CN216751873U - Image sensor assembly, camera module and electronic equipment - Google Patents

Abstract

The application provides an image sensor subassembly, module and electronic equipment make a video recording, the image sensor subassembly is through setting up the driver between image sensor and circuit board, and the driver can drive image sensor and remove. A plurality of conductive wires are connected between the image sensor and the circuit board to realize signal transmission, and two ends of each conductive wire are respectively connected with the image sensor and the circuit board. The conductive wires are vertically arranged on the board surface of the circuit board, and the connectors are wrapped outside the conductive wires positioned on the same side of the image sensor, so that the strength of the conductive wires can be enhanced, the integrity of the conductive wires on the same side is improved, the conductive wires are prevented from being inclined and collapsed to be contacted with each other in the long-term use process, and the risk of short circuit of the conductive wires is reduced; meanwhile, the connector is wrapped in a partial area around the bent top of the conducting wire, so that the connector and the conducting wire are conveniently connected and fixed, and the influence on the deformability of the conducting wire is small.

Description

Image sensor assembly, camera module and electronic equipment

Technical Field

The application relates to the technical field of electronic equipment, in particular to an image sensor assembly, a camera module and electronic equipment.

Background

In the consumer electronics industry, particularly in the product fields of mobile phones, tablet computers, Virtual Reality (VR) devices and the like, the camera module is more and more widely applied due to supporting numerous functions and use scenes such as photographing, video recording, intelligent identification, consumption and the like.

The camera module generally includes a lens, a circuit board, an image sensor, and other components, wherein an Auto Focus (AF) module further includes a Focus driver, a sealing component, and other components. Specifically, the image sensor is generally fixed on a board surface of the circuit board by bonding with an adhesive, and then a Wire Bond (WB) process is used to connect a gold Wire between the image sensor and the circuit board so as to connect the image sensor and the circuit board through the gold Wire, thereby realizing signal transmission between the image sensor and the circuit board.

However, the gold wire in the conventional camera module does not have sufficient deformability, and cannot realize relative movement between the image sensor and the circuit board.

SUMMERY OF THE UTILITY MODEL

The application provides an image sensor subassembly, module and electronic equipment make a video recording, but the image sensor among the image sensor subassembly circuit board relatively removes, can realize the anti-shake function of the module of making a video recording, promotes electronic equipment's performance.

In a first aspect, the present application provides an image sensor assembly, including an image sensor, a circuit board, a driver and a plurality of conductive wires, where the image sensor is located on a side of the circuit board, the driver is connected between the image sensor and the circuit board, and the driver drives the image sensor to move;

the plurality of conducting wires are distributed at intervals along the circumferential direction of the image sensor, the first end of each conducting wire is connected with the image sensor, and the second end of each conducting wire is connected with the circuit board;

the connector wraps the conductive wires positioned on the same side of the image sensor, and the connector wraps the bent top.

The application provides an image sensor subassembly sets up the driver through setting up between the face at image sensor's the back and circuit board, and the driver can drive image sensor and remove, can realize the anti-shake function of the module of making a video recording through image sensor's removal. A plurality of conductive wires are connected between the image sensor and the circuit board to realize signal transmission, and two ends of each conductive wire are respectively connected with the image sensor and the circuit board. The conductive wires are vertically arranged on the board surface of the circuit board, and the connectors are wrapped outside the conductive wires positioned on the same side of the image sensor, so that the strength of the conductive wires can be enhanced, the integrity of the conductive wires on the same side is improved, the conductive wires are prevented from being inclined and collapsed to be contacted with each other in the long-term use process, and the risk of short circuit of the conductive wires is reduced; meanwhile, the connector is wrapped in a partial area around the bent top of the conducting wire, so that the connector and the conducting wire are conveniently connected and fixed, and the influence on the deformability of the conducting wire is small.

In one possible embodiment, the spacing between the curved top and the first end is greater than or equal to 250 μm.

The distance between the bent top of the conductive wire, which is far away from the board surface of the circuit board, and the first end of the conductive wire is larger than or equal to 250 microns, and the conductive wire has higher wire arc height, so that a larger deformation moving space can be reserved for the conductive wire, and the moving requirement of the image sensor can be met.

In one possible embodiment, the spacing between the curved top and the first end is greater than or equal to 300 μm.

In one possible embodiment, the conductive line comprises an ascending section, a return bending section and a descending section in sequence along the direction from the first end to the second end, and the top of the return bending section forms a bending top;

wherein the bending radian of the bending section is more than or equal to 120 degrees.

By making the bending radian of the return bending section more than or equal to 120 degrees, the extending directions of the line segments at the two sides of the return bending section tend to extend in opposite directions, and an obvious ascending section and a descending section can be formed. And, the bigger the bending radian of the back bending section of the conductive wire is, the higher the wire arc height of the conductive wire is, and the smaller the limitation of the conductive wire on the moving range of the image sensor is.

In a possible implementation mode, an included angle between the ascending section and a plane where the image sensor is located and an included angle between the descending section and the plane where the image sensor is located are both smaller than 90 degrees, and a projection of the return bending section on the board surface of the circuit board is located between the first end and the second end.

The included angles between the planes of the ascending section and the descending section and the image sensor are smaller than 90 degrees, so that the top of the conductive wire is positioned between the two ends of the conductive wire, the top of the conductive wire is prevented from inclining towards the outer side or the center of the image sensor, the conductive wire can be prevented from seriously inclining along with the movement of the image sensor, the shape of the conductive wire can be recovered when the conductive wire is not deformed, and the risk of mutual short circuit of the conductive wire is weakened.

In a possible embodiment, a transverse section is further provided between the first end and the rising section, and an included angle between the transverse section and a plane where the image sensor is located is smaller than an included angle between the rising section and the plane where the image sensor is located.

A transverse section is arranged between the first end of the conductive wire and the rising section and extends to the outer side of the edge of the image sensor, and a space is reserved between the transverse section and the bent top in the height direction of the conductive wire so as to avoid an internal structure on the light incident side of the image sensor in the camera module.

In a possible embodiment, the angle between the rising section and the transverse section is greater than or equal to 90 ° and less than or equal to 120 °.

The included angle between the transverse section and the ascending section is set to be 90-120 degrees, so that the transverse section approaches to extend along the surface of the image sensor, an avoidance space formed above the transverse section is enlarged, the distance between the ascending section and the descending section is shortened, the bending radian of the return bending section is increased, the line arc height of the conducting wire is increased, the deformation and the movement of the conducting wire are facilitated, and the moving range of the image sensor is facilitated to be enlarged.

In one possible embodiment, the connector covers a line segment of the conductive line in the range of 30-150 μm from the curved top in the direction of the height of the line arc of the conductive line.

The height range of the arc of the conductor wire wrapped by the connecting body is set to be 30-150 mu m, so that the connecting body can be ensured to have enough coverage area on the conductor wire, and the connecting body can be ensured to prevent the conductor wires positioned on the same side of the image sensor from inclining and collapsing to be contacted with each other; meanwhile, the connector does not cover the excessive area of the conducting wire, and the deformation and the movement of the conducting wire are not influenced.

In one possible embodiment, the linker is a colloid.

The colloid is wrapped outside the conductive wire arranged on the same side, and the colloid has small limitation on the deformation and movement of the conductive wire while fixing the conductive wire, so that the deformation performance of the conductive wire can be improved, and the limitation of the conductive wire on the movement of the image sensor is reduced.

