CN107155028A - Imaging modules and electronic installation - Google Patents
Imaging modules and electronic installation Download PDFInfo
- Publication number
- CN107155028A CN107155028A CN201610120773.2A CN201610120773A CN107155028A CN 107155028 A CN107155028 A CN 107155028A CN 201610120773 A CN201610120773 A CN 201610120773A CN 107155028 A CN107155028 A CN 107155028A
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- Prior art keywords
- imaging modules
- installation portion
- module
- modules
- flexible pcb
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- 238000003384 imaging method Methods 0.000 title claims abstract description 90
- 238000009434 installation Methods 0.000 title claims abstract description 84
- 239000000084 colloidal system Substances 0.000 claims description 28
- 210000002421 cell wall Anatomy 0.000 claims description 4
- 239000000428 dust Substances 0.000 abstract description 6
- IYZWUWBAFUBNCH-UHFFFAOYSA-N 2,6-dichlorobiphenyl Chemical compound ClC1=CC=CC(Cl)=C1C1=CC=CC=C1 IYZWUWBAFUBNCH-UHFFFAOYSA-N 0.000 description 10
- 230000003287 optical effect Effects 0.000 description 10
- 230000009977 dual effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
Abstract
The invention discloses a kind of imaging modules and electronic installation.Imaging modules include flexible PCB, at least two camera modules, support and cover body.It is arranged between at least two camera modules on flexible PCB.Support offers at least two fixing holes, and each camera module is housed in corresponding fixing hole, and at least two camera modules are fixedly connected with support.Cover body cover sets at least two camera modules and support, and cover body is fixedly connected with support, and cover body offers at least two light holes, one camera module of each light hole correspondence.In above-mentioned imaging modules, because at least two camera modules are fixedly connected with support, it can prevent at least two camera modules from position skew occurring during falling or shaking, it is ensured that the image quality of imaging modules.In addition, cover body can reduce the dust into imaging modules, the image quality of imaging modules is further ensured.
Description
Technical field
The present invention relates to technical field of imaging, more particularly to a kind of imaging modules and a kind of electronic installation.
Background technology
As people improve to the quality requirement of shooting image, dual camera shooting technology arises at the historic moment.One
As, dual camera module include two optical axises it is parallel and towards the same side shoot camera module, two
Position skew may occur during falling or shaking for individual camera module, cause two cameras
The distortion of module and influence image quality, in addition, dust is easily accessible shadow in dual camera module
Ring the image quality of dual camera module.
The content of the invention
It is contemplated that at least solving one of technical problem present in prior art.Therefore, the present invention is carried
For a kind of imaging modules and a kind of electronic installation.
The imaging modules of embodiment of the present invention include flexible PCB, at least two camera modules, support
And cover body.It is arranged between at least two camera modules on flexible PCB.Support offers at least two and consolidated
Determine hole, each camera module is housed in corresponding fixing hole, and at least two camera modules are fixed with support
Connection.Cover body cover sets at least two camera modules and support, and cover body is fixedly connected with support, and cover body is opened up
There are at least two light holes, one camera module of each light hole correspondence.
In above-mentioned imaging modules, because at least two camera modules are fixedly connected with support, can prevent to
Position occurs during falling or shake and offsets for few two camera modules, it is ensured that imaging modules into
As quality.In addition, cover body can reduce the dust into imaging modules, imaging modules are further ensured
Image quality.
In some embodiments, the quantity of the camera module and the quantity of the fixing hole are two
It is individual.
In some embodiments, the cover body is fixedly connected with two camera modules.
In some embodiments, the flexible PCB include spaced two module installation portions and
The connector installation portion of described two module installation portions is connected, each camera module is arranged on corresponding
On the module installation portion；
The flexible PCB also includes spaced two connecting portions, each connecting portion connection pair
The module installation portion and the connector installation portion answered.
