CN216526414U

CN216526414U - Optical module

Info

Publication number: CN216526414U
Application number: CN202220297277.5U
Authority: CN
Inventors: 何鹏; 刘旭霞; 丁翔宇; 杨思更; 马晓磊
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2022-02-14
Filing date: 2022-02-14
Publication date: 2022-05-13
Anticipated expiration: 2032-02-14

Abstract

The application provides an optical module, includes: a circuit board; the lens assembly is arranged on the circuit board and does not have the circuit board to form a wrapping cavity; the optical chip is arranged in the packaging cavity and is electrically connected with the circuit board; the optical filter is arranged on the lens component, is combined with the lens component to establish optical connection with the optical chip and is used for changing the transmission direction of an optical signal; the top of the lens component comprises a first recess, a first optical surface, a second optical surface, a first mounting surface, a second mounting surface and a support table are arranged in the first recess, the first mounting surface and the second mounting surface are arranged on the side edges of the first optical surface and the second optical surface, the support table is arranged at the end part of the second optical surface, and grooves are respectively arranged at the bottom ends of the first mounting surface and the second mounting surface; the first mounting surface and the second mounting surface are connected with the transmission back surface of the optical filter, and the support table supports the side surface of the optical filter. The application provides an optical module makes things convenient for the light filter to fix on the lens subassembly, guarantees yield and stability when light filter glue is fixed.

Description

Optical module

Technical Field

The application relates to the technical field of optical fiber communication, in particular to an optical module.

Background

With the development of new services and application modes such as cloud computing, mobile internet, video and the like, the development and progress of the optical communication technology become increasingly important. In the optical communication technology, an optical module is a tool for realizing the interconversion of optical signals and is one of key devices in optical communication equipment, and the transmission rate of the optical module is continuously increased along with the development requirement of the optical communication technology.

The current packaging form of the optical module mainly includes a TO (Transistor-out) package and a COB (Chip on Board) package. In the COB package type optical module, the optical chip is arranged on the circuit board, the lens assembly is covered above the optical chip and connected with the optical fiber, and the lens assembly is used for changing an optical signal transmission optical path between the optical fiber and the optical chip. In order to change the optical path of the optical signal transmission, an optical filter is disposed on the lens assembly, and the optical filter is used for combining and splitting the optical signal. Therefore, in order to ensure the transmission stability of the optical signal between the optical fiber and the optical chip, the optical filter needs to be stably fixed on the lens assembly.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides an optical module, which facilitates the fixation of an optical filter on a lens assembly.

The application provides an optical module, includes: a circuit board;

the lens assembly is arranged on the circuit board and does not form a wrapping cavity body;

the optical chip is arranged in the packaging cavity and is electrically connected with the circuit board;

the optical filter is arranged on the lens component and combined with the lens component to establish optical connection with the optical chip and is used for changing the transmission direction of optical signals;

wherein: the top of the lens component comprises a first recess, a first optical surface, a second optical surface, a first mounting surface, a second mounting surface and a support table are arranged in the first recess, the first mounting surface and the second mounting surface are arranged on the side edges of the first optical surface and the second optical surface, the support table is arranged at the end part of the second optical surface, and grooves are respectively arranged at the bottom ends of the first mounting surface and the second mounting surface; the first mounting surface and the second mounting surface are connected with the reverse side and the transparent side of the optical filter, and the support table supports the side face of the optical filter.

In the optical module that this application provided, the top of lens subassembly includes first sunken, sets up first installation face, second installation face and brace table in the sunken, and the filter setting is on first installation face, second installation face and brace table to coordinate to support fixedly through first installation face, second installation face and brace table. Furthermore, in the optical module provided by the application, the optical filter can be connected with the first mounting surface and/or the second mounting surface through dispensing to fix the optical filter on the lens component, and meanwhile, glue is stored in the grooves formed in the bottom ends of the first mounting surface and the second mounting surface to prevent the glue from overflowing to the light transmission area of the optical filter or the second optical surface to influence the optical performance of the optical filter and the second optical surface. Therefore, the optical module that this application provided can be on the basis of guaranteeing light filter optical property, can also be convenient fix the light filter on the lens subassembly, guarantee yield and stability when the light filter passes through glue fixed simultaneously.

Drawings

In order to more clearly illustrate the technical solutions in the present disclosure, the drawings needed to be used in some embodiments of the present disclosure will be briefly described below, and it is apparent that the drawings in the following description are only drawings of some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art according to the drawings. Furthermore, the drawings in the following description may be regarded as schematic diagrams, and do not limit the actual size of products, the actual flow of methods, the actual timing of signals, and the like, involved in the embodiments of the present disclosure.

