CN201408276Y - Multi-path parallel optical component - Google Patents

Multi-path parallel optical component Download PDF

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Publication number
CN201408276Y
CN201408276Y CN2009200267036U CN200920026703U CN201408276Y CN 201408276 Y CN201408276 Y CN 201408276Y CN 2009200267036 U CN2009200267036 U CN 2009200267036U CN 200920026703 U CN200920026703 U CN 200920026703U CN 201408276 Y CN201408276 Y CN 201408276Y
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China
Prior art keywords
optical
multidiameter delay
array
optical assembly
optical device
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Expired - Lifetime
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CN2009200267036U
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Chinese (zh)
Inventor
姜瑜斐
冯璐
张海祥
陈广文
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China Aviation Haixin Optical-Electrical Technology Co., Ltd.
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Hisense Broadband Multimedia Technology Co Ltd
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Abstract

The utility model discloses a multi-path parallel optical component which comprises a circuit board, a base plate and an optical fiber component; wherein an optical device for sending or receiving optical signals is fixed on the base plate, the optical fiber component is provided with tail optical fibers and an optical interface, the optical device is a laser array comprising at least two laser devices or an array detector comprising at least two photo detectors; the tail optical fibers are an optical fiber array coupled with the optical device, one end of the optical fiber array is coupled with the optical device, and the other end thereof is connected with the optical interface. Through the coupling between the laser array or the array detector and the optical fiber array, the sending orreceiving of multi-path parallel signals can be realized; besides, the volume of the optical component is small, the cost is low, and the assembly is simple, therefore, the demand of the market on the transmission of high band-width multi-path parallel signals can be met.

