CN106937032A - Imaging modules and electronic installation - Google Patents

Imaging modules and electronic installation Download PDF

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Publication number
CN106937032A
CN106937032A CN201610120772.8A CN201610120772A CN106937032A CN 106937032 A CN106937032 A CN 106937032A CN 201610120772 A CN201610120772 A CN 201610120772A CN 106937032 A CN106937032 A CN 106937032A
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CN
China
Prior art keywords
modules
camera
module
installation portion
imaging modules
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610120772.8A
Other languages
Chinese (zh)
Inventor
申成哲
王昕�
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanchang OFilm Tech Co Ltd
Original Assignee
Nanchang OFilm Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=56779601&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CN106937032(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Nanchang OFilm Tech Co Ltd filed Critical Nanchang OFilm Tech Co Ltd
Priority to PCT/CN2016/090057 priority Critical patent/WO2017113747A1/en
Priority to PCT/CN2016/090056 priority patent/WO2017113746A1/en
Priority to PCT/CN2016/090064 priority patent/WO2017113752A1/en
Priority to PCT/CN2016/090059 priority patent/WO2017113748A1/en
Priority to PCT/CN2016/090061 priority patent/WO2017113750A1/en
Priority to PCT/CN2016/090062 priority patent/WO2017113751A1/en
Priority to PCT/CN2016/090060 priority patent/WO2017113749A1/en
Publication of CN106937032A publication Critical patent/CN106937032A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/45Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/54Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/55Optical parts specially adapted for electronic image sensors; Mounting thereof
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/90Arrangement of cameras or camera modules, e.g. multiple cameras in TV studios or sports stadiums

Abstract

The invention discloses a kind of imaging modules and electronic installation.Imaging modules include flexible PCB, at least two camera modules and two connectors.Flexible PCB includes the connector installation portion of at least two module installation portions of spaced at least two modules installation portion and connection.At least two camera modules are separately positioned at least two module installation portions, at least two camera module interval settings.Two connectors are disposed on the connector installation portion.In the imaging modules of embodiment of the present invention, at least two camera module interval settings cause there are enough spaces between at least two camera modules, it is convenient to by the light axial adjustment of at least two camera modules to being parallel to each other.In addition, easily can be installed to imaging modules on electronic installation by two connectors.

