WO2022147839A1

WO2022147839A1 - Circuit board assembly, camera module, and electronic device

Info

Publication number: WO2022147839A1
Application number: PCT/CN2021/071129
Authority: WO
Inventors: 申成哲; 马忠科; 刘燕妮; 陈小凤
Original assignee: 欧菲光集团股份有限公司; 南昌欧菲光电技术有限公司
Priority date: 2021-01-11
Filing date: 2021-01-11
Publication date: 2022-07-14

Abstract

A circuit board assembly, comprising: a first circuit board (12), provided with a receiving hole (122); a second circuit board (14), movably disposed in the receiving hole (122); and a conductive member (16), electrically connected to the first circuit board (12) and the second circuit board (14), respectively. Therefore, the connection stability is high, the movement of the second circuit board (14) is prevented from being interfered, and the second circuit board (14) can drive a chip assembly (30) connected thereto to move, thereby realizing an anti-shake function. Also provided are a camera module and an electronic device.

Description

Circuit board assemblies, camera modules and electronic equipment

technical field

The present application relates to the technical field of optical image stabilization, and in particular, to a circuit board assembly, a camera module and an electronic device.

Background technique

In recent years, electronic products, smart devices and other products have been increasingly developed in the direction of miniaturization and high performance, and consumers have put forward more stringent requirements for the size and imaging capabilities of the camera modules of such products. This also causes most of the existing products to pursue the compactness and functional integration of the camera module, and the anti-shake function is integrated into the camera module in this wave of development to realize the camera module. anti-shake function.

The anti-shake function is generally realized by the voice coil motor (VCM) driving the movement of the optical lens, but in the lens assembly process, the calibration process of the lens is involved, and the calibration equipment is heavily dependent. Therefore, in the prior art, a method of driving the photosensitive element to move is proposed to realize the anti-shake function. In the process of realizing this application, the inventor found that there are at least the following problems in the prior art: in this way, a circuit board is used to realize the electrical connection between the movable part and the fixed part, but in order to realize the movement of the photosensitive element, it is necessary to The board is folded and wound multiple times, so that the overall size of the camera module is large, which is not conducive to miniaturization.

SUMMARY OF THE INVENTION

In view of this, it is necessary to provide a circuit board assembly, a camera module and an electronic device to solve the above problems.

The embodiment of the present application provides a circuit board assembly, including:

The first circuit board is provided with a receiving hole;

a second circuit board movably disposed in the receiving hole; and

A conducting member is respectively electrically connected with the first circuit board and the second circuit board.

The above-mentioned circuit board assembly realizes the electrical connection between the first circuit board and the second circuit board through the conducting member, the connection stability is high, and the movement of the second circuit board can be avoided. In addition, the second circuit board is movably disposed inside the first circuit board, and the second circuit board can drive the chip assembly connected to it to move to realize the anti-shake function. The secondary folding and winding make the overall size of the camera module smaller, which is conducive to miniaturization.

The embodiment of the present application provides a camera module, including:

Such as the above circuit board assembly;

a lens assembly, wherein the second circuit board of the circuit board assembly is suspended from one side of the lens assembly;

a connecting frame, respectively connecting the circuit board assembly and the lens assembly;

a chip assembly, disposed on a side of the second circuit board of the circuit board assembly close to the lens assembly; and

The drive assembly includes a fixed part and a moving part, the fixed part is arranged on the first circuit board or the connecting frame, the moving part is arranged on the second circuit board, and the moving part and the fixed part are mutually It acts to drive the moving part to move and drive the second circuit board to move.

The circuit board assembly in the above-mentioned camera module realizes the electrical connection between the first circuit board and the second circuit board through the conducting member, the connection stability is high, and the movement of the second circuit board can be avoided. In addition, the second circuit board is movably disposed inside the first circuit board, and the second circuit board can drive the chip assembly connected to it to move to realize the anti-shake function. The secondary folding and winding make the overall size of the camera module smaller, which is conducive to miniaturization.

The embodiment of the present application also provides an electronic device, including:

ontology; and

The camera module described above is arranged on the body.

