CN218675389U - On-board photoelectric co-packaging structure - Google Patents
On-board photoelectric co-packaging structure Download PDFInfo
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- CN218675389U CN218675389U CN202222843097.5U CN202222843097U CN218675389U CN 218675389 U CN218675389 U CN 218675389U CN 202222843097 U CN202222843097 U CN 202222843097U CN 218675389 U CN218675389 U CN 218675389U
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Abstract
The utility model provides a photoelectricity common packaging structure on board, include: a motherboard having a plurality of light engine assemblies disposed along a perimeter side of the motherboard, the light engine assemblies comprising: one end of the first optical engine board is detachably and electrically connected with the mainboard through gold wire bonding, a plurality of photoelectric chips are arranged on the other end of the first optical engine board, a first gold wire bonding pad is arranged on the first optical engine board, the first gold wire bonding pad is electrically connected with the photoelectric chips through gold wires, the photoelectric chips are used for generating high-rate electric signals, and the photoelectric chips transmit the high-rate electric signals to the first optical engine board through the gold wires; the optical engine board is simple in structure and convenient to detach and replace, the technical problem that the optical engine board is damaged by high temperature during solder ball array packaging is avoided, the requirement of high-speed signal transmission can be met, and the requirement of on-board photoelectric co-packaging of high-speed signal transmission is met.
Description
Technical Field
The utility model relates to an optical communication technical field, concretely relates to on-board photoelectricity is packaging structure altogether.
Background
At present, optical modules dominate in the optical communication industry, but with the increasing speed and the increasing demand of optical modules, the requirements for the photoelectric packaging density are also increasing, and therefore, silicon photonic chips are proposed by multiple chip manufacturers to improve the optical and electric packaging density and reduce the power consumption. Currently, many optical module manufacturers adopt silicon optical chips, and the silicon optical chips are made into silicon optical modules with excellent performance. However, although the package density of the optoelectronic chip is reduced by reducing the power consumption, the package volume of the optical module structure is still not reduced, and the density is not increased.
Since on-board optical interconnects are used to more fully reduce the structural space, pluggable high-speed connectors used by optical modules are eliminated. And the light engine circuit board and the mainboard are connected by a solder ball array ball mounting process by adopting a solder ball array packaging form with higher packaging density. However, the ball grid array package is inherently reliable, but has three disadvantages: firstly, the disassembly is difficult, and if the light engine plate needs to be replaced, the welding points of the solder ball array can be damaged with probability, and the light engine plate can be damaged; secondly, the temperature of the solder ball array package needs to reach a high temperature of more than 200 ℃, so that the optical positioning adhesive in the optical engine is damaged to a certain extent, and the yield is low; thirdly, if the single wave rate of the signal is less than or equal to 25G, the transmission performance has no problem, and if a signal with higher transmission rate is needed, the connector in the market at present cannot meet the requirement.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model provides a pair of on-board photoelectricity is packaging structure altogether, its simple structure, convenient to detach changes the optical engine board, and high temperature is to the emergence that the optical engine board damaged technical problem when not only having avoided the encapsulation of solder ball array, can realize high rate signal transmission's requirement moreover, satisfies high rate signal transmission's on-board photoelectricity demand of encapsulating altogether.
In order to achieve the above purpose, the technical scheme of the utility model is as follows:
the utility model provides a photoelectricity common packaging structure on board, include: a motherboard having a plurality of light engine assemblies disposed along a perimeter side of the motherboard, the light engine assemblies comprising: first light engine board, first light engine board one end pass through the gold thread bonding with the detachable electricity of mainboard is connected, be equipped with a plurality of photoelectricity chip on another tip of first light engine board, be equipped with first gold thread bonding pad on the first light engine board, first gold thread bonding pad pass through the gold thread with the photoelectricity chip electricity is connected, photoelectricity chip is used for producing the high rate signal of telecommunication, photoelectricity chip passes through the gold thread with high rate signal of telecommunication to first light engine board on.
The utility model provides a pair of on-board photoelectricity is packaging structure altogether, its simple structure, convenient to detach changes the light engine board, and high temperature is to the emergence that the light engine board damaged technical problem when not only having avoided the encapsulation of solder ball array, can realize high rate signal transmission's requirement moreover, satisfies the demand that high rate signal transmission's on-board photoelectricity was packaged altogether.
