WO2017113751A1

WO2017113751A1 - Imaging module and electronic apparatus

Info

Publication number: WO2017113751A1
Application number: PCT/CN2016/090062
Authority: WO
Inventors: 申成哲; 王昕�
Original assignee: 深圳欧菲光科技股份有限公司
Priority date: 2015-12-30
Filing date: 2016-07-14
Publication date: 2017-07-06
Also published as: WO2017113752A1; WO2017113750A1; WO2017113749A1; WO2017113747A1; WO2017113748A1; WO2017113746A1

Abstract

An imaging module and an electronic apparatus. The imaging module comprises a flexible circuit board and at least two camera modules. The flexible circuit board comprises at least two module mounting parts and connector mounting parts connected to the at least two module mounting parts. The at least two module mounting parts are interconnected. The at least two camera modules are respectively arranged on the at least two module mounting parts, and the at least two camera modules are spaced apart from each other.

Description

Imaging module and electronic device

Priority information

This application is filed with the National Intellectual Property Office of China on December 30, 2015, and the patent application numbers are 201511025532.1, 201521132821.7, 201511024922.7, and 201521131513.2, and submitted to the State Intellectual Property Office of China on March 03, 2016. The patent application numbers are 201610120714.5 and 201620163180. .X, 201610120781.7, 201620162943.9, 201610120780.2, 201620163035.1, 201610120778.5, 201620163163.6, 201610120775.1, 201620163152.8, 201610120713.0, 201620162941.X, 201610120772.8, 201620163154.7, 201610120584.5, 201620162897.2, 201610120711.1, 201620163024.3, 201610120911.7, 201620162763.0, 201610120898.5, 201620162899.1, 201610120880.5, 201620163142.4, 201610120777.0 The priority and interest of the patent applications of 201620163009.9, 201610120867.X, 201620162868.6, 201610120876.9, 201620162728.9, 201610120745.0, 201620162720.2, 201610120468.3, 201620162718.5, 201610120773.2 and 201620162944.3 are hereby incorporated by reference in its entirety.

Technical field

The present invention relates to the field of camera technologies, and in particular, to an imaging module and an electronic device.

Background technique

As people's quality requirements for captured images increase, dual camera photography technology came into being. In order to ensure the quality of the photograph, the optical axes of the two camera modules of the dual camera module are arranged in parallel and the two camera modules are photographed toward the same side. Therefore, in the production process of the dual camera module, how to conveniently adjust the optical axis of the two cameras to the parallel position becomes an urgent problem to be solved.

Summary of the invention

The present invention is directed to solving one of the technical problems existing in the prior art. To this end, the present invention provides an imaging module and an electronic device.

The imaging module of the embodiment of the invention comprises a flexible circuit board and at least two camera modules. The flexible circuit board includes at least two module mounting portions and a connector mounting portion that connects at least two module mounting portions. At least two module mounting portions are connected to each other. At least two camera modules are respectively disposed on the two module mounting portions, and the two camera modules are spaced apart.

In the imaging module of the embodiment of the present invention, at least two camera modules are spaced apart such that there is sufficient space between the at least two camera modules, and the optical axes of the at least two camera modules can be conveniently adjusted to parallel positions. To ensure the quality of the imaging module.

In some implementations, the number of the module mounting portions and the number of the camera modules are two.

In some embodiments, the flexible circuit board includes two connecting portions that are connected or spaced apart from each other, each of the connecting portions connecting each of the module mounting portion and the connector mounting portion.

In some embodiments, each of the camera modules includes a printed circuit board and an image sensor disposed on the printed circuit board and electrically connected to the printed circuit board, the printed circuit board being disposed in the The module mounting portion is electrically connected to the module mounting portion.

In some embodiments, the module mounting portion includes a first electrical connection pad, and the printed circuit board includes a second electrical connection pad corresponding to the first electrical connection pad, the printed circuit board The module mounting portion is electrically connected to the first electrical connection pad through the second electrical connection pad.

In some embodiments, the camera module includes a lens module disposed on the printed circuit board and positioned above the image sensor.