Fig. 1 is a connection diagram of an optical communication system according to some embodiments;

figure 2 is a block diagram of an optical network terminal provided in accordance with some embodiments;

FIG. 3 is a block diagram of a light module provided in accordance with some embodiments;

FIG. 4 is an exploded view of a light module provided in accordance with some embodiments;

fig. 5 is a schematic diagram of an internal structure of a light module according to some embodiments;

FIG. 6 is an exploded schematic view of an internal structure of a light module according to some embodiments;

FIG. 7 is a first schematic structural diagram of a lens assembly provided in accordance with some embodiments;

FIG. 8 is a cross-sectional view through a lens assembly according to some embodiments;

FIG. 9 is a second schematic structural diagram of a lens assembly according to some embodiments;

FIG. 10 is an exploded view of a lens assembly and a filter according to some embodiments;

FIG. 11 is a schematic view of an assembly of a lens assembly and an optical filter according to some embodiments;

FIG. 12 is a cross-sectional view of FIG. 11;

FIG. 13 is a first cross-sectional view of an internal structure of a light module provided in accordance with some embodiments;

fig. 14 is a second cross-sectional view of an internal structure of a light module according to some embodiments;

fig. 15 is a third cross-sectional view of the internal structure of a light module according to some embodiments.

Detailed Description

Technical solutions in some embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present disclosure, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments provided by the present disclosure belong to the protection scope of the present disclosure.

Unless the context requires otherwise, throughout the description and the claims, the term "comprise" and its other forms, such as the third person's singular form "comprising" and the present participle form "comprising" are to be interpreted in an open, inclusive sense, i.e. as "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" and the like are intended to indicate that a particular feature, structure, material, or characteristic associated with the embodiment or example is included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms are not necessarily referring to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be included in any suitable manner in any one or more embodiments or examples.

In the following, the terms "first", "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present disclosure, "a plurality" means two or more unless otherwise specified.

In describing some embodiments, expressions of "coupled" and "connected," along with their derivatives, may be used. For example, the term "connected" may be used in describing some embodiments to indicate that two or more elements are in direct physical or electrical contact with each other. As another example, some embodiments may be described using the term "coupled" to indicate that two or more elements are in direct physical or electrical contact. However, the terms "coupled" or "communicatively coupled" may also mean that two or more elements are not in direct contact with each other, but yet still co-operate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents herein.

"at least one of A, B and C" has the same meaning as "A, B or at least one of C", both including the following combination of A, B and C: a alone, B alone, C alone, a and B in combination, a and C in combination, B and C in combination, and A, B and C in combination.

"A and/or B" includes the following three combinations: a alone, B alone, and a combination of A and B.

The use of "adapted to" or "configured to" herein is meant to be an open and inclusive language that does not exclude devices adapted to or configured to perform additional tasks or steps.

As used herein, "about," "approximately," or "approximately" includes the stated values as well as average values that are within an acceptable range of deviation for the particular value, as determined by one of ordinary skill in the art in view of the measurement in question and the error associated with measurement of the particular quantity (i.e., the limitations of the measurement system).

In the optical communication technology, light is used to carry information to be transmitted, and an optical signal carrying the information is transmitted to information processing equipment such as a computer through information transmission equipment such as an optical fiber or an optical waveguide, so as to complete information transmission. Because the optical signal has the passive transmission characteristic when being transmitted through the optical fiber or the optical waveguide, the information transmission with low cost and low loss can be realized. Further, since a signal transmitted by an information transmission device such as an optical fiber or an optical waveguide is an optical signal and a signal that can be recognized and processed by an information processing device such as a computer is an electrical signal, it is necessary to perform interconversion between the electrical signal and the optical signal in order to establish an information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer.

The optical module realizes the function of interconversion between the optical signal and the electrical signal in the technical field of optical fiber communication. The optical module comprises an optical port and an electrical port, the optical module realizes optical communication with information transmission equipment such as optical fibers or optical waveguides and the like through the optical port, realizes electrical connection with an optical network terminal (such as an optical modem) through the electrical port, and the electrical connection is mainly used for realizing power supply, I2C signal transmission, data signal transmission, grounding and the like; the optical network terminal transmits the electric signal to the computer and other information processing equipment through a network cable or a wireless fidelity (Wi-Fi).

Fig. 1 is a connection diagram of an optical communication system according to some embodiments. As shown in fig. 1, the optical communication system mainly includes a remote server 1000, a local information processing device 2000, an optical network terminal 100, an optical module 200, an optical fiber 101, and a network cable 103;

one end of the optical fiber 101 is connected to the remote server 1000, and the other end is connected to the optical network terminal 100 through the optical module 200. The optical fiber itself can support long-distance signal transmission, for example, signal transmission of several kilometers (6 kilometers to 8 kilometers), on the basis of which if a repeater is used, ultra-long-distance transmission can be theoretically achieved. Therefore, in a typical optical communication system, the distance between the remote server 1000 and the optical network terminal 100 may be several kilometers, tens of kilometers, or hundreds of kilometers.

