CN111971852B - Antenna packaging structure - Google Patents
Antenna packaging structure Download PDFInfo
- Publication number
- CN111971852B CN111971852B CN201880092303.7A CN201880092303A CN111971852B CN 111971852 B CN111971852 B CN 111971852B CN 201880092303 A CN201880092303 A CN 201880092303A CN 111971852 B CN111971852 B CN 111971852B
- Authority
- CN
- China
- Prior art keywords
- layer
- antenna
- metal sheet
- reference ground
- feed hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/28—Combinations of substantially independent non-interacting antenna units or systems
Abstract
The application discloses an antenna packaging structure. The lower ends of the two feed holes are respectively connected to different reference ground layers, a windowing of a metal sheet connected with one feed hole and a windowing allowing the other feed hole to pass through are required to be dug on one reference ground layer, and a windowing of a metal sheet connected with the other feed hole is required to be dug on the other reference ground layer, because the windowing area for the feed hole to pass through is smaller than the windowing area of the metal sheet connected with the feed hole, compared with the scheme of connecting the two feed holes to the same reference ground layer in the prior art, the invention reduces the hollowing area of the same reference ground layer, so that the capacitive coupling performance of the coupling capacitor formed by each radiation sheet and the reference ground layer is better, therefore, the reference ground layer with smaller area reduction amplitude can provide better reference ground signals for the antenna, and the interference shielding performance between the AiP antenna and the chip is improved, the high performance requirement of the antenna is met.
Description
Technical Field
The application relates to the technical field of antenna packaging, in particular to an antenna packaging structure.
Background
With the advent of high-rate communication era such as 5G and VR (Virtual Reality), millimeter wave communication has become mainstream. The design and application requirements of millimeter wave antennas are also increasing.
Since the length of the millimeter wave transmission path has a great influence on the signal amplitude loss, the traditional architecture mode of IC (Integrated Circuit) plus PCB (Printed Circuit Board) plus antenna has been unable to meet the requirement of high performance. In an architecture of an IC-packaged Antenna, that is, an AiP (packaged Antenna integrated) Antenna technology, an Antenna feeder path is very short, so that an EIRP (Equivalent Isotropic Radiated Power) value of a wireless system can be maximized, which is beneficial to wider coverage, and therefore, the AiP Antenna technology will gradually become a mainstream Antenna technology of 5G and millimeter wave high-speed communication systems, however, the existing AiP Antenna has poor performance and cannot meet high-performance requirements.
Disclosure of Invention
In view of the above, the present application provides an antenna package structure to improve the antenna performance of the AiP antenna, so that the antenna package structure meets the requirement of high performance.
In order to solve the technical problem, the following technical scheme is adopted in the application:
a first aspect of the present application provides an antenna package structure, which includes, from top to bottom, a first core board, a second core board, and a wiring layer, which are stacked in sequence;
a first radiation sheet is arranged on the upper surface of the first core plate; a second radiation sheet is arranged on the upper surface of the second core plate;
the antenna package structure further includes: a first feed hole penetrating the first core board and the second core board and a second feed hole penetrating the second core board; the first feed hole is used for feeding the first radiation piece, and the second feed hole is used for feeding the second radiation piece;
the wiring layers sequentially comprise a first reference grounding layer and a second reference grounding layer which are stacked and insulated from each other from top to bottom;
a first windowing and a second windowing which are mutually spaced are arranged on the first reference grounding layer, a first metal sheet is arranged in the first windowing, and a gap is formed between the edge of the first metal sheet and the edge of the first windowing;
a third opening window is arranged on the second reference grounding layer, and a second metal sheet is arranged in the third opening window; a gap is reserved between the edge of the second metal sheet and the edge of the third opening window;
and in the first feed hole and the second feed hole, the lower end of one feed hole is connected to the first metal sheet, and the lower end of the other feed hole passes through the second window and is connected to the second metal sheet.
In the antenna package structure provided in the first aspect of the present application, by connecting the lower ends of the two feeding holes to different reference ground layers respectively, a window for connecting a metal sheet of one feeding hole and a window for allowing another feeding hole to pass through need to be dug out on one reference ground layer, and a window for connecting a metal sheet of another feeding hole need to be dug out on another reference ground layer, because the feeding hole passing area is usually smaller than the metal sheet connecting the feeding holes, and therefore, the windowing area for passing through the feeding hole is smaller than the windowing area of the metal sheet connecting the feeding holes, so that compared with the prior art scheme (requiring the corresponding windows of the metal sheets for digging the first feeding hole and the second feeding hole on the same reference ground layer), the present application reduces the hollowed area of the same reference ground layer (including the first reference ground layer and the second reference ground layer), therefore, the capacitive coupling performance of the coupling capacitor formed by each radiating patch and the reference ground layer is better, so that the reference ground layer with smaller area reduction amplitude can provide better reference ground signals for the antenna, the problem that the interference shielding performance between the AiP antenna and the chip is poor is solved, and the high-performance requirement of the antenna is met.
With reference to the first aspect of the present application, in a first possible implementation manner, the first core plate includes a first core plate main body;
a first dielectric layer on an upper surface of the first core body;
the second medium layer is positioned on the lower surface of the first core plate main body;
the first core plate main body is made of a completely cured film, and the first dielectric layer and the second dielectric layer are made of prepregs attached to the upper surface and the lower surface of the first core plate main body through a hot-pressing curing process.
Based on the first possible implementation manner, the overall warping of the antenna packaging structure is reduced.
With reference to the first possible implementation manner of the first aspect of the present application, in a second possible implementation manner, the first core board further includes a third dielectric layer disposed on an upper surface of the first dielectric layer; the third dielectric layer is made of a prepreg attached to the upper surface of the first dielectric layer through a hot-pressing curing process.
Based on the second possible implementation manner, the overall warpage of the antenna packaging structure is further reduced.
With reference to the first aspect of the present application or any one of the foregoing possible implementation manners, in a third possible implementation manner, the upper surface of the first core board further includes a suspended copper layer or a ground copper layer disposed around the first radiation patch.
