CN107241539B

CN107241539B - Imaging device assembly and electronic device

Info

Publication number: CN107241539B
Application number: CN201710520453.0A
Authority: CN
Inventors: 吕向楠
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2017-06-30
Filing date: 2017-06-30
Publication date: 2021-02-02
Anticipated expiration: 2037-06-30
Also published as: CN107241539A

Abstract

The invention discloses an imaging device assembly and an electronic device. The imaging device assembly comprises a mounting shell, an imaging device and heat conducting glue. The imaging device is disposed on the mounting case. The imaging device includes a housing. The thermally conductive glue surrounds the housing. The heat-conducting glue is adhered to the shell and the mounting shell. In the imaging device assembly and the electronic device, the heat conducting glue can increase the heat dissipation area of the imaging device so as to dissipate the heat of the imaging device to the periphery, thereby reducing the heat transferred from the imaging device to the outer surface of the electronic device through the mounting shell, avoiding the concentration of the heat on the outer surface of the electronic device corresponding to the imaging device, causing excessive temperature rise and improving the user experience.

Description

Imaging device assembly and electronic device

Technical Field

The present invention relates to the field of terminals, and in particular, to an imaging device assembly and an electronic device.

Background

In an electronic device with a shooting function such as a mobile phone, heat generated by a camera is concentrated, so that the temperature of the outer surface of the electronic device corresponding to the camera is high, and user experience is influenced.

Disclosure of Invention

The invention provides an imaging device assembly and an electronic device.

The imaging device assembly comprises a mounting shell, an imaging device and heat conducting glue. The imaging device is disposed on the mounting case. The imaging device includes a housing. A thermally conductive glue surrounds the housing. The heat-conducting glue is adhered to the shell and the mounting shell.

In some embodiments, the thermally conductive glue is a thermally conductive gel.

In some embodiments, the mounting case includes a substrate on which the imaging device is disposed and a sidewall extending from an edge of the substrate.

In some embodiments, the imaging device includes a camera module housed in the housing, and the housing includes a bottom plate and a side plate extending from an edge of the bottom plate, and the side plate is fixedly connected to the camera module.

In some embodiments, the imaging device includes a circuit board disposed on the base plate and located within the housing, the camera module includes: an image sensor disposed on the circuit board; a lens disposed over the image sensor; and a voice coil motor in which the lens is disposed.

In some embodiments, the imaging device includes a flexible circuit board connected to the circuit board and extending outside the housing.

In some embodiments, the flexible circuit board is a unitary structure with the circuit.

In some embodiments, the imaging device includes a connector disposed on the flexible circuit board at an end of the flexible circuit board remote from the housing.

In some embodiments, the number of the camera modules is two, and the two camera modules are arranged in the shell at intervals.

An electronic device of an embodiment of the invention includes the imaging device assembly of any of the above embodiments and a display screen. The display screen sets up on the installation shell, the display screen with image device is located respectively the both sides that the installation shell was carried on the back mutually.

In the imaging device assembly and the electronic device, the heat conducting glue can increase the heat dissipation area of the imaging device so as to dissipate the heat of the imaging device to the periphery, thereby reducing the heat transferred from the imaging device to the outer surface of the electronic device through the mounting shell, avoiding the concentration of the heat on the outer surface of the electronic device corresponding to the imaging device, causing excessive temperature rise and improving the user experience.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a schematic plan view of an imaging device assembly according to an embodiment of the invention;

FIG. 2 is a schematic cross-sectional view of an electronic device according to an embodiment of the invention;

FIG. 3 is a schematic front view of an electronic device according to an embodiment of the invention;

fig. 4 is a schematic side view of an electronic device according to an embodiment of the invention.

Description of the main element symbols:

imaging device 100, bottom surface 102, gap 104;

the camera module comprises a shell 10, a bottom plate 11, a side plate 12, a camera module 20, an image sensor 21, a lens 22, a voice coil motor 23, a circuit board 30, a flexible circuit board 40 and a connector 50;

an imaging device assembly 200, a mounting case 210, a substrate 211, a groove 2111, a side wall 212, a support 220, and a heat conductive paste 230;

electronic device 300, display screen 310, receiver 320.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The following disclosure provides many different embodiments or examples for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or uses of other materials.

