CN105932419A - Multi-frequency band packaging antenna based on step type laminated structure - Google Patents

Abstract

The invention provides a multi-frequency band packaging antenna based on a step type laminated structure. The multi-frequency band packaging antenna is used for solving the technical problem that the number of the working frequency bands of the existing packaging antenna is insufficient. An upper layer radiation unit is printed on the upper surface of an upper layer dielectric substrate; a middle layer radiation unit is printed on the upper surface of a middle layer dielectric substrate; a lower layer radiation unit is printed on the upper surface of a lower layer dielectric substrate; an internal earth plate is printed on the lower surface of the lower layer dielectric substrate; the three layers of dielectric substrates and the three layers of radiation units are progressively increased in size from top to bottom and form the laminated structure; a packaging body is arranged under the laminated structure; a multi-layer assembly is arranged in the cavity at the center position of the packaging body; an external earth plate is arranged under the multi-layer assembly; metalized via holes are arranged on the three layers of dielectric substrates and the packaging body, thereby forming a coaxial feeder line; and power is directly fed to the upper layer radiation unit by the coaxial feeder line. The multi-band packaging antenna is good in independent frequency adjustability and can be used for wireless communication of three frequency bands.

Description

Multiband encapsulating antenna based on notch cuttype stepped construction

Technical field

The invention belongs to microwave and millimeter wave communication technical field, relate to multi-chip module encapsulation technology and microstrip antenna Technology, is specifically related to a kind of multiband encapsulating antenna based on notch cuttype stepped construction, can be used for IEEE 802.11 With wireless in 2.4GHz frequency range, 3.5GHz frequency range and 5.8GHz frequency range under IEEE 802.16 wireless protocols Communication.

Background technology

Along with modern wireless communication systems developing rapidly worldwide, the diversification of radio communication service promotees Make to work in the appearance of different frequency range communication system.Particularly WLAN wireless local area network technology and WiMAX The fast development of Worldwide Interoperability for Microwave interconnection access technology, the most progressively replaces old-fashioned coaxial cable and twisted-pair feeder is constituted Computer local network.Such that it is able to make user accomplish, information is changed with oneself, and not by time and geographical position Under the influence of putting, enjoy Internet resources fully.

Encapsulating antenna is adapted for carrying out the miniaturization of diectric antenna, by integration packaging cavity in antenna system, Use System-in-Package technology integrated multifunction chip assembly and conventional components and parts, it is achieved the multiple merit such as radio-frequency receiving-transmitting Energy.Stacked microstrip antenna technology is because it is in the motility of integrated multi-layer configuration aspects, and makes with encapsulating antenna Technique has the strongest compatibility, and the realization for encapsulating antenna technology provides a great convenience.

Multiband aerial is owing to can cover multiple communications band simultaneously, such that it is able to efficiently reduce shared by system Volume, and the manufacturing cost of whole system can be reduced, therefore create the very big demand to multiband aerial.With Time in order to avoid there is intercoupling and dry between multiple antenna being operated in different frequency range in a system The impact disturbed, designs the single high performance antenna that can simultaneously cover multiple wireless communication system frequency range and has become as The hot subject of Chinese scholars research recently.

Communication antenna realizes the mode of multiband work mainly to be had:

1, the method for designing of many minor matters is used；

2, multiple-layered patches Stack Technology is used；

3, slot-coupled technology is utilized；

4, the method using broadband trap.

It is most frequently with the method for designing of many minor matters and multiple-layered patches Stack Technology at present to realize multiband, but racemosus The multiband aerial of the method for designing design of joint, because volume is relatively big, limits its range of application.And multiple-layered patches The antenna of Stack Technology design by printing various sizes of radiating element on multilayer dielectric substrate surface, under Side arranges earth plate and cambium layer stack structure, and utilizes coaxial feeder to feed radiating element, it is possible to achieve Multiple band operation, and designed antenna volume is less, is more beneficial for the system in package of chip.But On the premise of meeting miniature antenna, owing to multiple-layered patches Stack Technology causes each radiating element electromagnetic coupled Challenge, the current double-deck radiating element of more uses stacks in order to realize two-band communication.

