CN112965294B

CN112965294B - Backlight module and electronic equipment

Info

Publication number: CN112965294B
Application number: CN202110227627.0A
Authority: CN
Inventors: 胡广跃; 何晓克; 唐建业
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2021-03-01
Filing date: 2021-03-01
Publication date: 2023-06-30
Anticipated expiration: 2041-03-01
Also published as: CN112965294A

Abstract

The application provides a backlight module, which comprises a light guide plate, a light source, a light homogenizing component, a circuit board and a shading component; the light guide plate comprises a light incident surface and a light emergent surface; the light source is arranged on one side of the light incident surface; the light homogenizing component is arranged on the light emitting surface of the light guide plate; the circuit board is arranged on the light source and is arranged at intervals with the light homogenizing component; the shading component is partially arranged between the light homogenizing component and the light guide plate; the shading component extends from the light homogenizing component to the direction of the circuit board and covers one side of the circuit board, which is close to the light homogenizing component. The backlight module provided by the embodiment of the application is characterized in that the partial shading component is arranged between the light homogenizing component and the light guide plate, and the shading component covers one side of the circuit board, which is close to the light homogenizing component, so that light leaking from the light source and the wedge of the light guide plate can be completely blocked, and the display effect is improved.

Description

Backlight module and electronic equipment

Technical Field

The application relates to the technical field of electronic equipment backlight, in particular to a backlight module and electronic equipment.

Background

At present, with the development of scientific technology, electronic devices such as smart phones are becoming necessities for people to live. The backlight module is an important component of electronic equipment, and currently, a side-in type backlight module is generally adopted in the backlight module of portable electronic equipment such as a smart phone, namely, light emitted by a light source is emitted into a light guide plate from the side edge of the light guide plate, and is guided by the light guide plate to provide backlight for a display panel of the electronic equipment.

Disclosure of Invention

In one aspect, a backlight module is provided and includes a light guide plate, a light source, a light homogenizing component, a circuit board and a shading component; the light guide plate comprises a light incident surface and a light emergent surface; the light source is arranged on one side of the light incident surface; the light homogenizing component is arranged on the light emitting surface of the light guide plate; the circuit board is arranged on the light source and is arranged at intervals with the light homogenizing component; the shading component is partially arranged between the light homogenizing component and the light guide plate; the shading component extends from the dodging component to the direction of the circuit board and covers one side, close to the dodging component, of the circuit board so as to prevent light rays emitted by the light source from leaking from a gap between the dodging component and the circuit board.

The embodiment of the invention provides an electronic device, which comprises a display panel and the backlight module in the previous embodiment, wherein the display panel and the backlight module are stacked, and the display panel is arranged on one side of the light homogenizing component, which is away from the light guide plate.

The backlight module and the electronic equipment provided by the embodiment of the application are characterized in that the partial shading component is arranged between the dodging component and the light guide plate, the shading component extends from the dodging component to the direction of the circuit board, and the shading component is further arranged on one side of the circuit board, which is close to the dodging component, so that light leaking from the light source and the wedge of the light guide plate can be completely blocked, light beams formed in the dodging component can be prevented from entering, and the display effect and the reliability of products are improved. Simultaneously, can make backlight unit's frame width further reduce to this promotes screen ratio, and then promotes the product expressive force.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of an electronic device in some embodiments of the present application;

FIG. 2 is a schematic diagram of a structural separation of the electronic device in the embodiment of FIG. 1;

FIG. 3 is a schematic diagram of a partial cross-sectional structure of a backlight module according to some embodiments of the present application;

FIG. 4 is a schematic view of a portion of a cross-sectional structure of a backlight module according to other embodiments of the present application;

FIG. 5 is a schematic layout of the first shading member in the embodiment of FIG. 4;

FIG. 6 is a schematic diagram of a layout structure of a second light shielding member in the embodiment of FIG. 4;

FIG. 7 is a schematic view of a portion of a cross-sectional structure of a backlight module according to other embodiments of the present application;

FIG. 8 is a schematic view of a partial enlarged structure of the area A in the embodiment of FIG. 7;

FIG. 9 is a schematic view of the third shade and guard of the embodiment of FIG. 7 when not assembled;

fig. 10 is a schematic structural diagram of a mobile terminal device according to other embodiments of the present application.

Detailed Description

The present application is described in further detail below with reference to the drawings and examples. It is specifically noted that the following examples are only for illustration of the present application, but do not limit the scope of the present application. Likewise, the following embodiments are only some, but not all, of the embodiments of the present application, and all other embodiments obtained by one of ordinary skill in the art without inventive effort are within the scope of the present application.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the present application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.