Referring to fig. 1 and 2, an image forming apparatus assembly 200 according to an embodiment of the present invention includes a mounting case 210, a supporting body 220, and an image forming apparatus 100. The support 220 is disposed on the mounting case 210. The bottom surface 102 of the image forming apparatus 100 is supported on the support 220 such that a gap 104 is formed between the bottom surface 102 and the mounting case 210.

In the above-mentioned imaging device assembly 200, the supporting body 220 can prevent the imaging device 100 from contacting the mounting case 210, so that the heat transferred from the imaging device 100 to the outer surface of the electronic device 300 through the mounting case 210 can be reduced, the temperature of the outer surface of the electronic device 300 corresponding to the imaging device 100 is prevented from being too high, and the user experience is improved.

Specifically, the gap 104 is filled with air, and since the thermal conductivity of the air is 0.01-0.04W/mK, the thermal conductivity of the air is low, and the heat generated by the image forming apparatus 100 is difficult to be transferred to the mounting case 210.

Referring to fig. 3 and 4, the imaging device assembly 200 may be applied to an electronic device 300, where the electronic device 300 is a terminal with a shooting function, such as a mobile phone and a tablet computer. In this embodiment, the electronic device 300 includes an imaging device assembly 200 and a display screen 310. The display screen 310 is disposed on the mounting case 210, and the display screen 310 and the imaging device 100 are respectively located on two opposite sides of the mounting case 210. Therefore, in the present embodiment, the imaging apparatus 100 is a rear imaging apparatus 100.

Since the heat generated by the image forming apparatus 100 is difficult to be transferred to the mounting case 210, the temperature of the outer surface of the electronic apparatus 300 is low, which is advantageous to the user experience. For example, the electronic device 300 includes a receiver 320, and the receiver 320 is disposed near the imaging device 100. When the user immediately carries out voice call after the imaging device 100 finishes shooting, the display screen 310 faces the user, the ear of the user can be attached to the receiver 320, and the user can carry out long-time call due to the fact that the temperature of the outer surface of the electronic device 300 is low, and the call quality is guaranteed.

In the present embodiment, the mounting case 210 is a middle frame of the electronic device 300. Therefore, it can be understood that the battery, the main circuit board, and the like of the electronic device 300 are mounted on the mounting case 210.

In this embodiment, the image forming apparatus 100 includes a housing 10, the image forming apparatus assembly 200 includes a thermal conductive paste 230, the thermal conductive paste 230 surrounds the housing 10, and the thermal conductive paste 230 bonds the housing 10 and the mounting case 210.

Thus, the heat dissipation area of the imaging device 100 can be increased by the heat conductive adhesive 230, so that the heat of the imaging device 100 is dissipated to the periphery, thereby reducing the heat transferred to the outer surface of the electronic device 300 by the imaging device 100 through the mounting shell 210, avoiding the concentration of the heat on the outer surface of the electronic device 300 corresponding to the imaging device 100, resulting in excessive temperature rise and improving the user experience.

Specifically, when assembling the image forming apparatus assembly 200, the image forming apparatus 100 is mounted on the mounting case 210, and then the heat conductive paste 230 is injected around the housing 10, and the heat conductive paste 230 is bonded to the housing 10 and the mounting case 210.

It should be noted that the thermal conductive paste 230 has an insulating property, and the thermal conductive paste 230 does not affect the normal operation of the electronic components around the imaging device 100.

In one example, the thermally conductive gel 230 is a thermally conductive gel. Thus, the thermal conductive adhesive 230 has a good thermal conductive effect, and can quickly transfer heat of the image forming apparatus 100 to the surroundings of the image forming apparatus 100. Specifically, the heat-conducting gel is a jelly prepared by taking silicone resin as a base material, adding a heat-conducting filler and a bonding material according to a certain proportion and processing the base material by a special process. The heat conductive gel has an adhesive property, does not require an adhesive layer, and can cover the uneven surface of the case 10 to sufficiently contact the case 10 to improve heat conduction efficiency.

Referring to fig. 1 and 2 again, in some embodiments, the mounting case 210 includes a substrate 211 and a sidewall 212 extending from an edge of the substrate 211, and the supporting member 220 is fixed on the substrate 211.

As such, the substrate 211 may provide a larger space to mount the image forming apparatus 100. The substrate 211 may be made of plastic, or may be made of plastic and metal sheet by insert injection molding.

