CN203259691U - Parallel optical transmission-reception assembly for micro serial SCSI broadband high-speed transmission - Google Patents
Parallel optical transmission-reception assembly for micro serial SCSI broadband high-speed transmission Download PDFInfo
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- CN203259691U CN203259691U CN 201320240727 CN201320240727U CN203259691U CN 203259691 U CN203259691 U CN 203259691U CN 201320240727 CN201320240727 CN 201320240727 CN 201320240727 U CN201320240727 U CN 201320240727U CN 203259691 U CN203259691 U CN 203259691U
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Abstract
The utility model relates to a parallel optical transmission-reception assembly for micro serial SCSI broadband high-speed transmission. One end of a first printed circuit board and one end of a second printed circuit are both provided with a signal input port of a gold-plated plug structure. The first printed circuit board is connected with a third printed circuit board through a first flexible board, and the second printed circuit board is connected with the third printed circuit board through a second flexible board. A PD photoelectric detector array, a VCSEL vertical-cavity surface-emitting laser array, a TIA transimpedance amplifier and a laser driving chip are arranged on the surface of the third printed circuit board. An optical fiber array is arranged in an optical fiber orientation device, and the optical fiber array is in coupled alignment with the PD photoelectric detector array and the VCSEL vertical-cavity surface-emitting laser array. The optical fiber orientation device is fixed by a heat radiation device. According to the utility model, the optical coupling of photoelectric element arrays is realized by the technology of combining flexible and hard boards, and the quick heat radiation device is used for heat radiation, so that the parallel optical transmission-reception assembly has the advantages of high coupling efficiency, high transmission speed and good stability.
Description
Technical field
The utility model relates to parallel light transceiver component and the heat abstractor thereof of miniature serial SCSI broadband high-speed transmission, belongs to communication technique field.
Background technology
Along with the development of communication network technology, large capacity, become at a high speed the direction of optical communications module development, the serial hyperchannel can hot-swappable structure arise at the historic moment.The carrier that traditional miniature serial SCSI hyperchannel can hot-swappable structure be all propagated as signal with copper cable.
The utility model content
The purpose of this utility model is to overcome the deficiency that prior art exists, and a kind of parallel light transceiver component of miniature serial SCSI broadband high-speed transmission is provided.
The purpose of this utility model is achieved through the following technical solutions:
A kind of parallel light transceiver component of miniature serial SCSI broadband high-speed transmission; Characteristics are: comprise the first printed circuit board (PCB); The second printed circuit board (PCB); The 3rd printed circuit board (PCB); The first soft board; The second soft board; Fiber array and optical fiber aligning device; One end of described the first printed circuit board (PCB) and the second printed circuit board (PCB) all is formed with the signal input port of gold-plated board plug structure; The first printed circuit board (PCB) is connected with the 3rd printed circuit board (PCB) by the first soft board; The second printed circuit board (PCB) is connected with the 3rd printed circuit board (PCB) by the second soft board; The 3rd printed circuit board surface is provided with the PD photodetector array; VCSEL vertical cavity emitting laser array; TIA trans-impedance amplifier and laser driving chip; The first printed circuit board (PCB) and the second printed circuit board (PCB) are provided with the hole that is complementary with bolt and the draw-in groove that is complementary with clasp; The fiber array front end is placed in the optical fiber aligning device; Fiber array and PD photodetector array and VCSEL vertical cavity emitting laser array are coupled and aligned; The optical fiber aligning device is fixed by heat abstractor;
Described heat abstractor comprises the first heat-conducting pad, the second heat-conducting pad, heat sink, clamp and sealing gland, the one side of the first heat-conducting pad and heat sink applying, the other one side of the first heat-conducting pad is fitted with the 3rd printed circuit board (PCB), heat sink below arranges the second heat-conducting pad, the heat sink U font draw-in groove that is complementary with clamp that is provided with, clamp is loaded in U font draw-in groove, and the optical fiber aligning device is placed in the groove of clamp, and sealing gland is installed on clamp.
Further; The parallel light transceiver component of above-mentioned a kind of miniature serial SCSI broadband high-speed transmission; Fixed or elargol is mounted on substrate base by AuSn alloy nation for described PD photodetector array and VCSEL vertical cavity emitting laser array; The substrate base that is pasted with PD photodetector array and VCSEL vertical cavity emitting laser array mounts by fixing glue and is assembled on the 3rd printed panel; PD photodetector array and VCSEL vertical cavity emitting laser array are electrically connected by gold thread bonding mode; TIA trans-impedance amplifier and laser driving chip mount and are electrically connected by flipchip reverse installation process mode; The two ends of substrate base are by each sticking pad of putting of fixing glue.