In some embodiments, the lens module includes a lens and a voice coil motor, the lens is disposed in the voice coil motor, the voice coil motor includes a housing, and two of the two camera modules The housings are spaced apart.

In some embodiments, the imaging module includes a connector assembly including a substrate and a connector disposed on the substrate, the substrate being disposed on the connector mounting portion and The connector mounting portion is electrically connected.

In some embodiments, the imaging module includes a gel that bonds the two camera modules.

In some embodiments, the camera module includes a connection side opposite to another camera module, and the two camera modules are fixedly connected by soldering the connection side.

In some embodiments, the imaging module includes a cover, and the two camera modules are disposed in the cover and are fixedly coupled to the cover.

In some embodiments, the cover includes a frame surrounding the two camera modules and a top cover connected to the top of the frame, the frame and the top cover and the two cameras The module is fixedly connected.

An electronic device according to an embodiment of the present invention includes the above-described imaging module.

In the above electronic device, at least two camera modules are arranged at intervals such that there is sufficient space between the at least two camera modules, and the optical axes of the at least two camera modules can be conveniently adjusted to parallel positions to ensure the imaging module. The quality of the shot.

The additional aspects and advantages of the invention will be set forth in part in the description which follows.

DRAWINGS

The above and/or additional aspects and advantages of the present invention will become apparent and readily understood from

1 is a schematic structural view of an imaging module according to an embodiment of the present invention.

2 is a perspective view of an imaging module according to an embodiment of the present invention.

3 is a cross-sectional view of the imaging module of FIG. 2 taken along the line III-III.

4 is an enlarged schematic view of an IV portion of the imaging module of FIG. 3.

FIG. 5 is an exploded perspective view of an imaging module according to an embodiment of the present invention.

FIG. 6 is another exploded schematic view of an imaging module according to an embodiment of the present invention.

7 is a perspective view of a cover body of an imaging module according to an embodiment of the present invention.

8 is a schematic structural view of a flexible circuit board of an imaging module according to an embodiment of the present invention.

detailed description

The embodiments of the present invention are described in detail below, and the examples of the embodiments are illustrated in the drawings, wherein the same or similar reference numerals indicate the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the drawings are intended to be illustrative of the invention and are not to be construed as limiting.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientations of "post", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, and is merely for the convenience of the description of the present invention and the simplified description, and is not intended to indicate or imply that the device or component referred to has a specific orientation, and is constructed and operated in a specific orientation. Therefore, it should not be construed as limiting the invention. Moreover, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first" or "second" may include one or more of the described features either explicitly or implicitly. In the description of the present invention, the meaning of "a plurality" is two or more unless specifically and specifically defined otherwise.

In the description of the present invention, it should be noted that the terms "installation", "connected", and "connected" are to be understood broadly, and may be fixed or detachable, for example, unless otherwise explicitly defined and defined. Connected, or integrally connected; may be mechanically connected, may be electrically connected or may communicate with each other; may be directly connected, or may be indirectly connected through an intermediate medium, may be internal communication of two elements or interaction of two elements relationship. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood on a case-by-case basis.

In the present invention, the first feature "on" or "under" the second feature may include direct contact of the first and second features, and may also include first and second features, unless otherwise specifically defined and defined. It is not in direct contact but through additional features between them. Moreover, the first feature "above", "above" and "above" the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is higher than the second feature. The first feature "below", "below" and "below" the second feature includes the first feature directly below and below the second feature, or merely the first feature level being less than the second feature.

The following disclosure provides many different embodiments or examples for implementing different structures of the present invention. In order to simplify the disclosure of the present invention, the components and arrangements of the specific examples are described below. Of course, they are merely examples and are not intended to limit the invention. In addition, the present invention may be repeated with reference to the numerals and/or reference numerals in the various examples, which are for the purpose of simplicity and clarity, and do not indicate the relationship between the various embodiments and/or arrangements discussed. Moreover, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the use of other processes and/or the use of other materials.

1 is a schematic structural view of an imaging module according to an embodiment of the present invention. Figure 1 does not show the cover of the imaging module.

