CN111565276A - Camera module and electronic equipment - Google Patents
Camera module and electronic equipment Download PDFInfo
- Publication number
- CN111565276A CN111565276A CN202010576327.9A CN202010576327A CN111565276A CN 111565276 A CN111565276 A CN 111565276A CN 202010576327 A CN202010576327 A CN 202010576327A CN 111565276 A CN111565276 A CN 111565276A
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- Prior art keywords
- camera module
- substrate
- circuit board
- photosensitive chip
- light
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Studio Devices (AREA)
- Blocking Light For Cameras (AREA)
Abstract
The invention discloses a camera module and electronic equipment, wherein the camera module comprises a lens component, a sensor component and an optical filter, the lens component comprises a bracket, a voice coil motor and a lens, the bracket is provided with a light-transmitting through hole, the voice coil motor is erected on the bracket, the voice coil motor is provided with a cavity, the lens is arranged in the cavity, and the voice coil motor is used for driving the lens to reciprocate along the axis of the cavity; the sensor assembly comprises a circuit board, a photosensitive chip and a connector, the photosensitive chip is arranged at the first end of the circuit board and is opposite to the light-transmitting through hole, the connector is arranged at the second end of the circuit board, and a first grounding layer is arranged on one side of the circuit board, which is far away from the photosensitive chip; the light filter is arranged right opposite to the light-transmitting through hole and is arranged on two sides of the support respectively with the photosensitive chip, and the lens, the light filter and the photosensitive chip are communicated in a light path. According to the invention, the first grounding layer is arranged, so that the grounding and interference shielding effects of the camera module are optimized, and the image captured by the camera can be clearer.
Description
Technical Field
The invention relates to the technical field of camera shooting, in particular to a camera module and electronic equipment.
Background
With the continuous progress of electronic technology and the rapid development of mobile communication, portable electronic devices such as mobile phones are more and more popular in people's lives, and as portable intelligent electronic devices, cameras are one of the indispensable standards. Taking a mobile phone as an example, as the consumption public is more and more demanding on the photographing effect, the pixel requirement on the camera of the mobile phone is also more and more high, but the mobile phone often can receive external electromagnetic interference in the use process, and other electronic components in the mobile phone also can cause electronic interference to the camera in operation, and then the conversion of the optical signal received by the camera to the electrical signal is influenced, so that the photographing effect of the camera is influenced, and therefore the pixel requirements in different environments cannot be met.
Therefore, it is necessary to provide a new camera module and an electronic device to solve the above technical problems.
Disclosure of Invention
The invention mainly aims to provide a camera module and electronic equipment, and aims to solve the problem of serious electromagnetic interference of the camera module in the using process.
In order to achieve the above object, the camera module provided by the present invention includes a lens assembly, a sensor assembly and an optical filter, wherein the lens assembly includes a support, a voice coil motor and a lens, the support is provided with a light-transmitting through hole, the voice coil motor is erected on the support, the voice coil motor is provided with a cavity, the lens is installed in the cavity, and the voice coil motor is used for driving the lens to reciprocate along an axis of the cavity; the sensor assembly comprises a circuit board, a photosensitive chip and a connector, the photosensitive chip is arranged at the first end of the circuit board and is opposite to the light-transmitting through hole, the connector is arranged at the second end of the circuit board, and a first grounding layer is arranged on one side of the circuit board, which is far away from the photosensitive chip; the light filter is opposite to the light transmission through hole and is arranged on two sides of the support respectively with the photosensitive chip, and the lens and the light filter are communicated with the light path of the photosensitive chip.
Preferably, the circuit board includes a first substrate, a flexible board and a second substrate connected in sequence, the support and the photosensitive chip are both disposed on the first substrate, the first ground layer is disposed on a side of the first substrate away from the photosensitive chip, and the connector is disposed on a side of the second substrate away from the support; and a second grounding layer is arranged on one side of the second substrate, which is far away from the connector.
Preferably, the first ground layer is a conductive cloth attached to a side of the first substrate away from the photosensitive chip.
Preferably, a gap exists between the edge of the conductive cloth and the edge of the first substrate, and a copper-exposed ground plane is formed on the first substrate corresponding to the gap.
Preferably, the gap between the edge of the conductive cloth and the edge of the first substrate is 0.35mm to 0.65 mm.
Preferably, the thickness of the conductive cloth is 0.05 mm-0.1 mm.
Preferably, the second ground layer is a second copper-exposed ground plane disposed on a side of the second substrate facing away from the connector.
Preferably, the voice coil motor is provided with a positioning column extending towards the circuit board, and the support is opposite to the positioning column to form an avoiding notch.
Preferably, an accommodating cavity is formed in one side, opposite to the circuit board, of the support, the photosensitive chip is arranged in the accommodating cavity, an installation groove is formed in one side, opposite to the voice coil motor, of the support, the optical filter is arranged in the installation groove, and the accommodating cavity is communicated with the installation groove through the light-transmitting through hole.
In addition, the invention also provides electronic equipment which comprises the camera module.
In the technical scheme of the invention, the photosensitive chip is electrically connected with the first end of the circuit board, the bracket is covered above the photosensitive chip, the light-transmitting through hole is aligned with the photosensitive area of the photosensitive chip, the optical filter is arranged on the bracket opposite to the photosensitive area of the photosensitive chip, and the voice coil motor is arranged on the bracket, so that the photosensitive chip, the optical filter and the optical path of the lens are communicated. The lens is used for receiving external light, the light shot from the outside enters the optical filter through the lens, part of the light filtered by the optical filter is received by the photosensitive chip on the circuit board, and the photosensitive chip converts an optical signal into an electric signal; and a connector is arranged at the second end of the circuit board, the connector is connected with an external structure of the electronic equipment, the electric signal is converted into a digital signal, and the digital signal is processed to display an image. Among them, the light sensing chip is preferably a CMOS (complementary metal oxide semiconductor) light sensing element. In addition, one side that the circuit board deviates from the sensitization chip is equipped with first ground plane, switch on through first ground plane and outside ground connection spare electrical property, make camera module realize ground connection through first ground plane, the area of contact of camera module and ground connection spare has been increased, the contact effect of camera module and outside ground connection spare has been optimized, thereby the ground connection of camera module, the shielding interference effect, block the external electromagnetic interference of in-process at signal conversion and influence the signal transmission of image conversion in-process, thereby can make the image that the camera caught more clear.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic view of a disassembled structure of a camera module according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a camera module according to an embodiment of the present invention;
FIG. 3 is a schematic view of a bracket according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of another bracket according to an angle of view of the bracket in the embodiment of the present invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | |
2 | Sensor assembly |
| 1 | |
21 | |
| 11 | |
211 | |
| 111 | Light-transmitting through hole | 211a | The first copper-exposed |
| 112 | Avoiding |
212 | |
| 113 | Containing |
213 | |
| 114 | |
22 | |
| 12 | |
23 | Connector with a |
| 121 | Hollow cavity | 24 | A first ground layer |
| 122 | |
25 | |
| 13 | |
3 | Optical filter |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are only for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "connected," "secured," and the like are to be construed broadly, and for example, "secured" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In addition, the technical solutions in the embodiments of the present invention may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination of technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
As shown in fig. 1 and fig. 2, in an embodiment of the present invention, a camera module 100 includes a lens assembly 1, a sensor assembly 2, and an optical filter 3, the lens assembly 1 includes a support 11, a voice coil motor 12, and a lens 13, the support 11 is provided with a light-transmitting through hole 111, the voice coil motor 12 is disposed on the support 11, the voice coil motor 12 is provided with a cavity 121, the lens 13 is mounted in the cavity 121, and the voice coil motor 12 is used for driving the lens 13 to reciprocate along an axis of the cavity 121; the sensor assembly 2 comprises a circuit board 21, a photosensitive chip 22 and a connector 23, the photosensitive chip 22 is arranged at a first end of the circuit board 21 and is opposite to the light-transmitting through hole 111, the connector 23 is arranged at a second end of the circuit board 21, and a first grounding layer 24 is arranged on one side of the circuit board 21, which is far away from the photosensitive chip 22; the optical filter 3 is arranged opposite to the light-transmitting through hole 111 and is arranged on two sides of the bracket 11 with the photosensitive chip 22, and the lens 13, the optical filter 3 and the photosensitive chip 22 are in optical path communication.
In the above technical solution, the light sensing chip 22 is electrically connected to the first end of the circuit board 21, the support 11 covers the light sensing chip 22, the light transmitting through hole 111 is aligned to the light sensing area of the light sensing chip 22, the optical filter 3 is mounted on the support opposite to the light sensing area of the light sensing chip 22, and the voice coil motor 12 is mounted on the support 11, so that the light paths of the light sensing chip 22, the optical filter 3 and the lens 13 are communicated. In this embodiment, the lens 13 is used for receiving external light, the light taken from the outside enters the optical filter 3 through the lens 13, part of the light filtered by the optical filter 3 is received by the photosensitive chip 22 on the circuit board 21, and the photosensitive chip 22 converts the optical signal into an electrical signal; and a connector 23 is provided at a second end of the circuit board 21, the connector 23 being connected to an external structure of the electronic device and converting the electrical signal into a digital signal, the digital signal being processed to display an image. Among them, the light sensing chip 22 is preferably a CMOS (complementary metal oxide semiconductor) light sensing element. In addition, one side of the circuit board 21 departing from the photosensitive chip 22 is provided with a first grounding layer 24, the circuit board is electrically conducted with an external grounding piece through the first grounding layer 24, the camera module 100 is grounded through the first grounding layer 24, the contact area between the camera module 100 and the grounding piece is increased, the contact effect between the camera module 100 and the external grounding piece is optimized, the grounding of the camera module 100 is optimized, the interference shielding effect is realized, the external electromagnetic interference in the signal conversion process is prevented from influencing the signal transmission in the image conversion process, and the image captured by the camera can be clearer.
The circuit board 21 includes a first substrate 211, a flexible board 212, and a second substrate 213 connected in sequence, the support 11 and the photosensitive chip 22 are both disposed on the first substrate 211, the first ground layer 24 is disposed on a side of the first substrate 211 away from the photosensitive chip 22, and the connector 23 is disposed on a side of the second substrate 213 away from the support 11; and a second ground plane 25 is provided on a side of the second substrate 213 facing away from the connector 23. The circuit board 21 includes a first substrate 211, a second substrate 213, and a flexible board 212 connecting the first substrate 211 and the second substrate 213, wherein the flexible board 212 in the middle is made of a flexible material, and the width of the flexible board 212 is smaller than the width of the first substrate 211 and the width of the second substrate 213. When the circuit board 21 is bent, the middle flexible board 212 is subjected to bending force and is not easily broken, which is beneficial to bending the first substrate 211 and the second substrate 213 to two sides. The photosensitive chip 22 is disposed on the first substrate 211, and the connector 23 is disposed on the second substrate 213. Photosensitive chip 22 and connector 23 divide and locate the both sides of circuit board 21, and like this when soft board 212 is crooked, photosensitive chip 22 and connector 23 can all deviate from the direction setting on ground, and protection photosensitive chip 22 and connector 23 that like this can be better to at the state of bending, first ground plane 24 is located between first base plate 211 and the second base plate 213, can effectively keep apart the mutual influence when connector 23 and photosensitive chip 22 move. The second ground plane 25 can shield the electromagnetic influence of the external components, and in addition, the electromagnetic film is disposed on the flexible board 212, so as to better prevent the external electromagnetic interference in the signal transmission between the photosensitive core and the connector 23. In a preferred embodiment, the circuit board 21 is a flexible circuit board 21 or a rigid-flex circuit board 21. In addition, both ends of the flexible board 212 are arc-connected to the first and second substrates 213, respectively. This can prevent the connection between the first substrate 211 and the second substrate 213 and the flexible board 212 from being easily broken during the bending process.
Optionally, the first ground layer 24 is a conductive cloth attached to a side of the first substrate 211 away from the photosensitive chip 22. The conductive cloth is made up by using fibre cloth (general polyester fibre cloth) as base material, after pretreatment applying metal plating layer to make it have metal property, and its crease-resisting property and form-retaining property are good, and possesses high strength and elastic recovery power. And is firm, durable, wrinkle-resistant and non-ironing.
In an embodiment, a gap exists between an edge of the conductive cloth and an edge of the first substrate 211, and a first exposed copper ground plane 211a is formed at a position of the first substrate 211 corresponding to the gap. That is, the first ground layer 24 and the first exposed copper ground plane 211a together form a shielding layer that can cover the whole first substrate 211 and the side opposite to the photosensitive chip 22, so as to ensure that the covered area of the shielding layer can isolate the influence of external or internal electromagnetic signals on the photosensitive chip 22. The conductive cloth can be fiber cloth with a conductive metal layer plated on the surface, and specifically, the thickness of the conductive cloth is 0.05 mm-0.1 mm. That is, the conductive cloth is in a sheet shape, and the influence on the size of the camera module 100 is reduced. More specifically, the gap size between the edge of the conductive cloth and the edge of the first substrate 211 is 0.35mm to 0.65 mm. A gap is ensured between the edge of the conductive cloth and the edge of the first substrate 211, so that the conductive cloth is prevented from being partially exposed out of the edge of the first substrate 211, and the overall size of the camera module 100 is maintained. The gap between the edge of the conductive cloth and the edge of the first substrate 211 can be 0.35 mm-0.65 mm, so that the shielding effect of the conductive cloth can be ensured, and the edge of the conductive cloth can be prevented from being worn due to too small space.
Optionally, the second ground layer 25 is a second exposed copper ground plane disposed on a side of the second substrate 213 facing away from the connector 23. The second copper-exposed ground plane with a large area can bear larger current, namely, the second copper-exposed ground plane has better shielding performance, and the signal processing and transmission performance of the connector 23 is ensured.
In addition, a positioning post 122 extending towards the circuit board 21 is disposed on the voice coil motor 12, and an avoiding notch 112 is formed at a position of the support 11 facing the positioning post 122. Because the lens 13 is fixed with the mounted position of voice coil motor 12, through reference column 122 and dodge breach 112 cooperation, the mounted position of voice coil motor 12 and support 11 is injectd, during the installation of every time, only need align reference column 122 with dodge breach 112, just can guarantee the light path intercommunication between lens 13, light filter 3 and the sensitization chip 22, can simplify the equipment degree of difficulty through setting up reference column 122 and dodge breach 112 promptly, improve the equipment precision, improve the imaging effect of the camera module 100 that final equipment was accomplished.
In an embodiment, referring to fig. 3 and fig. 4, an accommodating cavity 113 is formed on a side of the bracket 11 opposite to the circuit board 21, the photosensitive chip 22 is disposed in the accommodating cavity 113, an installation groove 114 is formed on a side of the bracket 11 opposite to the voice coil motor 12, the optical filter 3 is disposed in the installation groove 114, and the accommodating cavity 113 and the installation groove 114 are communicated through the light-transmitting through hole 111. That is, the support 11 covers the photosensitive chip 22, so that the photosensitive chip 22 is accommodated in the accommodating cavity 113, and the position of the support 11 is adjusted, so that the position of the light-transmitting through hole 111 corresponds to the position of the photosensitive area of the photosensitive chip 22, and the light-transmitting through hole 111 is directly formed in the bottom wall of the mounting groove 114, so that the light path communication between the optical filter 3 and the photosensitive chip 22 can be conveniently realized by disposing the optical filter 3 in the mounting groove 114. To facilitate the installation of the filter 3, the opening edge of the installation groove 114 may be chamfered.
In addition, the invention also provides an electronic device, which comprises the camera module 100. The electronic device can be a mobile phone, a camera or a computer. The specific structure of the camera module 100 refers to the above embodiments, and since the electronic device includes the camera module 100 as described above, the electronic device has all the advantages of the camera module 100, which is not repeated herein.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. The utility model provides a camera module which characterized in that:
the lens assembly comprises a support, a voice coil motor and a lens, wherein the support is provided with a light-transmitting through hole, the voice coil motor is erected on the support, the voice coil motor is provided with a cavity, the lens is installed in the cavity, and the voice coil motor is used for driving the lens to reciprocate along the axis of the cavity;
the sensor assembly comprises a circuit board, a photosensitive chip and a connector, the photosensitive chip is arranged at the first end of the circuit board and is opposite to the light-transmitting through hole, the connector is arranged at the second end of the circuit board, and a first grounding layer is arranged on one side of the circuit board, which is far away from the photosensitive chip;
the light filter is arranged right opposite to the light transmission through hole and is arranged on two sides of the support respectively with the photosensitive chip, and the lens and the light filter are communicated with the light path of the photosensitive chip.
2. The camera module according to claim 1, wherein the circuit board includes a first substrate, a flexible board, and a second substrate connected in sequence, the bracket and the photo sensor chip are disposed on the first substrate, the first ground layer is disposed on a side of the first substrate facing away from the photo sensor chip, and the connector is disposed on a side of the second substrate facing away from the bracket; and a second grounding layer is arranged on one side of the second substrate, which is far away from the connector.
3. The camera module of claim 2, wherein the first ground layer is a conductive cloth attached to a side of the first substrate away from the photo-sensing chip.
4. The camera module of claim 3, wherein a gap exists between an edge of the conductive cloth and an edge of the first substrate, and a first exposed copper ground plane is formed on the first substrate corresponding to the gap.
5. The camera module of claim 4, wherein the gap between the edge of the conductive cloth and the edge of the first substrate is 0.35mm to 0.65mm in size.
6. The camera module of claim 3, wherein the conductive cloth has a thickness of 0.05mm to 0.1 mm.
7. The camera module of claim 2, wherein the second ground plane is a second bare copper ground plane disposed on a side of the second substrate facing away from the connector.
8. The camera module according to any one of claims 1 to 7, wherein a positioning column extending toward the circuit board is disposed on the voice coil motor, and an avoiding notch is formed at a position of the support facing the positioning column.
9. The camera module according to any one of claims 1 to 7, wherein a side of the holder opposite to the circuit board is provided with a receiving cavity, the photosensitive chip is disposed in the receiving cavity, a side of the holder opposite to the voice coil motor is provided with a mounting groove, the optical filter is disposed in the mounting groove, and the receiving cavity and the mounting groove are communicated through the light-transmitting through hole.
10. An electronic device, characterized in that the electronic device comprises a camera module according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010576327.9A CN111565276A (en) | 2020-06-22 | 2020-06-22 | Camera module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010576327.9A CN111565276A (en) | 2020-06-22 | 2020-06-22 | Camera module and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111565276A true CN111565276A (en) | 2020-08-21 |
Family
ID=72075362
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010576327.9A Pending CN111565276A (en) | 2020-06-22 | 2020-06-22 | Camera module and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111565276A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114745477A (en) * | 2020-12-23 | 2022-07-12 | 华为技术有限公司 | Camera module and electronic equipment |
| CN115022502A (en) * | 2022-05-25 | 2022-09-06 | Oppo广东移动通信有限公司 | Camera module and electronic equipment |
| CN115242936A (en) * | 2021-04-22 | 2022-10-25 | 华为技术有限公司 | Camera module and electronic equipment |
| CN116671118A (en) * | 2022-08-25 | 2023-08-29 | 荣耀终端有限公司 | Camera module and electronic equipment |
-
2020
- 2020-06-22 CN CN202010576327.9A patent/CN111565276A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114745477A (en) * | 2020-12-23 | 2022-07-12 | 华为技术有限公司 | Camera module and electronic equipment |
| CN114745477B (en) * | 2020-12-23 | 2023-06-06 | 华为技术有限公司 | Camera module and electronic equipment |
| CN115242936A (en) * | 2021-04-22 | 2022-10-25 | 华为技术有限公司 | Camera module and electronic equipment |
| CN115022502A (en) * | 2022-05-25 | 2022-09-06 | Oppo广东移动通信有限公司 | Camera module and electronic equipment |
| CN115022502B (en) * | 2022-05-25 | 2023-12-05 | Oppo广东移动通信有限公司 | Camera module and electronic equipment |
| CN116671118A (en) * | 2022-08-25 | 2023-08-29 | 荣耀终端有限公司 | Camera module and electronic equipment |
| CN116671118B (en) * | 2022-08-25 | 2024-08-16 | 荣耀终端有限公司 | Camera module and electronic equipment |
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