Based on the third possible implementation manner, the coplanarity and the copper laying rate of the whole structure of the antenna packaging structure are improved.
With reference to the first aspect of the present application or any one of the foregoing possible implementation manners, in a fourth possible implementation manner, a dielectric constant of a dielectric material used for manufacturing the first core board is below 3.6.
Based on the fourth possible implementation manner, the antenna performance requirement is more easily met.
With reference to the first aspect of the present application or any one of the foregoing possible implementation manners, in a fifth possible implementation manner, the thickness of the first core plate is greater than or equal to 360 μm.
Based on the fifth possible implementation manner, mutual interference between the two antennas can be avoided, and the antenna performance requirements are met.
With reference to the first aspect of the present application or any one of the foregoing possible implementations, in a sixth possible implementation, a thermal expansion coefficient of a dielectric material used to fabricate the second core board is less than 6 ppm.
Based on the sixth possible implementation manner, the support and rigidity can be provided for the device product, the compatibility of the overall thermal expansion coefficient of the antenna packaging structure with the external chip and the PCB can be ensured, and the reliability of the connection position between the external chip and the PCB can be further ensured,
with reference to the first aspect of the present application or any one of the foregoing possible implementation manners, in a seventh possible implementation manner, a plurality of first pads are disposed on a lower surface of the wiring layer, and the plurality of first pads are used to electrically connect the wiring layer and a chip.
With reference to the seventh possible implementation manner of the present application, in an eighth possible implementation manner, a plurality of second pads are further disposed on the lower surface of the wiring layer, and the plurality of second pads are used for electrically connecting the antenna packaging structure with an external circuit.
With reference to the first aspect of the present application or any one of the foregoing possible implementation manners, in a ninth possible implementation manner, the first feeding hole and the second feeding hole are both mechanical through holes.
Based on the ninth possible implementation manner, the manufacturing process can be simplified, and the difficulty in the process is overcome.
With reference to the first aspect of the present application or any one of the foregoing possible implementation manners, in a tenth possible implementation manner, a first solder mask layer is further disposed on the upper surface of the first core board, and the first solder mask layer is provided with windows at different positions according to an electrical connection requirement.
With reference to the first aspect of the present application or any one of the foregoing possible implementation manners, in an eleventh possible implementation manner, a second solder mask layer is further disposed on the lower surface of the wiring layer, and the second solder mask layer is provided with windows at different positions according to an electrical connection requirement.
With reference to the first aspect of the present application or any one of the foregoing possible implementation manners, in a twelfth possible implementation manner, the antenna package structure further includes a chip disposed below the wiring layer, and the wiring layer is electrically connected to the chip.
In combination with the first aspect of the present application or any one of the above possible implementation manners, in a thirteenth possible implementation manner, the second reference ground layer is further provided with a fourth windowing spaced from the third windowing, the fourth windowing is provided with a third metal sheet, the third metal sheet is used for electrically connecting the first blind hole, the first blind hole is located in the first metal sheet and the medium layer between the second metal sheets, and is used for achieving electrical connection between the first metal sheet and the third metal sheet.
Compared with the prior art, the method has the following beneficial effects:
based on the above technical solutions, in the antenna package structure provided by the present application, through the structure that the lower ends of the two feeding holes are respectively connected to different reference ground layers, a window for connecting a metal sheet of one feeding hole and a window for allowing another feeding hole to pass through need to be dug out on one reference ground layer, and a window for connecting a metal sheet of another feeding hole need to be dug out on another reference ground layer, because the passing area of the feeding hole is usually smaller than the area of the metal sheet connected to the feeding hole, the windowing area for passing the feeding hole is smaller than the windowing area of the metal sheet connected to the feeding hole, so that compared with the prior art in which two feeding holes are both connected to the same reference ground layer (the windowing corresponding to the metal sheets needed to dig the first feeding hole and the second feeding hole on the same reference ground layer), the present application reduces the hollowed area of the same reference ground layer (including the first reference ground layer and the second reference ground layer), therefore, the capacitive coupling performance of the coupling capacitor formed by each radiating patch and the reference ground layer is better, so that the reference ground layer with smaller area reduction amplitude can provide better reference ground signals for the antenna, the problem that the interference shielding performance between the AiP antenna and the chip is poor is solved, and the high-performance requirement of the antenna is met.
Drawings
Fig. 1 is a schematic cross-sectional view of a package structure of AiP antenna;
fig. 2 is a schematic cross-sectional structure diagram of an antenna package structure according to an embodiment of the present application;
fig. 3 is a top view of a first reference ground plane provided by an embodiment of the present application;
fig. 4 is a top view of a second reference ground layer provided by an embodiment of the present application;
fig. 5 is a schematic cross-sectional structure diagram of a package structure according to an embodiment of the present application.
Description of reference numerals:
200. 500: an antenna packaging structure is provided with an antenna packaging structure,
11. 201: a first core plate is arranged on the first core plate,
2011: a first core plate main body having a first core plate main body,
2012: a first dielectric layer, a second dielectric layer,
2013: a second layer of dielectric material is provided,
2014: a third layer of a dielectric material,
12. 202: a second core plate is arranged on the first core plate,
13. 203: a wiring layer is provided on the substrate,
l1 to L9: a first copper layer to a ninth copper layer,
2031 to 2035: a fourth dielectric layer to an eighth dielectric layer,
15. 204: a first radiation sheet is arranged on the first radiation plate,
16. 205: a second radiation sheet is arranged on the first radiation sheet,
17. 206: a first feed hole is formed in the first substrate,
18. 207: a second feed hole is formed in the first substrate,
208: a first bonding pad having a first bonding area and a second bonding area,
209: a second bonding pad is formed on the second substrate,
210: a first solder resist layer is formed on the first solder resist layer,
211: a second solder resist layer is formed on the first solder resist layer,
14. 501: and (3) a chip.
Detailed Description
Before describing the detailed description of the present application, abbreviations and key term definitions as used in the present application are first described.
