CN116938147A - Small-sized frequency conversion assembly based on SCX frequency band and interconnection method thereof - Google Patents

Abstract

The invention provides a small-sized variable frequency component based on an SCX frequency band and an interconnection method thereof. In the invention, the signal is transmitted in the double-layer structure, and the signal is transmitted between the surface-mounted devices with various functions by interconnecting one structural body with the BGA device in the other structural body through the microstrip line and the SMP; the invention adopts modularized and universal design, avoids crosstalk between signals, and can weld the novel BGA packaging device integrating different functions on a printed board in the form of a ball-planting; because the BGA device adopts a hermetic package form, the whole structure adopts a non-hermetic design, and a standard SMP interface is used for connecting with an external radio frequency front-end component; the invention has compact and small structure and strong reliability, can reduce the development time of the frequency conversion assembly by adopting the design, and provides powerful guarantee for large-scale, large-batch and high-reliability system product delivery.

Description

Small-sized frequency conversion assembly based on SCX frequency band and interconnection method thereof

Technical Field

The invention relates to the technical field of electrical elements, in particular to a small-sized variable frequency component based on an SCX frequency band and an interconnection method thereof.

Background

With the continuous development of electronic information technology, the requirements of broadband, miniaturization and generalization have gradually become the development trend of novel frequency conversion transceiver components. The novel connecting method is endless, and a generalized simple and reliable assembly-level connecting mode can greatly reduce the time required by design and improve the design efficiency.

In the microwave field, SCX devices are mainly bare chips, and in the traditional design, the bare chips are packaged with gold boxes, and the radio frequency interconnection of a printed board is realized by adopting a glass bead welding mode. The soft substrate RT/duroid5880 is often used as a welding carrier for assembling a set of bare chips, and the basic steps comprise conductive adhesive pasting, ultrasonic cleaning, grooving, eutectic welding, gold wire bonding, sintering of glass beads and the like, so that high requirements are placed on raw materials, equipment cost and personnel investment.

There is therefore a need for an interconnect assembly and method that achieves less insertion loss, good flatness, and improved assembly efficiency.

Disclosure of Invention

The invention aims to solve the problems of large insertion loss, poor flatness and low assembly efficiency in the chip assembly process, and provides a small-sized variable frequency component based on an SCX frequency band and an interconnection method thereof, wherein signals are transmitted in a double-layer structure, and are interconnected with BGA devices in another structure from one structure body through microstrip lines and SMPs, so that signals can be transmitted among surface-mounted devices with various functions; the modularized and generalized design is adopted, so that crosstalk between signals is avoided, and novel BGA packaging devices integrated with different functions can be welded on a printed board in a ball-planting mode; because the BGA device adopts a hermetic package form, the whole structure adopts a non-hermetic design, and a standard SMP interface is used for connecting with an external radio frequency front-end component; the invention has compact and small structure and strong reliability, can reduce the development time of the frequency conversion assembly by adopting the design, and provides powerful guarantee for large-scale, large-batch and high-reliability system product delivery.

The invention provides a small-sized frequency conversion assembly based on an SCX frequency band, which comprises a BGA radio frequency module, a frequency synthesis module, a connector module for interconnecting the BGA radio frequency module and the frequency synthesis module and a box body connected outside the BGA radio frequency module, the frequency synthesis module and the connector module;

the connector module comprises a first connector module welded on one side of the BGA radio frequency module and a second connector module welded on one side of the frequency synthesizer module, and the first connector module and the second connector module are connected through opposite insertion so as to enable components in the BGA radio frequency module to be connected with components in the frequency synthesizer module;

the BGA radio frequency module is used for connecting a BGA device through a BGA ball implant, and the BGA device is connected with the first connector module through a microstrip line;

the frequency synthesizer module packages the surface-mounted device in the shell through welding, the surface-mounted device is connected with the second connector module through the microstrip line, the surface-mounted device outputs signals to the BGA radio frequency module through the connector module after processing the signals, and the BGA radio frequency module receives the signals output by the frequency synthesizer module and outputs the signals after processing the signals by using the BGA device;

the box body comprises an upper box body and a lower box body which are connected from top to bottom, the BGA radio frequency module and the first connector module are arranged in the upper box body, and the frequency synthesizer module and the second connector module are arranged in the lower box body.

The invention relates to a small-sized frequency conversion assembly based on SCX frequency band, which is characterized in that a BGA radio frequency module comprises a radio frequency module upper cover plate, a radio frequency module lower cover plate, a radio frequency module substrate connected to the bottom of the radio frequency module upper cover plate, a radio frequency assembly connected to the bottom of the radio frequency module substrate, a power supply control circuit connected to the top of the radio frequency module substrate, a BGA ball-planting device connected between the radio frequency module substrate and the radio frequency assembly, and a radio frequency module microstrip line interconnecting the radio frequency assembly and a first connector module;

the radio frequency components are BGA components;

the upper cover plate and the lower cover plate of the radio frequency module are respectively fixed on the upper part and the lower part of the upper box body through screws, the lower cover plate of the radio frequency module is fixed with the upper cover plate of the frequency synthesis module through screws, and a cavity for placing the base plate of the radio frequency module and the radio frequency assembly is arranged in the upper box body.