In some embodiments, the flexible PCB include spaced two module installation portions and
Spaced two connector installation portions, each module installation portion connects the corresponding connector
Installation portion, each camera module is arranged on the corresponding module installation portion；
The flexible PCB also includes spaced two connecting portions, each connecting portion connection pair
The module installation portion and the corresponding connector installation portion answered.
In sometimes mode, the flexible PCB includes module installation portion and connects the module peace
The connector installation portion in dress portion, two camera modules are arranged on the module installation portion；
The flexible PCB includes connecting portion, and the connecting portion connects the module installation portion and the company
Connect device installation portion.
In some embodiments, the hole wall of the fixing hole offers the step trough for placing colloid.
In some embodiments, the imaging modules include multiple colloids, each step trough interval
Colloid described at least two is provided with, the colloid connects the cell wall and the shooting mould of the step trough
Group.
In some embodiments, form raised in the step trough, the colloid is bonded the projection.
One of them described fixing hole in described two fixing holes is circular port, another described fixation
Hole is square opening；
The hole wall of the circular port offers the step trough of annular, and three hole walls of the square opening are opened
Provided with the step trough.
In some embodiments, the support includes two fixed parts and connects described two fixed parts
Bearing attachment, each fixed part offers each fixing hole.
In some embodiments, each camera module includes printed circuit board (PCB) and is arranged on the print
The imaging sensor being electrically connected with printed circuit board and with the printed circuit board (PCB), the printed circuit board (PCB) is set
Put on the flexible PCB and be electrically connected with the flexible PCB；
The imaging modules include electric connection pad, and the electric connection pad is arranged on the printed circuit board (PCB)
Between the flexible PCB, and it is electrically connected with the printed circuit board (PCB) and the flexible PCB.
The electronic installation of embodiment of the present invention includes above-mentioned imaging device.
In above-mentioned electronic installation, because at least two camera modules are fixedly connected with support, can prevent to
Position occurs during falling or shake and offsets for few two camera modules, it is ensured that imaging modules into
As quality.In addition, cover body can reduce the dust into imaging modules, electronic installation is further ensured
Image quality.
The additional aspect and advantage of the present invention will be set forth in part in the description, partly by from following
Become obvious in description, or recognized by the practice of the present invention.
Brief description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention is retouched from reference to accompanying drawings below to embodiment
It will be apparent and be readily appreciated that in stating, wherein：
Fig. 1 is the schematic perspective view of the imaging modules of embodiment of the present invention.
Fig. 2 is the decomposing schematic representation of the imaging modules of embodiment of the present invention.
Fig. 3 is another schematic diagram of the imaging modules of embodiment of the present invention.
Fig. 4 is the diagrammatic cross-section of the imaging modules of embodiment of the present invention.
Fig. 5 is the enlarged diagram of Fig. 4 imaging modules V parts.
Fig. 6 is the floor map of the imaging modules of embodiment of the present invention.
Fig. 7 is the structural representation of the flexible PCB of the imaging modules of embodiment of the present invention.
Fig. 8 is the structural representation of another flexible PCB of the imaging modules of embodiment of the present invention.
Fig. 9 is the structural representation of the another flexible PCB of the imaging modules of embodiment of the present invention.
Embodiment
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the drawings,
Wherein same or similar label represents same or similar element or with same or like from beginning to end
The element of function.The embodiment described below with reference to accompanying drawing is exemplary, is only used for explaining this
Invention, and be not considered as limiting the invention.
In the description of the invention, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length
Degree ", " width ", " thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " water
It is flat ", " top ", " bottom ", " interior ", " outer ", " clockwise ", the orientation or position pass of the instruction such as " counterclockwise "
It is to be retouched based on orientation shown in the drawings or position relationship, to be for only for ease of the description present invention and simplification
State, rather than indicate or imply that the device or element of meaning there must be specific orientation, with specific side
Position construction and operation, therefore be not considered as limiting the invention.In addition, term " first ", " the
Two " are only used for describing purpose, and it is not intended that indicating or implying relative importance or implicit indicate institute
The quantity of the technical characteristic of instruction.Thus, define " first ", the feature of " second " can express or
Implicitly include one or more feature.In the description of the invention, " multiple " are meant that
Two or more, unless otherwise specifically defined.