In one possible embodiment, the gel is a gel formed by curing a glue.

The outer surface of the gel is solidified, so that the glue can be prevented from overflowing, meanwhile, the interior of the gel is still in a liquid state, and the conductive wire has a certain deformation moving space in the gel.

In one possible embodiment, the conductive wire is vertically erected on the board surface of the circuit board.

The conductive wires are vertically erected on the board surface of the circuit board, included angles between the conductive wires and the board surfaces positioned on two sides of the conductive wires are equal, the tendency that the conductive wires are prone to inclining to one side can be reduced, the erected state of the conductive wires is kept favorably, a large moving space is formed between the adjacent conductive wires, the conductive wires can be prevented from inclining and collapsing, the conductive wires are prevented from contacting with each other, and the conductive wires are prevented from being short-circuited with each other.

In one possible embodiment, the driver is attached to the board side of the circuit board.

In one possible embodiment, the circuit board is provided with a mounting groove, a notch of the mounting groove is located on one side surface of the circuit board where the image sensor is located, and the driver is mounted in the mounting groove.

Through set up the mounting groove on the circuit board, install the driver in the mounting groove, driver and the holistic at least partial thickness of image sensor lie in the thickness of circuit board within range, can reduce the whole thickness of image sensor subassembly, and the thickness of module is made a video recording in the attenuate is favorable to electronic equipment's frivolousization.

In a possible implementation manner, a plurality of first interfaces are arranged in the edge region of the image sensor at intervals along the circumferential direction, the region, located on the periphery of the image sensor, on the circuit board is a connection region, and a plurality of second interfaces are arranged in the connection region at intervals along the circumferential direction;

the first end of each conducting wire is connected with each first interface, and the second end of each conducting wire is connected with each second interface nearby.

In one possible embodiment, the actuator is a MEMS actuator.

In a second aspect, the present application provides a camera module, which includes a lens assembly, a filter assembly and an image sensor assembly as described above, wherein the filter assembly and the image sensor assembly are sequentially stacked on the light-emitting side of the lens assembly.

The application provides a module of making a video recording, including lens subassembly, filtering component and image sensor subassembly stack gradually in the light-emitting side of lens subassembly, and wherein, the image sensor subassembly sets up the driver through setting up between the face of the back at image sensor and circuit board, and the driver can drive image sensor and remove, can realize the anti-shake function of the module of making a video recording through image sensor's removal. The image sensor is connected with the circuit board through the conducting wires to achieve signal transmission, a plurality of conducting wires are arranged in the peripheral area of the image sensor on the edge of the image sensor and the circuit board at intervals along the circumferential direction, the first end of each conducting wire is connected with the image sensor, and the second end of each conducting wire is connected with the part, close to the first end, of the circuit board. The conductive wire is vertically arranged on the board surface of the circuit board, and the distance between the bent top part of the conductive wire, which is far away from the board surface of the circuit board, and the first end of the conductive wire is larger than or equal to 250 micrometers, so that the conductive wire has a higher wire arc height, a larger deformation moving space can be reserved for the conductive wire, and the moving requirement of the image sensor can be met.

In one possible embodiment, the lens assembly includes a lens barrel and a plurality of lenses, the lenses are packaged in the lens barrel, and the plurality of lenses are stacked in an axial direction of the lens barrel.

In one possible embodiment, the lens assembly includes a driving device and a lens, the driving device includes a housing, and the lens is movably disposed in the housing.

In a third aspect, the present application provides an electronic device, which includes at least one camera module as described above.

The application provides an electronic equipment, including at least one module of making a video recording, the module of making a video recording includes the camera lens subassembly, filtering component and image sensor subassembly range upon range of in proper order in the light-emitting side of camera lens subassembly, and wherein, the image sensor subassembly is through setting up the driver between the face of the back at image sensor and circuit board, and the driver can drive image sensor and remove, can realize the anti-shake function of the module of making a video recording through image sensor's removal. The image sensor is connected with the circuit board through the conducting wires to achieve signal transmission, a plurality of conducting wires are arranged in the peripheral area of the image sensor on the edge of the image sensor and the circuit board at intervals along the circumferential direction, the first end of each conducting wire is connected with the image sensor, and the second end of each conducting wire is connected with the part, close to the first end, of the circuit board. The conductive wire is vertically arranged on the board surface of the circuit board, and the distance between the bent top part of the conductive wire, which is far away from the board surface of the circuit board, and the first end of the conductive wire is larger than or equal to 250 micrometers, so that the conductive wire has a higher wire arc height, a larger deformation moving space can be reserved for the conductive wire, and the moving requirement of the image sensor can be met.

Drawings

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure;

FIG. 2 is a partial exploded view of FIG. 1;

fig. 3 is a schematic structural diagram of a camera module according to an embodiment of the present disclosure;

FIG. 4 is an exploded view of FIG. 3;

fig. 5 is a schematic structural diagram of another camera module provided in the embodiment of the present application;

FIG. 6 is an exploded view of FIG. 5;

fig. 7 is a schematic structural diagram of an image sensor assembly according to an embodiment of the present disclosure;

FIG. 8 is an exploded view of FIG. 7;

FIG. 9 is a side view of FIG. 7;

FIG. 10 is a cross-sectional view of another image sensor assembly provided in an embodiment of the present application;

FIG. 11 is a cross-sectional view of a third image sensor assembly provided in an embodiment of the present application;

FIG. 12 is a schematic structural diagram of a conductive line provided in an embodiment of the present application;

fig. 13 is a schematic structural diagram of another conductive line provided in an embodiment of the present application.

Description of reference numerals:

100-an electronic device;

1-a camera module; 2-a housing; 21-a rear cover; 211-light transmission holes; 22-middle frame; 3-a display panel; 4, a main board;

10-an image sensor assembly; 20-a lens assembly; 30-a filter assembly;

11-an image sensor; 12-a circuit board; 13-a driver; 14-a conductive wire; 15-a linker; 16-FPC; 17-a metal sheet;

111-a first interface; 121-mounting grooves; 122-a connection region; 141-a first end; 142-a second end; 143-a rising section; 144-a return section; 145-descending section; 146-a transverse segment; 161-an electrical connector;

1221-a second interface; 1441-curved top;

201-lens barrel; 202-a drive; 2021-a housing; 2022-a drive assembly; 203-lens; 2031-lens; 301-a scaffold; 3011-a mounting opening; 302-optical filter.

Detailed Description

The terminology used in the description of the embodiments section of the present application is for the purpose of describing particular embodiments of the present application only and is not intended to be limiting of the present application.

With the continuous progress of science and technology, cameras have become the basic configuration of mobile terminal devices such as mobile phones, tablet computers, notebook computers, ultra-mobile Personal computers (UMPC), netbooks, Personal Digital Assistants (PDA), smart wearable devices, Point of Sales (POS), Augmented Reality (AR)/Virtual Reality (VR) devices, and the like. Moreover, the camera is more and more widely applied due to supporting a plurality of functions and use scenes such as photographing, video recording, intelligent identification and consumption.

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure; fig. 2 is a partial exploded view of fig. 1. Referring to fig. 1 and 2, an electronic device 100 according to the present application will be described with reference to a mobile phone as an example. It should be understood that the electronic device 100 of the present embodiment includes, but is not limited to, a mobile phone, and the electronic device 100 may also be a mobile terminal device such as the tablet computer, the notebook computer, the UMPC, the netbook, the PDA, the POS device, the AR/VR device, and the like.