Abbreviations and Key term definitions
Antenna for Antenna
Patch array Patch array
AiP (antenna in Package) packaged antenna integration
EIRP (equivalent Isotropic Radiated Power)
5G(the 5thGeneration) fifth Generation (communication technology)
VR (virtual reality) virtual reality
Low DK/DF Low dielectric constant/Low loss
Build up laminate Build-up (package substrate proper name)
GND (ground) ground plane
CSP (chip scale package) chip scale package
SAP semi-additive process (Package substrate proper name)
MSAP improved semi-additive process (package substrate proper name)
AiP antenna technology will gradually become the mainstream antenna technology of 5G and millimeter wave high-speed communication systems, and has wide application space and market space prospects. Especially, the 5G millimeter wave dual-frequency dual-polarized antenna has wide application prospect in future mobile phone terminal equipment.
AiP A cross-sectional view of a package structure of the antenna is shown in FIG. 1. It should be noted that the AiP antenna shown in fig. 1 is a dual-band array antenna.
The AiP antenna package structure includes, from top to bottom, a first core board 11, a second core board 12, and a wiring layer 13, which are stacked, and a chip 14 is further disposed below the wiring layer 13.
The wiring layer 13 includes a multilayer laminated structure such as a ground layer, an antenna feeder layer, and a signal output layer.
The antenna shown in fig. 1 is a dual-frequency multi-polarization antenna, and the package structure shown in fig. 1 includes two radiation plates: a first radiation sheet 15 located on the surface layer of the package structure and a second radiation sheet 16 located inside the package structure, wherein the first radiation sheet 15 is disposed on the upper surface of the first core board 11, and the second radiation sheet 16 is disposed on the upper surface of the second core board 12.
The two radiating sheets 15 and 16 need to be kept a certain distance in the vertical direction, generally about 360 μm, and the second radiating sheet 16 is also kept a certain larger distance in the vertical direction, generally about 300 μm, from the ground plane. The specific distance value depends on the dielectric constant of the dielectric layer and the operating frequency of the antenna.
Since the first radiation plate 15 and the second radiation plate 16 need to transmit signals to and from the chip 14, a first feed hole 17 communicating with each other is provided in the first core board 11 and the second core board 12, and a second feed hole 18 is provided in the second core board 12.
Normally, the lower ends of the first feed hole 17 and the second feed hole 18 are both connected to the same antenna reference ground layer in the wiring layer 13. In order to avoid short circuit between the first feeding hole 17 and the antenna reference ground layer, a window corresponding to the metal sheet connected to the first feeding hole 17 and a window corresponding to the metal sheet connected to the second feeding hole 18 are disposed on the same antenna reference ground layer, and the windows are used for avoiding short circuit connection between the feeding holes and the antenna reference ground layer, so as to achieve electrical isolation between the feeding holes and the antenna reference ground layer. The arrangement of the windows of the metal plates corresponding to the first feed hole 17 and the second feed hole 18 requires a considerable area to be dug out on the antenna reference ground layer, which results in a reduction in the area of the antenna reference ground layer. In the antenna packaging structure, a coupling capacitor is formed between the radiation sheet and the antenna reference ground layer, and the radiation sheet and the antenna reference ground layer are respectively equivalent to two polar plates of the coupling capacitor, so that the area of the antenna reference ground layer is reduced, which is equivalent to the area of a negative polar plate of the coupling capacitor, and further, the antenna reference ground layer with the reduced area reduces the capacitive coupling performance of the coupling capacitor, so that a higher reference ground signal cannot be provided for the antenna, the interference shielding performance between the AiP antenna and the chip is poor, and the high performance requirement of the antenna cannot be met.
In order to improve the performance of the AiP antenna and further meet the high-performance requirement of the antenna, the embodiment of the application further provides an antenna packaging structure applied to the AiP antenna. The antenna packaging structure is applied to a dual-frequency array antenna, particularly to a 5G dual-frequency array antenna, and therefore the antenna packaging structure comprises two radiating sheets.
Referring to fig. 2, an antenna package structure 200 of an AiP antenna provided in the embodiment of the present application sequentially includes, from top to bottom, a first core board 201, a second core board 202, and a wiring layer 203, which are stacked;
a first copper layer L1 is disposed on the upper surface of the first core board 201, and the first copper layer L1 is used for forming the first radiation piece 204; a second copper layer L2 is provided on the upper surface of the second core board 202, and the second copper layer L2 is used to form the second radiation piece 205.
The wiring layer 203 may be a multilayer laminated structure made by a laminated build-up process (built up), which may include a ground layer, a feeder layer, and a signal output layer. The grounding layer, the feeder layer and the signal output layer can be all copper layer structures.
As an example, the wiring layer 203 includes, in order from top to bottom: 6 copper layers spaced from each other by a dielectric layer: third copper layer L3 through eighth copper layer L8. The third copper layer L3 and the fourth copper layer L4 are used for providing a first reference ground layer and a second reference ground layer of a reference ground signal for the antenna, the fifth copper layer L5 and the seventh copper layer L7 can be used for manufacturing an antenna feeder layer and a signal output layer, the sixth copper layer L6 can be a ground layer for isolation, and the eighth copper layer L8 is used for manufacturing a pad electrically connected with the chip and an external circuit.
It should be noted that, in the embodiment of the present application, the dielectric layers inside the wiring layer 203 are respectively a fourth dielectric layer 2031 to an eighth dielectric layer 2035 from top to bottom. The fourth dielectric layer 2031 to the eighth dielectric layer 2305 may be made of a conventional low loss (low loss) material or a conventional dielectric material according to the length of the trace. Specifically, each dielectric layer can be made of organic resin materials with conventional characteristics so as to reduce the material cost of the basic packaging structure. More specifically, each dielectric layer can be formed by laminating through a hot-pressing curing process by using a prepreg material.