Description

Imaging modules and electronic installation
Priority information
The application request on December 30th, 2015 submitted to China national Department of Intellectual Property, number of patent application be 201511025532.1st, 201521132821.7,201511024922.7 and 201521131513.2 patent application is excellent First power and rights and interests, and by referring to being incorporated by herein.
Technical field
The present invention relates to technical field of imaging, more particularly to a kind of imaging modules and a kind of electronic installation.
Background technology
As people improve to the quality requirement of shooting image, dual camera shooting technology arises at the historic moment.In order to ensure to take pictures Quality, the optical axis of two camera modules of dual camera module is parallel to each other.Therefore, in the production of dual camera module How Cheng Zhong, facilitate two optical axises of camera module of adjustment to being parallel to each other, and easily dual camera module is attached to electricity Turn into problem demanding prompt solution in sub-device.
The content of the invention
It is contemplated that at least solving one of technical problem present in prior art.Therefore, the present invention provides a kind of imaging Module and a kind of electronic installation.
The imaging modules of embodiment of the present invention include flexible PCB, at least two camera modules and two connectors.It is soft Property circuit board include spaced at least two modules installation portion and connection at least two module installation portions connector peace Dress portion.At least two camera modules are separately positioned at least two module installation portions, and at least two camera modules interval sets Put.Two connectors are disposed on connector installation portion.
The imaging modules of embodiment of the present invention, at least two camera module interval settings cause at least two camera modules it Between have enough spaces, it is convenient to by the light axial adjustment of at least two camera modules to being parallel to each other.In addition, two companies Connecing device easily can be installed on electronic installation imaging modules.
In some embodiments, the quantity of the module installation portion and the quantity of the camera module are two.
In some embodiments, the flexible PCB includes spaced two connecting portions, described two connecting portions Two module installation portions and the connector installation portion are connected respectively.
In some embodiments, each described camera module includes printed circuit board (PCB) and sets on the printed circuit board And the imageing sensor being electrically connected with the printed circuit board (PCB), the printed circuit board (PCB) is arranged on the module installation portion And be electrically connected with the module installation portion.
In some embodiments, the module installation portion include the first electric connection pad, the printed circuit board (PCB) include with Second electric connection pad of the first electric connection pad correspondence connection, the printed circuit board (PCB) electrically connects by described second Connection pad is electrically connected with the module installation portion with first electric connection pad.
In some embodiments, the printed circuit board (PCB) is corresponding with the corresponding module installation portion shape and size.
In some embodiments, the camera module includes setting on the printed circuit board and is passed positioned at described image Camera lens module above sensor.
In some embodiments, each described camera lens module includes camera lens and voice coil motor, and the camera lens is arranged on described In voice coil motor, each described voice coil motor includes housing, two housing interval settings.
In some embodiments, the imaging modules include substrate, and the substrate is arranged on the connector and installs It is electrically connected with portion and with the connector installation portion, described two connectors are set on the substrate.
In some embodiments, the imaging modules include colloid, the colloid be arranged on two camera modules it Between and be bonded two camera modules.
In some embodiments, each described camera module includes the connecting side relative with camera module another described, Two camera modules are fixedly connected by welding the connecting side.
In some embodiments, the described pair of camera module includes cover body, the cover body cover set two camera modules and It is fixedly connected with two camera modules.
In some embodiments, the cover body include around two camera modules framework and with framework top The top cover of connection, the framework and the top cover are fixedly connected by colloid with two camera modules.
The electronic installation of embodiment of the present invention includes above-mentioned imaging modules.
The electronic installation of embodiment of the present invention, at least two camera module interval settings cause at least two camera modules it Between have enough spaces, it is convenient to by the light axial adjustment of at least two camera modules to being parallel to each other.In addition, two companies Connecing device easily can be installed on electronic installation imaging modules.
Additional aspect of the invention and advantage will be set forth in part in the description, and will partly become from the following description Substantially, or by practice of the invention recognize.
Brief description of the drawings
Of the invention above-mentioned and/or additional aspect and advantage will become from description of the accompanying drawings below to implementation method is combined Substantially and be readily appreciated that, wherein:
Fig. 1 is the structural representation of the imaging modules of embodiment of the present invention.