According to the small-sized frequency conversion assembly based on the SCX frequency band, as a preferable mode, a radio frequency module substrate is a substrate laminated by TSM-DS3M and FR-28-0040-50S, a solder mask is arranged between interconnection wire bonding pads of the radio frequency module substrate, each pin bonding pad of a device is independent, a microstrip line mounting groove is arranged in the radio frequency module substrate, the radio frequency module substrate is fixedly connected with an upper box body through a screw, the distance from the edge of each signal hole in the radio frequency module substrate to an external window is 0.4mm, ground holes are plated and leveled, and a boss structure is arranged at the joint of the radio frequency module substrate and a first connector module;

the radio frequency component is packaged by AlN, the radio frequency component comprises a frequency mixing component, an amplifying component and a filtering component which are mutually connected, the radio frequency component can be also provided with a switch and a grounding through hole which are used for increasing isolation, the radio frequency component is mutually connected with the first connector module by a microstrip line, and the gains of all the components in the radio frequency component are lower than 40dB;

the power supply control circuit is welded and fixed on the upper part of the upper cover plate of the radio frequency module;

the number of welding spots is reduced by 4 around the BGA implant ball for transmitting radio frequency signals, and the BGA implant ball is a high-lead implant ball.

The invention relates to a small-sized frequency conversion assembly based on an SCX frequency band, which is used as a preferable mode, wherein a frequency synthesis module comprises an upper cover plate of the frequency synthesis module, a lower cover plate of the frequency synthesis module, a frequency synthesis module base plate connected to the top of the lower cover plate of the frequency synthesis module, a frequency synthesis assembly connected to the upper part of the frequency synthesis module base plate and a frequency synthesis module microstrip line interconnecting the frequency synthesis assembly and a second connector module;

the upper cover plate of the frequency heald module and the lower cover plate of the frequency heald module are respectively fixed on the upper part and the lower part of the lower box body through screws, and a cavity for placing the base plate of the frequency heald module and the frequency heald assembly is arranged in the lower box body.

According to the small-sized frequency conversion assembly based on the SCX frequency band, as an optimal mode, an upper cover plate of the frequency synthesis module is fixed with the bottom of the BGA radio frequency module through a screw, and a base plate of the frequency synthesis module is fixed on the bottom surface of the lower box body through a screw;

the frequency synthesis module substrate is in a mode of laminating TSM-DS3M and FR-28-0040-50S, a solder resist film is arranged between interconnection line bonding pads of the frequency synthesis module substrate, each pin bonding pad of the device is independent, a microstrip line mounting groove is arranged in the frequency synthesis module substrate, the distance from the edge of each signal hole in the frequency synthesis module substrate to an external window is 0.4mm, ground holes are plated evenly, a boss structure is arranged at the joint of the frequency synthesis module substrate and the second connector module, and the frequency synthesis module substrate is connected with the lower box body through screws or conductive adhesive;

the frequency synthesis assembly comprises a power division network and an amplifying assembly which are connected with each other, the frequency synthesis assembly can be also provided with a switch and a grounding through hole for increasing isolation, and the amplifying assembly is connected with the second connector module through a microstrip line;

the connecting surfaces of the upper box body and the lower box body are plane and are connected through screws;

the vertical positions of the frequency synthesizer component and the radio frequency component are staggered.

In the small-sized frequency conversion assembly based on the SCX frequency band, as an optimal mode, the first connector module comprises a first SMP connector and a first power supply socket, the second connector module comprises a second SMP connector and a second power supply socket, the first SMP connector and the second SMP connector transmit radio frequency signals to the plug-in interconnection, and the first power supply socket and the second power supply socket transmit power signals to the plug-in interconnection;

the first SMP connector and the first power supply socket are both fixed in the upper box body by spot welding, and the second SMP connector and the second power supply socket are both fixed in the shell of the lower box body by spot welding.

According to the small-sized frequency conversion assembly based on the SCX frequency band, as an optimal mode, the first SMP connector and the second SMP connector are SMP-KK connectors, and the first feed socket and the second feed socket are JMC-KK video connectors;

the outer parts of the first SMP connector, the first power supply socket, the second SMP connector and the second power supply socket are provided with cavity structures with the thickness of 5mm or more;

the number of the first SMP connectors, the first power supply socket, the second SMP connectors and the second power supply socket is at least two.

The invention provides an interconnection method of small-sized frequency conversion components based on an SCX frequency band, which comprises the following steps:

s1, interconnecting a packaged BGA device and a substrate through a BGA ball implant to obtain a BGA radio frequency module, wherein the BGA device is interconnected with a first connector module through a microstrip line;

s2, packaging the surface-mounted device in a shell through welding to obtain a frequency synthesis module, wherein the surface-mounted device is interconnected with a second connector module through a microstrip line;

s3, inverting the BGA radio frequency module, inserting and interconnecting the first connector module and the second connector module, and interconnecting the BGA radio frequency module and the frequency synthesis module, and completing the interconnection method of the small-sized frequency conversion assembly based on the SCX frequency band.

