patch (133) and two U-shaped coupling gaps (134); the first metal layer (131) is plated on the lower surface of the second dielectric plate (132), the U-shaped coupling gap (134) is a through groove formed in the second dielectric plate (132), the opening end of the U-shaped coupling gap (134) is outwards far from the center point of the second dielectric plate (132), and the closed end of the U-shaped coupling gap (134) is inwards close to the center point of the second dielectric plate (132); the radiation patch (133) is a group of rectangular metal patches with diagonal corners, and the radiation patch (133) is arranged in the middle of the upper surface of the second dielectric plate (132); the radiation patch (133) covers the closed ends of the two U-shaped coupling slits (134); the open ends of the third transmission line (1135) and the open ends of the S-shaped transmission line (1136) are respectively perpendicular to the closed ends of the two U-shaped coupling gaps (134) in space, and electromagnetic waves in the third transmission line (1135) and the S-shaped transmission line (1136) are coupled to the upper radiation patch (133) through the two U-shaped coupling gaps (134).
Further, the rf antenna top layer (15) includes: a third dielectric plate (151), a center parasitic patch (152), four edge parasitic patches (153); the center parasitic patch (152) and the four edge parasitic patches (153) are all attached to the upper surface of the first dielectric plate (151), the four edge parasitic patches (153) are symmetrically arranged on the upper surface of the first dielectric plate (151) in a cross structure, and the center parasitic patch (152) is arranged at the center position of the four edge parasitic patches (153).
Further, the vertical interconnection portion (2) includes: a vertical interconnect bottom layer (21), a plurality of vertical interconnect transition layers (22), a plurality of third adhesive layers (23); the vertical interconnection bottom layer (21) is arranged at the bottommost layer of the vertical interconnection part (2), and a plurality of vertical interconnection transition layers (22) and third bonding layers (23) are sequentially and alternately laminated above the vertical interconnection bottom layer (21); and the two sides of each layer of the vertical interconnection bottom layer (21) and the vertical interconnection transition layers (22) are plated with metal, and through holes are formed in the corresponding positions of the vertical interconnection transition layers (22) and the third bonding layers (23).
Further, the vertical interconnect (21) includes: a vertical interconnection ground plate (211), a fourth dielectric plate (212), a second metal layer (213); the vertical interconnection grounding plate (211) is covered on the lower surface of the fourth dielectric plate (212), the second metal layer (213) is covered on the upper surface of the fourth dielectric plate (212), and through holes are correspondingly formed in the corners of the fourth dielectric plate (212) and the second metal layer (213); an L-shaped groove (2111), a second L-shaped transmission line (2112), a second bonding pad (2113) and a third bonding pad (2114) are formed in the vertical interconnection grounding plate (211), one end of the L-shaped groove (2111) is a square end, the other end of the L-shaped groove is a round end, the second bonding pad (2113) and the third bonding pad (2114) are respectively arranged in the square end and the round end, the second L-shaped transmission line (2112) is correspondingly arranged in the L-shaped groove (2111), and two ends of the second L-shaped transmission line (2112) are respectively connected with the second bonding pad (2113) and the third bonding pad (2114); one end of the vertical transmission conductor (4) passes through the through holes arranged on each layer to be connected with the third bonding pad (2114), and the other end of the vertical transmission conductor (4) passes through the through holes arranged on each layer to be connected with the first bonding pad (1131).
Further, the electromagnetic shielding portion (3) includes: l-shaped metal frame (31), semi-cylindrical metal cylinder (32), rectangle metal frame (33), the embedding of L-shaped metal frame (31) at the bottom of perpendicular interconnection bottom (21), wrap up around L-shaped groove (2111), semi-cylindrical metal cylinder (32) pass each layer parcel around perpendicular transmission conductor (4), rectangle metal frame (33) set up in the last half outside of antenna, rectangle metal frame (33) parcel is around radio frequency antenna part (1).
An antenna array adopts a plurality of antenna subarrays to be assembled, the antenna subarrays adopt first antenna element, second antenna element, third antenna element, fourth antenna element to constitute two square arrays of two rows and two columns, first antenna element adopt the above-mentioned broadband circular polarized antenna who is applied to the active phased array of chip architecture, second antenna element, third antenna element, fourth antenna element respectively by first antenna element around the summit rotation 90 DEG, 180 DEG, 270 DEG obtain in proper order.