In order to realize signal transmission between the first radiation plate 204 and the feeder layer of the wiring layer 203 in the lower half area of the antenna package structure 200, the antenna package structure 200 further includes: a first feeding hole 206 penetrates the first core board 201 and the second core board 202, and the first feeding hole 206 is used for feeding the first radiation patch 204. In order to realize signal transmission between the second radiation patch 205 and the feeder layer of the wiring layer 203 in the lower half area of the antenna package structure 200, the antenna package structure 200 further includes a second feeding hole 207 penetrating through the second core board 202, and the second feeding hole 207 is used for feeding the second radiation patch 205.
It should be noted that, in the embodiment of the present application, the first feeding hole 206 or the second feeding hole 207 is filled with a feeding line or a conductive material, such as metallic copper, and the first feeding hole 206 or the second feeding hole 207 may be used for signal transmission. In this way, the first radiation plate 204 may realize power feeding through the first feeding hole 206, and the second radiation plate 207 may realize power feeding through the second feeding hole 207.
As an example, the first radiation patch 204 may be an antenna with a frequency of 39G, and accordingly, the first feed hole 206 may be a feed hole of the antenna with the frequency of 39G. The second radiation patch 205 may be an antenna with a frequency of 28G, and accordingly, the second feeding hole 207 may be a feeding hole of the antenna with a frequency of 28G.
In the embodiment of the present application, in order to reduce the hollowed area as the antenna radiation reference ground layer to improve the antenna performance, the lower ends of the first feed hole 206 and the second feed hole 207 may be connected to different antenna reference ground layers, respectively. As such, the wiring layer 203 may include, in order from top to bottom, a first reference ground layer, a second reference ground layer, and a feeder layer that are stacked and spaced apart from each other in an insulated manner. As an example, a first reference ground layer may be disposed on the third metallic copper layer L3, and the second reference ground layer may be disposed on the fourth copper layer L4.
As an example, the lower end of the first feed hole 206 may be connected to the layer structure on which the second reference ground layer is located, and the lower end of the second feed hole 207 may be connected to the layer structure on which the first reference ground layer is located.
Further, in order to avoid an electrical short between the feed hole and the reference ground layer, the first reference ground layer is provided with two first windows w1 and two second windows w2 spaced apart from each other in a top view as shown in fig. 3.
A first metal plate p1 for electrically connecting a second feeding hole 207 and the first blind hole v1 is provided in one of the first windows w1, and the lower end of the second feeding hole 207 may be connected to a region where the dotted-line circle C1 of the first metal plate p1 is located. The first blind hole v1 is used for realizing the electrical connection between the first metal sheet p1 and the adjacent feeder layer below the first metal sheet p 1; as an example, the region connecting the first blind hole v1 is the region shown by the solid coil v 1. Since the second feed hole 207 needs to be electrically insulated from the first reference ground layer, electrical insulation is needed between the first metal sheet p1 and the first reference ground layer, and therefore, there is a certain interval between the edge of the first metal sheet p1 and the edge of the first window w 1.
A second open window w2 is used to pass a first feed hole 206 therethrough, so that the lower end of the first feed hole 206 is connected to the open window area of the second reference ground layer. The region where the first feed hole 206 passes through the second window w2 is set to the region shown by the solid coil C2. Since the first feed hole 206 needs to be electrically insulated from the first reference ground layer, the first feed hole 206 passes through a partial region of the second window w2, and thus there is a certain interval between the edge of the region C2 where the first feed hole 206 passes through the second window w2 and the edge of the second window w 2.
The top view of the second reference ground layer is shown in fig. 4, and two third windows w3 and two fourth windows w4 are disposed thereon.
A second metal sheet p2 for electrically connecting the first feeding hole 206 and the second blind hole v2 is arranged in the third open window w3, and the lower end of the first feeding hole 206 can be connected to the position of the virtual coil C3 of the second metal sheet p 2. The second blind hole v2 is used for realizing the electrical connection between the second metal sheet p2 and the adjacent feeder layer below the second metal sheet p 2; as an example, the region connecting the second blind hole v2 is the region shown by the solid coil v 2. Since the first feed hole 206 needs to be electrically insulated from the second reference ground layer, electrical insulation is needed between the second metal sheet p2 and the second reference ground layer, and therefore, a certain interval exists between the edge of the second metal sheet p2 and the edge of the third open window w 3.
A third metal sheet p3 is arranged in the fourth window w4, and an area for connecting the first blind hole v1 needs to be reserved on the third metal sheet p3, so that the second feeding hole 207 can be electrically connected with the feeder layer below through the first blind hole v1 and the third metal sheet p 3. The region connecting the first blind hole v1 is set to the region shown by the solid coil C4. In order to achieve electrical isolation of the second feed hole 207 from the second reference ground layer, there is a certain interval between the edge of the third metal sheet p3 and the edge of the fourth window w 4.
With the above structure of the first reference ground layer and the second reference ground layer, in the embodiment of the present application, the lower end of the first feed hole 206 passes through the second window w2 to be connected with the second metal sheet p2, and since the second metal sheet p2 is electrically connected to the second blind via and the first feed hole 206 is electrically connected with the second metal sheet p2, the first feed hole 206 can be in signal connection with the feed line layer in the wiring layer 203 through the second metal sheet p2, thereby feeding the first radiation plate 204.
The lower end of the second feeding hole 207 is connected to the first metal sheet p1, and since the first metal sheet p1 and the third metal sheet are both electrically connected to the first blind hole, and the second feeding hole 207 is electrically connected to the first metal sheet p1, the second feeding hole 207 can be in signal connection with the feeding line layer in the wiring layer 203 through the first metal sheet p1, the first blind hole, and the third metal sheet, so as to feed the second radiation sheet 205.
It should be noted that, in the embodiment of the present application, each metal sheet may be a metal copper sheet, and each metal sheet may be a copper layer portion left by etching a copper layer.