As a preferred technical solution, the light engine assembly includes: a second light engine board, first light engine board set up in on the second light engine board and with the second light engine board is connected, first light engine board with the second light engine board is corresponding setting, a second light engine board end connection has the board to board interlayer connector, the second light engine board passes through the board to interlayer connector with the detachable electricity of mainboard is connected, be equipped with electric chip in the one side of mainboard, electric chip is used for producing ordinary transmission rate signal of telecommunication, electric chip passes through the board with ordinary transmission rate signal of telecommunication to the second light engine board to interlayer connector.
As a preferred technical solution, the board-to-board interlayer connector is disposed on a surface of the other surface of the main board, and the board-to-board interlayer connector is connected to the main board.
According to the preferable technical scheme, the first gold wire bonding pad is arranged on one end portion of the first optical engine board, the edge of the mainboard is provided with a second gold wire bonding pad, one end of the first gold wire bonding pad and the second gold wire bonding pad form detachable electric connection with the first optical engine board and the mainboard through gold wire bonding, and the other end of the first gold wire bonding pad is electrically connected with the photoelectric chip through a gold wire.
The preferable technical scheme comprises the following steps: the optical fiber is connected with the first light engine plate through an optical fiber fixing block, and one end of the optical fiber is directly coupled with the end face of the photoelectric chip.
Preferably, the first light engine plate and the second light engine plate are connected to form an integrally formed structure.
Preferably, the first light engine board is electrically connected to the second light engine board.
As a preferred technical solution, the first light engine board, the second light engine board and the main board are all PCB boards.
Preferably, the single wave velocity of the high-speed electrical signal is greater than 25G.
As a preferred technical scheme, the single wave rate of the electric signal with the ordinary transmission rate is less than or equal to 25G.
The utility model provides a pair of on-board photoelectricity is packaging structure altogether, its simple structure, convenient to detach changes the light engine board, and high temperature is to the emergence that the light engine board damaged technical problem when not only having avoided the encapsulation of solder ball array, can realize high rate signal transmission's requirement moreover, satisfies the demand that high rate signal transmission's on-board photoelectricity was packaged altogether.
Drawings
Fig. 1 is a structural diagram of an on-board optoelectronic common package structure provided by the present invention;
FIG. 2 is an enlarged view of A in the block diagram of the on-board optoelectronic co-package structure provided in FIG. 1;
fig. 3 is a structural diagram of a light engine assembly in an on-board optoelectronic common package structure according to the present invention;
wherein, 1-a main board; 2-a light engine assembly; 3-a first light engine board; 4-a second light engine board; 5-an electrical chip; 6-gold wire bonding pad; 7-a photoelectric chip; 8-board-to-board mezzanine connectors; 9-first gold wire bond pad; 10-a second gold wire bond pad; 11-an optical fiber; 12-optical fiber fixing block.
Detailed Description
Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
It is understood that the present invention is directed to some embodiments to achieve the objects of the present invention, as shown in fig. 1-3, the present invention provides an on-board photoelectric co-packaging structure, including: a main board 1, a plurality of light engine assemblies 2 are arranged along the periphery of the main board 1, and the light engine assemblies 2 include: the optical engine board comprises a first optical engine board 3, one end of the first optical engine board 3 is detachably and electrically connected with the mainboard 1 through gold wire bonding, a plurality of photoelectric chips 7 are arranged on the other end of the first optical engine board 3, a first gold wire bonding pad 9 is arranged on the first optical engine board 3, the first gold wire bonding pad 9 is electrically connected with the photoelectric chips 7 through gold wires, the photoelectric chips 7 are used for optical signal transmission and conversion of optical signals and electric signals, the electric signals contain high-speed signals, the photoelectric chips 7 are used for generating high-speed electric signals, the photoelectric chips 7 transmit the high-speed electric signals to the first optical engine board 3 through the gold wires, and the single wave rate of the high-speed electric signals is more than 25G, so that the high-speed electric signal transmission can be met, and the first optical engine board 3 can be conveniently detached and replaced; the light engine assembly 2 comprises: the second optical engine board 4, the first optical engine board 3 and the second optical engine board 4 are correspondingly arranged, the first optical engine board 3 is arranged on the second optical engine board 4 and connected with the second optical engine board 4, one end of the second optical engine board 4 is connected with a board-to-board interlayer connector 8, the second optical engine board 4 is detachably and electrically connected with the mainboard 1 through the board-to-board interlayer connector 8, the second optical engine board 4 is connected with the mainboard 1 through the board-to-board interlayer connector 8, so that not only can a large amount of ordinary