CN111405144A - Manufacturing method of camera module and terminal processing equipment - Google Patents
Manufacturing method of camera module and terminal processing equipment Download PDFInfo
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- CN111405144A CN111405144A CN201910000829.4A CN201910000829A CN111405144A CN 111405144 A CN111405144 A CN 111405144A CN 201910000829 A CN201910000829 A CN 201910000829A CN 111405144 A CN111405144 A CN 111405144A
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- 238000012545 processing Methods 0.000 title claims abstract description 159
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 238000004806 packaging method and process Methods 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 claims description 52
- 229910000679 solder Inorganic materials 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 19
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 239000000945 filler Substances 0.000 claims description 10
- 230000005540 biological transmission Effects 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 238000004891 communication Methods 0.000 claims description 7
- 238000001746 injection moulding Methods 0.000 claims description 5
- 230000002457 bidirectional effect Effects 0.000 claims description 3
- 230000015556 catabolic process Effects 0.000 claims description 3
- 238000006731 degradation reaction Methods 0.000 claims description 3
- 230000020169 heat generation Effects 0.000 claims description 3
- 239000000872 buffer Substances 0.000 claims description 2
- 230000002708 enhancing effect Effects 0.000 claims description 2
- 238000002347 injection Methods 0.000 claims description 2
- 239000007924 injection Substances 0.000 claims description 2
- 238000012858 packaging process Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 10
- 230000008054 signal transmission Effects 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 238000005476 soldering Methods 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000013144 data compression Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
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- 230000006872 improvement Effects 0.000 description 1
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- 238000003698 laser cutting Methods 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
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- Signal Processing (AREA)
- Studio Devices (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
The invention provides a manufacturing method of a camera module and terminal processing equipment, wherein the manufacturing method comprises the following steps: providing a camera, a flexible circuit board, a co-processing chip and a connector, wherein the co-processing chip, the connector and the flexible circuit board are assembled into a packaging piece; and transferring part of data processing functions in the image sensor chip of the camera to the co-processing chip so as to reduce the power consumption of the image sensor chip in the camera module and improve the performance of the camera module.
Description
Technical Field
The invention relates to the technical field of camera modules, in particular to a manufacturing method of a camera module and terminal processing equipment.
Background
Image Signal Processing (ISP) is a commonly used camera processing technique, which performs post-processing on Image data output from an Image sensor according to the requirements of human vision. With the continuous improvement of camera pixels, the requirement on image processing capacity in the later period is higher and higher. The low pixel image sensor is provided with an ISP processing unit, and the high pixel image sensor generally adopts a scheme of Raw format output plus platform ISP. But limited by the transmission bandwidth of the camera module and the ISP chip, the high-end image sensor also has a built-in ISP to preprocess and compress the image to alleviate the bandwidth problem and the pressure of the platform ISP.
Referring to fig. 1, a current high-end image sensor generally adopts a stacked design, and a stacked image sensor is formed by stacking an image sensor chip 1 and a chip 2 for ISP processing, so that the chip for ISP processing does not occupy other spaces in a camera module, so as to reduce the area of the whole camera module and form a high-pixel camera module. However, bonding the image sensor chip 1 and the chip 2 for ISP processing results in an increase in the height of the entire camera module and affects the yield of the camera module. In addition, the chip 2 for ISP processing consumes a large amount of power and generates heat seriously, and thermal noise is introduced into an image signal of the camera module.
Disclosure of Invention
The invention aims to provide a manufacturing method of a camera module and terminal processing equipment, which solve the technical problems that the height of the camera module is increased, the yield is influenced and thermal noise is generated due to a chip for ISP processing in the prior art.
In order to solve the above technical problem, the present invention provides a method for manufacturing a camera module, including:
providing a camera, a flexible circuit board, a co-processing chip and a connector, wherein the co-processing chip, the connector and the flexible circuit board are assembled into a packaging piece;
and transferring part of data processing functions in the image sensor chip of the camera to the co-processing chip so as to reduce the power consumption of the image sensor chip in the camera module and improve the performance of the camera module.
