CN111711719A - Camera assembly and electronic equipment - Google Patents

Abstract

The application discloses a camera assembly and electronic equipment, wherein the camera assembly comprises a camera support, a camera circuit board and a first electronic element; the camera circuit board is connected with the camera support and encloses into an accommodating cavity, a photosensitive chip and blue glass are arranged in the accommodating cavity, the first electronic element is arranged outside the accommodating cavity and fixedly connected with the camera support, and the first electronic element is coupled with the camera circuit board through a connecting plate; wherein, the first electronic component is at least one of a capacitor and a memory. In this way, the holding that camera circuit board and camera support are constituteed is located to the first electronic component that this application set up extramurally, and first electronic component and camera support fixed connection to coupling through connecting plate and camera circuit board, can reducing the overall dimension of enclosing the camera support in synthetic holding chamber, and then make the overall dimension of camera assembly be less than the overall dimension of traditional camera assembly.

Description

Camera assembly and electronic equipment

Technical Field

The present application relates to the field of electronic devices, and in particular, to a camera module and an electronic device.

Background

With the improvement of the requirements of people on electronic equipment, the electronic equipment is developed towards the direction of faster operation, thinner body and higher cost performance, the thickness of the electronic equipment in the current market is a focus, and users can select the electronic equipment with the thinner body even if more cost is spent.

The thinner body requires that each component inside the electronic device is smaller and smaller, for example, the size of the camera assembly directly affects the ratio of the screen display area and the thickness of the body, the current camera can be very small, but the size of other components connected with the camera integrally affects the size of the whole camera assembly.

Disclosure of Invention

The technical problem that this application mainly solved provides a camera subassembly and electronic equipment, can reduce the holistic size of camera subassembly.

In order to solve the technical problem, the application adopts a technical scheme that: there is provided a camera assembly comprising:

a camera head bracket;

the camera circuit board is connected with the camera support and encloses into an accommodating cavity, and a photosensitive chip and blue glass are arranged in the accommodating cavity;

the first electronic element is arranged outside the accommodating cavity and fixedly connected with the camera support, and the first electronic element is coupled with the camera circuit board through a connecting plate; wherein the content of the first and second substances,

the first electronic component is at least one of a capacitor and a memory.

In order to solve the above technical problem, another technical solution adopted by the present application is: an electronic device is provided, the electronic device including: the camera comprises a shell, a control circuit board, a display screen and the camera assembly; wherein the content of the first and second substances,

the display screen and the shell enclose a cavity, and the control circuit board is arranged in the cavity and coupled with the camera assembly.

The beneficial effect of this application is: be different from prior art's condition, the holding that camera circuit board and camera support are constituteed is located to the first electronic component that this application set up outside the chamber, and first electronic component and camera support fixed connection to be coupled with the camera circuit board through the connecting plate. Because the holding intracavity has set up photosensitive chip and blue glass, so locate the holding chamber with first electronic component outside, can reduce the overall dimension of enclosing the camera support who becomes the holding chamber, and then the overall dimension of camera subassembly just is less than traditional camera subassembly's overall dimension.

Drawings

FIG. 1 is a schematic structural diagram of an embodiment of an electronic device of the present application;

FIG. 2 is a schematic structural diagram of one embodiment of a camera assembly of the present application;

FIG. 3 is a front view of the camera assembly shown in FIG. 2;

FIG. 4 is a cross-sectional view taken at X-X of FIG. 2;

FIG. 5 is an exploded view of the camera assembly shown in FIG. 2;

fig. 6 is a schematic structural view of a conventional camera stand;

FIG. 7 is a schematic structural view of one embodiment of a camera mount of the camera assembly shown in FIG. 2;

FIG. 8 is a schematic diagram of an embodiment of a blue glass mount in a camera assembly;

FIG. 9 is a bottom view of a camera mount in the camera assembly;

FIG. 10 is an exploded view of another embodiment of a camera assembly;

FIG. 11 is a schematic diagram of the construction of one embodiment of a connecting plate in the camera assembly shown in FIG. 10;

FIG. 12 is a top view of FIG. 10;

FIG. 13 is a cross-sectional view taken at Y-Y of FIG. 12;

FIG. 14 is a schematic structural view of a blue glass mount in the camera assembly shown in FIG. 10;

FIG. 15 is a schematic view of the structure of the photosensitive chip shown in FIG. 10;

FIG. 16 is an exploded view of another embodiment of the camera assembly shown in FIG. 2;

FIG. 17 is a top plan view of the assembled state shown in FIG. 16;

fig. 18 is a sectional view at C-C shown in fig. 17.