The invention has the advantages that:
the broadband circularly polarized microstrip antenna applied to the chip-type structure active phased array adopts a structure form of a plurality of layers of microstrip boards, and mainly comprises a radio frequency antenna part, a vertical interconnection part and an electromagnetic shielding part. The radio frequency antenna part adopts a 90-degree phase difference constant-amplitude power division feed network, excites the radiation patch in a slot coupling mode, and meanwhile, a parasitic patch is arranged on the top layer to improve circular polarization performance. The vertical interconnect is formed of a feed network and vertical transmission lines for transmitting the underlying signals to the upper radio frequency antenna section, and a plurality of active phased array components are integrated into a multi-layer board through which the vertical interconnect extends. The electromagnetic shielding part consists of a rectangular metal frame, a cylindrical metal cylinder and an L-shaped metal frame, the shielding structure can be constructed in a metallized via hole mode in the actual processing process, and the electromagnetic shielding part has the main functions of separating an antenna part, a vertical interconnection part and other components in the chip-type structure active phased array and improving electromagnetic compatibility.
Drawings
Fig. 1 is a schematic structural diagram of a wideband circularly polarized antenna applied to a chip-type active phased array according to a first embodiment of the present invention;
fig. 2 is a schematic structural diagram of a radio frequency antenna according to a first embodiment of the present invention;
fig. 3 is a schematic view of a bottom layer structure of a radio frequency antenna according to a first embodiment of the present invention;
fig. 4 is a schematic diagram of a radio frequency antenna portion 90 ° phase difference constant amplitude power division feed network structure according to an embodiment of the present invention;
fig. 5 is a schematic view of a layer structure of a radio frequency antenna according to a first embodiment of the present invention;
fig. 6 is a top view of a layer structure of a radio frequency antenna part according to a first embodiment of the present invention;
fig. 7 is a schematic diagram of a top layer structure of a radio frequency antenna according to a first embodiment of the present invention;
FIG. 8 is a schematic view of a vertical interconnect according to a first embodiment of the present invention;
FIG. 9 is a schematic view of a bottom structure of a vertical interconnect according to a first embodiment of the present invention;
FIG. 10 is a top view of a vertical interconnect sub-floor structure according to a first embodiment of the present invention;
fig. 11 is a schematic structural diagram of an electromagnetic shielding part according to a first embodiment of the present invention;
fig. 12 is a front view showing the structure of an electromagnetic shielding portion according to the first embodiment of the present invention;
fig. 13 is a side view showing the structure of an electromagnetic shielding portion according to the first embodiment of the present invention;
fig. 14 is a top view showing the structure of an electromagnetic shielding part according to the first embodiment of the present invention;
fig. 15 is a standing wave characteristic curve and an axial ratio characteristic curve of a broadband circularly polarized antenna applied to a chip-type active phased array according to the first embodiment of the invention;
fig. 16 is a schematic diagram of an antenna array according to a second embodiment of the invention.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions in the embodiments of the present invention will be clearly and completely described in the following in conjunction with the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The technical scheme of the invention is further described below with reference to the attached drawings and specific embodiments:
example 1
As shown in fig. 1, a schematic structural diagram of a wideband circularly polarized antenna applied to a chip-type active phased array according to an embodiment of the present invention includes: a radio frequency antenna part (1), a vertical interconnection part (2) and an electromagnetic shielding part (3); the radio frequency antenna part (1) adopts a 90-degree phase difference constant-amplitude power division feed network, excites a radiation patch in a slot coupling mode, and meanwhile, a parasitic patch is arranged on the top layer to improve circular polarization performance; the vertical interconnection part (2) is composed of a feed network and a vertical transmission conductor (4) and is used for transmitting the bottom layer signal to the upper radio frequency antenna part; an electromagnetic shielding portion (3) separates the radio frequency antenna portion, the vertical interconnect portion, and components in the chip architecture active phased array, thereby improving electromagnetic compatibility.
