CN210780990U - Camera module and electronic equipment - Google Patents
Camera module and electronic equipment Download PDFInfo
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- CN210780990U CN210780990U CN201921873929.XU CN201921873929U CN210780990U CN 210780990 U CN210780990 U CN 210780990U CN 201921873929 U CN201921873929 U CN 201921873929U CN 210780990 U CN210780990 U CN 210780990U
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Abstract
The utility model provides a with a camera module and electronic equipment, relate to electronic equipment technical field, this camera module includes circuit substrate, image sensor, the module of attached online circuit substrate bottom surface side surface strengthens the bottom plate, attached bearing base and the optical lens of installing on bearing base of side surface on circuit substrate, the sensitization through-hole has been seted up on the bearing base, the holding through-hole has been seted up on the circuit substrate, image sensor sets up in the holding through-hole and attached on the module strengthens the bottom plate, optical lens and sensitization through-hole all are located image sensor's sensitization route. Through setting up the module and strengthening the bottom plate and bear image sensor, and image sensor compares in the setting that sinks of circuit base plate for under the fixed condition of distance between image sensor and optical lens, wholly reduce optical lens's height, make the whole height reduction of camera module, and then make the camera module thinner, littleer, realize the miniaturization.
Description
Technical Field
The utility model relates to an electronic equipment technical field particularly, relates to a camera module and electronic equipment.
Background
At present, in a general camera module structure, an image sensor is disposed on a circuit substrate, the image sensor is connected with the substrate through a gold wire to realize signal transmission, a bracket is attached to the circuit substrate, and a lens is disposed in the bracket. The camera module is generally thick in circuit substrate size, and the thickness of the substrate cannot be further reduced due to the structural reasons of materials, so that the camera module is not suitable for the requirement of pursuing miniaturization of the camera module at present.
In view of this, it is important to design and manufacture a camera module that can make the camera module thinner and smaller, effectively reduce the module height, and achieve module miniaturization.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a camera module, it is thinner, littleer, can effectively reduce the module height, reduce the module size, realize that the module is miniaturized.
Another object of the present invention is to provide an electronic apparatus, which has a small size of the camera module, so that the overall size can be reduced and the thickness is thinner.
The utility model is realized by adopting the following technical scheme.
In one aspect, the utility model provides a camera module, including circuit substrate, image sensor, attached online road substrate bottom surface's module reinforcing bottom plate, attached bearing base and the optical lens of installing on bearing base of side surface on circuit substrate, the sensitization through-hole has been seted up on the bearing base, has seted up the holding through-hole on the circuit substrate, and image sensor sets up in the holding through-hole and attached on module reinforcing bottom plate, and optical lens and sensitization through-hole all are located image sensor's sensitization route.
Furthermore, the image sensor is in clearance fit in the accommodating through hole, so that an installation gap is formed between the image sensor and the side wall of the accommodating through hole, a structural member is arranged at the bottom of the bearing base and extends into the installation gap and is connected with the module reinforcing bottom plate.
Further, the bearing base, the structural member and the module reinforcing bottom plate are arranged into a whole.
Further, the bearing base, the structural member and the module reinforcing bottom plate are formed by injection molding of thermosetting resin materials.
Furthermore, the module reinforcing bottom plate is formed by one-time injection molding of thermosetting resin materials, and the bearing base and the structural member are formed by two-time injection molding of thermosetting resin materials and are fused with the module reinforcing bottom plate.
Furthermore, the bearing base comprises a bearing part and a pressing part which are integrally arranged, the bearing part is attached to the circuit substrate, the pressing part is attached to the edge of the image sensor and covers the installation gap, and the pressing part is connected with the structural part.
Furthermore, the bottom side of the stitching part is flush with the bottom side of the bearing part, and a step-shaped mounting groove for mounting the optical filter is formed between the top side of the stitching part and the top side of the bearing part.
Further, the thickness of the image sensor is consistent with the depth of the accommodating through hole, so that the upper side surface of the image sensor is flush with the upper side surface of the circuit substrate.
Further, the image sensor is bonded to the module reinforcing chassis by an adhesive.
Furthermore, the optical lens comprises a lens body and lens support legs which are integrally arranged, wherein the lens support legs are annularly arranged at the bottom edge of the lens body and are adhered to the top of the bearing base.