Fig. 19 is a schematic structural diagram of an electronic device according to an embodiment of the invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an embodiment of an electronic device 90 according to the present application. The present application provides an electronic device 90, the electronic device 90 includes a housing 710, a control circuit board 720, a display screen 730 and a camera assembly 740, the display screen 730 and the housing 710 form a cavity, and the control circuit board 720 is disposed in the cavity and coupled to the camera assembly 740. It is noted that the terms "comprises" and "comprising," as well as any variations thereof, are intended to cover a non-exclusive inclusion. As used herein, an "electronic device" (or simply "terminal") includes, but is not limited to, an apparatus that is configured to receive/transmit communication signals via a wireline connection, such as via a Public Switched Telephone Network (PSTN), a Digital Subscriber Line (DSL), a digital cable, a direct cable connection, and/or another data connection/network, and/or via a wireless interface (e.g., for a cellular network, a Wireless Local Area Network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and/or another communication terminal). A communication terminal arranged to communicate over a wireless interface may be referred to as a "wireless communication terminal", "wireless terminal" or "mobile terminal". Examples of mobile terminals include, but are not limited to, satellite or cellular telephones; a Personal Communications System (PCS) terminal that may combine a cellular radiotelephone with data processing, facsimile and data communications capabilities; PDAs that may include radiotelephones, pagers, internet/intranet access, Web browsers, notepads, calendars, and/or Global Positioning System (GPS) receivers; and conventional laptop and/or palmtop receivers or other electronic devices that include a radiotelephone transceiver. A cellular phone is an electronic device 90 equipped with a cellular communication module. The following embodiments are illustrated but not limited to a mobile phone.

Referring to fig. 2, 3 and 4, fig. 2 is a schematic structural diagram of an embodiment of a camera head assembly 740 according to the present application, fig. 3 is a front view of the camera head assembly 740 shown in fig. 2, and fig. 4 is a cross-sectional view taken at X-X shown in fig. 3. One embodiment of the camera assembly 740 of the present application comprises: camera support 10, camera circuit board 20 and first electronic component 30. The camera assembly 740 may include a camera and a bracket for mounting the camera, that is, the camera may be disposed separately from the bracket of the camera or may be disposed integrally. In an embodiment of the present application, the camera bracket 10 includes an integrally disposed camera, and in other embodiments, the camera bracket 10 may be only an installation frame for supporting the camera, and the camera is matched with the installation frame. The camera circuit board 20 is connected with the camera support 10 and encloses a containing cavity 40, and a photosensitive chip 410 and blue glass 430 are arranged in the containing cavity 40. The accommodating cavity 40 is used for receiving external light to the blue glass 430 and the photosensitive chip 410. The first electronic component 30 is arranged outside the accommodating cavity 40 and fixedly connected with the camera support 10, and the first electronic component 30 is coupled with the camera circuit board 20 through the connecting plate 310; wherein the first electronic element 30 is at least one of a capacitor and a memory. It can be concluded that, in an embodiment of the present application, the first electronic component 30 and the camera circuit board 20 are connected through the external connecting board 310, the first electronic component 30 is externally disposed and fixedly connected to the camera support 10, so as to save the space of the accommodating cavity 40, and further reduce the overall size of the camera support 10 enclosing the accommodating cavity 40. It should be noted that the terms "first", "second" and "third" in the present application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of indicated technical features. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the feature. It is noted that the terms "comprises" and "comprising," as well as any variations thereof, are intended to cover a non-exclusive inclusion.

