CN111313969B - Optical module - Google Patents

Optical module Download PDF

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Publication number
CN111313969B
CN111313969B CN201911259686.5A CN201911259686A CN111313969B CN 111313969 B CN111313969 B CN 111313969B CN 201911259686 A CN201911259686 A CN 201911259686A CN 111313969 B CN111313969 B CN 111313969B
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China
Prior art keywords
module
optical fiber
wave
optical
laser
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CN201911259686.5A
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CN111313969A (en
Inventor
梁付运
郑萌
汤金宽
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Yangtze Optical Fibre and Cable Co Ltd
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Yangtze Optical Fibre and Cable Co Ltd
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Priority to CN201911259686.5A priority Critical patent/CN111313969B/en
Publication of CN111313969A publication Critical patent/CN111313969A/en
Priority to PCT/CN2020/131835 priority patent/WO2021115129A1/en
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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B10/00Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/50Transmitters
    • H04B10/501Structural aspects
    • H04B10/503Laser transmitters
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B10/00Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/60Receivers

Abstract

The invention discloses an optical module, which belongs to the field of optical communication and comprises a multipath light emitting device and a multipath light receiving device, wherein a multipath transmitter assembly comprises a metal piece, the metal piece is adhered to a circuit board, elements such as a multipath laser, a PLC chip, a lens and the like are arranged on the metal piece, the laser is electrically connected with the circuit board through gold wire welding, the laser couples laser emitted by the corresponding laser into a port of the corresponding PLC chip through the lens positioned between the PLC chip and the laser, and the laser enters an optical fiber assembly after being combined and is input into an external optical fiber through an optical interface. The multiple-path light receiving device directly places the photodiodes and the transimpedance amplifier on the circuit board, external light signals enter the optical fiber assembly through the optical interface, are split by the optical splitter and then are reflected into the corresponding photodiodes to be received, and conversion from the light signals to electric signals is achieved. The components adopted by the package can be reduced, and the volume is reduced.