The above-mentioned electronic device includes a circuit board assembly, the circuit board assembly realizes the electrical connection between the first circuit board and the second circuit board through the conducting member, the connection stability is high, and the movement of the second circuit board can be avoided. In addition, the second circuit board is movably disposed inside the first circuit board, and the second circuit board can drive the chip assembly connected to it to move to realize the anti-shake function. The secondary folding and winding make the overall size of the camera module smaller, which is conducive to miniaturization.

Description of drawings

FIG. 1 is a schematic cross-sectional structure diagram of a camera module provided by a first embodiment of the present application.

FIG. 2 is a schematic cross-sectional structural diagram of a camera module according to a second embodiment of the present application.

FIG. 3 is a schematic cross-sectional structural diagram of the camera module shown in FIG. 2 along the III-III direction.

FIG. 4 is a schematic cross-sectional structure diagram of a camera module according to a third embodiment of the present application.

FIG. 5 is a schematic cross-sectional structural diagram of the camera module shown in FIG. 4 along the V-V direction.

FIG. 6 is a schematic cross-sectional structure diagram of a camera module provided by a fourth embodiment of the present application.

FIG. 7 is a schematic cross-sectional structural diagram of the camera module shown in FIG. 6 along the direction VII-VII.

FIG. 8 is a schematic cross-sectional structure diagram of a camera module provided by a fifth embodiment of the present application.

FIG. 9 is a schematic cross-sectional structural diagram of a camera module provided by a sixth embodiment of the present application.

FIG. 10 is a schematic cross-sectional structural diagram of the camera module shown in FIG. 9 along the X-X direction.

FIG. 11 is a schematic cross-sectional structural diagram of a camera module provided by a seventh embodiment of the present application.

FIG. 12 is a schematic three-dimensional structural diagram of an electronic device provided by an embodiment of the present application.

Description of main component symbols

Camera module 100

Circuit board assembly 10

The first circuit board 12

Containment hole 122

first surface 124

Protrusion 126

The first overlapping surface 128

Second circuit board 14

second surface 142

first connection end 144

Second overlapping surface 146

Conductor 16

Protective glue 18

Lens assembly 20

Shell 22

Lenses 24

Drive 26

Chip assembly 30

Photosensitive element 32

Components 34

Drive components 40

Magnet 42

Coil 44

Connection frame 50

first bracket 52

The first opening 522

The first accommodating cavity 524

Second bracket 54

Second opening 542

Second accommodating cavity 544

Suspension 56

Filter 60

Strength plate 70

Connector 80

Ontology 200

Electronic equipment 300

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

It should be noted that when a component is referred to as being "electrically connected" to another component, it may be directly on the other component or an intervening component may also exist. When one component is considered to be "electrically connected" to another component, it can be a contact connection, eg, by means of wire connections, or a contactless connection, eg, by contactless coupling.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terms used herein in the specification of the present application are for the purpose of describing specific embodiments only and are not intended to limit the present application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Some embodiments of the present application will be described in detail below with reference to the accompanying drawings. The embodiments described below and features in the embodiments may be combined with each other without conflict.

Referring to FIG. 1, the first embodiment of the present application provides a camera module 100, which can simultaneously realize the functions of auto-focus and shake compensation. Specifically in this embodiment, the camera module 100 includes a circuit board assembly 10 , a lens assembly 20 , a chip assembly 30 , a driving assembly 40 and a connecting frame 50 .

The circuit board assembly 10 includes a first circuit board 12 , a second circuit board 14 and a conductive member 16 .

The first circuit board 12 has a substantially rectangular plate shape. The first circuit board 12 defines a receiving hole 122 , and the receiving hole 122 is substantially rectangular. In this embodiment, the first circuit board 12 may be any one of a flexible circuit board (Flexible Printed Circuit, FPC), a printed circuit board (Printed Circuit Board, PCB), and a flexible-rigid combination circuit board, which can be specifically based on actual needs. Make settings. It can be understood that, in other embodiments, the first circuit board 12 and the receiving hole 122 can also be circular, oval, square, etc., but not limited thereto.

The second wiring board 14 has a substantially rectangular plate shape. The second circuit board 14 is movably disposed in the receiving hole 122 . Specifically, there is a gap between the edge of the second circuit board 14 and the hole wall of the receiving hole 122 , so that the second circuit board 14 can move along the X axis and/or the Y axis in the receiving hole 122 , wherein the second circuit board 14 can move along the X axis and/or the Y axis. All of them are located in the receiving hole 122 , and may also be partially located in the receiving hole 122 , and may also be completely outside the receiving hole 122 .