As can be seen from the first and second reference ground layers, not only the metal sheet region electrically connected to the feed hole needs to be provided in the first open window w1 and the third open window w3, but also a region of the first blind via for realizing interlayer electrical connection needs to be reserved, so that the first open window w1 and the third open window w3 need to accommodate not only the metal sheet C1 of the feed hole but also the metal sheet v1 of the blind via, while the second open window w2 only needs to accommodate the region C2 through which the first feed hole 206 passes, and only the third metal sheet p3 for connecting the blind via needs to be accommodated in the fourth open window w 4. Because the penetrating area of the feed hole or the area of the metal sheet connected with the blind hole is smaller than the area of the metal sheet connected with the feed hole and the blind hole, the windowing area for the feed hole to penetrate through or the windowing area of the windowing corresponding to the pad connected with the blind hole is smaller than the windowing area of the metal sheet provided with the feed hole and the blind hole, and therefore the windowing areas of the first windowing w1 and the third windowing w3 are larger than the windowing area of the second windowing w2 or the fourth windowing.
As can be seen from the connection manner of the first reference ground layer, the second reference ground layer, and the first power feed hole 206 and the second power feed hole 207, a first window w1 corresponding to the first metal plate p1 of the second power feed hole 207 and the first blind via v1 and a second window w2 for allowing the first power feed hole 206 to pass through need to be dug out on the first reference ground layer, and a third window w3 corresponding to the second metal plate p2 of the first power feed hole 206 and the second blind via v2 and a fourth window corresponding to the third pad p3 connected to the first blind via v1 need to be dug out on the second reference ground layer. Since the window areas of the second window w2 and the fourth window w4 are smaller than the window areas of the first window w1 or the third window w3, the hollowed areas of the first reference ground layer and the second reference ground layer are smaller than the hollowed area of the reference ground layer of the structure of fig. 1 (fig. 1 requires that the first window w1 and the second window w2 are hollowed out on one reference ground layer). Therefore, the present application reduces the hollowed area of the same reference ground layer (including the first reference ground layer and the second reference ground layer), so that the capacitive coupling performance of the coupling capacitor formed by each radiating patch and the reference ground layer is better, and therefore, the reference ground layer with the reduced area can provide a better reference ground signal for the antenna, and improve AiP the problem of poor interference shielding performance between the antenna and the chip, and meet the high performance requirement of the antenna.
It should be noted that in the embodiment of the present application, the first radiation patch 204 and the second radiation patch 205 function as antennas for receiving and transmitting signals with different frequencies, and as an example, the first radiation patch 204 may receive and transmit signals with a frequency of 39G, and the second radiation patch 205 may receive and transmit signals with a frequency of 28G. Therefore, in order to avoid mutual interference between the two antennas and meet the antenna performance requirement, the first radiation sheet 204 and the second radiation sheet 205 need to be spaced apart by a certain distance in the stacking direction, and as an example, the distance between the first radiation sheet 204 and the second radiation sheet 205 in the stacking direction may be 360 μm or more. Therefore, in the present embodiment, the thickness of the first core board 201 between the first radiation piece 205 and the second radiation piece 206 is set to a certain thickness. As an example, the thickness of the first core plate 201 may be 360 μm or more. In addition, in order to meet the antenna performance requirement, the first core board 201 may be made of a dielectric material with a low dielectric constant or low loss, and in general, the dielectric constant of the dielectric material used for manufacturing the first core board 201 may be below 3.6.
In addition, a certain distance is required between the second radiation piece 205 and the second reference ground layer L3 in the stacking direction, and therefore, the thickness of the second core board 202 located between the second radiation piece 205 and the second reference ground layer L3 also needs to reach a certain thickness, and the thickness of the second core board 202 may be, for example, 300 μm or more.
Further, the first feed hole 206 needs to penetrate the first core board 201 and the second core board 202. And based on the above example, the sum of the thicknesses of the first core plate 201 and the second core plate 202 reaches 600 μm or more. The blind via, through-hole process of conventional substrates has difficulty in forming through-holes through such thick layer structures. Therefore, if the first feeding hole 206 is formed by using a blind hole or through hole process of a conventional substrate, such as an etching process, to form a plated hole, there is a great difficulty in the process. Therefore, to overcome the process difficulty, the first feeding hole 206 may be formed by a mechanical drilling process or a laser drilling process. Thus, to overcome the process difficulty of fabricating the first feed hole 206, the first feed hole 206 may be a mechanical via. In addition, the second power feeding hole 207 may be formed by making a plated hole, or may be formed by a mechanical drilling or laser drilling process. In order to simplify the manufacturing process, the second feeding hole 207 may use the same manufacturing process as the first feeding hole 206, and therefore, when the first feeding hole 206 is a mechanical through hole, the second feeding hole 207 may also be a mechanical through hole.
In addition, in the antenna package structure provided in the embodiment of the present application, with the third copper layer L3 on the topmost layer of the wiring layer 203 as a boundary, the structure located above the third copper layer L3 may be regarded as an antenna layer, and the structure located below the third copper layer L3 (including the third copper layer L3) is a wiring layer. The copper remaining ratio of the wiring layer 203 is generally 80% or more, while the copper remaining ratio of the antenna layer is low and generally 50% or less. Therefore, the upper half portion (antenna layer) and the lower half portion (wiring layer) of the antenna package structure have a large difference in residual copper rate, which easily causes the overall warpage of the antenna package structure.
As an alternative embodiment of the present application, in order to improve coplanarity and copper spreading rate of the whole structure of the antenna package structure, the upper surface of the first core board 201 may further include a suspended copper layer or a ground copper layer disposed around the first radiating patch 204. The arrangement of the suspended copper layer or the grounding copper layer is beneficial to improving the copper laying rate of the upper half part of the antenna packaging structure, so that the difference of the residual copper rate of the upper half part and the lower half part of the antenna packaging structure is beneficial to reducing, and the overall warping of the antenna packaging structure is further improved.