Description

Optical module
Technical Field
The invention belongs to the technical field of optical communication, and particularly relates to an optical module.
Background
In recent years, due to the development and application of access networks and data centers, more cost-effective and efficient ways to expand bandwidth are required to increase network capacity. Large scale connection point distribution and fiber optic cable densification according to conventional schemes is occurring. Each node requires an optical fiber for interconnection, so the demand of the optical fiber rises spirally, and the space and physical path for laying the optical fibers are limited.
In the prior art, a WDM system is usually adopted for solving the problem, but the prior WDM module adopts a free space implementation scheme, mainly uses parallel light to realize light separation and synthesis through multiple-path light band-pass film and multiple-time sheet reflection, and has poor light path stability caused by long light path, complex process and difficult production; or a small laser assembly TOSA is adopted, the AWG coupling FA array coupling assembly is adopted for light splitting, and the ceramic contact pin is used for being connected with the small TOSA, so that the size and space are large, and the fiber coiling is troublesome. The cost is also high.
Disclosure of Invention
In view of the above defects or improvement requirements of the prior art, the invention provides an optical module which has a simple structure, higher packaging density compared with the existing scheme, relatively simple and stable process, and more advantageous cost, and is beneficial to mass production.
To achieve the above object, the present invention provides an optical module including: a plurality of light emitting devices and a plurality of light receiving devices;
the multiplex light emitting device includes: the optical fiber coupling device comprises N lasers, N coupling lenses, a wave combination module, a first optical fiber connector and an output port;
the multipath light receiving device includes: the device comprises an input port, a second optical fiber connector, a wave division module and N photoelectric detection modules; wherein N is a positive integer;
the N lasers emit N paths of laser beams, the N paths of laser beams are coupled through N coupling lenses corresponding to the N lasers respectively and then enter the wave combining module, and the wave combining module converges the N paths of coupled laser beams into a beam of combined wave beams which then enter the output port through the first optical fiber connector;
the input port emits laser beams, the laser beams enter the wave division module through the second optical fiber connector, the wave division module divides waves into N paths of wave division beams and then enters the corresponding N waveguide ports, and the N paths of wave division beams respectively enter the photoelectric detection modules corresponding to the waveguide ports after passing through the N waveguide ports.
Preferably, the wave combining module and the wave splitting module are both implemented by PLC chips, and the first fiber connector and the second fiber connector are both implemented by fiber arrays FA.
Preferably, the laser wavelengths output by the N lasers are different.
Preferably, the N lasers are electrically connected with the PCBA through gold welding wires by thermosonic welding.
Preferably, the N lasers, the N coupling lenses, and the wave combining module are all disposed on the same metal carrier, the metal carrier is attached to the PCBA through a plane, and the PCBA includes a limiting structure thereon to limit the position of the metal carrier, so as to facilitate mounting and positioning of the metal carrier.
Preferably, the multipath light receiving device further includes: a transimpedance amplifier;
and the N paths of the wave-splitting light beams respectively pass through the N waveguide ports, enter the photoelectric detection module corresponding to each waveguide port, and are amplified by the trans-impedance amplifier and then output.
Preferably, the wave-splitting module and the N photoelectric detection modules are directly coupled; or, the end faces of the wave splitting module corresponding to the N photoelectric detection modules are made into preset angles, so that the N paths of wave splitting light beams are reflected into the photoelectric detection modules through the end faces.
Preferably, a plurality of positioning holes are formed at corresponding positions on the PCBA where the multiple light receiving devices are placed, and correspond to the positioning protrusions on the housing of the multiple light receiving devices.
Preferably, the first optical fiber connector is connected with the output port through a first optical fiber; the input port is connected with the second optical fiber connector through a second optical fiber.
In general, compared with the prior art, the above technical solution contemplated by the present invention can achieve the following beneficial effects: the optical module of the present invention includes a multiplex light emitting device and a multiplex light receiving device, the multiplex light emitting device including: the optical fiber coupling device comprises N lasers, N coupling lenses, a wave combination module, a first optical fiber connector and an output port; the multipath light receiving device includes: input port, second fiber connector, wavelength division module, N photoelectric detection module. The invention has simple structure and process, and because of direct integrated packaging, the required elements are less, and the cost is lower; and the light path is simple, the free light path is shorter, and the light path is more stable.
Drawings
FIG. 1 is a top view of an embodiment of the present invention after opening the outer lid;
fig. 2 is a top view of an optical module according to an embodiment of the present invention;
FIG. 3 is a side view of an embodiment of the present invention;
FIG. 4 is a diagram of a base structure according to an embodiment of the present invention;
FIG. 5 is a PCBA structure provided by the embodiments of the present invention;
FIG. 6 is a diagram illustrating an assembly of a base and a PCBA according to an embodiment of the present invention;
FIG. 7 is an electrical connection structure for a laser and a PCBA according to an embodiment of the present invention;
fig. 8 is a protective cover outside the receiving end according to an embodiment of the present invention;
the optical transceiver comprises a multi-path optical transmitter, a multi-path optical receiver, a multi-path optical transmitter, a multi-path optical receiver, a multi-path optical transmitter, a multi-path optical receiver, a multi-path optical transmitter, a multi-path optical receiver, a multi-path optical transmitter, a multi-path optical receiver, a multi-path optical transmitter, a multi-path optical receiver, a multi-path optical transmitter, a multi-path optical receiver, a multi-path optical transmitter, a multi-path optical receiver, a multi-path optical transmitter, a multi-path optical receiver, a multi-path optical transmitter.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
The invention adopts the optical waveguide PLC chip technology, the multipath light emitting device at the emitting end combines and couples the multipath laser into an optical fiber for transmission through the PLC chip, and the multipath light receiving device at the receiving end adopts the PLC to decompose the received multipath light signals and then transmit the light signals to the corresponding photodiode PD for reception.