As used herein, an "electronic device" (or simply "terminal") includes, but is not limited to, a device configured to receive/transmit communication signals via a wireline connection, such as via a public-switched telephone network (PSTN), a Digital Subscriber Line (DSL), a digital cable, a direct cable connection, and/or another data connection/network, and/or via a wireless interface, such as for example, for a cellular network, a Wireless Local Area Network (WLAN), a digital television network, such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and/or another communication terminal. A communication terminal configured to communicate through a wireless interface may be referred to as a "wireless communication terminal", "wireless terminal", or "mobile terminal". Examples of mobile terminals include, but are not limited to, satellites or cellular telephones; a Personal Communications System (PCS) terminal that may combine a cellular radiotelephone with data processing, facsimile and data communications capabilities; a PDA that can include a radiotelephone, pager, internet/intranet access, web browser, organizer, calendar, and/or a Global Positioning System (GPS) receiver; and conventional laptop and/or palmtop receivers or other electronic devices that include a radiotelephone transceiver. The mobile phone is the electronic equipment provided with the cellular communication module.

It should be noted that, when a portable electronic device such as a smart phone pursues a narrow bezel or a full screen, some non-optical elements, that is, elements that do not substantially participate in light emission and transmission of light, are generally omitted, for example, elements that are only used as separate light shielding functions are removed, so that space of the elements can be saved, and further, the narrow bezel or the full screen is designed. For example, in a backlight module of a portable electronic device such as a smart phone, a light shielding element disposed on a light guide plate and located on a side surface of a light homogenizing component may be removed. However, the light leakage problem will occur when the light shielding function is removed, which ultimately affects the user experience. The embodiments of the present application will provide some technical solutions for backlight modules and electronic devices to solve the above problems.

Referring to fig. 1 and fig. 2, fig. 1 is a schematic structural diagram of an electronic device 100 according to some embodiments of the present application, and fig. 2 is a schematic structural exploded view of the electronic device 100 according to the embodiment of fig. 1. The electronic device 100 may include a rear case 10, a middle frame 20, a backlight module 30, a display panel 40, and a cover 50. The electronic device 100 may be a tablet computer, a mobile phone, an electronic reader, a remote controller, a personal computer, a notebook computer, a vehicle-mounted device, a network television, a wearable device, etc.

Specifically, the center 20 is fixedly connected to the rear case 10. The display panel 40 and the backlight module 30 are stacked, and the backlight module 30 is fixed to the middle frame 20. The backlight module 30 is used for providing backlight for the display panel 40. The display panel 40 may be a liquid crystal display panel or other display panel. The cover plate 50 is disposed on the display panel 40. The cover 50 may be a transparent glass cover, and in the non-display area, the cover 50 may be opaque. For example, the cover plate 50 is coated with light shielding ink in the non-display area. It should be understood that other structures of the electronic device, such as a circuit board, etc., may be provided between the rear case 10 and the center frame 20, and as the present application does not relate to improvements to these components, no specific description is made herein. In other embodiments, the electronic device 100 may also have other structures, and the description of the structure of the electronic device 100 is not limited to the protection scope of the present application.

The electronic device 100 may generally include a display area 101 and a non-display area 102, where the non-display area 102 is generally disposed around an edge of the display area 101. It can be appreciated that the non-display area 102 of the electronic device 100 generally does not have a display function, and the width of the non-display area 102 is related to whether the electronic device 100 can achieve the ultra-narrow bezel effect.

It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present application are merely used to explain the relative positional relationship, movement conditions, and the like between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is correspondingly changed.

In this embodiment, referring to fig. 3 in combination, fig. 3 is a schematic view of a partial cross-sectional structure of a backlight module 30 according to some embodiments of the present application, and the backlight module 30 may include a back frame 31, a reflective sheet 32, a light guide plate 33, a light homogenizing component 34, a light source 35, a circuit board 36 and a shading component. The back frame 31 is a box-shaped structure with an opening on one side, the back frame 31 includes a bottom wall 311 and a side wall 312, the bottom wall 311 is connected with the side wall 312 in a bending manner, and the bottom wall 311 and the side wall 312 enclose a receiving cavity. The back frame 31 may be made of metal, such as iron, aluminum, or plastic. In the present embodiment, the back frame 31 of the backlight module 30 is connected to the middle frame 20 to position the backlight module 30.

The reflective sheet 32 is disposed on the bottom wall 111 of the back frame 11 and is located inside the accommodating cavity. The reflective sheet 12 may reflect incident light.