Fig. 2 is the schematic perspective view of the imaging modules of embodiment of the present invention.
Fig. 3 be imaging modules in Fig. 2 along III-III to generalized section.
Fig. 4 is the enlarged diagram of the IV parts of the imaging modules in Fig. 3.
Fig. 5 is the decomposing schematic representation of the imaging modules of embodiment of the present invention.
Fig. 6 is another decomposing schematic representation of the imaging modules of embodiment of the present invention.
Fig. 7 is the schematic perspective view of the cover body of the imaging modules of embodiment of the present invention.
Fig. 8 is the part-structure schematic diagram of the imaging modules of embodiment of the present invention.
Specific embodiment
Embodiments of the present invention are described below in detail, the example of the implementation method is shown in the drawings, wherein ad initio extremely Same or similar label represents same or similar element or the element with same or like function eventually.Below by ginseng The implementation method for examining Description of Drawings is exemplary, is only used for explaining the present invention, and is not considered as limiting the invention.
In the description of the invention, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ", " thickness ", " on ", D score, "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outward ", The orientation or position relationship of the instructions such as " clockwise ", " counterclockwise " are, based on orientation shown in the drawings or position relationship, to be only Described with simplified for the ease of the description present invention, must be with specific rather than the device or element for indicating or imply meaning Orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.Additionally, term " first ", " second " is only used for describing purpose, and it is not intended that indicating or implying relative importance or imply to indicate indicated skill The quantity of art feature.Thus, define " first ", the feature of " second " can express or implicitly include one or More described features.In the description of the invention, " multiple " is meant that two or more, unless otherwise clear and definite It is specific to limit.
In the description of the invention, it is necessary to illustrate, unless otherwise clearly defined and limited, term " installation ", " phase Even ", " connection " should be interpreted broadly, for example, it may be fixedly connected, or be detachably connected, or integratedly Connection;Can mechanically connect, or electrically connect or can mutually communicate;Can be joined directly together, it is also possible to logical Intermediary is crossed to be indirectly connected to, can be two element internals connection or two interaction relationships of element.For this For the those of ordinary skill in field, above-mentioned term concrete meaning in the present invention can be as the case may be understood.
In the present invention, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or D score The first and second feature directly contacts can be included, it is also possible to including the first and second features be not directly contact but pass through Other characterisation contact between them.And, fisrt feature second feature " on ", " top " and " above " Including fisrt feature directly over second feature and oblique upper, or to be merely representative of fisrt feature level height special higher than second Levy.Fisrt feature second feature " under ", " lower section " and " below " just go up including fisrt feature in second feature Side and oblique upper, or fisrt feature level height is merely representative of less than second feature.
Following disclosure provides many different implementation methods or example is used for realizing different structure of the invention.For letter Change disclosure of the invention, hereinafter the part and setting to specific examples are described.Certainly, they are only merely illustrative, And purpose does not lie in the limitation present invention.Additionally, the present invention can in different examples repeat reference numerals and/or reference word Mother, this repetition is for purposes of simplicity and clarity, discussed various implementation methods itself not to be indicated and/or it is set Between relation.Additionally, the invention provides various specific technique and material example, but ordinary skill Personnel can be appreciated that the application of other techniques and/or the use of other materials.
Fig. 1 is the structural representation of the imaging modules of embodiment of the present invention.The cover body of imaging modules not shown in Fig. 1.
Please join Fig. 1 and Fig. 5, the imaging modules 100 of embodiment of the present invention include 10, two shooting moulds of flexible PCB Group 20 and two connectors 32.Flexible PCB 10 includes two module installation portions 11 and connector installation portion 12.Two The individual interval setting of module installation portion 11.Connector installation portion 12 connects two module installation portions 11.Two camera modules 20 are separately positioned on module installation portion 11, two interval settings of camera module 20.Two interval settings of connector 32 On connector installation portion 12.
In the imaging modules 100 of embodiment of the present invention, two interval settings of camera module 20 cause two camera modules There are enough spaces between 20, it is convenient to by two light axial adjustment of camera module 20 to being parallel to each other.In addition, two Easily can be installed to imaging modules 100 on electronic installation by individual connector 32.
Specifically, in one example, it is first that two camera modules 20 are solid respectively when imaging modules 100 are assembled Calmly to module installation portion 11, then robotic arm grips one of camera module 20, afterwards by manipulator The position of another camera module 20 is adjusted so that the optical axis of two camera modules 20 is parallel, and two camera modules 20 Towards the same side.