One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the optical network terminal 100. The local information processing apparatus 2000 may be any one or several of the following apparatuses: router, switch, computer, cell-phone, panel computer, TV set etc..

The physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing apparatus 2000 and the optical network terminal 100. The connection between the local information processing device 2000 and the remote server 1000 is completed by the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical module 200 and the optical network terminal 100.

The optical module 200 includes an optical port and an electrical port. The optical port is configured to connect with the optical fiber 101, so that the optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101; the electrical port is configured to be accessed into the optical network terminal 100, so that the optical module 200 establishes a bidirectional electrical signal connection with the optical network terminal 100. The optical module 200 converts an optical signal and an electrical signal to each other, so that a connection is established between the optical fiber 101 and the optical network terminal 100. For example, an optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input to the optical network terminal 100, and an electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and input to the optical fiber 101.

The optical network terminal 100 includes a housing (housing) having a substantially rectangular parallelepiped shape, and an optical module interface 102 and a network cable interface 104 provided on the housing. The optical module interface 102 is configured to access the optical module 200, so that the optical network terminal 100 establishes a bidirectional electrical signal connection with the optical module 200; the network cable interface 104 is configured to access the network cable 103 such that the optical network terminal 100 establishes a bi-directional electrical signal connection with the network cable 103. The optical module 200 is connected to the network cable 103 via the optical network terminal 100. For example, the optical network terminal 100 transmits an electrical signal from the optical module 200 to the network cable 103, and transmits a signal from the network cable 103 to the optical module 200, so that the optical network terminal 100 can monitor the operation of the optical module 200 as an upper computer of the optical module 200. The upper computer of the Optical module 200 may include an Optical Line Terminal (OLT) and the like in addition to the Optical network Terminal 100.

The remote server 1000 establishes a bidirectional signal transmission channel with the local information processing device 2000 through the optical fiber 101, the optical module 200, the optical network terminal 100, and the network cable 103.

Fig. 2 is a structural diagram of an optical network terminal according to some embodiments, and fig. 2 only shows a structure of the optical module 100 related to the optical module 200 in order to clearly show a connection relationship between the optical module 200 and the optical network terminal 100. As shown in fig. 2, the optical network terminal 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on a surface of the PCB circuit board 105, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access an electrical port of the optical module 200; the heat sink 107 has a projection such as a fin that increases a heat radiation area.

The optical module 200 is inserted into a cage 106 of the optical network terminal 100, the cage 106 holds the optical module 200, and heat generated by the optical module 200 is conducted to the cage 106 and then diffused by a heat sink 107. After the optical module 200 is inserted into the cage 106, an electrical port of the optical module 200 is connected to an electrical connector inside the cage 106, and thus the optical module 200 establishes a bidirectional electrical signal connection with the optical network terminal 100. Further, the optical port of the optical module 200 is connected to the optical fiber 101, and the optical module 200 establishes bidirectional electrical signal connection with the optical fiber 101.

Fig. 3 is a block diagram of a light module according to some embodiments, and fig. 4 is an exploded view of a light module according to some embodiments. As shown in fig. 3 and 4, the optical module 200 includes a housing, a circuit board 206 disposed in the housing, an unlocking member 203 disposed on the housing, and a lens assembly 300.

The shell comprises an upper shell 201 and a lower shell 202, wherein the upper shell 201 is covered on the lower shell 202 to form the shell with two

openings

204 and 205; the outer contour of the housing generally appears square.

In some embodiments of the present disclosure, the lower housing 202 includes a bottom plate and two lower side plates located at two sides of the bottom plate and disposed perpendicular to the bottom plate; the upper housing 201 includes a cover plate, and two upper side plates disposed on two sides of the cover plate and perpendicular to the cover plate, and is combined with the two side plates by two side walls to cover the upper housing 201 on the lower housing 202.

The direction of the connecting line of the two

openings

204 and 205 may be the same as the length direction of the optical module 200, or may not be the same as the length direction of the optical module 200. For example, the opening 204 is located at an end (right end in fig. 3) of the optical module 200, and the opening 205 is also located at an end (left end in fig. 3) of the optical module 200. Alternatively, the opening 204 is located at an end of the optical module 200, and the opening 205 is located at a side of the optical module 200. Wherein, the opening 204 is an electrical port, and a gold finger of the circuit board 206 extends out from the electrical port 204 and is inserted into an upper computer (such as the optical network terminal 100); the opening 205 is an optical port configured to access the external optical fiber 101, so that the optical fiber 101 is connected to the lens assembly 300 inside the optical module 200.