Such as, Chinese patent application, Authorization Notice No. is CN 103066385B, entitled " for system-level The LTCC Two--Layer Microstrip Antenna of encapsulation " patent of invention, disclose a kind of double-deck encapsulating antenna, including antenna Cover layer, upper strata rectangular radiation element, intermediate course, lower floor's rectangular radiation element, antenna substrate layer, inside Earth plate, packaging body and external ground plate, its use coaxial feeder to lower floor's rectangular radiation element direct feed, Upper strata rectangular radiation element is carried out the mode of electromagnetic coupled feed, makes the double-deck radiating element can be two frequencies Scope works, but owing to the two frequency range is mutually adjacent, it is impossible to realize the radio communication in other frequency ranges Agreement, thus greatly limit its range.

Summary of the invention

It is an object of the invention to the defect overcoming above-mentioned prior art to exist, it is proposed that a kind of based on notch cuttype layer The multiband encapsulating antenna of stack structure, each layer radiating element is relatively independent works in different frequency scope, is used for solving The certainly technical problem of existing encapsulating antenna working frequency range lazy weight.

For achieving the above object, the technical scheme that the present invention takes is:

A kind of multiband encapsulating antenna based on notch cuttype stepped construction, including radiating element, medium substrate, interior Portion's earth plate, external ground plate, packaging body and coaxial feeder；Radiating element include upper strata radiating element 1, in Layer radiating element 3 and lower floor's radiating element 5, medium substrate includes upper layer medium substrate 2, middle level medium substrate 4 and layer dielectric substrate 6；The upper surface of upper layer medium substrate 2 is printed with upper strata radiating element 1, and middle level is situated between The upper surface of matter substrate 4 prints the middle level radiating element 3 with the first perforate 31, layer dielectric substrate 6 Upper surface prints the lower floor's radiating element 5 with the second perforate 51, and its lower surface is printed with the 3rd perforate 71 Inner ground plate 7, these three layers of medium substrates 2,4,6 form the stepped construction that is arranged in order from top to bottom； Being provided with packaging body 8 below stepped construction, the center of this packaging body 8 is provided with cavity, cavity surrounding It is provided with multiple fifth metal through hole 82；Multi-chip module 10 it is provided with, this multi-chip module 10 in cavity Lower section be provided with the external ground plate 9 of the 4th perforate 91；Upper layer medium substrate 2 is provided with the first metal Changing through hole 21, middle level medium substrate 4 is provided with the second plated-through hole 41, and layer dielectric substrate 6 is provided with 3rd plated-through hole 61, packaging body 8 is provided with the 4th plated-through hole 81, these four plated-through holes 21, 41,61,81 are sequentially connected into coaxial feeder, this coaxial feeder through external ground plate 9, inner ground plate 7, Lower floor's radiating element 5 and middle level radiating element 3, to upper strata radiating element 1 direct feed.

Above-mentioned multiband encapsulating antenna based on notch cuttype stepped construction, the first plated-through hole 21, second Plated-through hole the 41, the 3rd plated-through hole the 61, the 4th plated-through hole the 81, first perforate 31, second open The central point of hole the 51, the 3rd perforate 71 and the 4th perforate 91 is longitudinally-aligned.

Above-mentioned multiband encapsulating antenna based on notch cuttype stepped construction, the first plated-through hole 21, second Plated-through hole the 41, the 3rd plated-through hole 61 is identical with the radius of the 4th plated-through hole 81；First opens Hole 31 is identical with the radius of the second perforate 51；3rd perforate 71 is identical with the radius of the 4th perforate 91.

Above-mentioned multiband encapsulating antenna based on notch cuttype stepped construction, upper layer medium substrate 2, middle level medium Substrate 4, layer dielectric substrate 6 and packaging body 8 all use cross section to be the sheet material of rectangle, upper strata radiating element 1, middle level radiating element 3, lower floor's radiating element 5 and inner ground plate 7 all use rectangular metal paster, and Upper layer medium substrate 2 is identical with the length of side of middle level radiating element 3, middle level medium substrate 4 and lower floor's radiating element The length of side of 5 is identical, and layer dielectric substrate 6 is identical with the length of side of inner ground plate 7.