As shown in fig. 2, the radio frequency antenna part (1) comprises a radio frequency antenna bottom layer (11), a first bonding layer (12), a radio frequency antenna middle layer (13), a second bonding layer (14) and a radio frequency antenna top layer (15) which are sequentially stacked from bottom to top; the first adhesive layer (12) is used for bonding between the bottom layer (11) of the radio frequency antenna and the middle layer (13) of the radio frequency antenna, and the second adhesive layer (14) is used for bonding between the middle layer (13) of the radio frequency antenna and the top layer (15) of the radio frequency antenna.
As shown in fig. 3, the radio frequency antenna substrate (11) includes: an antenna grounding plate (111), a first dielectric plate (112) and a 90-degree phase difference constant-amplitude power division feed network (113); the antenna grounding plate (111) is covered on the lower surface of the first dielectric plate (112), through holes are formed in the corners of the antenna grounding plate (111) and the first dielectric plate (112), and the first bonding pads (1131) are covered on the through holes.
As shown in fig. 4, the 90 ° phase difference constant amplitude power division feeding network (113) includes: the first bonding pad (1131), the first transmission line (1132), the second transmission line (1133), the first L-shaped transmission line (1134), the third transmission line (1135) and the S-shaped transmission line (1136), wherein the transmission lines are copper microstrip lines etched on the upper surface of the first dielectric plate (112); one end of a first transmission line (1132) is connected with a first bonding pad (1131), the other end of the first transmission line (1132) is connected with one end of a second transmission line (1133), the other end of the second transmission line (1133) is connected with one end of a first L-shaped transmission line (1134), one end of a third transmission line (1135) at the other end of the first L-shaped transmission line (1134) is connected, the other end of the third transmission line (1135) is open, one end of an S-shaped transmission line (1136) is connected at the connection point of the first L-shaped transmission line (1134) and the third transmission line (1135), and the other end of the S-shaped transmission line (1136) is open.
As shown in fig. 5 and 6, the radio frequency antenna middle layer (13) includes: the radiating patch comprises a first metal layer (131), a second dielectric plate (132), a radiating patch (133) and two U-shaped coupling gaps (134); the first metal layer (131) is plated on the lower surface of the second dielectric plate (132), the U-shaped coupling gap (134) is a through groove formed in the second dielectric plate (132), the opening end of the U-shaped coupling gap (134) is outwards far from the center point of the second dielectric plate (132), and the closed end of the U-shaped coupling gap (134) is inwards close to the center point of the second dielectric plate (132); the radiation patch (133) is a group of rectangular metal patches with diagonal corners, and the radiation patch (133) is arranged in the middle of the upper surface of the second dielectric plate (132); the radiation patch (133) covers the closed ends of the two U-shaped coupling slits (134); the open ends of the third transmission line (1135) and the open ends of the S-shaped transmission line (1136) are respectively perpendicular to the closed ends of the two U-shaped coupling gaps (134) in space, and electromagnetic waves in the third transmission line (1135) and the S-shaped transmission line (1136) are coupled to the upper radiation patch (133) through the two U-shaped coupling gaps (134).
As shown in fig. 7, the rf antenna top layer (15) includes: a third dielectric plate (151), a center parasitic patch (152), four edge parasitic patches (153); the center parasitic patch (152) and the four edge parasitic patches (153) are respectively attached to the upper surface of the first dielectric plate (151), the four edge parasitic patches (153) are symmetrically arranged on the upper surface of the first dielectric plate (151) in a cross structure, and the center parasitic patch (152) is arranged at the center position of the four edge parasitic patches (153); the parasitic structure formed by the center parasitic patch (152) and the four edge parasitic patches (153) is beneficial to the broadening of the antenna standing wave bandwidth and the improvement of the axial ratio.
As shown in fig. 8, the vertical interconnection portion (2) includes: a vertical interconnect bottom layer (21), a plurality of vertical interconnect transition layers (22), a plurality of third adhesive layers (23); the vertical interconnection bottom layer (21) is arranged at the bottommost layer of the vertical interconnection part (2), and a plurality of vertical interconnection transition layers (22) and third bonding layers (23) are sequentially and alternately laminated above the vertical interconnection bottom layer (21); and the two sides of each layer of the vertical interconnection bottom layer (21) and the vertical interconnection transition layers (22) are plated with metal, and through holes are formed in the corresponding positions of the vertical interconnection transition layers (22) and the third bonding layers (23).