Further, the parallel light transceiver component of above-mentioned a kind of miniature serial SCSI broadband high-speed transmission, described PD photodetector array, VCSEL vertical cavity emitting laser array and pad are arranged side by side on substrate base, substrate base is mounted on the centre of the 3rd printed circuit board (PCB), the TIA trans-impedance amplifier be arranged on the PD photodetector array directly over, laser driving chip be arranged on VCSEL vertical cavity emitting laser array under.
The substantive distinguishing features that technical solutions of the utility model are outstanding and significant progressive being mainly reflected in:
Parallel light transceiver component and the heat abstractor thereof of a kind of simple miniature serial SCSI broadband high-speed transmission of the utility model design are filled up the blank that miniature serial SCS hyperchannel can hot-swappable cable configuration.Adopt the technology of unique rigid-flex combination, adopt the active alignment technology to carry out optical coupled to VCSEL laser array and PD photodetector array, realize heat radiation by rapid heat radiation device, to guarantee that coupling efficiency is high, transmission speed fast and the characteristic such as good stability, this structure has that coupling efficiency is high, processing cost is low, operation is few, volume is little, transmission speed is fast and the characteristics such as good stability, is fit to mass production applications.
Description of drawings
Below in conjunction with accompanying drawing, technical solutions of the utility model are described further:
Fig. 1: the utility model one-piece construction schematic diagram;
Fig. 2: parallel light transceiver component and heat abstractor decomposing schematic representation;
Fig. 3: parallel light transceiver component decomposing schematic representation;
Fig. 4: photoelectric component assembling schematic diagram;
Fig. 5: heat abstractor decomposing schematic representation.
Embodiment
The utility model design a kind of applicable to miniature serial SCSI the broadband high-speed transmission parallel light transceiver component in can hot-swappable cable configuration, this assembly can be realized the mutual conversion of multi-channel electric signal and light signal in a monomer structure, have that integrated level is high, volume is little and the remarkable advantage such as transmission speed is fast.This assembly has special soft or hard combination, and heat dissipation problem is particularly outstanding, has therefore designed the heat abstractor that is complementary with this parallel light transceiver component.
As Fig. 1; Shown in Figure 2; A kind of parallel light transceiver component of miniature serial SCSI broadband high-speed transmission; Light transmitting-receiving subassembly 1 is assembled mutually with heat abstractor 2; Heat abstractor 2 and the 3rd printed circuit board (PCB) 5 fit tightly; To guarantee that coupling efficiency is high; The characteristics such as the fast and good stability of transmission speed; Light transmitting-receiving subassembly 1 comprises the first printed circuit board (PCB) 3; The second printed circuit board (PCB) 4; The 3rd printed circuit board (PCB) 5; The first soft board 6; The second soft board 7; Fiber array 8 and optical fiber aligning device 9; One end of the first printed circuit board (PCB) 3 and the second printed circuit board (PCB) 4 all is formed with the signal input port 10 of gold-plated board plug structure; The first printed circuit board (PCB) 3 is connected with the 3rd printed circuit board (PCB) 5 by the first soft board 6; The second printed circuit board (PCB) 4 is connected with the 3rd printed circuit board (PCB) 5 by the second soft board 7; The 3rd printed circuit board (PCB) 5 surfaces are provided with PD photodetector array 17; VCSEL vertical cavity emitting laser array 18; TIA trans-impedance amplifier 13 and laser driving chip 14; The first printed circuit board (PCB) 3 and the second printed circuit board (PCB) 4 are provided with the hole 11 that is complementary with bolt and the draw-in groove 12 that is complementary with clasp; Be used for the fixing of light transmitting-receiving subassembly; Fiber array 8 is placed in optical fiber aligning device 9, and fiber array 8 is coupled and aligned with PD photodetector array 17 and VCSEL vertical cavity emitting laser array 18 and carries out the signal transmission, and optical fiber aligning device 9 is fixed by the clamp 22 in heat abstractor 2.
