CN115016079B

CN115016079B - 800G optical module

Info

Publication number: CN115016079B
Application number: CN202210706810.3A
Authority: CN
Inventors: 梁付运; 薄生伟; 郑萌; 熊梦; 周新桃
Original assignee: Everpro Technologies Wuhan Co Ltd
Current assignee: Everpro Technologies Wuhan Co Ltd
Priority date: 2022-06-21
Filing date: 2022-06-21
Publication date: 2024-05-24
Anticipated expiration: 2042-06-21
Also published as: CN115016079A

Abstract

The invention discloses an 800G optical module, which belongs to the technical field of optical communication and comprises a PCB (printed circuit board), an optical emission assembly, an optical receiving assembly and an installation structural member; the light emitting component is arranged on the mounting structural component, the light receiving component is correspondingly arranged on the PCB, the mounting structural component is correspondingly provided with a clamping groove, one end of the PCB is correspondingly clamped in the clamping groove, the PCB and the mounting structural component are mutually abutted in the clamping direction, the PCB and the mounting structural component are relatively fixed in the direction perpendicular to the clamping direction, and the light emitting component and the light receiving component which are respectively arranged on the mounting structural component and the PCB are relatively fixed in the use state. According to the 800G optical module, the transmission displacement between the mounting structural member and the PCB is limited, so that the optical emission assembly and the PCB are in a relatively constant state in the working state, the photoelectric signal transmission among the PCB, the optical emission assembly and the optical receiving assembly is ensured, and the efficient and stable operation of the 800G optical module is further ensured.

Description

800G optical module

Technical Field

The invention belongs to the technical field of optical modules, and particularly relates to an 800G optical module.

Background

With the continuous high-speed development of the optical communication industry in China, the communication technology is updated and upgraded, and the optical module is used as a basis for building a modern high-speed information network and plays an irreplaceable role in the optical communication industry. With the development of optical module technology, the transmission rate is continuously improved, the transmission rate is gradually improved from 1.25G to 10G, 25G and 100G, and even to the current 200G, 400G and 800G, the transmission rate of the optical module is higher and higher, and the required size is smaller and smaller.

In recent years, data centers are being developed and applied, the bandwidth is wider and the cost is required to be lower and lower. COB packaging is a low-cost high-speed packaging solution at present, and mainly comprises the steps of combining device packaging with module packaging, removing structures such as BOX, flexible boards and the like, so as to reduce the cost of an optical module, shorten the high-frequency wiring length, improve the module performance, and greatly help to improve the packaging density and the volume.

The COB packaging technology mainly comprises the steps of adhering a bare chip to an interconnection substrate through conductive or non-conductive adhesive, and then conducting wire bonding to achieve electrical connection. However, in the case of higher power devices such as 800G optical modules, the operation of the optical module itself may cause tiny expansion deformation of materials in the chip, and further cause an offset of an optical transmission path in the optical module, resulting in loss of optical signals.

Disclosure of Invention

In response to one or more of the above-identified deficiencies or improvements in the prior art, the present invention provides an 800G optical module for solving the problem of optical transmission path offset within the optical module when the existing 800G optical module is in operation.

In order to achieve the above object, the present invention provides an 800G optical module, which includes a PCB board, a light emitting assembly, a light receiving assembly, and a mounting structure;

the light emitting component is arranged on the mounting structural component, and the light receiving component is correspondingly arranged on the PCB;

The mounting structural member is provided with a clamping groove, and one end of the PCB is correspondingly clamped in the clamping groove; the PCB board with the installation structure is in mutual butt in the card direction of establishing, just the PCB board with the installation structure is in perpendicular to card direction of establishing relatively fixed, and makes the score locate the installation structure with light emitting component and the light receiving component on the PCB board are relatively fixed under the user state.

As a further improvement of the invention, the mounting structure is provided with a first mounting groove, a first mounting plane and a second mounting groove which are arranged side by side in sequence towards one end of the light emitting component;

The light emitting component comprises a plurality of paths of lasers, a first coupling lens, a second coupling lens and an emitting end optical fiber array, wherein the first coupling lens, the second coupling lens and the emitting end optical fiber array are matched with the plurality of paths of lasers;

The first coupling lens and the multipath lasers are correspondingly arranged in the first mounting groove, the second coupling lens is attached to the first mounting plane, and the transmitting end optical fiber array is attached to the second mounting groove.