In the description of the invention, it is necessary to illustrate, unless otherwise clearly defined and limited, term
" installation ", " connected ", " connection " should be interpreted broadly, for example, it may be fixedly connected or
It is detachably connected, or is integrally connected；Can be mechanical connection or electrical connection or can be mutual
Communication；Can be joined directly together, can also be indirectly connected to by intermediary, can be in two elements
The connection in portion or the interaction relationship of two elements.For the ordinary skill in the art, may be used
To understand the concrete meaning of above-mentioned term in the present invention as the case may be.
In the present invention, unless otherwise clearly defined and limited, fisrt feature second feature it " on "
Or it " under " can directly be contacted including the first and second features, the first and second features can also be included
It is not direct contact but by the other characterisation contact between them.Moreover, fisrt feature is second
Feature " on ", " top " and it is " above " include fisrt feature directly over the second feature and tiltedly on
Side, or fisrt feature level height is merely representative of higher than second feature.Fisrt feature is in second feature " it
Under ", " lower section " and " following " fisrt feature that includes directly over second feature and oblique upper, or only
Only represent that fisrt feature level height is less than second feature.
Following disclosure provides many different embodiments or example is used for realizing the difference of the present invention
Structure.In order to simplify disclosure of the invention, hereinafter the part and setting of specific examples are described.
Certainly, they are only merely illustrative, and purpose does not lie in the limitation present invention.In addition, the present invention can be
Repeat reference numerals and/or reference letter in different examples, this repetition are for simplified and clear mesh
, the relation between discussed various embodiments itself are not indicated and/or are set.In addition, this hair
The example of the bright various specific techniques provided and material, but those of ordinary skill in the art can anticipate
Know the application of other techniques and/or the use of other materials.
Please join Fig. 1 and Fig. 2, the imaging modules 100 of embodiment of the present invention include flexible PCB 10,
At least two camera modules 20, support 30 and cover body 40.
At least two camera modules 20 are disposed on flexible PCB 10.Support 30 offer to
Few two fixing holes 32, each 20 groups of mould of shooting is housed in corresponding fixing hole 32, and at least two
Camera module 20 is fixedly connected with support 30.
The cover of cover body 40 sets at least two camera modules 20 and support 30, and cover body 40 is fixed with support 30 to be connected
Connect, cover body 40 offers at least two light holes 41, one camera module of each correspondence of light hole 41
20。
In the imaging modules 100 of embodiment of the present invention, due at least two camera modules 20 and support
30 are fixedly connected, and can prevent at least two camera modules 20 from occurring position during falling or shaking
Put skew, it is ensured that the image quality of imaging modules 100.In addition, cover body 40 can be reduced into imaging
Dust in module 100, further ensures the image quality of imaging modules 100.
In present embodiment, the quantity of camera module 20 and the quantity of fixing hole 32 are two, at it
In his embodiment, the quantity of camera module can be more than three, the quantity of fixing hole and camera module
Quantity correspondence.More than three camera modules are disposed on flexible PCB.
For convenience of explanation, hereafter make furtherly by the embodiment of two of the quantity of camera module
It is bright, but it is not intended that limitation to invention.
In one example, when imaging modules 100 are assembled, first two camera modules 20 are consolidated
Calmly to flexible PCB 10, then robotic arm grips one of camera module 20, afterwards
The position of another camera module 20 is adjusted by manipulator so that the optical axis of two camera modules 20 is put down
OK, and two camera modules 20 are towards the same side.