Description

The multidiameter delay optical assembly
Technical field
The utility model relates to a kind of optical assembly, specifically, relates to a kind of optical assembly that is used for emission of multidiameter delay light or light-receiving, belongs to the optical communication technique field.
Background technology
Be accompanied by digitized process, the processing of data, storage and transmission have obtained development at full speed, and the demand of high bandwidth makes that short distance is interconnected and become the bottleneck of system development.The bandwidth that provided of the optical module product based on the single channel optical assembly basis of Shi Yonging has influenced user's demand and experience in the market, can not satisfy people's more clear and other transmission data requirements faster to vision signal well.For realizing high bandwidth requirements, transmission requirement for multidiameter delay, existing scheme can only adopt the optical fiber of a plurality of separation to form system with a plurality of optical devices that separate, but the system bulk of collocation is big like this, cost is high, assembling is difficult, has been difficult to satisfy growing demand.
Summary of the invention
The purpose of this utility model just is to overcome above-mentioned shortcoming and defect, and a kind of multidiameter delay optical assembly is provided, and realizes the parallel emission or the parallel receive of multipath light signal, meets the need of market.
For solving the problems of the technologies described above, the utility model is achieved by the following technical solutions:
A kind of multidiameter delay optical assembly, comprise circuit board, substrate and optical fiber component, be fixed with on the described substrate and be used to the optical device launching light signal or be used for receiving optical signals, described optical fiber component has tail optical fiber and optical interface, it is characterized in that described optical device is the detector array that comprises the laser array of two laser instruments at least or comprise two photodetectors at least; Described tail optical fiber is the fiber array that is coupled with described optical device, and described fiber array one end and described optical device are coupled, and the other end is connected with described optical interface.
According to the utility model, described optical device is directly aimed at coupling scheme with described fiber array employing and is coupled.
According to the utility model, have bonding welding pad on the described circuit board, described optical device adopts lead key closing process to be connected with described bonding welding pad; Described lead-in wire adopts a kind of in gold thread or the aluminum steel.
According to the utility model, described optical interface is any one in MT attachment plug, MPO attachment plug or the LC attachment plug.
According to the utility model, have electrical interface on the described circuit board, described electrical interface is a kind of in golden finger plug form or the direct welding manner of pad.
According to the utility model, for strengthening the heat dispersion of optical assembly, described substrate selects for use metal or pottery to make.
According to the utility model, described circuit board can adopt any one in flexible PCB or the hard and soft mixed plate, so that bending.
According to the utility model, for ease of fixing, the end that described fiber array and described optical device are coupled is fixed on the described substrate by fixed mount, and described fixed mount preferably adopts metal or stupalith to make, with the heat dispersion of enhancing optical assembly.
Compared with prior art, advantage of the present utility model and good effect are:
1, the optical device in the optical assembly is to include the laser array of a plurality of laser instruments or the detector array of a plurality of photodetectors, coupling by laser array or detector array and fiber array, can realize multidiameter delay optical signal transmitting or reception, and the optical assembly volume is little, cost is low, assembling is simple, can satisfy market to high bandwidth multi-path parallel signal transmission requirements.
2, optical assembly adopts emission and reception to separate making, both can match use, finish the transceiver transmission of light signal, can only use wherein emitting module or receiving unit according to different situations again, satisfy user's different request for utilizations well, thereby reduced the manufacture difficulty of optical assembly and saved cost.
3, optical device and fiber array adopt and directly aim at coupling scheme and be coupled, and have avoided the drawback that needs gyration to be coupled, have improved coupling efficiency.
4, use the optical interface attachment plug of standard to be connected, increased the dirigibility of connection and the convenience of dismounting with external devices, make optical assembly manufacturing and keep in repair convenient; Electrical interface can adopt golden finger, supports hot plug, has increased the dirigibility of using, and also can adopt the direct welding manner of pad to connect, and has guaranteed the stability of high speed signal effectively.
Description of drawings
Fig. 1 is the structural drawing of an embodiment of the utility model multidiameter delay optical assembly;
Fig. 2 is optical device and a circuit board bonding synoptic diagram in the multidiameter delay optical assembly shown in Figure 1;
Fig. 3 is optical device and a fiber array coupling synoptic diagram in the multidiameter delay optical assembly shown in Figure 1;
Fig. 4 is the fundamental diagram of multidiameter delay optical assembly when being light emission component;
Fig. 5 is the fundamental diagram of multidiameter delay optical assembly when being optical fiber receive module.
Among the figure, 1, circuit board; 11, golden finger; 12, bonding welding pad; 2, substrate; 3, fixed mount; 4, fiber array; 5, optical interface; 6, optical device; 7, lead-in wire.
Embodiment
Below in conjunction with accompanying drawing embodiment of the present utility model is described in detail.
Please refer to Fig. 1, Fig. 2 and shown in Figure 3, wherein, Fig. 1 is the structural drawing of an embodiment of the utility model multidiameter delay optical assembly, Fig. 2 is optical device and a circuit board bonding synoptic diagram in the described embodiment multidiameter delay optical assembly, and Fig. 3 then is optical device and a fiber array coupling synoptic diagram in the described embodiment multidiameter delay optical assembly.
In this embodiment, the multidiameter delay optical assembly comprises circuit board 1, substrate 2 and optical fiber component, and described optical fiber component comprises fiber array 4 and as the attachment plug 5 of optical assembly optical interface.Described fiber array 4 one ends are connected with described substrate 2 by fixed mount 3, and the other end is connected with described attachment plug 5.Described circuit board 1 one ends are fixed on the described substrate 2, have golden finger 11 at the other end of described circuit board 1.Described golden finger 11 is as the electrical interface that optical assembly is electrically connected with the system main circuit board, also adopt pad directly the mode of welding replace.Be fixed with optical device 6 on described substrate 2, described optical device 6 is coupled with described fiber array 4.Described optical device 6 can be the laser array that comprises 12 laser instruments, realizes 12 tunnel optical signal transmitting, can be the detector array that comprises 12 photodetectors also, realizes the reception of 12 road light signals.Described attachment plug 5 can be adopted standard light interface attachment plugs such as MT attachment plug, MPO attachment plug or LC attachment plug, with the dirigibility of increase connection and the convenience of dismounting.