An embodiment of the present invention provides an optical module, including: a plurality of light emitting devices and a plurality of light receiving devices;
the multiplex light emitting device includes: the optical fiber coupling device comprises N lasers, N coupling lenses, a wave combination module, a first optical fiber connector and an output port;
the multipath light receiving device includes: the device comprises an input port, a second optical fiber connector, a wave division module and N photoelectric detection modules; wherein N is a positive integer;
the N lasers emit N paths of laser beams, the N paths of laser beams are coupled through N coupling lenses corresponding to the N lasers respectively and then enter the wave combining module, and the wave combining module converges the N paths of coupled laser beams into a beam of combined beam, and then the beam of combined beam enters the output port through the first optical fiber connector;
the input port emits laser beams, the laser beams enter the wave splitting module through the second optical fiber connector, the wave splitting module splits the waves into N paths of wave splitting beams and then enters the corresponding N waveguide ports, and the N paths of wave splitting beams respectively enter the photoelectric detection modules corresponding to each waveguide port after passing through the N waveguide ports.
As shown in fig. 1, fig. 2 and fig. 3, wherein fig. 1 is a top view of an optical module provided in an embodiment of the present invention after an outer cover is opened, fig. 2 is a top view of the optical module provided in the embodiment of the present invention, fig. 3 is a side view provided in the embodiment of the present invention, it should be noted that the optical module illustrated in fig. 1, fig. 2 and fig. 3 is only an optional embodiment, and as shown in fig. 1, the optical module provided in the embodiment of the present invention includes: a plurality of light emitting devices and a plurality of light receiving devices;
the PCBA7 inputs 4 paths of driving signals into the 4 paths of lasers 6 through the PCBA electrical output interface 8, so that the lasers emit laser signals, electrical signals are converted into optical signals, the optical signals are coupled into input ports in one-to-one correspondence with the PLC chips 6 through corresponding coupling lenses 5 located between the lasers 6 and the PLC chips 4, the light entering the PLC chips 6 is coupled with FA2 after being combined by the PLC chips, and the light enters the optical fibers and is output through the receiving end 1.
The lasers usually have different wavelengths, for example, they may be 1270nm, 1290nm, 1311nm and 1331nm, and the laser 6, the coupling lens 5 and the PLC chip 4 in the embodiment of the present invention correspond to one channel.
As an alternative, the 4-way laser may be a separate laser or an array of 4-way lasers.
As an alternative embodiment, the coupling lens may be a single discrete lens or an array of 4 lenses.
In the embodiment of the invention, the coupling of the laser and the PLC chip shapes and converges the light emitted by the laser through the lens and then couples the light into the PLC chip, the optical coupling efficiency can be adjusted by selecting the type of the lens and adjusting the distance between the PLC and the laser, and the finally output optical power is controlled within a required range. The packaging density can be improved, the components used for packaging are reduced, the volume is reduced, and the cost is reduced.
As an alternative embodiment, the 4-way laser is connected electrically between the laser and the PCBA by a gold wire 18, as shown in fig. 7, using thermosonic bonding, to transmit electrical signals from the PCBA to the laser for conversion into optical signals.
In the embodiment of the present invention, the laser, the PLC, and the lens in the multiple light emitting device are all placed on the same metal carrier 3, as shown in fig. 5, the metal carrier 3 is attached to the PCBA7 through the metal carrier plane 3-3, and the 3-1 and 3-2 structures on the PCBA board can function to define the metal carrier, so as to facilitate the attachment and positioning of the metal carrier, specifically, the PCBA board has two symmetrical protrusion structures, each of which includes a groove 3-1 and a boss 3-2, and the groove 3-1 and the boss 3-2 are adjacent to each other, as shown in fig. 4, fig. 5, and fig. 6, so as to define the position of the PCBA when the PCBA and the metal carrier are attached together.
As shown in fig. 2 and 5, the 3-1 and 3-2 structures can also utilize the positioning surfaces on the front side and the side sides to define the position of the cover 17, so as to clamp the cover on the side of the multiple light emitting device on the metal carrier, thereby facilitating the positioning and installation of the cover.
As an alternative embodiment, the metal carrier may adopt a direct mounting structure, and may be mounted in batches automatically, which may improve production efficiency.
In the embodiment of the present invention, the multipath optical receiving device couples the multipath laser signal into the demodulated receiving-end PLC chip 12 through the receiving end 15 and through the optical fiber and the FA14, where the FA14 is located on the FA avoiding hole 13 of the PCBA for receiving the PLC, the receiving-end PLC chip 12 separates the received multipath laser signal and inputs the separated laser signal into the corresponding waveguide port, each output port corresponds to one path of photodiode PD 11, receives the corresponding optical signal, converts the received optical signal into an electrical signal, and then amplifies the electrical signal by the trans-impedance amplifier (TIA) 10 and outputs the electrical signal.
As an alternative embodiment, a direct coupling mode is usually adopted between the demodulated PLC chip 12 and the received photodiode 11, and the outgoing signal light is directly irradiated or irradiated into the PD in a form of end surface reflection by grinding the PLC chip 12 and the end surface corresponding to the photodiode 11 to a certain angle.
The angle can be determined according to actual needs, generally the angle is about 41 degrees, and the specific angle is not limited uniquely in the embodiment of the present invention.
In the embodiment of the invention, as shown in fig. 8, two positioning holes 9 are formed in the PCBA in the area where the multipath light receiving device is placed, and correspond to the positioning protrusions 16-1 on the housing 16 of the multipath light receiving device, so as to position the housing of the multipath light receiving device, thereby facilitating positioning and installation.
As an alternative embodiment, the housings of the multiple light emitting devices and the multiple light receiving devices can also be mounted by using an automatic mounting device, so that the production efficiency is improved.
In the embodiment of the invention, the FA adopted by the multipath light emitting device and the multipath light receiving device adopts a straight-out optical fiber form, so that a complicated fiber coiling process is avoided, and the production efficiency can be too high.
It should be noted that, according to the implementation requirement, each step/component described in the present application can be divided into more steps/components, and two or more steps/components or partial operations of the steps/components can be combined into new steps/components to achieve the purpose of the present invention.
It will be understood by those skilled in the art that the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the invention, and that any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the present invention.