After the optical axis of two camera modules 20 is parallel, the fixing hole 32 of support 30 can be arranged two and taken the photograph
As module 20, the cover of cover body 40 is finally set into two camera modules 20 and support 30, and make cover body 40
It is fixedly connected with support 30.Cover body 40 can be for example fixedly connected by welding or colloid with support 30.
In present embodiment, cover body 40 is fixedly connected with two camera modules 20.
In this way, cover body 40 may further ensure that the position of two camera modules 20 keeps interfixing,
Prevent position skew during the dropping or shake of two camera modules 20 and influence imaging modules
100 image quality.
Cover body 40 can be fixedly connected with two camera modules 20 by colloid.Colloid is, for example, UV glue.
When cover body 40 are installed, colloid can be first coated on the inner surface of cover body 40, and then make cover body
40 can be bonded two camera modules 20 when cover sets two camera modules 20 and support 30 by colloid.
Incorporated by reference to Fig. 7, in present embodiment, flexible PCB 10 includes spaced two modules peace
Dress portion 11 and spaced two connector installation portions 12, each connection of module installation portion 11 correspondence
Connector installation portion 12.Each camera module 20 is arranged on corresponding module installation portion 11.
In the case of so can be so that a connector installation portion 12 is damaged wherein, flexible electrical be convenient for changing
Road plate 10.
In present embodiment, flexible PCB 10 includes spaced two connecting portions 13.Each connect
Socket part 13 connects corresponding module installation portion 11 and corresponding connector installation portion 12.
Fig. 3 and Fig. 4 is referred to, two camera modules 20 can be fixedly connected by colloid with support 30,
In order to ensure in reliability that two camera modules 20 are connected with support 30, present embodiment, fixing hole
32 hole wall offers the step trough 38 for placing colloid.
In this way, step trough 38 can increase the connection area of support 30 and colloid, and then colloid can be increased
With the adhesion strength of support 30, the reliability that two camera modules 20 are connected with support 30 is realized.
In present embodiment, further, imaging modules 100 include multiple colloids 50, each step trough
38 are arranged at intervals with least two colloids 50, and colloid 50 connects the cell wall and camera module of step trough 38
20。
Therefore, the cell wall of the multiple connection of colloid 50 step troughs 38 increases the company of colloid 50 and support 30
Junction is accumulated, and then camera module 20 is securely fixed on support 30.In present embodiment, ladder
Projection 42 is formed in groove 38, colloid 50 is bonded projection 42.
Therefore, on the basis of step trough 38, projection 42 can further increase colloid 50 and support 30
Connection area, it is ensured that the bonding strength of colloid 50 and support 30.Meanwhile, projection 42 also can
Colloid 50 is prevented to be subjected to displacement.
For example, in diagrammatically shown example, the quantity of projection 42 is multiple, and it is disposed on rank
In terraced groove 38.Multiple raised 42 in circular port are circumferentially uniformly distributed, to improve more uniform connection
Power, is shown in Fig. 6.
In present embodiment, one of fixing hole 32 in two fixing holes 32 is circular port, in addition
One fixing hole 32 is square opening.For example, in orientation shown in the figure, the fixing hole positioned at left side
32 be circular port, and the fixing hole 32 positioned at right side is square opening.
The hole wall of circular port offers the step trough 38 of annular, and three hole walls of square opening offer step trough
38。
In one example, circular port is capable of the camera module 20 of auto-focusing, square opening available for fixation
Available for the camera module 20 focused, the function of abundant imaging modules 100 so, it is possible.
In present embodiment, support 30 includes two fixed parts 34 and connects the branch of two fixed parts 34
Frame connecting portion 36, each fixed part 34 offers each fixing hole 32.
Therefore, two fixed parts 34 can fix two camera modules 20 respectively, be conducive to each shooting mould
Group 20 is firmly fixed.