It is appreciated that in other embodiments, the quantity of module installation portion and camera module can be more than three, three Camera module interval setting more than individual.The module installation portion interval setting of more than three.The camera module of more than three point It is not arranged on the module installation portion of more than three.
For convenience of explanation, the implementation method for being hereafter two with the quantity of the quantity of module installation portion and camera module is made Further illustrate, but be not considered as limiting the invention.
Incorporated by reference to Fig. 8, in present embodiment, flexible PCB 10 includes two spaced connecting portions 13, two companies Socket part 13 connects two module installation portions 11 and connector installation portion 12 respectively.
Two interval settings of connecting portion 13 can further be conducive to flexible PCB 10 to deform, so as to be conducive to adjustment two The position of camera module 20 is so that the optical axis of two camera modules 20 is parallel.
Fig. 2-Fig. 4 is referred to, in present embodiment, each camera module 20 includes (the Printed Circuit of printed circuit board (PCB) 21 Board, PCB) and imageing sensor 22.Printed circuit board (PCB) 21 be arranged on module installation portion 11 and with module installation portion 11 are electrically connected with.Imageing sensor 22 is arranged on printed circuit board (PCB) 21 and is electrically connected with printed circuit board (PCB) 21.
In this way, imageing sensor 22 can obtain the image of object, and image is passed through into printed circuit board (PCB) 21 and flexible circuit Plate 10 reaches external device (ED).It should be noted that two sensing faces of imageing sensor 22 are towards the same side.
Specifically, imageing sensor 22 can use complementary metal oxide semiconductors (CMOS) (Complementary Metal Oxide Semiconductor, CMOS) CIS or charge coupled cell (Charge-coupled Device, CCD) shadow As sensor.
In present embodiment, module installation portion 11 includes the first electric connection pad 111, and printed circuit board (PCB) 21 includes and the Corresponding second electric connection pad 211 of one electric connection pad 111, printed circuit board (PCB) 21 passes through the second electric connection pad 211 Module installation portion 11 is electrically connected with the first electric connection pad 111.
In this way, the first electric connection pad 111 and the second electric connection pad 211 realize flexible PCB 10 and camera module It is electrically connected between 20 and is communicated.For example, the first electric connection pad 111 and the second electric connection pad 211 are using conduction Glue.
In present embodiment, printed circuit board (PCB) 21 is corresponding with the shape and size of corresponding module installation portion 11.
Can so make the structure of imaging modules 100 compacter, be conducive to reducing the volume of imaging modules 100.Imaging mould When group 100 is applied to electronic installation, can further reduce the volume of electronic installation.
In present embodiment, as an example, each printed circuit board (PCB) 21 and the shape with corresponding module installation portion 11 Shape is in plate shaped and size is identical.And in other embodiments, each printed circuit board (PCB) and with corresponding module installation portion Shape can set according to the actual requirements and specifically.Size between printed circuit board (PCB) and corresponding module installation portion can be with root It is adjusted according to needs.
Incorporated by reference to Fig. 5 and Fig. 6, in present embodiment, camera module 20 includes being arranged on printed circuit board (PCB) 21 and position In the camera lens module 23 of the top of imageing sensor 22.
In this way, camera lens module 23 can make imageing sensor 22 obtain quality preferably image, so as to imaging modules can be improved 100 shooting quality.
In present embodiment, each camera lens module 23 includes camera lens 231 and voice coil motor 232, and camera lens 231 is arranged on sound In coil motor 232, each voice coil motor 232 includes housing 2321, two interval settings of housing 2321.
Voice coil motor 232 can drive camera lens 231 along the optical axis direction movement of camera lens 231 to adjust camera lens 231 and image The distance between sensor 22, and then the auto-focusing of imaging modules 100 is realized, so that imaging modules 100 are obtained Quality preferably image.
Further, optical filter 24 is provided between camera lens 231 and imageing sensor 22.Optical filter 24 can filter pre- If the light of frequency so that imageing sensor 22 forms preferably image according to the light after filtering.
It is preferred that optical filter 24 is cutoff filter.In this way, cutoff filter 24 can filter infrared ray, Avoid the image fault of imageing sensor 22.
Specifically, camera lens module 23 also includes pedestal 233, and pedestal 233 opens up fluted 2331, the bottom of groove 2331 Face offers through hole 2332.Optical filter 24 is arranged in groove 2331 and is supported on the bottom surface of groove 2331, passes through The light of the filtering of optical filter 24 can reach imageing sensor 22 by through hole 2332.
Take for convenience optical filter 24, link slot 2333, the communication groove 2331 of link slot 2333 are offered on pedestal 233.
Incorporated by reference to Fig. 8, in present embodiment, imaging modules 100 include substrate 31, and substrate 31 is arranged on connector installation It is electrically connected with portion 12 and with connector installation portion 12, two connectors 32 are set on the substrate 31.
