WO2021115129A1 - Optical module - Google Patents

Optical module Download PDF

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Publication number
WO2021115129A1
WO2021115129A1 PCT/CN2020/131835 CN2020131835W WO2021115129A1 WO 2021115129 A1 WO2021115129 A1 WO 2021115129A1 CN 2020131835 W CN2020131835 W CN 2020131835W WO 2021115129 A1 WO2021115129 A1 WO 2021115129A1
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WIPO (PCT)
Prior art keywords
optical
module
optical fiber
path
laser
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PCT/CN2020/131835
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French (fr)
Chinese (zh)
Inventor
梁付运
郑萌
汤金宽
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长飞光纤光缆股份有限公司
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Publication of WO2021115129A1 publication Critical patent/WO2021115129A1/en

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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B10/00Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/50Transmitters
    • H04B10/501Structural aspects
    • H04B10/503Laser transmitters
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B10/00Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/60Receivers

Definitions

  • the present invention belongs to the field of optical communication technology, and more specifically, relates to an optical module.
  • the existing solution to this problem usually adopts WDM system, but the current WDM module either adopts a free space implementation scheme, mainly parallel light, which is reflected by multiple optical bandpass films to achieve light separation and synthesis.
  • the long optical path causes the optical path.
  • the stability is poor, and the process is complicated, which is not conducive to production; either the small laser component TOSA is used, the beam splitting uses the AWG coupling FA array coupling component, and the ceramic pin is used to connect with the small TOSA, which requires large size space and troublesome fiber optics. The cost is also higher.
  • the present invention proposes an optical module, which has a simple structure, a higher packaging density than existing solutions, a relatively simple and stable process, and a more advantageous cost. Mass production.
  • the present invention provides an optical module, including: a multi-path optical transmitting device and a multi-path optical receiving device;
  • the multi-path light emitting device includes: N lasers, N coupling lenses, a multiplexing module, a first optical fiber connector, and an output port;
  • the multi-path optical receiving device includes: an input port, a second optical fiber connector, a demultiplexing module, and N photoelectric detection modules; where N is a positive integer;
  • the N lasers emit N laser beams, and the N laser beams are respectively coupled through the N coupling lenses corresponding to the N lasers, and then enter the multiplexing module, and the N laser beams are combined by the multiplexing module. After the coupled laser beam is converged into a combined beam, it enters the output port through the first optical fiber connector;
  • the input port emits a laser beam
  • the laser beam enters the demultiplexing module through the second optical fiber connector
  • the demultiplexing module demultiplexes into N demultiplexed light beams and then enters the corresponding N waveguide ports
  • the N split-wave beams respectively pass through the N waveguide ports and enter the photoelectric detection module corresponding to each waveguide port.
  • the multiplexing module and the demultiplexing module are both implemented by a PLC chip, and the first optical fiber connector and the second optical fiber connector are both implemented by an optical fiber array FA.
  • the laser wavelengths output by the N lasers are different.
  • the N lasers realize the electrical connection between each of the lasers and the PCBA by welding gold wires and adopting thermosonic welding.
  • the N lasers, the N coupling lenses, and the multiplexing module are all placed on the same metal carrier, and the metal carrier is bonded to the PCBA through a plane, and the PCBA includes a limiting structure. , To define the position of the metal carrier to facilitate the placement and positioning of the metal carrier.
  • the multi-path optical receiving device further includes: a transimpedance amplifier;
  • the N split-wave beams After passing through the N waveguide ports, the N split-wave beams enter the photodetection module corresponding to each waveguide port, and then are amplified by the transimpedance amplifier and output.
  • the demultiplexing module and the N photodetection modules are directly coupled; or, the end faces of the demultiplexing module and the N photodetection modules are made into a preset angle to The N-channel demultiplexed light beams are reflected into each of the photoelectric detection modules through the end surface.
  • a plurality of positioning holes are opened at the corresponding positions where the multi-path light receiving device is placed on the PCBA, corresponding to the positioning protrusions on the housing of the multi-path light receiving device.
  • the first optical fiber connector is connected to the output port through a first optical fiber; the input port is connected to the second optical fiber connector through a second optical fiber.
  • the optical module of the present invention includes multiple optical emitting devices and multiple optical receiving devices, and multiple optical emitting devices. Including: N lasers, N coupling lenses, multiplexing modules, first optical fiber connectors and output ports; multi-path optical receiving devices include: input ports, second optical fiber connectors, demultiplexing modules, and N photoelectric detection modules.
  • the invention has simple structure and process, because it is directly integrated and packaged, it requires fewer components and lower cost; and the optical path is simple, the free optical path is shorter, and the optical path is more stable.
  • Figure 1 is a top view of an embodiment of the present invention after opening the outer cover
  • Figure 2 is a top view of an optical module provided by an embodiment of the present invention.
  • Figure 3 is a side view of an embodiment of the present invention.
  • Figure 4 is a base structure provided by an embodiment of the present invention.
  • Figure 5 is a PCBA structure provided by an embodiment of the present invention.
  • FIG. 6 is an effect diagram after assembly of a base and PCBA according to an embodiment of the present invention.
  • FIG. 7 is an electrical connection structure between a laser and a PCBA provided by an embodiment of the present invention.
  • Figure 8 is a receiving end outer protective cover provided by an embodiment of the present invention.