Referring to FIG. 1 , an imaging module 100 according to an embodiment of the present invention includes a flexible circuit board 10 and two camera modules 20 . The flexible circuit board 10 includes two module mounting portions 11 and a connector mounting portion 12. The two module mounting portions 11 are connected to each other. The connector mounting portion 12 connects the two module mounting portions 11. The two camera modules 20 are respectively disposed on the two module mounting portions 11, and the two camera modules 20 are spaced apart.

In the imaging module 100 of the embodiment of the present invention, the two camera modules 20 are spaced apart such that there is sufficient space between the two camera modules 20, and the optical axes of the two camera modules 20 can be conveniently adjusted to be parallel. The position ensures the shooting quality of the imaging module 100.

Specifically, in an example, when assembling the imaging module 100, the two camera modules 20 are respectively fixed to the module mounting portion 11, and then one of the camera modules 20 can be clamped by a robot, and then passed through a robot. The position of the other camera module 20 is adjusted such that the optical axes of the two camera modules 20 are parallel, and then the two camera modules 20 are fixed by gel bonding or welding. When the two camera modules 20 are adjusted, the module mounting portion 11 can be slightly deformed to enable the position of the camera module 20 to be adjusted.

It can be understood that in other embodiments, the number of the module mounting portion and the camera module may be three or more, and three or more camera modules are spaced apart. More than three module mounting sections are spaced apart. Three or more camera modules are respectively disposed on three or more module mounting portions.

For convenience of description, the following description is made by the embodiment in which the number of module mounting portions and the number of camera modules are two, but it is not to be construed as limiting the present invention.

Referring to FIG. 8 , in the present embodiment, the flexible circuit board 10 includes two connecting portions 13 disposed at intervals, and each connecting portion 13 is connected to each of the module mounting portions 11 and the connector mounting portion 12 .

The two connecting portions 13 are spaced apart to further facilitate the deformation of the flexible circuit board 10, thereby facilitating adjustment of the positions of the two camera modules 20 such that the optical axes of the two camera modules 20 are parallel.

It will be appreciated that in other embodiments, the two connections may be connected to each other. Due to the low rigidity of the connecting portion, the interconnecting connecting portions can also be deformed to adjust the positions of the two camera modules.

Referring to FIG. 2 to FIG. 4 , in the embodiment, each camera module 20 includes a printed circuit board 21 (PCB) and an image sensor 22 . The sensing faces of the two image sensors 22 are parallel or coplanar and face the same side. The printed circuit board 21 is disposed on the module mounting portion 11 and is electrically connected to the module mounting portion 11. Image sensing The device 22 is disposed on the printed circuit board 21 and electrically connected to the printed circuit board 21.

As such, the image sensor 22 can acquire an image of the object and transmit the image to the external device through the printed circuit board 21 and the flexible circuit board 10.

Specifically, the image sensor 22 may be a complementary metal oxide semiconductor (CMOS) image sensor or a charge-coupled device (CCD) image sensor.

In this embodiment, the module mounting portion 11 includes a first electrical connection pad 111, and the printed circuit board 21 includes a second electrical connection pad 211 correspondingly connected to the first electrical connection pad 111, and the printed circuit board 21 passes through the second The electrical connection pad 211 and the first electrical connection pad 111 are electrically connected to the module mounting portion 11 .

As such, the first electrical connection pad 111 and the second electrical connection pad 211 electrically connect and communicate between the flexible circuit board 10 and the camera module 20 . For example, the first electrical connection pad 111 and the second electrical connection pad 211 are each made of a conductive paste.

In the present embodiment, the shape and size of the printed circuit board 21 are slightly smaller than the shape and size of the corresponding module mounting portion 11.

This makes the structure of the imaging module 100 more compact, and is advantageous for reducing the volume of the imaging module 100. When the imaging module 100 is applied to an electronic device, the volume of the electronic device can be further reduced.

In the present embodiment, as an example, each printed circuit board 21 and the corresponding module mounting portion 11 have a flat shape. In other embodiments, the shape of each printed circuit board and the corresponding module mounting portion may be specifically set according to actual needs.

Referring to FIG. 5 and FIG. 6 , in the embodiment, the camera module 20 includes a lens module 23 disposed on the printed circuit board 21 and located above the image sensor 22 .