The second circuit board 14 can be any one of a flexible circuit board (Flexible Printed Circuit, FPC), a printed circuit board (Printed Circuit Board, PCB), and a flexible and rigid circuit board, which can be specifically set according to actual needs. It can be understood that, in other embodiments, the second circuit board 14 can also be circular, oval, square, etc., but is not limited thereto.

It should be noted that, in this embodiment, for ease of understanding, the length direction of the first circuit board 12 is defined as the X-axis direction, and the width direction of the first circuit board 12 is defined as the Y-axis direction, which is consistent with the light of the camera module 100 The direction in which the axes are parallel is the Z-axis direction.

It can be understood that the first surface of the first circuit board 12 and the second surface of the second circuit board 14 may have different levels of height difference, that is to say, during the anti-shake process, the second circuit board 14 may be relatively The first circuit board 12 moves in the Z-axis direction, and at this time, there will be a height difference between the first surface and the second surface, so that the anti-shake in the Z-axis direction can be achieved.

The conducting member 16 is electrically connected to the first circuit board 12 and the second circuit board 14 respectively, and the main function of the conducting member 16 is to realize the electrical connection between the first circuit board 12 and the second circuit board 14 .

In this embodiment, the conducting member 16 is a wire. The wire needs to have good fatigue resistance and electrical conductivity, and the wire can be gold wire, silver wire, copper wire, aluminum wire, alloy wire, etc., but not limited to this.

In this embodiment, the first circuit board 12 has a first surface 124 close to the lens assembly 20 , the second circuit board 14 has a second surface 142 close to the lens assembly 20 , and two ends of the wires are respectively connected to the first surface 124 and the lens assembly 20 . The second surface 142 .

It can be understood that in other embodiments, the second circuit board 14 has a first connection end 144 away from the optical axis, the first circuit board 12 has a second connection end, and both ends of the conducting member 16 are respectively connected to the first connection end The end 144 is connected to the second connection end. Specifically in this embodiment, the second connection end is the first surface 124 of the first circuit board 12 , that is to say, one end of the wire is connected to the first connection of the second circuit board 14 end 144 and the other end is connected to the first surface 124 .

Understandably, in other embodiments, one end of the wire is connected to the first connecting end 144 of the second circuit board 14 , and the other end is connected to the hole wall of the receiving hole 122 , and the second connecting end is the hole wall of the receiving hole 122 at this time. .

Understandably, in other embodiments, one end of the wire is connected to the second surface 142, and the other end is connected to the hole wall of the receiving hole 122.

It can be understood that, in other embodiments, one end of the wire is connected to the surface of the second circuit board 14 opposite to the second surface 142 , and the other end is connected to the first surface 124 .

Understandably, in other embodiments, one end of the wire is connected to the surface of the second circuit board 14 opposite to the second surface 142 , and the other end is connected to the hole wall of the receiving hole 122 .

The circuit board assembly 10 also includes a protective glue 18 . The protective glue 18 covers the connection between one end of the wire and the first circuit board 12 and the connection between the other end of the wire and the second circuit board 14 . Specifically, the wires are electrically connected to the first circuit board 12 and the second circuit board 14 by means of soldering, and a solder joint will be formed at the soldering position. Since part of the area at the solder joint is a heat-affected zone, the connection strength of this area is relatively high. The connection strength in other areas of the solder joint is weak, so protective glue is used for coating to increase the connection strength between the wire and the circuit board in this area.

Understandably, in other embodiments, the protective glue 18 may be omitted.

The lens assembly 20 includes a housing 22 , a lens 24 and a driver 26 .

The housing 22 has a generally hollow annular shape. The housing 22 is disposed on the object side of the circuit board assembly 10 , that is, the side close to the object. The second circuit board 14 of the circuit board assembly 10 is suspended from the housing 22 .

The lens 24 includes at least one lens, and the lens can be a common light-transmitting lens with bending force, a liquid lens, or an electrochromic lens.

The driver 26 is connected to the lens 24 for driving the lens 24 to move in the direction of the optical axis, so as to realize automatic focusing.