In the step S1, BGA implanting balls are placed at the bottom of an airtight radio frequency component, the BGA implanting balls are heated to 230-200 ℃ and are welded in a reflow mode for 30-40 seconds to enable the BGA implanting balls to be fixed at the bottom of the radio frequency component, tin paste is smeared on the surface of the BGA implanting balls and welded on a radio frequency module substrate, one end of a radio frequency module microstrip line arranged in a groove of the radio frequency module substrate is connected with the radio frequency component, the radio frequency component is heated to 170-190 ℃ to enable the radio frequency component to be fixedly connected with the radio frequency module substrate, a power supply control circuit is welded on the other side of the radio frequency module substrate, the radio frequency module substrate is fixed in a cavity of an upper box body through screws to enable the radio frequency component to face upwards, then a first connector module is connected with the other end of the radio frequency module microstrip line and then fixed in the upper box body through electric welding, and then an upper cover plate of the radio frequency module and a lower cover plate of the radio frequency module are respectively assembled into the upper box body through screws for parallel seal welding.

In the step S2, the frequency harness assembly is fixed on a frequency harness module substrate in a reflow soldering mode and is connected with one end of a frequency harness module microstrip line arranged in a groove of the frequency harness module substrate, then the frequency harness module substrate is fixed in a lower box body, a second connector module is connected with the other end of the frequency harness module microstrip line and is fixed in the lower box body through electric welding, and an upper cover plate of the frequency harness module and a lower cover plate of the frequency harness module are respectively assembled in the lower box body through screws for parallel seal soldering;

in step S3, the lower cover plate of the radio frequency module is in planar connection with the upper cover plate of the frequency synthesis module, and the first connector module and the second connector module are fixedly connected with the upper box body and the lower box body through screws after being interconnected.

The invention comprises the following technical scheme:

the technical solution to be solved by the invention is as follows: an internal interconnection scheme of a 2-12GHz frequency band variable frequency component is provided. The small insertion loss, the good flatness and the improvement of the assembly efficiency are realized. The design can greatly reduce the design time and improve the stability of the product.

The invention provides a high-integration SIP, which has the characteristics of modularized functions and easy disassembly and repair, integrates a radio frequency link in the SIP, and uses a common substrate for connection. In the production and processing, the modularized product is used as a surface-mounted device and is welded on a printed board in a Ball Grid Array (BGA) ball-mounting mode.

The invention realizes the transmission of signals in a double-layer structure, and the signals can be transmitted between the surface-mounted devices with different functions by interconnecting one structure body with the BGA devices in the other structure body through the microstrip line and the SMP. In order to reduce the insertion loss of the design, microstrip lines with different widths are adopted for matching, and the transmission loss of 40mm is tested to be less than 5dB.

The substrate is laminated with TSM-DS3-M and FR-28-0040-50S, and various blind holes and through holes are used for signal transmission and shielding. In order to ensure good welding of BGA in the design, the distance from the edge of each signal hole to the outside window is 0.4mm, and the ground holes are plated with a flat technology for all grounding, so that the phenomenon of pad enlargement after mounting is avoided. In the design, the BGA needs to transmit radio frequency signals, so that welding spots around the BGA transmitting broadband radio frequency signals are eliminated, and the insertion loss is reduced. The printed board is adhered to the inside of the SIP shell through the conductive adhesive during welding, the chip is adhered and bonded through gold wires, and the cover plate is subjected to parallel seal welding after the test is finished, so that various temperature gradients are adopted in the whole design, and the problem that soldering tin is dissolved during welding and assembling is avoided. High-lead ball implantation is adopted, the peak temperature of ball implantation reflow soldering is 210 ℃ and the duration is 30-40 s, and then solder paste soldering at 183 ℃ is used for soldering the device to a motherboard. And respectively installing masters with different functions on the upper and lower box bodies in a screw fixing mode, welding SMP (M) -JYD15-S on the structure, and screwing the upper and lower cover plates on the upper and lower box bodies. And the printed boards in two different structures are subjected to radio frequency interconnection according to requirements by adopting an SMP-KK351 direct opposite insertion mode.

The invention has the following advantages:

(1) The invention works in a 2-12GHz frequency band system, has small design size, adopts modularized and generalized design, avoids crosstalk between signals, and can weld novel BGA packaging devices integrated with different functions on a printed board in a ball-planting mode;

(2) The invention uses an integrated design, and as the BGA device adopts an airtight packaging mode, the whole structure adopts a non-airtight design, and a standard SMP interface is used for connecting with an external radio frequency front-end component;

(3) The invention has compact and small structure and strong reliability, can reduce the development time of the frequency conversion assembly by adopting the design, and provides powerful guarantee for large-scale, large-batch and high-reliability system product delivery.

Drawings

FIG. 1 is a schematic diagram of a small-sized frequency conversion assembly based on SCX frequency band;

FIG. 2 is a schematic diagram of a BGA RF module with a compact frequency conversion module based on SCX frequency band;

FIG. 3 is a bottom view of a small-sized frequency conversion assembly BGA radio frequency module structure based on SCX frequency band in an upper case;

FIG. 4 is a side view of a compact frequency conversion assembly frequency synthesizer module based on the SCX frequency band;

FIG. 5 is an assembled perspective view of a compact frequency conversion assembly connector module based on the SCX frequency band;

fig. 6 is a flowchart of an interconnection method of small-sized frequency conversion components based on SCX frequency band.