Optionally, the manufactured structure is applied to a non-stacked image sensor module.
Optionally, the camera transmits the original image signal to the co-processing chip, and the co-processing chip performs caching or compression processing on the original image signal, so that a peak bandwidth transmitted by the co-processing chip to the terminal processing device through the connector is smaller than a peak bandwidth transmitted by the image sensor to the co-processing chip.
Optionally, the distance between the co-processing chip and the image sensor chip is greater than or equal to 0.2 mm, so as to reduce image quality degradation caused by heat generation of the co-processing chip on the image sensor chip.
Optionally, a communication protocol between the camera and the co-processing chip is defined to transmit image signals, and the number of pins for transmitting image signals between the camera and the co-processing chip is less than the number of pins for transmitting image signals between the co-processing chip and the connector, so that the wiring complexity of the flexible circuit board is reduced.
Optionally, a communication protocol between the camera and the co-processing chip is defined as a bidirectional transmission protocol, a serial interface for controlling the image sensor chip is omitted, and complexity of wiring of the flexible circuit board is reduced.
Optionally, an adhesive filler is disposed between the co-processing chip and the flexible circuit board, and the co-processing chip and the adhesive filler are used for enhancing strength of the flexible circuit board to support plugging and unplugging of the connector.
Optionally, solder bumps are prepared on the surface of the substrate, the co-processing chip and the substrate are packaged and injection-molded, the connector and the substrate are welded, the substrate is cut, and the solder bumps are welded to the flexible circuit board so that the co-processing chip, the connector and the flexible circuit board are packaged into a whole, and the co-processing chip and the connector are located on the same surface of the flexible circuit board.
Optionally, the co-processing chip and the substrate are packaged and semi-injection molded, solder bumps are prepared on the surface of the substrate, the connector and the substrate are welded, the substrate is cut, and the solder bumps are welded to the flexible circuit board, so that the co-processing chip, the connector and the flexible circuit board are packaged into a whole, and the co-processing chip and the connector are located on the same surface of the flexible circuit board.
Optionally, the co-processing chip and the substrate are packaged, glue is dispensed outside a metal lead of the co-processing chip, a solder bump is prepared on the surface of the substrate, the connector and the substrate are welded, the substrate is cut, the solder bump is welded to the flexible circuit board, so that the co-processing chip, the connector and the flexible circuit board are packaged into a whole, and the co-processing chip and the connector are located on the same surface of the flexible circuit board.
Optionally, the co-processing chip and the substrate are subjected to packaging and injection molding processes, the substrate is cut, and the co-processing chip, the connector and the flexible circuit board are packaged into a whole, wherein the co-processing chip and the connector are located on two sides of the flexible circuit board.
Correspondingly, the invention also provides a terminal processing device, which comprises: the main board is electrically connected with the connector, and the main board receives the image signal processed by the co-processing chip through the connector.
Compared with the prior art, the manufacturing method of the camera module and the terminal processing equipment have the following beneficial effects:
in the camera module, the co-processing chip, the connector and the flexible circuit board are assembled into a packaging piece, and part of data processing functions in the image sensor chip of the camera are transferred to the co-processing chip, so that the power consumption of the image sensor chip in the camera module is reduced, and the performance of the camera module is improved.
Drawings
FIG. 1 is a schematic diagram of a stacked image sensor in the prior art;
fig. 2 is a schematic structural diagram of a camera module according to an embodiment of the invention;
FIG. 3 is a schematic diagram of signal transmission according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a wiring diagram according to an embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a camera module according to a second embodiment of the present invention;
fig. 6 is a schematic structural diagram of a camera module according to a third embodiment of the present invention;
fig. 7 is a schematic structural diagram of a camera module according to a fourth embodiment of the present invention.