As shown in fig. 9, the vertical interconnect substrate (21) includes: a vertical interconnection ground plate (211), a fourth dielectric plate (212), a second metal layer (213); the vertical interconnection grounding plate (211) is covered on the lower surface of the fourth dielectric plate (212), the second metal layer (213) is covered on the upper surface of the fourth dielectric plate (212), and through holes are correspondingly formed in the corners of the fourth dielectric plate (212) and the corners of the second metal layer (213).
As shown in fig. 10, the vertical interconnection ground plate (211) is provided with an L-shaped groove (2111), a second L-shaped transmission line (2112), a second bonding pad (2113) and a third bonding pad (2114), one end of the L-shaped groove (2111) is a square end, the other end of the L-shaped groove is a round end, the second bonding pad (2113) and the third bonding pad (2114) are respectively arranged inside the square end and the round end, the second L-shaped transmission line (2112) is correspondingly arranged inside the L-shaped groove (2111), and two ends of the second L-shaped transmission line (2112) are respectively connected with the second bonding pad (2113) and the third bonding pad (2114).
One end of the vertical transmission conductor (4) passes through the through holes arranged on each layer to be connected with the third bonding pad (2114), and the other end of the vertical transmission conductor (4) passes through the through holes arranged on each layer to be connected with the first bonding pad (1131).
As shown in fig. 11 to 14, the active phased array based on the chip architecture includes a plurality of components, and the problem of electromagnetic compatibility between the components is complex, in order to improve the electromagnetic compatibility, an electromagnetic shielding portion (3) is added in the antenna structure of the present invention, and the electromagnetic shielding portion (3) includes: the antenna comprises an L-shaped metal frame (31), a semi-cylindrical metal cylinder (32) and a rectangular metal frame (33), wherein the L-shaped metal frame (31) is embedded in the bottom of a vertical interconnection bottom layer (21) and wrapped around an L-shaped groove (2111), the semi-cylindrical metal cylinder (32) passes through each layer to be wrapped around a vertical transmission conductor (4), the rectangular metal frame (33) is arranged on the outer side of the upper half part of the antenna, and the rectangular metal frame (33) is wrapped around a radio frequency antenna part (1); the actual process may take the form of metallized vias to build the shielding structure. The main function of the electromagnetic shielding part is to separate the antenna part, the vertical interconnection part and other components in the chip-type active phased array.
The working principle of the antenna is as follows:
the radio frequency antenna part adopts a 90-degree phase difference equal-amplitude power division feed network, the length of a third transmission line in the feed network is different from that of an S-shaped transmission line by a quarter wavelength, so that the 90-degree phase difference is generated, and the third transmission line and the tail end of the S-shaped transmission line are orthogonal, so that the antenna has the circular polarization generating conditions of orthogonal, equal-amplitude and 90-degree phase difference; the antenna excites the radiation patch in a slot coupling feed mode, the feed network is not in direct contact with the radiation patch, but the electromagnetic signals below are transmitted to the patch above through the U-shaped coupling slot, so that the bandwidth is effectively widened, and meanwhile, the parasitic patch arranged on the top layer is also beneficial to widening the bandwidth; the vertical interconnection part is composed of a feed network and a vertical transmission conductor and is used for transmitting the bottom layer signal to the upper radio frequency antenna part; the electromagnetic shielding portion separates the radio frequency antenna portion, the vertical interconnect portion, and components in the chip-type architecture active phased array, thereby improving electromagnetic compatibility.
As shown in fig. 15, the standing wave characteristic curve and the axial ratio characteristic curve of the wideband circularly polarized antenna applied to the chip-type active phased array in this embodiment are given, and it can be seen from the curves that the antenna in this embodiment has better wideband and circularly polarized characteristics.
Example two
As shown in fig. 16, a 4×4 antenna array formed by antennas in the first embodiment is adopted, wherein the antenna units B, C, D are respectively obtained by sequentially rotating the antenna unit a around the vertex by 90 ° and sequentially rotating the antenna unit a around the vertex by 180 ° by 270 °, and a rotating layout mode is adopted in the antenna array, so as to improve the circular polarization performance of the common-caliber antenna and the array thereof; the antenna array is integrally processed, instead of independently processing the units and then splicing, so that the processing precision can be ensured, and the processing cost can be reduced.