As a further improvement of the present invention, the first mounting groove and the first mounting plane are disposed at different plane heights, and the first coupling lens and the second coupling lens have the same inclination angle with respect to the PCB board, so that an optical signal emitted from the first coupling lens is received by the second coupling lens.

As a further improvement of the invention, a heat dissipation component is arranged at the bottom of the first mounting groove, and the first coupling lens and the laser are correspondingly attached to the heat dissipation component.

As a further improvement of the invention, the optical receiving assembly comprises a trans-impedance amplifier, a detector and a receiving end optical fiber array which are sequentially connected, wherein the receiving end optical fiber array and the PCB are arranged at an inclined angle, so that an optical signal received by the receiving end optical fiber array is converted into an electric signal and transmitted to the PCB.

As a further improvement of the invention, the mounting structure comprises a first platform and a second platform which are attached to the outer sides of the upper plate surface and the lower plate surface of the PCB, the clamping groove is formed between the first platform and the second platform, the clamping groove is U-shaped, a U-shaped bayonet is arranged on the corresponding clamping end surface of the PCB, and the U-shaped bayonet is correspondingly clamped with the clamping groove.

As a further improvement of the invention, the expansion rate difference between the mounting structural member and the PCB within 75 ℃ is 1 ppm-5 ppm.

As a further improvement of the invention, the mounting structural member is a tungsten-copper structural member, and the tungsten-copper element content ratio is 70:30.

As a further improvement of the invention, the heat dissipation component is a TEC and/or an aluminum nitride carrier.

The invention further comprises a first cover body and a second cover body, wherein the first cover body is correspondingly attached to the PCB, the first cover body and the PCB form a first sealing cavity, and the light receiving component is correspondingly sealed in the first sealing cavity;

the second cover body is correspondingly attached to the mounting structural member, a second sealing cavity is formed by the second cover body and the mounting structural member, and the light emitting assembly is correspondingly sealed in the second sealing cavity.

As a further improvement of the invention, an MPO connector is further arranged on the side of the light emitting component, which is away from the light receiving component, and the MPO connector is respectively connected with the light emitting component and the light receiving component through optical fibers;

And two ends of the second cover body, which face the light receiving assembly and the MPO connector, are respectively provided with a chute for overlapping the optical fibers.

The above-mentioned improved technical features can be combined with each other as long as they do not collide with each other.

In general, the above technical solutions conceived by the present invention have the beneficial effects compared with the prior art including:

(1) According to the 800G optical module, the PCB is fixed by adopting the mounting structural member, after the light emitting component and the light receiving component are respectively arranged on the mounting structural member and the PCB, the relative stability of the light emitting component and the light receiving component in the use state is ensured by utilizing the relative fixation of the mounting structural member and the PCB, the offset of the light emitting component and the light receiving component on the optical transmission path is avoided when the optical module works and heats, and the high-efficiency stability of the optical module transmission is ensured.

(2) According to the 800G optical module, the multipath lasers and the first coupling lenses are arranged in the first mounting grooves, and the second coupling lenses are arranged in the second mounting grooves, so that displacement differences exist between the two coupling lenses in the transverse direction and the vertical direction relative to the PCB, light emitted by the multipath lasers is conveniently shaped through the first coupling lenses and then is optically coupled to the emitting end optical fiber array through the second coupling lenses, the combination arrangement of the double lenses increases the distance between the lasers and the emitting end optical fiber array and the relative dislocation tolerance, the overall process difficulty of the optical module is reduced, the optical module packaging scheme is convenient to select and control the power, the adjustment of the optical coupling efficiency can be facilitated, and finally the output optical power is controlled in a required range.

(3) According to the 800G optical module, the mounting structural member is arranged in the U-shaped clamping groove mode, the PCB is correspondingly arranged in the U-shaped bayonet mode, the mounting structural member and the PCB are mutually clamped and then fixed on the upper plate surface, the lower plate surface and the two side end surfaces, and the mounting structural member is selected to be a material with similar expansion rate as the PCB at the working temperature, so that the mounting structural member and the PCB synchronously retract and expand when the optical module works, the mounting structural member and the PCB are always kept relatively stable, the light emitting assembly and the light receiving assembly arranged on the planes of the mounting structural member and the PCB are relatively stable, and efficient and stable working of the light emitting module and the light receiving module is ensured.