Detailed Description
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, but rather construed as limited to the embodiments set forth herein.
Next, the present invention is described in detail by using schematic diagrams, and when the embodiments of the present invention are described in detail, the schematic diagrams are only examples for convenience of description, and the scope of the present invention should not be limited herein.
In order to make the above objects, features and advantages of the present invention more comprehensible, a method of manufacturing a camera module according to the present invention is described in detail below with reference to the accompanying drawings.
In the manufacturing method, the camera, the flexible circuit board, the co-processing chip and the connector are provided, the co-processing chip, the connector and the flexible circuit board are assembled into a packaging piece, and part of data processing functions in the image sensor chip of the camera are transferred to the co-processing chip, so that the power consumption of the image sensor chip in the camera module is reduced, and the performance of the camera module is improved. The camera module formed by the manufacturing method is used for a non-stack type image sensor.
Example one
Referring to fig. 2, the camera module of the present invention includes a camera 10, a flexible circuit board (FPC) 20, a co-processing chip (ISP Bridge) 42, and Connectors (Connectors) 30. The camera 10 includes an image sensor chip (not shown in fig. 2) and a metal wire electrically connected to the image sensor chip, wherein the metal wire electrically connects the image sensor chip to the flexible circuit board. And packaging the cut co-processing chip 42 and the substrate 41, wherein the processes comprise die welding, lead welding and the like, the substrate 41 is a printed circuit board, then, an injection molding process is performed, laser marking and cutting are performed on the substrate 41, and the substrate 41 and the connector 30 are respectively welded on the front surface and the back surface of the flexible circuit board 20, so that the co-processing chip 42, the connector 30 and the flexible circuit board 20 are packaged into an integral package, and the co-processing chip 42 and the connector 30 are positioned on the two surfaces of the flexible circuit board 20. The soldering process may include laser soldering or reflow soldering, among others. The integral package can then be mounted on the handset motherboard.
Referring to fig. 3, the image sensor chip transmits an original image signal to the co-processing chip 42, and the original image signal is processed by the co-processing chip 42, wherein the co-processing chip 42 performs ISP processing on the original image signal, including high dynamic range rendering (HDR), Phase Detection Auto Focus (PDAF), De-noise (De-noise), auto white balance, data compression, auto exposure control, dead pixel removal, tone adjustment, and the like. The processed image signal is then transmitted by the connector 30 to an image signal processing chip (not shown) in the main processor of the terminal processing device, and the image signal processing chip further processes the received image signal. For example, in an embodiment of the present invention, the image sensor chip of the camera 10 transmits the original image signal to the co-processing chip 42, the data of the original image signal is large, the co-processing chip 42 firstly buffers or compresses the original image signal, and the co-processing chip 42 then transmits the compressed data to the terminal processing device through the connector 30, so as to improve the data transmission efficiency. Wherein the peak bandwidth transmitted by the co-processor chip 42 to the terminal processing device (not labeled) via the connector 30 is smaller than the peak bandwidth transmitted by the image sensor chip to the co-processor chip 42.
Continuing with fig. 2, the co-processing chip 42 is spaced apart from the image sensor chip in the camera to enhance heat dissipation of the image sensor chip and the co-processing chip and improve heat dissipation performance of the camera module, in an embodiment, the spacing between the co-processing chip 42 and the image sensor chip is greater than or equal to 0.2 mm to reduce image quality degradation caused by heat generation of the co-processing chip 42 on the image sensor chip.
In addition, the flexible material of the flexible circuit board 20 has low mechanical strength, and in the present invention, an adhesive filler is disposed between the co-processing chip 42 and the flexible circuit board 20, and the adhesive filler can realize adhesion between the co-processing chip 42 and the flexible circuit board 20, and simultaneously, the co-processing chip 42 and the adhesive filler can enhance the mechanical strength of the flexible circuit board 20 to support insertion and extraction of the connector 30.