The above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. A wideband circularly polarized antenna for use in a chip-type architecture active phased array, comprising: a radio frequency antenna part (1), a vertical interconnection part (2) and an electromagnetic shielding part (3); the radio frequency antenna part (1) adopts a 90-degree phase difference constant-amplitude power division feed network, excites a radiation patch in a slot coupling mode, and meanwhile, a parasitic patch is arranged on the top layer; the vertical interconnection part (2) is composed of a feed network and a vertical transmission conductor (4) and is used for transmitting the bottom layer signal to the upper radio frequency antenna part; an electromagnetic shielding portion (3) separates the radio frequency antenna portion, the vertical interconnect portion, and components in the chip architecture active phased array.
2. Broadband circularly polarized antenna for chip-based active phased arrays according to claim 1, characterized in that the rf antenna part (1) comprises an rf antenna bottom layer (11), a first adhesive layer (12), an rf antenna middle layer (13), a second adhesive layer (14), an rf antenna top layer (15) laminated in sequence from bottom to top; the first adhesive layer (12) is used for bonding between the bottom layer (11) of the radio frequency antenna and the middle layer (13) of the radio frequency antenna, and the second adhesive layer (14) is used for bonding between the middle layer (13) of the radio frequency antenna and the top layer (15) of the radio frequency antenna.
3. Broadband circularly polarized antenna for chip-based active phased arrays according to claim 2, wherein the radio frequency antenna substrate (11) comprises: an antenna grounding plate (111), a first dielectric plate (112) and a 90-degree phase difference constant-amplitude power division feed network (113); the antenna grounding plate (111) is covered on the lower surface of the first dielectric plate (112), through holes are formed in the corners of the antenna grounding plate (111) and the first dielectric plate (112), and the first bonding pads (1131) are covered on the through holes.
4. A wideband circularly polarized antenna for use in a chip-type active phased array as claimed in claim 3, wherein the 90 ° out of phase constant amplitude power division feed network (113) comprises: the first bonding pad (1131), the first transmission line (1132), the second transmission line (1133), the first L-shaped transmission line (1134), the third transmission line (1135) and the S-shaped transmission line (1136), wherein the transmission lines are copper microstrip lines etched on the upper surface of the first dielectric plate (112); one end of a first transmission line (1132) is connected with a first bonding pad (1131), the other end of the first transmission line (1132) is connected with one end of a second transmission line (1133), the other end of the second transmission line (1133) is connected with one end of a first L-shaped transmission line (1134), one end of a third transmission line (1135) at the other end of the first L-shaped transmission line (1134) is connected, the other end of the third transmission line (1135) is open, one end of an S-shaped transmission line (1136) is connected at the connection point of the first L-shaped transmission line (1134) and the third transmission line (1135), and the other end of the S-shaped transmission line (1136) is open.
5. Broadband circularly polarized antenna for chip-based active phased arrays as claimed in claim 4, wherein the radio frequency antenna layer (13) comprises: the radiating patch comprises a first metal layer (131), a second dielectric plate (132), a radiating patch (133) and two U-shaped coupling gaps (134); the first metal layer (131) is plated on the lower surface of the second dielectric plate (132), the U-shaped coupling gap (134) is a through groove formed in the second dielectric plate (132), the opening end of the U-shaped coupling gap (134) is outwards far from the center point of the second dielectric plate (132), and the closed end of the U-shaped coupling gap (134) is inwards close to the center point of the second dielectric plate (132); the radiation patch (133) is a group of rectangular metal patches with diagonal corners, and the radiation patch (133) is arranged in the middle of the upper surface of the second dielectric plate (132); the radiation patch (133) covers the closed ends of the two U-shaped coupling slits (134); the open ends of the third transmission line (1135) and the open ends of the S-shaped transmission line (1136) are respectively perpendicular to the closed ends of the two U-shaped coupling gaps (134) in space, and electromagnetic waves in the third transmission line (1135) and the S-shaped transmission line (1136) are coupled to the upper radiation patch (133) through the two U-shaped coupling gaps (134).