  • 1 is the output end of the multiple light emitting device
  • 2 is the FA of the multiple light emitting device
  • 3 is the metal carrier
  • 3-1 is the right positioning surface of the metal carrier
  • 3-2 is the left positioning surface of the metal carrier.
  • 3-3 is the bonding surface between metal carrier and PCBA
  • 4 is PLC MUX
  • 5 is coupling lens
  • 6 is laser
  • 7 is PCBA
  • 8 is PCBA electrical output interface
  • 9 is the housing positioning hole of multi-path optical receiving device
  • 10 It TIA
  • 11 is PD
  • 12 is PLC Demux
  • 13 is FA avoiding hole on PCBA to receive PLC
  • 14 is FA at the end of multi-channel optical receiving device
  • 15 is input of multi-channel optical receiving device
  • 16 is multi-channel optical receiving
  • 16-1 is the outer cover positioning post of the multi-path optical receiving device
  • 17 is the housing of the multi-path optical transmitting device
  • 18 is the gold wire for electrical connection between the laser and the PCBA.
  • the present invention adopts optical waveguide PLC chip technology.
  • the multi-channel optical transmitting device at the transmitting end multiplexes and couples multiple lasers through the PLC chip into an optical fiber for transmission, and the multi-channel optical receiving device at the receiving end uses PLC to receive multiple channels.
  • the optical signal is decomposed and transmitted to the corresponding photodiode PD for reception.
  • the embodiment of the present invention provides an optical module, including: a multi-path optical transmitting device and a multi-path optical receiving device;
  • the multi-path optical transmitting device includes: N lasers, N coupling lenses, multiplexing module, first optical fiber connector and output port;
  • the multi-path optical receiving device includes: an input port, a second optical fiber connector, a demultiplexing module, and N photoelectric detection modules; where N is a positive integer;
  • N lasers emit N laser beams, and the N laser beams are respectively coupled through the N coupling lenses corresponding to the N lasers, and then enter the multiplexing module.
  • the multiplexing module converges the N coupled laser beams into a multiplexed beam. , Enter the output port through the first optical fiber connector;
  • the input port emits a laser beam, and the laser beam enters the demultiplexing module through the second optical fiber connector.
  • the demultiplexing module demultiplexes into N demultiplexed beams and then enters the corresponding N waveguide ports.
  • the N demultiplexed beams respectively pass through N waveguides. After the port, enter the photodetection module corresponding to each waveguide port.
  • FIG. 1 is a top view of an optical module provided by an embodiment of the present invention with the outer cover opened
  • FIG. 2 is a top view of an optical module provided by an embodiment of the present invention
  • Fig. 3 is a side view provided by an embodiment of the present invention. It should be noted that the optical module illustrated in Fig. 1, Fig. 2 and Fig. 3 is only an optional implementation, as shown in Fig. 1.
  • the optical module provided by the embodiment of the present invention includes: a multi-channel optical transmitting device and a multi-channel optical receiving device;
  • PCBA 7 inputs 4 drive signals to 4 lasers 6 through PCBA electrical output interface 8, so that each laser emits laser signals, thereby converting the electrical signals into optical signals, which pass through the interface between the laser 6 and the PLC chip 4.
  • the corresponding coupling lens 5 is coupled into the input port corresponding to the PLC chip 6 one-to-one, the light entering the PLC chip 6 is combined with the light by the PLC chip and then coupled to the FA 2 and enters the optical fiber to be output through the receiving end 1.
  • the lasers usually have different wavelengths, for example, they can be 1270 nm, 1290 nm, 1311 nm, and 1331 nm respectively.
  • the corresponding channels of the laser 6, the coupling lens 5, and the PLC chip 4 correspond one-to-one.
  • the 4-channel laser may be a separate laser or an array of 4-channels together.
  • the coupling lens may be a single discrete lens or an array of 4 lenses.
  • the coupling between the laser and the PLC chip is shaped and converged by the lens to couple the light emitted by the laser into the PLC chip.
  • the optical coupling efficiency can be adjusted by selecting the lens and adjusting the distance between the PLC and the laser. Control the final output optical power within the required range.
  • the packaging density can be increased, the components used in the packaging can be reduced, the volume is reduced, and the cost is reduced.
  • the 4 lasers are electrically connected between the laser and the PCBA by welding the gold wire 18 and using thermosonic welding, so that the PCBA transmits the electrical signal to the laser and converts it into light. signal.
  • the lasers, PLCs, and lenses in the multi-path light emitting device are all placed on the same metal carrier 3.
  • the metal carrier 3 is pasted on the PCBA 7 through the metal carrier plane 3-3.
  • the 3-1 and 3-2 structures on the PCBA board can play the role of limiting the metal carrier and facilitate the placement and positioning of the metal carrier.
  • there are two symmetrical raised structures on the PCBA board, each raised The structure includes a groove 3-1 and a boss 3-2, and the groove 3-1 and the boss 3-2 are adjacent, as shown in the examples shown in Figure 4, Figure 5 and Figure 6, the PCBA and When the metal carriers are mounted together, the position of the PCBA is limited.
  • the 3-1 and 3-2 structures can use the front and side positioning surfaces to limit the position of the outer cover 17, and the outer cover on the side of the multiple light emitting device It is clamped on the metal carrier to facilitate the positioning and installation of the outer cover.
  • the metal carrier can adopt a direct mounting structure design, which can be automatically mounted in batches, which can improve production efficiency.