transmission rate electric signal transmission be met, but also the second optical engine board 4 can be conveniently detached and replaced, one side of the mainboard 1 is provided with an electric chip 5, the electric chip 5 generates an ordinary transmission rate electric signal, the electric chip 5 transmits the ordinary transmission rate electric signal to the second optical engine board 4 through the board-to-board interlayer connector 8, the single wave rate of the ordinary transmission rate electric signal is not more than 25G, so that the high-rate electric signal is completely transmitted on the first optical engine board 3, the ordinary transmission rate electric signal is completely transmitted on the second optical engine board 4, and the mutual interference between the boards is not fully utilized; the board-to-board interlayer connector 8 is arranged on the surface of the other surface of the main board 1, and the board-to-board interlayer connector 8 is connected with the main board 1; the gold wire bonding pad 6 includes: a first gold wire bonding pad 9 and a second gold wire bonding pad 10, wherein the first gold wire bonding pad 9 is arranged on one end of the first optical engine board 3, the second gold wire bonding pad 10 is arranged on the edge of the mainboard 1, one end of the first gold wire bonding pad 9 and the second gold wire bonding pad 10 form a detachable electric connection between the first optical engine board 3 and the mainboard 1 through gold wire bonding, the other end of the first gold wire bonding pad 9 is electrically connected with the photoelectric chip 7 through a gold wire, and the first optical engine board 3 and the mainboard 1 are bonded through the gold wire bonding pad 6, so that the high-speed electric signal transmission performance can be met, and the first optical engine board 3 is convenient to detach and replace; the optical fiber 11 is connected with the first light engine board 3 through an optical fiber fixing block 12, one end of the optical fiber 11 is directly coupled with the end face of the photoelectric chip 7, and the first light engine board 3, the second light engine board 4 and the main board 1 are all PCB boards; the optical engine board is simple in structure and convenient to detach and replace, the technical problem that the optical engine board is damaged by high temperature during solder ball array packaging is avoided, the requirement of high-speed signal transmission can be met, and the requirement of on-board photoelectric co-packaging of high-speed signal transmission is met.
The utility model provides an on-board photoelectricity common packaging structure, include: a main board 1, a plurality of light engine assemblies 2 are arranged along the periphery of the main board 1, and the light engine assemblies 2 include: the optical engine comprises a first optical engine plate 3, one end of the first optical engine plate 3 is detachably and electrically connected with the mainboard 1 through gold wire bonding, a plurality of photoelectric chips 7 are arranged on the other end of the first optical engine plate 3, a first gold wire bonding pad 9 is arranged on the first optical engine plate 3, the first gold wire bonding pad 9 is electrically connected with the photoelectric chips 7 through gold wires, the photoelectric chips 7 are used for optical signal transmission and conversion of optical signals and electric signals, the electric signals contain high-speed signals, the photoelectric chips 7 are used for generating high-speed electric signals, the photoelectric chips 7 transmit the high-speed electric signals to the first optical engine plate 3 through gold wires, and the single wave rate of the high-speed electric signals is more than 25G, so that the transmission of the high-speed electric signals can be met, and the first optical engine plate 3 can be conveniently detached and replaced; the light engine assembly 2 comprises: the first light engine plate 3 and the second light engine plate 4 are correspondingly arranged, the first light engine plate 3 is arranged on the second light engine plate 4, the first light engine plate 3 and the second light engine plate 4 are connected into an integrally formed structure, and the integrally formed structure is step-shaped; one end of the second optical engine board 4 is connected with a board-to-board interlayer connector 8, the second optical engine board 4 is detachably and electrically connected with the mainboard 1 through the board-to-board interlayer connector 8, the second optical engine board 4 is connected with the mainboard 1 through the board-to-board interlayer connector 8, a large amount of common transmission rate electric signal transmission can be met, the second optical engine board 4 is convenient to detach and replace, one surface of the mainboard 1 is provided with an electric chip 5, the electric chip 5 generates a common transmission rate electric signal, the electric chip 5 transmits the common transmission rate electric signal to the second optical engine board 4 through the board-to-board interlayer connector 8, the single wave rate of the common transmission rate electric signal is not more than 25G, so that the high-rate electric signal is completely transmitted on the first optical engine board 3, the common transmission rate electric signal is completely transmitted on the second optical engine board 4, signals are not interfered with each other, and a board distribution space is fully utilized; the board-to-board interlayer connector 8 is arranged on the surface of the other surface of the main board 1, and the board-to-board interlayer connector 8 is connected with the main board 1; the gold wire bonding pad 6 includes: a first gold wire bonding pad 9 and a second gold wire bonding pad 10, wherein the first gold wire bonding pad 9 is arranged on one end of the first optical engine board 3, the second gold wire bonding pad 10 is arranged on the edge