Reference numerals:

1. a BGA radio frequency module; 11. an upper cover plate of the radio frequency module; 12. a lower cover plate of the radio frequency module; 13. a radio frequency module substrate; 14. a radio frequency assembly; 15. a power supply control circuit; 16. ball Grid Array (BGA) ball placement; 17. a radio frequency module microstrip line; 2. a frequency synthesis module; 21. an upper cover plate of the frequency synthesis module; 22. a lower cover plate of the frequency synthesis module; 23. a frequency synthesis module base plate; 24. a frequency synthesizer component; 25. a frequency synthesis module microstrip line; 3. a connector module; 31. a first connector module; 311. a first SMP socket; 312. a first power feeding receptacle; 321. a second SMP connector; 322. a second power feeding receptacle; 4. a case body; 41. an upper case; 42. a lower box body.

Detailed Description

The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.

Example 1

As shown in fig. 1 to 5, a small-sized frequency conversion assembly based on SCX frequency band comprises a BGA radio frequency module 1, a frequency synthesis module 2, a connector module 3 interconnecting the BGA radio frequency module 1 and the frequency synthesis module 2, and a box body 4 connected outside the BGA radio frequency module 1, the frequency synthesis module 2 and the connector module 3;

the connector module 3 includes a first connector module 31 welded to one side of the BGA radio frequency module 1 and a second connector module 32 welded to one side of the frequency synthesizer module 2, the first and second connector modules 31 and 32 being interconnected by butt-insertion to interconnect components in the BGA radio frequency module 1 with components in the frequency synthesizer module 2;

the BGA radio frequency module 1 connects the BGA devices through the BGA ball-planting, and the BGA devices are interconnected with the first connector module 31 through the microstrip line;

the frequency synthesizer module 2 packages the surface-mounted device in the shell through welding, the surface-mounted device is interconnected with the second connector module 32 through a microstrip line, the surface-mounted device outputs signals to the BGA radio frequency module 1 through the connector module 3 after processing the signals, and the BGA radio frequency module 1 receives the signals output by the frequency synthesizer module 2 and outputs the signals after processing the signals by using the BGA device;

the box body 4 comprises an upper box body 41 and a lower box body 42 which are connected from top to bottom, the BGA radio frequency module 1 and the first connector module 31 are arranged in the upper box body 41, and the frequency synthesis module 2 and the second connector module 32 are arranged in the lower box body 42;

the BGA radio frequency module 1 comprises a radio frequency module upper cover plate 11, a radio frequency module lower cover plate 12, a radio frequency module substrate 13 connected to the bottom of the radio frequency module upper cover plate 11, a radio frequency component 14 connected to the bottom of the radio frequency module substrate 13, a power control circuit 15 connected to the top of the radio frequency module substrate 13, a BGA ball-planting 16 connected between the radio frequency module substrate 13 and the radio frequency component 14, and a radio frequency module microstrip line 17 interconnecting the radio frequency component 14 and the first connector module 31;

the radio frequency components 14 are all BGA components;

the upper cover plate 11 and the lower cover plate 12 of the radio frequency module are respectively fixed on the upper part and the lower part of the upper box body 41 through screws, the lower cover plate 12 of the radio frequency module is fixed with the upper cover plate of the frequency synthesis module 2 through screws, and a cavity for placing the base plate 13 of the radio frequency module and the radio frequency assembly 14 is arranged in the upper box body 41;

the radio frequency module substrate 13 is a substrate laminated by TSM-DS3M and FR-28-0040-50S, a solder resist film is arranged between interconnection wire bonding pads of the radio frequency module substrate 13, each pin bonding pad of the device is independent, a microstrip line mounting groove is arranged in the radio frequency module substrate 13, the radio frequency module substrate 13 is fixedly connected with the upper box 41 through screws, the distance from the edge of each signal hole in the radio frequency module substrate 13 to the external window is 0.4mm, the ground holes are plated evenly, and a boss structure is arranged at the joint of the radio frequency module substrate 13 and the first connector module 31;

the radio frequency component 14 is packaged by AlN, the radio frequency component 14 comprises a frequency mixing component, an amplifying component and a filtering component which are mutually connected, the radio frequency component 14 can be provided with a switch and a grounding through hole for increasing isolation, the radio frequency component 14 is mutually connected with the first SMP connector 311 by a microstrip line, and the gain of each component in the radio frequency component 14 is lower than 40dB;

the power supply control circuit 15 is welded and fixed on the upper part of the upper cover plate 11 of the radio frequency module and is interconnected with the first power supply socket 312 by a wire;

the periphery of the BGA implant ball 16 for transmitting radio frequency signals is reduced by 4 welding spots, and the BGA implant ball 16 is a high-lead implant ball;

the frequency synthesis module 2 comprises a frequency synthesis module upper cover plate 21, a frequency synthesis module lower cover plate 22, a frequency synthesis module baseplate 23 connected to the top of the frequency synthesis module lower cover plate 22, a frequency synthesis assembly 24 connected to the upper part of the frequency synthesis module baseplate 23, and a frequency synthesis module microstrip line 25 interconnecting the frequency synthesis assembly 24 with a second connector module 32;