The upper shell 201 and the lower shell 202 are combined in an assembly mode, so that devices such as the circuit board 206 and the optical transceiver device can be conveniently installed in the shells, and the upper shell 201 and the lower shell 202 can form packaging protection for the devices. In addition, when the devices such as the circuit board 206 and the like are assembled, the positioning components, the heat dissipation components and the electromagnetic shielding components of the devices are convenient to arrange, and the automatic implementation production is facilitated.

In some embodiments, the upper housing 201 and the lower housing 202 are generally made of a metal material, which is beneficial to achieve electromagnetic shielding and heat dissipation.

In some embodiments, the optical module 200 further includes an unlocking component 203 located on an outer wall of a housing thereof, and the unlocking component 203 is configured to realize a fixed connection between the optical module 200 and an upper computer or release the fixed connection between the optical module 200 and the upper computer.

Illustratively, the unlocking members 203 are located on the outer walls of the two lower side plates of the lower housing 202, and include snap-fit members that mate with a cage of an upper computer (e.g., the cage 106 of the optical network terminal 100). When the optical module 200 is inserted into the cage of the upper computer, the optical module 200 is fixed in the cage of the upper computer by the engaging member of the unlocking member 203; when the unlocking member 203 is pulled, the engaging member of the unlocking member 203 moves along with it, and the connection relationship between the engaging member and the upper computer is changed to release the engagement relationship between the optical module 200 and the upper computer, so that the optical module 200 can be drawn out from the cage of the upper computer.

The circuit board 300 includes circuit traces, electronic components, and chips, and the electronic components and the chips are connected together by the circuit traces according to a circuit design to implement functions of power supply, electrical signal transmission, grounding, and the like. The electronic components may include, for example, capacitors, resistors, transistors, Metal-Oxide-Semiconductor Field-Effect transistors (MOSFETs). The chip may include, for example, a Micro Controller Unit (MCU), a Transimpedance Amplifier (TIA), a Clock and Data Recovery (CDR), a power management chip, and a Digital Signal Processing (DSP) chip.

The circuit board 206 is generally a rigid circuit board, which can also perform a load-bearing function due to its relatively rigid material, for example, the rigid circuit board can stably bear a chip; the rigid circuit board can also be inserted into an electric connector in the cage of the upper computer.

The circuit board 206 further includes a gold finger formed on an end surface thereof, the gold finger being composed of a plurality of pins independent of each other. The circuit board 206 is inserted into the cage 106 and electrically connected to the electrical connectors in the cage 106 by gold fingers. The gold fingers may be disposed on only one side of the circuit board 206 (e.g., the top surface shown in fig. 4), or may be disposed on both sides of the circuit board 206 to meet the requirement of a large number of pins. The golden finger is configured to establish an electrical connection with the upper computer to achieve power supply, grounding, I2C signal transmission, data signal transmission and the like. Of course, a flexible circuit board is also used in some optical modules. Flexible circuit boards are commonly used in conjunction with rigid circuit boards to supplement the rigid circuit boards.

In this embodiment, the lens assembly 300 is disposed on the circuit board 206, and is covered above the optical chip (the optical chip includes one or two of a light emitting chip and a light receiving chip, and may further include a driving chip, a transimpedance amplifier chip, an amplitude limiting amplifier chip, and other chips related to a photoelectric conversion function) in a cover-and-lock manner, the lens assembly 300 and the circuit board 206 form a cavity for wrapping the optical chip, and the lens assembly 300 and the circuit board 206 form a structure for packaging the optical chip together, so that the lens assembly 300 has an effect of sealing the optical chip.

In some embodiments of the present application, the lens assembly 300 is connected to the fiber optic adapter 207 via the optical fiber 2071, and the optical connection between the optical fiber 2071 and the optical chip is established via the lens assembly 300. Illustratively, the optical signal generated by the light emitting chip is reflected by the lens assembly 300 to change the direction and then transmitted to the optical fiber 2071, and the optical signal from the optical fiber 2071 is reflected by the lens assembly 300 to change the direction and then transmitted to the light receiving chip. Of course, the embodiments of the present application are not limited to the connection of the fiber optic adapter 207 via the optical fiber 2071, and the line adapter 207 may also be connected via a fiber array.

Lens assembly 300 may be integrally formed from a polymer material using an injection molding process. Specifically, the lens assembly 400 is made of a material having a high light transmittance, such as PEI (Polyetherimide) plastic (Ultem series). Because all of the beam spreading elements in lens assembly 300 are formed from the same single sheet of polymer material, the number of molding dies and manufacturing costs and complexity can be significantly reduced. Meanwhile, the lens assembly 300 structure provided in the embodiment of the present application only needs to adjust the positions of the incident light beam and the optical fiber, and is simple to install and debug.

In some embodiments of the present application, the optical module 200 includes a lens assembly 300, the lens assembly 300 covers a light emitting chip and a light receiving chip, and the lens assembly 300 respectively implements transmission of optical signals between the light emitting chip and the optical fiber 2071 and transmission of optical signals between the light receiving chip and the optical fiber 2071.