The light guide plate 33 is disposed on the reflective plate 32 and located inside the accommodating cavity. The light guide plate 33 may include a light incident end portion 331 and a light guide plate main body portion 332, the light incident end portion 331 being provided with a light incident surface 333, and the light guide plate main body portion 332 being provided with a light emitting surface 334. The thickness of the light incident end 331 is greater than that of the light guide plate main body 332, and the thickness of the light incident end 331 gradually decreases from the light incident surface 333 to the direction away from the light incident surface 333, and the thickness of the light guide plate main body 332 is uniform, i.e. the thickness is equal everywhere. Of course, in other embodiments, the thickness of the light-entering end 331 may be equal to the thickness of the light-guiding plate body 332, and the thickness of the light-entering end 331 is uniform, i.e. the thickness is equal at the light-entering end 331. The light incident surface 333 and the light emergent surface 334 are two surfaces of the light guide plate 33 that are substantially perpendicular to each other. The light emitting surface 334 of the light guide plate 33 is located at a side of the light guide plate 33 opposite to the reflective sheet 32.

The light source 35 is disposed on the light incident surface 333 side and on the area of the emission sheet 32 not covered by the light guide plate 33. The light source 35 may be an LED (Light Emitting Diode ) lamp.

The light-homogenizing element 34 is disposed on the light-emitting surface 334 of the light guide plate 33, and one end of the light-homogenizing element 34, which is close to the light-entering surface 333, is located in the non-display area 102. The display panel 40 is disposed on a side of the light homogenizing component 34 facing away from the light guide plate 33.

The light homogenizing component 34 includes a diffusion film 341, a first antireflection film 342, and a second antireflection film 343, which are sequentially disposed on the light emitting surface 334 in a spaced apart manner.

The diffusion film 341, the first anti-reflection film 342, and the second anti-reflection film 343 may be non-composite films, i.e., independent films from each other. In addition, the diffusion film 341, the first antireflection film 342, and the second antireflection film 343 may be a composite film. Specifically, two cases are included:

in the first case, the first antireflection film 342 and the second antireflection film 343 are composite films, that is, the first antireflection film 342 and the second antireflection film 343 are provided as an integral film layer, and the integral film layer and the diffusion film 341 are independent film layers from each other.

In the second case, the diffusion film 341, the first antireflection film 342, and the second antireflection film 343 are composite films, that is, the diffusion film 341, the first antireflection film 342, and the second antireflection film 343 are provided as an integral film layer.

The first anti-reflection film 342 may be referred to as a lower anti-reflection film, and the second anti-reflection film 343 may be referred to as an upper anti-reflection film. The upper antireflection film may be an upper prism, and the lower antireflection film may be a lower prism.

A circuit board 36 is provided on the light source 35 and electrically connected to the light source 35 to transmit an externally provided control signal to the light source 35. Wherein the circuit board 36 may be a flexible circuit board. Further, the circuit board 36 is spaced apart from the light homogenizing component 34 with a gap therebetween. The gap is used for matching assembly errors on one hand, and on the other hand, the backlight module can still be normally used under the condition of cold and hot deformation to a certain extent.

The light emitted by the light source 35 is incident into the light incident end 331 of the light guide plate 33 from the light incident surface 333 of the light guide plate 33, the light incident end 331 guides the light into the light guide plate main body 332 by using the wedge-shaped structure, the light guided by the light guide plate main body 332 is transmitted to the light homogenizing component 34 after being spread over the whole light guide plate main body 332, and the light homogenizing component 34 performs treatments such as diffusion, condensation and brightness enhancement on the incident light to be output as a backlight module. Wherein, part of the light leaked from the side surface of the light guide plate 33 away from the light emergent surface 334 is reflected back into the light guide plate 33 by the reflecting sheet 32.

In this embodiment, the backlight module 30 further includes an inner frame 38 and an outer frame (not shown). The outer frame is disposed on a side (left side in fig. 3) of the circuit board 36 away from the light homogenizing module 34, and can be used to fixedly connect the backlight module 30 with the middle frame 20. The inner frame 38 may be integrally formed with the outer frame. The inner frame 38 is disposed in the accommodating cavity of the back frame 31, and is disposed at a side of the light source 35 away from the light incident surface 333, for supporting the circuit board 36. The outer frame is located outside the accommodating cavity of the back frame 31. Both the inner frame 38 and the outer frame may be made of metal, such as iron, aluminum, or plastic.

The circuit board 36 can be adhered and fixed with the inner frame 38 and the light guide plate 33 respectively through colloid. For example, one end of the circuit board 36 may be adhesively fixed by the first adhesive 301 and the inner frame 38, and the other end of the circuit board 36 may be adhesively fixed by the second adhesive 302 and the light guide plate 33. The first colloid 301 and the second colloid 302 may be double-sided adhesive tapes. Further, the first glue 301 completely covers the end of the inner frame 38 facing away from the bottom wall 111, so as to ensure the reliability of the adhesion between the circuit board 36 and the inner frame 38. The second glue 302 is disposed between the circuit board 36 and the light guide plate 33, and in order to ensure the reliability of the adhesion between the circuit board 36 and the light guide plate 33, to prevent light leakage caused by tilting of the circuit board 36, the adhesion width W1 of the second glue 302 is generally not less than 0.7mm. More specifically, the second encapsulant 302 is disposed between the circuit board 36 and the light incident end 331 of the light guide plate 33.