As shown in Figure 5, heat abstractor 2 comprises the first heat-conducting pad 19, the second heat-conducting pad 20, heat sink 21, clamp 22 and sealing gland 23, the one side of the first heat-conducting pad 19 is fitted with heat sink 21, the other one side of the first heat-conducting pad 19 is fitted with the 3rd printed circuit board (PCB) 5, heat sink 21 below arranges the second heat-conducting pad 20, heat sink 21 are provided with the U font draw-in groove that is complementary with clamp 22, clamp 22 is loaded in U font draw-in groove, optical fiber aligning device 9 is placed in the groove of clamp 22, and sealing gland 23 is installed on clamp 22.The heat that photoelectric component when work produces is diffused into device outer case by heat conduction the first heat-conducting pad 19, the second heat-conducting pad 20 and heat sink 21 etc. and realizes the effect of dispelling the heat.
When light transmitting-receiving subassembly 1 is assembled with heat abstractor 2, first utilize fixing glue that clamp 22 and the 3rd printed circuit board (PCB) 5 are assembled, then the first heat-conducting pad 19 and the 3rd printed circuit board (PCB) 5 are fitted, the other one side of the first heat-conducting pad 19 is fitted with heat sink 21, utilizes heat sink 21 U font draw-in groove and the fixing glue that are complementary with clamp 22 to carry out dual fixing; Heat sink 21 below arranges the second heat-conducting pad 20, and the second heat-conducting pad 20 directly is connected with shell; By fitting tightly of each parts, realize that heat from photoelectric component to the three printed circuit board (PCB)s 5, the first heat-conducting pad 19, heat sink the 21, second heat-conducting pad 20, is delivered to shell at last.
As shown in Figure 3, fixed or elargol is mounted on substrate base 15 by AuSn alloy nation for PD photodetector array 17 and VCSEL vertical cavity emitting laser array 18, the substrate base 15 that is pasted with PD photodetector array 17 and VCSEL vertical cavity emitting laser array 18 mounts by fixing glue and is assembled on the 3rd printed panel 5, PD photodetector array 17 is electrically connected by gold thread bonding mode with VCSEL vertical cavity emitting laser array 18, and TIA trans-impedance amplifier 13 mounts and is electrically connected by flipchip reverse installation process mode with laser driving chip 14; Each sticking puts a pad 16 by fixing glue at the two ends of substrate base 15, prevents that optical fiber aligning device 9 and fiber array 8 from breaking photoelectric device with PD photodetector array 17 and 18 coupling of VCSEL vertical cavity emitting laser array the time.As shown in Figure 4, PD photodetector array 17, VCSEL vertical cavity emitting laser array 18 and pad 16 are arranged side by side on substrate base 15, substrate base 15 is mounted on the centre of the 3rd printed circuit board (PCB) 5, TIA trans-impedance amplifier 13 be arranged on PD photodetector array 17 directly over, laser driving chip 14 be arranged on VCSEL vertical cavity emitting laser array 18 under.
Parallel light transceiver component and the heat abstractor thereof of a kind of simple miniature serial SCSI broadband high-speed transmission of the utility model design are filled up the blank that miniature serial SCS hyperchannel can hot-swappable cable configuration.Adopt the technology of unique rigid-flex combination, adopt the active alignment technology to carry out optical coupled to VCSEL laser array and PD photodetector array, realize heat radiation by rapid heat radiation device, to guarantee that coupling efficiency is high, transmission speed fast and the characteristic such as good stability, this structure has that coupling efficiency is high, processing cost is low, operation is few, volume is little, transmission speed is fast and the characteristics such as good stability, is fit to mass production applications.
What need to understand is: the above is only preferred implementation of the present utility model; for those skilled in the art; under the prerequisite that does not break away from the utility model principle; can also make some improvements and modifications, these improvements and modifications also should be considered as protection domain of the present utility model.