In some embodiments of the present application, two lens assemblies 300 are included in the optical module, and the transmission and reception of the two optical signals with different wavelengths are realized through the two lens assemblies 300, although the embodiments of the present application are not limited to one or two lens assemblies 300. The following mainly takes the optical module to transmit and receive two optical signals with different wavelengths as an example to describe in detail the optical module provided in the present application.

Fig. 5 is a schematic diagram of an internal structure of an optical module according to some embodiments. As shown in fig. 5, two lens assemblies 300 are disposed on the circuit board 206, each lens assembly 300 is connected to a corresponding optical fiber adapter 207 through a corresponding optical fiber 2071, and then optical connection with an external optical fiber is achieved through the optical fiber adapter 207, so as to achieve transmission of optical signals between the lens assembly 300 and the external optical fiber.

In some embodiments, as shown in fig. 5, two lens assemblies 300 are disposed side-by-side on circuit board 206, with two lens assemblies 300 being disposed side-by-side along the width of circuit board 206; each of which can generate an optical signal and receive an optical signal, or one of which is used for generating an optical signal and the other is used for receiving an optical signal, and the specific requirements can be selected according to actual needs.

In some embodiments of the present application, to facilitate the connection of the optical fiber 2071 and the lens assembly 300, an optical fiber connector 2072 is disposed at an end of the optical fiber 2071, and the lens assembly 300 is connected through the optical fiber connector 2072.

Fig. 6 is an exploded schematic view of an internal structure of an optical module according to some embodiments. As shown in fig. 6, the optical filter 400 is disposed on the lens assembly 300, and the lens assembly 300 and the optical filter 400 are used in cooperation to change the transmission direction of the optical signal, so as to realize the transmission of the optical signal between the optical chip and the optical fiber 2071. The optical filter 400 selectively reflects or transmits the optical signal according to the wavelength of the optical signal.

As shown in fig. 6, the optical chip 500 is disposed on the circuit board 206, the optical chip 500 is electrically connected to the circuit board 206, and the lens assembly 300 carrying the optical filter 400 is disposed on the optical chip 500; the optical chip 500 may include a light emitting chip and/or a light receiving chip, etc., and the lens assembly 300 in combination with the optical filter 400 may enable transmission of an optical signal generated by the light emitting chip into the optical fiber 2071 and/or transmission of an optical signal in the optical fiber 2071 to the light receiving chip. In some embodiments of the present application, a transimpedance amplifier or the like is further disposed below the lens assembly 300, so as to fully utilize the space below the lens assembly 300 and relatively reduce the distance between the transimpedance amplifier or the like and the light receiving chip.

Fig. 7 is a first schematic structural view of a lens assembly provided in accordance with some embodiments, and fig. 8 is a cross-sectional view through a lens assembly in accordance with some embodiments. As shown in fig. 7 and 8, in some examples of the present application, a first recess 301 is disposed at the top of the lens assembly 300, the first recess 301 is used for assembling the optical filter 400, the lens assembly 300 is used for assembling the optical filter 400 through the first recess 301 so as to protect the optical filter 400, and the optical filter 400 is obliquely disposed in the first recess 301 of the lens assembly 300.

A first optical surface 302 and a second optical surface 303 are formed in the first recess 301, the first optical surface 302 is located at a side of the first recess 301, the second optical surface 303 is located at a bottom of the first recess 301 and below the optical filter 400, and the first optical surface 302 and the second optical surface 303 are used for transmitting optical signals. In some embodiments of the present disclosure, the optical signal from the optical fiber 2071 is transmitted to the optical filter 400 through the first optical surface 302, wherein the optical signal reflected by the optical filter 400 is reflected by the optical filter 400 to the second optical surface 303, and the second optical surface 303 can transmit the optical signal reflected by the optical filter 400; in addition, when the optical signal generated by the light emitting chip in the optical chip 500 is transmitted to the second optical surface 303, the optical signal transmitted through the second optical surface 303 is transmitted to the optical filter 400, the optical signal reflected by the optical filter 400 is transmitted to the first optical surface 302, and finally, the optical signal is transmitted to the direction of the optical fiber 2071 through the first optical surface 302.

In some embodiments of the present application, a third optical surface 304 and a fourth optical surface 305 are formed in the first recess 301, and the third optical surface 304 and the fourth optical surface 305 are located on a side of the second optical surface 303 away from the first optical surface 301; the third optical surface 304 is for transmitting optical signals and the fourth optical surface 305 is for reflecting optical signals. In some embodiments, third optical surface 304 is used to adjust the direction of propagation of the optical signal by refraction to facilitate efficient reflection of the optical signal by fourth optical surface 305; alternatively, the transmission direction of the light signal reflected by the fourth optical surface 305 is adjusted. In some embodiments of the present disclosure, the optical signal transmitted through the filter 400 is transmitted to the third optical surface 304, transmitted to the fourth optical surface 305 through the third optical surface 304, and then reflected by the fourth optical surface 305; in addition, when the optical signal generated by the light emitting chip in the optical chip 500 is transmitted to the fourth optical surface 305, reflected by the fourth optical surface 305, transmitted to the third optical surface 304, and transmitted to the optical filter 400 through the third optical surface 304.

