CN112835227A

CN112835227A - Backlight module and electronic equipment

Info

Publication number: CN112835227A
Application number: CN202110195767.4A
Authority: CN
Inventors: 唐建业
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2021-02-19
Filing date: 2021-02-19
Publication date: 2021-05-25
Anticipated expiration: 2041-02-19
Also published as: CN112835227B

Abstract

The application provides a backlight module, which comprises a first back frame and a second back frame; the first back frame comprises a first bottom plate and a first side plate which are connected in a bending mode; the second back frame comprises a second bottom plate and a second side plate which are connected in a bending mode; the first bottom plate and the second bottom plate are arranged in a stacked mode in a first direction, the first side plate and the second side plate are arranged in a stacked mode in a second direction, and the first direction and the second direction are crossed; the end part of the first side plate, which is far away from the first bottom plate, and the end part of the second side plate, which is far away from the second bottom plate, are fixedly connected; the orthographic projection of the second bottom plate on the first bottom plate covers at least part of the first bottom plate. The application provides a backlight unit, through the first back of the body frame and the second back of the body frame that range upon range of setting, can increase the local structural strength who carries the back of the body frame, avoid making the back of the body frame take place deformation because external force, keep the stability of carrying the back of the body frame module overall structure performance.

Description

Backlight module and electronic equipment

Technical Field

The application relates to the technical field of backlight of electronic equipment, in particular to a backlight module and electronic equipment.

Background

At present, with the development of science and technology, electronic equipment such as smart phones and the like are gradually becoming necessities of life of people. The backlight module is an important component of electronic equipment, and currently, the backlight module of portable electronic equipment such as a smart phone and the like generally forms an accommodating space by a back frame, or an iron frame, and then assembles other optical elements of the backlight module into the accommodating space.

In the prior art, the back frame of the backlight module is generally connected to the middle frame of the electronic device through the conductive foam to form a grounding structure. Therefore, the conductive foam needs to be compressed to a certain extent so as to ensure the conductive effect of the conductive foam. In the process of compressing the conductive foam, the back frame is easy to deform, so that the backlight module has certain functional defects.

Disclosure of Invention

An aspect of the present embodiments provides a backlight module, including a first back frame and a second back frame; the first back frame comprises a first bottom plate and a first side plate which are connected in a bending mode; the second back frame comprises a second bottom plate and a second side plate which are connected in a bending mode; the first bottom plate and the second bottom plate are arranged in a stacked mode in a first direction, the first side plate and the second side plate are arranged in a stacked mode in a second direction, and the first direction and the second direction are crossed; the end part of the first side plate, which is far away from the first bottom plate, and the end part of the second side plate, which is far away from the second bottom plate, are fixedly connected; the orthographic projection of the second bottom plate on the first bottom plate covers at least part of the first bottom plate.

Another aspect of the embodiments of the present application further provides an electronic device, where the electronic device includes a backlight module and a middle frame, and the backlight module is the backlight module described in the foregoing embodiments; the middle frame comprises a bottom frame and a side frame which are connected in a bending mode; the second back frame is located between the first back frame and the middle frame, the second bottom plate and the bottom frame are arranged at intervals, and the second side plate and the side frame are arranged at intervals.

The backlight module and the electronic equipment that this application embodiment provided, through the first back of the body frame and the second back of the body frame that range upon range of setting, can increase the local structural strength who carries the back of the body frame, avoid making the back of the body frame take place deformation owing to compress electrically conductive piece or other external forces in the assembling process, keep the stability of carrying back frame module and electronic equipment overall structure performance. In addition, the first back frame and the second back frame can be prevented from being dislocated in the assembling or using process of the backlight module by fixedly connecting the corresponding end parts of the first back frame and the second back frame.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is a schematic, exploded view of an electronic device in some embodiments of the present application;

FIG. 2 is a schematic cross-sectional view of a portion of the electronic device in the embodiment of FIG. 1;

FIG. 3 is a schematic diagram of a partial cross-sectional structure of an electronic device in accordance with further embodiments of the present application;

FIG. 4 is a schematic structural diagram of the back frame in the embodiment of FIG. 3;

FIG. 5 is a schematic cross-sectional view of a portion of an electronic device in accordance with further embodiments of the present application;

FIG. 6 is a schematic cross-sectional view of a portion of an electronic device in accordance with further embodiments of the present application;

FIG. 7 is a schematic diagram of a cross-sectional view of a portion of an electronic device in accordance with further embodiments of the present application;

fig. 8 is a schematic structural component diagram of a mobile terminal device in other embodiments of the present application.

Detailed Description

The present application will be described in further detail with reference to the following drawings and examples. It is to be noted that the following examples are only illustrative of the present application, and do not limit the scope of the present application. Likewise, the following examples are only some examples and not all examples of the present application, and all other examples obtained by a person of ordinary skill in the art without any inventive step are within the scope of the present application.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

As used herein, an "electronic device" (or simply "terminal") includes, but is not limited to, an apparatus that is configured to receive/transmit communication signals via a wireline connection, such as via a Public Switched Telephone Network (PSTN), a Digital Subscriber Line (DSL), a digital cable, a direct cable connection, and/or another data connection/network, and/or via a wireless interface (e.g., for a cellular network, a Wireless Local Area Network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and/or another communication terminal). A communication terminal arranged to communicate over a wireless interface may be referred to as a "wireless communication terminal", "wireless terminal" or "mobile terminal". Examples of mobile terminals include, but are not limited to, satellite or cellular telephones; a Personal Communications System (PCS) terminal that may combine a cellular radiotelephone with data processing, facsimile and data communications capabilities; PDAs that may include radiotelephones, pagers, internet/intranet access, Web browsers, notepads, calendars, and/or Global Positioning System (GPS) receivers; and conventional laptop and/or palmtop receivers or other electronic devices that include a radiotelephone transceiver. A cellular phone is an electronic device equipped with a cellular communication module.

Referring to fig. 1 and fig. 2, fig. 1 is a schematic diagram illustrating a structure of an electronic device 100 according to some embodiments of the present disclosure in a disassembled state, and fig. 2 is a schematic diagram illustrating a partial cross-sectional structure of the electronic device 100 according to fig. 1. The electronic device 100 may include a rear case 10, a middle frame 20, a backlight module 30, a display panel 40, and a cover plate 50. In this embodiment, the electronic device 100 may be a tablet computer, a mobile phone, an e-reader, a remote controller, a personal computer, a notebook computer, a vehicle-mounted device, a web tv, a wearable device, or the like.

Specifically, the middle frame 20 is fixedly coupled to the rear case 10. The display panel 40 is stacked on the backlight module 30, and the backlight module 30 is fixed to the middle frame 20. The backlight module 30 is used for providing backlight for the display panel 40. The display panel 40 may be a liquid crystal display panel or other display panel. The cover plate 50 is disposed over the display panel 40. The cover plate 50 may be a transparent glass cover plate, and in the non-display area, the cover plate 50 may be opaque. For example, the cover plate 50 is coated with a light-shielding ink in the non-display area. It is to be understood that other structures of the electronic device, for example, a circuit board, etc., may be disposed between the rear case 10 and the middle frame 20, and thus will not be specifically described herein since the present application is not directed to the improvement of these components. In other embodiments, the electronic device 100 may also have other structures, and the structural description of the electronic device 100 is not intended to limit the scope of the present application.

Further, the display panel 40 includes a lower polarizer 411, an array substrate 412, a color filter substrate 413, and an upper polarizer 414 sequentially disposed in the light emitting direction of the backlight module 30 along a direction away from the backlight module 30. A liquid crystal layer (not shown) is further disposed between the array substrate 412 and the color filter substrate 413. The upper polarizer 414 is adhered to the cover plate 50 via the optical adhesive layer 60, and the lower polarizer 411 is adhered to the backlight module 30 via the light-shielding tape 70. In other embodiments, the display panel 40 may have other structures, and the structural description of the display panel 40 is not intended to limit the scope of the present application.

It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present application are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.

In the present embodiment, the backlight module 30 includes a back frame 31, a light source 32, a light guide plate 33, a light uniformizing element 34 and a reflective sheet 35. The back frame 31 has a receiving space for receiving other components (such as the light source 32, the light guide plate 33, the reflective sheet 35, etc.) of the backlight module 30.

Specifically, the Light source 32 may be a plurality of LED (Light Emitting Diode) lamps arranged at intervals. The reflective sheet 35 is disposed on the bottom plate of the back frame 31 and located inside the accommodating space, and the reflective sheet 35 can reflect incident light.

The light guide plate 33 is disposed on a bottom plate of the back frame 31, specifically, on the reflective sheet 35. The light guide plate 33 includes a light incident surface 331 and a light emitting surface 332. The light source 32 is disposed on one side of the light incident surface, and the light uniformizing element 34 is disposed on the light emergent surface 332. The light incident surface 331 and the light emitting surface 332 are two substantially perpendicular surfaces of the light guide plate 33, and the reflective sheet 35 is disposed on a side of the light guide plate 33 opposite to the light emitting surface 332.

The light uniformizing assembly 34 includes a diffusion film 341, a first antireflection film 342 and a second antireflection film 343 disposed on the light emergent surface 332 in a manner of sequentially separating from each other.

The diffusion film 341, the first antireflection film 342, and the second antireflection film 343 may be non-composite films, that is, film layers independent of each other. In addition, the diffusion film 341, the first antireflection film 342, and the second antireflection film 343 may be composite films. The method specifically comprises two conditions:

in the first case, the first antireflection film 342 and the second antireflection film 343 are composite films, that is, the first antireflection film 342 and the second antireflection film 343 are provided as an integral film layer, and the integral film layer and the diffusion film 341 are independent from each other.

In the second case, the diffusion film 341, the first antireflection film 342, and the second antireflection film 343 are composite films, that is, the diffusion film 341, the first antireflection film 342, and the second antireflection film 343 are provided as an integral film layer.

The first antireflection film 342 may be referred to as a lower antireflection film, and the second antireflection film 343 may be referred to as an upper antireflection film. The upper antireflection film can be an upper prism, and the lower antireflection film can be a lower prism.

In the present embodiment, the light-shielding tape 70 is a light-shielding tape having adhesiveness on both surfaces. One end of the light shielding tape 70 is further extended from the upper side of the light source 32 to the direction of the light uniformizing assembly 34 and then disposed on the second antireflection film 343. The other end of the masking tape 70 may be attached to the light source 32. The region where the light shielding tape 70 is disposed is a non-display region, and the region outside the light shielding tape 70 is a display region.

In other embodiments, the other end of the masking tape 70 may be attached to a side panel of the back frame 31. The light sources 32 are covered with adhesive tape, thereby increasing the adhesive area.

In the present embodiment, the back frame 31 of the backlight module 30 is connected to the middle frame 20 to position the backlight module 30. The electronic device 100 may further include a conductive member 80, and the back frame 31 is connected to the middle frame 20 through the conductive member 80 to ground the back frame module 30 and the middle frame 20.

The conductive member 80 may be a conductive foam. The conductive element 80 includes a first surface 801 and a second surface 802 opposite to each other, the first surface 801 of the conductive element 80 is adhered to the middle frame 20, and the second surface 802 abuts against the back frame 31.

In the actual assembly process of the electronic device 100, first, the middle frame 20 is provided, the conductive member 80 is bonded and fixed at the corresponding position of the middle frame 20, then the back frame 31 of the backlight module 30 is pressed on the conductive member 80, the display panel 40 is then placed on the backlight module 30, the cover plate 50 is covered on the display panel 40, and the cover plate 50 and the middle frame 20 are fixedly connected. At this time, in the process of fixing the cover plate 50, the conductive member 80 is compressed, so that the electronic device 100 has a stable structure, and the compression ratio of the conductive member 80 is maintained at about 50%, thereby ensuring that the conductive member 80 has a good conductive effect.

It can be understood that, taking the thickness of the conductive element 80 as 0.6mm and the compression ratio of the conductive element 80 as 50%, after the electronic device 100 is assembled, the distance H between the back frame 31 and the middle frame 20 of the backlight module 30 is approximately 0.3 mm.

In the embodiment of the present application, the material of the back frame 31 may be a metal alloy material, such as stainless steel, aluminum alloy, and the like. The back frame 31 made of an aluminum alloy material has a lighter weight and a better heat dissipation performance than the back frame 31 made of a stainless material, and therefore, in the embodiment of the present application, the back frame 31 is preferably made of an aluminum alloy material.

It can be understood that, when the back frame 31 is made of aluminum alloy, the weight of the backlight module 30 can be reduced, and the heat dissipation performance of the backlight module 30 can be greatly improved, so that the graphite sheet attached to the backlight module 30 in the general technical scheme can be omitted, and the structural cost can be further reduced.

Referring to fig. 3, fig. 3 is a schematic cross-sectional view of a portion of an electronic device 100 according to another embodiment of the present application, where the electronic device 100 in this embodiment is different from the electronic device 100 in the previous embodiment in that: the back frame 31 is different in structure.

The back frame 31 may include a first back frame 311 and a second back frame 312 stacked together, so as to enhance the overall structural strength of the back frame 31, and avoid the risk of delamination or light leakage between the back frame 31 and the display panel 40 due to deformation of the back frame 31 in the process of compressing the conductive member 80 or due to external force. The second back frame 312 is disposed between the first back frame 311 and the middle frame 20, and the second back frame 312 and the middle frame 20 are disposed at an interval, wherein the second back frame 312 and the middle frame 20 can be connected through the conductive member 80.

It should be noted that the terms "first" and "second" in the embodiments of the present application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature.

Referring to fig. 4, fig. 4 is a schematic structural diagram of the back frame 31 in the embodiment of fig. 3. The first back frame 311 may include a first bottom plate 3111 and a first side plate 3112 connected by bending, and the second back frame 312 may include a second bottom plate 3121 and a second side plate 3122 connected by bending. Wherein the first bottom panel 3111 and the second bottom panel 3121 are stacked in a first direction and the first side panel 3112 and the second side panel 3122 are stacked in a second direction.

It is understood that the first direction may be a thickness direction of the electronic device 100, i.e., a Z direction as shown in fig. 4. The second direction may be a planar extending direction perpendicular to the thickness direction of the electronic device 100, that is, the second direction may be an extending direction parallel to a plane where the display surface of the electronic device 100 is located. In the present embodiment, the second direction is exemplified by the X direction shown in fig. 4. Wherein the first direction and the second direction intersect.

Further, the bending angle of the first bottom plate 3111 and the first side plate 3112 may be 60 ° to 120 °, for example, 60 °, 90 °, 120 °. The bending angles of the second bottom plate 3121 and the second side plate 3122 may be 60 ° to 120 °, for example, 60 °, 90 °, 120 °. In this embodiment, the bending angles of the first bottom plate 3111 and the first side plate 3112 and the second bottom plate 3121 and the second side plate 3122 may be the same or different.

Preferably, the bending angle of the first bottom plate 3111 and the first side plate 3112 is 90 °, and the bending angle of the second bottom plate 3121 and the second side plate 3122 is 90 °, that is, the first bottom plate 3111 and the first side plate 3112 are perpendicularly bent and connected, and the second bottom plate 3121 and the second side plate 3122 are perpendicularly bent and connected. At this time, the first direction and the second direction are perpendicular.

In this embodiment, an end of the first side plate 3112 departing from the first bottom plate 3111 and an end of the second side plate 3122 departing from the second bottom plate 3121 are fixedly connected to avoid a misalignment phenomenon occurring during the process of compressing the conductive members 80 of the first back frame 311 and the second back frame 312. The corresponding ends of the first side plate 3112 and the second side plate 3122 may be fixed by bonding, welding, screwing, or the like.

Preferably, the first back frame 311 and the second back frame 312 may be an integrally formed structure, that is, the back frame 31 is joined at its side to form the first back frame 311 and the second back frame 312. In other words, the end of the first side plate 3112 away from the first bottom plate 3111 is folded back to form the second back frame 312, and the second back frame 312 and the first back frame 311 are stacked. It is understood that the first back frame 311 may be understood as an inner layer of the back frame 31 and the second back frame 312 may be understood as an outer layer of the back frame 31. The first bottom plate 3111 and the first side plate 3112 of the first back frame 311 enclose a receiving space for receiving other components (e.g., the light source 32, the light guide plate 33, the reflective sheet 35, etc.) of the backlight module 30. The second bottom plate 3121 and the second side plate 3122 of the second back frame 312 are respectively located at a side of the first back frame 311 departing from the receiving space thereof.

Further, the orthographic projection of the second bottom plate 3121 onto the first bottom plate 3111 covers at least a portion of the first bottom plate 3111. That is, in some embodiments, the first bottom panel 3111 and the second bottom panel 3121 are completely overlapped, i.e., equally large, in the stacking direction of the first bottom panel 3111 and the second bottom panel 3121.

In this embodiment, since the second bottom plate 3121 is connected to the middle frame 20 through the conductive member 80, a front projection of the conductive member 80 projected on the first bottom plate 3111 generally covers a portion of the first bottom plate 3111. Therefore, the front projection of the second bottom plate 3121 projected on the first bottom plate 3111 covers a portion of the first bottom plate 3111, and completely covers the front projection of the conductive member 80 projected on the first bottom plate 3111. Through above-mentioned structural setting, can avoid causing the waste of material on the one hand, on the other hand can increase the local structural strength of back frame 31, avoids taking place deformation at the in-process of compressing electrically conductive 80.

The conductive member 80 may be a conductive foam. The conductive member 80 includes a first surface 801 and a second surface 802 that are opposite to each other, and the first surface 801 and the second surface 802 are substantially parallel to the plane of the second bottom plate 3121. Further, the first surface 801 of the conductive member 80 and the middle frame 20 are adhesively fixed, and the second surface 802 abuts against the second bottom plate 3121.

The backlight module that this application embodiment provided, through the first back of the body frame and the second back of the body frame that range upon range of setting, can increase the local structural strength of back of the body frame, avoid taking place deformation because compression electrically conductive piece in assembling process, keep overall structure performance's stability. In addition, the first back frame and the second back frame can be prevented from being dislocated in the assembling process of the backlight module by fixedly connecting the corresponding end parts of the first back frame and the second back frame.

Further, as previously described, the spacing H between the first bottom plate 3111 of the first back frame 311 and the middle frame is maintained constant at 0.3mm, while the spacing H between the second bottom plate 3121 of the second back frame 312 and the middle frame is significantly smaller than H. Taking the thickness of the second bottom plate 3121 as 0.1mm as an example, the corresponding relationship between the distance H and the distance H is: h +0.1mm, i.e. H0.2 mm. At this time, if the thickness of the conductive member 80 is still maintained at 0.6mm, the compression ratio of the conductive member 80 is approximately 67%.

Based on this, in the embodiment of the present application, in order to maintain the compression ratio of the conductive device 80 at about 50%, the thickness of the conductive device 80 may be reduced. Referring to the above-described exemplary data, it can be seen that when the second bottom plate 3121 and the first bottom plate 3111 are stacked, the thickness of the conductive member 80 is 0.4mm, which can maintain the compression ratio of the conductive member 80 at about 50%.

It can be understood that, in order to maintain the compression ratio of the conductive member 80 at about 50%, the initial thickness of the conductive member 80 is approximately twice the distance h between the second bottom plate 3121 and the middle frame 20. Of course, in other embodiments, when the compression ratio of the conductive member 80 is required to be greater than 50%, the initial thickness of the conductive member 80 is greater than twice the distance h between the second bottom plate 3121 and the middle frame 20.

Of course, in other embodiments, the compression ratio of the conductive member 80 can be maintained at about 50% by changing the structure of the middle frame 20 without reducing the thickness of the conductive member 80.

Referring to fig. 5, fig. 5 is a schematic cross-sectional view of a portion of an electronic device 100 in another embodiment of the present application, where the electronic device 100 in this embodiment is different from the electronic device 100 in the embodiment of fig. 3 in that: the structure of the middle frame 20 is different.

The middle frame 20 generally includes a bottom frame 210 and a side frame 220 connected by bending, wherein the bending angle of the bottom frame 210 and the side frame 220 may be 60 ° to 120 °, for example, 60 °, 90 °, 120 °. Further, the bottom frame 210 and the side frame 220 may be enclosed to form an accommodating space, and the backlight module 30 is disposed in the accommodating space. The second back frame 312 is located between the first back frame 311 and the middle frame 20, and the second back frame 312 and the middle frame 20 are spaced apart from each other.

Specifically, the bottom frame 210 is disposed corresponding to the second bottom plate 3121 of the second back frame 312, and is spaced apart from the second bottom plate 3121. The side frame 220 is disposed corresponding to the second side plate 3122 of the second back frame 312 and spaced apart from the second side plate 3122. Wherein, the second bottom plate 3121 and the bottom frame 210 are fixedly connected through the conductive member 80.

Further, the conductive member 80 is located between the second bottom plate 3121 and the bottom frame 210, so that the second bottom plate 3121 and the bottom frame 210 are disposed with a gap therebetween. The bottom frame 210 has a first recess 211 corresponding to the second bottom plate 3121, and the conductive member 80 is partially received in the first recess 211. Preferably, the conductive member 80 is adhesively fixed to the bottom wall of the first recess 211, and a side of the conductive member 80 facing away from the bottom wall of the first recess 211 abuts against the second bottom plate 3121.

As mentioned above, the distance H between the first bottom plate 3111 of the first back frame 311 and the middle frame is maintained to be 0.3mm, and the compression ratio of the conductive member 80 needs to be maintained to be about 50% without changing the thickness of the conductive member 80. Based on this, the depth of the first recess 211 is substantially uniform with the thickness of the second bottom plate 3121. In other words, the interval H between the second bottom plate 3121 and the bottom wall of the first groove 211 is substantially the same as the interval H. I.e., the initial thickness of the conductive member 80 is approximately twice the spacing h between the second bottom plate 3121 and the bottom wall of the first recess 211. Of course, in other embodiments, when the compression ratio of the conductive member 80 is required to be greater than 50%, the initial thickness of the conductive member 80 is greater than twice the distance h between the second bottom plate 3121 and the bottom wall of the first groove.

According to the backlight module provided by the embodiment of the application, the first groove is formed in the bottom frame of the middle frame, the depth of the first groove is consistent with the thickness of the second bottom plate, and therefore the compression ratio of the conductive piece can be maintained at about 50% on the premise that the thickness of the conductive piece is not changed. In addition, the first groove is formed in the bottom frame of the middle frame, so that the thickness of the bottom frame can be prevented from being increased when the distance H between the second bottom plate and the bottom wall of the first groove is kept to be the same as the distance H, and the overall thickness of the electronic equipment is further influenced.

Referring to fig. 6, fig. 6 is a schematic cross-sectional view of a portion of an electronic device 100 in another embodiment of the present application, where the electronic device 100 in this embodiment is different from the electronic device 100 in the embodiment of fig. 5 in that: the structure of the middle frame 20 is different.

The applicant found in the research that, in the structural arrangement of a general electronic device, in order to enhance the overall structural compactness, the space between the side frames 220 of the middle frame 20 and the side portions of the back frame 31 is limited. This is to prevent interference between the second side plate 3122 of the second back frame 312 and the side frame 220 of the middle frame 20 during the actual assembly of the backlight assembly 30.

Therefore, in the present embodiment, the side frame 220 is provided with the second groove 222 corresponding to the second side plate 3122, and the opening direction of the second groove 222 faces the second side wall 3122, so as to avoid the interference with the side frame 220 in the process of assembling the backlight module 30.

It will be appreciated that the bottom wall of the second groove 222 may be arcuate or planar. In the present embodiment, the bottom wall of the second groove 222 is an arc-shaped surface to avoid great influence on the structural strength of the side frame 220. The depth of the second groove 222 is approximately the same as the thickness of the second side plate 3122.

The backlight module that this application embodiment provided sets up the second recess through the side frame at the center to can dodge the back of the body frame at the in-process of assembly backlight module, avoid taking place the interference phenomenon with the side frame.

Referring to fig. 7, fig. 7 is a schematic cross-sectional view of a portion of an electronic device 100 in another embodiment of the present application, where the electronic device 100 in this embodiment is different from the electronic device 100 in the embodiment of fig. 6 in that: the back frame 31 is different in structure.

The back frame 31 may further include a third back frame 313, and the third back frame 313 and the first and second back frames 311 and 312 are stacked. Specifically, the third back frame 313 and the second bottom plate 3121 are disposed substantially in parallel and are located at a side of the second bottom plate 3121 facing away from the first bottom plate 3111. That is, the third back frame 313 is substantially sheet-shaped and is attached to the side of the second bottom plate 3121 away from the first bottom plate 3111 to further enhance the overall structural strength of the back frame 31.

The front projection of the third back frame 313 projected on the second bottom plate 3121 completely covers the front projection of the conductive member 80 projected on the second bottom plate 3121.

It is understood that the material of the third back frame 313 may be the same as or different from the material of the first back frame 311 and the second back frame 312. For example, the third back frame 313 may be made of a metal alloy material such as stainless steel or aluminum alloy, or another material having high thermal and electrical conductivity.

Of course, in other embodiments, the third back frame 313 may also be disposed between the first bottom plate 3111 and the second bottom plate 3121, or on a side of the first bottom plate 3111 facing away from the second bottom plate 3121.

