CN205647690U - Imaging module and electron device - Google Patents
Imaging module and electron device Download PDFInfo
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- CN205647690U CN205647690U CN201620163163.6U CN201620163163U CN205647690U CN 205647690 U CN205647690 U CN 205647690U CN 201620163163 U CN201620163163 U CN 201620163163U CN 205647690 U CN205647690 U CN 205647690U
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- 238000009434 installation Methods 0.000 claims abstract description 68
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- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
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- 229910044991 metal oxide Inorganic materials 0.000 description 2
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/45—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/90—Arrangement of cameras or camera modules, e.g. multiple cameras in TV studios or sports stadiums
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Human Computer Interaction (AREA)
- Studio Devices (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
Abstract
The utility model discloses an imaging module and electron device. Imaging module includes flexible circuit board, at least two the make a video recording module and the cover bodies. The flexible circuit board includes two at least module installation departments and connects the connector installation department of two at least module installation departments. At least two mould splitss of making a video recording do not set up on at least two module installation departments, and at least two the module intervals of making a video recording set up. Cover body cover establish at least two make a video recording the module and with at least two the module fixed connection that make a video recording, the cover body includes that framework and the distance range of making a video recording between the module are 0.1 around the framework of two at least modules of making a video recording 0.5 the millimeter. The utility model discloses are be embodiment's the imaging module accessible colloid bonding framework and the module of making a video recording because the framework and the distance range of making a video recording between the module 0.1 0.5 the millimeter, the framework not only can firm in connection with the module of making a video recording, can also reduce imaging module's volume, is favorable to imaging module miniaturized.
Description
Priority information
The priority of patent application and the rights and interests that the application request is that submit to China national Department of Intellectual Property December in 2015 30 days, number of patent application is 201511025532.1,201521132821.7,201511024922.7 and 201521131513.2, and by referring to being incorporated by herein.
Technical field
This utility model relates to technical field of imaging, particularly relates to a kind of imaging modules and a kind of electronic installation.
Background technology
Along with the prescription of shooting image is improved by people, dual camera shooting technology arises at the historic moment.Usually, dual camera module includes two optical axis photographic head modules that are parallel and that shoot towards same side, and the volume how reducing dual camera module while fixing two photographic head modules becomes problem demanding prompt solution.
Utility model content
This utility model is intended at least to solve one of technical problem present in prior art.To this end, this utility model provides a kind of imaging modules and a kind of electronic installation.
The imaging modules of this utility model embodiment includes flexible PCB, at least two camera module and cover body.Flexible PCB includes at least two module installation portion and connects the adapter installation portion of at least two module installation portion.At least two camera module is separately positioned at least two module installation portion, and at least two camera module interval is arranged.Cover body cover sets at least two camera module and fixing with at least two camera module is connected.Cover body includes the framework around at least two camera module, and the distance range between framework and camera module is 0.1-0.5 millimeter.
The imaging modules of this utility model embodiment can be by colloid bonding framework and camera module, owing to the distance range between framework and camera module is 0.1-0.5 millimeter, framework and camera module are possible not only to be connected firmly, it is also possible to reduce the volume of imaging modules, beneficially imaging modules miniaturization.
In some is implemented, the quantity of described module installation portion and the quantity of described camera module are two.
In some embodiments, the distance range between described framework and described camera module is 0.15-0.3 millimeter.
In some embodiments, described framework is connected by colloid and described camera module are fixing.
In some embodiments, described cover body includes the top cover being connected with the top of described framework, and described top cover is by colloid and two fixing connections of described camera module.
In some embodiments, two described module installation portion intervals are arranged, and described flexible PCB includes spaced two connecting portions, and said two connecting portion connects two described module installation portions and described adapter installation portion respectively.
In some embodiments, each described camera module includes printed circuit board (PCB) and arranges the imageing sensor on the printed circuit board and being electrically connected with described printed circuit board (PCB), and described printed circuit board (PCB) is arranged on described module installation portion and is electrically connected with described module installation portion.
In some embodiments, described module installation portion includes the first electric connection pad, described printed circuit board (PCB) includes the second electric connection pad of connection corresponding with described first electric connection pad, and described printed circuit board (PCB) is electrically connected with described module installation portion by described second electric connection pad with described first electric connection pad.