(4) According to the 800G optical module, the first cover body and the second cover body are arranged to seal the optical receiving assembly and the optical transmitting assembly on the PCB and the mounting structural member respectively, so that collision damage is avoided, and meanwhile, the two ends of the second cover body, which face the optical receiving assembly and the MPO connector, are respectively provided with the inclined grooves, so that optical fibers between the optical receiving assembly and the MPO connector are conveniently overlapped, and corner abrasion and extrusion of connecting optical fibers of the two and two sides of the second cover body are avoided.

Drawings

FIG. 1 is a schematic diagram of an overall structure of an 800G optical module according to an embodiment of the present invention;

fig. 2 is a schematic diagram of a structure of an 800G optical module after a cover is mounted in an embodiment of the present invention;

FIG. 3 is a schematic view of a mounting structure in accordance with an embodiment of the present invention;

Fig. 4 is a schematic structural diagram of a PCB board according to an embodiment of the present invention;

fig. 5 is a schematic structural view of a second cover according to an embodiment of the present invention.

Like reference numerals denote like technical features throughout the drawings, in particular:

1. a PCB board; 2. a light emitting assembly; 3. a light receiving assembly; 4. installing a structural member; 5. a first cover; 6. a second cover; 7. an MPO connector; 8. a golden finger;

201. a multi-path laser; 202. a first coupling lens; 203. a second coupling lens; 204. a transmitting-end optical fiber array;

301. A transimpedance amplifier; 302. a detector; 303. a receiving-end optical fiber array;

401. a clamping groove; 402. a first mounting groove; 403. a first mounting plane; 404. and a second mounting groove.

Detailed Description

The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention. In addition, the technical features of the embodiments of the present invention described below may be combined with each other as long as they do not collide with each other.

In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present invention, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present invention, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

Examples:

Referring to fig. 1 to 5, an 800G optical module in a preferred embodiment of the present invention includes a PCB board 1, an optical transmitting assembly 2, an optical receiving assembly 3 and a mounting structure 4; wherein, this light emission subassembly 2 sets up on mounting structure 4, and light receiving module 3 corresponds to set up on PCB board 1, has seted up joint groove 401 on the mounting structure 4 corresponds, and one of them end of PCB board 1 corresponds the card and establishes in this joint groove 401, and this PCB board 1 and mounting structure 4 are in the mutual butt of card setting direction to PCB board 1 and mounting structure 4 are in perpendicular to card setting direction relatively fixed, and make the light emission subassembly 2 and the light receiving module 3 of dividing on mounting structure 4 and PCB board 1 relatively fixed under the user state. Preferably, the butt joint direction of the PCB board 1 and the mounting structure 4 is set to be transverse, and the PCB board 1 and the mounting structure 4 are relatively fixed in the longitudinal direction and the vertical direction, so that the two are kept in a relatively stable state.

In the setting process of the 800G optical module, the optical transmitting component 2 and the optical receiving component 3 are usually directly arranged on the PCB 1 or are isolated from the PCB 1, and compared with the conventional 200G or 400G optical module, the 800G optical module has higher transmission power, which also causes that the 800G optical module can generate larger heat in the working process, so that the PCB 1 and the conventional packaging structure are easy to generate expansion displacement, and the PCB 1, the optical transmitting component 2, the optical receiving component 3 and the like are not usually synchronously displaced, so that the deviation of the positions of the PCB 1, the optical transmitting component 2 and the optical receiving component 3 is caused, and the normal photoelectric signal transmission of the PCB, the optical transmitting component 2 and the optical receiving component 3 is further influenced, thereby causing the problem of optical signal loss.

According to the 800G optical module, the optical emission component 2 is used as a main heating device, and the optical emission component 2 is limited in the mounting structural member 4, and the transmission displacement between the mounting structural member 4 and the PCB 1 is limited, so that the optical emission component 2 and the PCB 1 are in a relatively constant state in a working state, the photoelectric signal transmission among the PCB 1, the optical emission component 2 and the optical receiving component 3 is ensured, and the efficient and stable operation of the 800G optical module is further ensured.