In the present embodiment, the imaging device 100 is provided on the substrate 211. Further, the image forming device 211 is disposed on the substrate 211 through a support 220.

In some embodiments, the support 220 is a unitary structure with the substrate 211. For example, the material of the support 220 is plastic, and the support 220 and the substrate 211 form an integral structure through an injection molding process. Thus, the connection structure of the supporting body 220 and the substrate 211 is simple, and the number of parts of the imaging device assembly 200 can be reduced, which is beneficial to the assembly of the imaging device assembly 200.

In some embodiments, the substrate 211 is formed with a groove 2111, and one end of the support 220 is inserted into the groove 2111. As such, the notch 2111 facilitates positioning of the support body 220 such that the support body 220 is quickly installed in place. In this case, the support 220 and the substrate 211 are separate bodies, and the support 220 may be fixed to the substrate 211 by welding, bonding, or the like.

The support 220 may have a rectangular parallelepiped shape, a cylindrical shape, or a truncated cone shape. Preferably, the shape of the groove 2111 matches the shape of the supporting body 220, so that the supporting body 220 and the groove 2111 are more compactly connected.

In some embodiments, the bottom surface 102 is square, the number of the supporting members 220 is plural, and the plurality of supporting members 220 are respectively connected to the corner positions of the bottom surface 102. Preferably, the number of the supporting bodies 220 is four, and four supporting bodies 220 are respectively connected to four corner positions of the bottom surface 102.

Thus, the supporting body 220 can stably support the image forming apparatus 100, and prevent the image forming apparatus 100 from being tilted or the like.

In some embodiments, the imaging device 100 includes a camera module 20, the camera module 20 is housed in a housing 10, the housing 10 includes a bottom plate 11 and a side plate 12 extending from an edge of the bottom plate 11, and the side plate 12 is fixedly connected to the camera module 20.

The camera module 20 and the housing 10 can be fixed together by gluing or welding, so that when the imaging device 100 falls, the housing 10 can reduce the impact on the camera module 20 to ensure that the camera module 20 can work normally.

In the present embodiment, the bottom plate 11 includes a bottom surface 102. It will be appreciated that the bottom surface 102 is an outer surface of the base plate 11 so that the image forming apparatus 100 can be supported on the support 220.

In some embodiments, the number of the camera modules 20 is two, and the two camera modules 20 are spaced apart from each other in the housing 10. Thus, the two camera modules 20 are beneficial to improving the imaging quality of the imaging device 100. For example, one of the camera modules 20 is a telephoto camera module, and the other camera module 20 is a wide-angle camera module. The two camera modules 20 work together to make the imaging device 100 obtain images with better quality.

In some embodiments, the housing 10 is a unitary structure with the support body 220. Thus, the connection structure of the housing 10 and the support 220 is simple.

In some embodiments, the imaging device 100 includes a Circuit Board 30 (PCB) disposed on the bottom plate 11 and located in the housing 10, and the camera module 20 includes an image sensor 21, a lens 22, and a voice coil motor 23. The image sensor 21 is disposed on the circuit board 30. The lens 22 is disposed above the image sensor 21 and in the voice coil motor 23.

In this way, the image sensor 21 can sense light outside the camera module 20 to obtain an external image. The lens 22 may allow an external object to be imaged on the image sensor 21 so that the image sensor 21 acquires a better image. The voice coil motor 23 can drive the lens 22 to move along the optical axis direction of the lens 22 to adjust the distance between the lens 22 and the image sensor 21, so as to realize the auto-focusing of the camera module 20, and thus the camera module 20 can obtain an image with better quality.

Specifically, the image sensor 21 is, for example, a Complementary Metal Oxide Semiconductor (CMOS) image sensor or a Charge-coupled Device (CCD) image sensor. The image sensor 21 generates a large amount of heat during operation, which is transferred to the circuit board 30 and then to the housing 10 through the circuit board 30. Since the outer case 10 is spaced apart from the mounting case 210, it is difficult for heat to be transferred to the mounting case 210.

In some embodiments, the imaging device 100 includes a flexible circuit board 40, the flexible circuit board 40 being connected to the circuit board 30 and protruding out of the housing 10.