the upper cover plate 21 and the lower cover plate 22 of the frequency heald module are respectively fixed on the upper part and the lower part of the lower box body 42 through screws, and cavities for placing the base plate 23 of the frequency heald module and the frequency heald assembly 14 are arranged in the lower box body 42;

the upper cover plate 21 of the frequency synthesis module is fixed with the bottom of the BGA radio frequency module 1 through screws, and the base plate 23 of the frequency synthesis module is fixed on the bottom surface of the lower box body 42 through screws;

the frequency synthesis module substrate 23 is in a mode of laminating TSM-DS3M and FR-28-0040-50S, a solder resist film is arranged between interconnection line bonding pads of the frequency synthesis module substrate 23, each pin bonding pad of the device is independent, a microstrip line mounting groove is arranged in the frequency synthesis module substrate 23, the distance from the edge of each signal hole in the frequency synthesis module substrate 23 to an external window is 0.4mm, ground holes are plated evenly, a boss structure is arranged at the joint of the frequency synthesis module substrate 23 and the second connector module 32, and the frequency synthesis module substrate 23 is connected with the lower box body 42 through screws or conductive adhesive;

the frequency synthesizer assembly 24 comprises an interconnected power division network and an amplifying assembly, the frequency synthesizer assembly 24 can be provided with a switch and a grounding through hole for increasing isolation, and the amplifying assembly is interconnected with the second SMP connector 321 through a microstrip line;

the connection surfaces of the upper box 41 and the lower box 42 are plane and are connected by screws;

the frequency synthesizer assembly 24 is staggered from the vertical position of the rf assembly 14;

the first connector module 31 includes a first SMP connector 311 and a first power supply socket 312, the second connector module 32 includes a second SMP connector 321 and a second power supply socket 322, the first SMP connector 311 and the second SMP connector 321 transmit radio frequency signals to the plug interconnect, and the first power supply socket 312 and the second power supply socket 322 transmit power signals to the plug interconnect;

the first SMP connector 311 and the first power supply socket 312 are both fixed in the upper case 41 by spot welding, and the second SMP connector 321 and the second power supply socket 322 are both fixed in the case of the lower case 42 by spot welding;

the first SMP connector 311 and the second SMP connector 321 are SMP-KK connectors, and the first power supply socket 312 and the second power supply socket 322 are JMC-KK video connectors;

the outer parts of the first SMP connector 311, the first power supply socket 312, the second SMP connector 321 and the second power supply socket 322 are provided with cavity structures of 5mm or more;

the number of the first SMP connectors 311, the first power supply sockets 312, the second SMP connectors 321, and the second power supply sockets 322 is at least two.

Example 2

As shown in fig. 6, a method for interconnecting small-sized frequency conversion components based on SCX frequency band includes the following steps:

s1, interconnecting a packaged BGA device and a substrate through a BGA ball implant to obtain a BGA radio frequency module 1, wherein the BGA device is interconnected with a first connector module 31 through a microstrip line;

placing the BGA implanting ball 16 at the bottom of the airtight radio frequency component 14, heating to 230-200 ℃ and reflow soldering for 30-40 s to fix the BGA implanting ball 16 at the bottom of the radio frequency component 14, coating solder paste on the surface of the BGA implanting ball 16 and soldering, placing the BGA implanting ball on the radio frequency module substrate 13, connecting one end of a radio frequency module microstrip line 17 arranged in a groove of the radio frequency module substrate 13 with the radio frequency component 14, heating to 170-190 ℃ to fixedly connect the radio frequency component 14 with the radio frequency module substrate 13, soldering a power supply control circuit 15 at the other side of the radio frequency module substrate 13, fixing the radio frequency module substrate 13 in a cavity of an upper box 41 through screws to enable the radio frequency component 14 to face upwards, then interconnecting the first connector module 31 with the other end of the radio frequency module microstrip line 17 and fixing in the upper box 41 through electric welding, and then respectively assembling the radio frequency module upper cover plate 11 and the radio frequency module lower cover plate 12 into the upper box 41 through screws for parallel sealing;

s2, packaging the surface-mounted device in a shell through welding to obtain a frequency synthesis module 2, wherein the surface-mounted device is interconnected with a second connector module 32 through a microstrip line;

fixing the frequency harness assembly 24 on the frequency harness module substrate 23 in a reflow soldering mode and connecting one end of a frequency harness module microstrip line 25 arranged in a groove of the frequency harness module substrate 23, fixing the frequency harness module substrate 23 in a lower box body 42, interconnecting the second connector module 32 with the other end of the frequency harness module microstrip line 25, fixing the second connector module with the other end of the frequency harness module microstrip line in the lower box body 42 through electric welding, and respectively assembling the frequency harness module upper cover plate 21 and the frequency harness module lower cover plate 22 into the lower box body 42 through screws for parallel seal soldering;

s3, inverting the BGA radio frequency module 1, and interconnecting the first connector module 31 and the second connector module 32 in a plug-in manner and interconnecting the BGA radio frequency module 1 and the frequency synthesizer module 2;

the radio frequency module lower cover plate 12 is in plane connection with the frequency synthesis module upper cover plate 21, and the first connector module 31 and the second connector module 32 are fixedly connected with the upper box body 41 and the lower box body 42 through screws after being interconnected;

the interconnection method of the small-sized frequency conversion component based on the SCX frequency band is completed.