In some embodiments of the present application, a first mounting surface 306 and a second mounting surface 307 are further disposed in the first recess 301, the first mounting surface 306 is disposed on one side of the second optical surface 303, the second mounting surface 307 is disposed on the other side of the second optical surface 303, and the first mounting surface 306 and the second mounting surface 307 are used for mounting and fixing the optical filter 400, so as to facilitate fixing of the optical filter 400; the first mounting surface 306 and the second mounting surface 307 are both inclined surfaces, which facilitates the optical filter to be obliquely arranged in the first recess 301. Further, a support table 308 is disposed in the first recess 301, the support table 308 is disposed on a side surface of an end portion of the second optical surface 302, and the support table 308 is used for supporting the optical filter 400, so as to improve fixing reliability of the optical filter 400.

In some embodiments of the present application, the optical filter 400 may be fixed by dispensing, so as to adhere the optical filter 400 in the first recess 301 of the lens assembly 300 by glue, for example, the optical filter 400 is fixedly connected to the first mounting surface 306 or the second mounting surface 307 by dispensing. Illustratively, the optical filter 400 is connected to the first mounting surface 306 and the second mounting surface 307 by dispensing, and the supporting table 308 supports the side of the optical filter 400.

The optical filter 400 is generally a thin sheet-like cubic structure, and the top and bottom surfaces of the cube are the main optical surfaces for transmitting and reflecting light, so that the first mounting surface 306 and the second mounting surface 307 are glued and connected to the top or bottom surface of the cube. In some embodiments of the present disclosure, in order to prevent the filter 400 or the second optical surface 303 from being contaminated by the overflow glue during the dispensing and fixing of the filter 400, the bottom ends of the first mounting surface 306 and the second mounting surface 307 are provided with the grooves 309, and the overflow glue of the first mounting surface 306 and the second mounting surface 307 flows into the corresponding grooves 309 along the inclined directions of the first mounting surface 306 and the second mounting surface 307, so as to ensure the safety of the filter 400 and ensure the yield and stability of the filter 400 during the dispensing and fixing.

In some embodiments of the present application, the extension length of the support stage 308 in the width direction of the lens assembly 300 is smaller than the width of the first recess 301 in the width direction of the lens assembly 300, so that the support stage 308 and the sidewall of the first recess 301 may form a groove. Illustratively, one end of the supporting platform 308 extends to the bottom end of the first mounting surface 306, and the other end of the supporting platform 308 extends to the bottom end of the second mounting surface 307, so that the supporting platform 308 and the sidewall of the first recess 301 form a groove 309, respectively. Grooves 309 are provided at both ends of support platform 308 to ensure that grooves 309 can sufficiently store and receive flash flowing down first mounting surface 306 and second mounting surface 307.

In some embodiments of the present application, the support table 308 includes a support surface 3081, and the support surface 3081 supports the side of the filter 400. Further, the supporting surface 3081 is perpendicular to the first mounting surface 306 and the second mounting surface 307, so as to ensure that the side surface of the optical filter 400 is fully contacted with the supporting surface 3081, and further, the supporting surface 3081 fully supports the side surface of the optical filter 400 to ensure the mounting reliability of the optical filter 400.

In some embodiments of the present application, the bottom of the supporting platform 308 is connected to the third optical surface 304, so as to reduce the constraint of the third optical surface 304 caused by the filter 400 supported by the third optical surface 304 in some conventional schemes, and further facilitate the setting and using of the third optical surface 304.

Fig. 9 is a second schematic structural diagram of a lens assembly according to some embodiments. As shown in fig. 8 and 9, in one embodiment of the present application, a second recess 310 is disposed at the bottom of the lens assembly 300, and the second recess 310 facilitates avoiding the optical chip 500 disposed below the lens assembly 300. When the lens assembly 300 is disposed on the circuit board 206, the second recess 310 forms a receiving cavity between the lens assembly 300 and the circuit board 206, and the optical chip 500 is located in the receiving cavity.

In some embodiments of the present application, a first lens 311 is disposed in the second recess 310, and the first lens 311 is used for converging or collimating an optical signal; the number of the first lenses 311 is not exclusive, and may be specifically selected according to the number of the light emitting chips and the light receiving chips covered under the lens assembly 300, for example, one light emitting chip and one light receiving chip covered under the lens assembly 300, and two first lenses 311 are disposed in the second recess 310. For example, the first lens 311 may be formed by protruding the bottom side of the second recess 310, and the focal point of the first lens 311 is located on the corresponding optical chip 500.