Referring to fig. 5 and 7, fig. 5 is an exploded view of the camera assembly 740 shown in fig. 2, and fig. 7 is a schematic structural view of an embodiment of the camera mounting bracket 120 in the camera assembly 740 shown in fig. 2. At least one accommodating groove 110 is formed in an end face, far away from the camera circuit board 20, of the camera support 10, and the accommodating groove 110 is located in four corner regions opposite to the end face; the first electronic component 30 is disposed in the receiving cavity 110 and coupled to the camera circuit board 20. In an embodiment of the present invention, the number of the accommodating grooves 110 is 4, and the first electronic components 30 are respectively accommodated in the accommodating grooves 110 and connected to the camera stand 10. In one embodiment, the first electronic component 30 may be adhered in the accommodating groove 110. In other embodiments, other connection methods, such as clamping, may also be adopted, and are not limited herein. For example, if only one accommodating groove 110 is needed to accommodate all the first electronic components 30, only one accommodating groove 110 is provided, and the position of the accommodating groove 110 is not limited to the four corner regions on which the end surfaces of the accommodating groove 110 are provided, or the positions near the four corner regions are not limited thereto.

In an embodiment of the present application, the connection board 310 is an FPC flexible circuit board. The first electronic component 30 is coupled to the flexible circuit board at one end and coupled to the camera circuit board 20 at the other end. Compare in traditional scheme, installation space that can use on the make full use of camera support 10 body, the storage tank 110 that also corresponds to digging on camera support 10 and establish removes to place first electronic component 30, traditional first electronic component 30 is whole holding in holding chamber 40, and then the volume of holding chamber 40 can the grow, so that the size of camera module also can the grow, and in this application, expose first electronic component 30 and set up, alright save the volume of holding chamber 40, reduce the size of camera support 10 who encloses synthetic holding chamber 40. Compared with the conventional camera stand 10, referring to fig. 6, the size of the bottom of the camera stand 10 is much larger than that of the middle. Specifically, the dotted frame area marked by reference to fig. 7, that is, the corresponding Q area, may be saved by 0.3mm in the X direction of the camera stand 10, and saved by 0.5mm in the Y direction, that is, the Q area redundant to the dotted frame is also saved. Therefore, the overall size of the camera module can be reduced, and more usable space is provided for the whole electronic equipment 90.

In an embodiment of the present invention, the first electronic component 30 is disposed in all of the 4 receiving slots 110, so that 4 connecting plates 310 are required to be disposed to be connected to the camera circuit board 20, and the 4 connecting plates 310 are disposed at intervals and are not connected to each other. It is understood that, in other embodiments, 4 connecting plates 310 may be additionally connected to form a whole by a plurality of connecting plates 310, or adjacent connecting plates 310 may be connected to form a whole, which is not limited herein. In another embodiment, referring to fig. 9, fig. 9 is a bottom view of the camera mounting bracket 120 of the camera assembly 740 shown in fig. 2. It is understood that the receiving groove 110 may be opened inside the camera support 10, for example, in the X, Y, Z, W area shown in fig. 9, and the connecting board 310 may be connected to the camera circuit board 20 through the inside.

Referring to fig. 5 and 8, fig. 8 is a schematic structural diagram of an embodiment of a blue glass support 130 in a camera assembly 740. The camera support 10 includes a camera mounting bracket 120 and a blue glass support 130, and the blue glass support 130 is located between the camera mounting bracket 120 and the camera circuit board 20 and is connected with the camera mounting bracket 120 and the camera circuit board 20, respectively. The top of the blue glass support 130 is abutted to the bottom of the camera mounting bracket 120, and the blue glass support 130 can be bonded with the camera mounting bracket 120 through adhesive to be fixed, or can also be clamped by arranging a limiting groove without limitation. The blue glass support 130 is used for containing the blue glass 430, the blue glass 430 is placed in the containing cavity 40, and the blue glass support 130 is provided with adhesive to be fixed with the blue glass 430. In one embodiment of the present application, the blue glass bracket 130 is connected to the camera mounting bracket 120 by an adhesive. Referring specifically to fig. 5, the camera mount 120 is coupled to the blue glass bracket 130 through a first coupling layer 140, and the blue glass 430 is coupled to the blue glass bracket 130 through a second coupling layer 150. The first connecting layer 140 and the second connecting layer 150 are both adhesive. It should be noted that, the connection mode of the blue glass 430 and the blue glass support 130 may also be a detachable connection in other embodiments, that is, a notch may be formed in the blue glass support 130, and then a magnet is disposed in the notch, so that the blue glass 430 is fixed by a magnetic member magnetically attracted to the magnet. Blue glass 430 and blue glass support 130 adopt to dismantle to be connected in order to improve blue glass 430's life cycle, and convenient to detach is favorable to blue glass 430's recovery, and then practices thrift the cost.

Referring to fig. 8 and 10, fig. 8 is a schematic structural diagram of an embodiment of a blue glass support 130 in a camera head assembly 740, and fig. 10 is a schematic structural diagram of an exploded view of another embodiment of the camera head assembly 740. The blue glass bracket 130 comprises a first mounting plate 1310, a second mounting plate 1320, a third mounting plate 1330 and a fourth mounting plate 1340 which are sequentially connected around the side surface of the blue glass bracket 130, the first mounting plate 1310, the second mounting plate 1320, the third mounting plate 1330 and the fourth mounting plate 1340 are enclosed to form a mounting cavity 1350, the photosensitive chip 410 is accommodated in the mounting cavity 1350 and coupled with the camera circuit board 20, wherein the photosensitive chip 410 is communicated with the camera circuit board 20 through a gold wire 420. Further, the mounting chamber 1350 communicates with the receiving chamber 40, and the photosensitive chip 410 is coupled to the camera circuit board 20 and disposed in the mounting chamber 1350. In an embodiment of the present application, a second electronic component 50 is further included, and the second electronic component 50 is disposed in the mounting cavity 1350 and coupled to the camera circuit board 20. It should be noted that the second electronic component 50 and the first electronic component 30 are electronic components, and are at least one of a capacitor and a memory.

Referring to fig. 12, 13 and 14, fig. 12 is a top view of fig. 10, fig. 13 is a cross-sectional view at B-B of fig. 12, and fig. 14 is a schematic structural view of the blue glass support 130 in the camera assembly 740 of fig. 10. In an embodiment of the present application, the second electronic component 50 is spaced apart from the photosensitive chip 410, that is, the mounting cavity 1350 further includes a region for placing the second electronic component 50, and the region is disposed around the circumference of the photosensitive chip 410. The sealing plate 60 is further included, at least one of the first mounting plate 1310, the second mounting plate 1320, the third mounting plate 1330 and the fourth mounting plate 1340 is provided with a mounting notch 1360, and the mounting notch 1360 is communicated with the mounting cavity 1350; the sealing plate 60 covers the mounting gap 1360, and the thickness of the sealing plate 60 is smaller than the thickness of the first mounting plate 1310, the second mounting plate 1320, the third mounting plate 1330 and the fourth mounting plate 1340.