  • the multi-channel optical receiving device couples the multi-channel laser signal through the receiving end 15 into the demodulation receiving end PLC chip 12 through the optical fiber and the FA 14.
  • the FA 14 is located on the PCBA to receive the FA of the PLC.
  • the receiving end PLC chip 12 separates the received multiple laser signals, and inputs them into the corresponding waveguide ports.
  • Each output port corresponds to a photodiode PD 11, which receives the corresponding optical signal and will receive the corresponding optical signal.
  • the optical signal is converted into an electrical signal, and then amplified by a trans-impedance amplifier (TIA) 10 and output.
  • TIA trans-impedance amplifier
  • a direct coupling form is usually adopted between the demodulated PLC chip 12 and the received photodiode 11, and the emitted signal light is directly irradiated or by connecting the PLC chip 12 and the photodiode 11 corresponding to each other.
  • the end surface is ground to a certain angle, and the PD is irradiated into the PD through the reflection of the end surface.
  • the angle can be determined according to actual needs. Usually, the angle is about 41°.
  • the specific angle used is not uniquely limited in the embodiment of the present invention.
  • two positioning holes 9 are opened in the area where the multi-path light receiving device is placed on the PCBA, corresponding to the positioning protrusions 16-1 on the housing 16 of the multi-path light receiving device. Used to locate the housing of the multi-path optical receiving device, which is convenient for positioning and installation.
  • the housings of the multi-path light emitting device and the multi-path light receiving device can also be mounted by automatic placement equipment to improve production efficiency.
  • the FA adopted by the multi-path light emitting device and the multi-path light receiving device adopts the form of straight-out fiber, which avoids the complicated fiber coiling process and can also achieve high production efficiency.
  • each step/component described in this application can be split into more steps/components, or two or more steps/components or partial operations of steps/components can be combined into new ones. Steps/components to achieve the purpose of the present invention.

Abstract

The present invention relates to the field of optical communications. Disclosed is an optical module, comprising a multi-path optical transmitting device and a multi-path optical receiving device. A multi-path transmitter component comprises a metal member adhered to a circuit board. An upper part of the multi-path transmitter component is used for placing elements such as a multi-path laser, a PLC chip, and a lens. The laser is electrically connected to the circuit board by means of gold wire welding. The laser passes an optical light through the lens located between the PLC chip and the laser. A laser light emitted by a corresponding laser is coupled into a corresponding PLC chip port, is multiplexed, and then enters an optical fiber component, and is output to an external optical fiber by means of an optical interface. The multi-path optical receiving device directly places a photodiode and a transimpedance amplifier onto the circuit board. An external optical signal enters the optical fiber component by means of the optical interface, is split by an optical beam splitter, and then reflected into a corresponding photodiode for optical reception, which achieves the conversion from the optical signal to an electrical signal. The element used for packaging can be reduced, and the volume is reduced.

Description

一种光模块An optical module 技术领域Technical field
本发明属于光通信技术领域,更具体地,涉及一种光模块。The present invention belongs to the field of optical communication technology, and more specifically, relates to an optical module.
背景技术Background technique
近年来,由于接入网及数据中心的发展应用,需要寻求更加经济有效的扩展带宽的方式,以增加网络容量。按照传统方案进行大规模连接点分配和光纤光缆密集化正在发生。而每一个节点均需要一根光纤进行互联,因此光纤的需求量呈螺旋式上升,而铺设这些光纤的空间和物理路径是有限的。In recent years, due to the development and application of access networks and data centers, it is necessary to find a more cost-effective way to expand bandwidth to increase network capacity. According to the traditional scheme, large-scale connection point distribution and fiber optic cable densification are taking place. Each node needs an optical fiber for interconnection, so the demand for optical fiber is spirally rising, and the space and physical path for laying these optical fibers are limited.
现有解决此问题通常采用WDM系统,但目前的WDM模块要么采用free space实现方案,主要以平行光,经多路光带通膜多次片反射以实现光的分开和合成,光路长造成光路稳定性差,且工艺过程复杂,不利于生产;要么采用小激光器组件TOSA,分光采用AWG耦合FA阵列耦合组件,使用陶瓷插针与小TOSA连接,需要尺寸空间大,盘纤麻烦。成本也较高。The existing solution to this problem usually adopts WDM system, but the current WDM module either adopts a free space implementation scheme, mainly parallel light, which is reflected by multiple optical bandpass films to achieve light separation and synthesis. The long optical path causes the optical path. The stability is poor, and the process is complicated, which is not conducive to production; either the small laser component TOSA is used, the beam splitting uses the AWG coupling FA array coupling component, and the ceramic pin is used to connect with the small TOSA, which requires large size space and troublesome fiber optics. The cost is also higher.
发明内容Summary of the invention
针对现有技术的以上缺陷或改进需求,本发明提出了一种光模块,该光模块结构简单,相较于现存方案封装密度更高,且工艺相对简单稳定,成本也更有优势,利于大批量生产。In view of the above defects or improvement requirements of the prior art, the present invention proposes an optical module, which has a simple structure, a higher packaging density than existing solutions, a relatively simple and stable process, and a more advantageous cost. Mass production.