Refer in 4 and Fig. 5, present embodiment, each camera module 20 includes printed circuit board (PCB)
21 (Printed Circuit Board, PCB) and imaging sensor 22.Printed circuit board (PCB) 21 is arranged on flexibility
It is electrically connected with circuit board 10 and with flexible PCB 10.Imaging sensor 22 is arranged on printed circuit
It is electrically connected with plate 21 and with printed circuit board (PCB) 21.
Imaging modules 100 include electric connection pad 52, and electric connection pad 52 is arranged on printed circuit board (PCB) 21
Between flexible PCB 10, and it is electrically connected with printed circuit board (PCB) 21 and flexible PCB 10.
In this way, imaging sensor 22 can obtain the image of object, and image is passed through into printed circuit board (PCB) 21
And flexible PCB 10 reaches external device (ED).It should be noted that the sensing of two imaging sensors 22
Facing to the same side.
It is electrically connected with addition, electric connection pad 52 is realized between flexible PCB 10 and camera module 20
And communication.For example, electric connection pad 52 can use conducting resinl.
Specifically, imaging sensor 22 can for example use complementary metal oxide semiconductor
(Complementary Metal Oxide Semiconductor, CMOS) CIS or electric charge coupling
Close element (Charge-coupled Device, CCD) CIS.Printed circuit board (PCB) 21 is arranged on mould
On group installation portion 11, and it is electrically connected with module installation portion 11.
In present embodiment, the shape of printed circuit board (PCB) 21 and be dimensioned slightly smaller than and corresponding module install
The shape and size in portion 11.
So the structure of imaging modules 100 can be made compacter, be conducive to reducing the body of imaging modules 100
Product.When imaging modules 100 are applied to electronic installation, it can further reduce the volume of electronic installation.
In present embodiment, pacify as an example, each printed circuit board (PCB) 21 and with corresponding module
The shape in dress portion 11 is in plate shaped.And in other embodiments, each printed circuit board (PCB) and with it is corresponding
The shape of module installation portion can set according to the actual requirements and specifically.Printed circuit board (PCB) and corresponding module
Size between installation portion can be adjusted as needed.
Incorporated by reference to Fig. 4, in present embodiment, camera module 20 includes being arranged on printed circuit board (PCB) 21
And positioned at the camera lens module 23 of the top of imaging sensor 22.
In this way, camera lens module 23 can make imaging sensor 22 obtain quality preferably image, so as to carry
The shooting quality of high imaging modules 100.
Further, in present embodiment, in one example, the camera module 20 in circular port
Camera lens module 23 include autofocus lenses 231, autofocus lenses 231 include lens unit and
Voice coil motor, lens unit is arranged in voice coil motor.
Voice coil motor can drive optical axis direction of the lens unit along camera lens 231 to move to adjust lens unit
The distance between with imaging sensor 22, and then the auto-focusing of camera module 20 is realized, make imaging mould
Group 100 obtains quality preferably image.
Further, optical filter 24 is provided between camera lens 231 and imaging sensor 22.Optical filter 24
The light of predeterminated frequency can be filtered so that imaging sensor 22 is formed preferably according to the light after filtering
Image.
It is preferred that optical filter 24 is cutoff filter.In this way, cutoff filter 24 can be with
Filter infrared ray, it is to avoid the image fault of imaging sensor 22.Light sequentially passes through camera lens 231 and filter
Imaging sensor 22 is reached after mating plate 24, imaging sensor 22 is so as to collecting external image.
Specifically, camera lens module 23 also includes pedestal 233, and autofocus lenses 231 are arranged on pedestal
On 233, pedestal 233 opens up fluted 2331, and the bottom surface of groove 2331 offers through hole 2332.Filter
Mating plate 24 is arranged in groove 2331 and is supported on the bottom surface of groove 2331, by through hole 2332
Light enter optical filter 24 after reach imaging sensor 22.
In present embodiment, Fig. 4 please be join, imaging modules 100 include connector 58, and connector 58 is set
Put on connector installation portion 12 and be electrically connected with connector installation portion 12.