Furthermore, at least one electric connector is arranged on the image sensor, the electric connectors are respectively electrically connected with the image sensor and the circuit substrate, and the bearing base covers the electric connectors.
Furthermore, at least one electronic component is arranged on the upper side surface of the circuit substrate, and the bearing base covers the electronic component.
Further, the image sensor is assembled in the accommodating through hole, and the edge of the image sensor is tightly attached to the side wall of the accommodating through hole.
In another aspect, the utility model provides an electronic equipment, including the camera module, this camera module includes circuit substrate, image sensor, the module of attached online circuit substrate bottom surface side surface strengthens the bottom plate, attached bearing base and the optical lens of installing on bearing base of attached side surface on circuit substrate, the sensitization through-hole has been seted up on the bearing base, the holding through-hole has been seted up on the circuit substrate, image sensor sets up in the holding through-hole and attached on module strengthening the bottom plate, optical lens and sensitization through-hole all are located image sensor's sensitization route.
The utility model discloses following beneficial effect has:
the utility model provides a pair of camera module, through the attached module reinforcing bottom plate that sets up in circuit substrate's bottom surface, and set up the holding through-hole on circuit substrate, set up image sensor in the holding through-hole and attached on module reinforcing bottom plate simultaneously, strengthen the bottom plate through setting up the module and bear image sensor, and image sensor compares and sinks the setting in circuit substrate, make between image sensor and optical lens apart from the fixed condition under, wholly reduce optical lens's height, make the whole height reduction of camera module, and then make the camera module thinner, and is smaller, realize the miniaturization.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic view of an overall structure of a camera module according to a first embodiment of the present invention;
fig. 2 is a schematic view of a partial structure of a camera module according to a first embodiment of the present invention;
fig. 3 is a second schematic partial structural view of a camera module according to a first embodiment of the present invention;
fig. 4 is a third schematic view of a partial structure of a camera module according to the first embodiment of the present invention;
fig. 5 is a fourth schematic view of a partial structure of a camera module according to the first embodiment of the present invention;
fig. 6 is a schematic view of an overall structure of a camera module according to a second embodiment of the present invention;
fig. 7 is a schematic view of a partial structure of a camera module according to a second embodiment of the present invention;
fig. 8 is a schematic structural diagram of an electronic device according to a third embodiment of the present invention.
Icon: 100-a camera module; 110-a circuit substrate; 111-a receiving through hole; 113-installing a gap; 115-electronic components; 130-an image sensor; 131-an electrical connection; 150-a module reinforcing bottom plate; 170-a load-bearing base; 171-photosensitive through holes; 173-a carrier part; 175-a press fit; 177-an optical filter; 179-mounting groove; 180-structural member; 190-an optical lens; 191-a lens body; 193-lens foot; 200-an electronic device; 210-device body.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "center", "upper", "vertical", "horizontal", "inner", "outer", etc. indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship that the products of the present invention are usually placed when in use, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or element to which the term refers must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "connected," "mounted," and "connected" are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the prior art, a camera module structure on an electronic device is to directly bond an image sensor to a circuit substrate, connect the image sensor to the substrate through a gold wire, attach a bracket to the substrate, and place a lens on the bracket. Due to the requirement of imaging, the distance between the image sensor and the lens cannot be reduced to be lower, and meanwhile, the size of the circuit board is thicker, so that the miniaturization of the whole module is difficult. The utility model discloses a local hole of digging on the circuit substrate to place image sensor on the circuit substrate dig the hole region, thereby make image sensor can sink the setting for the circuit substrate, thereby can reduce the height of camera lens, and then reduced the height of whole module. In addition, form integrative bearing base and module reinforcing bottom plate through injection moulding, can strengthen the overall structure intensity of module.
Some embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Features in the embodiments described below may be combined with each other without conflict.
First embodiment
With reference to fig. 1 to 6, the present embodiment provides a camera module 100, which is assembled on an apparatus main body of an electronic apparatus, and the camera module is installed by sinking an image sensor 130, so that the height of the camera module can be effectively reduced, and the miniaturization of the camera module is realized.
The camera module 100 provided by this embodiment includes a circuit substrate 110, an image sensor 130, a module reinforcing bottom plate 150 attached to the bottom surface of the circuit substrate 110, a carrying base 170 attached to the upper surface of the circuit substrate 110, and an optical lens 190 mounted on the carrying base 170, wherein a photosensitive through hole 171 is formed in the carrying base 170, an accommodating through hole 111 is formed in the circuit substrate 110, the image sensor 130 is disposed in the accommodating through hole 111 and attached to the module reinforcing bottom plate 150, and the optical lens 190 and the photosensitive through hole 171 are both located on a photosensitive path of the image sensor 130.
In the present embodiment, the circuit substrate 110 is a hard board, a soft board, or a rigid-flex board, such as a ceramic substrate, a PCB hard board, etc., and the specific type thereof is not limited. The electronic device mentioned in this embodiment includes, but is not limited to, a mobile phone, a notebook computer, a tablet computer, and the like.
In the present embodiment, the module reinforcing bottom plate 150 is disposed on the lower surface of the circuit substrate 110 by injection molding, and covers the circuit substrate 110, so as to enhance the structural strength of the circuit substrate 110. And the surface of the module reinforcing base plate 150 exposed at the accommodating through hole 111 is flush with the bottom surface of the circuit substrate 110, so that the image sensor 130 is located on the same horizontal plane as the circuit substrate 110 when the image sensor 130 is attached to the module reinforcing base plate 150, and the image sensor 130 is disposed on the circuit substrate 110 in a sinking manner as much as possible.
In the present embodiment, the image sensor 130 is in a clearance fit in the receiving through hole 111, so that a mounting gap 113 is formed between the image sensor 130 and a sidewall of the receiving through hole 111, a structural member 180 is disposed at the bottom of the bearing base 170, and the structural member 180 extends into the mounting gap 113 and is connected to the module reinforcing bottom plate 150.
It should be noted that the installation gaps 113 are uniformly distributed around the image sensor 130, and the widths of the installation gaps 113 are the same, so that the image sensor 130 can be placed in the central position of the accommodating through hole 111, and the imaging effect of the image sensor 130 is ensured.
In the present embodiment, the load base 170, the structural member 180, and the module reinforcing bottom plate 150 are integrally provided. The carrier base 170 and the structural member 180 are injection molded onto the wiring substrate 110 and into the mounting gap 113. Specifically, an injection molding material is injected into the mold, the injection molding material flows into the mounting gap 113 and is cured to form the structural member 180, the injection molding material forms the bearing base 170 after the upper surface of the circuit substrate 110 is cured, and the bearing base 170 and the structural member 180 are simultaneously injection molded. In addition, the injection material flows into the mounting gap 113 and then contacts the bottom module reinforcing bottom plate 150, so that the injection material forming the structural member 180 and the injection material contacting with the same forming the module reinforcing bottom plate 150 are fused with each other and solidified into a whole, and the integral arrangement of the bearing base 170, the structural member 180 and the module reinforcing bottom plate 150 is realized. Through injection molding, the surface smoothness of the bearing base 170 can be improved, so that the assembly precision of the camera module 100 is improved, and the optical lens 190 can be accurately installed in place.
In the present embodiment, the load base 170, the structural member 180, and the module reinforcing bottom plate 150 are injection molded from thermosetting resin material. The cured resin material has better strength compared with the circuit substrate 110, and meanwhile, the bearing base 170, the structural member 180 and the module reinforcing plate are integrally arranged, so that the strength of the whole framework of the module is enhanced.
It should be noted that, in this embodiment, the module reinforcing base plate 150 and the bearing base 170 are respectively formed by a secondary forming process, specifically, the module reinforcing base plate 150 is formed by a thermosetting resin material through one-step injection molding, and the bearing base 170 and the structural member 180 are formed by a thermosetting resin material through two-step injection molding and are fused with the module reinforcing base plate 150, so that the requirement of the mold is reduced and the demolding is more convenient through the secondary forming process.
In the present embodiment, the image sensor 130 is adhered to the module reinforcing base plate 150 by an adhesive. Specifically, the surface of the module reinforcing base plate 150 exposed at the accommodating through hole 111 is coated with an adhesive, and the image sensor 130 is bonded to the module reinforcing base plate 150, and in the case that the image sensor 130 is compacted, the thickness of the adhesive is negligible, and the sinking height of the image sensor 130 is not affected.
The carrier base 170 includes a carrier portion 173 and a pressing portion 175 integrally disposed, the carrier portion 173 is attached to the circuit substrate 110, the pressing portion 175 is attached to an edge of the image sensor 130 and covers the mounting gap 113, the pressing portion 175 is connected to the structural member 180, and the optical lens 190 is disposed on the carrier portion 173. Specifically, the bearing part 173 is disposed on the circuit substrate 110 around the receiving through hole 111, and the pressing part 175 extends from the bearing part 173 toward the center of the receiving through hole 111 and presses the edge of the image sensor 130, so that the position of the image sensor 130 can be defined.
In this embodiment, the bearing portion 173 is ring-shaped, the pressing portion 175 is disposed inside the bearing portion 173, and the top of the bearing portion 173 has a mounting plane parallel to the light sensing plane of the image sensor 130 for bearing the optical lens 190 and ensuring that the optical lens 190 is horizontally disposed relative to the image sensor 130. Meanwhile, the bearing portion 173 disposed annularly can isolate the photosensitive through hole 171 from the external space, so as to prevent impurities such as external dust from entering the photosensitive through hole 171 and affecting the imaging effect of the image sensor 130.
In other preferred embodiments of the present invention, the bearing portion 173 may also have a slot communicating with the outside, so that the bearing portion 173 forms a C-shaped structure, and the slot communicates with the photosensitive through hole 171 and the external space. Through slotting on bearing part 173, can not cause too big deformation because of being heated, cooling in the injection moulding process, make things convenient for bearing part 173 injection moulding.
In this embodiment, the camera module 100 may further include a filter 177, a bottom side of the pressing portion 175 is flush with a bottom side of the carrying portion 173, and a step-shaped mounting groove 179 for mounting the filter 177 is formed between a top side of the pressing portion 175 and a top side of the carrying portion 173. Specifically, the shape of the mounting groove 179 is adapted to the shape of the optical filter 177, the top side of the press-fit portion 175 is lower than the top side of the carrier portion 173, and the edge of the optical filter 177 is adhered to the top side of the press-fit portion 175, thereby supporting the optical filter 177 through the top side of the press-fit portion 175.
In the embodiment, the cross-sectional shape of the bearing portion 173 is rectangular, the cross-sectional shape of the pressing portion 175 is also rectangular, and the width of the bearing portion 173 is greater than the width of the pressing portion 175, so as to avoid the situation that the pressing portion 175 is too wide and is difficult to be aligned. In other preferred embodiments of the present invention, for the convenience of injection molding, the cross-sectional shape of the bearing portion 173 and the cross-sectional shape of the pressing portion 175 are both trapezoidal, i.e. the width of the upper side is smaller than the width of the lower side, so as to facilitate the demolding.
In this embodiment, at least one electrical connector 131 is disposed on the image sensor 130, the electrical connector 131 is electrically connected to the image sensor 130 and the circuit substrate 110, and the carrying substrate 170 is covered outside the electrical connector 131. Specifically, the periphery of the image sensor 130 is provided with a plurality of electrical connectors 131, each electrical connector 131 is wrapped in the stitching portion 175 and the partial bearing portion 173, and the image sensor 130 and the circuit substrate 110 are electrically connected through the electrical connectors 131.
It should be noted that, here, the electrical connector 131 is a gold wire disposed between the image sensor 130 and the circuit substrate 110, the image sensor 130 and the circuit substrate 110 are electrically connected by means of gold wire bonding, and the gold wire is wrapped and disposed in the carrying base 170 for fixing, so as to prevent dust or impurities outside the module from contaminating the electrical connector 131 and affecting the electrical connection performance thereof, and also prevent dust remaining on the electrical connector 131 from contaminating the image sensor 130. Of course, the electrical connection member 131 may be an electrical connection wire made of other material such as silver wire or copper wire.
In this embodiment, at least one electronic component 115 is disposed on the upper surface of the circuit substrate 110, and the carrier base 170 covers the electronic component 115. Specifically, a plurality of electronic components 115 are disposed on the circuit substrate 110 around the receiving through hole 111, and the plurality of electronic components 115 are wrapped in the bearing portion 173, so that the circuit substrate can be fixed and protected. The electronic component 115 may be a capacitor, a resistor or a driver element.
In this embodiment, the electronic component 115 is protruded on the circuit substrate 110 and electrically connected to the circuit substrate 110, and the carrier 173 completely covers the electronic component 115. In other preferred embodiments, the electronic component 115 is attached to the surface of the circuit substrate 110 by a surface mount process, and the bearing portion 173 covers the electronic component 115, so that the electronic component 115 can be fixed and protected, and by the coating effect of the bearing portion 173, it is possible to prevent dust or impurities outside the module from contaminating the electronic component 115 and affecting the electrical performance thereof, and prevent dust remaining on the electronic component 115 from contaminating the image sensor 130.
In other preferred embodiments of the present invention, the supporting portion 173 may also be partially covered outside the electronic component 115, so that the electronic component 115 can be partially exposed to facilitate heat dissipation, and the specific structure thereof is not described herein.
In this embodiment, the thickness of the image sensor 130 is the same as the depth of the receiving through hole 111, so that the upper surface of the image sensor 130 is flush with the upper surface of the circuit substrate 110, thereby preventing the image sensor 130 from protruding from the circuit substrate 110 to affect the injection molding of the carrying base 170, and facilitating the installation of other optical elements.
In other preferred embodiments of the present invention, the thickness of the image sensor 130 is smaller than the depth of the receiving through hole 111, so that the image sensor 130 is concavely disposed on the circuit substrate 110, which can also avoid the influence of the image sensor 130 on the injection molding of the carrying base 170.
The optical lens 190 includes a lens body 191 and a lens leg 193 integrally disposed, and the lens leg 193 is disposed around the bottom edge of the lens body 191 and adhered to the top of the carrying base 170. Specifically, the lens leg 193 is pasted on the top surface of the bearing 173, i.e., the lens leg 193 is pasted on the mounting surface, ensuring horizontal mounting of the lens body 191 with respect to the image sensor 130.
In the present embodiment, the lens body 191 is disposed above the filter 177, and the distance between the lens body 191 and the image sensor 130 is set according to the imaging requirement, and the lens body 191 is disposed on the light sensing path of the image sensor 130. The lens legs 193 are annularly disposed at the bottom edge of the lens body 191 and are outwardly flared without interfering with the light sensing path of the image sensor 130. The bottom side surfaces of the lens legs 193 are closely attached to the mounting surfaces of the bearing parts 173, thereby securing the level of mounting.
In summary, in the camera module 100 provided in this embodiment, a hole is partially dug in the circuit substrate 110 to form the accommodating through hole 111, a resin adhesive is injected on the bottom surface of the circuit substrate 110, the cured resin adhesive forms the module reinforcing base plate 150 attached to the bottom surface of the circuit substrate 110, and the image sensor 130 is placed in the accommodating through hole 111 and attached to the module reinforcing base plate 150, so that the mounting height of the optical lens 190 can be reduced, thereby reducing the height of the whole module. And then, resin glue is injected on the surface of the upper side of the circuit substrate 110, the solidified resin glue forms a bearing base attached to the upper side of the circuit substrate 110 and a structural member 180 formed in an installation gap 113 formed between the side walls of the image sensor 130 and the accommodating through hole 111, and the structural member 180, the bearing base 170 and the module reinforcing bottom plate 150 are integrally arranged, so that the structural strength of the whole module is higher.
Second embodiment
Referring to fig. 6 and fig. 7 in combination, the present embodiment provides a camera module 100, the basic structure and principle and the generated technical effects are the same as those of the first embodiment, and for the sake of brief description, reference may be made to corresponding contents in the first embodiment for parts not mentioned in the present embodiment.
The camera module 100 provided by this embodiment includes a circuit substrate 110, an image sensor 130, a module reinforcing bottom plate 150 attached to the bottom surface of the circuit substrate 110, a carrying base 170 attached to the upper surface of the circuit substrate 110, and an optical lens 190 mounted on the carrying base 170, wherein a photosensitive through hole 171 is formed in the carrying base 170, an accommodating through hole 111 is formed in the circuit substrate 110, the image sensor 130 is disposed in the accommodating through hole 111 and attached to the module reinforcing bottom plate 150, and the optical lens 190 and the photosensitive through hole 171 are both located on a photosensitive path of the image sensor 130.
In the embodiment, the shape of the image sensor 130 is adapted to the receiving through hole 111, and the edge of the image sensor 130 is disposed closely to the circuit substrate 110, so that there is no gap between the image sensor 130 and the sidewall of the receiving through hole 111, and the carrying base 170 covers the image sensor 130 and the circuit substrate 110.
In this embodiment, the module reinforcing bottom plate 150 is disposed on the lower surface of the circuit substrate 110 by injection molding, and covers the circuit substrate 110, so as to enhance the structural strength of the circuit substrate 110. The bearing base 170 is injection molded on the circuit substrate 110, and the bearing base 170 and the magic cube reinforced bottom plate are isolated from each other through the circuit substrate 110 and the image sensor 130. The module reinforcing bottom plate 150 plays a bearing role for the image sensor 130, the bearing base 170 and the optical lens 190 play a bearing role, and meanwhile, the bearing base 170 and the module reinforcing bottom plate 150 are respectively formed in an injection molding mode, so that the injection molding process cannot be influenced mutually, and the molding quality can be guaranteed.
Third embodiment
Referring to fig. 8, the present embodiment provides an electronic device 200, which includes a device main body 210 and a camera module 100, the basic structure and principle of the camera module 100 and the generated technical effects are the same as those of the first embodiment, and for the sake of brief description, reference may be made to corresponding contents in the first embodiment for parts not mentioned in the present embodiment.
In this embodiment, the camera module 100 is packaged and disposed on the device body 210, the camera module 100 includes a circuit substrate 110, an image sensor 130, a module reinforcing bottom plate 150 attached to a bottom surface of the circuit substrate 110, a carrying base 170 attached to an upper surface of the circuit substrate 110, and an optical lens 190 mounted on the carrying base 170, a photosensitive through hole 171 is formed on the carrying base 170, an accommodating through hole 111 is formed on the circuit substrate 110, the image sensor 130 is disposed in the accommodating through hole 111 and attached to the module reinforcing bottom plate 150, and the optical lens 190 and the photosensitive through hole 171 are both located on a photosensitive path of the image sensor 130. Specifically, the module reinforcing base plate 150 is attached to the device main body 210, and the camera module 100 is integrally covered by a device housing, and a transparent window for the optical lens 190 to collect light is formed on the device housing, and the specific structure of the module reinforcing base plate can be referred to as a camera structure on the existing electronic device 200.
In other preferred embodiments of this embodiment, the camera module 100 may be multiple, form multiple camera modules and be assembled on the apparatus main body 210, and the arrangement manner thereof may be horizontal or vertical along the same straight line, or may be arranged in an array or along the same circumference, and the like, which is not limited herein.
The electronic device 200 mentioned in this embodiment includes, but is not limited to, a mobile phone, a notebook computer, a tablet computer, and the like. The embodiment is illustrated by taking a mobile phone as an example.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (14)
1. The camera module is characterized by comprising a circuit substrate, an image sensor, a module reinforcing bottom plate attached to the bottom surface of the circuit substrate, a bearing base attached to the upper surface of the circuit substrate and an optical lens installed on the bearing base, wherein a photosensitive through hole is formed in the bearing base, a holding through hole is formed in the circuit substrate, the image sensor is arranged in the holding through hole and attached to the module reinforcing bottom plate, and the optical lens and the photosensitive through hole are located on a photosensitive path of the image sensor.
2. The camera module according to claim 1, wherein the image sensor is clearance-fitted in the receiving through-hole so as to form a mounting gap between the image sensor and a sidewall of the receiving through-hole, and a structural member is disposed at a bottom of the bearing base, and extends into the mounting gap and is connected to the module reinforcing bottom plate.
3. The camera module of claim 2, wherein the carrier base, the structural member, and the module stiffener plate are integrally formed.
4. The camera module of claim 3, wherein the carrier base, the structural member, and the module stiffener baseplate are injection molded from a thermoset resin material.
5. The camera module of claim 4, wherein the module stiffener plate is injection molded in one piece from a thermoset resin material, and the carrier base and the structural member are injection molded in two pieces from a thermoset resin material and are fused with the module stiffener plate.