It will be appreciated that light output from the backlight module will be displayed in the display area to form the desired image. In order to pursue a high screen ratio, i.e. a wide screen or even a full screen design, a very demanding limitation is put on the design width of the non-display area, and the design of the narrow bezel usually removes some elements which are not essential for the emission and transmission of light, such as some elements which only play a role in shading. This easily causes light leakage in the non-display area. In this regard, the light shielding component is disposed in the non-display area in the present embodiment to avoid the problem of light leakage.

The light shielding assembly may include a light shielding tape 370, where the light shielding tape 370 is disposed on a side of the circuit board 36 facing away from the light source 35 and extends from the circuit board 36 to a side of the light homogenizing assembly 34 facing away from the light guide plate 33. The end of the light shielding tape 370 away from the circuit board 36 is overlapped with the second anti-reflection film 343 of the light homogenizing component 34. In this embodiment, the light shielding tape 370 is a light shielding tape having adhesive on both sides. One end of the light shielding tape 370 further extends from the upper direction of the light source 35 to the direction of the light homogenizing component 34 and is then disposed on the second antireflection film 343. The other end of the masking tape 370 may be attached to the end of the circuit board 36 facing away from the light homogenizing assembly 34. The area where the light shielding tape 370 is disposed is a non-display area, and the area outside the light shielding tape 370 is a display area. In other embodiments, the other end of the masking tape 370 may meet the sidewall 312 of the back frame 31, thereby increasing the bonding area.

Because there is a gap between the circuit board 36 and the light homogenizing component 34, the light emitted by the light source 35 can leak out of the gap, and in order to solve the technical problem, the light shielding component in the embodiment of the application may further include a first light shielding sheet 371 and a second light shielding sheet 372. It should be noted that the terms "first," "second," and "second" in embodiments of the present application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or as implying any particular order of magnitude of the features being indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature.

The first light shielding sheet 371 is disposed between the diffusion film 341 and the light guiding plate 33 to shield the light leaking from the front surface of the light guiding plate 33, so as to prevent the light from entering the light beam phenomenon caused by the structure of the light homogenizing component 34. The first light shielding film 371 and the diffusion film 341 extend to the gap between the circuit board 36 and the light homogenizing component 34 synchronously, so as to provide a bearing for the second light shielding film 372. That is, the side of the diffusion film 341 near the circuit board 36 is protruded compared to the first anti-reflection film 342 and/or the second anti-reflection film 343.

The second light shielding sheet 372 is disposed between the diffusion film 341 and the light shielding tape 370 to block light emitted from the light source 35 from leaking out of the wedge-shaped surface of the light guide plate 33 and the side of the circuit board 36. In the present embodiment, the first light shielding sheet 371 and the second light shielding sheet 372 may be made of a light-impermeable sheet resin material. For example, the first light shielding sheet 371 and the second light shielding sheet 372 may each be a black PET sheet. The width W2 of the second light shielding sheet 372 can be only 0.4mm at the minimum due to the limitation of the cutting technology capability, that is, the width W2 of the second light shielding sheet 372 is generally not less than 0.4mm.

Meanwhile, in order to prevent the assembly interference and the expansion amount required during the film material environment reliability test, the first light shielding film 371, the second light shielding film 372, the diffusion film 341 and the circuit board 36 have assembly gaps, namely a first gap D1, and the second light shielding film 372, the first anti-reflection film 342 and the second anti-reflection film 343 have assembly gaps, namely a second gap D2. Wherein the width of the first gap D1 is approximately 0.1-0.2mm, and the width of the second gap D2 is approximately 0.1-0.2mm.

It can be understood that whether the non-display area 102, i.e., the frame, of the electronic device 100 can achieve the ultra-narrow frame effect is mainly limited by the bonding width W1 of the second colloid 302, the width W2 of the second light shielding sheet 372, the first gap D1, and the second gap D2 on the premise of avoiding light leakage. As mentioned above, the sum of W1, W2, D1 and D2 is approximately in the range of 1.3-1.5 mm.

Referring to fig. 4, fig. 4 is a schematic cross-sectional view of a portion of a backlight module 60 according to another embodiment of the present application, where the backlight module 60 may include a back frame 31, a reflective sheet 32, a light guide plate 33, a light homogenizing component 34, a light source 35, a circuit board 36 and a shading component. The difference between this embodiment and the embodiment of fig. 3 is that: the structure of the shade assembly is different.