Referring to fig. 1 and 2, the electronic apparatus 100 may include a housing 2, a display panel 3, a camera module 1, and a main board 4. The back and the side of establishing at electronic equipment 100 are enclosed to shell 2, and display panel 3 installs in the region that the lateral wall of shell 2 encloses, and display panel 3 is located electronic equipment 100's front, and display panel 3 and shell 2 enclose into electronic equipment 100's accommodation space jointly, and module 1 and mainboard 4 of making a video recording are all installed in this accommodation space. In addition, a microphone, a loudspeaker, a battery or other devices can be arranged in the accommodating space.

Referring to fig. 1, the camera module 1 is shown in the top, near-edge region of the housing 2. It is to be understood that the position of the camera module 1 is not limited to the position shown in fig. 1.

Referring to fig. 2, the housing 2 may include a rear cover 21 and a middle frame 22, the rear cover 21 is located on the back of the electronic device 100, the middle frame 22 is disposed around the peripheral edge of the rear cover 21, the display panel 3 is connected to the middle frame 22 and is disposed opposite to the rear cover 21, and the camera module 1 may be mounted on the middle frame 22. Use module 1 of making a video recording as the rearmounted camera as the example, be equipped with the light trap 211 on the back lid 21, the sensitization face of module 1 of making a video recording is towards back lid 21 and set up with the light trap 211 relatively, and module 1 of making a video recording gathers external environment light through the light trap 211 on the back lid 21. Wherein, outside environment light passes the light trap 211 and shines to the photosurface of module 1 of making a video recording, and outside environment light is gathered to the photosurface to convert light signal into the signal of telecommunication through module 1 of making a video recording, in order to realize the shooting function of module 1 of making a video recording.

The camera module 1 may also be a front camera, at this time, the photosensitive surface of the camera module 1 faces the display panel 3, a light-transmitting portion (not shown) is disposed at a position on the display panel 3, which is directly opposite to the photosensitive surface of the camera module 1, and external ambient light irradiates the photosensitive surface of the camera module 1 through the light-transmitting portion of the display panel 3, which is not described again.

Fig. 2 shows that one image pickup module 1 is provided in the electronic apparatus 100, and it should be noted that, in practical applications, the number of image pickup modules 1 in the electronic apparatus 100 is not limited to one, and the number of image pickup modules 1 may also be two or more than two. When the number of the camera modules 1 is plural, the plurality of camera modules 1 can be arranged arbitrarily in the X-Y plane. For example, the plurality of camera modules 1 are arranged in the X-axis direction, or the plurality of camera modules 1 are arranged in the Y-axis direction.

In addition, the image pickup module 1 includes, but is not limited to, an Auto Focus (AF) module, a Fixed Focus (FF) module, a wide image pickup module 1, a telephoto image pickup module 1, a color image pickup module 1, or a black and white image pickup module 1. The camera module 1 in the electronic device 100 may include any one of the camera modules 1, or two or more of the camera modules 1. When the number of the camera modules 1 is two or more, the two or more camera modules 1 may be integrated into one camera module.

Referring to fig. 2, the camera module 1 may be electrically connected to a motherboard 4 in the electronic device 100, and as an embodiment, the camera module 1 may be electrically connected to the motherboard 4 through an electrical connector. For example, the camera module 1 is provided with a female socket of an electrical connector, and the motherboard 4 is provided with a male socket of the electrical connector, and the female socket is inserted into the male socket to realize the electrical connection between the camera module 1 and the motherboard 4. Wherein, mainboard 4 is equipped with the treater on for example, shoots the image through treater control camera module 1. When a user inputs a shooting instruction, the processor receives the shooting instruction and controls the camera module 1 to shoot a shooting object according to the shooting instruction.

The image pickup module 1 in the electronic apparatus 100 according to the embodiment of the present application will be described in detail below.

Fig. 3 is a schematic structural diagram of a camera module according to an embodiment of the present disclosure; fig. 4 is an exploded view of fig. 3. Referring to fig. 3, the camera module 1 according to the present embodiment includes a lens assembly 20, a filter assembly 30, and an image sensor assembly 10, where two axial ends of the lens assembly 20 are a light incident end and a light exiting end, and the filter assembly 30 and the image sensor assembly 10 are sequentially stacked on the light exiting end of the lens assembly 20. The external environment light irradiates to the light inlet end of the lens assembly 20, passes through the lens assembly 20 and is emitted from the light outlet end thereof, the light emitted from the light outlet end of the lens assembly 20 irradiates to the light filtering assembly 30, stray light is filtered by the light filtering assembly 30 and then irradiates to the image sensor assembly 10, and the image sensor assembly 10 converts an optical signal into an electrical signal, so that the imaging function of the camera module 1 is realized.

Specifically, the lens assembly 20 of the camera module 1 shown in fig. 3 may be an FF module, where the lens assembly 20 includes a lens barrel 201 and a plurality of lenses (not shown in the drawings), and the lenses are enclosed in the lens barrel 201, and exemplarily, the lenses may be stacked in an axial direction of the lens barrel 201, for example, an optical axis of each lens is located on a central axis of the lens barrel 201, and an axial direction of the lens barrel 201 is an optical axis of the lens assembly 20.

Generally, the lens is disposed near one end of the lens barrel 201, and the end of the lens barrel 201 corresponds to the light-entering end of the lens assembly 20; the image sensor assembly 10 is disposed at the other end of the lens barrel 201, which end of the lens barrel 201 corresponds to the light exit end of the lens assembly 20. External environment light irradiates the light inlet end of the lens barrel 201, the light passes through the stacked lenses, the incident light is converged by the lenses, and the converged light is emitted from the light outlet end of the lens barrel 201.

Referring to fig. 4, the filter assembly 30 includes a support 301 and a filter 302, the filter 302 is mounted on the support 301, the support 301 is used for supporting and positioning the filter 302, and illustratively, the support 301 is provided with a mounting opening 3011, and the filter 302 covers the mounting opening 3011. The light emitted from the lens assembly 20 is irradiated to the filter 302, filtered by the filter 302 to remove stray light, and then irradiated to the image sensor assembly 10 through the mounting opening 3011.

The image sensor assembly 10 includes an image sensor 11 and a Circuit Board 12, the Circuit Board 12 is, for example, a Printed Circuit Board (PCB) 12, the image sensor 11 is packaged on the PCB, and the PCB is used for fixing the image sensor 11 and enabling signal transmission with the image sensor 11. The light emitted from the filter assembly 30 is irradiated to the image sensor 11, and the optical signal is converted into an electrical signal by the photoelectric conversion of the image sensor 11, and the electrical signal is transmitted to an external circuit through the circuit board 12, for example, the circuit board 12 is electrically connected to the main board 4 in the electronic device 100, so as to transmit the electrical signal converted by the image sensor 11 to the main board 4.

With continued reference to fig. 4, a Flexible electrical connector, such as a Flexible Printed Circuit (FPC) for example, is typically connected to the Circuit board 12, and the Circuit board 12 is electrically connected to an external Circuit (e.g., the motherboard 4) through the FPC 16. Illustratively, one end of the FPC16 is connected to the circuit board 12, the other end of the FPC16 is provided with, for example, a female socket of the electrical connector 161, a male socket of the electrical connector 161 is provided on the motherboard 4, and the female socket on the FPC16 is inserted into the male socket on the motherboard 4, so as to electrically connect the image sensor assembly 10 and the motherboard 4.