The connecting frame 50 connects the circuit board assembly 10 and the lens assembly 20 . Specifically, the connecting frame 50 includes a first bracket 52 , a second bracket 54 and a suspension member 56 .

The first bracket 52 is substantially rectangular parallelepiped. The first bracket 52 is fixed to the side of the first circuit board 12 of the circuit board assembly 10 close to the lens assembly 20 , and the housing 22 of the lens assembly 20 is fixed to the side of the first bracket 52 away from the first circuit board 12 .

The first bracket 52 has a first opening 522 and a first accommodating cavity 524 . The first opening 522 is opened on the side of the first bracket 52 close to the object to allow light entering from the outside to pass through. The first accommodating cavity 524 communicates with the first opening 522 , and the first accommodating cavity 524 can accommodate the movement of the second circuit board 14 .

The second bracket 54 is substantially rectangular parallelepiped. The second bracket 54 is located in the first accommodating cavity 524 of the first bracket 52, and is fixed to the side of the second circuit board 14 of the circuit board assembly 10 close to the lens assembly 20.

The second bracket 54 has a second opening 542 and a second accommodating cavity 544 . The second opening 542 is opened on the side of the second bracket 54 close to the object to allow light entering from the outside to pass therethrough. The second accommodating cavity 544 communicates with the second opening 542 .

In this embodiment, the camera module 100 further includes an optical filter 60 , and the optical filter 60 is disposed in the second opening 542 and is disposed perpendicular to the optical axis. Specifically, the filter 60 is an infrared cut-off filter to allow light in other wavelength bands than red light to pass through.

One end of the suspension member 56 is connected to the side of the second bracket 54 close to the lens assembly 20 , and the other end is connected to the first bracket 52 . In a natural state, the suspension member 56 is parallel to the optical axis. In this embodiment, the suspension member 56 is a suspension wire, and the suspension wire mainly plays a supporting role. It can be understood that, in other embodiments, the suspension member 56 can be made of materials such as elastic sheets, silicon sheets, films, etc., but is not limited thereto.

It should be noted that the drive assembly 40 in this embodiment is a translational OIS focusing motor, and the translational OIS focusing motor is to fix an independent AF autofocusing motor on a translational suspension system (usually four equal-length vertical The vertical suspension wire, that is, the suspension member in this embodiment), the translation suspension system allows the AF autofocus motor to perform small translations in any direction on the plane parallel to the chip assembly (generally within plus or minus 100 microns). ). The autofocus function of the translational OIS focus motor is realized by the independent AF motor, and the OIS function is realized by the lens suspension composed of the AF motor and the lens, which is translated relative to the chip assembly. Due to the large total weight of the lens suspension body and the limited hardness of the suspension system, under different photographing postures (downward, horizontally forward, upward, etc.), the lens suspension body will be relatively The chip assembly generates translation, and more seriously, the lens suspension (equivalent to a spring oscillator) will generate translation vibration under external disturbances, resulting in blurred images. In order to solve the above problems, two Hall sensor elements are integrated in the motor to accurately measure the position of the lens suspension in the two orthogonal translation directions. Lock the position of the lens suspension so that it only translates according to the requirements of the actual OIS, and is not affected by its own gravity and photographing posture, and is also free from external mechanical disturbances.

The chip assembly 30 includes a photosensitive element 32 and a component 34 .

The photosensitive element 32 is located in the second accommodating cavity 544 of the second bracket 54 , is disposed on the side of the second circuit board 14 close to the lens assembly 20 , and is electrically connected to the second circuit board 14 through gold wires. Specifically, the photosensitive element 32 is fixed on one side of the second circuit board 14 by means of gluing. The photosensitive element 32 can be a complementary metal oxide semiconductor (CMOS, Complementary Metal Oxide Semiconductor) image sensor or a charge-coupled device (CCD, Charge-coupled Device).

The components 34 can be capacitors, resistors, Hall sensing devices, etc., only part of which is shown in the figure.

The drive assembly 40 includes a magnet 42 and a coil 44 . The magnet 42 is a fixed part, that is, a stator, and the coil 44 is a moving part, that is, a mover.

The magnet 42 is located in the first accommodating cavity 524 of the first bracket 52 and is fixed on the first circuit board 12 or the connecting frame 50 . The magnets 42 can be one or more.