of the mainboard 1, one end of the first gold wire bonding pad 9 and the second gold wire bonding pad 10 form a detachable electric connection between the first optical engine board 3 and the mainboard 1 through gold wire bonding, the other end of the first gold wire bonding pad 9 is electrically connected with the photoelectric chip 7 through a gold wire, and the first optical engine board 3 and the mainboard 1 are bonded through the gold wire bonding pad 6, so that the high-speed electric signal transmission performance can be met, and the first optical engine board 3 is convenient to detach and replace; the optical fiber 11 is connected with the first light engine board 3 through an optical fiber fixing block 12, one end of the optical fiber 11 is directly coupled with the end face of the photoelectric chip 7, and the first light engine board 3, the second light engine board 4 and the main board 1 are all PCB boards; the optical engine board is simple in structure and convenient to detach and replace, the technical problem that the optical engine board is damaged by high temperature during solder ball array packaging is avoided, the requirement of high-speed signal transmission can be met, and the requirement of on-board photoelectric co-packaging of high-speed signal transmission is met.
The utility model provides an on-board photoelectricity common packaging structure, include: a main board 1, a plurality of light engine assemblies 2 are arranged along the periphery of the main board 1, and the light engine assemblies 2 include: the optical engine board comprises a first optical engine board 3, one end of the first optical engine board 3 is detachably and electrically connected with the mainboard 1 through gold wire bonding, a plurality of photoelectric chips 7 are arranged on the other end of the first optical engine board 3, a first gold wire bonding pad 9 is arranged on the first optical engine board 3, the first gold wire bonding pad 9 is electrically connected with the photoelectric chips 7 through gold wires, the photoelectric chips 7 are used for optical signal transmission and conversion of optical signals and electric signals, the electric signals contain high-speed signals, the photoelectric chips 7 are used for generating high-speed electric signals, the photoelectric chips 7 transmit the high-speed electric signals to the first optical engine board 3 through the gold wires, and the single wave rate of the high-speed electric signals is more than 25G, so that the high-speed electric signal transmission can be met, and the first optical engine board 3 can be conveniently detached and replaced; the light engine assembly 2 comprises: a second light engine plate 4, wherein the first light engine plate 3 and the second light engine plate 4 are disposed correspondingly, the first light engine plate 3 is disposed on the second light engine plate 4, and the first light engine plate 3 and the second light engine plate 4 are electrically connected; one end of the second optical engine board 4 is connected with a board-to-board interlayer connector 8, the second optical engine board 4 is detachably and electrically connected with the mainboard 1 through the board-to-board interlayer connector 8, the second optical engine board 4 is connected with the mainboard 1 through the board-to-board interlayer connector 8, a large amount of common transmission rate electric signal transmission can be met, the second optical engine board 4 is convenient to detach and replace, one surface of the mainboard 1 is provided with an electric chip 5, the electric chip 5 generates a common transmission rate electric signal, the electric chip 5 transmits the common transmission rate electric signal to the second optical engine board 4 through the board-to-board interlayer connector 8, the single wave rate of the common transmission rate electric signal is not more than 25G, so that the high-rate electric signal is completely transmitted on the first optical engine board 3, the common transmission rate electric signal is completely transmitted on the second optical engine board 4, the electric signals are not interfered with each other, and a board distribution space is fully utilized; the board-to-board interlayer connector 8 is arranged on the surface of the other surface of the main board 1, and the board-to-board interlayer connector 8 is connected with the main board 1; the gold wire bonding pad 6 includes: a first gold wire bonding pad 9 and a second gold wire bonding pad 10, wherein the first gold wire bonding pad 9 is arranged on one end of the first optical engine board 3, the second gold wire bonding pad 10 is arranged on the edge of the mainboard 1, one end of the first gold wire bonding pad 9 and the second gold wire bonding pad 10 form a detachable electric connection between the first optical engine board 3 and the mainboard 1 through gold wire bonding, the other end of the first gold wire bonding pad 9 is electrically connected with the photoelectric chip 7 through a gold wire, and the first optical engine board 3 and the mainboard 1 are bonded through the gold wire bonding pad 6, so that the high-speed signal transmission performance can be met, and the first optical engine board 3 is convenient to detach and replace; the optical fiber 11 is connected with the first light engine board 3 through an optical fiber fixing block 12, one end of the optical fiber 11 is directly coupled with the end face of the photoelectric chip 7, and the first light engine board 3, the second light engine board 4 and the main board 1 are all PCB boards; the optical engine board is simple in structure and convenient to detach and replace, the technical problem that the optical engine board is damaged by high temperature during solder ball array packaging is avoided, the requirement of high-speed signal transmission can be met, and the requirement of on-board photoelectric co-packaging of high-speed signal transmission is met.