In this manner, the flexible circuit board 40 may enable the image forming apparatus 100 to realize data transmission with external elements. For example, the image sensor 21 may transmit the acquired image signal to an external component through the flexible circuit board 40, and the external component may process the image signal to obtain an external image. As another example, the external element may control the image sensor 21 to be photosensitive through the flexible circuit board 40 to acquire an external image.

The housing 10 may be formed with an opening through which the flexible circuit board 40 passes such that the flexible circuit board 40 protrudes out of the housing 10.

A connector 50 may be disposed on the flexible circuit board 40, the connector 50 being located at an end of the flexible circuit board 40 remote from the housing 10.

In this manner, the connector 50 can be connected to the main circuit board of the electronic device 300, so that the imaging device 100 can realize data transmission with external elements. For example, a connector interface corresponding to the connector 50 is disposed on the main circuit board of the electronic device 300, and the connector 50 is inserted into the connector interface to complete the connection between the connector 50 and the main circuit board.

In some embodiments, the circuit board 30 is a unitary structure with the flexible circuit board 40. For example, the circuit board 30 and the flexible circuit board 40 are respectively a part of a rigid-flex board. The circuit board 30 is a hard board portion of the rigid-flex board, and the flexible circuit board 40 is a flexible board portion of the rigid-flex board.

In this way, the structure between the circuit board 30 and the flexible circuit board 40 is simple, and the number of parts of the imaging device 100 can be reduced, so that the assembly process of the imaging device 100 can be reduced to reduce the assembly cost of the imaging device 100.

In summary, the image forming apparatus assembly 200 according to the embodiment of the invention includes a mounting case 210, an image forming apparatus 100, and a thermal conductive paste 230, wherein the image forming apparatus 100 is disposed on the mounting case 210, the thermal conductive paste 230 surrounds the housing 10, and the thermal conductive paste 230 bonds the housing 10 and the mounting case 210.

In the imaging device assembly 200 according to the embodiment of the invention, the heat conducting glue 230 can increase the heat dissipation area of the imaging device 100, so that the heat of the imaging device 100 can be dissipated to the surroundings, thereby reducing the heat transferred from the imaging device 100 to the outer surface of the electronic device 300 through the mounting case 210, avoiding the concentration of the heat on the outer surface of the electronic device 300 corresponding to the imaging device 100, causing excessive temperature rise, and improving the user experience.

In the description herein, references to the description of the terms "one embodiment," "certain embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. An electronic device comprising a display screen and an imaging device assembly, the imaging device assembly comprising:

the mounting shell is provided with a groove, and the display screen is arranged on the mounting shellShellThe above step (1);

the imaging device is connected to one side of the mounting shell, which is far away from the display screen; the imaging device comprises a shell, a hard circuit board, a flexible circuit board and an image sensor, wherein the shell is provided with an opening, and the image sensor is arranged on the hard circuit board; the shell comprises a bottom plate and a side plate extending from the edge of the bottom plate, the circuit boards are arranged on the bottom plate in a stacking mode, and the flexible circuit board penetrates through the opening and extends out of the shell;

the support body and the bottom plate are of an integral structure and are inserted into the groove; the supporting body is positioned between the mounting shell and the imaging device, so that a gap is formed between the bottom plate and the mounting shell, and air is filled in the gap to prevent the heat of the imaging device from being intensively transferred to the mounting shell and the display screen; and

a thermally conductive adhesive surrounding the housing, the thermally conductive adhesive bonding the housing and the mounting shell.

2. The electronic device of claim 1, wherein the thermally conductive adhesive is a thermally conductive gel.

3. The electronic device of claim 1, wherein the mounting case includes a substrate and a side wall extending from an edge of the substrate, the support body is fixed on the substrate, and the imaging device is disposed on the substrate through the support body.

4. The electronic device of claim 1, wherein the imaging device further comprises a lens disposed over the image sensor; and

a voice coil motor in which the lens is disposed.

5. The electronic device of claim 4, wherein the electronic device is a mobile phone or a tablet computer.

6. The electronic device of claim 1, wherein the flexible circuit board and the rigid circuit board are of a unitary rigid-flex board structure.

7. The electronic device of claim 1, wherein the imaging device includes a connector disposed on the flexible circuit board, the connector being located at an end of the flexible circuit board remote from the housing.