Example 3

As shown in fig. 1 to 6, a small-sized variable frequency component based on SCX frequency band and an interconnection method thereof.

Fig. 5 shows the interconnection of separate rf interfaces and microstrip lines. The upper and lower shells are respectively interconnected with the printed board through a micro-strip line by an SMP, so that signals can be transmitted between surface-mounted devices with various different functions. In order to reduce the insertion loss of the design, microstrip lines with different widths are adopted for matching. When the structure is welded, a wall structure with the thickness of 5mm is required to be reserved at the periphery, and a boss structure is added at the joint of the wall structure and the printed board in order to meet the requirement of opposite insertion.

As shown in fig. 4, the frequency synthesizer modules 2 of two different frequencies respectively generate different local oscillation signals, which are divided into 4 paths of local oscillation signals through a distribution network, amplified and output to the second SMP connectors 321, so as to ensure mutual isolation between the local oscillation signals, the design is respectively transmitted to the four second SMP connectors 321 through an excessive form in fig. 5. In order to ensure isolation of local oscillation and radio frequency signals, a method of cavity design is adopted, and a radio frequency layer and a local oscillation layer are respectively divided into two independent cavities. In order to reduce crosstalk between the two frequency synthesis modules, the microstrip line 25 adopts a grooving mode, so that mutual windings between signal lines are reduced.

As shown in fig. 1 to 3, the power supply signal is supplied by the first power supply socket 312, the X-band local oscillation signal generated in fig. 4 is transmitted to the microstrip line 25 in the printed board through the second SMP connector 321 in fig. 5, and is amplified and split, mixed with the radio frequency signal input from the outside, and then generates an intermediate frequency signal in the BGA radio frequency module 1, and amplified and filtered and then output.

As shown in fig. 1, an AlN-encapsulated BGA radio frequency module 1, a power supply control circuit 15, an upper case upper cover 11, and an upper case lower cover 12 are provided in an upper case 41. The frequency synthesizer 2 is arranged in the lower box 42, and the upper cover 21 of the lower shell and the lower cover 22 of the lower shell are arranged. The upper and lower shells are connected with each other through video pair plug-in connectors 312 and 322, and the radio frequency pair plug-in connectors 311 and 321 realize radio frequency interconnection of the upper substrate 13 and the lower substrate 23; according to the invention, the SMP-KK and JMC-KK (video plug-in) are used for plug-in connection between the substrate and the structure body, so that the quick plug-in connection can be realized, the interconnection lines are reduced, and the repairing efficiency can be improved. The interconnection method of the small-sized frequency conversion assembly based on the SCX frequency band is applied to the transmission of local oscillation signals, wherein the video pair plug-in connectors 312 and 322 and the radio pair plug-in connectors 311 and 321 are required to be welded on the structures of the upper shell and the lower shell according to the structure shown in fig. 5.

As shown in fig. 5, when mounting, a reasonable temperature gradient is formulated according to the soldering step by means of reflow soldering, so that the BGA radio frequency component 14 encapsulated by AlN is soldered on the upper substrate 13 by the power supply control circuit 15. The frequency synthesizer 24 is required to be soldered to the lower substrate 23 by means of reflow soldering. The upper substrate 13 and the lower substrate 23 are required to be fixed on the structures of the upper and lower shells through screws, and after the manual spot welding is performed on the radio frequency connector, the upper box upper cover 11, the upper box lower cover 12 and the lower shell upper cover 21, and the lower shell and the lower cover 22 are respectively fixed and assembled on the upper and lower shells. The upper layer and the lower layer are connected in a plane, SMP-KK and JMC-KK are adopted for mutual connection, and after the two layers are installed, the two layers are fixed through screws.

Preferably, the base plates 13, 23 in the upper and lower shells are selected from TSM-DS3M laminated plates with good flatness, the thickness of the plates is 2mm, and the thickness of the copper coating is 17um; and a solder resist film is added between the interconnection wire bonding pads in the design of the printed board, and each pin bonding pad of the device is independent.

In order to adapt to the packaging volume of 21mm multiplied by 16mm of the external dimension of the BGA device, the cavity structure is reasonably designed, the interconnection length between devices is reduced as much as possible, and the turning distance is reduced. To reduce the unevenness, a straight line is employed in the board as much as possible. The gain of each BGA device should be below 40dB at design time to prevent self-excitation inside the module. While minimizing the number of gold wire bonds in the inter-board interconnect. When layering, the local oscillation distribution layer with the same function is separated from the radio frequency layer as far as possible, so that the isolation degree in the design is increased. In order to prevent signal crosstalk in the same layer, the isolation of signals is improved by adding filters, switches and grounding through holes.

Experiments prove that the vertical interconnection of small-sized frequency conversion components of the SCX frequency band can reach the following indexes: the transmission loss of 40mm was tested to be less than 5dB.

The interconnection method of the small-sized frequency conversion component of the SCX frequency band can be applied to interconnection of various shells to realize transmission of radio frequency signals.