In this way, the lens module 23 can obtain an image of better quality by the image sensor 22, thereby improving the shooting quality of the imaging module 100.

In this embodiment, the lens module 23 includes a lens 231 and a voice coil motor 232. The lens 231 is disposed in the voice coil motor 232. The voice coil motor 232 includes a housing 2321. The two housings 2321 of the two camera modules 20 are spaced apart. Settings.

The voice coil motor 232 can drive the lens 231 to move along the optical axis of the lens 231 to adjust the distance between the lens 231 and the image sensor 22, thereby achieving autofocus of the imaging module 100, so that the imaging module 100 can obtain a better quality image. .

Further, a filter 24 is disposed between the lens 231 and the image sensor 22. The filter 24 can filter the light of a predetermined frequency such that the image sensor 22 forms a better image based on the filtered light.

Preferably, the filter 24 is an infrared cut filter. As such, the infrared cut filter 24 can filter infrared rays to avoid image distortion of the image sensor 22.

Specifically, the lens module 23 further includes a base 233, and the base 233 is provided with a recess 2331, and the bottom of the recess 2331 A through hole 2332 is formed in the surface. The filter 24 is disposed in the recess 2331 and supported on the bottom surface of the recess 2331, and the light filtered by the filter 24 can pass through the through hole 2332 to reach the image sensor 22.

In order to facilitate the take-up of the filter 24, the base 233 is provided with a connecting groove 2333, and the connecting groove 2333 communicates with the groove 2331.

In the present embodiment, the imaging module 100 includes a connector assembly 30 including a substrate 31 and a connector 32 disposed on the substrate 31. The substrate 31 is disposed on the connector mounting portion 12 and electrically connected to the connector mounting portion 12.

As such, the connector 32 can quickly mount the imaging module 100 to the electronic device.

Preferably, the substrate 31 corresponds to the shape and size of the connector mounting portion 12. This makes the structure of the connector 32 and the flexible circuit board 10 more compact.

In the embodiment, the imaging module 100 includes a colloid 40, and the colloid 40 bonds the two camera modules 20.

After the optical axes of the two camera modules 20 are adjusted to be parallel to each other, the colloid 40 is inserted between the two camera modules. The colloid 40 ensures that the two camera modules 20 are relatively fixed. The colloid 40 can increase the connection strength of the two camera modules 20, and can reduce the probability of the optical axis offset of the two camera modules 20.

It should be noted that, in the present embodiment, as shown by the orientation in FIG. 3 , the colloid 40 is located at a lower portion of the gap between the two camera modules 20 . In other embodiments, the colloid can fill the gap between the two camera modules.

The colloid 40 may be, for example, a colloidal colloid such as UV glue (Ultraviolet Glue).

In some embodiments, the camera module includes a connection side opposite to another camera module, and the two camera modules are fixedly connected by a solder connection side.

In this way, the two camera modules can be firmly fixed together by welding. For example, the connection side of each camera module can be fixedly connected to another camera module by laser spot welding or solder paste or tin wire bonding.

In the present embodiment, the imaging module 100 includes a cover 50 , and the two camera modules 20 are disposed in the cover 50 and fixedly coupled to the cover 50 .

For example, the cover 50 and the two camera modules 20 can be fixedly connected by welding or colloid.

In this way, the cover 50 can further fix the positions of the two camera modules 20, reduce the impact force of the camera module 20 during the falling or oscillating process, increase the stability of the structure of the imaging module 100, and improve the imaging. The quality of the module 100.

Referring to FIG. 7 , in the embodiment, the cover 50 includes a frame 51 surrounding the two camera modules 20 and a top cover 52 connected to the top of the frame 51 , the frame 51 and the cover 52 and two camera modules 20 fixed connections.

In this manner, the frame body 51 and the top cover 52 of the cover 50 are connected to the two camera modules 20, so that the connection area between the cover 50 and the two camera modules 20 can be increased, so that the cover 50 and the two camera modules are Group 20 connections are more secure.

Specifically, the top cover 52 defines two light-passing holes 251, and the two camera modules 20 are respectively exposed through the two light-passing holes 251. The light passes through the light-passing aperture 251, the lens 231 and the filter 24 in sequence, and then reaches the image sensor 22, so that the image sensor 22 can collect an external image.