Above-mentioned multiband encapsulating antenna based on notch cuttype stepped construction, upper strata radiating element 1, middle level radiation Unit 3 and lower floor's radiating element 5, the length and width of these three radiating elements 1,3,5 is incremented by successively, its Concrete size is calculated by equation below:

$W=\frac{c}{2f_0}{\left(\frac{{\mathrm{\ϵ}}_r+1}{2}\right)}^{-\frac{1}{2}}$

$L=\frac{c}{2f_0}\frac{1}{\sqrt{{\mathrm{\ϵ}}_e}}-0.824h\frac{({\mathrm{\ϵ}}_e+0.3)(\frac{W}{h}+0.264)}{({\mathrm{\ϵ}}_e-0.258)(\frac{W}{h}+0.8)}$

${\mathrm{\ϵ}}_e=\frac{{\mathrm{\ϵ}}_r+1}{2}+\frac{{\mathrm{\ϵ}}_r-1}{2}{(1+12\frac{h}{W})}^{-\frac{1}{2}}$

Wherein, L represents the length of radiating element, and W represents the width of radiating element, ε_eRepresent effective dielectric Constant, c represents the light velocity in vacuum, f₀Represent the mid frequency of radiating element work, ε_rRepresent medium Relative dielectric constant, h represents the thickness of medium substrate.

Above-mentioned multiband encapsulating antenna based on notch cuttype stepped construction, the central axis of coaxial feeder relative to Upper strata radiating element 1, middle level radiating element 3 and lower floor's radiating element 5 are relatively transverse summit, same direction Coordinate, is calculated by equation below:

$X_f=\frac{L}{2}-\frac{L}{2\sqrt{(\frac{{\mathrm{\ϵ}}_r+1}{2}+\frac{{\mathrm{\ϵ}}_r-1}{2}{\left(1+12\frac{h}{L}\right)}^{-\frac{1}{2}})}}$

$Y_f=\frac{W}{2}$

Wherein, (X_f,Y_f) represent the relative coordinate of central axis of radiating element correspondence coaxial feeder.

The present invention compared with prior art, has the advantage that

1, present invention employs the three-layer metal paster of vertical stacking as radiating element, and shape is rectangle The length and width of upper strata radiating element, middle level radiating element and lower floor's radiating element be incremented by successively so that spoke Penetrate unit to work at different frequency, also by using the stacked medium substrate of notch cuttype so that encapsulating antenna Remain to normally work in each frequency range in the case of overall structure is constant, with prior art in use single The mode that the medium substrate of size couples in same frequency range with double-deck rectangular radiation element is compared, and is more beneficial for radiation The outside radiated electromagnetic energy of radiating slot around unit, and encapsulating antenna can be carried out three frequency ranges simultaneously Radio communication.

2, present invention employs the coaxial feeder mode directly to top layer radiating element feed, and at last layer spoke When penetrating the outside radiated electromagnetic energy of unit, next layer of radiating element becomes its equivalence earth plate so that encapsulating antenna Each layer radiating element keep to a certain extent in relative independentability, with prior art use coaxial feeder straight The mode to bottom radiating element feed that connects is compared, and efficiently avoid the mutual shadow between different layers radiating element Ring, enhance the independent adjustability of its frequency.

Accompanying drawing explanation

Fig. 1 is that the overall structure of the present invention launches schematic diagram；

Fig. 2 is the structural representation of three radiating elements of the present invention；

Fig. 3 is the structural representation of three medium substrates of the present invention；

Fig. 4 is the integrally-built top view of the present invention；

Fig. 5 is inner ground plate of the present invention and the structural representation of external ground plate；

Fig. 6 is the structural representation of packaging body of the present invention and multi-chip module；

Fig. 7 is mid frequency and the reflection loss S of the present invention₁₁Analogous diagram；

Fig. 8 is that the present invention is in the E face of three frequency ranges and the gain pattern in H face.