6. The camera module according to claim 2, wherein the supporting base includes a supporting portion and a pressing portion integrally disposed, the supporting portion is attached to the circuit substrate, the pressing portion is attached to an edge of the image sensor and covers the mounting gap, and the pressing portion is connected to the structural member.
7. The camera module according to claim 6, wherein a bottom side of the pressing portion is flush with a bottom side of the carrying portion, and a top side of the pressing portion and a top side of the carrying portion are stepped to form a mounting groove for mounting the optical filter.
8. The camera module according to claim 1, wherein the thickness of the image sensor is consistent with the depth of the receiving through hole, so that the upper side surface of the image sensor is flush with the upper side surface of the circuit substrate.
9. The camera module of claim 8, wherein the image sensor is bonded to the module stiffener substrate with an adhesive.
10. The camera module according to claim 1, wherein the optical lens comprises a lens body and a lens leg integrally disposed, and the lens leg is disposed around a bottom edge of the lens body and adhered to a top of the supporting base.
11. The camera module according to claim 1, wherein at least one electrical connector is disposed on the image sensor, the electrical connector is electrically connected to the image sensor and the circuit substrate, respectively, and the carrier base covers the electrical connector.
12. The camera module according to claim 1 or 11, wherein at least one electronic component is disposed on an upper surface of the circuit substrate, and the carrier base covers the electronic component.
13. The camera module according to claim 1, wherein the image sensor is fitted in the receiving through hole, and an edge of the image sensor is closely attached to a sidewall of the receiving through hole.
14. An electronic device, comprising the camera module according to any one of claims 1 to 13.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921873929.XU CN210780990U (en) | 2019-11-01 | 2019-11-01 | Camera module and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921873929.XU CN210780990U (en) | 2019-11-01 | 2019-11-01 | Camera module and electronic equipment |
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| CN210780990U true CN210780990U (en) | 2020-06-16 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110620870A (en) * | 2019-11-01 | 2019-12-27 | 昆山丘钛微电子科技有限公司 | Camera module, electronic equipment and manufacturing method of camera module |
| CN111711719A (en) * | 2020-07-03 | 2020-09-25 | Oppo（重庆）智能科技有限公司 | Camera assembly and electronic equipment |
| CN113489539A (en) * | 2021-08-09 | 2021-10-08 | 维沃移动通信有限公司 | Electronic device |
| CN115348369A (en) * | 2022-06-29 | 2022-11-15 | 荣耀终端有限公司 | Camera module and electronic equipment |
| WO2023011665A1 (en) * | 2021-08-03 | 2023-02-09 | 深圳市群晖智能科技股份有限公司 | Base of image acquisition module, image acquisition module, and camera module |
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2019
- 2019-11-01 CN CN201921873929.XU patent/CN210780990U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110620870A (en) * | 2019-11-01 | 2019-12-27 | 昆山丘钛微电子科技有限公司 | Camera module, electronic equipment and manufacturing method of camera module |
| CN111711719A (en) * | 2020-07-03 | 2020-09-25 | Oppo（重庆）智能科技有限公司 | Camera assembly and electronic equipment |
| WO2023011665A1 (en) * | 2021-08-03 | 2023-02-09 | 深圳市群晖智能科技股份有限公司 | Base of image acquisition module, image acquisition module, and camera module |
| CN113489539A (en) * | 2021-08-09 | 2021-10-08 | 维沃移动通信有限公司 | Electronic device |
| CN113489539B (en) * | 2021-08-09 | 2023-10-13 | 维沃移动通信有限公司 | Electronic equipment |
| CN115348369A (en) * | 2022-06-29 | 2022-11-15 | 荣耀终端有限公司 | Camera module and electronic equipment |
| CN115348369B (en) * | 2022-06-29 | 2023-09-05 | 荣耀终端有限公司 | Camera module and electronic equipment |
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Address after: No.3, Taihong Road, Kunshan high tech Industrial Development Zone, Kunshan City, Suzhou City, Jiangsu Province Patentee after: Kunshan Qiuti Microelectronics Technology Co.,Ltd. Address before: No.3, Taihong Road, Kunshan high tech Industrial Development Zone, Kunshan City, Suzhou City, Jiangsu Province Patentee before: KUNSHAN Q TECHNOLOGY Co.,Ltd. |