In some embodiments, described camera module includes the camera lens module arranging on the printed circuit board and being positioned at above described imageing sensor.
In some embodiments, each described camera lens module includes that camera lens and voice coil motor, described camera lens are arranged in described voice coil motor, and each described voice coil motor includes housing, and two described housing intervals are arranged.
In some embodiments, described imaging modules includes that connector assembly, described connector assembly include substrate and arrange adapter on the substrate, and described substrate is arranged on described adapter installation portion and is electrically connected with described adapter installation portion.
In some embodiments, described imaging modules includes that colloid, described colloid are arranged between two described camera modules and bonding two described camera modules.
In some embodiments, described camera module includes the connection side relative with camera module another described, and by welding, described connection side is fixing to be connected two described camera modules.
The electronic installation of this utility model embodiment includes above-mentioned imaging modules.
In the electronic installation of this enforcement embodiment, imaging modules can be by colloid bonding top cover and camera module, owing to the distance range between top cover and camera module is 0-0.1 millimeter, top cover and camera module are possible not only to be connected firmly, the thickness of imaging modules, beneficially group of electronic devices miniaturization can also be reduced.Additional aspect of the present utility model and advantage will part be given in the following description, and part will become apparent from the description below, or is recognized by practice of the present utility model.
Accompanying drawing explanation
Above-mentioned and/or additional aspect of the present utility model and advantage will be apparent from easy to understand, wherein from combining the accompanying drawings below description to embodiment:
Fig. 1 is the structural representation of the imaging modules of this utility model embodiment.
Fig. 2 is the schematic perspective view of the imaging modules of this utility model embodiment.
Fig. 3 be imaging modules in Fig. 2 along III-III to generalized section.
Fig. 4 is the enlarged diagram of the IV part of the imaging modules in Fig. 3.
Fig. 5 is the decomposing schematic representation of the imaging modules of this utility model embodiment.
Fig. 6 is another decomposing schematic representation of the imaging modules of this utility model embodiment.
Fig. 7 is the schematic perspective view of the cover body of the imaging modules of this utility model embodiment.
Fig. 8 is the structural representation of the flexible PCB of the imaging modules of this utility model embodiment.
Fig. 9 is the enlarged diagram of the IX part of the imaging modules in Fig. 3.
Detailed description of the invention
Of the present utility model embodiment is described below in detail, and the example of described embodiment is shown in the drawings, and the most same or similar label represents same or similar element or has the element of same or like function.The embodiment described below with reference to accompanying drawing is exemplary, is only used for explaining this utility model, and it is not intended that to restriction of the present utility model.
In description of the present utility model, it will be appreciated that, term " " center ", " longitudinally ", " laterally ", " length ", " width ", " thickness ", on " ", D score, " front ", " afterwards ", " left ", " right ", " vertically ", " level ", " push up ", " end ", " interior ", " outward ", " clockwise ", orientation or the position relationship of the instruction such as " counterclockwise " are based on orientation shown in the drawings or position relationship, it is for only for ease of description this utility model and simplifies description, rather than indicate or imply that the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that to restriction of the present utility model.Additionally, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint relative importance or the implicit quantity indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can express or implicitly include one or more described features.In description of the present utility model, " multiple " are meant that two or more, unless otherwise expressly limited specifically.
In description of the present utility model, it should be noted that unless otherwise clearly defined and limited, term " is installed ", " being connected ", " connection " should be interpreted broadly, and connects for example, it may be fixing, it is also possible to be to removably connect, or be integrally connected；Can be mechanically connected, it is also possible to be electrical connection or can mutually communication；Can be to be joined directly together, it is also possible to be indirectly connected to by intermediary, can be connection or the interaction relationship of two elements of two element internals.For the ordinary skill in the art, above-mentioned term concrete meaning in this utility model can be understood as the case may be.
In this utility model, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or D score can include that the first and second features directly contact, it is also possible to include that the first and second features are not directly contact but by the other characterisation contact between them.And, fisrt feature second feature " on ", " top " and " above " include that fisrt feature directly over second feature and oblique upper, or is merely representative of fisrt feature level height higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " include that fisrt feature directly over second feature and oblique upper, or is merely representative of fisrt feature level height less than second feature.