In order to reduce the complexity of metal wiring in the flexible circuit board 20, a communication protocol between the camera 10 and the co-processing chip 42 is defined to perform image signal transmission, so that the number of pins for image signal transmission between the camera 10 and the co-processing chip 42 in the flexible circuit board 20 is less than the number of pins for image signal transmission between the co-processing chip 42 and the connector 30. For example, referring to fig. 4, the image sensor chip transmits the original image signal to the co-processing chip 42 based on a CPHY high-speed communication protocol, two groups of pins are arranged between the image sensor chip and the co-processing chip 42, each group of 3 wires includes 6 wires, and the transmission rate is 3Gbps to 8 Gbps. Image signals are transmitted between the co-processing chip 42 and the connector 30 through an MIPI protocol, and four-wire MIPI is arranged between the co-processing chip 42 and the connector 30 and comprises 4 pairs of data wires and a pair of clock wires, and the total number of wires is 10. Meanwhile, 2I 2C wires need to be arranged between the co-processing chip 42 and the connector 30 for controlling signal transmission, so that 12 wires are arranged between the co-processing chip 42 and the connector 30.
In addition, the communication protocol between the camera 10 and the co-processing chip 42 is a bidirectional transmission protocol, a serial interface for controlling the image sensor chip is omitted, and the uplink speed is high, and the downlink speed is low, that is, the speed at which the camera 10 transmits the image signal to the co-processing chip 42 adopts high-speed transmission, and the speed at which the co-processing chip 42 transmits the signal to the camera 10 adopts low-speed transmission, so that the power consumption of the whole camera module is reduced.
It should be noted that, because the distance between the co-processing chip and the camera is greater than the distance between the co-processing chip and the connector, in the present invention, in order to reduce the difficulty of metal wiring between the co-processing chip and the camera in the flexible circuit board, the number of pins for image signal transmission between the camera and the co-processing chip is less than the number of pins for image signal transmission between the co-processing chip 42 and the connector 30, and a serial interface for controlling the image sensor chip between the camera and the co-processing chip is omitted.
Example two
Referring to fig. 5, a solder bump 43 is prepared on the surface of the substrate 41, and the cut co-processing chip 42 and the substrate 41 are packaged, including processes of die bonding, wire bonding, and the like, where the solder bump 43 is located around the co-processing chip 42. Thereafter, an injection molding process is performed, and the top of the solder bump 43 is exposed. Then, the connector 30 is soldered to the substrate 41, the connector is electrically connected to the substrate 41 through the pads on the surface of the substrate 41, the substrate 41 is cut, and the solder bumps 43 are soldered to the flexible circuit board 20, so that the co-processing chip 42, the connector 30, and the flexible circuit board 20 are packaged as a whole, and the co-processing chip 42 and the connector 30 are located on the same surface of the flexible circuit board 20.
Further, after the co-processing chip, the connector and the flexible circuit board are packaged into a whole, an adhesive filler can be filled between the co-processing chip 42 and the flexible circuit board 20, the adhesive filler can realize adhesion between the co-processing chip 42 and the flexible circuit board 20, and meanwhile, the co-processing chip 42 and the adhesive filler can enhance the mechanical strength of the flexible circuit board 20 so as to support the plugging and unplugging of the connector 30.
EXAMPLE III
Referring to fig. 6, the cut co-processing chip 42 and the substrate 41 are packaged, including die bonding, wire bonding, and other processes. Then, a half-injection molding process is performed, in which only a portion of the substrate 41 is covered and a portion of the periphery of the substrate 41 is exposed. Then, solder bumps 43 are formed on the surface of the substrate 41, and the solder bumps 43 are located on two sides of the co-processing chip 42. The connector 30 is soldered to the substrate 41, and the connector is electrically connected to the substrate 41 via the land on the surface of the substrate 41, thereby cutting the substrate 41. And thirdly, soldering the solder bumps 43 to the flexible circuit board 20 to package the co-processing chip 42, the connector 30 and the flexible circuit board 20 into a whole, wherein the co-processing chip 42 and the connector 30 are located on the same surface of the flexible circuit board 20.