In the present embodiment, the light shielding component is partially disposed between the light homogenizing component 34 and the light guide plate 33, and extends from the light homogenizing component 34 toward the circuit board 36, and covers one side of the circuit board 36 near the light homogenizing component 34, so as to prevent the light emitted by the light source 35 from leaking from the gap between the light homogenizing component 34 and the circuit board 36.

Specifically, the light shielding assembly may generally include a light shielding tape 670, a first light shielding member 671, and a second light shielding member 672. The specific structural features of the light shielding tape 670 may refer to the light shielding tape 370 in the foregoing embodiment, so that the description thereof will not be repeated.

The first light shielding member 671 is disposed on the light emitting surface 334 of the light guide plate 33, and is located between the light guide plate 33 and the light homogenizing component 34. One end of the first light shielding member 671 is disposed between the light homogenizing component 34 and the light guide plate 33, and the other end of the first light shielding member 671 is disposed at a distance from the circuit board 36. Specifically, the first light shielding member 671 is disposed between the diffusion film 341 and the light guide plate 33 to shield the light leaking from the front surface of the light guide plate 33, so as to prevent the light from entering the structure of the light homogenizing component 34 to cause a light beam phenomenon. The first light shielding member 671 extends to a gap a between the circuit board 36 and the light homogenizing component 34, and is spaced apart from the circuit board 36. That is, one end of the first light shielding member 371 is disposed between the light guide plate 33 and the light homogenizing member 34. Preferably, one end of the first light blocking member 371 is disposed between the light guide plate 33 and the diffusion film 341. The other end of the first light shielding piece 371 is arranged in a gap a between the circuit board 36 and the light homogenizing component 34, namely, the end part of the first light shielding piece 371, which is away from the light homogenizing component 34, is positioned in the gap a between the circuit board 36 and the light homogenizing component 34 and is arranged at intervals with the circuit board 36.

Referring to fig. 5 in combination, fig. 5 is a schematic layout structure of the first light shielding member 671 in the embodiment of fig. 4. The first light shielding member 671 has a first distance h1 between the front projection of the first light shielding member on the display panel 40 and the edge of the display area 101, so as to ensure that the light homogenizing component 34 and the light shielding tape 370 can form a certain overlap width. The first shutter 671 and the circuit board 36 have a second interval h2 therebetween to prevent assembly interference and an amount of expansion required at the time of reliability test. In this embodiment, the first pitch h1 is generally not more than 0.2mm, and the second pitch h2 is generally not more than 0.1mm.

The first light-shielding member 671 may be a black ink layer formed on the light guide plate 33 through a screen printing process, or the first light-shielding member 671 may also be a black ink layer formed on the light guide plate 33 through a spraying process. Of course, in other embodiments, the first light shielding member 671 may be a black film adhered to the light guide plate 33. It should be understood that the present embodiment only illustrates the formation of the first light shielding member 671, and is not meant to limit the formation of the first light shielding member 671. The first light shielding member 671 is made of a light-tight material, and has a thickness generally not greater than 0.01mm, so as to avoid greatly affecting the flatness of the light homogenizing component 34, and further avoid causing a gap between the light homogenizing component 34 and the light guide plate 33 in the thickness direction of the backlight module, and light is directly emitted through the gap, so that light leakage occurs at the edge of the display area.

The second light shielding member 672 is disposed between the first light shielding member 671 and the circuit board 36, i.e. the second light shielding member 672 fills the gap between the first light shielding member 671 and the circuit board 36, so as to block the light leaking from the sides of the light guiding plate 33 and the circuit board 36 from entering the structure of the light homogenizing component 34, thereby avoiding the occurrence of light beam phenomenon. The second light shielding member 672 and the light homogenizing component 34 are disposed at intervals, and a side of the second light shielding member 672 facing away from the light homogenizing component 34 covers a side of the circuit board 36 close to the light homogenizing component 34, so that a side surface of the circuit board 36 is connected with the light guide plate 33 through the second light shielding member 672. Obviously, the second light shielding member 672 covers the same side of the circuit board 36 and the second encapsulant 302, i.e. the side of the circuit board 36 and the second encapsulant 302 close to the light homogenizing component 34.