Following disclosure provides many different embodiments or example for realizing different structure of the present utility model.In order to simplify disclosure of the present utility model, hereinafter parts and setting to specific examples are described.Certainly, they are the most merely illustrative, and are not intended to limit this utility model.Additionally, this utility model can in different examples repeat reference numerals and/or reference letter, this repetition is for purposes of simplicity and clarity, itself does not indicate the relation between discussed various embodiment and/or setting.Additionally, the various specific technique that provides of this utility model and the example of material, but those of ordinary skill in the art are it can be appreciated that the application of other techniques and/or the use of other materials.
Fig. 1 is the structural representation of the imaging modules of this utility model embodiment.The cover body of imaging modules not shown in Fig. 1.
Joining Fig. 1-Fig. 3 and Fig. 7 the most in the lump, the imaging modules 100 of this utility model embodiment includes 10, two camera modules 20 of flexible PCB and cover body 50.
Flexible PCB 10 includes two module installation portions 11 and adapter installation portion 12.Adapter installation portion 12 connects two module installation portions 11.
Two camera modules 20 are separately positioned on module installation portion 11, and two camera module 20 intervals are arranged.
Cover body 50 cover sets two camera modules 20 and fixing with two camera modules 20 is connected.Cover body 50 includes framework 51, and framework 51 is around two camera modules 50.Distance D scope between framework 51 and camera module 20 is 0.1-0.5 millimeter.
The imaging modules 100 of this utility model embodiment can be by colloid bonding framework 51 and camera module 20, owing to the distance D scope between framework 51 and camera module 20 is 0.1-0.5 millimeter.Framework 51 is possible not only to be connected firmly with camera module 20, it is also possible to reduce the volume of imaging modules 100, beneficially imaging modules 100 miniaturization.
Specifically, in one example, assembling imaging modules 100 when, first two camera modules 20 are individually secured to module installation portion 11, then robotic arm grips one of them camera module 20, and adjust the position of another camera module 20 by mechanical hand so that the optical axis of two camera modules 20 is parallel, then by bonding by colloid for two camera modules 20 or be welded and fixed.Afterwards, colloid can be coated in framework 51, can be connected fixing with camera module 20 for framework 51 by colloid.
It should be noted that framework 51 includes that first surface 51a, camera module 20 include and first surface 51a opposite second surface 20a.Distance D between framework 51 and camera module 20 is the minimum range between first surface 51a and second surface 20a.
Being appreciated that in other embodiments, the quantity of module installation portion and camera module all can be more than three, and the camera module interval of more than three is arranged.The module installation portion interval of more than three is arranged.The camera module of more than three is separately positioned on the module installation portion of more than three.
For convenience of explanation, hereafter it is the embodiment of two with the quantity of module installation portion and the quantity of camera module and is described further, but it is not intended that to restriction of the present utility model.
In present embodiment, it is preferred that the distance D scope between framework 51 and camera module 20 is 0.15-0.3 millimeter.
In present embodiment, framework 51 is connected by colloid is fixing with camera module 20.So, the framework of cover body 50 51 is connected by colloid and two camera modules 20, easily realizes cover body 50 and fixes with two camera modules 20 and be connected, it is possible to decrease the cost of imaging modules 100.
In present embodiment, cover body 50 includes the top cover 52 being connected with framework 51 top, and top cover 52 is by colloid and two fixing connections of camera module 20.
So, top cover 52 can increase cover body 50 and the connection area of two camera modules 20, is conducive to cover body 50 to be connected firmly with two camera modules 20 further.
Specifically, top cover 52 offers two light holes 251, and two camera modules 20 are exposed, so that two camera modules 20 can gather external image by two light holes 251 respectively.
It should be noted that in present embodiment, two equal cylindrical form of light hole 251.In other embodiments, depending on the shape of two light holes can be distinguished specifically.Therefore, the shape of the light hole 251 of present embodiment is it is not intended that to restriction of the present utility model.
In present embodiment, it is preferred that the light shaft coaxle of light hole 251 and camera module 20 is arranged.