In addition, during the thermal compression curing process of the prepreg material, volume shrinkage may occur, and the stress generated during the volume shrinkage process may improve the warpage of the overall structure of the antenna package structure, so as to reduce the overall warpage of the antenna package structure, as another alternative embodiment of the present application, the first core board 201 may include a first core board main body 2011;
a first dielectric layer 2012 on the upper surface of the first core body 2011;
and a second dielectric layer 2013 on the lower surface of the first core body 2011;
the first core main body 2011 is made of a completely cured film, and the first dielectric layer 2012 and the second dielectric layer 2013 are made of prepregs attached to the upper surface and the lower surface of the first core main body 2011 through a hot press curing process.
In addition, to further facilitate adjustment of the overall warpage performance of the antenna package structure, the first core board 201 may further include a ninth copper layer L9 disposed on the upper surface of the first dielectric layer 2011 and a third dielectric layer 2014 located above the 9 th copper layer. In addition, the third dielectric layer 2014 may also be formed by thermal compression curing of a semi-cured material. In the embodiment of the present application, the ninth copper layer L9 mainly serves to electrically connect the first radiating patch 204 and the first feeding hole 206. In addition, in order to electrically connect the first radiation patch 204 and the first feed hole 206, a blind via filled with copper metal may be further disposed on the third dielectric layer 2014, so that the first radiation patch 206 may be electrically connected to the first feed hole 206 through the blind via disposed on the third dielectric layer 2014 and the ninth copper layer L9.
As an example, the above-mentioned first core 201 preparation process may be as follows:
upper semi-cured sheets (prep) are respectively stuck to the upper and lower surfaces of the fully cured first core body 2011, and then the first dielectric layer 2012, the second dielectric layer 2013 and the third dielectric layer 2014 are laminated together by a hot press curing process. In the hot-pressing curing process, the prepreg can generate a curing reaction and shrink in volume, so that the warping performance of the whole antenna packaging structure can be improved. It should be noted that, on the premise that the distance between the first radiation sheet 204 and the second radiation sheet 205 is not changed, that is, on the premise that the total thickness of the first chip 201 is not changed, the overall warpage performance of the antenna package structure can be effectively adjusted by adjusting the thickness relationship between the first dielectric layer 2012, the second dielectric layer 2013, the third dielectric layer 2014 and the first chip main body 2011, so as to meet the package requirement.
Note that, in the above example, the feeding to the first radiation patch 206 is implemented by an electrical connection. As another example of the present application, the first radiation patch 204 may be further fed by capacitive coupling, and thus, the first feeding hole 206 may not be electrically connected to the first radiation patch 204, and a thin dielectric layer may be interposed therebetween. Therefore, in this example, no blind via may be provided on the third dielectric layer 2014.
It should be noted that, in the practical application process, the present application provides an antenna package structure for connecting with a chip (radio frequency chip), that is, an external chip is disposed on the antenna package structure, and the chip is made of a different material from the antenna package structure, and the chip generates heat during operation, so that, in order to improve the reliability of the device, it is necessary to improve the mismatch problem between the antenna package structure and the external chip caused by mismatch of thermal expansion coefficients.
In addition, in order to facilitate electrical connection between the antenna package structure and an external chip, a plurality of first pads 208 may be further disposed on the lower surface of the wiring layer 203, and the first pads 208 are used for electrically connecting the chip and the wiring layer 203. In this way, the first radiation patch 204 located on the upper half of the antenna package structure can be electrically connected to the chip through the first feeding hole 206, the first reference ground layer on the wiring layer 203, the feeding line layer, the signal output layer, and the first pad 208. The second radiation patch 205 located at the upper part of the package antenna package structure can be electrically connected to the chip through the second feeding hole 207, the second reference ground layer on the wiring layer 203, the feeding line layer, and the signal output layer, and the first pad 08.
As an example, the first pad 208 may be a metal bump, a metal plate, or a metal solder ball.
In addition, in order to realize the electrical connection of the packaged antenna package structure with an external circuit, such as a PCB, a plurality of second pads 209 may be further disposed on the lower surface of the wiring layer 203, and the second pads 209 are used for the electrical connection with the external circuit. As an example, the second pad 209 may be a metal solder Ball, and may be a BGA (Ball grid array).
In addition, in order to improve the performance of the antenna package structure, a first solder mask layer 210 may be further disposed on the upper surface of the first chip 201, and the first solder mask layer 210 is provided with windows at different positions according to the electrical connection requirement.
A second solder resist layer 211 may also be provided on the lower surface of the wiring layer 203, the second solder resist layer 211 being provided with windows at different positions according to the electrical connection requirements.
The above is a specific implementation manner of the antenna packaging structure applied to the dual-band array antenna provided in the embodiment of the present application. The antenna packaging structure is an antenna packaging structure of a dual-frequency dual-polarization AIP antenna. Therefore, the antenna package structure includes two first and second radiation sheets serving as an antenna. In the antenna package structure, the cut-out window corresponding to the metal sheet of one feeding hole and the cut-out window allowing the other feeding hole to pass through are required to be cut out on one reference ground layer, the cut-out window corresponding to the metal sheet of the other feeding hole and the cut-out window corresponding to the metal sheet of the connecting blind hole are required to be cut out on the other reference ground layer, because the area of the feeding hole passing through or the area of the metal sheet of the connecting blind hole is usually smaller than the area of the metal sheet connecting the feeding hole, the cut-out area for the feeding hole passing through or the area of the metal sheet of the connecting blind hole is smaller than the cut-out area of the metal sheet connecting the feeding hole, therefore, compared with the prior art in which two feeding holes are both connected to the same reference ground layer (the cut-out windows corresponding to the metal sheets requiring the first feeding hole and the second feeding hole to be cut out on the same reference ground layer), the present application reduces the cut-out area of the same reference ground layer (including the first reference ground layer and the second reference ground layer), therefore, the capacitive coupling performance of the coupling capacitor formed by each radiating patch and the reference ground layer is better, and the reference ground layer with smaller area reduction amplitude can provide better reference ground signals for the antenna, so that the problem of poor interference shielding performance between the AiP antenna and the chip is improved, and the high-performance requirement of the antenna is met.