Detailed description of the invention

Below in conjunction with the drawings and specific embodiments, the present invention is made into a description.

With reference to Fig. 1, the present invention includes, upper strata radiating element 1, upper layer medium substrate 2, middle level radiating element 3, Middle level medium substrate 4, lower floor's radiating element 5, layer dielectric substrate 6, inner ground plate 7, packaging body 8, External ground plate 9, multi-chip module 10；The upper layer medium substrate 2 that thickness is H1=2.418mm is provided with First plated-through hole 21, and surface is printed with upper strata radiating element 1 thereon, is H2=2.232mm at thickness Middle level medium substrate 4 be provided with the second plated-through hole 41, and surface is printed with the first perforate thereon The middle level radiating element 3 of 31, is provided with the 3rd metal on the layer dielectric substrate 6 that thickness is H3=2.046mm Change through hole 61, and the lower floor's radiating element 5 with the second perforate 51 is printed on surface thereon, at its lower surface Print the inner ground plate 7 with the 3rd perforate 71, the packaging body 8 that thickness is H4=0.93mm is provided with 4th plated-through hole 81, and heart position is provided with cavity wherein, and cavity surrounding is provided with the multiple 5th Plated-through hole 82, is provided with multi-chip module 10 in cavity, is provided with below multi-chip module 10 The external ground plate 9 of four perforates 91.The first plated-through hole 21 in upper layer medium substrate 2, middle level medium The second plated-through hole 41 on substrate 4, the 3rd plated-through hole 61 on layer dielectric substrate 6 and encapsulation The 4th plated-through hole 81 on body 8 is sequentially connected into coaxial feeder, and through external ground plate 9, inside Earth plate 7, lower floor's radiating element 5 and middle level radiating element 3, by upper strata radiating element 1 and external signal phase Connect.

With reference to Fig. 2, upper strata radiating element 1 and middle level radiating element 3 and lower floor's radiating element 5 all use rectangle Metal patch, the W1=13.92mm of upper strata radiating element 1 width, length L1=9.55mm, middle level radiates The width W2=24.04mm of unit 3, length L2=15.81mm, the width of lower floor's radiating element 5 W3=31.74mm, length L3=23.38mm；The radius of the first perforate 31 and the second perforate 51 is 0.6mm.

With reference to Fig. 3, upper layer medium substrate 2, middle level medium substrate 4, layer dielectric substrate 6 all use cross section For the sheet material of rectangle, the width W2=24.04mm of upper layer medium substrate 2, length L2=15.81mm, middle level The width W3=31.74mm of medium substrate 4, length L3=23.38mm, the length of layer dielectric substrate 6 is a width of Lg=38mm；First plated-through hole the 21, second plated-through hole 41 and the half of the 3rd plated-through hole 61 Footpath is 0.45mm.

With reference to Fig. 4, the central axis of coaxial feeder and the nearest border of upper strata radiating element 1 and time nearest border Distance be respectively Xf1=2.535mm and Yf1=6.96mm, with the nearest border of middle level radiating element 3 with time Recently the distance on border is respectively Xf2=4.355mm and Yf2=12.02mm, with lower floor radiating element 5 Proximal border is respectively Xf3=6.17mm and Yf3=15.87mm with time distance on nearest border.

With reference to Fig. 5, the length and width of inner ground plate 7 and external ground plate 9 are Lg=38mm, inner ground plate On 7, the radius of the 3rd perforate 71 is 1.5mm, itself and the nearest border of inner ground plate 7 and time nearest border Distance be respectively L7=13.48mm and L8=19mm；On external ground plate 9, the radius of the 4th perforate 91 is 1.5mm, it is respectively L7=13.48mm with the nearest border of external ground plate 9 with time distance on nearest border And L8=19mm.