Incorporated by reference to Fig. 8, in present embodiment, two module installation portion 11 intervals are arranged.Flexible PCB 10 includes that spaced two connecting portions 13, two connecting portions 13 connect two module installation portions 11 and adapter installation portion 12 respectively.
Two connecting portions 13 are spaced setting and flexible PCB 10 can be conducive to further to deform, thus are conducive to the position adjusting two camera modules 20 so that the optical axis of two camera modules 20 is parallel.
Incorporated by reference to Fig. 4, in present embodiment, each camera module 20 includes printed circuit board (PCB) 21 (Printed Circuit Board, PCB) and imageing sensor 22.The sensing face of two imageing sensors 22 is parallel or coplanar and towards the same side.Printed circuit board (PCB) 21 is arranged on module installation portion 11 and is electrically connected with module installation portion 11.Imageing sensor 22 is arranged on printed circuit board (PCB) 21 and is electrically connected with printed circuit board (PCB) 21.
So, imageing sensor 22 can obtain the image of object, and by printed circuit board (PCB) 21 and flexible PCB 10, image is reached external device (ED).
Specifically, imageing sensor 22 can use complementary metal oxide semiconductors (CMOS) (Complementary Metal Oxide Semiconductor, CMOS) CIS or charge coupled cell (Charge-coupled Device, CCD) CIS.
In present embodiment, module installation portion 11 includes the first electric connection pad 111, printed circuit board (PCB) 21 includes that the second electric connection pad 211 of connection corresponding with the first electric connection pad 111, printed circuit board (PCB) 21 are electrically connected with module installation portion 11 by the second electric connection pad 211 and the first electric connection pad 111.
So, the first electric connection pad 111 and the second electric connection pad 211 realize being electrically connected with between flexible PCB 10 with camera module 20 and communicating.Such as, the first electric connection pad 111 and the second electric connection pad 211 all use conducting resinl.
In present embodiment, each printed circuit board (PCB) 21 is corresponding with the shape of corresponding module installation portion 11 and size.
The structure that so can make imaging modules 100 is compacter, is conducive to reducing the volume of imaging modules 100.When imaging modules 100 is applied to electronic installation, the volume of electronic installation can be reduced further.
In present embodiment, as an example, each printed circuit board (PCB) 21 and with the shape of corresponding module installation portion 11 be tabular and size identical.And in other embodiments, each printed circuit board (PCB) and the shape with corresponding module installation portion can be arranged according to the actual requirements and specifically.Size between printed circuit board (PCB) and corresponding module installation portion can be adjusted as required.
Incorporated by reference to Fig. 5 and Fig. 6, in present embodiment, camera module 20 includes the camera lens module 23 being arranged on printed circuit board (PCB) 21 and be positioned at above imageing sensor 22.
So, camera lens module 23 can make imageing sensor 22 obtain quality preferably image, thus can improve the shooting quality of imaging modules 100.
In present embodiment, each camera lens module 23 includes camera lens 231 and voice coil motor 232, and camera lens 231 is arranged in voice coil motor 232, and each voice coil motor 232 includes that housing 2321, two housing 2321 intervals are arranged.
Voice coil motor 232 can drive camera lens 231 to move to adjust the distance between camera lens 231 and imageing sensor 22 along the optical axis direction of camera lens 231, and then realizes the auto-focusing of imaging modules 100, makes imaging modules 100 obtain quality preferably image.
Further, optical filter 24 it is provided with between camera lens 231 and imageing sensor 22.Optical filter 24 can filter the light of predeterminated frequency so that imageing sensor 22 forms preferably image according to the light after filtering.
It is preferred that optical filter 24 is cutoff filter.So, cutoff filter can filter infrared ray, it is to avoid the image fault of imageing sensor 22.
Specifically, camera lens module 23 also includes that pedestal 233, pedestal 233 offer groove 2331, and the bottom surface of groove 2331 offers through hole 2332.In optical filter 24 is arranged on groove 2331 and be supported on the bottom surface of groove 2331, the light filtered through optical filter 24 can arrive imageing sensor 22 by through hole 2332.