Specifically, the second light shielding member 672 fills the gap between the first light shielding member 671 and the circuit board 36 on the one hand, and connects the circuit board 36 and the light guide plate 33 on the other hand, so that the reliability of the connection between the circuit board 36 and the light guide plate 33 is increased, the bonding width of the circuit board 36 and the light guide plate 33 can be further reduced, i.e., the width of the second adhesive 302 can be reduced. In this embodiment, the width w1 of the second encapsulant 302 is limited by the cutting process capability of the second encapsulant 302, and may be 0.4mm at a minimum. Further considering the influence of the fitting tolerance, the assembly tolerance, etc., the width w1 of the second glue 302 in this embodiment is generally 0.4mm-0.5mm.

It is understood that when the cutting process capability of the second molding compound 302 is improved, the width w1 of the second molding compound 302 may be further reduced, for example, the width w1 may be about 0.2mm.

Further, since the second distance h2 between the first light shielding member 671 and the circuit board 36 is generally not more than 0.1mm, the width w2 of the second light shielding member 672 is generally not less than 0.1mm, so as to block the light leaking from the side surfaces of the shielding light guide plate 33 and the circuit board 36. The second light shielding member 672 and the light homogenizing component 34 are arranged at intervals, that is, an assembly gap, that is, a third gap D3 is formed between the second light shielding member 672 and the light homogenizing component 34, so as to avoid assembly interference and the expansion amount required during the film environment reliability test. Wherein the width of the third gap D3 is approximately 0.1-0.2mm.

Referring to fig. 6 in combination, fig. 6 is a schematic layout structure of a second shade 672 in the embodiment of fig. 4. The side of the second light shielding member 672 near the light homogenizing element 34 is overlapped with the first light shielding member 671, so as to avoid an assembly gap between the second light shielding member 672 and the first light shielding member 671, and further avoid light leakage between the second light shielding member 672 and the first light shielding member 671.

Specifically, the second light shielding member 672 is partially disposed on the light guide plate 33 and connected to the light guide plate 33, and the other portion of the second light shielding member 672 is disposed on the first light shielding member 671 to avoid a gap between the second light shielding member 672 and the first light shielding member 671. The side of the second light shielding member 672 away from the light homogenizing component 34 covers the side of the circuit board 36 close to the light homogenizing component 34, so that the side surface of the circuit board 36 and the light guide plate 33 are connected through the second light shielding member 672, the circuit board 36 can be fixed from multiple directions, and the connection reliability of the circuit board 36 and the light guide plate 33 is improved.

The width w2 of the second light shielding member 672 may be defined within 0.1-0.3mm, for example, the width w2 of the second light shielding member 672 is 0.2mm, so that the second light shielding member 672 may overlap the first light shielding member 671 while filling the gap between the first light shielding member 671 and the circuit board 36.

The second light shielding member 672 may be a black sealant formed by a dispensing process, which may have an effect of connecting the circuit board 36 and the light guide plate 33, and may also have a light shielding effect. It should be understood that the present embodiment only exemplifies the formation of the second light shielding member 672, and does not mean that the formation of the second light shielding member 672 is limited to the formation by the above process.

It can be understood that whether the non-display area 102, i.e. the frame, of the electronic device 100 can achieve the ultra-narrow frame effect is mainly limited by the bonding width w1 of the second adhesive 302, the width w2 of the second light shielding member 672, and the third gap D3 on the premise of avoiding light leakage. As mentioned above, the sum of w1, w2 and D3 is approximately in the range of 0.6-1.0 mm. Compared to the backlight module in the embodiment shown in fig. 3, the frame width L2 of the backlight module in the embodiment is significantly smaller than the frame width L1 of the backlight module shown in fig. 3.

The backlight module provided by the embodiment is characterized in that the light shielding component is arranged between the light homogenizing component and the light guide plate, the light shielding component extends from the light homogenizing component to the direction of the circuit board, and the light shielding component covers one side of the circuit board, which is close to the light homogenizing component, so that light leaking from the light source and the wedge of the light guide plate can be completely blocked and shielded, light beams formed in the light homogenizing component can be prevented from entering, and the display effect and the reliability of products are improved. Simultaneously, adopt above-mentioned structure, backlight unit's frame width can further reduce to this promotes screen ratio, and then promotes the product expressive force.

Referring to fig. 7 and 8 in combination, fig. 7 is a schematic view of a partial cross-sectional structure of a backlight module 70 according to other embodiments of the present application, and fig. 8 is a schematic view of a partial enlarged structure of a region a in the embodiment of fig. 7, where the backlight module 70 may include a back frame 31, a reflective sheet 32, a light guide plate 33, a light homogenizing component 34, a light source 35, a circuit board 36 and a shading component. The difference between this embodiment and the foregoing embodiments is that: the structure of the shade assembly is different.