Referring to fig. 3, when the camera module 1 is assembled, the bracket 301 of the filter assembly 30 may be connected to the light-emitting end of the lens barrel 201, for example, the bracket 301 and the lens barrel 201 are connected by an encapsulating adhesive layer. The circuit board 12 of the image sensor assembly 10 is attached to the support 301, for example, by an encapsulating adhesive layer between the circuit board 12 and the support 301. The lens assembly 20, the filter assembly 30 and the image sensor assembly 10 are connected in a sealing manner, so that the sealing performance of the camera module 1 can be ensured, and the performance of the camera module 1 can be improved.

Fig. 5 is a schematic structural diagram of another camera module provided in the embodiment of the present application; fig. 6 is an exploded view of fig. 5. The camera module 1 shown in fig. 5 is an AF module, and as shown in fig. 5, unlike the lens assembly 20 of the FF module shown in fig. 3, the lens assembly 20 of the AF module includes a driving device 202 and a lens 203, the driving device 202 includes a housing 2021, a mounting hole is provided on one side surface of the housing 2021, a portion of the lens 203 may be located in an accommodating space inside the housing 2021, and another portion of the lens 203 may protrude out of the housing 2021 through the mounting hole.

Generally, a portion of the lens 203 near the light input end thereof passes through the mounting hole and extends out of the housing 2021, the light input surface of the lens 203 is exposed outside the housing 2021, a portion of the lens 203 near the light output end thereof is located in the housing 2021, and the other side surface of the housing 2021 opposite to the surface where the mounting hole is located is the light output side of the lens assembly 20.

Similar to the FF module, a plurality of lenses 2031 are encapsulated in the lens 203 of the AF module, the plurality of lenses 2031 are stacked along the optical axis direction of the lens 203, external ambient light enters the lens 203 from the light-in surface of the lens 203, each lens 2031 converges the incident light, and the converged light exits from the light-out end of the lens 203. Unlike the FF module, the lens 203 is movable in the housing 2021 of the driving device 202, for example, in the axial direction of the mounting hole, the lens 203 extends out of the housing 2021 or retracts into the housing 2021.

Referring to fig. 6, a driving assembly 2022 is generally disposed in the housing 2021 of the driving device 202, and the driving assembly 2022 is used for driving the lens 203 to move. Illustratively, the driving component 2022 may drive the lens 203 to move along its own optical axis direction, so as to implement the auto-focusing function of the lens 203. Alternatively, the driving component 2022 may further drive the lens 203 to move in a plane (a plane perpendicular to the optical axis) where the lens 203 is located, or drive the lens 203 to deflect around the optical axis, so as to compensate the shake amount of the electronic device 100 through the translation or angular deflection of the lens 203, thereby implementing the anti-shake function of the lens 203.

Similar to the FF module, the light filtering component 30 and the image sensor component 10 of the AF module are sequentially stacked on the light emergent side of the lens component 20, light emitted from the light emergent side of the lens component 20 is filtered by the light filtering component 30 to remove stray light, and then the stray light is irradiated to the image sensor component 10, and the image sensor component 10 converts the light signal into an electrical signal, so as to realize the imaging function of the camera module 1, which is not described herein again.

For example, the bracket 301 of the filter assembly 30 may be connected to the other side surface of the housing 2021 of the driving device 202 opposite to the surface where the mounting hole is located, for example, the bracket 301 and the outer surface of the housing 2021 are connected by an encapsulating adhesive layer.

As for the connection and fixation of the image sensor 11 on the circuit board 12, the image sensor 11 is usually adhered to the circuit board 12 to fix the image sensor 11, and by connecting gold wires between the image sensor 11 and the circuit board 12, signal transmission between the image sensor 11 and the circuit board 12 is realized by the gold wires, so that the circuit board 12 controls the operation of the image sensor 11 and transmits the electrical signal converted by the image sensor 11 to an external circuit.

However, in the related art, the wire loop height of the gold wire connected between the image sensor 11 and the circuit board 12 is small, and the wire loop height is generally between 90 to 130 μm, and there is not enough deformability to restrict the movement of the image sensor 11, and the relative movement between the image sensor 11 and the circuit board 12 cannot be realized. In addition, even if the image sensor 11 can be moved with a small amplitude, when the image sensor 11 causes the gold wires to deform and move, the adjacent gold wires are easily in contact with each other, and there is a risk of short-circuiting each other.

It should be noted that, since one end of the gold wire is connected to the image sensor 11 and the other end is connected to the circuit board 12, and the surface of the image sensor 11 and the surface of the circuit board 12 are generally not in the same plane, the gold wire has a curvature in a direction substantially away from the surface of the circuit board 12, and thus, the loop height of the gold wire generally refers to the distance between the curved top 1441 of the gold wire away from the surface of the circuit board 12 and the surface of the circuit board 12.

In contrast, in the present embodiment, the line arc height of the conductive line 14 connected between the image sensor 11 and the circuit board 12 is increased, a large deformation moving space is reserved for the conductive line 14, so that the restriction of the conductive line 14 on the movement of the image sensor 11 is weakened, the image sensor 11 can move relative to the circuit board 12, and the anti-shake function of the camera module 1 is realized through the movement of the image sensor 11.

The image sensor module 10 in the camera module 1 according to the embodiment of the present application will be described in detail below.

Fig. 7 is a schematic structural diagram of an image sensor assembly according to an embodiment of the present disclosure; FIG. 8 is an exploded view of FIG. 7;

fig. 9 is a side view of fig. 7. Referring to fig. 7, the image sensor assembly 10 includes an image sensor 11 and a circuit board 12, wherein the image sensor 11 is disposed on a side surface of the circuit board 12, and the image sensor 11 is disposed on a side surface of the circuit board 12 facing the filter assembly 30 and the lens assembly 20, for example, so as to irradiate the image sensor 11 with light emitted from the filter assembly 30. Taking the front surface of the image sensor 11 as its photosensitive surface and the other surface of the image sensor 11 opposite to the photosensitive surface as its back surface, the front surface of the image sensor 11 faces upward to receive incident light, and the back surface of the image sensor 11 faces the circuit board 12.

Referring to fig. 8, in order to realize the movement of the image sensor 11 relative to the circuit board 12, the image sensor assembly 10 further includes a driver 13, the driver 13 is disposed between the back surface of the image sensor 11 and the circuit board 12, and the driver 13 drives the image sensor 11 to move relative to the circuit board 12. Taking the circuit board 12 fixed in the camera module 1 as an example, the driver 13 drives the image sensor 11 to move in the plane where the image sensor 11 is located, so as to compensate the shake amount of the electronic device 100, and realize the anti-shake function of the camera module 1.

Wherein the driver 13 may comprise a fixed part, for example connected to the circuit board 12, and a movable part, for example connected to the image sensor 11, which by means of the movable part of the driver 13 drives the image sensor 11 in motion, for example the movable part of the driver 13 drives the image sensor 11 in motion in the plane of the image sensor 11 itself. Illustratively, the driver 13 may be a Micro-Electro-Mechanical System (MEMS) driver 13.

In some embodiments, the driver 13 can drive the image sensor 11 to move in its own plane, and can also drive the image sensor 11 to move in its axial direction, for example, the image sensor 11 can move in the optical axis direction of the lens assembly 20 to change the distance between the image sensor 11 and the lens assembly 20, and the auto-focusing function of the camera module 1 is realized by moving the image sensor 11 in the optical axis direction.