Take for convenience optical filter 24, pedestal 233 offers link slot 2333, link slot 2333 communication groove 2331.
In present embodiment, imaging modules 100 includes that connector assembly 30, connector assembly 30 include substrate 31 and arrange adapter 32 on the substrate 31.Substrate 31 is arranged on adapter installation portion 12 and is electrically connected with adapter installation portion 12.
So, imaging modules 100 can be quickly installed on electronic equipment by adapter 32.
It is preferred that the shape of substrate 31 and adapter installation portion 12 and consistent size.Adapter 32 so can be made compacter with the structure of flexible PCB 10.
In present embodiment, imaging modules 100 includes that colloid 40, colloid 40 are arranged between two camera modules 20 and bonding two camera modules 20.
After being adjusted to be parallel to each other by the optical axis of two camera modules 20, between two camera modules 20, click and enter colloid 40.Colloid 40 can ensure that two camera modules 20 are relatively fixed, colloid and can increase the bonding strength of two camera modules 20, it is possible to decrease the probability of the light shaft offset of two camera modules 20.
It should be noted that in present embodiment, as shown in the orientation in Fig. 3, the bottom in the colloid 40 gap between two camera modules 20.And in other embodiments, colloid can fill up the gap between two camera modules.
Colloid 40 can be such as the colloid that UV glue (Ultraviolet Glue) etc. has stickiness.
In some embodiments, camera module includes the connection side relative with another camera module, and by being welded to connect, side is fixing to be connected two camera modules.
So, two camera modules can will be rigidly secured together by welding.Such as, the connection side of each camera module can be welded by laser spot welding or tin cream or solder and be fixed with another camera module and be connected.
Further, imaging modules 100 also includes that reinforcing plate 60, two module installation portions 11 are fixed in reinforcing plate 60.
So, reinforcing plate 60 can fix the position of two camera modules 20 further, improves the ability of the anti-collision of imaging modules 100, and then improves shooting quality.
In present embodiment, imaging modules 100 also includes anti-electromagnetic interference part 70, and reinforcing plate 60 is arranged on anti-electromagnetic interference part 70.
Anti-electromagnetic interference part 70 can prevent imaging modules 100 from being disturbed by electromagnetic wave, it is ensured that imaging modules 100 obtains quality preferably image.Anti electromagnetic wave disruption member 70 such as can use metal material to make.
The electronic installation of this utility model embodiment includes above-mentioned imaging modules 100.Electronic installation can be mobile phone or panel computer etc..
In the electronic installation of this enforcement embodiment, imaging modules 100 can be by colloid bonding top cover 52 and camera module 20, owing to the distance range between top cover 52 and camera module 20 is 0-0.1 millimeter, top cover 52 is possible not only to be connected firmly with camera module 20, the thickness of imaging modules 100, beneficially electronic device miniaturization can also be reduced.
In the description of this specification, the description of reference term " embodiment ", " some embodiments ", " exemplary embodiment ", " example ", " concrete example " or " some examples " etc. means that the specific features, structure, material or the feature that combine described embodiment or example description are contained at least one embodiment of the present utility model or example.In this manual, the schematic representation to above-mentioned term is not necessarily referring to identical embodiment or example.And, the specific features of description, structure, material or feature can combine in any one or more embodiments or example in an appropriate manner.
Embodiment the most of the present utility model, it will be understood by those skilled in the art that: these embodiments can carry out in the case of without departing from principle of the present utility model and objective multiple change, revise, replace and modification, scope of the present utility model is limited by claim and equivalent thereof.
Claims (14)
1. an imaging modules, it is characterised in that including:
Flexible PCB, described flexible PCB includes at least two module installation portion and connects the adapter installation portion of described at least two module installation portion；
At least two camera module, described at least two camera module is separately positioned on described at least two module installation portion, and described at least two camera module interval is arranged；And
Cover body, described cover body cover sets described at least two camera module and fixing with described at least two camera module is connected, described cover body includes the framework around described at least two camera module, and the distance range between described framework and described camera module is 0.1-0.5 millimeter.
2. imaging modules as claimed in claim 1, it is characterised in that the quantity of described module installation portion and the quantity of described camera module are two.