The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.

Claims (10)

1. The utility model provides a small-size variable frequency subassembly based on SCX frequency channel which characterized in that: the device comprises a BGA radio frequency module (1), a frequency synthesis module (2), a connector module (3) for interconnecting the BGA radio frequency module (1) and the frequency synthesis module (2) and a box body (4) connected to the exterior of the BGA radio frequency module (1), the frequency synthesis module (2) and the connector module (3);

the connector module (3) comprises a first connector module (31) welded on one side of the BGA radio frequency module (1) and a second connector module (32) welded on one side of the frequency synthesis module (2), and the first connector module (31) and the second connector module (32) are mutually connected to interconnect components in the BGA radio frequency module (1) and components in the frequency synthesis module (2);

the BGA radio frequency module (1) connects BGA devices through BGA ball implantation, and the BGA devices are interconnected with the first connector module (31) through microstrip lines;

the frequency synthesizer module (2) packages a surface-mounted device in a shell through welding, the surface-mounted device is interconnected with the second connector module (32) through a microstrip line, the surface-mounted device outputs signals to the BGA radio frequency module (1) through the connector module (3) after processing, and the BGA radio frequency module (1) receives signals output by the frequency synthesizer module (2) and outputs the signals after processing the signals by using the BGA device;

the box body (4) comprises an upper box body (41) and a lower box body (42) which are connected from top to bottom, the BGA radio frequency module (1) and the first connector module (31) are arranged in the upper box body (41), and the frequency synthesis module (2) and the second connector module (32) are arranged in the lower box body (42).

2. The SCX-band based compact frequency conversion assembly of claim 1, wherein: the BGA radio frequency module (1) comprises a radio frequency module upper cover plate (11), a radio frequency module lower cover plate (12), a radio frequency module substrate (13) connected to the bottom of the radio frequency module upper cover plate (11), a radio frequency assembly (14) connected to the bottom of the radio frequency module substrate (13), a power supply control circuit (15) connected to the top of the radio frequency module substrate (13), a BGA ball-planting (16) connected between the radio frequency module substrate (13) and the radio frequency assembly (14), and a radio frequency module microstrip line (17) interconnecting the radio frequency assembly (14) and the first connector module (31);

the radio frequency components (14) are BGA components;

the upper cover plate (11) of the radio frequency module and the lower cover plate (12) of the radio frequency module are respectively fixed on the upper part and the lower part of the upper box body (41) through screws, the lower cover plate (12) of the radio frequency module and the upper cover plate of the frequency synthesis module (2) are fixed through screws, and a cavity for placing the base plate (13) of the radio frequency module and the radio frequency assembly (14) is arranged in the upper box body (41).

3. The small-sized frequency conversion module based on SCX band as claimed in claim 2, wherein: the radio frequency module substrate (13) is a substrate laminated by TSM-DS3M and FR-28-0040-50S, a solder mask is arranged between interconnection wire bonding pads of the radio frequency module substrate (13) and each pin bonding pad of a device is independent, a microstrip line mounting groove is arranged in the radio frequency module substrate (13), the radio frequency module substrate (13) is fixedly connected with the upper box body (41) through a screw, the distance from the edge of each signal hole in the radio frequency module substrate (13) to an external window is 0.4mm, ground holes are plated evenly, and a boss structure is arranged at the joint of the radio frequency module substrate (13) and the first connector module (31);

the radio frequency component (14) is packaged by AlN, the radio frequency component (14) comprises a frequency mixing component, an amplifying component and a filtering component which are mutually connected, the radio frequency component (14) can be provided with a switch and a grounding through hole for increasing isolation, the radio frequency component (14) is mutually connected with the first connector module (31) by a microstrip line, and the gains of all components in the radio frequency component (14) are lower than 40dB;

the power supply control circuit (15) is welded and fixed on the upper part of the upper cover plate (11) of the radio frequency module;

the number of welding spots is reduced by 4 around the BGA implant (16) for transmitting radio frequency signals, and the BGA implant (16) is a high-lead implant.

4. The SCX-band based compact frequency conversion assembly of claim 1, wherein: the frequency synthesis module (2) comprises a frequency synthesis module upper cover plate (21), a frequency synthesis module lower cover plate (22), a frequency synthesis module base plate (23) connected to the top of the frequency synthesis module lower cover plate (22), a frequency synthesis assembly (24) connected to the upper part of the frequency synthesis module base plate (23) and a frequency synthesis module microstrip line (25) interconnecting the frequency synthesis assembly (24) and the second connector module (32);

the upper cover plate (21) of the frequency heald module and the lower cover plate (22) of the frequency heald module are respectively fixed on the upper part and the lower part of the lower box body (42) through screws, and cavities for placing the base plate (23) of the frequency heald module and the frequency heald assembly (14) are arranged in the lower box body (42).