With reference to Fig. 6, the length and width of packaging body 8 are Lp=20mm, and the cavity length that its center is arranged is a width of Lc=8mm, is provided with multi-chip module 10 in cavity, the 4th plated-through hole 81 on packaging body 8 Radius is 0.6mm, is additionally provided with and leads to by multiple fifth metalization being vertically spaced substantially equidistant of dead square distribution Hole 82, radius is 0.15mm, pitch of holes 0.736mm.

Upper strata radiating element 1, middle level radiating element 3, lower floor's radiating element 5, inner ground plate 7 and outside connect Floor 9 all uses silver metallic film to print；Upper layer medium substrate 2, middle level medium substrate 4, layer dielectric Substrate 6 and packaging body 8 all use dielectric constant to be 5.9, and Dielectric loss tangent is 0.2%, and thickness in monolayer is The Ferro A6M low-temperature co-burning ceramic material of 0.093mm is made；First plated-through hole the 21, second metal Change through hole the 41, the 3rd plated-through hole the 61, the 4th plated-through hole 81 and fifth metal through hole 82 is the most logical Cross the silver metal material row of fill in hole.

Effect of the present invention can be further illustrated by following emulation:

1, emulation content

Use the three-dimensional full-wave electromagnetic field simulation software HFSS_15.0 reflection coefficient S to the present invention₁₁With radiation side To emulating, its result is as shown in Figure 7 and Figure 8.

2, simulation result

With reference to Fig. 7, the resonance point of three layers of microstrip antenna is respectively 2.445GHz, 3.505GHz and 5.770GHz, Its reflection coefficient be respectively-32.79dB ,-16.39dB and-20.09dB, 2.41GHz-2.48GHz, 3.47HGz-3.55GHz with the reflection coefficient in 5.66GHz-5.89GHz frequency range is respectively less than-10dB.Imitative True result illustrates, the multiband encapsulating antenna based on notch cuttype stepped construction invented can exist simultaneously 2.4GHz frequency range, 3.5GHz frequency range and 5.8GHz band operation.

With reference to Fig. 8, three layers of microstrip antenna maximum when each band operation, on E face and H surface radiation direction Gain is respectively 4.91dBi, 6.05dBi and 6.07dBi.Simulation result illustrates, invented based on ladder The multiband encapsulating antenna of type stepped construction all has in 2.4GHz frequency range, 3.5GHz frequency range and 5.8GHz frequency range There is bigger gain.

As can be seen here, present invention uses three layers of radiating element vertical cartel and the stacked medium substrate of notch cuttype Structure solves the encapsulating antenna problem at wireless communication protocol Mid Frequency lazy weight.

Above description is only example of the present invention, does not constitute any limitation of the invention.Should manage Solve, for professional and technical personnel in the field, after understanding present invention and principle, all may be not In the case of deviating from the principle of the invention, structure, according to the above description form, details and parameter etc. are improved Or conversion, and all these modifications and variations all should belong to the protection domain of claims of the present invention.

Claims (6)

1. a multiband encapsulating antenna based on notch cuttype stepped construction, including radiating element, medium substrate, Inner ground plate, external ground plate, packaging body and coaxial feeder；It is characterized in that, described radiating element includes Upper strata radiating element (1), middle level radiating element (3) and lower floor's radiating element (5), described medium substrate bag Include upper layer medium substrate (2), middle level medium substrate (4) and layer dielectric substrate (6)；Described top dielectric The upper surface of substrate (2) is printed with upper strata radiating element (1), the upper surface in described middle level medium substrate (4) Print the middle level radiating element (3) with the first perforate (31), the upper table of described layer dielectric substrate (6) The lower floor's radiating element (5) with the second perforate (51) is printed in face, and its lower surface is printed with the 3rd perforate (71) Inner ground plate (7), these three layers of medium substrates (2,4,6) form the stacking being arranged in order from top to bottom Structure；Being provided with packaging body (8) below stepped construction, the center of this packaging body (8) arranges free Chamber, cavity surrounding is provided with multiple fifth metal through hole (82)；It is provided with multi-chip module in described cavity (10), the lower section of this multi-chip module (10) is provided with the external ground plate (9) of the 4th perforate (91)； Described upper layer medium substrate (2) is provided with the first plated-through hole (21), described middle level medium substrate (4) Being provided with the second plated-through hole (41), described layer dielectric substrate (6) is provided with the 3rd plated-through hole (61), Described packaging body (8) is provided with the 4th plated-through hole (81), these four plated-through holes (21,41,61, 81) be sequentially connected into coaxial feeder, this coaxial feeder through external ground plate (9), inner ground plate (7), Lower floor's radiating element (5) and middle level radiating element (3), to upper strata radiating element (1) direct feed.