Example four
Referring to fig. 7, the cut co-processing chip 42 and the substrate 41 are packaged, including die bonding, wire bonding, and other processes, dispensing glue outside the metal leads of the co-processing chip 42 to protect the metal leads, and preparing solder bumps 43 on the surface of the substrate 41, where the solder bumps 43 are located on two sides of the co-processing chip 42. The connector 30 is soldered to the substrate 41, and the connector is electrically connected to the substrate 41 via the land on the surface of the substrate 41, thereby cutting the substrate 41. And thirdly, soldering the solder bumps 43 to the flexible circuit board 20 to package the co-processing chip 42, the connector 30 and the flexible circuit board 20 into a whole, wherein the co-processing chip 42 and the connector 30 are located on the same surface of the flexible circuit board 20.
EXAMPLE five
The present invention also provides a terminal processing device, comprising: the mainboard is electrically connected with the connector, and the mainboard receives the image signals processed by the co-processing chip through the connector, namely, the image signals processed by the co-processing chip are received by the image signal processing chip on the mainboard and then are further processed, so that the pressure of the image signal processing chip on image processing is relieved, and the image quality is improved.
In summary, in the image sensor manufacturing method of the present invention, the camera, the flexible circuit board, the co-processing chip and the connector are provided, the co-processing chip, the connector and the flexible circuit board are assembled into a package, and part of the data processing function in the image sensor chip of the camera is transferred to the co-processing chip, so as to reduce the power consumption of the image sensor chip in the camera module and improve the performance of the camera module.
Although the present invention has been described with reference to the preferred embodiments, it is not intended to limit the present invention, and those skilled in the art can make variations and modifications of the present invention without departing from the spirit and scope of the present invention by using the methods and technical contents disclosed above.
Claims (12)
1. A manufacturing method of a camera module is characterized by comprising the following steps:
providing a camera, a flexible circuit board, a co-processing chip and a connector, wherein the co-processing chip, the connector and the flexible circuit board are assembled into a packaging piece;
and transferring part of data processing functions in the image sensor chip of the camera to the co-processing chip so as to reduce the power consumption of the image sensor chip in the camera module and improve the performance of the camera module.
2. The method of claim 1, wherein the structure is applied to a non-stacked image sensor module.
3. The method of claim 1, wherein the camera transmits an original image signal to the co-processing chip, and the co-processing chip buffers or compresses the original image signal, such that a peak bandwidth transmitted from the co-processing chip to the terminal processing device via the connector is smaller than a peak bandwidth transmitted from the image sensor to the co-processing chip.
4. The method for manufacturing a camera module according to claim 1, wherein the distance between the co-processing chip and the image sensor chip is greater than or equal to 0.2 mm, so as to reduce image degradation caused by heat generation of the co-processing chip on the image sensor chip.
5. The method for manufacturing the camera module according to claim 1, wherein a communication protocol between the camera and the co-processing chip is defined for transmitting image signals, and the number of pins for transmitting image signals between the camera and the co-processing chip is less than that between the co-processing chip and the connector, so that the wiring complexity of a flexible circuit board is reduced.
6. The method for manufacturing the camera module according to claim 1, wherein a communication protocol between the camera and the co-processing chip is defined as a bidirectional transmission protocol, a serial interface for controlling the image sensor chip is omitted, and the wiring complexity of the flexible circuit board is reduced.
7. The method for manufacturing the camera module according to claim 1, wherein an adhesive filler is provided between the co-processing chip and the flexible circuit board, and the co-processing chip and the adhesive filler are used for enhancing the strength of the flexible circuit board to support the plugging and unplugging of the connector.