In addition, first core board 201 can be bonded respectively on the upper and lower surface of its first core board main part 2011 has the prepreg material to form through thermosetting, because of the prepreg material in thermosetting process, can the volume shrink, the shrink of this volume can produce certain stress to antenna packaging structure, and this stress is favorable to adjusting antenna packaging structure's the degree of warp to be favorable to antenna packaging structure's level and smooth, and then make antenna packaging structure satisfy the encapsulation requirement.
In addition, in the embodiment of the present application, the first feeding hole 206 and the second feeding hole 207 may be formed by using a mechanical drilling process, and the mechanical drilling process is not limited by the thickness of the layer structure to be drilled, so that the antenna package structure provided by the present application has a simpler manufacturing process, and overcomes the process difficulty of the conventional AiP antenna. Moreover, the antenna packaging structure shortens the processing process flow of the antenna packaging structure, and further shortens the processing period of the antenna packaging structure.
In addition, in the antenna packaging structure of the above specific implementation manner, the number of layers of the antenna packaging structure is effectively reduced, and the total thickness of the antenna packaging structure is controlled to be less than 930 μm, so that the thickness of the whole packaging structure of the antenna packaging structure and the chip can be controlled to be less than 1.2 mm.
As an example, the antenna package structure in the above specific implementation includes various layer structures, and the thickness and the function of the antenna package structure are shown in table 1.
TABLE 1
As can be seen from the thicknesses of the layers shown in table 1, the total thickness of the antenna package structure is 930 μm or less, and thus the total thickness of the package can be controlled to 1.2mm or less.
In the above specific implementation, the number of wiring layers of the antenna package structure is not limited to the number of layers shown in fig. 2, and the number of wiring layers of the antenna package structure may be adjusted according to the antenna performance and the routing requirement.
In addition, in the above specific implementation, the second metal sheet of the third opening window of the first reference ground layer to which the lower end of the first feeding hole 206 is connected is taken as an example, and the first metal sheet of the first opening window of the first reference ground layer to which the lower end of the second feeding hole 207 is connected is taken as an example. In fact, in the embodiment of the present application, the connection manner is not limited as long as the two feed holes are not simultaneously connected to the reference ground layer used as the antenna radiation. Therefore, the connection manner of the first feeding hole 206 and the second feeding hole 207 may be replaced with each other. As such, as another example of the present application, the lower end of the first feeding hole 206 may be connected to the first metal sheet of the first open window of the first reference ground layer, and the lower end of the second feeding hole 207 may be connected to the second metal sheet of the third open window of the second reference ground layer.
As an alternative embodiment of the present application, as shown in fig. 5, the antenna package structure provided in the above embodiment may further include a chip 501 disposed below the wiring layer 203, in addition to the antenna package structure 200, where the chip 501 is electrically connected to the wiring layer 203. When the first metal piece 208 is provided below the wiring layer 203, the chip 501 is electrically connected to the wiring layer through the first metal piece 208.
As an example, the chip 501 may be disposed below the wiring layer 203 by flip-chip.
It should be noted that, in the embodiment of the present application, the chip 501 may be a radio frequency chip, which may be disposed on the lower surface of the wiring layer 203 through a flip-chip process. The chip 501 is used for providing active excitation, and may specifically include adjusting the amplitude phase of the radio frequency signal.
The above is a specific implementation manner of the antenna packaging structure provided by the embodiment of the present application.
Claims (14)
1. The antenna packaging structure is characterized by comprising a first core board, a second core board and a wiring layer which are stacked from top to bottom in sequence;
a first radiation sheet is arranged on the upper surface of the first core plate; a second radiation sheet is arranged on the upper surface of the second core plate;
the antenna package structure further includes: a first feed hole penetrating the first core board and the second core board and a second feed hole penetrating the second core board; the first feed hole is used for feeding the first radiation piece, and the second feed hole is used for feeding the second radiation piece;
the wiring layers sequentially comprise a first reference grounding layer and a second reference grounding layer which are stacked and insulated from each other from top to bottom;
a first windowing and a second windowing which are mutually spaced are arranged on the first reference grounding layer, a first metal sheet is arranged in the first windowing, and a gap is formed between the edge of the first metal sheet and the edge of the first windowing;
a third opening window is arranged on the second reference grounding layer, and a second metal sheet is arranged in the third opening window; a gap is reserved between the edge of the second metal sheet and the edge of the third opening window;
and in the first feed hole and the second feed hole, the lower end of one feed hole is connected to the first metal sheet, and the lower end of the other feed hole passes through the second window and is connected to the second metal sheet.
2. The antenna package of claim 1, wherein the first core plate comprises a first core plate body;
a first dielectric layer on an upper surface of the first core body;
the second medium layer is positioned on the lower surface of the first core plate main body;
the first core plate main body is made of a completely cured film, and the first dielectric layer and the second dielectric layer are made of prepregs attached to the upper surface and the lower surface of the first core plate main body through a hot-pressing curing process.
3. The antenna package structure of claim 2, wherein the first core board further comprises a third dielectric layer disposed on an upper surface of the first dielectric layer; the third dielectric layer is made of a prepreg attached to the upper surface of the first dielectric layer through a hot-pressing curing process.
4. The antenna package structure of any one of claims 1-3, further comprising a suspended copper layer or a ground copper layer disposed around the first radiating patch on the upper surface of the first core board.
5. The antenna package structure of any one of claims 1-3, wherein a dielectric constant of a dielectric material used to fabricate the first core board is below 3.6.
6. The antenna package structure of any of claims 1-3, wherein the first core plate has a thickness of 360 μm or more.
7. The antenna package structure of any of claims 1-3, wherein a coefficient of thermal expansion of a dielectric material used to make the second core board is less than 6 ppm.
8. The antenna package structure of any one of claims 1-3, wherein a plurality of first pads are disposed on a lower surface of the wiring layer, the plurality of first pads being configured to electrically connect the wiring layer to a chip.
9. The antenna packaging structure according to any one of claims 1 to 3, wherein a plurality of second pads are further disposed on a lower surface of the wiring layer, and the second pads are used for electrically connecting the antenna packaging structure with an external circuit.