6. A wideband circularly polarized antenna for use in a chip-type active phased array as claimed in claim 3, wherein the rf antenna top layer (15) comprises: a third dielectric plate (151), a center parasitic patch (152), four edge parasitic patches (153); the center parasitic patch (152) and the four edge parasitic patches (153) are all attached to the upper surface of the first dielectric plate (151), the four edge parasitic patches (153) are symmetrically arranged on the upper surface of the first dielectric plate (151) in a cross structure, and the center parasitic patch (152) is arranged at the center position of the four edge parasitic patches (153).
7. Broadband circularly polarized antenna for chip-based active phased arrays according to claim 1, wherein the vertical interconnect (2) comprises: a vertical interconnect bottom layer (21), a plurality of vertical interconnect transition layers (22), a plurality of third adhesive layers (23); the vertical interconnection bottom layer (21) is arranged at the bottommost layer of the vertical interconnection part (2), and a plurality of vertical interconnection transition layers (22) and third bonding layers (23) are sequentially and alternately laminated above the vertical interconnection bottom layer (21); and the two sides of each layer of the vertical interconnection bottom layer (21) and the vertical interconnection transition layers (22) are plated with metal, and through holes are formed in the corresponding positions of the vertical interconnection transition layers (22) and the third bonding layers (23).
8. Broadband circularly polarized antenna for chip-based active phased arrays as claimed in claim 7, wherein the vertical interconnect substrate (21) comprises: a vertical interconnection ground plate (211), a fourth dielectric plate (212), a second metal layer (213); the vertical interconnection grounding plate (211) is covered on the lower surface of the fourth dielectric plate (212), the second metal layer (213) is covered on the upper surface of the fourth dielectric plate (212), and through holes are correspondingly formed in the corners of the fourth dielectric plate (212) and the second metal layer (213); an L-shaped groove (2111), a second L-shaped transmission line (2112), a second bonding pad (2113) and a third bonding pad (2114) are formed in the vertical interconnection grounding plate (211), one end of the L-shaped groove (2111) is a square end, the other end of the L-shaped groove is a round end, the second bonding pad (2113) and the third bonding pad (2114) are respectively arranged in the square end and the round end, the second L-shaped transmission line (2112) is correspondingly arranged in the L-shaped groove (2111), and two ends of the second L-shaped transmission line (2112) are respectively connected with the second bonding pad (2113) and the third bonding pad (2114); one end of the vertical transmission conductor (4) passes through the through holes arranged on each layer to be connected with the third bonding pad (2114), and the other end of the vertical transmission conductor (4) passes through the through holes arranged on each layer to be connected with the first bonding pad (1131).
9. Broadband circularly polarized antenna for chip-based active phased arrays according to claim 8, wherein the electromagnetic shielding section (3) comprises: l-shaped metal frame (31), semi-cylindrical metal cylinder (32), rectangle metal frame (33), the embedding of L-shaped metal frame (31) at the bottom of perpendicular interconnection bottom (21), wrap up around L-shaped groove (2111), semi-cylindrical metal cylinder (32) pass each layer parcel around perpendicular transmission conductor (4), rectangle metal frame (33) set up in the last half outside of antenna, rectangle metal frame (33) parcel is around radio frequency antenna part (1).
10. An antenna array is characterized in that a plurality of antenna subarrays are adopted, the antenna subarrays form a square array with two rows and two columns by adopting a first antenna unit, a second antenna unit, a third antenna unit and a fourth antenna unit, the first antenna unit adopts the broadband circularly polarized antenna applied to a chip-type structure active phased array according to any one of claims 1 to 8, and the second antenna unit, the third antenna unit and the fourth antenna unit are respectively obtained by rotating the first antenna unit around vertexes by 90 degrees, 180 degrees and 270 degrees in sequence.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311719335.4A CN117498024A (en) | 2023-12-13 | 2023-12-13 | Broadband circularly polarized antenna and antenna array applied to chip-type architecture active phased array |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311719335.4A CN117498024A (en) | 2023-12-13 | 2023-12-13 | Broadband circularly polarized antenna and antenna array applied to chip-type architecture active phased array |
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| CN117498024A true CN117498024A (en) | 2024-02-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311719335.4A Pending CN117498024A (en) | 2023-12-13 | 2023-12-13 | Broadband circularly polarized antenna and antenna array applied to chip-type architecture active phased array |
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| Country | Link |
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| CN (1) | CN117498024A (en) |
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