Aspect the light path connection, described optical device 6 and described fiber array 4 adopt height accurately coupling cramp directly aim at coupling, as shown in Figure 3,, improve coupling efficiency to avoid the drawback of gyration coupling.Among Fig. 3, solid line represents that the light signal of laser array emission is coupled in the described fiber array 4, and dotted line represents that the described fiber array 4 of optical signals is coupled in the detector array.
At the circuit side connector face, described circuit board 1 can adopt flexible PCB or hard and soft mixed plate as required, so that the bending of circuit board.Have bonding welding pad 12 on the described circuit board 1, described bonding welding pad 12 adopts lead key closing process to be connected with described optical device 6, and described lead-in wire 7 can be selected gold thread or aluminum steel for use.
In this embodiment, for strengthening the heat dispersion of multidiameter delay optical assembly, described substrate 2 and described fixed mount 3 all adopt stupalith or metal material to make.
Fundamental diagram when Fig. 4 shows the multidiameter delay optical assembly and is light emission component, the optical device among this figure is the laser array that comprises 12 laser instruments, then the optical assembly of Gou Chenging is for realizing 12 tunnel parallel light emission components of 12 road parallel signals emission.The electric signal that need launch transfers in the laser instrument of laser array by the signal input terminal LDOUT0 to LDOUT11 of golden finger or pad, convert corresponding light signal to through laser instrument, and be coupled in the fiber array, and then export 12 the tunnel and traveling optical signal by connector.
Fundamental diagram when Fig. 5 shows the multidiameter delay optical assembly and is optical fiber receive module, the optical device among this figure is the detector array that comprises 12 photodetectors, then the 12 tunnel parallel optical fiber receive modules of the optical assembly of Gou Chenging for realizing that 12 road parallel signals receive.Outside 12 tunnel and traveling optical signal are received by fiber array by connector, and then 12 road light signals are coupled in the detector array, photodetector in detector array is converted to corresponding electric signal with 12 road light signals, and exports by the TIA-IN0 to TIA-IN11 of golden finger or pad.
Below in conjunction with Fig. 1, Fig. 2, Fig. 3 and Fig. 4, the assembling and the coupling process of 12 tunnel parallel light emission components described:
Optical device 6 that laser array is constituted and the described circuit board 1 with described golden finger 11 adopt technologies such as gluing or welding to be fixed on the relevant position of described substrate 2, and 12 paths are connected respectively with lead key closing process between described optical device 6 and the described bonding welding pad 12.Adopt adhesion process to be fixed on the described substrate 2 described fixed mount 3, the described substrate 2 that will be fixed with described optical device 6, described circuit board 1 and described fixed mount 3 then is respectively charged into high precision coupling frock with described fiber array 4.Described optical interface 5 bonds together before coupling with described fiber array 4, and has carried out end surface grinding.Described golden finger 11 is inserted power connectors (if electrical interface is a pad, directly optical assembly being welded on the power panel), simultaneously described optical interface 5 is connected with optical fiber on the power monitor by adapter.After powering on, 12 tunnel optical device 6 sends the light of 12 tunnel certain wavelength, by the anchor clamps coupling, 12 road light is coupled into respectively in the 12 tunnel corresponding described fiber arrays 4.Light after the coupling enters described power monitor by described fiber array 4 and described optical interface 5, after reaching needed luminous power, by described fixed mount 3 described fiber array 4 is fixed on the described substrate 2, finishes the assembling and the coupling of light emission component.
Below in conjunction with Fig. 1, Fig. 2, Fig. 3 and Fig. 5, the assembling and the coupling process of 12 tunnel parallel optical fiber receive modules described:
Optical device 6 that detector array is constituted and the described circuit board 1 with described golden finger 11 adopt technologies such as gluing or welding to be fixed on the relevant position of described substrate 2, and 12 paths are connected respectively with lead key closing process between described optical device 6 and the described bonding welding pad 12.Adopt adhesion process to be fixed on the described substrate 2 described fixed mount 3, the described substrate 2 that will be fixed with described optical device 6, described circuit board 1 and described fixed mount 3 then is respectively charged into high precision coupling frock with described fiber array 4.Described optical interface 5 bonds together before coupling with described fiber array 4, and has carried out end surface grinding.
Described golden finger (or pad) 11 is inserted power connector (if electrical interface is a pad, directly optical assembly being welded on the power panel), simultaneously described optical interface 5 is connected with the light source that can launch the light of certain wavelength by adapter.Light source is exported 12 road light signals to described fiber array 4, by the anchor clamps coupling, 12 road light signals is coupled into respectively to the window of optical device 6, and induces 12 tunnel photo-signals.Photo-signal after the coupling inputs in the described current detector, after reaching needed photocurrent, by described fixed mount 3 described fiber array 4 is fixed, and finishes the assembling and the coupling of optical fiber receive module.
Foregoing description is an example with 12 tunnel parallel light emission components or 12 tunnel parallel optical fiber receive modules all, but be not limited thereto, can be as required, select corresponding laser array or detector array and corresponding with it fiber array, constitute multidiameter delay optical assemblies such as 2 tunnel, 4 tunnel, 8 tunnel, 24 tunnel.
Certainly; the above only is a kind of preferred implementation of the present utility model; should be understood that; for those skilled in the art; under the prerequisite that does not break away from the utility model principle; can also make some improvements and modifications, these improvements and modifications also should be considered as protection domain of the present utility model.