3. imaging modules as claimed in claim 2, it is characterised in that the distance range between described framework and described camera module is 0.15-0.3 millimeter.
4. imaging modules as claimed in claim 2, it is characterised in that described framework is connected by colloid and described camera module are fixing.
5. imaging modules as claimed in claim 2, it is characterised in that described cover body includes the top cover being connected with the top of described framework, described top cover is by colloid and two fixing connections of described camera module.
6. imaging modules as claimed in claim 2, it is characterized in that, two described module installation portion intervals are arranged, and described flexible PCB includes spaced two connecting portions, and said two connecting portion connects two described module installation portions and described adapter installation portion respectively.
7. imaging modules as claimed in claim 2, it is characterized in that, each described camera module includes printed circuit board (PCB) and arranges the imageing sensor on the printed circuit board and being electrically connected with described printed circuit board (PCB), and described printed circuit board (PCB) is arranged on described module installation portion and is electrically connected with described module installation portion.
8. imaging modules as claimed in claim 7, it is characterized in that, described module installation portion includes the first electric connection pad, described printed circuit board (PCB) includes the second electric connection pad of connection corresponding with described first electric connection pad, and described printed circuit board (PCB) is electrically connected with described module installation portion by described second electric connection pad with described first electric connection pad.
9. imaging modules as claimed in claim 7, it is characterised in that described camera module includes the camera lens module arranging on the printed circuit board and being positioned at above described imageing sensor.
10. imaging modules as claimed in claim 9, it is characterised in that each described camera lens module includes that camera lens and voice coil motor, described camera lens are arranged in described voice coil motor, and each described voice coil motor includes housing, two described housing intervals are arranged.
11. imaging modules as claimed in claim 2, it is characterized in that, described imaging modules includes that connector assembly, described connector assembly include substrate and arrange adapter on the substrate, and described substrate is arranged on described adapter installation portion and is electrically connected with described adapter installation portion.
12. imaging modules as claimed in claim 2, it is characterised in that described imaging modules includes that colloid, described colloid are arranged between two described camera modules and bonding two described camera modules.
13. imaging modules as claimed in claim 2, it is characterised in that described camera module includes the connection side relative with camera module another described, and described connection side is fixing to be connected two described camera modules by welding.
14. 1 kinds of electronic installations, it is characterised in that include the imaging modules as described in any one of claim 1-13.
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2016/090056 WO2017113746A1 (en) | 2015-12-30 | 2016-07-14 | Imaging module and electronic device |
| PCT/CN2016/090060 WO2017113749A1 (en) | 2015-12-30 | 2016-07-14 | Imaging module and electronic device |
| PCT/CN2016/090059 WO2017113748A1 (en) | 2015-12-30 | 2016-07-14 | Imaging module and electronic device |
| PCT/CN2016/090061 WO2017113750A1 (en) | 2015-12-30 | 2016-07-14 | Imaging module and electronic device |
| PCT/CN2016/090062 WO2017113751A1 (en) | 2015-12-30 | 2016-07-14 | Imaging module and electronic apparatus |
| PCT/CN2016/090064 WO2017113752A1 (en) | 2015-12-30 | 2016-07-14 | Imaging module and electronic device |
| PCT/CN2016/090057 WO2017113747A1 (en) | 2015-12-30 | 2016-07-14 | Imaging module and electronic apparatus |
Applications Claiming Priority (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2015110249227 | 2015-12-30 | ||