The coil 44 is located in the second accommodating cavity 544 of the second bracket 54 and is fixed on the second circuit board 14, wherein the coil 44 is located outside the photosensitive element 32, the magnet 42 interacts with the coil 44 to drive the coil 44 to move, and The second circuit board 14 is driven to move.

It can be understood that the driving assembly 40 may be a structure of SMA, Piezo, OIS motor, etc., but is not limited thereto.

In the case of shaking, the camera module 100 may move slightly in a plane perpendicular to the optical axis. At this time, the driving component 40 can drive the second circuit board 14 and the photosensitive element 32 to move in a plane perpendicular to the optical axis. the opposite displacement. Specifically, when the coil 44 is energized, the magnetic field generated by the coil 44 interacts with the magnetic field generated by the magnet 42 to drive the second circuit board 14 and the photosensitive element 32 to move in a plane perpendicular to the optical axis, that is, the XY plane, to compensate for amount of jitter to obtain high-definition images. Wherein, when the second circuit board 14 moves in the plane perpendicular to the optical axis, the suspension member 56 swings in the plane perpendicular to the optical axis. After the coil 44 is powered off, the suspension member 56 can drive the second circuit board 14 to recover to the initial position.

In some embodiments, the camera module 100 further includes a strengthening plate 70 . The strengthening plate 70 is disposed on the side of the circuit board assembly 10 away from the lens assembly 20 , and blocks one end of the receiving hole 122 of the first circuit board 12 , mainly for strengthening and sealing.

In some embodiments, the camera module 100 further includes a connector 80 . The connector 80 is disposed on the strength plate 70 and is electrically connected to the first circuit board 12 for being electrically connected to the main board of the terminal to which the camera module 100 of the embodiment of the present application is applied, so as to realize signal conduction.

The circuit board assembly 10 in the above-mentioned camera module 100 realizes the electrical connection between the first circuit board 12 and the second circuit board 14 through the conducting member 16 , the connection stability is high, and interference with the second circuit board 14 can be avoided. and the second circuit board 14 is movably disposed inside the first circuit board 12, and the second circuit board 14 can drive the chip assembly 30 connected to it to move to realize the anti-shake function, and the circuit board and the chip assembly 30 There is no need to perform multiple folding and winding operations, so that the overall size of the camera module 100 is small, which is conducive to miniaturization.

Referring to FIG. 2, a second embodiment of the present application provides a camera module 100. The structure of the camera module 100 in the second embodiment is substantially the same as the structure of the camera module 100 in the first embodiment. at:

The conducting member 16 is in the shape of an organ or a spiral. Two ends of the conducting member 16 are respectively connected to the first connecting end 144 and the second connecting end of the first circuit board 12. In this embodiment, the second connecting end is the hole wall of the receiving hole 122, and the conducting member 16 is perpendicular to the vertical Set parallel to the plane of the optical axis.

Referring to FIG. 3 , there are a plurality of conductive members 16 , and are disposed between the first circuit board 12 and the second circuit board 14 at uniform intervals around the optical axis. In this embodiment, the projection of the conducting member 16 on a plane perpendicular to the optical axis is a long strip. The number of the conducting members 16 is four, and it is understood that in other embodiments, the conducting members 16 may also be two, six, etc., but not limited thereto.

The circuit board assembly 10 in the camera module 100 in the second embodiment realizes the electrical connection between the first circuit board 12 and the second circuit board 14 through the conducting member 16 . The movement of the circuit board 14; and the second circuit board 14 is movably arranged inside the first circuit board 12, and the second circuit board 14 can drive the chip assembly 30 connected to it to move to realize the anti-shake function, and the circuit board and the chip There is no need to perform multiple folding and winding between the components 30, so that the overall size of the camera module 100 is small, which is beneficial to realize miniaturization.

Referring to FIG. 4 , a third embodiment of the present application provides a camera module 100 . The structure of the camera module 100 in the third embodiment is substantially the same as the structure of the camera module 100 in the first embodiment, and the difference is at:

The conducting member 16 is in the shape of an organ or a spiral. The hole wall of the receiving hole 122 protrudes toward the optical axis to form a protruding portion 126. The protruding portion 126 is disposed away from the lens assembly 20 relative to the second circuit board 14. The protruding portion 126 has a first overlapping surface 128 on the side close to the lens assembly 20. The side of the second circuit board 14 away from the lens assembly 20 has a second overlapping surface 146 , the projections of the first overlapping surface 128 and the second overlapping surface 146 on a plane perpendicular to the optical axis overlap, and the two ends of the conducting member 16 are respectively connected On the first overlapping surface 128 and the second overlapping surface 146, the conducting member 16 is disposed parallel to the optical axis.