In some embodiments, to facilitate the lens assembly 300 to connect the optical fiber connector 2072, the lens assembly 300 is provided with an optical fiber connector connection 312 to connect the optical fiber connector 2072 through the optical fiber connector connection 312. Further, a second lens 313 is disposed in the optical fiber joint connection portion 312, and the second lens 313 is used for collimating or focusing the transmitted optical signal, so as to improve the optical signal coupling efficiency between the lens assembly 300 and the optical fiber 2071. For example, the second lens 313 may be formed by protruding an inner sidewall of the optical fiber connector connection portion 312.

In some embodiments of the present application, lens assembly 300 may be formed by injection molding, so to ensure the quality of injection molding of lens assembly 300, a wall thickness adjusting cavity 314 is further disposed in the second recess, and the wall thickness adjusting cavity 314 is used to equalize the thickness of lens assembly 300 at various places, so as to avoid cooling shrinkage unevenness caused by too large difference in wall thickness of lens assembly 300 at various places during injection molding process, which affects the quality of molding of lens assembly 300.

Fig. 10 is an exploded view of a lens assembly and a filter according to some embodiments, fig. 11 is an assembled view of a lens assembly and a filter according to some embodiments, and fig. 12 is a cross-sectional view of fig. 11. As shown in fig. 10-12, the first mounting surface 306, the second mounting surface 307, and the support table 308 support and fix the optical filter 400 such that the optical filter 400 is inclined toward the front end of the lens assembly 300; the first mounting surface 306 and the second mounting surface 307 are connected to a transflective surface 401 of the filter 400, the supporting table 308 supports a side surface of the filter 400, and a transmission surface 402 of the filter 400 is located on the back surface of the transflective surface 401. In some embodiments of the present application, the filter 400 is provided with the first lens 311 in the projection coverage area of the bottom of the lens assembly 300, and the fourth optical surface 305 is provided with the first lens 311 in the projection coverage area of the bottom of the lens assembly 300.

In some embodiments of the present application, the first optical surface 302 and the second optical surface 303 are both slightly inclined, and the inclination angle may be 3 to 8 °, that is, the first optical surface 302 is not perpendicular to the optical axis of the second lens 313, and the second optical surface 303 is not parallel to the optical axis of the second lens 313, which helps to prevent the light reflected by the filter from returning back to the original path.

Fig. 13 is a cross-sectional view of an internal structure of an optical module according to some embodiments, and fig. 13 shows a use state of an optical transceiver. As shown in fig. 13, the optical chip 500 includes a light emitting chip 501 and a light receiving chip 502, the light emitting chip 501 and the light receiving chip 502 are mounted on the circuit board 206, the light emitting chip 501 is disposed on the left side of the light receiving chip 502, and the arrow therein is used to identify the optical path therein. The optical signal generated by the light emitting chip 501 is transmitted to the first lens 311 on the left side, is collimated and transmitted to the second optical surface 303 through the first lens 311, is transmitted to the reverse side 401 of the optical filter 400 through the second optical surface 303, is reflected and transmitted to the first optical surface 302 through the reverse side 401, is transmitted to the second lens 313 through the first optical surface 302, is focused and transmitted to the optical fiber connector connecting part 312 through the second lens 313, and is coupled into the optical fiber at the optical fiber connector connecting part 312. The optical signal transmitted to the optical fiber connector 312 through the optical fiber is transmitted to the second lens 313, collimated and transmitted to the first optical surface 302 through the second lens 313, transmitted to the reverse transparent surface 401 of the second lens 313 through the first optical surface 302, transmitted to the transmission surface 402 through the reverse transparent surface 401, transmitted to the third optical surface 304 through the transmission surface 402 and transmitted to the fourth optical surface 305 through the third optical surface 304, reflected and transmitted to the first lens 311 on the right side through the fourth optical surface 305, and focused and transmitted to the light receiving chip 502 through the first lens 311. The embodiment shown in fig. 13 can realize the single-fiber bidirectional transmission function of the optical module.