Claims (7)

1. A light module, comprising: a plurality of light emitting devices and a plurality of light receiving devices;
the multiplex light emitting device includes: the optical fiber coupling device comprises N lasers, N coupling lenses, a wave combination module, a first optical fiber connector and an output port;
the multipath light receiving device includes: the device comprises an input port, a second optical fiber connector, a wave division module and N photoelectric detection modules; wherein N is a positive integer;
the N lasers emit N paths of laser beams, the N paths of laser beams are coupled through N coupling lenses corresponding to the N lasers respectively and then enter the wave combining module, and the wave combining module converges the N paths of coupled laser beams into a beam of combined wave beams which then enter the output port through the first optical fiber connector; the N lasers, the N coupling lenses and the wave combining module are all arranged on the same metal carrier, the metal carrier is adhered to a PCBA through a plane, the PCBA comprises a limiting structure to limit the position of the metal carrier, so that the metal carrier is convenient to mount and position, the metal carrier adopts an embedded direct-mounting structural design, and the position of the metal carrier is close to a golden finger;
the input port emits a laser beam, the laser beam enters the wave division module through the second optical fiber connector, the wave division module divides the wave into N paths of wave division beams and then enters the corresponding N waveguide ports, and the N paths of wave division beams respectively pass through the N waveguide ports and then enter the photoelectric detection module corresponding to each waveguide port;
the first optical fiber connector and the second optical fiber connector are both realized by adopting an optical fiber array FA which adopts a straight-out optical fiber form;
the wave combining module and the wave splitting module are both realized by adopting PLC chips.
2. The optical module of claim 1, wherein the N lasers output different laser wavelengths.
3. The optical module of claim 2, wherein the N lasers are electrically connected to the PCBA by bonding gold wires using thermosonic bonding.
4. The optical module according to claim 1, wherein the multichannel light receiving device further comprises: a transimpedance amplifier;
and the N paths of the wave-splitting light beams respectively pass through the N waveguide ports, enter the photoelectric detection module corresponding to each waveguide port, and are amplified by the trans-impedance amplifier and then output.
5. The optical module according to claim 4, wherein the wavelength division module and the N photo-detection modules are directly coupled; or, the end faces of the wave splitting module corresponding to the N photoelectric detection modules are made into preset angles, so that the N paths of wave splitting light beams are reflected into the photoelectric detection modules through the end faces.
6. The optical module as claimed in claim 5, wherein a plurality of positioning holes are formed at corresponding positions on the PCBA where the plurality of light receiving devices are placed, and correspond to the positioning protrusions on the housing of the plurality of light receiving devices.
7. The optical module of claim 1, wherein the first fiber optic connector is connected to the output port by a first optical fiber; the input port is connected with the second optical fiber connector through a second optical fiber.
CN201911259686.5A 2019-12-10 2019-12-10 Optical module Active CN111313969B (en)

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PCT/CN2020/131835 WO2021115129A1 (en) 2019-12-10 2020-11-26 Optical module

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CN112346181A (en) * 2020-11-09 2021-02-09 长飞光纤光缆股份有限公司 Optical module
CN113296201B (en) * 2021-05-21 2022-07-22 福建中科光芯光电科技有限公司 Optical assembly, optical module and working method
CN113721331B (en) * 2021-08-31 2022-07-08 青岛海信宽带多媒体技术有限公司 Optical module
WO2023029707A1 (en) * 2021-08-31 2023-03-09 青岛海信宽带多媒体技术有限公司 Optical module
CN114706175B (en) * 2022-04-08 2023-11-14 江苏铌奥光电科技有限公司 High-speed optical module structure and packaging method thereof
CN115016079A (en) * 2022-06-21 2022-09-06 长芯盛(武汉)科技有限公司 800G optical module

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