It should be noted that the image sensor assembly 10 of the present embodiment can be applied to an FF module, and the driver 13 drives the image sensor 11 to move, for example, the driver 13 drives the image sensor 11 to move along its own plane, so as to implement the anti-shake function of the FF module, or the driver 13 drives the image sensor 11 to move along the optical axis direction, so as to enable the FF module to implement the auto-focus function.

Alternatively, the image sensor assembly 10 of the present embodiment may be applied to an AF module, and the driver 13 drives the image sensor 11 to move, for example, the driver 13 drives the image sensor 11 to move along its own plane, so as to implement the anti-shake function of the AF module, or the driver 13 drives the image sensor 11 to move along the optical axis direction, and the stroke amount of the image sensor 11 in the optical axis direction is overlapped with the stroke amount of the lens 203 in the optical axis direction, so as to increase the stroke amount of the image pickup module 1 in the optical axis direction, and increase the autofocus stroke of the image pickup module 1.

Referring to fig. 7, the image sensor 11 and the circuit board 12 are electrically connected through the conductive line 14, the first end 141 of the conductive line 14 is connected to the image sensor 11, the second end 142 of the conductive line 14 is connected to the circuit board 12, and signal conduction between the image sensor 11 and the circuit board 12 is realized through the conductive line 14. An interface is generally disposed at a portion (a peripheral area of the photosensitive area) of the image sensor 11 near the edge, an interface is also disposed at an area of the circuit board 12 near the edge of the image sensor 11, the interface on the circuit board 12 is disposed adjacent to the interface at the edge of the image sensor 11, and two ends of the conductive wire 14 are respectively connected to the interface at the edge of the image sensor 11 and the interface at the adjacent portion on the circuit board 12.

Referring to fig. 8, in practical applications, a plurality of first interfaces 111 are generally disposed in an edge region of the image sensor 11, the plurality of first interfaces 111 are spaced apart along a circumferential direction of the image sensor 11, and correspondingly, a region of the circuit board 12 located at the periphery of the image sensor 11 is generally a connection region 122, and a plurality of second interfaces 1221 are disposed at intervals along the circumferential direction in the connection region 122, so that the image sensor 11 and the circuit board 12 are generally electrically connected by a plurality of conductive lines 14, the plurality of conductive lines 14 are spaced apart along the circumferential direction of the image sensor 11, a first end 141 of each conductive line 14 is connected to each first interface 111 on the image sensor 11, and a second end 142 of each conductive line 14 is connected to each corresponding second interface 1221 on the circuit board 12.

Taking the outline of the image sensor 11 as a rectangle as an example, at least one of the four sides of the image sensor 11 has a conductive wire 14, for example, the conductive wire 14 is disposed on one, two opposite sides, two adjacent sides, three sides or four sides of the image sensor 11.

It should be noted that the conductive lines 14 usually adopt the principle of proximity connection, taking one of the conductive lines 14 as an example, the first end 141 of the conductive line 14 is connected to a first interface 111 in one side edge of the image sensor 11, the second end 142 of the conductive line 14 is connected to a second interface 1221 on the corresponding side of the connection region 122 on the circuit board 12, and the second interface 1221 is the second interface 1221 corresponding to the first interface 111 in close proximity. In this way, the conductive lines 14 are sequentially arranged along the circumferential direction of the image sensor 11, and the conductive lines 14 are spaced from each other, so as to prevent adjacent conductive lines 14 from being interlaced with each other, thereby preventing signal short circuit caused by mutual contact between the conductive lines 14.

In addition, the conductive lines 14 are typically connected between the image sensor 11 and the circuit board 12 by a Wire Bond (WB) process. The WB process is a process in which the back surface of the image sensor 11 is bonded to the circuit board 12 with an adhesive, the image sensor 11 is fixed to the circuit board 12, and then the interface of the image sensor 11 and the interface of the circuit board 12 are bonded with the conductive line 14.

For example, both ends of the conductive line 14 may be soldered to the image sensor 11 and the circuit board 12, respectively, by a bonding process. In addition, the conductive wires 14 may be made of high-purity gold wires, which have high conductivity and can ensure the signal transmission rate between the image sensor 11 and the circuit board 12. For example, the conductive line 14 may be a gold line having a purity of 99.9% or more, and may be doped with an element such as silver, palladium, magnesium, iron, copper, or silicon.

When the two ends of the conductive line 14 are respectively soldered to the image sensor 11 and the circuit board 12 by using the WB process, according to the characteristics of the WB process, the first soldered end of the conductive line 14 is usually formed as a "gold ball region" shaped like a sphere, and the second soldered end can be formed as a "gold ball region" or a "fish tail region" shaped like a fish tail.

Taking as an example that the first end 141 of the conductive wire 14 is first soldered on the image sensor 11, and then the second end 142 of the conductive wire 14 is soldered on the circuit board 12, the first end 141 of the conductive wire 14 may form a "gold ball region", and the second end 142 of the conductive wire 14 may form a "gold ball region" or a "fish tail region"; on the contrary, if the second end 142 of the conductive line 14 is soldered on the circuit board 12 and then the first end 141 of the conductive line 14 is soldered on the image sensor 11, the second end 142 of the conductive line 14 may form a "gold ball region" and the first end 141 of the conductive line 14 may form a "gold ball region" or a "fish tail region".

With continued reference to fig. 7, in order to realize the movement of the image sensor 11 relative to the circuit board 12, the conductive line 14 is designed to be vertically disposed on the board surface of the circuit board 12, that is, the conductive line 14 forms an angle with the board surface of the circuit board 12, and correspondingly, the conductive line 14 forms an angle with the surface of the image sensor 11. When the image sensor 11 is at the set initial position and the conductive wire 14 is in a plane without moving and deforming, an included angle is formed between the plane of the conductive wire 14 and the board surface of the circuit board 12.

Thus, when the image sensor 11 moves, the conductive line 14 erected on the circuit board 12 has a large deformation space, and the movement of the image sensor 11 is less restricted, thereby facilitating the movement of the image sensor 11. For example, when the image sensor 11 moves, the portion between the two ends of the conductive line 14 may be in a deformed state of twisting, expanding, or contracting, and the distance between the two ends of the conductive line 14 increases or decreases with the movement of the image sensor 11.

Illustratively, the conductive traces 14 may be angled between 30 and 90 degrees relative to the plane of the circuit board 12. In the moving process of the image sensor 11, when the conductive line 14 deforms and moves along with the image sensor, in order to prevent the conductive line 14 from collapsing obliquely, an included angle between the conductive line 14 and the board surface of the circuit board 12 may be selected within a wide angle range.

Referring to fig. 9, as a specific embodiment, when the conductive lines 14 are laid by using a WB process, an included angle between the conductive lines 14 and a board surface of the circuit board 12 may be 90 °, that is, the conductive lines 14 are vertically erected on the board surface of the circuit board 12, so, taking the conductive line 14 disposed on a side edge of one side of the image sensor 11 as an example, in an extension direction of the side edge, the included angle between the conductive line 14 and the board surface on two sides of the side edge is equal, and a center of gravity of the conductive line 14 is located in a plane where the conductive line 14 is located, so that a tendency that the conductive line 14 is easily inclined to one side is reduced, and a signal short circuit caused by mutual contact between the conductive lines 14 is avoided. When the conductive line 14 moves with the image sensor 11, for example, when the conductive line 14 is twisted, the conductive line 14 is prevented from being inclined in a direction approaching the board surface of the circuit board 12, which helps to maintain the erected state of the conductive line 14.