Multiband encapsulating antenna based on notch cuttype stepped construction the most according to claim 1, its feature Be, described first plated-through hole (21), the second plated-through hole (41), the 3rd plated-through hole (61), 4th plated-through hole (81), the first perforate (31), the second perforate (51), the 3rd perforate (71) and The central point of four perforates (91) is longitudinally-aligned.

Multiband encapsulating antenna based on notch cuttype stepped construction the most according to claim 1, its feature It is, described first plated-through hole (21), the second plated-through hole (41), the 3rd plated-through hole (61) Identical with the radius of the 4th plated-through hole (81)；First perforate (31) and the radius of the second perforate (51) Identical；3rd perforate (71) is identical with the radius of the 4th perforate (91).

Multiband encapsulating antenna based on notch cuttype stepped construction the most according to claim 1, its feature It is, described upper layer medium substrate (2), middle level medium substrate (4), layer dielectric substrate (6) and encapsulation Body (8) all uses cross section to be the sheet material of rectangle, described upper strata radiating element (1), middle level radiating element (3), Lower floor's radiating element (5) and inner ground plate (7) all use rectangular metal paster, and upper layer medium substrate (2) Identical with the length of side of middle level radiating element (3), middle level medium substrate (4) and lower floor's radiating element (5) The length of side is identical, and layer dielectric substrate (6) is identical with the length of side of inner ground plate (7).

Multiband encapsulating antenna based on notch cuttype stepped construction the most according to claim 1, its feature Being, described upper strata radiating element (1), middle level radiating element (3) and lower floor's radiating element (5), these are three years old The length and width of individual radiating element (1,3,5) is incremented by successively, and its concrete size is calculated by equation below:

$W=\frac{c}{2f_0}{\left(\frac{{\mathrm{\ϵ}}_r+1}{2}\right)}^{-\frac{1}{2}}$

$L=\frac{c}{2f_0}\frac{1}{\sqrt{{\mathrm{\ϵ}}_e}}-0.824h\frac{({\mathrm{\ϵ}}_e+0.3)(\frac{W}{h}+0.264)}{({\mathrm{\ϵ}}_e-0.258)(\frac{W}{h}+0.8)}$

${\mathrm{\ϵ}}_e=\frac{{\mathrm{\ϵ}}_r+1}{2}+\frac{{\mathrm{\ϵ}}_r-1}{2}{(1+12\frac{h}{W})}^{-\frac{1}{2}}$

Wherein, L represents the length of radiating element, and W represents the width of radiating element, ε_eRepresent effective dielectric Constant, c represents the light velocity in vacuum, f₀Represent the mid frequency of radiating element work, ε_rRepresent medium Relative dielectric constant, h represents the thickness of medium substrate.

Multiband encapsulating antenna based on notch cuttype stepped construction the most according to claim 1, its feature Being, the central axis of described coaxial feeder is relative to upper strata radiating element (1), middle level radiating element (3) With lower floor's radiating element (5) at the relatively transverse coordinate on summit, same direction, calculated by equation below:

$X_f=\frac{L}{2}-\frac{L}{2\sqrt{(\frac{{\mathrm{\ϵ}}_r+1}{2}+\frac{{\mathrm{\ϵ}}_r-1}{2}{\left(1+12\frac{h}{L}\right)}^{-\frac{1}{2}})}}$

$Y_f=\frac{W}{2}$

Wherein, (X_f,Y_f) represent the relative coordinate of central axis of radiating element correspondence coaxial feeder.