Referring to fig. 15, fig. 15 is a schematic structural diagram of the photosensitive chip 410 shown in fig. 10. It should be noted that, in addition to the photosensitive chip 410, a part of the space in the mounting chamber 1350 is used for accommodating the second electronic component 50, wherein the photosensitive chip 410 may be rectangular and includes a first side 4110, a second side 4120, a third side 4130 and a fourth side 4140 connected in sequence, wherein the second electronic component 50 can be disposed at a position flush with the first side 4110, the second side 4120, the third side 4130 and the fourth side 4140, that is, the position of the second electronic component 50 can be determined according to the distance between the first side 4110, the second side 4120, the third side 4130 and the fourth side 4140 and the inner wall of the blue glass support 130, for example, the shortest distance of the first side 4110 from the inner wall of the blue glass holder 130 is greater than the shortest distance of the second side 4120 from the inner wall of the blue glass holder 130, the placeable space on the side of first edge 4110 is greater than the placeable space on the side of second edge 4120, further, the second electronic component 50 is preferentially placed in the placement space on the first side 4110 side. Further, the circumferential dimension of the bottom surface of the conventional blue glass 430 mounting bracket is larger than the circumferential dimension of the bottom surface of the camera mounting bracket 120, and the size of the blue glass 430 is larger than that of the camera head assembly 740, so in an embodiment of the present invention, the outer side surfaces of the first mounting plate 1310, the second mounting plate 1320, the third mounting plate 1330 and the fourth mounting plate 1340 are flush with the outer side surface of the camera circuit board 20. So set up, alright keep the parallel and level state with the circumference size that makes camera circuit board 20, the circumference size of blue glass support 130 and camera mounting bracket 120, can not increase because blue glass support 130 need place second electronic component 50 and place the space and then influence whole size. The blue glass bracket 130 is surrounded by the first mounting plate 1310, the second mounting plate 1320, the third mounting plate 1330 and the fourth mounting plate 1340, and reducing the overall size of the blue glass bracket 130 is equivalent to reducing the thickness of the first mounting plate 1310, the second mounting plate 1320, the third mounting plate 1330 or the fourth mounting plate 1340, and in the actual production process, the extra size of the first mounting plate 1310, the second mounting plate 1320, the third mounting plate 1330 or the fourth mounting plate 1340 can be cut off, and then the sealing plate 60 with a thinner thickness is used for further sealing. During the cutting process, the cutting along the outer edge of the second electronic component 50 can ensure that the circumferential dimension of the blue glass bracket 130 is minimized, and the second electronic component 50 is exposed, and in the case that the second electronic component 50 is exposed, the sealing plate 60 can be used for sealing the second electronic component. In one embodiment of the present application, two of the first mounting plate 1310, the second mounting plate 1320, the third mounting plate 1330 and the fourth mounting plate 1340 that are adjacent to each other are cut away, and the sealing plate 60 is a right-angle plate, and the adjacent cut-away mounting plates can be covered with each other. It is understood that in other embodiments, the first mounting plate 1310, the second mounting plate 1320, the third mounting plate 1330 and the fourth mounting plate 1340, which are redundant with respect to the circumferential dimension of the camera circuit board 20, may be cut away to seal with the sealing plate 60. It can be appreciated that the sealing plate 60 can be used to seal the first mounting plate 1310, the second mounting plate 1320, the third mounting plate 1330 and the fourth mounting plate 1340 around the blue glass bracket 130.

Referring to fig. 11, fig. 11 is a schematic structural diagram of an embodiment of a connecting plate 310 in the camera assembly 740 shown in fig. 10. The side of the sealing plate 60 facing the notch is provided with an adhesive layer 610, and the sealing plate 60 is connected to the blue glass holder 130 through the adhesive layer 610. In the embodiment of the present application, the sealing plate 60 may be a double-sided tape, and one side of the sealing plate is bonded, and it should be understood that other plate bodies may also be adopted, and the sealing plate is sealed by dispensing, and the dispensing layer corresponds to the bonding layer 610, which is not limited herein.

Further, compared with the scheme of the traditional camera, the embodiment cuts the edge of the blue glass bracket 130, the mounting plate of the blue glass bracket 130 close to the second electronic element 50 is cut off or thinned, and the exposed part of the second electronic element 50 is sealed by the sealing plate 60 with the thickness smaller than the cut-off part, so that the camera module is miniaturized, and further compared with the traditional camera module, the peripheral side size of the blue glass bracket 130 can be reduced by 0.3mm, the overall size of the camera module is reduced, and more installation usable spaces of the electronic device 90 are provided.

Referring to fig. 16, 17 and 18, fig. 16 is an exploded view of another embodiment of the camera assembly 740 shown in fig. 2, fig. 17 is a top view of an assembled state shown in fig. 16, and fig. 18 is a cross-sectional view at C-C shown in fig. 17. In another embodiment, the second electronic component 50 may be provided integrally with the photosensitive chip 410. The integration method can be used for decoupling through a high-voltage technology, the capacitor is used in a multi-chip module of the photosensitive chip 410, and the appropriate capacitor can be selected based on the charging current required by the silicon disk invasion peak current impulse condition. In other embodiments, the integration method may take other forms, and is not limited herein. Integrating the capacitor or memory with the photosensitive chip 410 can save more space than the space for placing the second electronic component 50 in the mounting cavity 1350, so that the overall size of the camera assembly 740 can be reduced.