In the present embodiment, the light shielding component is partially disposed between the light homogenizing component 34 and the light guide plate 33, and extends from the light homogenizing component 34 toward the circuit board 36, and covers one side of the circuit board 36 near the light homogenizing component 34, so as to prevent the light emitted by the light source 35 from leaking from the gap between the light homogenizing component 34 and the circuit board 36. Specifically, the shade assembly can generally include a shade tape 770 and a third shade 773. The specific structural features of the light shielding tape 770 may refer to the light shielding tape in the foregoing embodiments, so that the description thereof will not be repeated.

One end of the third light shielding member 773 is disposed between the light homogenizing component 34 and the light guide plate 33, and the other end of the third light shielding member 773 is disposed on one side of the circuit board 36 away from the light emitting surface of the light guide plate 33. Specifically, one end of the third light shielding member 773 is disposed between the diffusion film 341 and the light guide plate 33 to shield the light leaking from the front surface of the light guide plate 33, so as to prevent the light from entering the light beam phenomenon caused by the structure of the light homogenizing component 34. The third light shielding member 773 is bent and extended from the light homogenizing component 34 toward the circuit board 36, and the other end of the third light shielding member 773 extends to one side of the circuit board 36 away from the light emitting surface of the light guide plate 33, so as to prevent light emitted by the light source 35 from leaking from a gap between the light homogenizing component 34 and the circuit board 36.

Specifically, the third shade 773 includes a first connecting portion 7731, a second connecting portion 7732, and a third connecting portion 7733 that are sequentially bent and connected. The first connecting portion 7731 is arranged on the light emitting surface 334 of the light guide plate 33, the second connecting portion 7732 covers one side of the circuit board 36 close to the light homogenizing component 34, and the third connecting portion 7733 is arranged on one side of the circuit board 36 away from the light emitting surface 334; wherein the second connection portion 7732 and the dodging component 34 are disposed at intervals.

In other words, the third light shielding member 773 may include a first connection portion 7731, a second connection portion 7732, and a third connection portion 7733, where the first connection portion 7731 is disposed on the light emitting surface 334 of the light guide plate 33, and one end of the first connection portion 7731 is disposed between the light guide plate 33 and the light homogenizing component 34. The front projection of the first connecting portion 7731 projected onto the display panel 40 and the edge of the display area 101 are disposed at a distance therebetween, so as to ensure that the light homogenizing component 34 and the light shielding tape 370 can form a certain overlap width. It is understood that the spacing between the front projection of the first connecting portion 7731 projected on the display panel 40 and the edge of the display area 101 is substantially equal to the first spacing in the foregoing embodiment.

The third connecting portion 7733 is disposed at a side of the circuit board 36 away from the light emitting surface 334 of the light guide plate 33, that is, the third connecting portion 7733 and the second colloid 302 are distributed on two opposite sides of the circuit board 36 in the thickness direction of the backlight module. The second connecting portion 7732 is disposed on a side of the circuit board 36 close to the light homogenizing component 34 and is spaced apart from the light homogenizing component 34, and the second connecting portion 7732 covers both the circuit board 36 and a side of the second gel 302 close to the light homogenizing component 34.

The second connecting portion 7732 is respectively connected with the first connecting portion 7731 and the third connecting portion 7733 in a bending manner, so as to block light leaking from the sides of the shielding light guide plate 33 and the circuit board 36 from entering the structure of the light homogenizing component 34, and to block light leaking from the front surface of the light guide plate 33 from entering the structure of the light homogenizing component 34, thereby preventing light beam phenomenon caused by light entering the structure of the light homogenizing component 34.

The third light shielding member 773 is made of a light-tight material, for example, the third light shielding member 773 is made of black light shielding glue, and the thickness of the light shielding glue is generally not more than 0.05mm, for example, can be 0.01mm, so as to avoid greatly influencing the flatness of the light homogenizing component 34, further avoid causing a gap between the light homogenizing component 34 and the light guiding plate 33 in the thickness direction of the backlight module, and light is directly emitted through the gap, so that the edge of the display area has a light leakage phenomenon.

Meanwhile, the thickness of the third light shielding member 773 does not exceed 0.05mm, which may further reduce the frame width of the electronic apparatus 100. In this embodiment, the third light shielding member 773 may be a black light shielding tape, which is sequentially attached to the surface of the light guide plate 33, the side surface of the circuit board 36, and the side of the circuit board 36 facing away from the light guide plate 33. Of course, in other embodiments, the third light shielding member may be formed by a printing or spraying process.

In the present embodiment, the third light shielding member 773 can not only play a role of shielding light, but also play a role of connecting the circuit board 36 and the light guide plate 33, thereby enabling the circuit board 36 to be fixed with the light guide plate 33 from a plurality of orientations, and improving the reliability of connection of the circuit board 36 and the light guide plate 33. Meanwhile, the adhesion width of the circuit board 36 and the light guide plate 33 can be further reduced, i.e. the width of the second glue 302 can be reduced. In this embodiment, the width w3 of the second encapsulant 302 is limited by the cutting process capability of the second encapsulant 302, and may be 0.4mm at a minimum. Further considering the influence of the fitting tolerance, the assembly tolerance, etc., the width w3 of the second glue 302 in this embodiment is generally 0.4mm-0.5mm.