为实现上述目的,本发明提供了一种光模块,包括:多路光发射器件和多路光接收器件;In order to achieve the above-mentioned objective, the present invention provides an optical module, including: a multi-path optical transmitting device and a multi-path optical receiving device;
所述多路光发射器件包括:N个激光器、N个耦合透镜、合波模块、第一光纤连接器及输出端口;The multi-path light emitting device includes: N lasers, N coupling lenses, a multiplexing module, a first optical fiber connector, and an output port;
所述多路光接收器件包括:输入端口、第二光纤连接器、分波模块、N 个光电探测模块;其中,N为正整数;The multi-path optical receiving device includes: an input port, a second optical fiber connector, a demultiplexing module, and N photoelectric detection modules; where N is a positive integer;
所述N个激光器发射N路激光光束,所述N路激光光束分别经由与所述N个激光器对应的N个耦合透镜耦合后,进入所述合波模块,由所述合波模块将N路耦合激光光束汇聚成一束合波光束后,通过所述第一光纤连接器进入所述输出端口;The N lasers emit N laser beams, and the N laser beams are respectively coupled through the N coupling lenses corresponding to the N lasers, and then enter the multiplexing module, and the N laser beams are combined by the multiplexing module. After the coupled laser beam is converged into a combined beam, it enters the output port through the first optical fiber connector;
所述输入端口发射激光光束,所述激光光束通过所述第二光纤连接器进入所述分波模块,由所述分波模块分波为N路分波光束后进入对应的N个波导端口,所述N路分波光束分别经过所述N个波导端口后,进入与每个所述波导端口对应的光电探测模块。The input port emits a laser beam, the laser beam enters the demultiplexing module through the second optical fiber connector, and the demultiplexing module demultiplexes into N demultiplexed light beams and then enters the corresponding N waveguide ports, The N split-wave beams respectively pass through the N waveguide ports and enter the photoelectric detection module corresponding to each waveguide port.
优选地,所述合波模块与所述分波模块均采用PLC芯片实现,所述第一光纤连接器及所述第二光纤连接器均采用光纤阵列FA实现。Preferably, the multiplexing module and the demultiplexing module are both implemented by a PLC chip, and the first optical fiber connector and the second optical fiber connector are both implemented by an optical fiber array FA.
优选地,所述N个激光器输出的激光波长不同。Preferably, the laser wavelengths output by the N lasers are different.
优选地,所述N个激光器通过焊接金丝,采用热超声焊接实现各所述激光器与PCBA之间的电连接。Preferably, the N lasers realize the electrical connection between each of the lasers and the PCBA by welding gold wires and adopting thermosonic welding.
优选地,所述N个激光器、所述N个耦合透镜及所述合波模块均放置在同一个金属载体上,所述金属载体通过平面与所述PCBA粘贴,所述PCBA上包括限位结构,以限定所述金属载体的位置,便于所述金属载体的贴装定位。Preferably, the N lasers, the N coupling lenses, and the multiplexing module are all placed on the same metal carrier, and the metal carrier is bonded to the PCBA through a plane, and the PCBA includes a limiting structure. , To define the position of the metal carrier to facilitate the placement and positioning of the metal carrier.
优选地,所述多路光接收器件还包括:跨阻抗放大器;Preferably, the multi-path optical receiving device further includes: a transimpedance amplifier;
所述N路分波光束分别经过所述N个波导端口后,进入与每个所述波导端口对应的光电探测模块,然后经过所述跨阻抗放大器放大后输出。After passing through the N waveguide ports, the N split-wave beams enter the photodetection module corresponding to each waveguide port, and then are amplified by the transimpedance amplifier and output.
优选地,所述分波模块与所述N个光电探测模块之间采用直接耦合的形式;或者,将所述分波模块与所述N个光电探测模块对应的端面制作成预设角度,以使所述N路分波光束通过所述端面反射入各所述光电探测模块。Preferably, the demultiplexing module and the N photodetection modules are directly coupled; or, the end faces of the demultiplexing module and the N photodetection modules are made into a preset angle to The N-channel demultiplexed light beams are reflected into each of the photoelectric detection modules through the end surface.
优选地,在所述PCBA上放置多路光接收器件的对应位置开有若干个 定位孔,与所述多路光接收器件的外壳上的定位凸起对应。Preferably, a plurality of positioning holes are opened at the corresponding positions where the multi-path light receiving device is placed on the PCBA, corresponding to the positioning protrusions on the housing of the multi-path light receiving device.
优选地,所述第一光纤连接器通过第一光纤与所述输出端口连接;所述输入端口通过第二光纤与所述第二光纤连接器连接。Preferably, the first optical fiber connector is connected to the output port through a first optical fiber; the input port is connected to the second optical fiber connector through a second optical fiber.
总体而言,通过本发明所构思的以上技术方案与现有技术相比,能够取得下列有益效果:本发明的光模块,包括多路光发射器件和多路光接收器件,多路光发射器件包括:N个激光器、N个耦合透镜、合波模块、第一光纤连接器及输出端口;多路光接收器件包括:输入端口、第二光纤连接器、分波模块、N个光电探测模块。本发明结构和工艺简单,由于是直接集成封装,需要元件更少,成本更低;且光路简单,自由光路较短,光路更加稳定。Generally speaking, compared with the prior art, the above technical solutions conceived by the present invention can achieve the following beneficial effects: The optical module of the present invention includes multiple optical emitting devices and multiple optical receiving devices, and multiple optical emitting devices. Including: N lasers, N coupling lenses, multiplexing modules, first optical fiber connectors and output ports; multi-path optical receiving devices include: input ports, second optical fiber connectors, demultiplexing modules, and N photoelectric detection modules. The invention has simple structure and process, because it is directly integrated and packaged, it requires fewer components and lower cost; and the optical path is simple, the free optical path is shorter, and the optical path is more stable.