Further, as shown in fig. 4, as a preferred embodiment of the present application, the mounting structure 4 in the present application includes a first platform and a second platform attached to the outer sides of the upper and lower PCB boards 1 of the PCB board 1, and a clamping groove 401 is formed between the two platforms, where the clamping groove 401 is in a U-shape, a U-shaped bayonet is correspondingly disposed on the PCB board 1, and the U-shaped bayonet is correspondingly clamped in the clamping groove 401. In the process of butt-joint setting of the PCB board 1 and the mounting structure 4, it is necessary to ensure the relative fixation of the upper and lower end surfaces and the left and right end surfaces of the PCB board 1 and the mounting structure 4, so as to ensure stable connection of the upper and lower end surfaces and the left and right end surfaces. Therefore, the butt joint end part of the PCB 1 is set to be a U-shaped bayonet, the installation structural member 4 is correspondingly set to be a U-shaped clamping groove 401, the upper end face and the lower end face of the PCB 1 are clamped between the two platforms of the PCB 1, and the two sides of the PCB 1 are clamped with the two sides of the U-shaped clamping groove 401, so that the relative stability of the PCB 1 and the installation structural member 4 is ensured. Preferably, the conventional arrangement form of the PCB board 1 is provided with a U-shaped bayonet, so that the mounting groove of the mounting structure 4 is correspondingly provided with a U-shaped clamping groove 401, and the design structure of the PCB board 1 is not required to be changed under the condition of ensuring the connection stability of the mounting structure and the mounting structure, thereby reducing the manufacturing cost of the 800G optical module.

Further preferably, the mounting structure 4 may be provided here in one piece, but also in the form of a mating mounting of the first platform, the second platform or the U-shaped protrusion. Meanwhile, when the PCB 1 is set to be of a special shape, the butt joint section of the PCB 1 can be set to be convex at the end part, the mounting groove is correspondingly set to be in a U-shaped notch form, and the butt joint and the fixing can be completed similarly. In order to ensure stable installation between the installation structure 4 and the PCB board 1, after the two are installed in a matched manner, the two are required to be adhered and fixed by glue.

Further, as shown in fig. 3, as a preferred embodiment of the present application, a first mounting groove 402, a first mounting plane 403 and a second mounting groove 404 are sequentially disposed side by side at one end of the mounting structure 4 facing the light emitting component 2, the light emitting component 2 includes a multiple laser 201, a first coupling lens 202, a second coupling lens 203 and an emitting-end optical fiber array 204 matched with the multiple laser 201, wherein the first coupling lens 202 is disposed in the first mounting groove 402 corresponding to the multiple laser 201, the second coupling lens 203 is attached to the first mounting plane 403, and the emitting-end optical fiber array 204 is attached to the second mounting groove 404.

The light emitting assembly 2 operates as follows: the driving amplifier on the PCB board 1 modulates the received electric signal into the multipath laser 201 of the light emitting device, converts the electric signal into an optical signal, and then the multipath laser 201 collimates the optical signal and couples the optical signal to the corresponding port of the optical fiber array 204 at the transmitting end through the first coupling lens 202 and the second coupling lens 203, and then outputs the optical signal through other devices. In the transmission process of the optical signal, compared with the single coupling lens, the dual coupling lens is more convenient for adjusting the optical coupling efficiency, and the optical signal can be shaped through the first coupling lens 202 and then coupled into the optical fiber array through the second coupling lens 203. In order to enable the laser and the optical fiber array 204 at the transmitting end to have larger transmission distance and relative dislocation tolerance, the first coupling lens 202, the second coupling lens 203 and the optical fiber array 204 at the transmitting end are arranged in a vertically relative dislocation mode, so that the process difficulty of an optical module is reduced, the shape selection and the power control of a packaging scheme are greatly facilitated, the optical coupling efficiency can be conveniently adjusted, the finally output optical power is controlled within a required range, the packaging density is improved, the elements adopted in packaging are reduced, the volume is reduced, and the cost is reduced.

Preferably, the second coupling lens 203 is not disposed on the same plane as the transmitting-end optical fiber array 204, so that the transmitting-end optical fiber array 204 also needs to adjust the arrangement angle so that the optical signal emitted by the second coupling lens 203 can be correspondingly received by the transmitting-end optical fiber array 204. Meanwhile, the platform structure and the groove structure of the mounting structural member 4 are used for correspondingly placing the multipath lasers 201, the coupling lenses and the optical fiber arrays, and meanwhile, the strength and the stress distribution of the mounting structural member 4 can be enhanced.