Referring to FIG. 5 , there are a plurality of conductive members 16 , which are evenly spaced around the optical axis. In this embodiment, the second circuit board 14 has four sides, and the number of the conducting members 16 disposed on each side is four. It can be understood that in other embodiments, the conducting members 16 can also be Two, six, etc., but not limited thereto.

The circuit board assembly 10 in the camera module 100 in the third embodiment realizes the electrical connection between the first circuit board 12 and the second circuit board 14 through the conducting member 16 . The movement of the circuit board 14; and the second circuit board 14 is movably arranged inside the first circuit board 12, and the second circuit board 14 can drive the chip assembly 30 connected to it to move to realize the anti-shake function, and the circuit board and the chip There is no need to perform multiple folding and winding between the components 30, so that the overall size of the camera module 100 is small, which is beneficial to realize miniaturization.

Referring to FIG. 6, a fourth embodiment of the present application provides a camera module 100. The structure of the camera module 100 in the fourth embodiment is substantially the same as the structure of the camera module 100 in the first embodiment, and the difference is at:

The conducting member 16 is in the shape of an organ or a spiral. Two ends of the conducting member 16 are respectively connected to the first connecting end 144 and the hole wall of the receiving hole 122 , and the second connecting end is the hole wall of the receiving hole 122 .

Referring to FIG. 7 , there are a plurality of conductive members 16 , which are evenly spaced around the optical axis between the first circuit board 12 and the second circuit board 14 . In this embodiment, the projection of the conducting member 16 on a plane perpendicular to the optical axis is a long strip. The second circuit board 14 has four sides, and the number of conducting members 16 disposed on each side is one, that is, the number of conducting members 16 is four. The number of pieces 16 may also be two, six, etc., but not limited thereto.

The circuit board assembly 10 in the camera module 100 in the fourth embodiment realizes the electrical connection between the first circuit board 12 and the second circuit board 14 through the conducting member 16, the connection stability is high, and the interference of the second circuit board 14 can be avoided. The movement of the circuit board 14; and the second circuit board 14 is movably arranged inside the first circuit board 12, and the second circuit board 14 can drive the chip assembly 30 connected to it to move to realize the anti-shake function, and the circuit board and the chip There is no need to perform multiple folding and winding between the components 30, so that the overall size of the camera module 100 is small, which is beneficial to realize miniaturization.

Referring to FIG. 8 , a fifth embodiment of the present application provides a camera module 100 . The structure of the camera module 100 in the fifth embodiment is substantially the same as the structure of the camera module 100 in the first embodiment, and the difference is at:

The conducting member 16 is in the shape of an organ or a spiral. The hole wall of the receiving hole 122 protrudes toward the optical axis to form a protruding portion 126. The protruding portion 126 is disposed away from the lens assembly 20 relative to the second circuit board 14. The protruding portion 126 has a first overlapping surface 128 on the side close to the lens assembly 20. The side of the second circuit board 14 away from the lens assembly 20 has a second overlapping surface 146 , the projections of the first overlapping surface 128 and the second overlapping surface 146 on a plane perpendicular to the optical axis overlap, and the two ends of the conducting member 16 are respectively connected The end of the first overlapping surface 128 close to the optical axis and the end of the second overlapping surface 146 away from the optical axis, the extension line of the conducting member 16 intersects the optical axis, that is to say, the conducting member 16 overlaps the first The surface 128 and the second overlapping surface 146 are inclined.

The circuit board assembly 10 in the camera module 100 in the fifth embodiment realizes the electrical connection between the first circuit board 12 and the second circuit board 14 through the conducting member 16 , the connection stability is high, and the interference of the second circuit board 14 can be avoided. The movement of the circuit board 14; and the second circuit board 14 is movably arranged inside the first circuit board 12, and the second circuit board 14 can drive the chip assembly 30 connected to it to move to realize the anti-shake function, and the circuit board and the chip There is no need to perform multiple folding and winding between the components 30, so that the overall size of the camera module 100 is small, which is beneficial to realize miniaturization.