8. The method of claim 1, wherein the solder bumps are formed on a surface of a substrate, the co-processing chip and the substrate are packaged and injection-molded, the connector and the substrate are soldered, the substrate is cut, and the solder bumps are welded to the flexible printed circuit board to integrate the co-processing chip, the connector and the flexible printed circuit board, wherein the co-processing chip and the connector are located on a same surface of the flexible printed circuit board.
9. The method of claim 1, wherein the co-processing chip and the substrate are packaged and semi-injection molded, solder bumps are formed on the surface of the substrate, the connector is soldered to the substrate, the substrate is cut, and the solder bumps are welded to the flexible printed circuit board to integrate the co-processing chip, the connector and the flexible printed circuit board, wherein the co-processing chip and the connector are located on the same surface of the flexible printed circuit board.
10. The method of claim 1, wherein the co-processing chip is packaged with the substrate, dispensing is performed outside the metal leads of the co-processing chip, solder bumps are formed on the surface of the substrate, the connector is soldered to the substrate, the substrate is cut, and the solder bumps are soldered to the flexible circuit board so that the co-processing chip, the connector and the flexible circuit board are packaged as a whole, and the co-processing chip and the connector are located on the same surface of the flexible circuit board.
11. The method for manufacturing a camera module according to claim 1, wherein the co-processing chip and the substrate are subjected to a packaging and injection molding process, the substrate is cut, and the co-processing chip, the connector and the flexible circuit board are packaged into a whole, and the co-processing chip and the connector are located on two sides of the flexible circuit board.
12. A terminal processing device, comprising: the main board and the camera module formed by the manufacturing method according to any one of claims 1 to 11, wherein the main board is electrically connected with the connector, and the main board receives the image signal processed by the co-processing chip through the connector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201910000829.4A CN111405144A (en) | 2019-01-02 | 2019-01-02 | Manufacturing method of camera module and terminal processing equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910000829.4A CN111405144A (en) | 2019-01-02 | 2019-01-02 | Manufacturing method of camera module and terminal processing equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112187975A (en) * | 2020-09-17 | 2021-01-05 | 淮安维嘉益集成科技有限公司 | Application of WOFC2 material in manufacturing of FPC (flexible printed circuit) substrate of camera module |
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| US20030223008A1 (en) * | 2002-05-28 | 2003-12-04 | Samsung Electro-Mechanics Co., Ltd. | Image sensor module and process of fabricating the same |
| CN102722223A (en) * | 2012-05-24 | 2012-10-10 | 四川华立德科技有限公司 | Modular splitting structure and implementation method for intelligent mobile phone and tablet personal computer |
| CN107094224A (en) * | 2016-09-14 | 2017-08-25 | 格科微电子（上海）有限公司 | The manufacture method and terminal process equipment of camera module |
| CN207250494U (en) * | 2017-10-11 | 2018-04-17 | 中芯长电半导体（江阴）有限公司 | A kind of encapsulating structure |
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2019
- 2019-01-02 CN CN201910000829.4A patent/CN111405144A/en active Pending
Patent Citations (4)
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|---|---|---|---|---|
| US20030223008A1 (en) * | 2002-05-28 | 2003-12-04 | Samsung Electro-Mechanics Co., Ltd. | Image sensor module and process of fabricating the same |
| CN102722223A (en) * | 2012-05-24 | 2012-10-10 | 四川华立德科技有限公司 | Modular splitting structure and implementation method for intelligent mobile phone and tablet personal computer |
| CN107094224A (en) * | 2016-09-14 | 2017-08-25 | 格科微电子（上海）有限公司 | The manufacture method and terminal process equipment of camera module |
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| CN112187975A (en) * | 2020-09-17 | 2021-01-05 | 淮安维嘉益集成科技有限公司 | Application of WOFC2 material in manufacturing of FPC (flexible printed circuit) substrate of camera module |
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