In this way, substrate 31 can increase the reliability that connector 32 is connected with connector installation portion 12, make connector 32 not Easily come off from connector installation portion 12.
It is pointed out that in present embodiment, two connectors 32 are arranged on same substrate 31.It is appreciated that In other embodiments, two connectors can be separately positioned on two substrates.
In present embodiment, imaging modules 100 include colloid 40, and colloid 40 is arranged between two camera modules 20 simultaneously Two camera modules 20 of bonding.
After being adjusted to be parallel to each other by the optical axis of two camera modules 20, colloid 40 is clicked and entered between two camera modules 20. Colloid 40 can ensure that two camera modules 20 are relatively fixed.Colloid 40 can increase by two bonding strengths of camera module 20, Two probability of the light shaft offset of imaging modules 100 can be reduced.
It should be noted that in present embodiment, as shown in the orientation in Fig. 3, colloid 40 is located at two camera modules The bottom in the gap between 20.And in other embodiments, the gap that colloid can be filled up between two camera modules.
Colloid 40 for example can be the colloids with stickiness such as UV glue (Ultraviolet Glue).
In some embodiments, each camera module includes the connecting side relative with another camera module, two shootings Module is fixedly connected by being welded to connect side.
In this way, two camera modules will can be rigidly secured together by welding.For example, the connection of each camera module Side can be welded by laser spot welding or tin cream or solder and is fixedly connected with another camera module.
In present embodiment, imaging modules 100 include cover body 50, cover body 50 cover set two camera modules 20 and with two Camera module 20 is fixedly connected.
For example, cover body 50 can be fixedly connected with two camera modules 20 by welding or colloid.
In this way, cover body 50 can further fix two positions of camera module 20, reduce camera module 20 falling or Suffered impulsive force during concussion, increases the stability of the structure of imaging modules 100, improves imaging modules 100 Quality.
Incorporated by reference to Fig. 7, in present embodiment, cover body 50 is included around two frameworks of camera module 20 51 and and framework The top cover 52 of 51 top connections, framework 51 and top cover 52 are fixedly connected by colloid with two camera modules 20.
In this way, the framework 51 and top cover 52 of cover body 50 are connected by colloid with two camera modules 20, can increase Connection area between cover body 50 and two camera modules 20 so that cover body 50 is connected more with two camera modules 20 Firmly.
Specifically, top cover 52 offers two light holes 251, and two camera modules 20 pass through two light holes 251 respectively Exposure.Light reaches imageing sensor 22 after sequentially passing through light hole 251, camera lens 231 and optical filter 24, and image is passed Sensor 22 is so as to collect external image.
It should be noted that in present embodiment, two equal cylindrical forms of light hole 251.In other embodiments, Depending on two shapes of light hole can be distinguished specifically.Therefore, the shape of the light hole of present embodiment is it is not intended that to this The limitation of invention.
In present embodiment, it is preferred that light hole 251 is set with the light shaft coaxle of camera lens 231.
Fig. 5 and Fig. 6 is referred to, further, imaging modules 100 also include reinforcing plate 60, two module installation portions 11 It is fixed in reinforcing plate 60.
In this way, reinforcing plate 60 can further fix two positions of camera module 20, the anti-impact of imaging modules 100 is improved The ability hit, and then improve shooting quality.Reinforcing plate 60 can be made of intensity material higher, such as metal material.
In present embodiment, imaging modules 100 also include metal foil 70, and reinforcing plate 60 is arranged in metal foil 70.Gold Category paper tinsel 70 can prevent imaging modules 100 from being disturbed by electromagnetic wave, it is ensured that imaging modules 100 obtain quality and preferably scheme Picture.Anti electromagnetic wave disruption member 70 can be for example made of metal material.
The electronic installation of embodiment of the present invention includes above-mentioned imaging modules 100.Electronic installation is, for example, mobile phone, flat board Computer etc..
The electronic installation of embodiment of the present invention, two interval settings of camera module 20 are caused between two camera modules 20 There are enough spaces, it is convenient to which the light axial adjustment of two camera modules 20 is parallel to each other.In addition, two connectors 32 easily can be installed on electronic installation imaging modules 100.
In the description of this specification, reference term " implementation method ", " some implementation methods ", " schematic embodiment party The description of formula ", " example ", " specific example " or " some examples " etc. means to combine the implementation method or example describes Specific features, structure, material or feature are contained at least one implementation method of the invention or example.In this explanation In book, the schematic representation to above-mentioned term is not necessarily referring to identical implementation method or example.And, the tool of description Body characteristicses, structure, material or feature can be in one or more any implementation methods or example in an appropriate manner With reference to.
While embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that:Not These implementation methods can be carried out with various changes, modification, replacement in the case of departing from principle of the invention and objective and become Type, the scope of the present invention is limited by claim and its equivalent.