In addition, as shown in fig. 7, the conductive wires 14 are vertically erected on the board surface of the circuit board 12, the moving space formed between the adjacent conductive wires 14 is a vertical space which is vertical to the board surface of the circuit board 12, and the vertical space enables both sides of the conductive wires 14 to have a large moving space, so that when the conductive wires 14 are twisted or inclined, the conductive wires 14 are not easily contacted with the adjacent conductive wires 14, and the short circuit between the conductive wires 14 can be prevented.

Fig. 7 shows a case where the driver 13 is connected to the board surface of the circuit board 12, and the image sensor 11 is stacked on the driver 13, so that the overall thickness of the image sensor assembly 10 is a thickness obtained by stacking the thicknesses of the image sensor 11, the driver 13, and the circuit board 12, and the overall thickness of the image sensor assembly 10 is large, and the occupied thickness space of the camera module 1 is large, which is not favorable for the miniaturization design of the camera module 1.

FIG. 10 is a cross-sectional view of another image sensor assembly provided in an embodiment of the present application; fig. 11 is a cross-sectional view of a third image sensor assembly provided in an embodiment of the present application. Referring to fig. 10 and 11, in order to reduce the overall thickness of the image sensor assembly 10, a mounting groove 121 may be formed in the circuit board 12, a notch of the mounting groove 121 may be located on a side surface of the circuit board 12 where the image sensor 11 is located, and the driver 13 may be mounted in the mounting groove 121. Like this, the holistic at least partial thickness of image sensor 11 and driver 13 is located the thickness range of circuit board 12, has reduced the thickness space that image sensor 11 and driver 13 occupy, can reduce the thickness of image sensor subassembly 10, and then, reduces the whole thickness of camera module 1, reduces the thickness space of electronic equipment 100 that camera module 1 occupied, is favorable to electronic equipment 100's frivolousization.

As shown in fig. 10, in one embodiment, the mounting groove 121 formed on the circuit board 12 may only occupy a partial thickness space of the circuit board 12, and the groove bottom of the mounting groove 121 is located at a middle portion in the thickness direction of the circuit board 12. As shown in fig. 11, in another embodiment, the circuit board 12 may be provided with a mounting opening penetrating through both sides of the circuit board in the thickness direction, and the metal sheet 17 covers the mounting opening by attaching the metal sheet 17 to the back surface (the surface of the side facing away from the lens assembly 20) of the circuit board 12, and the mounting opening and the metal sheet 17 together form a mounting groove 121.

According to the depth of the mounting groove 121 formed in the circuit board 12 and the overall thickness of the image sensor 11 and the driver 13, the driver 13 with a partial thickness may be located in the accommodating space of the mounting groove 121, or the driver 13 and the image sensor 11 may be located in the accommodating space of the mounting groove 121.

Referring to fig. 8, in the conductive line 14, which is connected to the image sensor 11 and the circuit board 12 at both ends thereof, and is erected on the board surface of the circuit board 12, a curved top 1441 is provided between both ends of the conductive line 14, and the curved top 1441 is a portion of the conductive line 14 away from the board surface of the circuit board 12. In order to make the conductive line 14 have enough space for deformation to meet the requirement of moving the image sensor 11, in the embodiment, by providing the conductive line 14 with a longer length, for example, the length of the conductive line 14 may be greater than 500 μm, after the conductive line 14 is soldered on the circuit board 12, because the distance between the first end 141 and the second end 142 of the conductive line 14 is small, the distance between the curved top 1441 of the conductive line 14 and the first end 141 thereof may be greater than or equal to 250 μm, so that the conductive line 14 has enough deformability to meet the requirement of moving the image sensor 11.

Taking the example of the conductive line 14 vertically standing on the circuit board 12, the distance between the curved top 1441 of the conductive line 14 and the first end 141 thereof is greater than or equal to 250 μm, and the height of the arc of the conductive line 14 is approximately greater than or equal to 250 μm. Therefore, a sufficient deformation space is provided between the first end 141 and the second end 142 of the conductive line 14, which can meet the requirements of stretching, shrinking and twisting of the portion between the first end 141 and the second end 142 of the conductive line 14, and the conductive line 14 can deform along with the movement of the image sensor 11 without limiting the movement of the image sensor 11.

Illustratively, the distance between the curved top 1441 of the conductive line 14 and the first end 141 thereof may be greater than or equal to 300 μm, and taking the conductive line 14 standing vertically on the circuit board 12 as an example, by making the line arc height of the conductive line 14 greater than or equal to 300 μm, increasing the height of the conductive line 14, there is enough space between the curved top 1441 of the conductive line 14 and the surface of the image sensor 11, so that the conductive line 14 has enough deformability, and the conductive line 14 can generate corresponding elastic deformation along with the movement of the image sensor 11.

Referring to fig. 8, the image sensor 11 is generally parallel to the board surface of the circuit board 12, and the distances between the respective portions of the image sensor 11 and the board surface of the circuit board 12 are constant, so that the shapes and sizes of the respective conductive lines 14 connected between the image sensor 11 and the circuit board 12 can be substantially uniform. Fig. 12 is a schematic structural diagram of a conductive line according to an embodiment of the present application. Referring to fig. 12, for example, one of the conductive lines 14 is taken as an example, and the conductive line 14 is vertically erected on the board surface of the circuit board 12, a rising section 143, a bent back section 144, and a falling section 145 may be sequentially included between the first end 141 and the second end 142 of the conductive line 14.

The distance between the first end 141 and the second end 142 of the conductive line 14 is small, the height of the arc of the conductive line 14 is greater than or equal to 250 μm, and the bending degree between the two ends of the conductive line 14 is large, so, as shown in fig. 7 and 12, in the extending direction from the first end 141 to the second end 142 of the conductive line 14, the conductive line 14 extends from the end connected with the image sensor 11 to the direction obviously departing from the board surface of the circuit board 12, after reaching the bent top 1441 of the terminal of the conductive line 14, the conductive line 14 bends in the opposite direction to form a bent back section 144, and after passing through the bent back section 144, the conductive line 14 extends to the end connected with the board surface of the circuit board 12 in the direction obviously facing the board surface of the circuit board 12.

That is to say, the conductive line 14 extends from the first end 141 to the second end 142 thereof, the rising section 143 near the first end 141 extends in a direction obviously away from the board surface of the circuit board 12, the bent section 144 is connected behind the rising section 143, the extending direction of the conductive line 14 is covered by the bent section 144, wherein the top of the bent section 144 is the bent top 1441 of the conductive line 14, the conductive line 14 extends reversely after passing through the bent section 144, the falling section 145 connected behind the bent section 144 extends in a direction obviously towards the board surface of the circuit board 12, and the second end 142 of the conductive line 14 is connected to the board surface of the circuit board 12.

Referring to fig. 7, it should be noted that the ascending portion 143, the return-bent portion 144, and the descending portion 145 of the conductive line 14 defined in this embodiment are sequentially connected between the first end 141 and the second end 142 thereof, and are illustrated in the extending direction from the first end 141 to the second end 142 of the conductive line 14. Conversely, when the conductive line 14 is viewed as extending from the second end 142 to the first end 141, the rising portion 143 extending in a direction away from the board surface of the circuit board 12 is located between the second end 142 and the bent back portion 144, and the falling portion 145 extending in a direction toward the board surface of the circuit board 12 is located between the bent back portion 144 and the first end 141.