Preferably, the multi-path laser 201 is preferably an eight-path laser, and the first coupling lens 202 and the second coupling lens 203 are correspondingly eight groups of coupling lenses, and each eight groups of coupling lenses may be a single discrete lens or a lens array.

It is further preferred that the bottom of the first mounting groove 402 is also provided with a heat dissipating member, which is mainly used for cooling the portion of the multiplex laser 201. Preferably, the heat dissipation component is a TEC and/or an aluminum nitride carrier, the TEC is a semiconductor refrigerator, and can be used for reducing heating power, and the aluminum nitride carrier is mainly used as a good insulating and heat conducting carrier for conducting heat on the multi-path laser 201 to the mounting structural member 4, and then the heat is dissipated to the outside through the mounting structural member 4.

Further, as a preferred embodiment of the present application, the optical receiving assembly 3 in the present application includes a transimpedance amplifier 301, a detector 302, and a receiving-end optical fiber array 303, which are sequentially connected, where the receiving-end optical fiber array 303 is disposed at a certain inclination angle with respect to the PCB board 1, so that an optical signal received by the receiving-end optical fiber array 303 is converted into an electrical signal and then transmitted to the PCB board 1. The light receiving assembly 3 operates as follows: the optical receiving assembly 3 transmits an optical signal transmitted from the outside to the receiving-end optical fiber array 303, the end of the receiving-end optical fiber array 303, which is arranged at an inclination angle, reflects the optical signal and transmits the optical signal to the photosensitive surface of the detector 302, then the detector 302 converts the multipath optical signal into an electrical signal, the electrical signal is amplified by the transimpedance amplifier 301 and then transmitted to the PCB 1, and the electrical signal is transmitted to the external single PCB 1 through the PCB 1.

Preferably, the front end of the receiving-end optical fiber array 303 is disposed at 40-50 ° so that the optical signal is directly transmitted to the PCB board 1 vertically. And, the light emitting assembly 2 and the light receiving assembly 3 are disposed on the same side of the PCB board 1.

Further, as a preferred embodiment of the present application, the difference between the expansion rate of the mounting structure 4 and the expansion rate of the PCB board 1 at 75 ℃ is 1ppm to 5 ppm. Normally, the theoretical working temperature of the 800G optical module is below 75 ℃, so that the mounting structural member 4 and the PCB board 1 basically do not deform relatively in the working state, and the deformation difference between the mounting structural member 4 and the PCB board 1 in the working state is between one part per million and five parts per million, so that the mounting structural member and the PCB board synchronously expand and contract. Further preferably, the mounting structure 4 is a tungsten-copper structure, the material of the mounting structure is W70Cu30, the content ratio of tungsten to copper elements is 70:30, and the thermal expansion coefficient of the mounting structure 4 and the PCB board 1 of the material is substantially the same or slightly smaller than that of the PCB board 1, so that the mounting structure and the PCB board 1 generate relatively small stress and deformation at the working temperature, the stable arrangement of the light emitting component 2 on the mounting structure 4 is ensured, and the mounting structure has better heat conducting capability for radiating the heat generated by the light emitting component 2 to the outside.

Further, as shown in fig. 2, as a preferred embodiment of the present application, the 800G optical module further includes a first cover 5 and a second cover 6. The first cover body 5 is arranged on the PCB board 1, a first sealed cavity is formed between the first cover body 5 and the PCB board 1, and the transimpedance amplifier 301, the detector 302 and the receiving-end optical fiber array 303 in the light receiving assembly 3 are correspondingly sealed in the first sealed cavity; the second cover 6 is disposed on the mounting structure 4, and a second sealed cavity is formed between the second cover 6 and the mounting structure 4, and the multi-path laser 201, the first coupling lens 202, the second coupling lens 203, the optical fiber array 204 at the transmitting end, and the like in the optical transmitting assembly 2 are all sealed in the second sealed cavity. The arrangement of the first cover body 5 and the second cover body 6 can well protect the light emitting component 2 and the light receiving component 3 so as to avoid displacement or damage of components and the like caused by external collision and the like and ensure stable use of the optical module.