Claims (14)

1. a kind of imaging modules, it is characterised in that including:
Flexible PCB, the flexible PCB is included described in spaced at least two modules installation portion and connection at least Two connector installation portions of module installation portion;
At least two camera modules, at least two camera module is separately positioned at least two modules installation portion On, at least two camera modules interval setting;And
Two connectors, described two connectors are disposed on the connector installation portion.
2. imaging modules as claimed in claim 1, it is characterised in that the quantity of the module installation portion and the shooting The quantity of module is two.
3. imaging modules as claimed in claim 2, it is characterised in that the flexible PCB includes spaced two Individual connecting portion, described two connecting portions connect two module installation portions and the connector installation portion respectively.
4. imaging modules as claimed in claim 2, it is characterised in that each described camera module includes printed circuit board (PCB) And the imageing sensor being electrically connected with the printed circuit board and with the printed circuit board (PCB), the printed circuit are set Plate is arranged on the module installation portion and is electrically connected with the module installation portion.
5. imaging modules as claimed in claim 4, it is characterised in that the module installation portion includes that first is electrically connected with Pad, the printed circuit board (PCB) includes the second electric connection pad of connection corresponding with first electric connection pad, the printing Circuit board is electrically connected with the module installation portion by second electric connection pad with first electric connection pad.
6. imaging modules as claimed in claim 4, it is characterised in that the printed circuit board (PCB) and the corresponding module Installation portion shape and size are corresponding.
7. imaging modules as claimed in claim 4, it is characterised in that the camera module includes being arranged on the printing Camera lens module on circuit board and above described image sensor.
8. imaging modules as claimed in claim 7, it is characterised in that each described camera lens module includes camera lens and voice coil loudspeaker voice coil Motor, the camera lens is arranged in the voice coil motor, and each described voice coil motor is included between housing, two housings Every setting.
9. imaging modules as claimed in claim 2, it is characterised in that the imaging modules include substrate, the substrate It is arranged on the connector installation portion and is electrically connected with the connector installation portion, described two connectors is arranged on institute State on substrate.
10. imaging modules as claimed in claim 2, it is characterised in that the imaging modules include colloid, the glue Body is arranged between two camera modules and is bonded two camera modules.
11. imaging modules as claimed in claim 2, it is characterised in that each described camera module includes and another The relative connecting side of the camera module, two camera modules are fixedly connected by welding the connecting side.
12. imaging modules as claimed in claim 2, it is characterised in that described pair of camera module includes cover body, the cover Body cover sets two camera modules and is fixedly connected with two camera modules.
13. imaging modules as claimed in claim 12, it is characterised in that the cover body is included around two shootings The framework of module and the top cover being connected with framework top, the framework and the top cover are taken the photograph by colloid with described in two As module is fixedly connected.
14. a kind of electronic installations, it is characterised in that including the imaging modules as described in claim any one of 1-13.
CN201610120772.8A 2015-12-30 2016-03-03 Imaging modules and electronic installation Pending CN106937032A (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
PCT/CN2016/090057 WO2017113747A1 (en) 2015-12-30 2016-07-14 Imaging module and electronic apparatus
PCT/CN2016/090056 WO2017113746A1 (en) 2015-12-30 2016-07-14 Imaging module and electronic device
PCT/CN2016/090064 WO2017113752A1 (en) 2015-12-30 2016-07-14 Imaging module and electronic device
PCT/CN2016/090059 WO2017113748A1 (en) 2015-12-30 2016-07-14 Imaging module and electronic device
PCT/CN2016/090061 WO2017113750A1 (en) 2015-12-30 2016-07-14 Imaging module and electronic device
PCT/CN2016/090062 WO2017113751A1 (en) 2015-12-30 2016-07-14 Imaging module and electronic apparatus
PCT/CN2016/090060 WO2017113749A1 (en) 2015-12-30 2016-07-14 Imaging module and electronic device