In this way, imaging modules 100 can be quickly installed on electronic equipment by connector 58.
In present embodiment, imaging modules 100 also include anti electromagnetic wave disruption member 70, flexible PCB
Module installation portion 11 is arranged in anti electromagnetic wave disruption member 70.Anti electromagnetic wave disruption member 70 can be prevented into
As module 100 is disturbed by electromagnetic wave, it is ensured that imaging modules 100 obtain quality preferably image.It is anti-
Electromagnetic Interference part 70 can be for example made of metal material.
Referring to Fig. 8, the imaging mould of the imaging modules of another embodiment of the invention and above-mentioned embodiment
Group is 100 essentially identical, unlike it, and in present embodiment, flexible PCB 10a includes two moulds
Group installation portion 11a and connector installation portion 12a.Two module installation portion 11a are arranged at intervals.Connector
Two module installation portion 11a of installation portion 12a connections.Each camera module is arranged on corresponding module and installed
On portion 11a.
In this way, two module installation portion 11a are arranged at intervals, it can make between two module installation portion 11a
Enough spaces are formed with, are easy to the optical axis of two camera modules being adjusted to the position that is parallel to each other.
In present embodiment, further, flexible PCB 10a includes spaced two connecting portions
13a.The corresponding module installation portion 11a and connector installation portion 12a of each connecting portion 13a connections.
Two connecting portion 13a, which are arranged at intervals, can further be conducive to flexible PCB 10a to deform, so as to have
Beneficial to adjustment two camera module 20a position so that two camera module 20a optical axis is parallel.
Other not deployed parts of the imaging modules of present embodiment refer to the imaging of above-mentioned embodiment
The same or similar part of module 100, will not be repeated here.
Referring to Fig. 9, the imaging mould of the imaging modules of a further embodiment of this invention and above-mentioned embodiment
Group is 100 essentially identical, unlike it, and in present embodiment, flexible PCB 10b includes module peace
Dress portion 11b and connection module installation portion 11b connector installation portion 12b.Two camera modules are arranged on
On module installation portion 11b.
So rapidly imaging modules can be attached on electronic installation by a flexible PCB 10b.
In present embodiment, flexible PCB 10b includes connecting portion 13b, connecting portion 13b connection modules
Installation portion 11b and connector installation portion 12b.
In this way, connecting portion 13b can be realized between module installation portion 11b and connector installation portion 12b
Communication, so that the image information collected is reached electricity by the camera module being arranged on module installation portion 11b
Sub-device.
The electronic installation of embodiment of the present invention includes the imaging modules of any of the above-described embodiment.Electronics is filled
Put e.g. mobile phone, tablet personal computer etc..
In the electronic installation of embodiment of the present invention, due at least two camera modules and support fixation company
Connect, can prevent at least two camera modules from position skew occurring during falling or shaking, it is ensured that
The image qualities of imaging modules.In addition, cover body can reduce the dust into imaging modules, further
It ensure that the image quality of electronic installation.
In the description of this specification, reference term " embodiment ", " some embodiments ", " show
The description of meaning property embodiment ", " example ", " specific example " or " some examples " etc. means to combine institute
Specific features, structure, material or the feature for stating embodiment or example description are contained in the present invention extremely
In few an embodiment or example.In this manual, to the schematic representation of above-mentioned term not necessarily
Refer to identical embodiment or example.Moreover, specific features, structure, material or the spy of description
Point can in an appropriate manner be combined in any one or more embodiments or example.
While embodiments of the present invention have been illustrated and described, one of ordinary skill in the art can be with
Understand：These embodiments can be carried out in the case where not departing from the principle and objective of the present invention a variety of
Change, modification, replacement and modification, the scope of the present invention is limited by claim and its equivalent.