附图说明Description of the drawings
图1是本发明实施例提供的一种打开外盖后的俯视图;Figure 1 is a top view of an embodiment of the present invention after opening the outer cover;
图2是本发明实施例提供的一种光模块的俯视图;Figure 2 is a top view of an optical module provided by an embodiment of the present invention;
图3是本发明实施例提供的一种侧向视图;Figure 3 is a side view of an embodiment of the present invention;
图4是本发明实施例提供的一种底座结构;Figure 4 is a base structure provided by an embodiment of the present invention;
图5是本发明实施例提供的一种PCBA结构;Figure 5 is a PCBA structure provided by an embodiment of the present invention;
图6是本发明实施例提供的一种底座与PCBA组装后效果图;FIG. 6 is an effect diagram after assembly of a base and PCBA according to an embodiment of the present invention;
图7是本发明实施例提供的一种激光器与PCBA的电气连接结构;FIG. 7 is an electrical connection structure between a laser and a PCBA provided by an embodiment of the present invention;
图8是本发明实施例提供的一种接收端外保护盖;Figure 8 is a receiving end outer protective cover provided by an embodiment of the present invention;
其中,1为多路光发射器件的输出端,2为多路光发射器件端的FA,3为金属载体,3-1为金属载体的右定位面,3-2为金属载体的左定位面,3-3为金属载体与PCBA粘接面,4为PLC MUX,5为耦合透镜,6为激光器,7为PCBA,8为PCBA电输出接口,9为多路光接收器件的外壳定位孔,10为TIA,11为PD,12为PLC Demux,13为PCBA上接收PLC的FA避让孔,14为多路光接收器件端的FA,15为多路光接收器件的输入端,16为多路光接收器件的外壳,16-1为多路光接收器件的外盖定位柱,17为 多路光发射器件的外壳,18为激光器与PCBA电连接金丝。Among them, 1 is the output end of the multiple light emitting device, 2 is the FA of the multiple light emitting device, 3 is the metal carrier, 3-1 is the right positioning surface of the metal carrier, and 3-2 is the left positioning surface of the metal carrier. 3-3 is the bonding surface between metal carrier and PCBA, 4 is PLC MUX, 5 is coupling lens, 6 is laser, 7 is PCBA, 8 is PCBA electrical output interface, 9 is the housing positioning hole of multi-path optical receiving device, 10 It is TIA, 11 is PD, 12 is PLC Demux, 13 is FA avoiding hole on PCBA to receive PLC, 14 is FA at the end of multi-channel optical receiving device, 15 is input of multi-channel optical receiving device, 16 is multi-channel optical receiving The housing of the device, 16-1 is the outer cover positioning post of the multi-path optical receiving device, 17 is the housing of the multi-path optical transmitting device, and 18 is the gold wire for electrical connection between the laser and the PCBA.
具体实施方式Detailed ways
为了使本发明的目的、技术方案及优点更加清楚明白,以下结合附图及实施例,对本发明进行进一步详细说明。应当理解,此处所描述的具体实施例仅仅用以解释本发明,并不用于限定本发明。此外,下面所描述的本发明各个实施方式中所涉及到的技术特征只要彼此之间未构成冲突就可以相互组合。In order to make the objectives, technical solutions, and advantages of the present invention clearer, the following further describes the present invention in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not used to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.
本发明采用光波导PLC芯片技术,发射端的多路光发射器件将多路激光器通过PLC芯片进行合波耦合进一根光纤进行传输,接收端的多路光接收器件则采用PLC将接收到的多路光信号进行分解后传送至对应的光电二极管PD进行接收。The present invention adopts optical waveguide PLC chip technology. The multi-channel optical transmitting device at the transmitting end multiplexes and couples multiple lasers through the PLC chip into an optical fiber for transmission, and the multi-channel optical receiving device at the receiving end uses PLC to receive multiple channels. The optical signal is decomposed and transmitted to the corresponding photodiode PD for reception.
本发明实施例提供了一种光模块,包括:多路光发射器件和多路光接收器件;The embodiment of the present invention provides an optical module, including: a multi-path optical transmitting device and a multi-path optical receiving device;
多路光发射器件包括:N个激光器、N个耦合透镜、合波模块、第一光纤连接器及输出端口;The multi-path optical transmitting device includes: N lasers, N coupling lenses, multiplexing module, first optical fiber connector and output port;
多路光接收器件包括:输入端口、第二光纤连接器、分波模块、N个光电探测模块;其中,N为正整数;The multi-path optical receiving device includes: an input port, a second optical fiber connector, a demultiplexing module, and N photoelectric detection modules; where N is a positive integer;
N个激光器发射N路激光光束,N路激光光束分别经由与N个激光器对应的N个耦合透镜耦合后,进入合波模块,由合波模块将N路耦合激光光束汇聚成一束合波光束后,通过第一光纤连接器进入输出端口;N lasers emit N laser beams, and the N laser beams are respectively coupled through the N coupling lenses corresponding to the N lasers, and then enter the multiplexing module. The multiplexing module converges the N coupled laser beams into a multiplexed beam. , Enter the output port through the first optical fiber connector;
输入端口发射激光光束,激光光束通过第二光纤连接器进入分波模块,由分波模块分波为N路分波光束后进入对应的N个波导端口,N路分波光束分别经过N个波导端口后,进入与每个波导端口对应的光电探测模块。The input port emits a laser beam, and the laser beam enters the demultiplexing module through the second optical fiber connector. The demultiplexing module demultiplexes into N demultiplexed beams and then enters the corresponding N waveguide ports. The N demultiplexed beams respectively pass through N waveguides. After the port, enter the photodetection module corresponding to each waveguide port.