In the following description, only the rising section 143 defines a line segment of the conductive line 14 that obviously extends in a direction away from the board surface of the circuit board 12, and the falling section 145 defines a line segment of the conductive line 14 that obviously extends in a direction toward the board surface of the circuit board 12, which is not limited by the extending direction from the first end 141 to the second end 142 of the conductive line 14, and is not described again.

Referring to fig. 12, for the line segments on both sides of the return-bent segment 144 on the top of the conductive line 14, which are the rising segment 143 and the falling segment 145, respectively, in order to make the rising segment 143 and the falling segment 145 form line segments that are obviously deviated from and extend toward the board surface of the circuit board 12, respectively, the bending radian of the return-bent segment 144 may be greater than or equal to 120 °, and the line segments on both sides of the return-bent segment 144 with a large return-bent angle tend to extend in opposite directions, so that the obvious rising segment 143 and the falling segment 145 can be formed.

Illustratively, the bending arc of the bent back section 144 may be greater than or equal to 150 ° so that both ends of the bent back section 144 approach to the same direction, and the rising section 143 and the falling section 145 connected to both sides of the bent back section 144 approach to extend in opposite directions. Taking the example that the conductive line 14 is vertically erected on the board surface of the circuit board 12, on the basis that the extension length of the conductive line 14 is fixed, the larger the bending radian of the bent back section 144 of the conductive line 14 is, the higher the line arc height of the conductive line 14 is, and the smaller the limitation of the conductive line 14 on the moving range of the image sensor 11 is.

In addition, as shown in fig. 9, an angle of an included angle between the rising section 143 of the conductive line 14 and a plane where the image sensor 11 is located, and an angle of an included angle between the falling section 145 and a plane where the image sensor 11 is located, may both be smaller than 90 °, so that a projection of the bent-back section 144 on the board surface of the circuit board 12 is located in an area between the first end 141 and the second end 142 of the conductive line 14, and in a height direction of the conductive line 14, the conductive line 14 is prevented from being inclined toward an outer side of the image sensor 11 or inclined toward a center of the image sensor 11. Thus, the image sensor 11 moves to deform the conductive wires 14, and taking the movement of the image sensor 11 in the plane where the image sensor 11 is located as an example, for the movement of the image sensor 11 to each direction in the plane, the conductive wires 14 located at different directions around the image sensor 11 can be prevented from being seriously inclined, the conductive wires 14 can be ensured to be restored to the shape when not deformed, and the risk of short circuit of the conductive wires 14 with each other is reduced.

In practical applications, there may be internal structures around the image sensor 11, and referring to fig. 4 and 6, for example, the structure around the mounting opening 3011 of the bracket 301 of the optical filter assembly 30 is slightly spaced from the surface of the image sensor 11, and the conductive wires 14 need to avoid the internal structures and be connected to the edge of the image sensor 11. In contrast, fig. 13 is a schematic structural diagram of another conductive line provided in this embodiment of the present application, and referring to fig. 13, a transverse section 146 may be further disposed between the first end 141 of the conductive line 14 connected to the image sensor 11 and the rising section 143, and an angle between the transverse section 146 and a plane where the image sensor 11 is located is smaller than an angle between the rising section 143 and the plane where the image sensor 11 is located.

In this way, the conducting line 14 is extended to the outside of the edge of the image sensor 11 by the transverse section 146 having a smaller angle with the plane of the image sensor 11, so as to leave a space between the transverse section 146 and the curved top 1441 in the height direction of the conducting line 14, to avoid an internal structural member on the light incident side of the image sensor 11, for example, a structure or a component in the space enclosed between the bracket 301 of the filter assembly 30 and the circuit board 12.

With continued reference to fig. 13, in order to reserve more space above the lateral segment 146 of the conductive line 14 (the side of the lateral segment 146 facing away from the image sensor 11), the included angle between the lateral segment 146 and the rising segment 143 may be set to be between 90 ° and 120 °, so that the lateral segment 146 may extend approximately along the surface of the image sensor 11, and the conductive line 14 is prevented from occupying too much space above the edge region of the image sensor 11.

Moreover, since the transverse section 146 extends to the side edge or even the outer side of the image sensor 11, the rising section 143 deviates to the outer side of the image sensor 11, the distance between the rising section 143 and the falling section 145 is shortened, the bending radian of the bent back section 144 is increased, the erecting degree (the perpendicularity relative to the board surface of the circuit board 12) of the rising section 143 and the falling section 145 is increased, and further, the height of the arc of the conductive wire 14 is increased, which is beneficial to deformation and movement of the conductive wire 14 and is beneficial to expansion of the movement range of the image sensor 11.

Referring to fig. 7, in the present embodiment, in order to reduce the restriction of the conductive line 14 on the movement of the image sensor 11, the height of the arc of the conductive line 14 is increased, and since the conductive line 14 is erected on the board surface of the circuit board 12 and the height of the arc of the conductive line 14 is high, the risk of the conductive line 14 tilting and collapsing increases, whereas in the present embodiment, the conductive line 14 is additionally provided with the connecting body 15, and the strength of the conductive line 14 is increased by the connecting body 15, so as to prevent the conductive line 14 from tilting or collapsing.

The connecting body 15 wraps the conductive wires 14 on the same side of the image sensor 11, and taking a row of conductive wires 14 on the left side of the image sensor 11 shown in fig. 7 as an example, the connecting body 15 wraps the outside of the row of conductive wires 14, so that the connecting body can play a role in reinforcing and fixing the conductive wires 14, the strength of the conductive wires 14 is improved, the conductive wires 14 are prevented from being inclined or collapsed in the process of repeatedly moving along with the image sensor 11 for a long time, and the upright state of the conductive wires 14 is maintained.

In addition, the connecting body 15 is simultaneously contacted with the conductive wires 14 positioned on the same side of the image sensor 11, the connecting body 15 wraps each conductive wire 14 on the side, and meanwhile, the fixing effect is achieved on each conductive wire 14, the integrity of the conductive wires 14 on the same side is improved, when the conductive wires 14 move, the moving trends of the conductive wires 14 on the same side are consistent, the conductive wires 14 can be prevented from being contacted with each other, and the risk that the conductive wires 14 are mutually short-circuited is reduced.

The connector 15 is wrapped on a local area of the conductive wire 14, and when the connector 15 enhances the strength of the conductive wire 14 and improves the integrity of the conductive wires 14 arranged on the same side, most areas of the conductive wires 14 are exposed outside the connector 15, so that the connector 15 is prevented from limiting the deformation and movement of the conductive wires 14.

With continued reference to fig. 7, as an embodiment, connector 15 may be wrapped around a curved top 1441 of each conductive wire 14 disposed on the same side. On one hand, the bent top 1441 of the conductive line 14 is located at the top of the conductive line 14 far away from the circuit board 12, so as to facilitate the connection fixation between the connecting body 15 and the conductive line 14; on the other hand, when the conductive line 14 deforms as the image sensor 11 moves, the deformation region of the conductive line 14 is mainly concentrated on the rising portion 143 and the falling portion 145, the degree of deformation of the top region in the height direction of the conductive line 14 is small, and the influence on the deformability of the conductive line 14 is small because the deformation of the top region of the conductive line 14 is limited by the connection body 15.

In a specific application, the connecting body 15 wrapped outside the conductive wire 14 disposed on the same side may be a gel. The colloid is made of a flexible material and has good deformability, the conductive wire 14 is fixed, the deformation and movement limitations on the conductive wire 14 are small, the conductive wire 14 is located in a line segment in the colloid wrapping area and still has deformability to a certain degree, the deformation performance of the conductive wire 14 can be improved, the limitation of the conductive wire 14 on the movement of the image sensor 11 is reduced, and the movable range of the image sensor 11 is expanded to a certain degree.

For example, the gel may be a gel material, which is formed by applying a glue on the outer portion of the conductive wires 14 and then curing the glue. The conductive wire 14 is coated with a glue, and then the glue is irradiated by UV to cure the outer surface of the glue to form a gel, so that the glue can be prevented from overflowing, meanwhile, the inside of the gel is still in a liquid state, and the conductive wire 14 has a certain deformation moving space inside the gel.

Illustratively, in the height direction of the line arc of the conductive line 14, the conductive line 14 is vertically erected on the board surface of the circuit board 12, that is, in the height direction of the conductive line 14, the connector 15 may cover a line segment of the conductive line 14 with a distance from the bent top 1441 in a range of 30-150 μm, that is, a height range of a top area of the conductive line 14 within a coverage range of the connector 15 is 30-150 μm. In this way, the connecting body 15 has a sufficient coverage to enhance the strength of the conductive wire 14, the integrity of the conductive wire 14 disposed on the same side, and the influence of the connecting body 15 on the movable range of the conductive wire 14 is small, so that the conductive wire 14 can generate corresponding elastic deformation along with the movement of the image sensor 11.

Wherein, if the connector 15 is a gel in a liquid state inside, the gel covers more areas of the top of the conductive wire 14 because the gel has less restriction on the deformation movement of the conductive wire 14, and the height of the gel covering the top area of the conductive wire 14 may range from 60 μm to 150 μm, and exemplarily, the height of the gel covering the top area of the conductive wire 14 ranges from 90 μm to 150 μm. If the connector 15 is a colloid with poor fluidity, the colloid covers a smaller area of the top of the conductive line, and the height of the colloid covering the top area of the conductive line 14 may be in the range of 30-90 μm, and for example, the height of the colloid covering the top area of the conductive line 14 is in the range of 30-90 μm. This embodiment does not specifically limit this.

Illustratively, the height at which the connectors 15 cover the top region of the conductive lines 14 is 35 μm, 40 μm, 45 μm, 50 μm, 55 μm, 65 μm, 70 μm, 75 μm, 80 μm, 85 μm, 95 μm, 100 μm, 110 μm, 120 μm, and the like.

For the conductive line 14 disposed on the same side, the glue is applied to the outside and cured to form a gel as the connecting body 15, and the limitation of the process of applying the glue is small, so the glue can be applied to the line segment region where the ascending section 143 or the descending section 145 of the conductive line 14 is located, that is, the connecting body 15 wraps the ascending section 143 or the descending section 145 of the conductive line 14, and the movement of the conductive line 14 is limited to a small extent because the inside of the gel is liquid, and the connecting body 15 can also wrap the ascending section 143 and the descending section 145 at the same time.

In the description of the embodiments of the present application, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, a fixed connection, an indirect connection via an intermediary, a connection between two elements, or an interaction between two elements. The specific meanings of the above terms in the embodiments of the present application can be understood by those of ordinary skill in the art according to specific situations.

The terms "first," "second," "third," "fourth," and the like in the description and in the claims of the embodiments of the application and in the drawings described above, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.

Claims (19)

1. An image sensor assembly is characterized by comprising an image sensor, a circuit board, a driver, a plurality of conducting wires and at least one connecting body, wherein the image sensor is positioned on one side of the circuit board, the driver is connected between the image sensor and the circuit board, and the driver drives the image sensor to move;

the conductive wires are distributed at intervals along the circumferential direction of the image sensor, a first end of each conductive wire is connected with the image sensor, and a second end of each conductive wire is connected with the circuit board;

the image sensor comprises a circuit board, a conductive wire, a connector and a circuit board, wherein an included angle is formed between the conductive wire and the board surface of the circuit board, a bent top part far away from the board surface of the circuit board is arranged between two ends of the conductive wire, the connector wraps the conductive wires which are positioned on the same side of the image sensor, and the connector wraps the bent top part.

2. The image sensor assembly of claim 1, wherein a spacing between the curved top and the first end is greater than or equal to 250 μ ι η.

3. The image sensor assembly of claim 2, wherein a spacing between the curved top and the first end is greater than or equal to 300 μ ι η.

4. The image sensor assembly of any of claims 1-3, wherein the conductive line comprises, in order in a direction from the first end to the second end, an ascending segment, a return segment, and a descending segment, a top of the return segment forming the curved top;

wherein the bending radian of the bending section is larger than or equal to 120 degrees.

5. The image sensor assembly of claim 4, wherein an angle between the rising section and a plane of the image sensor and an angle between the falling section and the plane of the image sensor are both less than 90 °, and a projection of the return section on the board surface of the circuit board is located between the first end and the second end.

6. The image sensor assembly of claim 4, wherein a transverse segment is further disposed between the first end and the rising segment, and an included angle between the transverse segment and a plane of the image sensor is smaller than an included angle between the rising segment and the plane of the image sensor.

7. The image sensor assembly of claim 6, wherein an angle between the rising segment and the transverse segment is greater than or equal to 90 ° and less than or equal to 120 °.

8. The image sensor assembly of any of claims 1-3, wherein the connectors cover line segments of the conductive lines within 30-150 μm from the curved top in a direction of a line arc height of the conductive lines.

9. The image sensor assembly of any of claims 1-3, wherein the connector is a gel.

10. The image sensor assembly of claim 9, wherein the gel is a gel formed by curing the glue.

11. The image sensor assembly of any of claims 1-3, wherein the conductive line is vertically erected on a board surface of the circuit board.

12. The image sensor assembly of any of claims 1-3, wherein the driver is attached to a board surface of the circuit board.

13. The image sensor assembly of any one of claims 1-3, wherein the circuit board is provided with a mounting slot, a notch of the mounting slot is located on a side of the circuit board where the image sensor is located, and the driver is mounted in the mounting slot.

14. The image sensor assembly according to any one of claims 1 to 3, wherein a plurality of first interfaces are circumferentially spaced in an edge region of the image sensor, a region of the circuit board located at the periphery of the image sensor is a connection region, and a plurality of second interfaces are circumferentially spaced in the connection region;

the first end of each conducting wire is connected with each first interface respectively, and the second end of each conducting wire is connected with each second interface nearby.

15. The image sensor assembly of any of claims 1-3, wherein the actuator is a MEMS actuator.

16. A camera module comprising a lens assembly, a filter assembly and the image sensor assembly of any one of claims 1-15, wherein the filter assembly and the image sensor assembly are sequentially stacked on a light-emitting side of the lens assembly.

17. The camera module of claim 16, wherein the lens assembly includes a barrel and a plurality of lenses, the lenses are enclosed in the barrel, and the plurality of lenses are stacked in an axial direction of the barrel.

18. The camera module of claim 16, wherein the lens assembly comprises a drive device and a lens, the drive device comprising a housing, the lens being movably disposed within the housing.

19. An electronic device comprising at least one camera module according to any one of claims 16-18.

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