Claims (13)
1. a kind of imaging modules, it is characterised in that including：
Flexible PCB；
The flexible PCB is arranged between at least two camera modules, at least two camera module
On；
Support, the support offers at least two fixing holes, and each camera module is housed in correspondence
The fixing hole in, at least two camera module is fixedly connected with the support；And
Cover body, the cover body cover sets at least two camera module and the support, the cover body and institute
State support to be fixedly connected, the cover body offers at least two light holes, each light hole correspondence one
The individual camera module.
2. imaging modules as claimed in claim 1, it is characterised in that the quantity of the camera module
And the quantity of the fixing hole is two.
3. imaging modules as claimed in claim 2, it is characterised in that described in the cover body and two
Camera module is fixedly connected.
4. imaging modules as claimed in claim 2, it is characterised in that the flexible PCB includes
The connector installation portion of spaced two module installation portions and the described two module installation portions of connection, often
The individual camera module is arranged on the corresponding module installation portion；
The flexible PCB also includes spaced two connecting portions, each connecting portion connection pair
The module installation portion and the connector installation portion answered.
5. imaging modules as claimed in claim 2, it is characterised in that the flexible PCB includes
Spaced two module installation portions and spaced two connector installation portions, each module
Installation portion connects the corresponding connector installation portion, and each camera module is arranged on corresponding described
On module installation portion；
The flexible PCB also includes spaced two connecting portions, each connecting portion connection pair
The module installation portion and the corresponding connector installation portion answered.
6. imaging modules as claimed in claim 2, it is characterised in that the flexible PCB includes
The connector installation portion of module installation portion and the connection module installation portion, two camera modules are set
On the module installation portion；
The flexible PCB also includes connecting portion, and the connecting portion connects the module installation portion and described
Connector installation portion.
7. imaging modules as claimed in claim 2, it is characterised in that the hole wall of the fixing hole is opened
Provided with the step trough for placing colloid.
8. imaging modules as claimed in claim 7, it is characterised in that the imaging modules include many
Individual colloid, each step trough is arranged at intervals with colloid described at least two, and the colloid connection is described
The cell wall of step trough and the camera module.
9. imaging modules as claimed in claim 8, it is characterised in that formed in the step trough convex
Rise, the colloid is bonded the projection.
10. imaging modules as claimed in claim 7, it is characterised in that in described two fixing holes
One of them described fixing hole is circular port, and another described fixing hole is square opening；
The hole wall of the circular port offers the step trough of annular, and three hole walls of the square opening are opened
Provided with the step trough.
11. imaging modules as claimed in claim 2, it is characterised in that the support includes two admittedly
Determine the bearing attachment of portion and the described two fixed parts of connection, each fixed part offers each described
Fixing hole.
12. imaging modules as claimed in claim 2, it is characterised in that each camera module bag
Include what printed circuit board (PCB) and setting were electrically connected with the printed circuit board and with the printed circuit board (PCB)
Imaging sensor, the printed circuit board (PCB) be arranged on the flexible PCB and with the flexible PCB
It is electrically connected with；
The imaging modules include electric connection pad, and the electric connection pad is arranged on the printed circuit board (PCB)
Between the flexible PCB, and it is electrically connected with the printed circuit board (PCB) and the flexible PCB.
13. a kind of electronic installation, it is characterised in that including as described in claim any one of 1-12
Imaging modules.