Claims (3)
1. the parallel light transceiver component of a miniature serial SCSI broadband high-speed transmission; It is characterized in that: comprise the first printed circuit board (PCB); The second printed circuit board (PCB); The 3rd printed circuit board (PCB); The first soft board; The second soft board; Fiber array and optical fiber aligning device; One end of described the first printed circuit board (PCB) and the second printed circuit board (PCB) all is formed with the signal input port of gold-plated board plug structure; The first printed circuit board (PCB) is connected with the 3rd printed circuit board (PCB) by the first soft board; The second printed circuit board (PCB) is connected with the 3rd printed circuit board (PCB) by the second soft board; The 3rd printed circuit board surface is provided with the PD photodetector array; VCSEL vertical cavity emitting laser array; TIA trans-impedance amplifier and laser driving chip; The first printed circuit board (PCB) and the second printed circuit board (PCB) are provided with the hole that is complementary with bolt and the draw-in groove that is complementary with clasp; The fiber array front end is placed in the optical fiber aligning device; Fiber array and PD photodetector array and VCSEL vertical cavity emitting laser array are coupled and aligned; The optical fiber aligning device is fixed by heat abstractor; Described heat abstractor comprises the first heat-conducting pad, the second heat-conducting pad, heat sink, clamp and sealing gland, the one side of the first heat-conducting pad and heat sink applying, the other one side of the first heat-conducting pad is fitted with the 3rd printed circuit board (PCB), heat sink below arranges the second heat-conducting pad, the heat sink U font draw-in groove that is complementary with clamp that is provided with, clamp is loaded in U font draw-in groove, and the optical fiber aligning device is placed in the clamp groove, and sealing gland is installed on clamp.
2. the parallel light transceiver component of a kind of miniature serial SCSI broadband high-speed transmission according to claim 1; It is characterized in that: fixed or elargol is mounted on substrate base by AuSn alloy nation for described PD photodetector array and VCSEL vertical cavity emitting laser array; The substrate base that is pasted with PD photodetector array and VCSEL vertical cavity emitting laser array mounts by fixing glue and is assembled on the 3rd printed panel; PD photodetector array and VCSEL vertical cavity emitting laser array are electrically connected by gold thread bonding mode; TIA trans-impedance amplifier and laser driving chip mount and are electrically connected by flipchip reverse installation process mode; The two ends of substrate base are by each sticking pad of putting of fixing glue.
3. the parallel light transceiver component of a kind of miniature serial SCSI broadband high-speed transmission according to claim 2, it is characterized in that: described PD photodetector array, VCSEL vertical cavity emitting laser array and pad are arranged side by side on substrate base, substrate base is mounted on the centre of the 3rd printed circuit board (PCB), the TIA trans-impedance amplifier be arranged on the PD photodetector array directly over, laser driving chip be arranged on VCSEL vertical cavity emitting laser array under.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320240727 CN203259691U (en) | 2013-05-07 | 2013-05-07 | Parallel optical transmission-reception assembly for micro serial SCSI broadband high-speed transmission |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320240727 CN203259691U (en) | 2013-05-07 | 2013-05-07 | Parallel optical transmission-reception assembly for micro serial SCSI broadband high-speed transmission |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203259691U true CN203259691U (en) | 2013-10-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320240727 Expired - Fee Related CN203259691U (en) | 2013-05-07 | 2013-05-07 | Parallel optical transmission-reception assembly for micro serial SCSI broadband high-speed transmission |
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| CN (1) | CN203259691U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103257413A (en) * | 2013-05-07 | 2013-08-21 | 苏州旭创科技有限公司 | Parallel light transmit-receive component of mini serial SCSI broadband high-speed transmission |
| CN104767561A (en) * | 2014-01-03 | 2015-07-08 | 上海光维通信技术股份有限公司 | Multi-channel laser output device and testing device for MPO (Maximum Power Output) optical fiber connector |
| CN107608038A (en) * | 2017-09-18 | 2018-01-19 | 青岛海信宽带多媒体技术有限公司 | A kind of optical secondary module and optical module |
| US11937382B2 (en) * | 2015-07-30 | 2024-03-19 | Lg Innotek Co., Ltd. | Substrate unit and substrate assembly, and camera module using same |
-
2013
- 2013-05-07 CN CN 201320240727 patent/CN203259691U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103257413A (en) * | 2013-05-07 | 2013-08-21 | 苏州旭创科技有限公司 | Parallel light transmit-receive component of mini serial SCSI broadband high-speed transmission |
| CN103257413B (en) * | 2013-05-07 | 2015-02-25 | 苏州旭创科技有限公司 | Parallel light transmit-receive component of mini serial SCSI broadband high-speed transmission |
| CN104767561A (en) * | 2014-01-03 | 2015-07-08 | 上海光维通信技术股份有限公司 | Multi-channel laser output device and testing device for MPO (Maximum Power Output) optical fiber connector |
| US11937382B2 (en) * | 2015-07-30 | 2024-03-19 | Lg Innotek Co., Ltd. | Substrate unit and substrate assembly, and camera module using same |
| CN107608038A (en) * | 2017-09-18 | 2018-01-19 | 青岛海信宽带多媒体技术有限公司 | A kind of optical secondary module and optical module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131030 Termination date: 20160507 |