It should be noted that in the present embodiment, both of the light-passing holes 251 have a cylindrical shape. In other embodiments, the shapes of the two light-passing holes may be specifically determined. Therefore, the shape of the light-passing hole of the present embodiment is not to be construed as limiting the invention.

In the present embodiment, preferably, the light passing hole 251 is disposed coaxially with the optical axis of the lens 231.

Further, the imaging module 100 further includes a reinforcing plate 60, and the two module mounting portions 11 are fixed on the reinforcing plate 60.

In this way, the reinforcing plate 60 can further fix the positions of the two camera modules 20, improve the anti-collision capability of the imaging module 100, and thereby improve the shooting quality.

In the embodiment, the imaging module 100 further includes an electromagnetic wave interference preventing member 70, and the reinforcing plate 60 is disposed on the electromagnetic wave preventing component 70.

The anti-electromagnetic interference component 70 can prevent the imaging module 100 from being interfered by electromagnetic waves, and ensure that the imaging module 100 obtains a better quality image. The electromagnetic wave preventing member 70 can be made of, for example, a metal material.

The electronic device of the embodiment of the present invention includes the imaging module 100 described above.

Therefore, the electronic device can conveniently adjust the optical axes of the at least two camera modules 20 to parallel positions, thereby ensuring the shooting quality of the electronic device.

In the description of the present specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiment", "example", "specific example", or "some examples", etc. Particular features, structures, materials or features described in the embodiments or examples are included in at least one embodiment or example of the invention. In the present specification, the schematic representation of the above terms does not necessarily mean the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples.

While the embodiments of the present invention have been shown and described, the embodiments of the invention may The scope of the invention is defined by the claims and their equivalents.

Claims

An imaging module, comprising:

a flexible circuit board comprising at least two module mounting portions and a connector mounting portion connecting the at least two module mounting portions, the at least two module mounting portions being connected to each other;

The at least two camera modules are respectively disposed on the at least two module mounting portions, and the at least two camera modules are spaced apart.
The imaging module of claim 1 , wherein the number of the module mounting portions and the number of the camera modules are two.
The imaging module according to claim 2, wherein the flexible circuit board comprises two connecting portions connected or spaced apart from each other, each of the connecting portions connecting each of the module mounting portions and the Connector mounting section.
The imaging module of claim 2, wherein each of the camera modules comprises a printed circuit board and an image sensor disposed on the printed circuit board and electrically connected to the printed circuit board. The printed circuit board is disposed on the module mounting portion and electrically connected to the module mounting portion.
The imaging module of claim 4, wherein the module mounting portion comprises a first electrical connection pad, and the printed circuit board comprises a second electrical property corresponding to the first electrical connection pad Connecting the pad, the printed circuit board is electrically connected to the module mounting portion through the second electrical connection pad and the first electrical connection pad.
The imaging module of claim 4, wherein the camera module comprises a lens module disposed on the printed circuit board and above the image sensor.
The imaging module according to claim 6, wherein the lens module comprises a lens and a voice coil motor, the lens is disposed in the voice coil motor, and the voice coil motor comprises a housing, two The two housings of the camera module are spaced apart.
The imaging module of claim 2, wherein the imaging module comprises a connector assembly, the connector assembly comprising a substrate and a connector disposed on the substrate, the substrate being disposed on the The connector mounting portion is electrically connected to the connector mounting portion.
The imaging module of claim 2, wherein the imaging module comprises a glue body, and the glue body bonds the two camera modules.
The imaging module of claim 2, wherein the camera module comprises a connecting side opposite to the other camera module, and the two camera modules are fixedly connected by soldering the connecting side.
The imaging module of claim 2, wherein the imaging module comprises a cover, and the two camera modules are disposed in the cover and fixedly connected to the cover.
The imaging module of claim 11 , wherein the cover comprises a frame surrounding the two camera modules and a top cover connected to the top of the frame, the frame and the The top cover is fixedly connected to the two camera modules.
An electronic device comprising the imaging module of any of claims 1-12.