Fig. 14 is a second cross-sectional view of an internal structure of an optical module according to some embodiments, and fig. 14 shows another usage state of the optical transceiver. As shown in fig. 14, the optical chip 500 includes a first light emitting chip 503 and a second light emitting chip 504, the first light emitting chip 503 and the second light emitting chip 504 are mounted on the circuit board 206, the first light emitting chip 503 is disposed on the left side of the second light emitting chip 504, and an arrow therein is used to identify a light path therein. The first transmitting chip 503 generates an optical signal of the first wavelength, and a transmission path of the optical signal may refer to a transmission path of the optical signal generated by the optical transmitting chip 501 in fig. 13. The second light emitting chip 504 generates an optical signal with a second wavelength, the optical signal is transmitted to the first lens 311 on the right side, is transmitted to the fourth optical surface 305 through the first lens 311 in a collimated manner, is transmitted to the third optical surface 304 through the fourth optical surface 305 in a reflected manner, is transmitted to the optical filter 400 through the third optical surface 304, is transmitted to the first optical surface 302 through the transmission surface 402 and the reverse transmission surface 401 in sequence, is transmitted to the second lens 313 through the first optical surface 302, is transmitted to the optical fiber connector 312 through the second lens 313 in a focused manner, and is coupled into an optical fiber at the optical fiber connector 312. Therefore, as shown in fig. 14, the optical filter 400 can combine the optical signal generated by the first light emitting chip 503 and the optical signal generated by the second light emitting chip 504.

Fig. 15 is a third cross-sectional view of an internal structure of an optical module according to some embodiments, and fig. 15 shows a further usage state of the optical transceiver. As shown in fig. 15, the optical chip 500 includes a first light receiving chip 505 and a second light receiving chip 506, the first light receiving chip 505 and the second light receiving chip 506 are mounted on the circuit board 206, the first light receiving chip 505 is disposed on the left side of the second light receiving chip 505, and an arrow therein is used to identify an optical path therein. The optical signal with the first wavelength transmitted to the optical fiber connector connection portion 312 through the optical fiber is transmitted to the second lens 313, is collimated and transmitted to the first optical surface 302 through the second lens 313, is transmitted to the reverse transparent surface 401 of the second lens 313 through the first optical surface 302, is reflected and transmitted to the second optical surface 303 through the reverse transparent surface 401, is transmitted to the first lens 311 on the left side through the second optical surface 303, and is focused and transmitted to the first light receiving chip 505 through the first lens 311. The optical signal of the second wavelength transmitted to the optical fiber connector 312 through the optical fiber is transmitted to the second light receiving chip 506, and a transmission path of the optical signal of the second wavelength may refer to a transmission path of the optical signal received by the optical receiving chip 502 in fig. 13. Therefore, as shown in fig. 14, the optical filter 400 can perform beam splitting of the light signal to be received by the first light-receiving chip 505 and the light signal to be received by the second light-receiving chip 506.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.

Claims

1. A light module, comprising:

a circuit board;

2. The optical module as claimed in claim 1, wherein one end of the supporting stage extends to a bottom end of the first mounting surface, the other end of the supporting stage extends to a bottom end of the second mounting surface, and the grooves are provided at both ends of the supporting stage; and the transmission back surface of the optical filter is connected with the first mounting surface and the second mounting surface through dispensing.

3. The optical module of claim 1, wherein the support stage comprises a support surface, the first and second mounting surfaces each being perpendicular to the support surface;

the projection of the optical filter in the bottom direction of the lens component covers the second optical surface; the first recess is further internally provided with a third optical surface and a fourth optical surface, the third optical surface is arranged on one side, far away from the second optical surface, of the supporting table, the bottom of the supporting table is connected with the third optical surface, and the fourth optical surface is used for reflecting optical signals.

4. The optical module of claim 1, wherein an extension length of the support stage in a width direction of the lens assembly is smaller than a width of the first recess in the width direction of the lens assembly.

5. The optical module of claim 1, wherein the bottom of the lens assembly comprises a second recess, a first lens is disposed in the second recess, the second recess forms a package cavity with the circuit board, and a projection of the first lens on the circuit board is located on the optical chip.

6. The optical module of claim 3, wherein the optical chip comprises a light emitting chip and a light receiving chip, a projection of the optical filter on the circuit board covers the light emitting chip, and a projection of the fourth optical surface in the direction of the circuit board covers the light receiving chip.

7. The optical module of claim 3, wherein the optical chip comprises a first light emitting chip and a second light emitting chip, a projection of the optical filter on the circuit board covers the first light emitting chip, and a projection of the fourth optical surface in the direction of the circuit board covers the second light emitting chip.

8. The optical module according to claim 3, wherein the optical chip includes a first light-receiving chip and a second light-receiving chip, a projection of the optical filter on the circuit board covers the first light-receiving chip, and a projection of the fourth optical surface in the direction of the circuit board covers the second light-receiving chip.

9. The optical module of claim 5, wherein the second recess includes a wall thickness adjustment cavity therein for equalizing thickness throughout the lens assembly.

10. The optical module of claim 1, further comprising a fiber optic adapter optically connecting the lens assembly sequentially via an optical fiber and an optical fiber connector, the optical fiber connector connecting the lens assembly;

the lens component is provided with an optical fiber connector connecting part, the optical fiber connecting part is connected with the optical fiber connector, and a lens is arranged in the optical fiber connector connecting part.