It is to be understood that the present invention has been described with reference to certain embodiments, and that various changes or equivalents may be substituted for elements thereof by those skilled in the art without departing from the spirit and scope of the invention. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from the essential scope thereof. Therefore, the present invention is not to be limited to the specific embodiments disclosed herein, and all modifications and equivalents that fall within the scope of the claims of the present application are intended to be embraced therein. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from the essential scope thereof. Therefore, the present invention is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of the present application are intended to be covered by the present invention.
Claims (10)
1. An on-board optoelectronic co-package structure, comprising: a motherboard having a plurality of light engine assemblies disposed along a perimeter side of the motherboard, the light engine assemblies comprising: first light engine board, first light engine board one end pass through the gold thread bonding with the detachable electricity of mainboard is connected, be equipped with a plurality of photoelectricity chip on another tip of first light engine board, be equipped with first gold thread bonding pad on the first light engine board, first gold thread bonding pad pass through the gold thread with the photoelectricity chip electricity is connected, photoelectricity chip is used for producing the high rate signal of telecommunication, photoelectricity chip passes through the gold thread with high rate signal of telecommunication to first light engine board on.
2. The on-board optoelectronic co-package structure of claim 1, wherein the light engine assembly comprises: the second light engine board, first light engine board set up in on the second light engine board and with the second light engine board is connected, first light engine board with the second light engine board is corresponding setting, a second light engine board end connection has the board to board intermediate layer connector, the second light engine board passes through the board to board intermediate layer connector with the detachable electricity of mainboard is connected, be equipped with electric chip in the one side of mainboard, electric chip is used for producing ordinary transmission rate signal of telecommunication, electric chip passes through the board and transmits ordinary transmission rate signal of telecommunication to the second light engine board to board intermediate layer connector.
3. The on-board optoelectronic co-package structure of claim 2, wherein the board-to-board interlayer connector is disposed on a surface of the other side of the main board, and the board-to-board interlayer connector is connected to the main board.
4. The on-board optoelectronic common package structure of claim 1, wherein the first gold wire bonding pad is disposed on an end portion of the first optical engine board, a second gold wire bonding pad is disposed at an edge of the main board, one end of the first gold wire bonding pad and the second gold wire bonding pad form a detachable electrical connection with the main board through gold wire bonding, and the other end of the first gold wire bonding pad is electrically connected with the optoelectronic chip through gold wire.
5. The on-board optoelectronic co-package structure of claim 1, comprising: the optical fiber is connected with the first light engine plate through an optical fiber fixing block, and one end of the optical fiber is directly coupled with the end face of the photoelectric chip.
6. The on-board optoelectronic co-package structure of claim 2, wherein the first light engine board and the second light engine board are connected as an integral structure.
7. The on-board optoelectronic co-package structure of claim 2, wherein the first light engine board is electrically connected to the second light engine board.
8. The on-board optical electrical co-package structure of claim 2, wherein the first light engine board, the second light engine board and the main board are all PCB boards.
9. The on-board optoelectronic co-package structure of claim 1, wherein a single wave velocity of the high-rate electrical signal is > 25G.
10. The on-board optoelectronic co-package structure of claim 2, wherein a single wave rate of the common transmission rate electrical signal is less than or equal to 25G.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222843097.5U CN218675389U (en) | 2022-10-25 | 2022-10-25 | On-board photoelectric co-packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222843097.5U CN218675389U (en) | 2022-10-25 | 2022-10-25 | On-board photoelectric co-packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218675389U true CN218675389U (en) | 2023-03-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222843097.5U Active CN218675389U (en) | 2022-10-25 | 2022-10-25 | On-board photoelectric co-packaging structure |
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| Country | Link |
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| CN (1) | CN218675389U (en) |
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2022
- 2022-10-25 CN CN202222843097.5U patent/CN218675389U/en active Active
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