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610120773.2A CN107155028A (en) | 2016-03-03 | 2016-03-03 | Imaging modules and electronic installation |
| PCT/CN2016/090056 WO2017113746A1 (en) | 2015-12-30 | 2016-07-14 | Imaging module and electronic device |
| PCT/CN2016/090060 WO2017113749A1 (en) | 2015-12-30 | 2016-07-14 | Imaging module and electronic device |
| PCT/CN2016/090059 WO2017113748A1 (en) | 2015-12-30 | 2016-07-14 | Imaging module and electronic device |
| PCT/CN2016/090061 WO2017113750A1 (en) | 2015-12-30 | 2016-07-14 | Imaging module and electronic device |
| PCT/CN2016/090062 WO2017113751A1 (en) | 2015-12-30 | 2016-07-14 | Imaging module and electronic apparatus |
| PCT/CN2016/090064 WO2017113752A1 (en) | 2015-12-30 | 2016-07-14 | Imaging module and electronic device |
| PCT/CN2016/090057 WO2017113747A1 (en) | 2015-12-30 | 2016-07-14 | Imaging module and electronic apparatus |
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| CN201610120773.2A CN107155028A (en) | 2016-03-03 | 2016-03-03 | Imaging modules and electronic installation |
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| CN107155028A true CN107155028A (en) | 2017-09-12 |
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| CN201610120773.2A Pending CN107155028A (en) | 2015-12-30 | 2016-03-03 | Imaging modules and electronic installation |
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Cited By (10)
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| CN108012067A (en) * | 2018-01-11 | 2018-05-08 | 宁波维森智能传感技术有限公司 | A kind of camera module |
| CN108322633A (en) * | 2018-03-05 | 2018-07-24 | 信利光电股份有限公司 | A kind of imaging modules and electronic device |
| CN108418923A (en) * | 2018-04-10 | 2018-08-17 | Oppo广东移动通信有限公司 | Holder, in-out box and terminal |
| CN108418922A (en) * | 2018-04-10 | 2018-08-17 | Oppo广东移动通信有限公司 | Holder, in-out box and terminal |
| CN110135415A (en) * | 2019-05-27 | 2019-08-16 | 深圳阜时科技有限公司 | A kind of bracket, sensing device and electronic equipment |
| CN110174078A (en) * | 2019-05-10 | 2019-08-27 | 深圳阜时科技有限公司 | A kind of sensing mould group and sensing device |
| CN110186498A (en) * | 2019-05-27 | 2019-08-30 | 深圳阜时科技有限公司 | A kind of sensing mould group, sensing device and electronic equipment |
| CN113329156A (en) * | 2021-05-31 | 2021-08-31 | 江西欧迈斯微电子有限公司 | Sensing module and electronic equipment |
| CN113726988A (en) * | 2020-05-26 | 2021-11-30 | 黑芝麻智能科技(重庆)有限公司 | Alignment offset reduction system |
| US11575820B2 (en) * | 2019-01-22 | 2023-02-07 | Lg Innotek Co., Ltd. | Camera module |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108012067A (en) * | 2018-01-11 | 2018-05-08 | 宁波维森智能传感技术有限公司 | A kind of camera module |
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| CN108322633A (en) * | 2018-03-05 | 2018-07-24 | 信利光电股份有限公司 | A kind of imaging modules and electronic device |
| CN108418923A (en) * | 2018-04-10 | 2018-08-17 | Oppo广东移动通信有限公司 | Holder, in-out box and terminal |
| CN108418922A (en) * | 2018-04-10 | 2018-08-17 | Oppo广东移动通信有限公司 | Holder, in-out box and terminal |
| US11575820B2 (en) * | 2019-01-22 | 2023-02-07 | Lg Innotek Co., Ltd. | Camera module |
| CN110174078A (en) * | 2019-05-10 | 2019-08-27 | 深圳阜时科技有限公司 | A kind of sensing mould group and sensing device |
| CN110135415A (en) * | 2019-05-27 | 2019-08-16 | 深圳阜时科技有限公司 | A kind of bracket, sensing device and electronic equipment |
| CN110186498A (en) * | 2019-05-27 | 2019-08-30 | 深圳阜时科技有限公司 | A kind of sensing mould group, sensing device and electronic equipment |
| CN113726988A (en) * | 2020-05-26 | 2021-11-30 | 黑芝麻智能科技(重庆)有限公司 | Alignment offset reduction system |
| CN113329156A (en) * | 2021-05-31 | 2021-08-31 | 江西欧迈斯微电子有限公司 | Sensing module and electronic equipment |
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Application publication date: 20170912 |