Referring to FIG. 9 , a sixth embodiment of the present application provides a camera module 100 . The structure of the camera module 100 in the sixth embodiment is substantially the same as the structure of the camera module 100 in the first embodiment. at:

The conducting member 16 is in the shape of an organ or a spiral. Two ends of the conducting member 16 are respectively connected to the first surface 124 and the second surface 142 .

Referring to FIG. 10 , there are a plurality of conductive members 16 , which are evenly spaced around the optical axis between the first circuit board 12 and the second circuit board 14 . In this embodiment, the projection of the conducting member 16 on a plane perpendicular to the optical axis is a long strip. The second circuit board 14 has four sides, and the number of conducting members 16 disposed on each side is one, that is, the number of conducting members 16 is four. The number of pieces 16 may also be two, six, etc., but not limited thereto.

The circuit board assembly 10 in the camera module 100 in the sixth embodiment realizes the electrical connection between the first circuit board 12 and the second circuit board 14 through the conducting member 16 , the connection stability is high, and the interference of the second circuit board 14 can be avoided. The movement of the circuit board 14; and the second circuit board 14 is movably arranged inside the first circuit board 12, and the second circuit board 14 can drive the chip assembly 30 connected to it to move to realize the anti-shake function, and the circuit board and the chip There is no need to perform multiple folding and winding between the components 30, so that the overall size of the camera module 100 is small, which is beneficial to realize miniaturization.

Referring to FIG. 11 , a seventh embodiment of the present application provides a camera module 100 . The structure of the camera module 100 in the seventh embodiment is substantially the same as the structure of the camera module 100 in the first embodiment. at:

The conducting member 16 is in the shape of an organ or a spiral. The hole wall of the receiving hole 122 protrudes toward the optical axis to form a protruding portion 126. The protruding portion 126 is disposed away from the lens assembly 20 relative to the second circuit board 14. The protruding portion 126 has a first overlapping surface 128 on the side close to the lens assembly 20. The side of the second circuit board 14 away from the lens assembly 20 has a second overlapping surface 146 , there is a gap between the projections of the first overlapping surface 128 and the second overlapping surface 146 on a plane perpendicular to the optical axis, and both ends of the conducting member 16 are connected First overlapping surface 128 and second overlapping surface 146 .

The circuit board assembly 10 in the camera module 100 in the seventh embodiment realizes the electrical connection between the first circuit board 12 and the second circuit board 14 through the conducting member 16 , the connection stability is high, and the interference of the second circuit board 14 can be avoided. The movement of the circuit board 14; and the second circuit board 14 is movably arranged inside the first circuit board 12, and the second circuit board 14 can drive the chip assembly 30 connected to it to move to realize the anti-shake function, and the circuit board and the chip There is no need to perform multiple folding and winding between the components 30, so that the overall size of the camera module 100 is small, which is beneficial to realize miniaturization.

Referring to FIG. 12 , an embodiment of the present application further proposes an electronic device 300 , and the electronic device 300 includes but is not limited to a smartphone, a tablet computer, a notebook computer, an electronic book reader, a portable multimedia player (PMP), a portable phone electronic devices that support imaging, such as cameras, video phones, digital still cameras, mobile medical devices, and wearable devices.

The electronic device 300 includes the aforementioned camera module 100 and the main body 200 ; the camera module 100 is disposed on the main body 200 . In this embodiment, the electronic device 500 is a smart phone.

The above-mentioned electronic device 300 includes the circuit board assembly 10, and the circuit board assembly 10 realizes the electrical connection between the first circuit board 12 and the second circuit board 14 through the conducting member 16, the connection stability is high, and interference with the second circuit can be avoided. The movement of the board 14; and the second circuit board 14 is movably arranged inside the first circuit board 12, and the chip assembly 30 connected to it can be driven by the second circuit board 14 to move to realize the anti-shake function, and the circuit board and the chip assembly. There is no need to perform multiple folding and winding between 30 , so that the overall size of the camera module 100 is small, which is beneficial to realize miniaturization.