如图1、图2及图3所示,其中,图1为本发明实施例提供的一种光模块打开外盖后的俯视图,图2是本发明实施例提供的一种光模块的俯视图,图3是本发明实施例提供的一种侧向视图,需要说明的是,图1、图2及 图3中示意出的光模块仅为一种可选的实施方式,如图1所示,本发明实施例提供的光模块包括:多路光发射器件和多路光接收器件;As shown in FIGS. 1, 2 and 3, FIG. 1 is a top view of an optical module provided by an embodiment of the present invention with the outer cover opened, and FIG. 2 is a top view of an optical module provided by an embodiment of the present invention. Fig. 3 is a side view provided by an embodiment of the present invention. It should be noted that the optical module illustrated in Fig. 1, Fig. 2 and Fig. 3 is only an optional implementation, as shown in Fig. 1. The optical module provided by the embodiment of the present invention includes: a multi-channel optical transmitting device and a multi-channel optical receiving device;
其中,PCBA 7通过PCBA电输出接口8将4路驱动信号输入4路激光器6,以由各路激光器发射激光信号,从而将电信号转化成光信号,通过位于激光器6和PLC芯片4之间的对应耦合透镜5耦合进PLC芯片6一一对应的输入端口,进入PLC芯片6的光经过PLC芯片合光后与FA 2耦合,进入光纤经接收端1输出。Among them, PCBA 7 inputs 4 drive signals to 4 lasers 6 through PCBA electrical output interface 8, so that each laser emits laser signals, thereby converting the electrical signals into optical signals, which pass through the interface between the laser 6 and the PLC chip 4. The corresponding coupling lens 5 is coupled into the input port corresponding to the PLC chip 6 one-to-one, the light entering the PLC chip 6 is combined with the light by the PLC chip and then coupled to the FA 2 and enters the optical fiber to be output through the receiving end 1.
其中,激光器通常具有不同的波长,例如,可以分别为1270nm、1290nm、1311nm及1331nm,在本发明实施例中的激光器6,耦合透镜5,PLC芯片4对应通道是一对一对应的。The lasers usually have different wavelengths, for example, they can be 1270 nm, 1290 nm, 1311 nm, and 1331 nm respectively. In the embodiment of the present invention, the corresponding channels of the laser 6, the coupling lens 5, and the PLC chip 4 correspond one-to-one.
作为一种可选的实施方式,4路激光器可以是分离的激光器,也可以是4路一起的阵列。As an optional implementation manner, the 4-channel laser may be a separate laser or an array of 4-channels together.
作为一种可选的实施方式,耦合透镜可以是单个的分立透镜,也可以是4个透镜的阵列。As an optional implementation, the coupling lens may be a single discrete lens or an array of 4 lenses.
在本发明实施例中,激光器与PLC芯片的耦合通过透镜将激光器发出来的光进行整形汇聚后耦合进PLC芯片,通过透镜的选型和调节PLC与激光器之间的间距可以调节光耦合效率,将最后输出的光功率控制在需要的范围之内。可以提高封装密度,减少封装采用的元件,减小体积,降低成本。In the embodiment of the present invention, the coupling between the laser and the PLC chip is shaped and converged by the lens to couple the light emitted by the laser into the PLC chip. The optical coupling efficiency can be adjusted by selecting the lens and adjusting the distance between the PLC and the laser. Control the final output optical power within the required range. The packaging density can be increased, the components used in the packaging can be reduced, the volume is reduced, and the cost is reduced.
作为一种可选的实施方式,如图7所示,4路激光通过焊接金丝18,采用热超声焊接将激光器和PCBA之间进行电连接,以由PCBA将电信号传输到激光器转化成光信号。As an optional implementation, as shown in FIG. 7, the 4 lasers are electrically connected between the laser and the PCBA by welding the gold wire 18 and using thermosonic welding, so that the PCBA transmits the electrical signal to the laser and converts it into light. signal.
在本发明实施例中,多路光发射器件中的激光器,PLC,透镜均放置在同一个金属载体3上边,如图5所示,金属载体3通过金属载体平面3-3与PCBA 7粘贴在一起,PCBA板上的3-1和3-2结构可以起到限定金属载体的作用,便于金属载体的贴装定位,具体地,PCBA板上有两个对称的凸 起结构,每个凸起结构中均包括一个凹槽3-1和一个凸台3-2,且凹槽3-1和凸台3-2相邻,如图4,图5和图6所示样例,将PCBA与金属载体贴装在一起的时候将PCBA的位置限定住。In the embodiment of the present invention, the lasers, PLCs, and lenses in the multi-path light emitting device are all placed on the same metal carrier 3. As shown in FIG. 5, the metal carrier 3 is pasted on the PCBA 7 through the metal carrier plane 3-3. At the same time, the 3-1 and 3-2 structures on the PCBA board can play the role of limiting the metal carrier and facilitate the placement and positioning of the metal carrier. Specifically, there are two symmetrical raised structures on the PCBA board, each raised The structure includes a groove 3-1 and a boss 3-2, and the groove 3-1 and the boss 3-2 are adjacent, as shown in the examples shown in Figure 4, Figure 5 and Figure 6, the PCBA and When the metal carriers are mounted together, the position of the PCBA is limited.