| CN201521132821 | 2015-12-30 | ||
| CN2015110255321 | 2015-12-30 | ||
| CN201521131513 | 2015-12-30 | ||
| CN201511025532 | 2015-12-30 | ||
| CN2015211328217 | 2015-12-30 | ||
| CN2015211315132 | 2015-12-30 | ||
| CN201511024922 | 2015-12-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205647690U true CN205647690U (en) | 2016-10-12 |
Family
ID=56779601
Family Applications (14)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620163035.1U Expired - Fee Related CN205545565U (en) | 2015-12-30 | 2016-03-03 | Imaging module and electron device |
| CN201610120778.5A Pending CN106937034A (en) | 2015-12-30 | 2016-03-03 | Imaging modules and electronic installation |
| CN201610120781.7A Pending CN106937035A (en) | 2015-12-30 | 2016-03-03 | Imaging modules and electronic installation |
| CN201610120780.2A Pending CN106937058A (en) | 2015-12-30 | 2016-03-03 | Imaging modules and electronic installation |
| CN201610120714.5A Pending CN106937031A (en) | 2015-12-30 | 2016-03-03 | Imaging modules and electronic installation |
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| CN201620163152.8U Expired - Fee Related CN205545574U (en) | 2015-12-30 | 2016-03-03 | Imaging module and electron device |
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| CN201620163163.6U Expired - Fee Related CN205647690U (en) | 2015-12-30 | 2016-03-03 | Imaging module and electron device |
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| CN201610120781.7A Pending CN106937035A (en) | 2015-12-30 | 2016-03-03 | Imaging modules and electronic installation |
| CN201610120780.2A Pending CN106937058A (en) | 2015-12-30 | 2016-03-03 | Imaging modules and electronic installation |
| CN201610120714.5A Pending CN106937031A (en) | 2015-12-30 | 2016-03-03 | Imaging modules and electronic installation |
| CN201620162943.9U Expired - Fee Related CN205545559U (en) | 2015-12-30 | 2016-03-03 | Imaging module and electron device |
| CN201610120713.0A Pending CN106937030A (en) | 2015-12-30 | 2016-03-03 | Imaging modules and electronic installation |
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2016
- 2016-03-03 CN CN201620163035.1U patent/CN205545565U/en not_active Expired - Fee Related
- 2016-03-03 CN CN201610120778.5A patent/CN106937034A/en active Pending
- 2016-03-03 CN CN201610120781.7A patent/CN106937035A/en active Pending
- 2016-03-03 CN CN201610120780.2A patent/CN106937058A/en active Pending
- 2016-03-03 CN CN201610120714.5A patent/CN106937031A/en active Pending
- 2016-03-03 CN CN201620162943.9U patent/CN205545559U/en not_active Expired - Fee Related
- 2016-03-03 CN CN201610120713.0A patent/CN106937030A/en active Pending
- 2016-03-03 CN CN201620162941.XU patent/CN205545558U/en active Active
- 2016-03-03 CN CN201620163152.8U patent/CN205545574U/en not_active Expired - Fee Related
- 2016-03-03 CN CN201610120772.8A patent/CN106937032A/en active Pending
- 2016-03-03 CN CN201610120775.1A patent/CN106937033A/en active Pending
- 2016-03-03 CN CN201620163180.XU patent/CN205545576U/en not_active Ceased
- 2016-03-03 CN CN201620163154.7U patent/CN205545575U/en not_active Ceased
- 2016-03-03 CN CN201620163163.6U patent/CN205647690U/en not_active Expired - Fee Related
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108462816A (en) * | 2017-02-20 | 2018-08-28 | 北京小米移动软件有限公司 | Camera module and electronic equipment |
| CN108462816B (en) * | 2017-02-20 | 2021-01-01 | 北京小米移动软件有限公司 | Camera module and electronic equipment |
| CN106851066A (en) * | 2017-03-10 | 2017-06-13 | 信利光电股份有限公司 | A kind of many camera modules and its engine mounting support |
| CN107181900A (en) * | 2017-06-05 | 2017-09-19 | 信利光电股份有限公司 | It is a kind of double to take the photograph module bracket, double take the photograph module and mobile terminal |
Also Published As
| Publication number | Publication date |
|---|---|
| CN205545576U (en) | 2016-08-31 |
| CN106937033A (en) | 2017-07-07 |
| CN106937035A (en) | 2017-07-07 |
| CN106937058A (en) | 2017-07-07 |
| CN205545565U (en) | 2016-08-31 |
| CN205545558U (en) | 2016-08-31 |
| CN205545559U (en) | 2016-08-31 |
| CN106937030A (en) | 2017-07-07 |
| CN106937031A (en) | 2017-07-07 |
| CN106937032A (en) | 2017-07-07 |
| CN205545574U (en) | 2016-08-31 |
| CN205545575U (en) | 2016-08-31 |
| CN106937034A (en) | 2017-07-07 |
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