5. The SCX-band based compact frequency conversion assembly of claim 4, wherein: the upper cover plate (21) of the frequency synthesis module is fixed with the bottom of the BGA radio frequency module (1) through screws, and the base plate (23) of the frequency synthesis module is fixed on the bottom surface of the lower box body (42) through screws;

the frequency synthesis module substrate (23) is in a mode of laminating TSM-DS3M and FR-28-0040-50S, a solder mask is arranged between interconnection line bonding pads of the frequency synthesis module substrate (23) and each pin bonding pad of a device is independent, a microstrip line mounting groove is arranged in the frequency synthesis module substrate (23), the distance from the edge of each signal hole in the frequency synthesis module substrate (23) to an external window is 0.4mm, ground holes are evenly plated, a boss structure is arranged at the joint of the frequency synthesis module substrate (23) and the second connector module (32), and the frequency synthesis module substrate (23) is connected with the lower box body (42) through screws or conductive adhesive;

the frequency synthesis assembly (24) comprises a power division network and an amplifying assembly which are connected with each other, the frequency synthesis assembly (24) can be provided with a switch and a grounding through hole for increasing isolation, and the amplifying assembly is connected with the second connector module (32) through a microstrip line;

the connecting surfaces of the upper box body (41) and the lower box body (42) are plane and are connected through screws;

the frequency synthesizer assembly (24) is staggered from the vertical position of the radio frequency assembly (14).

6. The SCX-band based compact frequency conversion assembly of claim 1, wherein: the first connector module (31) comprises a first SMP connector (311) and a first power supply socket (312), the second connector module (32) comprises a second SMP connector (321) and a second power supply socket (322), the first SMP connector (311) and the second SMP connector (321) transmit radio frequency signals to the plug-in interconnection, and the first power supply socket (312) and the second power supply socket (322) transmit power signals to the plug-in interconnection;

the first SMP connector (311) and the first power supply socket (312) are both fixed in the upper box body (41) by spot welding, and the second SMP connector (321) and the second power supply socket (322) are both fixed in the shell of the lower box body (42) by spot welding.

7. The SCX-band based compact frequency conversion assembly of claim 6, wherein: the first SMP connector (311) and the second SMP connector (321) are SMP-KK connectors, and the first power supply socket (312) and the second power supply socket (322) are JMC-KK video connectors;

the outer parts of the first SMP connector (311), the first power supply socket (312), the second SMP connector (321) and the second power supply socket (322) are provided with cavity structures with the thickness of 5mm or more;

the number of the first SMP connectors (311), the first power supply socket (312), the second SMP connectors (321) and the second power supply socket (322) is at least two.

8. An interconnection method of small-sized frequency conversion components based on SCX frequency band is characterized in that: the method comprises the following steps:

s1, interconnecting a packaged BGA device and a substrate through a BGA ball implant to obtain a BGA radio frequency module (1), wherein the BGA device is interconnected with the first connector module (31) through a microstrip line;

s2, packaging a surface-mounted device in a shell through welding to obtain the frequency synthesis module (2), wherein the surface-mounted device is interconnected with the second connector module (32) through a microstrip line;

s3, inverting the BGA radio frequency module (1), interconnecting the first connector module (31) and the second connector module (32) in an opposite-plug manner, and interconnecting the BGA radio frequency module (1) and the frequency synthesis module (2), wherein the interconnection method of the small-sized frequency conversion assembly based on the SCX frequency band is completed.

9. The method for interconnecting small-sized frequency conversion components based on the SCX frequency band according to claim 8, wherein the method comprises the following steps: in step S1, placing a BGA-embedded ball (16) at the bottom of an airtight radio frequency component (14), heating to 230-200 ℃ and reflowing for 30-40S to fix the BGA-embedded ball (16) at the bottom of the radio frequency component (14), coating solder paste on the surface of the BGA-embedded ball (16), placing the BGA-embedded ball on a radio frequency module substrate (13), connecting one end of a radio frequency module microstrip line (17) arranged in a groove of the radio frequency module substrate (13) with the radio frequency component (14), heating to 170-190 ℃ to fixedly connect the radio frequency component (14) with the radio frequency module substrate (13), welding a power supply control circuit (15) at the other side of the radio frequency module substrate (13), fixing the radio frequency module substrate (13) in a cavity of an upper box body (41) through a screw, interconnecting the other ends of a first connector module (31) and the radio frequency module microstrip line (17), fixing the radio frequency module microstrip line (17) in the upper box body (41) through electric welding, and then respectively welding the upper cover plate (11) and the lower cover plate (12) in parallel to the upper box body (41).

10. The method for interconnecting small-sized frequency conversion components based on the SCX frequency band according to claim 8, wherein the method comprises the following steps: in step S2, a frequency harness assembly (24) is fixed on the frequency harness module substrate (23) by means of reflow soldering and is connected with one end of a frequency harness module microstrip line (25) arranged in a groove of the frequency harness module substrate (23), then the frequency harness module substrate (23) is fixed in a lower box body (42), a second connector module (32) is interconnected with the other end of the frequency harness module microstrip line (25) and then fixed in the lower box body (42) by means of electric welding, and an upper frequency harness module cover plate (21) and a lower frequency harness module cover plate (22) are respectively assembled in the lower box body (42) by means of screws for parallel seal soldering;

in step S3, the lower cover plate (12) of the radio frequency module is in plane connection with the upper cover plate (21) of the frequency synthesis module, and the first connector module (31) and the second connector module (32) are interconnected and then fixedly connected with the upper box body (41) and the lower box body (42) through screws.