其中,如图2及图5所示,3-1和3-2结构又可以利用前边和侧边的定位面起到限定外盖17的位置的作用,将多路光发射器件侧的外盖卡在金属载体上,便于外盖定位和安装。Among them, as shown in Figure 2 and Figure 5, the 3-1 and 3-2 structures can use the front and side positioning surfaces to limit the position of the outer cover 17, and the outer cover on the side of the multiple light emitting device It is clamped on the metal carrier to facilitate the positioning and installation of the outer cover.
作为一种可选的实施方式,金属载体可以采用直接贴装的结构设计,可以自动化批量贴装,可以提高生产效率。As an optional implementation manner, the metal carrier can adopt a direct mounting structure design, which can be automatically mounted in batches, which can improve production efficiency.
在本发明实施例中,多路光接收器件将多路激光器信号,经过接收端15,通过光纤和FA 14耦合进解调的收端PLC芯片12,其中,FA 14位于PCBA上接收PLC的FA避让孔13上,由收端PLC芯片12将接收到的多路激光信号分开,输入到对应的波导端口内,每一个输出端口对应一路光电二极管PD 11,接收对应的光信号,将接收到的光信号转化成电信号,然后经过跨阻抗放大器(trans-impedance amplifier,TIA)10放大后输出。In the embodiment of the present invention, the multi-channel optical receiving device couples the multi-channel laser signal through the receiving end 15 into the demodulation receiving end PLC chip 12 through the optical fiber and the FA 14. The FA 14 is located on the PCBA to receive the FA of the PLC. On the avoidance hole 13, the receiving end PLC chip 12 separates the received multiple laser signals, and inputs them into the corresponding waveguide ports. Each output port corresponds to a photodiode PD 11, which receives the corresponding optical signal and will receive the corresponding optical signal. The optical signal is converted into an electrical signal, and then amplified by a trans-impedance amplifier (TIA) 10 and output.
作为一种可选的实施方式,在解调的PLC芯片12和接收的光电二极管11之间通常采用直接耦合的形式,将出射的信号光直接照射或者通过将PLC芯片12与光电二极管11对应的端面研磨成一定的角度,通过端面反射的形式照射入PD。As an optional implementation manner, a direct coupling form is usually adopted between the demodulated PLC chip 12 and the received photodiode 11, and the emitted signal light is directly irradiated or by connecting the PLC chip 12 and the photodiode 11 corresponding to each other. The end surface is ground to a certain angle, and the PD is irradiated into the PD through the reflection of the end surface.
其中,该角度可以根据实际需要确定,通常这个角度在41°左右,具体采用何种角度本发明实施例不做唯一性限定。Wherein, the angle can be determined according to actual needs. Usually, the angle is about 41°. The specific angle used is not uniquely limited in the embodiment of the present invention.
在本发明实施例中,如图8所示,在PCBA放置多路光接收器件的区域开有两个定位孔9,与多路光接收器件的外壳16上的定位凸起16-1对应,用于定位多路光接收器件的外壳,方便定位和安装。In the embodiment of the present invention, as shown in FIG. 8, two positioning holes 9 are opened in the area where the multi-path light receiving device is placed on the PCBA, corresponding to the positioning protrusions 16-1 on the housing 16 of the multi-path light receiving device. Used to locate the housing of the multi-path optical receiving device, which is convenient for positioning and installation.
作为一种可选的实施方式,多路光发射器件和多路光接收器件的外壳同样可以采用自动贴片设备贴装,提高生产效率。As an optional implementation manner, the housings of the multi-path light emitting device and the multi-path light receiving device can also be mounted by automatic placement equipment to improve production efficiency.
在本发明实施例中,多路光发射器件和多路光接收器件采用的FA采用 直出光纤的形式,避免了复杂的盘纤工序,同样的可以太高生产效率。In the embodiment of the present invention, the FA adopted by the multi-path light emitting device and the multi-path light receiving device adopts the form of straight-out fiber, which avoids the complicated fiber coiling process and can also achieve high production efficiency.
需要指出,根据实施的需要,可将本申请中描述的各个步骤/部件拆分为更多步骤/部件,也可将两个或多个步骤/部件或者步骤/部件的部分操作组合成新的步骤/部件,以实现本发明的目的。It needs to be pointed out that according to the needs of implementation, each step/component described in this application can be split into more steps/components, or two or more steps/components or partial operations of steps/components can be combined into new ones. Steps/components to achieve the purpose of the present invention.
本领域的技术人员容易理解,以上所述仅为本发明的较佳实施例而已,并不用以限制本发明,凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等,均应包含在本发明的保护范围之内。Those skilled in the art can easily understand that the above descriptions are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modification, equivalent replacement and improvement, etc. made within the spirit and principle of the present invention, All should be included in the protection scope of the present invention.