10. The antenna package structure of any one of claims 1-3, wherein the first feed hole and the second feed hole are both mechanical vias.
11. The antenna package structure of any one of claims 1-3, wherein a first solder mask layer is further disposed on the upper surface of the first core board, and the first solder mask layer is provided with windows at different positions according to electrical connection requirements.
12. The antenna package structure of any one of claims 1-3, wherein a second solder mask is further disposed on a lower surface of the wiring layer, the second solder mask being provided with windows at different locations according to electrical connection requirements.
13. The antenna package structure of any one of claims 1-3, further comprising a chip disposed below the wiring layer, the wiring layer being electrically connected to the chip.
14. The antenna packaging structure according to any one of claims 1 to 3, wherein a fourth open window is further disposed on the second reference ground layer and spaced from the third open window, a third metal sheet is disposed on the fourth open window, the third metal sheet is used to electrically connect a first blind hole, and the first blind hole is located in a dielectric layer between the first metal sheet and the second metal sheet and is used to electrically connect the first metal sheet and the third metal sheet.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2018/093081 WO2020000250A1 (en) | 2018-06-27 | 2018-06-27 | Antenna packaging structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111971852A CN111971852A (en) | 2020-11-20 |
| CN111971852B true CN111971852B (en) | 2022-01-14 |
Family
ID=68985565
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880092303.7A Active CN111971852B (en) | 2018-06-27 | 2018-06-27 | Antenna packaging structure |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN111971852B (en) |
| WO (1) | WO2020000250A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114464983A (en) * | 2022-01-11 | 2022-05-10 | 华为技术有限公司 | Package antenna substrate, preparation method thereof and electronic equipment |
| CN116885444B (en) * | 2023-09-06 | 2023-12-22 | 成都恪赛科技有限公司 | Chip phased array antenna structure |
| CN117559136B (en) * | 2024-01-12 | 2024-04-02 | 成都天锐星通科技有限公司 | Antenna terminal and electronic equipment |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102160235A (en) * | 2008-09-22 | 2011-08-17 | 凯瑟雷恩工厂两合公司 | Multilayer antenna arrangement |
| CN102332640A (en) * | 2010-07-09 | 2012-01-25 | 日立电线精密技术株式会社 | Electromagnetic coupler and information communication device including same |
| CN105932419A (en) * | 2016-07-01 | 2016-09-07 | 西安电子科技大学 | Multi-frequency band packaging antenna based on step type laminated structure |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1304766A4 (en) * | 2000-06-30 | 2009-05-13 | Sharp Kk | Radio communication device with integrated antenna, transmitter, and receiver |
| DE102004035064A1 (en) * | 2004-07-20 | 2006-02-16 | Receptec Gmbh | antenna module |
| US8648454B2 (en) * | 2012-02-14 | 2014-02-11 | International Business Machines Corporation | Wafer-scale package structures with integrated antennas |
| US9806422B2 (en) * | 2013-09-11 | 2017-10-31 | International Business Machines Corporation | Antenna-in-package structures with broadside and end-fire radiations |
| CN110611160B (en) * | 2016-01-30 | 2021-08-03 | 华为技术有限公司 | Patch antenna unit and antenna |
| CN107452720B (en) * | 2017-08-03 | 2020-04-17 | 华天科技（昆山）电子有限公司 | Chip fan-out packaging structure, multi-chip integrated module and wafer level packaging method |
-
2018
- 2018-06-27 WO PCT/CN2018/093081 patent/WO2020000250A1/en active Application Filing
- 2018-06-27 CN CN201880092303.7A patent/CN111971852B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102160235A (en) * | 2008-09-22 | 2011-08-17 | 凯瑟雷恩工厂两合公司 | Multilayer antenna arrangement |
| CN102332640A (en) * | 2010-07-09 | 2012-01-25 | 日立电线精密技术株式会社 | Electromagnetic coupler and information communication device including same |
| CN105932419A (en) * | 2016-07-01 | 2016-09-07 | 西安电子科技大学 | Multi-frequency band packaging antenna based on step type laminated structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111971852A (en) | 2020-11-20 |
| WO2020000250A1 (en) | 2020-01-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20230130259A1 (en) | Radio frequency device packages | |
| US9985346B2 (en) | Wireless communications package with integrated antennas and air cavity | |
| JP6964381B2 (en) | Wireless communication package with integrated antenna array | |
| US10431892B2 (en) | Antenna-in-package structures with broadside and end-fire radiations | |
| US9196951B2 (en) | Millimeter-wave radio frequency integrated circuit packages with integrated antennas | |
| US7808434B2 (en) | Systems and methods for integrated antennae structures in multilayer organic-based printed circuit devices | |
| US11637376B2 (en) | Antenna packaged substrate and manufacturing method thereof, packaged antenna, and terminal | |
| US11652272B2 (en) | Chip antenna | |
| US9331030B1 (en) | Integrated antenna package and manufacturing method thereof | |
| US9252474B2 (en) | Coupling arrangement | |
| KR20180089302A (en) | Radio frequency device packages and methods of formation thereof | |
| JP2020129790A (en) | Chip antenna and chip antenna module including the same | |
| US11211689B2 (en) | Chip antenna | |
| CN111971852B (en) | Antenna packaging structure | |
| US20140327490A1 (en) | Surface mount microwave system | |
| JP2017215197A (en) | Radio-frequency substrate | |
| US11251518B2 (en) | Chip antenna | |
| KR20200115413A (en) | Chip antenna module | |
| CN103367269A (en) | Separation mixed substrate for radio frequency application | |
| KR102163419B1 (en) | Chip antenna module | |
| WO2023134474A1 (en) | Antenna-in-package substrate and preparation method therefor, and electronic device | |
| KR20140002542A (en) | Antenna substrate | |
| CN112533358A (en) | High-frequency microwave multilayer circuit board and high-frequency microwave assembly | |
| JP2020174114A (en) | Multilayer circuit board | |
| CN114024134B (en) | LTCC packaging structure for communication antenna |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |