CN220693110U - Small-size variable frequency subassembly based on SCX frequency channel - Google Patents

Small-size variable frequency subassembly based on SCX frequency channel Download PDF

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Publication number
CN220693110U
CN220693110U CN202321968944.9U CN202321968944U CN220693110U CN 220693110 U CN220693110 U CN 220693110U CN 202321968944 U CN202321968944 U CN 202321968944U CN 220693110 U CN220693110 U CN 220693110U
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radio frequency
frequency
connector
assembly
layer
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王驰
刘德喜
祝大龙
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Beijing Research Institute of Telemetry
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Beijing Research Institute of Telemetry
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D30/00—Reducing energy consumption in communication networks
    • Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks

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Abstract

The utility model provides a small-sized variable frequency component based on an SCX frequency band, which comprises a first radio frequency layer and a second frequency comprehensive layer which are detachably connected in sequence from top to bottom, wherein the first radio frequency layer and the second frequency comprehensive layer are interconnected through a connector. The utility model is interconnected with devices in another structure body through the microstrip line and the connector, so that signals can be transmitted among surface-mounted devices with various functions, and the transmission of the signals in a double-layer structure is realized; microstrip lines with different widths are adopted for matching, and the transmission loss of 40mm is tested to be less than 5dB; the radio frequency assembly and the frequency assembly are respectively manufactured into modules, so that the assembly efficiency is improved; because the radio frequency device adopts a hermetic package form, the whole structure adopts a non-hermetic design, and a standard SMP interface is used for connecting with an external radio frequency front-end component; the technical scheme has compact and small structure and strong reliability, and can provide large-scale, large-batch and high-reliability system products.

Description

Small-size variable frequency subassembly based on SCX frequency channel
Technical Field
The utility model relates to the technical field of electrical elements, in particular to a small-sized frequency conversion assembly based on an SCX frequency band.
Background
With the continuous development of electronic information technology, the requirements of broadband, miniaturization and generalization have gradually become the development trend of novel frequency conversion transceiver components. The novel connecting method is endless, and a generalized simple and reliable assembly-level connecting mode can greatly reduce the time required by design and improve the design efficiency.
In the microwave field, SCX devices are mainly bare chips, and in the traditional design, the bare chips are packaged with gold boxes, and the radio frequency interconnection of a printed board is realized by adopting a glass bead welding mode. The soft substrate RT/duroid5880 is often used as a welding carrier for assembling a set of bare chips, and the basic steps comprise conductive adhesive pasting, ultrasonic cleaning, grooving, eutectic welding, gold wire bonding, sintering of glass beads and the like, so that high requirements are placed on raw materials, equipment cost and personnel investment.
Therefore, a frequency conversion module is needed that can achieve less insertion loss, good flatness, and improved assembly efficiency.
Disclosure of Invention
The utility model aims to solve the problems of low assembly efficiency and large insertion loss of a variable frequency component, and provides a small variable frequency component based on an SCX frequency band, which is interconnected with devices in another structure body through a microstrip line and a connector, so that signals can be transmitted among surface-mounted devices with various functions, and the transmission of the signals in a double-layer structure is realized; in order to reduce the insertion loss of the design, microstrip lines with different widths are adopted for matching, and the transmission loss of 40mm is tested to be less than 5dB; the novel BGA packaging devices with different functions are welded on the printed board in the form of ball implantation to connect the radio frequency component and the substrate, so that the isolation degree is improved, and signal crosstalk is avoided; the radio frequency assembly and the frequency assembly are respectively manufactured into modules, so that the assembly efficiency is improved; because the BGA radio frequency device adopts a hermetic package mode, the whole structure adopts a non-hermetic design, and a standard SMP interface is used for connecting with an external radio frequency front-end component; the technical scheme has compact and small structure and strong reliability, and the development time of the frequency conversion assembly can be reduced by adopting the design, so that a powerful guarantee is provided for large-scale, large-batch and high-reliability system product delivery.
The utility model provides a small-sized frequency conversion assembly based on an SCX frequency band, which comprises a first radio frequency layer and a second frequency comprehensive layer which are detachably connected in sequence from top to bottom, wherein the first radio frequency layer and the second frequency comprehensive layer are interconnected through a connector;
the first radio frequency layer comprises a first shell, a first upper cover plate and a first lower cover plate which are respectively and detachably connected to the upper part and the lower part of the first shell, a first radio frequency layer module connected in the first shell and a first connector connected with the first radio frequency layer module, a substrate of the first radio frequency layer module is positioned at the top of the first shell, and the first connector is connected in the first shell;
the second frequency heald layer comprises a second shell, a second upper cover plate and a second lower cover plate which are respectively and detachably connected to the upper part and the lower part of the second shell, a second frequency heald layer module connected in the second shell and a second connector connected with the second frequency heald layer module, a substrate of the second frequency heald layer module is positioned at the bottom of the second shell, and the second connector is connected in the second shell;
the first shell and the second shell are identical in length and width and are detachably connected, the first lower cover plate and the second upper cover plate are of a planar structure which is detachably connected, and the first connector and the second connector are in opposite-plug connection to enable the first radio frequency layer module and the second frequency comprehensive layer module to be connected.
According to the small-sized frequency conversion assembly based on the SCX frequency band, as an optimal mode, a cavity for placing a first radio frequency layer module is arranged in the first shell;
the first upper cover plate and the first lower cover plate are connected with the first shell through screws;
the first radio frequency layer module comprises a first substrate fixedly connected to the top of the first shell, a BGA ball-embedded ball, a first radio frequency layer assembly and a first microstrip line, wherein the BGA ball-embedded ball and the first radio frequency layer assembly are sequentially connected to the bottom of the first substrate, and the first microstrip line is connected with the first radio frequency layer assembly and the first connector.
According to the small-sized frequency conversion assembly based on the SCX frequency band, as an optimal mode, the first radio frequency layer assembly comprises a frequency mixing assembly, an amplifying assembly and a filtering assembly which are connected with each other, and the frequency mixing assembly, the amplifying assembly and the filtering assembly are connected with the first substrate through BGA (ball grid array) balls;
the first connector comprises a first radio frequency signal connector and a first video signal connector, the number of the first radio frequency signal connector and the number of the first video signal connector are at least two, the number of the cavities is at least two, the frequency mixing component is connected with the first radio frequency signal connector through a first microstrip line, and the frequency mixing component, the amplifying component and the filtering component are all connected with the first video signal connector through first microstrip lines, and the first microstrip line connected with the first radio frequency signal connector comprises at least two widths.
According to the small-sized frequency conversion assembly based on the SCX frequency band, as a preferable mode, a microstrip line groove is formed in a first substrate, one side of the first substrate extends to the tail end of a first connector and is provided with a boss at a connecting position, the first substrate is a substrate laminated by TSM-DS3M and FR-28-0040-50S, and the first substrate is connected with a first shell through bonding by screws or conductive adhesive;
the first radio frequency layer assembly is encapsulated with AlN, and the first radio frequency layer assembly is further provided with a filter, a switch and a grounding through hole.
According to the small-sized frequency conversion assembly based on the SCX frequency band, as an optimal mode, the first radio frequency layer further comprises a power supply control circuit connected to the upper portion of the first substrate, and the power supply control circuit is interconnected with the first radio frequency signal connector and the first video signal connector through the first microstrip line.
According to the small-sized frequency conversion assembly based on the SCX frequency band, as an optimal mode, a cavity for placing a second frequency comprehensive layer module is arranged in the second shell;
the second upper cover plate and the second lower cover plate are connected with the second shell through screws;
the second frequency comprehensive layer module comprises a second base plate fixedly connected to the bottom of the second shell, a second frequency comprehensive layer assembly connected to the top of the second base plate, and a second microstrip line connected with the second frequency comprehensive layer assembly and the second connector.
The utility model relates to a small-sized frequency conversion assembly based on an SCX frequency band, which is characterized in that a second frequency synthesis assembly comprises a power division network and an amplifying assembly which are connected with each other, wherein the power division network and the amplifying assembly are welded on a second substrate;
the second connector comprises a second radio frequency signal connector and a second video signal connector, the number of the second radio frequency signal connector and the second video signal connector is at least two, the number of the cavities is at least two, the amplifying component is connected with the second radio frequency signal connector through a second microstrip line, the power distribution network and the amplifying component are connected with the second video signal connector through a second microstrip line, and the second microstrip line connected with the second radio frequency signal connector comprises at least two widths.
According to the small-sized frequency conversion assembly based on the SCX frequency band, as an optimal mode, a filter, a switch and a grounding through hole can be further arranged in the second frequency synthesis layer assembly.
According to the small-sized frequency conversion assembly based on the SCX frequency band, as a preferable mode, a microstrip line groove is formed in a second substrate, one side of the second substrate extends to the tail end of a second connector and is provided with a boss at the joint, the second substrate is a substrate laminated by TSM-DS3M and FR-28-0040-50S, and the second substrate is connected with a second shell through bonding by screws or conductive adhesive;
the second radio frequency signal connector is an SMP-KK connector, and the second video signal connector is a JMC-KK video connector.
According to the small-sized variable frequency component based on the SCX frequency band, as an optimal mode, the first radio frequency layer module and the second frequency comprehensive layer module are arranged in a staggered mode in the vertical direction.
The technical solution to be solved by the utility model is as follows: an internal interconnection scheme of a 2-12GHz frequency band variable frequency component is provided. The small insertion loss, the good flatness and the improvement of the assembly efficiency are realized. The design can greatly reduce the design time and improve the stability of the product.
The utility model provides a high-integration SIP, which has the characteristics of modularized functions and easy disassembly and repair, integrates a radio frequency link in the SIP, and uses a common substrate for connection. In the production and processing, the modularized product is used as a surface-mounted device and is welded on a printed board in a Ball Grid Array (BGA) ball-mounting mode.
The substrate is laminated with TSM-DS3-M and FR-28-0040-50S, and various blind holes and through holes are used for signal transmission and shielding. In order to ensure good welding of BGA in the design, the distance from the edge of each signal hole to the outside window is 0.4mm, and the ground holes are plated with a flat technology for all grounding, so that the phenomenon of pad enlargement after mounting is avoided. In the design, the BGA needs to transmit radio frequency signals, so that welding spots around the BGA transmitting broadband radio frequency signals are eliminated, and the insertion loss is reduced. The printed board is adhered to the inside of the SIP shell through the conductive adhesive during welding, the chip is adhered and bonded through gold wires, and the cover plate is subjected to parallel seal welding after the test is finished, so that various temperature gradients are adopted in the whole design, and the problem that soldering tin is dissolved during welding and assembling is avoided. High-lead ball implantation is adopted, the peak temperature of ball implantation reflow soldering is 210 ℃ and the duration is 30-40 s, and then solder paste soldering at 183 ℃ is used for soldering the device to a motherboard. And respectively installing masters with different functions on the upper and lower box bodies in a screw fixing mode, welding SMP (M) -JYD15-S on the structure, and screwing the upper and lower cover plates on the upper and lower box bodies. And the printed boards in two different structures are subjected to radio frequency interconnection according to requirements by adopting an SMP-KK351 direct opposite insertion mode.
The utility model has the following advantages:
(1) The technical scheme realizes the transmission of signals in a double-layer structure, and the signals can be transmitted between surface-mounted devices with various functions by interconnecting one structure body with devices in the other structure body through the microstrip line and the connector; in order to reduce the insertion loss of the design, microstrip lines with different widths are adopted for matching, and the transmission loss of 40mm is tested to be less than 5dB;
(2) In the technical scheme, novel BGA packaging devices with different functions are welded on a printed board in a ball-planting mode to connect a radio frequency assembly and a substrate, so that isolation is improved, and signal crosstalk is avoided; the radio frequency assembly and the frequency assembly are respectively manufactured into modules, so that the assembly efficiency is improved.
(3) Since the BGA radio frequency device is in the form of a hermetic package, the overall structure is of a non-hermetic design, using a standard SMP interface for connection with the external radio frequency front-end component.
(4) The technical scheme has compact and small structure and strong reliability, and the development time of the frequency conversion assembly can be reduced by adopting the design, so that a powerful guarantee is provided for large-scale, large-batch and high-reliability system product delivery.
Drawings
FIG. 1 is a schematic diagram of a first RF layer structure of a small-sized variable frequency module based on SCX frequency band before being assembled with a second frequency synthesis layer;
FIG. 2 is a schematic diagram of a small-sized frequency conversion component based on SCX frequency band;
FIG. 3 is a bottom view of a first RF layer of a small-scale variable frequency module based on the SCX band;
FIG. 4 is a schematic diagram of a second frequency synthesizer of a small-sized frequency conversion module based on SCX frequency band;
fig. 5 is a schematic structural diagram of a first rf signal connector and a second rf signal connector of a small-sized frequency conversion assembly based on SCX frequency band.
Reference numerals:
1. a first radio frequency layer; 11. a first housing; 12. a first upper cover plate; 13. a first lower cover plate; 14. a first radio frequency layer module; 141. a first substrate; 142. ball Grid Array (BGA) ball placement; 143. a first radio frequency layer assembly; 144. a first microstrip line; 15. a first connector; 151. a first radio frequency signal connector; 152. a first video signal connector; 16. a power supply control circuit; 2. a second frequency synthesis layer; 21. a second housing; 22. a second upper cover plate; 23. a second lower cover plate; 24. a second frequency synthesis module; 241. a second substrate; 242. a second frequency synthesis layer assembly; 243. a second microstrip line; 25. a second connector; 251. a second radio frequency signal connector; 252. a second video signal connector.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.
Example 1
As shown in fig. 1 to 5, a small-sized frequency conversion assembly based on an SCX frequency band comprises a first radio frequency layer 1 and a second frequency synthesis layer 2 which are detachably connected in sequence from top to bottom, wherein the first radio frequency layer 1 and the second frequency synthesis layer 2 are interconnected through a connector;
as shown in fig. 2, the first rf layer 1 includes a first housing 11, a first upper cover plate 12 and a first lower cover plate 13 detachably connected to upper and lower portions of the first housing 11, respectively, a first rf layer module 14 connected in the first housing 11, and a first connector 15 interconnected with the first rf layer module 14, a substrate of the first rf layer module 14 being positioned on top of the first housing 11, the first connector 15 being connected in the first housing 11;
the second frequency synthesizer 2 includes a second housing 21, a second upper cover 22 and a second lower cover 23 detachably connected to the upper and lower parts of the second housing 21, respectively, a second frequency synthesizer module 24 connected in the second housing 21, and a second connector 25 interconnected with the second frequency synthesizer module 24, a substrate of the second frequency synthesizer module 24 being located at the bottom of the second housing 21, the second connector 25 being connected in the second housing 11;
the first shell 11 and the second shell 21 have the same length and width and are detachably connected, the first lower cover plate 13 and the second upper cover plate 22 are of a planar structure which is detachably connected, and the first connector 15 and the second connector 25 are in opposite-inserting interconnection to enable the first radio frequency layer module 14 and the second frequency comprehensive layer module 24 to be in interconnection;
a cavity for placing the first radio frequency layer module 14 is arranged in the first shell 11;
the first upper cover plate 12 and the first lower cover plate 13 are connected with the first housing 11 through screws;
as shown in fig. 1, the first radio frequency layer module 14 includes a first substrate 141 fixedly connected to the top of the first housing 11, a BGA ball 142, a first radio frequency layer assembly 143, and a first microstrip line 144 connected to the first radio frequency layer assembly 143 and the first connector 15, which are sequentially connected to the bottom of the first substrate 141;
the first radio frequency layer assembly 143 includes a mixing assembly, an amplifying assembly and a filtering assembly that are interconnected, and the mixing assembly, the amplifying assembly and the filtering assembly are all interconnected with the first substrate 141 through the BGA implant 142;
as shown in fig. 1 and 3, the first connector 15 includes a first radio frequency signal connector 151 and a first video signal connector 152, the number of the first radio frequency signal connector 151 and the first video signal connector 152 is at least two, the number of the cavities is at least two, the mixing component is connected with the first radio frequency signal connector 151 through a first microstrip line 144, the mixing component, the amplifying component and the filtering component are connected with the first video signal connector 152 through a first microstrip line 144, and the first microstrip line 144 connected with the first radio frequency signal connector 151 includes at least two widths;
the microstrip line slot is arranged in the first substrate 141, one side of the first substrate 141 extends to the tail end of the first connector 15 and is provided with a boss at the joint, the first substrate 141 is a substrate laminated by TSM-DS3M and FR-28-0040-50S, and the first substrate 141 and the first shell 11 are connected by bonding through screws or conductive adhesive;
the first radio frequency layer assembly 143 is packaged by AlN, and the first radio frequency layer assembly 143 is further provided with a filter, a switch and a grounding through hole;
the first radio frequency layer 1 further comprises a power supply control circuit 16 connected to the upper part of the first substrate 141, and the power supply control circuit 16 is interconnected with the first radio frequency signal connector 151 and the first video signal connector 152 through the first microstrip line 144;
a cavity for placing a second frequency synthesis module 24 is arranged in the second shell 21;
the second upper cover plate 22 and the second lower cover plate 23 are connected with the second housing 21 by screws;
as shown in fig. 4, the second frequency synthesizer module 24 includes a second base plate 241 fixedly connected to the bottom of the second housing 21, a second frequency synthesizer assembly 242 connected to the top of the second base plate 241, and a second microstrip line 243 connected to the second frequency synthesizer assembly 242 and the second connector 25;
the second frequency synthesis assembly 243 comprises a power division network and an amplifying assembly which are connected with each other, and the power division network and the amplifying assembly are welded on the second substrate 241;
the second connector 25 includes a second radio frequency signal connector 251 and a second video signal connector 252, the number of the second radio frequency signal connector 251 and the second video signal connector 252 is at least two, the number of the cavities is at least two, the amplifying component is connected with the second radio frequency signal connector 251 through a second microstrip line 243, the power division network and the amplifying component are connected with the second video signal connector 252 through a second microstrip line 243, and the second microstrip line 244 connected with the second radio frequency signal connector 251 includes at least two widths;
a filter, a switch and a grounding through hole can be further arranged in the second frequency synthesis layer assembly 242;
a microstrip line slot is arranged in the second substrate 241, one side of the second substrate 241 extends to the tail end of the second connector 25 and is provided with a boss at the joint, the second substrate 241 is a substrate laminated by TSM-DS3M and FR-28-0040-50S, and the second substrate 241 is connected with the second shell 21 through bonding by screws or conductive adhesive;
the second radio frequency signal connector 251 is an SMP-KK connector, and the second video signal connector 252 is a JMC-KK video connector;
as shown in fig. 2, the first rf layer module 14 and the second rf layer module 24 are staggered in a vertical direction.
The preparation method of the embodiment comprises the following steps:
s1, interconnecting a packaged BGA device (a first radio frequency layer assembly 143) and a substrate 141 through a BGA ball implant 142 to obtain a BGA radio frequency module (a first radio frequency layer module 14), wherein the BGA device is interconnected with a first connector 15 through a microstrip line 144;
the specific method comprises the following steps: placing a BGA (ball grid array) implant 142 at the bottom of an airtight first radio frequency layer assembly 143, heating to 230-200 ℃ and reflow soldering for 30-40 s to fix the BGA implant 142 at the bottom of the radio frequency assembly 143, coating solder paste on the surface of the BGA implant 142 and then placing a radio frequency module substrate (first substrate 141), connecting one end of a first microstrip line 144 arranged in a groove of the radio frequency module substrate with the radio frequency assembly 143, heating to 170-190 ℃ to fixedly connect the radio frequency assembly 143 with the radio frequency module substrate 141, welding a power supply control circuit 16 at the other side of the radio frequency module substrate 141, fixing the radio frequency module substrate 141 in a cavity of the first housing 11 through screws to enable the radio frequency assembly 14 to face upwards, then interconnecting the other ends of the first connector 15 and the first microstrip line 144 and then fixing the other ends of the first connector 15 in the first housing 11 through electric welding, and then respectively assembling a radio frequency module upper cover plate 11 and a radio frequency module lower cover plate 12 to the lower part and the upper part of the first housing 11 through screws for parallel sealing;
s2, packaging the surface-mounted device in a shell through welding to obtain a frequency synthesis module (a second frequency synthesis layer 2), wherein the surface-mounted device is interconnected with a second connector 25 through a microstrip line;
the specific method comprises the following steps: fixing a frequency synthesis assembly (a second frequency synthesis assembly 242) on a second base plate 241 in a reflow soldering mode and connecting one end of a second non-strip line 243 arranged in a groove of the second base plate 241, fixing the second base plate 241 in a second shell 21, interconnecting a second connector 25 with the other end of the frequency synthesis module base strip line 243, fixing the second connector 25 in the second shell 21 through electric welding, and respectively assembling a second upper cover plate 21 and a second lower cover plate 22 into the second shell 21 through screws for parallel seal soldering;
s3, inverting the first radio frequency layer 1, inserting and interconnecting the first connector 15 and the second connector 25, and interconnecting the first radio frequency layer assembly 143 and the second frequency synthesis layer assembly 243;
the first lower cover plate 12 is in plane connection with the second upper cover plate 21, and the first shell 11 and the second shell 21 are fixedly connected through screws after the first connector 15 and the second connector 25 are interconnected;
the interconnection method of the small-sized frequency conversion component based on the SCX frequency band is completed.
The principle of this embodiment is:
as shown in fig. 4, the second frequency synthesis layers 2 of two different frequencies respectively generate different local oscillation signals, which are divided into 4 paths of local oscillation signals through a distribution network, amplified and output to the second SMP connectors 251, so as to ensure mutual isolation between the local oscillation signals, the design is respectively transmitted to the four second SMP connectors 251 in an excessive form in fig. 4. In order to ensure isolation of the local oscillator and the radio frequency signal, a method of cavity design is adopted, and a radio frequency layer (a first radio frequency layer component 143) and a local oscillator layer (a second frequency comprehensive layer component 243) are respectively divided into two independent cavities. In order to reduce crosstalk between the two frequency synthesis modules, the microstrip lines 144 and 244 adopt a grooved mode, so that mutual windings between the signal lines are reduced.
As shown in fig. 1 to 3, the power supply signal is supplied by a first video signal connector 152 (a power supply socket), the X-band local oscillation signal generated in fig. 4 is transmitted to a second microstrip line 144 in the printed board through a second radio frequency signal connector 251 in fig. 2, and is amplified and split, mixed with an externally input radio frequency signal, and then an intermediate frequency signal is generated in the first radio frequency layer 2, amplified and filtered, and then output.
The upper and lower shells are connected with each other through video pair plug-in connectors 152 and 252, and the radio frequency pair plug-in connectors 151 and 251 are used for realizing radio frequency interconnection of the upper substrate 141 and the lower substrate 241;
in order to adapt to the packaging volume of 21mm multiplied by 16mm of the external dimension of the BGA device, the cavity structure is reasonably designed, the interconnection length between devices is reduced as much as possible, and the turning distance is reduced. To reduce the unevenness, a straight line is employed in the board as much as possible. The gain of each BGA device should be below 40dB at design time to prevent self-excitation inside the module. While minimizing the number of gold wire bonds in the inter-board interconnect. When layering, the local oscillation distribution layer with the same function is separated from the radio frequency layer as far as possible, so that the isolation degree in the design is increased. In order to prevent signal crosstalk in the same layer, the isolation of signals is improved by adding filters, switches and grounding through holes.
Experiments prove that the vertical interconnection of small-sized frequency conversion components of the SCX frequency band can reach the following indexes: the transmission loss of 40mm was tested to be less than 5dB.
The small-sized variable frequency component of the SCX frequency band can be applied to various shell interconnections to realize the transmission of radio frequency signals.
The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.

Claims (10)

1. The utility model provides a small-size variable frequency subassembly based on SCX frequency channel which characterized in that: the radio frequency integrated circuit comprises a first radio frequency layer (1) and a second frequency integrated layer (2) which are detachably connected in sequence from top to bottom, wherein the first radio frequency layer (1) and the second frequency integrated layer (2) are interconnected through connectors;
the first radio frequency layer (1) comprises a first shell (11), a first upper cover plate (12) and a first lower cover plate (13) which are respectively and detachably connected to the upper part and the lower part of the first shell (11), a first radio frequency layer module (14) connected in the first shell (11) and a first connector (15) interconnected with the first radio frequency layer module (14), a substrate of the first radio frequency layer module (14) is positioned at the top of the first shell (11), and the first connector (15) is connected in the first shell (11);
the second frequency synthesis layer (2) comprises a second shell (21), a second upper cover plate (22) and a second lower cover plate (23) which are respectively and detachably connected to the upper part and the lower part of the second shell (21), a second frequency synthesis layer module (24) connected in the second shell (21) and a second connector (25) interconnected with the second frequency synthesis layer module (24), a substrate of the second frequency synthesis layer module (24) is positioned at the bottom of the second shell (21), and the second connector (25) is connected in the second shell (21);
the first shell (11) and the second shell (21) are identical in length and width and are detachably connected, the first lower cover plate (13) and the second upper cover plate (22) are of a planar structure which is detachably connected, and the first connector (15) and the second connector (25) are in opposite-inserting interconnection to enable the first radio frequency layer module (14) and the second frequency comprehensive layer module (24) to be interconnected.
2. The SCX-band based compact frequency conversion assembly of claim 1, wherein: a cavity for placing the first radio frequency layer module (14) is arranged in the first shell (11);
the first upper cover plate (12) and the first lower cover plate (13) are connected with the first shell (11) through screws;
the first radio frequency layer module (14) comprises a first substrate (141) fixedly connected to the top of the first shell (11), a BGA ball-planting device (142) and a first radio frequency layer assembly (143) which are sequentially connected to the bottom of the first substrate (141), and a first microstrip line (144) which is connected to the first radio frequency layer assembly (143) and the first connector (15).
3. The small-sized frequency conversion module based on SCX band as claimed in claim 2, wherein: the first radio frequency layer assembly (143) comprises a mixing assembly, an amplifying assembly and a filtering assembly which are interconnected, wherein the mixing assembly, the amplifying assembly and the filtering assembly are all interconnected with the first substrate (141) through the BGA ball implant (142);
the first connector (15) comprises a first radio frequency signal connector (151) and a first video signal connector (152), the number of the first radio frequency signal connector (151) and the number of the first video signal connector (152) are at least two, the number of the cavities is at least two, the frequency mixing component is connected with the first radio frequency signal connector (151) through the first microstrip line (144), and the frequency mixing component, the amplifying component and the filtering component are connected with the first video signal connector (152) through the first microstrip line (144); the first microstrip line (144) connected to the first rf signal connector (151) comprises at least two widths.
4. The small-sized frequency conversion module based on SCX band as claimed in claim 2, wherein: a microstrip line slot is arranged in the first substrate (141), one side of the first substrate (141) extends to the tail end of the first connector (15) and a boss is arranged at the joint, the first substrate (141) is a substrate laminated by TSM-DS3M and FR-28-0040-50S, and the first substrate (141) and the first shell (11) are connected through bonding by screws or conductive adhesive;
the first radio frequency layer assembly (143) uses an AlN package, and the first radio frequency layer assembly (143) is further provided with a filter, a switch and a grounding through hole.
5. A small-scale frequency conversion module according to claim 3, wherein: the first radio frequency layer (1) further comprises a power supply control circuit (16) connected to the upper portion of the first substrate (141), and the power supply control circuit (16) is interconnected with the first radio frequency signal connector (151) and the first video signal connector (152) through the first microstrip line (144).
6. The SCX-band based compact frequency conversion assembly of claim 1, wherein: a cavity for placing the second frequency synthesis layer module (24) is arranged in the second shell (21);
the second upper cover plate (22) and the second lower cover plate (23) are connected with the second shell (21) through screws;
the second frequency synthesis module (24) comprises a second base plate (241) fixedly connected to the bottom of the second shell (21), a second frequency synthesis assembly (242) connected to the top of the second base plate (241), and a second microstrip line (243) connected to the second frequency synthesis assembly (242) and the second connector (25).
7. The SCX-band based compact frequency conversion assembly of claim 6, wherein: the second frequency synthesis assembly (242) comprises a power division network and an amplifying assembly which are connected with each other, and the power division network and the amplifying assembly are welded on the second substrate (241);
the second connector (25) comprises a second radio frequency signal connector (251) and a second video signal connector (252), the number of the second radio frequency signal connector (251) and the second video signal connector (252) is at least two, the number of the cavities is at least two, the amplifying component is connected with the second radio frequency signal connector (251) through the second microstrip line (243), and the power distribution network and the amplifying component are connected with the second video signal connector (252) through the second microstrip line (243); the second microstrip line (243) connected to the second rf signal connector (251) comprises at least two widths.
8. The SCX-band based compact frequency conversion assembly of claim 6, wherein: filters, switches and ground vias may also be provided in the second frequency synthesis assembly (242).
9. The SCX-band based compact frequency conversion assembly of claim 7, wherein:
a microstrip line slot is arranged in the second substrate (241), one side of the second substrate (241) extends to the tail end of the second connector (25) and is provided with a boss at the joint, the second substrate (241) is a substrate laminated by TSM-DS3M and FR-28-0040-50S, and the second substrate (241) and the second shell (21) are connected through bonding by screws or conductive adhesive;
the second radio frequency signal connector (251) is an SMP-KK connector, and the second video signal connector (252) is a JMC-KK video connector.
10. The SCX-band based compact frequency conversion assembly of claim 1, wherein: the first radio frequency layer modules (14) and the second frequency synthesis layer modules (24) are arranged in a staggered manner in the vertical direction.
CN202321968944.9U 2023-07-25 2023-07-25 Small-size variable frequency subassembly based on SCX frequency channel Active CN220693110U (en)

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CN202321968944.9U CN220693110U (en) 2023-07-25 2023-07-25 Small-size variable frequency subassembly based on SCX frequency channel

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Application Number Priority Date Filing Date Title
CN202321968944.9U CN220693110U (en) 2023-07-25 2023-07-25 Small-size variable frequency subassembly based on SCX frequency channel

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