The backlight module that this application embodiment provided further strengthens the local structural strength of back of the body frame through setting up the third back of the body frame, avoids taking place deformation owing to compress electrically conductive piece in the assembling process, keeps the stability of overall structure performance. In addition, the third back frame can also be made of a material with high heat conduction and electric conduction performance so as to further improve the heat dissipation performance and the electric conduction performance of the back frame.

In addition, an embodiment of the present application further provides a mobile terminal device, please refer to fig. 8, where fig. 8 is a schematic diagram illustrating a structural composition of a mobile terminal device 900 in another embodiment of the present application, where the mobile terminal device 900 may be a mobile phone, a tablet computer, a notebook computer, a wearable device, and the like, and the mobile phone is taken as an example in the embodiment of the present application. The structure of the mobile terminal apparatus 900 may generally include an RF circuit 910, a memory 920, an input unit 930, a display unit 940 (i.e., the display panel 40 in the above-described embodiment), a sensor 950, an audio circuit 960, a wifi module 970, a processor 980, a power supply 990, and the like. Wherein the RF circuit 910, the memory 920, the input unit 930, the display unit 940, the sensor 950, the audio circuit 960, and the wifi module 970 are respectively connected with the processor 980; the power supply 990 serves to supply power to the entire mobile terminal apparatus 900.

Specifically, the RF circuit 910 is used for transmitting and receiving signals; the memory 920 is used for storing data instruction information; the input unit 930 is used for inputting information, and may specifically include a touch panel 931 and other input devices 932 such as operation keys; the display unit 940 may include a display panel 941 (i.e., the display panel 40 in the above embodiment), and the like; the sensor 950 includes an infrared sensor, a laser sensor, etc. for detecting a user approach signal, a distance signal, etc.; a speaker 961 and a microphone 962 are connected to the processor 980 through the audio circuit 960 for emitting and receiving sound signals; the wifi module 970 is used for receiving and transmitting wifi signals, and the processor 980 is used for processing data information of the mobile terminal device. With regard to the related technical features of the display panel, please refer to the related description of the above embodiments of the display panel, and detailed description thereof will not be provided herein.

It is noted that the terms "comprises" and "comprising," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.

The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.

Claims

1. A backlight module is characterized in that the backlight module comprises:

the first back frame comprises a first bottom plate and a first side plate which are connected in a bent mode;

the second back frame comprises a second bottom plate and a second side plate which are connected in a bent mode;

the first bottom plate and the second bottom plate are arranged in a stacked mode in a first direction, the first side plate and the second side plate are arranged in a stacked mode in a second direction, and the first direction and the second direction are crossed; the end part of the first side plate, which is far away from the first bottom plate, and the end part of the second side plate, which is far away from the second bottom plate, are fixedly connected; the orthographic projection of the second bottom plate on the first bottom plate covers at least part of the first bottom plate.

2. The backlight module as claimed in claim 1, wherein the first bottom plate and the first side plate of the first back frame enclose to form an accommodating space; the backlight module further comprises a light source and a light guide plate, and the light source and the light guide plate are contained in the containing space.

3. A backlight module according to claim 1, wherein the first back frame and the second back frame are integrally formed.

4. The backlight module as claimed in claim 1, wherein the first back frame and the second back frame are made of aluminum alloy.

5. An electronic device, characterized in that the electronic device comprises:

a backlight module according to any one of claims 1-4;

the middle frame comprises a bottom frame and a side frame which are connected in a bending mode;

the second back frame is located between the first back frame and the middle frame, the second bottom plate and the bottom frame are arranged at intervals, and the second side plate and the side frame are arranged at intervals.

6. The electronic device according to claim 5, further comprising a conductive member, wherein the second bottom plate and the bottom frame are connected by the conductive member, so that a gap is formed between the second bottom plate and the bottom frame.

7. The electronic device of claim 6, wherein the initial thickness of the conductive member is not less than twice the spacing between the second bottom plate and the bottom frame.

8. The electronic device of claim 6, wherein the bottom frame is provided with a first groove corresponding to the second bottom plate, and the conductive member is provided at a bottom wall of the first groove.

9. The electronic device of claim 8, wherein a thickness of the second substrate is consistent with a depth of the first recess.

10. The electronic device according to claim 6, wherein the side frame is provided with a second groove corresponding to the second side plate, and an opening direction of the second groove faces the second side plate.

11. The electronic device according to any of claims 6-10, wherein the conductive member is a conductive foam.