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
CN201521132821 2015-12-30
CN2015211328217 2015-12-30
CN2015211315132 2015-12-30
CN2015110249227 2015-12-30
CN201511025532 2015-12-30
CN201521131513 2015-12-30
CN2015110255321 2015-12-30
CN201511024922 2015-12-30

Publications (1)

Publication Number Publication Date
CN106937032A true CN106937032A (en) 2017-07-07

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CN201620163035.1U Expired - Fee Related CN205545565U (en) 2015-12-30 2016-03-03 Imaging module and electron device
CN201620163154.7U Ceased CN205545575U (en) 2015-12-30 2016-03-03 Imaging module and electron device
CN201620162941.XU Active CN205545558U (en) 2015-12-30 2016-03-03 Imaging module and electron device
CN201610120781.7A Pending CN106937035A (en) 2015-12-30 2016-03-03 Imaging modules and electronic installation
CN201620163152.8U Expired - Fee Related CN205545574U (en) 2015-12-30 2016-03-03 Imaging module and electron device
CN201610120713.0A Pending CN106937030A (en) 2015-12-30 2016-03-03 Imaging modules and electronic installation
CN201620163163.6U Expired - Fee Related CN205647690U (en) 2015-12-30 2016-03-03 Imaging module and electron device
CN201610120780.2A Pending CN106937058A (en) 2015-12-30 2016-03-03 Imaging modules and electronic installation
CN201620162943.9U Expired - Fee Related CN205545559U (en) 2015-12-30 2016-03-03 Imaging module and electron device
CN201610120775.1A Pending CN106937033A (en) 2015-12-30 2016-03-03 Imaging modules and electronic installation
CN201610120772.8A Pending CN106937032A (en) 2015-12-30 2016-03-03 Imaging modules and electronic installation
CN201620163180.XU Ceased CN205545576U (en) 2015-12-30 2016-03-03 Imaging module and electron device
CN201610120714.5A Pending CN106937031A (en) 2015-12-30 2016-03-03 Imaging modules and electronic installation
CN201610120778.5A Pending CN106937034A (en) 2015-12-30 2016-03-03 Imaging modules and electronic installation

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Application Number Title Priority Date Filing Date
CN201620163035.1U Expired - Fee Related CN205545565U (en) 2015-12-30 2016-03-03 Imaging module and electron device
CN201620163154.7U Ceased CN205545575U (en) 2015-12-30 2016-03-03 Imaging module and electron device
CN201620162941.XU Active CN205545558U (en) 2015-12-30 2016-03-03 Imaging module and electron device
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