Claims (10)

1, a kind of multidiameter delay optical assembly, comprise circuit board, substrate and optical fiber component, be fixed with on the described substrate and be used to the optical device launching light signal or be used for receiving optical signals, described optical fiber component has tail optical fiber and optical interface, it is characterized in that described optical device is the detector array that comprises the laser array of two laser instruments at least or comprise two photodetectors at least; Described tail optical fiber is the fiber array that is coupled with described optical device, and described fiber array one end and described optical device are coupled, and the other end is connected with described optical interface.
2, multidiameter delay optical assembly according to claim 1 is characterized in that, described optical device is directly aimed at coupling scheme with described fiber array employing and is coupled.
3, multidiameter delay optical assembly according to claim 1 is characterized in that, has bonding welding pad on the described circuit board, and described optical device adopts lead key closing process to be connected with described bonding welding pad.
4, multidiameter delay optical assembly according to claim 3 is characterized in that, described lead-in wire adopts a kind of in gold thread or the aluminum steel.
According to each described multidiameter delay optical assembly in the claim 1 to 4, it is characterized in that 5, described optical interface is any one in MT attachment plug, MPO attachment plug or the LC attachment plug.
6, according to each described multidiameter delay optical assembly in the claim 1 to 4, it is characterized in that having electrical interface on the described circuit board, described electrical interface is a kind of in golden finger plug form or the direct welding manner of pad.
7, according to each described multidiameter delay optical assembly in the claim 1 to 4, it is characterized in that the material of described substrate is metal or pottery.
According to each described multidiameter delay optical assembly in the claim 1 to 4, it is characterized in that 8, described circuit board adopts a kind of in flexible PCB or the hard and soft mixed plate.
9, multidiameter delay optical assembly according to claim 1 is characterized in that, the end that described fiber array and described optical device are coupled is fixed on the described substrate by fixed mount.
10, multidiameter delay optical assembly according to claim 8 is characterized in that, the material of described fixed mount is metal or pottery.
CN2009200267036U 2009-05-26 2009-05-26 Multi-path parallel optical component Expired - Lifetime CN201408276Y (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104767561A (en) * 2014-01-03 2015-07-08 上海光维通信技术股份有限公司 Multi-channel laser output device and testing device for MPO (Maximum Power Output) optical fiber connector
CN110391846A (en) * 2018-04-23 2019-10-29 海思光电子有限公司 Tunable laser device assembly

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104767561A (en) * 2014-01-03 2015-07-08 上海光维通信技术股份有限公司 Multi-channel laser output device and testing device for MPO (Maximum Power Output) optical fiber connector
CN110391846A (en) * 2018-04-23 2019-10-29 海思光电子有限公司 Tunable laser device assembly
WO2019205800A1 (en) * 2018-04-23 2019-10-31 华为技术有限公司 Tunable laser assembly
CN110391846B (en) * 2018-04-23 2021-01-12 海思光电子有限公司 Tunable laser assembly

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C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: CHINA AVIATION HISENSE OPTICAL-ELECTRICAL TECHNOLO

Free format text: FORMER OWNER: HISENSE BROADBAND MULTIMEDIA TECHNOLOGY

Effective date: 20120731

C41 Transfer of patent application or patent right or utility model
COR Change of bibliographic data

Free format text: CORRECT: ADDRESS; FROM: 266100 QINGDAO, SHANDONG PROVINCE TO: 266061 QINGDAO, SHANDONG PROVINCE

TR01 Transfer of patent right

Effective date of registration: 20120731

Address after: 266061, Laoshan District, Shandong, Qingdao Province North residential community branch north house Subdistrict Office

Patentee after: China Aviation Haixin Optical-Electrical Technology Co., Ltd.

Address before: 266100 Zhuzhou Road, Laoshan District, Shandong, No. 151, No.

Patentee before: Hisense Broadband Multimedia Technology

CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20100217