The above embodiments are only used to illustrate the technical solutions of the present application rather than limitations. Although the present application has been described in detail with reference to the above preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present application can be modified or equivalently replaced. Neither should depart from the spirit and scope of the technical solutions of the present application. Those skilled in the art can also make other changes within the spirit of the present application, etc. to be used in the design of the present application, as long as they do not deviate from the technical effects of the present application. These changes made in accordance with the spirit of the present application should all be included within the scope of protection claimed in the present application.

Claims

A circuit board assembly, characterized in that it includes:

The first circuit board is provided with a receiving hole;

a second circuit board movably disposed in the receiving hole; and

A conducting member is electrically connected to the first circuit board and the second circuit board respectively.
The circuit board assembly of claim 1, wherein the conducting member is a wire, and two ends of the wire are electrically connected to the first circuit board and the second circuit board, respectively.
The circuit board assembly of claim 2, wherein the circuit board assembly further comprises:

The protective glue covers the connection between one end of the wire and the first circuit board, and the connection between the other end of the wire and the second circuit board.
The circuit board assembly of claim 1, wherein the second circuit board has a first connection end away from the optical axis, and two ends of the conducting member are respectively connected to the first connection end and the The hole wall of the accommodating hole is arranged in parallel with the plane perpendicular to the optical axis.
The circuit board assembly of claim 1, wherein the second circuit board has a first connection end away from the optical axis, and two ends of the conducting member are respectively connected to the first connection end and the The hole wall of the accommodating hole, and the conducting member is arranged to intersect with a plane perpendicular to the optical axis.
The circuit board assembly of claim 1, wherein the hole wall of the receiving hole protrudes toward the optical axis to form a protruding portion, the protruding portion is disposed away from the lens assembly relative to the second circuit board, and the A side of the protruding part close to the lens assembly has a first overlapping surface, a side of the second circuit board away from the lens assembly has a second overlapping surface, and the first overlapping surface and the second overlapping surface are perpendicular to the optical axis The projections on the plane overlap, the two ends of the conducting member are respectively connected to the first overlapping surface and the second overlapping surface, and the conducting member is arranged parallel to the optical axis.
The circuit board assembly of claim 1, wherein the hole wall of the receiving hole protrudes toward the optical axis to form a protruding portion, the protruding portion is disposed away from the lens assembly relative to the second circuit board, and the A side of the protruding part close to the lens assembly has a first overlapping surface, a side of the second circuit board away from the lens assembly has a second overlapping surface, and the first overlapping surface and the second overlapping surface are perpendicular to the optical axis The projections on the plane overlap, the two ends of the conducting member are respectively connected to the end of the first overlapping surface close to the optical axis and the end of the second overlapping surface far from the optical axis, the extension of the conducting member The line intersects the optical axis.
The circuit board assembly of claim 1, wherein the first circuit board has a first surface close to the lens assembly, the second circuit board has a second surface close to the lens assembly, and the conductive member The two ends are respectively connected to the first surface and the second surface.
The circuit board assembly according to claim 1, wherein the hole wall of the receiving hole protrudes toward the optical axis to form a protruding portion, the protruding portion is away from the lens assembly relative to the second circuit board, and the protruding portion extends away from the lens assembly relative to the second circuit board. The side of the extension part close to the lens assembly has a first overlapping surface, the side of the second circuit board away from the lens assembly has a second overlapping surface, and the first overlapping surface and the second overlapping surface are perpendicular to the optical axis. There is a gap in the projection on the plane, and two ends of the conducting member are connected to the first overlapping surface and the second overlapping surface.
The circuit board assembly according to any one of claims 4-9, wherein the conducting member is in an organ shape or a spiral shape.
A camera module, comprising:

lens assembly;

The circuit board assembly according to any one of claims 1-10, wherein the second circuit board of the circuit board assembly is suspended from one side of the lens assembly;

a connecting frame, respectively connecting the circuit board assembly and the lens assembly;

a chip assembly, disposed on a side of the second circuit board of the circuit board assembly close to the lens assembly; and

The drive assembly includes a fixed part and a moving part, the fixed part is arranged on the first circuit board or the connecting frame, the moving part is arranged on the second circuit board, and the moving part and the fixed part are mutually It acts to drive the moving part to move and drive the second circuit board to move.
An electronic device, comprising:

ontology; and

The camera module according to claim 11, which is arranged on the body.