Preferably, as shown in Figure 5, there is also an MPOMPO connector 7 on the side of the optical emission component 2 away from the optical receiving component 3, which is connected to the optical emission component 2 and the optical receiving component 3 through optical fibers. After receiving multiple optical signals emitted by the optical emission extension, it is transmitted to the optical receiving component 3 for optical signal transmission between the two. Because the mounting structure 4 itself is protruding in PCB board 1 surface, and MPOMPO connector 7 sets up in the one side that light emission component 2 deviates from light receiving component 3, consequently the optic fibre between light receiving component 3 and the MPOMPO connector 7 need cross the shell of second lid 6, and then be connected with MPOMPO connector 7 again, its fiber connection form is the extrusion that bumps into between the shell of optic fibre and second lid 6 in order to avoid, all set up the chute with the both sides of second lid 6 orientation light receiving component 3 and MPOMPO connector 7 to adapt to the setting angle of optic fibre, avoid it to receive the extrusion. Preferably, one side of the PCB board 1 facing away from the light emitting assembly 2 is further provided with a gold finger 8, and the gold finger 8 is mainly a conductive contact and is mainly used for signal transmission between the PCB board 1 and the outside.

Further, the light receiving assemblies 3 are arranged in pairs, and are connected with the MPOMPO connectors 7 by two groups of optical fibers, so that a branching block is further arranged on one side, away from the PCB board 1, of the second cover body 6, and the outer end area of the second cover body 6 is divided into two blocks for routing and arranging the optical fibers led out by the two light receiving assemblies 3.

The design of all elements in the 800G optical module considers the production efficiency and the automatic production requirement, structural devices, connection arrangement and the like are arranged by adopting the patch, the installation modes of each structure are simple, automatic mounting equipment can be directly adopted for full-automatic production, the manual dependence is reduced, and the production efficiency is improved.

It will be readily appreciated by those skilled in the art that the foregoing description is merely a preferred embodiment of the invention and is not intended to limit the invention, but any modifications, equivalents, improvements or alternatives falling within the spirit and principles of the invention are intended to be included within the scope of the invention.

Claims

1. An 800G optical module is characterized by comprising a PCB board, an optical emission component, an optical receiving component and a mounting structural component;

The mounting structural member is provided with a clamping groove, and one end of the PCB is correspondingly clamped in the clamping groove; the PCB and the mounting structural member are mutually abutted in the clamping direction, the PCB and the mounting structural member are relatively fixed in the direction perpendicular to the clamping direction, and the light emitting assembly and the light receiving assembly which are respectively arranged on the mounting structural member and the PCB are relatively fixed in the use state;

a first mounting groove, a first mounting plane and a second mounting groove are sequentially arranged on one end of the mounting structural member, which faces the light emitting assembly, side by side;

2. The 800G optical module of claim 1, wherein the first mounting groove and the first mounting plane are disposed at different planar heights, and the first coupling lens and the second coupling lens are at the same tilt angle relative to the PCB such that an optical signal emitted by the first coupling lens is received by the second coupling lens.

3. The 800G optical module of claim 1, wherein a heat dissipating component is further disposed at the bottom of the first mounting groove, and the first coupling lens is attached to the heat dissipating component corresponding to the laser.

4. The 800G optical module of claim 2, wherein the optical receiving assembly comprises a transimpedance amplifier, a detector and a receiving-end optical fiber array connected in sequence, and the receiving-end optical fiber array is arranged at an inclination angle with the PCB, so that an optical signal received by the receiving-end optical fiber array is converted into an electrical signal and transmitted to the PCB.

5. The 800G optical module of claim 1, wherein the mounting structure comprises a first platform and a second platform attached to the outer sides of the upper and lower board surfaces of the PCB, the first platform and the second platform form the clamping groove therebetween, the clamping groove is in a U-shaped configuration, a U-shaped bayonet is provided on the corresponding clamping end surface of the PCB, and the U-shaped bayonet is correspondingly clamped to the clamping groove.

6. The 800G optical module of any one of claims 1-5, wherein the difference in expansion rate between the mounting structure and the PCB board is 1 ppm-5 ppm at 75 ℃.

7. The 800G optical module of claim 3, wherein the heat sink assembly is a TEC and/or an aluminum nitride carrier.

8. The 800G optical module of any one of claims 1-5, further comprising a first cover and a second cover, wherein the first cover is correspondingly attached to the PCB, the first cover and the PCB form a first sealed cavity, and the light receiving assembly is correspondingly sealed in the first sealed cavity;

9. The 800G optical module of claim 8, wherein the side of the light emitting assembly facing away from the light receiving assembly is further provided with an MPO connector, the MPO connector connecting the light emitting assembly and the light receiving assembly via optical fibers, respectively;