CN210724995U

CN210724995U - Supporting seat, camera module and electronic equipment

Info

Publication number: CN210724995U
Application number: CN201921491454.8U
Authority: CN
Inventors: 钟应超
Original assignee: OFilm Image Technology Guangzhou Co Ltd
Current assignee: Guangzhou Delta Imaging Technology Co Ltd
Priority date: 2019-09-09
Filing date: 2019-09-09
Publication date: 2020-06-09
Anticipated expiration: 2029-09-09

Abstract

The utility model relates to a supporting seat, module and electronic equipment make a video recording, this supporting seat for meet with camera lens module and base plate to form an airtight space that is used for installing the sensitization chip, the sensitization chip with the camera lens module is relative, is used for receiving the follow the camera lens module spreads into the light in airtight space images, include: a first mounting area for mounting a lens module; a second mounting region arranged opposite to the first mounting region and used for mounting a substrate; a third mounting area for mounting a circuit board; the third mounting area is arranged away from the first mounting area and is arranged away from the second mounting area. The utility model discloses in, the third installing zone sets up with first installing zone phase separation to set up with the second installing zone phase separation, after the circuit board was installed on the supporting seat like this, the phenomenon that camera lens module, circuit board, base plate three superpose together can not appear, thereby can reduce the total height of the module of making a video recording.

Description

Supporting seat, camera module and electronic equipment

Technical Field

The utility model relates to a camera technical field especially relates to a supporting seat, module and electronic equipment make a video recording.

Background

The camera module is a key part of a mobile phone, as shown in fig. 1, the current camera module adopting the flip chip technology mainly comprises a lens module 91, a support seat 92, an FPC board 93, a reinforcement board 94 and a photosensitive chip 95, wherein the lens module 91, the support seat 92, the FPC board 93 and the reinforcement board 94 are sequentially superposed in the optical axis direction Z of the camera module, the support seat 92 is a hollow structure with two open ends, the FPC board 93 seals one open end of the support seat 92, the lens module 91 seals the other open end of the support seat 92, and further a closed space 96 is formed, the photosensitive chip 95 is located in the closed space 96 and is arranged on the support seat 92, and is used for imaging according to light rays transmitted into the closed space 96 from the lens module 91.

Since the height of the camera module (i.e. the dimension of the camera module in the optical axis direction) is a key parameter affecting the thickness of the mobile phone, how to improve the camera module in fig. 1 to reduce the height of the whole camera module is a direction that some manufacturers strive to pursue at present.

SUMMERY OF THE UTILITY MODEL

The utility model provides a supporting seat, module and electronic equipment make a video recording aims at reducing the height of the module of making a video recording.

A supporting base for connecting with a lens module and a substrate to form a closed space for installing a photosensitive chip, the photosensitive chip being opposite to the lens module and being used for receiving light rays transmitted into the closed space from the lens module for imaging, comprising: a first mounting area for mounting a lens module; a second mounting region arranged opposite to the first mounting region and used for mounting a substrate; a third mounting area for mounting a circuit board; the third mounting area is arranged away from the first mounting area and is arranged away from the second mounting area.

The utility model discloses in, the third installing zone sets up with first installing zone phase separation to set up with the second installing zone phase separation, after the circuit board was installed on the supporting seat like this, the phenomenon that camera lens module, circuit board, base plate three superpose together can not appear, thereby can reduce the total height of the module of making a video recording.

Further, the supporting seat comprises a first surface and a second surface which are arranged oppositely, the first installation area is arranged on the first surface, the second installation area is arranged on the second surface, and the third installation area is arranged on the first surface.

Furthermore, the first surface is a bending surface, and the second mounting area is lower than the first mounting area in the direction of the first mounting area, so that the mounting space can be increased, and the assembly of the camera module is facilitated.

Furthermore, the third installation area surrounds the outer side of the first installation area, and the stability of connection between the circuit board and the supporting seat can be improved after the supporting seat and the circuit board with the corresponding avoiding hole are assembled.

Further, the supporting seat comprises a first surface and a second surface which are arranged oppositely, and a through hole which penetrates from the first surface to the second surface; the inner wall of the through hole is provided with a fourth mounting area so as to mount the photosensitive chip; the third mounting area is provided with a first electrode pin which is used for being electrically connected with the circuit board; and the fourth mounting area is provided with a second electrode pin, and the second electrode pin is electrically connected with the first electrode pin and is used for being electrically connected with the photosensitive chip.

Furthermore, the through hole is a stepped hole, and the fourth mounting area is arranged on the stepped surface of the stepped hole, so that the production of the supporting seat is facilitated; and/or the first electrode pin and the second electrode pin are electrically connected through a lead, and the lead is a conductive circuit printed on the supporting seat, so that the supporting seat is more convenient to use, and the assembly of a subsequent camera module is facilitated.

Furthermore, the supporting seat is a ceramic base, so that the supporting seat has better strength and insulating property; and/or the substrate is an electromagnetic shielding plate to improve the working performance of the camera module.

A camera module comprises; a support base as described in any one of the above; the lens module is arranged in the first installation area of the supporting seat; the substrate is arranged in the second mounting area of the supporting seat; and the circuit board is arranged in the third mounting area of the supporting seat. The camera module adopts the setting mode to reduce the height of the whole camera module.

Furthermore, the third installation area surrounds the outer side of the first installation area, and the circuit board is provided with avoidance holes so as to avoid interference with the lens module.

An electronic device comprises the camera module, so that the miniaturization design of the electronic device is facilitated.

Drawings

Fig. 1 is a schematic stacked view of a conventional camera module;

fig. 2 is a schematic stacked view of a camera module according to a first embodiment of the present invention;

fig. 3 is a schematic structural view of a support seat of the camera module according to the first embodiment of the present invention;

fig. 4 is a projection view of another view angle of the supporting seat of the camera module according to the first embodiment of the present invention;

fig. 5 is a schematic structural view of a support seat of a camera module according to a second embodiment of the present invention;

fig. 6 is a schematic structural view of a support seat of a camera module according to a third embodiment of the present invention;

fig. 7 is a schematic back structural view of a circuit board of a camera module according to a first embodiment of the present invention;

fig. 8 is a schematic front structural view of a photosensitive chip of a camera module according to a first embodiment of the present invention;

fig. 9 is a partial cross-sectional view of a support seat of a camera module according to a first embodiment of the present invention;

fig. 10 is a schematic structural view of a support seat of a camera module according to a fourth embodiment of the present invention;

fig. 11 is a schematic back structure view of a circuit board of a camera module according to a fourth embodiment of the present invention.

Detailed Description

In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention can be embodied in many different forms other than those specifically described herein, and it will be apparent to those skilled in the art that similar modifications can be made without departing from the spirit and scope of the invention, and it is therefore not to be limited to the specific embodiments disclosed below.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

As shown in fig. 2, in the present embodiment, the image capturing module 100 includes a lens module 1, a support base 2, a substrate 3, a photo sensor chip 4, and a circuit board 5. Wherein, the lens module 1, the supporting seat 2 and the substrate 3 are sequentially superposed; the photosensitive chip 4 and the circuit board 5 are electrically connected and are all arranged on the supporting seat 2.

As shown in fig. 2 to 4, in the present embodiment, the supporting seat 2 has a first surface 21, a second surface 22, a third surface 23 and a through hole 24, wherein the first surface 21 and the second surface 22 are disposed opposite to each other and can be regarded as a top surface and a bottom surface of the supporting seat 2, the third surface 23 is a side surface of the supporting seat 2, and the through hole 24 penetrates from the first surface 21 to the second surface 22. In addition, in the embodiment, the supporting base 2 is substantially a rectangular parallelepiped structure, and the supporting base has four side surfaces, that is, four third surfaces 23.

In the present embodiment, the first surface 21 is provided with a first mounting region 211 for mounting the lens module 1, and the second surface 22 is provided with a second mounting region 221 for mounting the substrate 3. In addition, in the present embodiment, one end of the through hole 24 is located in the first mounting region 211, and the other end is located in the second mounting region 221, so that the lens module 1 is mounted in the first mounting region 211 and covers one end of the through hole 24, and the substrate 3 is mounted in the second mounting region 221 and covers the other end of the through hole 24, thereby forming the enclosed space 6, and external light can only enter the enclosed space 6 from the lens module 1.

As shown in fig. 2, the photosensitive chip 4 is disposed in the through hole 24, that is, the photosensitive chip 4 is disposed in the enclosed space 6, and is used for receiving light rays coming from the lens module 1 to perform imaging. In addition, in the present embodiment, when the lens module 1 is bonded to the first mounting region 211 by the connection glue, and the substrate 3 is bonded to the second mounting region 221 by the connection glue, the total height of the image pickup module 100 (i.e., the dimension of the image pickup module 100 in the optical axis direction Z of the lens module 1) is approximately the sum of the thickness of the lens module 1, the thickness of the support base 2, the thickness of the substrate 3, the thickness of the connection glue between the lens module 1 and the support base 2, and the thickness of the connection glue between the substrate 3 and the support base 2.

As shown in fig. 2 and 3, in the present embodiment, the first surface 21 is further provided with a third mounting region 212 for mounting the circuit board 5, and the third mounting region 212 is located outside the first mounting region 211, so that the circuit board 5 is not overlapped with the lens module 1 after being mounted on the supporting base 2, and the total height of the camera module 100 is not increased.

Specifically, as shown in fig. 2 and 3, in the present embodiment, the first surface 21 is a bending surface, the third mounting region 212 is disposed on one side of the first mounting region 211, and the height of the third mounting region 212 is lower than the height of the first mounting region 211 in the direction from the second mounting region 221 to the first mounting region 211, in which case the third mounting region 212 is located between the first mounting region 211 and the third mounting region 221. The installation space of the supporting base 2 can be enlarged by the arrangement, and the camera module 100 is more convenient to assemble.

As shown in fig. 2, the first surface 21 includes a connection region 213 for connecting the first mounting region 211 and the third mounting region 212, in addition to the first mounting region 211 and the third mounting region 212. In addition, in the present embodiment, for the convenience of production, the first mounting region 211, the third mounting region and the connection region 213 are all planar, and the first mounting region 211 is parallel to the third mounting region 212 and also parallel to the second mounting region 221, and the connection region 213 is perpendicular to the first mounting region. At this time, the third mounting region 212, the connection region 213, and the first mounting region 211 constitute a zigzag stepped surface. In addition, in the present embodiment, the first mounting region 211 and the third mounting region 212 are respectively located at both ends of the first surface 21, i.e., the first mounting region 211 and the third mounting region 212 are respectively connected to the three sides 23.

As shown in fig. 2, the support seat 2 provided in this embodiment can be integrally divided into a main body 2a and an extension 2b disposed on the sidewall of the main body 2a, wherein the first mounting region 211 and the second mounting region 221 are respectively disposed at two ends of the main body 2a, and the main body 2a is equivalent to the existing support seat; the third mounting region 212 is provided on the extension portion 2b, which corresponds to an extension portion for mounting the circuit board 5 provided on a side wall of the conventional support base (i.e., the support base 92 in fig. 1).

It is understood that in other embodiments, the third mounting region 212 may be disposed in other regions apart from the first mounting region 211 and apart from the second mounting region 221, for example, as shown in fig. 5, the first surface 211 is a plane, and the third mounting region 212 is disposed outside the first mounting region 211. For another example, as shown in fig. 6, the third mounting region 212 may be disposed on the third surface 23 of the supporting seat 2. After the camera module 100 is assembled, the lens module 1, the circuit board 5 and the substrate 4 are not stacked together in the optical axis direction Z, and the total height of the camera module 100 can be reduced by at least one thickness of the circuit board 5 compared with the arrangement shown in fig. 1.

In addition, in this embodiment, the third mounting region 212 is disposed apart from the first mounting region 211, which means that the third mounting region 212 may be connected to the first mounting region 211, or the third mounting region 212 is spaced apart from the first mounting region 211, that is, there is no overlapping portion between the third mounting region 212 and the first mounting region 211. Similarly, the third mounting region 212 is disposed apart from the second mounting region 221, which means that the third mounting region 212 may be connected to the second mounting region 221, or the third mounting region 212 is spaced apart from the second mounting region 221, i.e., there is no cross-overlapping portion between the third mounting region 212 and the second mounting region 221.

As shown in fig. 4, in the present embodiment, the side wall 241 of the through hole 24 is provided with a fourth mounting area 242 for mounting the photosensitive chip 4, specifically, in the present embodiment, the through hole 24 is a stepped hole, the diameter of the stepped hole on the side close to the second surface 22 is larger, and the fourth mounting area 242 is arranged on the stepped surface of the stepped hole.

In the present embodiment, the photosensitive chip 4 is electrically connected to the circuit board 5, so that the electrical signal generated on the photosensitive chip 4 can be transmitted to the circuit board 5.

As shown in fig. 3 and 7, in the present embodiment, the third mounting region 212 is provided with a first electrode pin 25, the circuit board 5 is provided with a third electrode pin 51 corresponding to the first electrode pin 25, and the first electrode pin 25 and the third electrode pin 51 can be electrically connected by a conductive adhesive, wherein the conductive adhesive can be an ACF adhesive (ACF is an abbreviation of Anisotropic conductive film, and the chinese name is Anisotropic conductive adhesive). Of course, in other embodiments, the first electrode pin 25 and the third electrode pin 51 may be electrically connected by soldering or the like. In addition, in the present embodiment, the circuit board 5 has a front surface 52 and a back surface 53 which are oppositely arranged, wherein the front surface 52 of the circuit board 5 is used for arranging electronic components, and the third electrode pin 51 is arranged on the back surface 53 of the circuit board 5. Of course, in other embodiments, the third electrode pin 51 may be disposed on the front surface 52 of the circuit board 5.

As shown in fig. 4 and fig. 8, in the present embodiment, the second electrode pin 26 is disposed on the fourth mounting region 242, the fourth electrode pin 42 is disposed on the front surface 41 of the photo sensor chip 4 (the front surface 41 of the photo sensor chip 4 is opposite to the lens module 1 and has a photo sensing region 411 for receiving light rays), and the second electrode pin 26 and the fourth electrode pin 42 may be electrically connected through a conductive adhesive, where the conductive adhesive may be an ACF adhesive. Of course, in other embodiments, the second electrode pin 26 and the fourth electrode pin 42 may be electrically connected by soldering or the like.

As shown in fig. 9, in the present embodiment, the first electrode lead 25 and the second electrode lead 26 are electrically connected by a lead 27, so that the circuit board 5 and the photosensitive chip 4 are electrically connected together. In this embodiment, the lead 27 may be a silver paste circuit printed thereon, and of course, in other embodiments, the silver paste may be replaced by other conductive paste, or the lead 27 may also directly adopt a conductive wire.

The supporting seat 2 is a substrate 3 printed with a silver paste circuit, the supporting seat 2 is electrically connected with the FPC board through a conductive adhesive (such as ACF adhesive), and the supporting seat 2 is also electrically connected with the photosensitive chip 4. During the actual use, the supporting seat 2 can also transmit signals except for supporting the lens module 1, specifically, the electrical signals generated by the photosensitive chip 4 are transmitted to the supporting seat 2 first and then transmitted to the FPC board.

In this embodiment, the supporting seat 2 may be a ceramic base so as to provide the supporting seat with better strength and insulating performance, and of course, the supporting seat 2 may also be made of other insulating materials. In addition, the circuit board 5 is an FPC board. The substrate 3 is an electromagnetic shielding plate with an electromagnetic shielding function to improve the working performance of the camera module 100, the electromagnetic shielding plate may be made of a magnetic conductive material such as iron, and of course, the electromagnetic shielding plate may also be made by coating a corresponding electromagnetic shielding layer on a non-magnetic conductive plate.

As shown in fig. 2, in the present embodiment, the image capturing module 100 further includes an optical filter 7, the optical filter 7 is disposed between the lens module 1 and the light sensing chip 4, so as to filter stray light coming from the lens module 1, wherein the optical filter 7 may be an infrared filter for filtering infrared light. In addition, in the present embodiment, the optical filter 7 is disposed on the first surface 21 of the support base 2 and covers the through hole 24.

In another embodiment, as shown in fig. 10, the third mounting region 212 is designed to be annular and surrounds the first mounting region 211, and at this time, as shown in fig. 11, the circuit board 5 is provided with an avoiding hole 54 to avoid interference with the lens module 1, wherein the avoiding hole 54 penetrates from the front surface 52 of the circuit board 5 to the back surface 53 of the circuit board 5. In addition, in the present embodiment, since the third mounting region 212 is lower than the first mounting region 211, when the shape and size of the avoiding hole 54 are properly set, the inner surface 541 of the avoiding hole 54 abuts against the surface corresponding to the connection region 213 after the circuit board 5 is mounted in the third mounting region 212, which can improve the stability of the connection between the circuit board 5 and the support base 2.

The camera module 100 can be used in an electronic device, and is beneficial to the miniaturization design of the electronic device. The electronic device can be a terminal product such as a smart phone and a tablet computer.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. A supporting seat is used for being connected with a lens module and a substrate to form a closed space for installing a photosensitive chip, the photosensitive chip is opposite to the lens module and used for receiving light rays transmitted into the closed space from the lens module to form images, and the supporting seat is characterized by comprising:

a first mounting area for mounting a lens module;

a second mounting region arranged opposite to the first mounting region and used for mounting a substrate;

a third mounting area for mounting a circuit board; the third mounting area is arranged away from the first mounting area and is arranged away from the second mounting area.

2. The support nest of claim 1, wherein the support nest includes first and second oppositely disposed surfaces, the first mounting region being disposed on the first surface, the second mounting region being disposed on the second surface, and the third mounting region being disposed on the first surface.

3. The support bracket of claim 2, wherein the first surface is a curved surface and the height of the third mounting region is less than the height of the first mounting region in a direction from the second mounting region to the first mounting region.

4. A support platform according to claim 2 or claim 3, wherein the third mounting region surrounds the first mounting region.

5. The support seat according to claim 1, wherein the support seat comprises a first surface and a second surface which are opposite to each other, and a through hole penetrating from the first surface to the second surface;

the inner wall of the through hole is provided with a fourth mounting area so as to mount the photosensitive chip;

the third mounting area is provided with a first electrode pin which is used for being electrically connected with the circuit board;

and the fourth mounting area is provided with a second electrode pin, and the second electrode pin is electrically connected with the first electrode pin and is used for being electrically connected with the photosensitive chip.

6. The support base of claim 5, wherein the through hole is a stepped hole, and the fourth mounting region is disposed on a stepped surface of the stepped hole; and/or

The first electrode pins and the second electrode pins are electrically connected through leads, and the leads are conductive circuits printed on the supporting seat.

7. The seat according to claim 1, wherein the seat is a ceramic base; and/or

The base plate is an electromagnetic shielding plate.

8. A camera module is characterized by comprising;

a support seat according to any one of claims 1 to 7;

the lens module is arranged in the first installation area of the supporting seat;

the substrate is arranged in the second mounting area of the supporting seat;

and the circuit board is arranged in the third mounting area of the supporting seat.

9. The camera module of claim 8, wherein the third mounting region surrounds the outside of the first mounting region, and the circuit board has an avoiding hole so as not to interfere with the lens module.

10. An electronic device characterized in that it comprises a camera module according to claim 9.