Claims (9)

  1. 一种光模块,其特征在于,包括:多路光发射器件和多路光接收器件;An optical module, which is characterized in that it comprises: a multi-path light emitting device and a multi-path light receiving device;
    所述多路光发射器件包括:N个激光器、N个耦合透镜、合波模块、第一光纤连接器及输出端口;The multi-path light emitting device includes: N lasers, N coupling lenses, a multiplexing module, a first optical fiber connector, and an output port;
    所述多路光接收器件包括:输入端口、第二光纤连接器、分波模块、N个光电探测模块;其中,N为正整数;The multi-path optical receiving device includes: an input port, a second optical fiber connector, a demultiplexing module, and N photoelectric detection modules; where N is a positive integer;
    所述N个激光器发射N路激光光束,所述N路激光光束分别经由与所述N个激光器对应的N个耦合透镜耦合后,进入所述合波模块,由所述合波模块将N路耦合激光光束汇聚成一束合波光束后,通过所述第一光纤连接器进入所述输出端口;The N lasers emit N laser beams, and the N laser beams are respectively coupled through the N coupling lenses corresponding to the N lasers, and then enter the multiplexing module, and the N laser beams are combined by the multiplexing module. After the coupled laser beam is converged into a combined beam, it enters the output port through the first optical fiber connector;
    所述输入端口发射激光光束,所述激光光束通过所述第二光纤连接器进入所述分波模块,由所述分波模块分波为N路分波光束后进入对应的N个波导端口,所述N路分波光束分别经过所述N个波导端口后,进入与每个所述波导端口对应的光电探测模块。The input port emits a laser beam, the laser beam enters the demultiplexing module through the second optical fiber connector, and the demultiplexing module demultiplexes into N demultiplexed light beams and then enters the corresponding N waveguide ports, The N split-wave beams respectively pass through the N waveguide ports and enter the photoelectric detection module corresponding to each waveguide port.
  2. 根据权利要求1所述的光模块,其特征在于,所述合波模块与所述分波模块均采用PLC芯片实现,所述第一光纤连接器及所述第二光纤连接器均采用光纤阵列FA实现。The optical module according to claim 1, wherein the multiplexing module and the demultiplexing module are both implemented by PLC chips, and the first optical fiber connector and the second optical fiber connector are both implemented by optical fiber arrays. FA implementation.
  3. 根据权利要求1或2所述的光模块,其特征在于,所述N个激光器输出的激光波长不同。The optical module according to claim 1 or 2, wherein the laser wavelengths output by the N lasers are different.
  4. 根据权利要求3所述的光模块,其特征在于,所述N个激光器通过焊接金丝,采用热超声焊接实现各所述激光器与PCBA之间的电连接。3. The optical module according to claim 3, wherein the N lasers realize the electrical connection between each of the lasers and the PCBA by welding gold wires and adopting thermosonic welding.
  5. 根据权利要求4所述的光模块,其特征在于,所述N个激光器、所述N个耦合透镜及所述合波模块均放置在同一个金属载体上,所述金属载体通过平面与所述PCBA粘贴,所述PCBA上包括限位结构,以限定所述 金属载体的位置,便于所述金属载体的贴装定位。The optical module according to claim 4, wherein the N lasers, the N coupling lenses, and the multiplexing module are all placed on the same metal carrier, and the metal carrier communicates with the The PCBA is pasted, and the PCBA includes a limiting structure to limit the position of the metal carrier and facilitate the mounting and positioning of the metal carrier.
  6. 根据权利要求1或2所述的光模块,其特征在于,所述多路光接收器件还包括:跨阻抗放大器;The optical module according to claim 1 or 2, wherein the multi-path optical receiving device further comprises: a transimpedance amplifier;
    所述N路分波光束分别经过所述N个波导端口后,进入与每个所述波导端口对应的光电探测模块,然后经过所述跨阻抗放大器放大后输出。After passing through the N waveguide ports, the N split-wave beams enter the photodetection module corresponding to each waveguide port, and then are amplified by the transimpedance amplifier and output.
  7. 根据权利要求6所述的光模块,其特征在于,所述分波模块与所述N个光电探测模块之间采用直接耦合的形式;或者,将所述分波模块与所述N个光电探测模块对应的端面制作成预设角度,以使所述N路分波光束通过所述端面反射入各所述光电探测模块。The optical module according to claim 6, wherein a direct coupling form is adopted between the demultiplexing module and the N photodetection modules; or, the demultiplexing module and the N photodetection modules are directly coupled. The corresponding end face of the module is made into a preset angle, so that the N beams are reflected into each of the photoelectric detection modules through the end face.
  8. 根据权利要求7所述的光模块,其特征在于,在所述PCBA上放置多路光接收器件的对应位置开有若干个定位孔,与所述多路光接收器件的外壳上的定位凸起对应。The optical module according to claim 7, wherein a plurality of positioning holes are opened on the PCBA at the corresponding positions where the multi-path light receiving device is placed, which are similar to the positioning protrusions on the housing of the multi-path light receiving device. correspond.
  9. 根据权利要求1所述的光模块,其特征在于,所述第一光纤连接器通过第一光纤与所述输出端口连接;所述输入端口通过第二光纤与所述第二光纤连接器连接。The optical module according to claim 1, wherein the first optical fiber connector is connected to the output port through a first optical fiber; the input port is connected to the second optical fiber connector through a second optical fiber.
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