Further, an electronic device 90 is further provided in the embodiments of the present application, please refer to fig. 19, fig. 19 is a schematic structural diagram of the electronic device 90 according to an embodiment of the present invention, the electronic device 90 may be a mobile phone, a tablet computer, a notebook computer, a wearable device, and the like, and the embodiment illustrates a mobile phone as an example. The structure of the terminal apparatus 900 may include an RF circuit 910, a memory 920, an input unit 930, a display unit 940 (i.e., the display screen 730 in the above-described embodiment), a sensor 950, an audio circuit 960, a wifi module 970, a processor 980, a power supply 990, and the like. Wherein the RF circuit 910, the memory 920, the input unit 930, the display unit 940, the sensor 950, the audio circuit 960, and the wifi module 970 are respectively connected with the processor 980; the power supply 990 is used to supply power to the entire terminal apparatus 900.

Specifically, the RF circuit 910 is used for transmitting and receiving signals; the memory 920 is used for storing data instruction information; the input unit 930 is used for inputting information, and may specifically include a touch panel 931 and other input devices 932 such as operation keys; the display unit 940 may include a display panel 941; the sensor 950 includes an infrared sensor, a laser sensor, etc. for detecting a user approach signal, a distance signal, etc.; a speaker 961 and a microphone (or microphone, or receiver assembly in the above embodiments) 962 are coupled to the processor 980 via audio circuitry 960 for emitting and receiving sound signals; the wifi module 970 is used for receiving and transmitting wifi signals, and the processor 980 is used for processing data information of the electronic device 90.

The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims (13)

1. A camera head assembly, comprising:

a camera head bracket;

the camera circuit board is connected with the camera support and encloses into an accommodating cavity, and a photosensitive chip and blue glass are arranged in the accommodating cavity;

the first electronic element is arranged outside the accommodating cavity and fixedly connected with the camera support, and the first electronic element is coupled with the camera circuit board through a connecting plate; wherein the content of the first and second substances,

the first electronic component is at least one of a capacitor and a memory.

2. The camera assembly according to claim 1, wherein at least one receiving groove is formed in an end surface of the camera bracket away from the camera circuit board, and the receiving groove is located in a four-corner area opposite to the end surface; wherein the content of the first and second substances,

the first electronic element is arranged in the accommodating groove and coupled with the camera circuit board.

3. The camera assembly of claim 2, wherein said plurality of receiving slots are four and are located in respective four corner regions of said end surface opposite to each other.

4. A camera assembly according to claim 1, wherein the connection board is an FPC flexible circuit board.

5. The camera assembly of claim 1, wherein the camera mount comprises a camera mount and a blue glass mount, the blue glass mount being positioned between the camera mount and the camera circuit board and being connected to the camera mount and the camera circuit board, respectively.

6. The camera assembly according to claim 5, wherein the blue glass bracket comprises a first mounting plate, a second mounting plate, a third mounting plate and a fourth mounting plate which are sequentially connected around the side surface of the blue glass bracket, and form a mounting cavity, and the photosensitive chip is accommodated in the mounting cavity and coupled with the camera circuit board; wherein the content of the first and second substances,

the installation cavity is communicated with the containing cavity.

7. The camera assembly of claim 6, further comprising a second electronic component disposed within the mounting cavity and coupled to the camera circuit board.

8. The camera assembly of claim 7, wherein the second electronic component is spaced apart from the photo-sensing die.

9. A camera assembly according to claim 7, wherein the second electronic component is provided integrally with the photo-sensing chip.

10. The camera assembly of claim 6, further comprising a sealing plate, wherein at least one of the first mounting plate, the second mounting plate, the third mounting plate, and the fourth mounting plate is provided with a mounting notch, and the mounting notch is communicated with the mounting cavity; wherein the content of the first and second substances,

the sealing plate cover is arranged on the mounting notch, and the thickness of the sealing plate is smaller than that of the first mounting plate, that of the second mounting plate, that of the third mounting plate and that of the fourth mounting plate.

11. The camera assembly of claim 10, wherein outer sides of the first, second, third, and fourth mounting plates are flush with an outer side of the camera circuit board.

12. The camera assembly of claim 10, wherein an adhesive layer is disposed on a side of the sealing plate facing the notch, and the sealing plate is connected to the blue glass bracket through the adhesive layer.

13. An electronic device comprising a housing, a control circuit board, a display screen, and the camera assembly of any of claims 1-12; wherein the content of the first and second substances,

the display screen and the shell enclose a cavity, and the control circuit board is arranged in the cavity and coupled with the camera assembly.

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