It is understood that when the cutting process capability of the second molding compound 302 is improved, the width w3 of the second molding compound 302 may be further reduced, for example, the width w3 may be about 0.2mm.

In this embodiment, the backlight module 70 may further include a protection member 78, where the protection member 78 is disposed on a side of the third light shielding member 773 facing away from the circuit board 36, so as to protect the third light shielding member 773 from scratching the third light shielding member 773 during the assembly process to cause light leakage.

Specifically, the guard 78 includes a first guard 781 and a second guard 782 that are connected in a bent manner. The first protection portion 781 is disposed on a side of the third connection portion 7733 facing away from the circuit board 36, and the second protection portion 782 is disposed on a side of the second connection portion 7732 facing away from the circuit board 36.

Further, the first protection portion 781 is disposed between the third connection portion 7733 and the light shielding tape 770, and can be used for filling a gap between the circuit board 36 and the light shielding tape 770 in a thickness direction of the backlight module, so as to prevent the risk of tilting the circuit board 36 caused by pulling the display panel 40 after the display panel is assembled. The second protection portion 782 is disposed on a side of the circuit board 36 near the light homogenizing component 34 and is wrapped on the second connection portion 7732, so that the strength of the second connection portion 7732 can be increased, and the risk of damage and light leakage can be prevented. The second protection portion 782 and the light homogenizing component 34 are disposed at intervals to avoid assembly interference and the expansion required during the reliability test of the film environment. That is, a fourth gap D4 is provided between the second guard 782 and the light homogenizing module 34, and the width of the fourth gap D4 is approximately 0.1-0.2mm.

The shielding member 78 may be an opaque film layer, for example, the shielding member 78 may be an opaque resin film layer such as a black PET film. Wherein the thickness of the guard 78 is generally no more than 0.05mm, for example, the guard 78 may be 0.03mm, 0.04mm, etc.

It can be understood that whether the non-display area 102, i.e. the frame, of the electronic device 100 achieves the ultra-narrow frame effect is mainly limited by the bonding width w3 of the second adhesive 302, the thickness of the third light shielding member 773, the thickness of the protective member 78 and the fourth gap D4 under the premise of avoiding light leakage. As described above, the sum of the bonding width w3, the thickness of the third shade 773, the thickness of the shielding member 78, and the fourth gap D4 is approximately in the range of 0.6 to 0.9 mm. Compared to the backlight module in the embodiment shown in fig. 3, the frame width L3 of the backlight module in the embodiment is significantly smaller than the frame width L1 of the backlight module shown in fig. 3.

Referring to fig. 9, fig. 9 is a schematic structural diagram of the embodiment of fig. 7 when the third shade 773 and the protection member 78 are not assembled, wherein the third shade 773 and the protection member 78 may be assembled by a composite cutting process. The third shade 773 is black shading glue and the guard 78 is black PET for example. The black PET is placed on the black shading adhesive, then the assembly structure of the third shading piece 773 and the protection piece 78 shown in fig. 9 is realized through integral cutting, the third shading piece 773 is further wrapped on one side of the circuit board 36, which faces away from the light guide plate 33, and one side of the circuit board 36, which is close to the light homogenizing component 34, and the third shading piece 773 is extended and attached on the light emitting surface of the light guide plate 33, and finally the light homogenizing component 34 is arranged on the light emitting surface, so that the third shading piece 773 is partially arranged between the light homogenizing component 34 and the light guide plate 33. Wherein, when the assembled structure of the third light shielding member 773 and the shielding member 78 shown in fig. 9 is integrally cut, the shielding member 78 covers a part of the surface of the third light shielding member 773. It is understood that the portion of the third light shielding member 773 covered by the shielding member 78 is the first connecting portion 7731 and the second connecting portion 7732, and the portion of the third light shielding member 773 not covered by the shielding member 78 is the third connecting portion 7733.

Of course, in other embodiments, the third light shielding member 773 may be first wrapped around the side of the circuit board 36 facing away from the light guide plate 33 and the side of the circuit board 36 near the light homogenizing component 34, and a portion is reserved, then the circuit board 36 is fixed on the light guide plate 33, and the reserved portion of the third light shielding member 773 is attached to the light guide plate, so as to implement the assembly of the third light shielding member 773 and the protection member 78.

In addition, referring to fig. 10, fig. 10 is a schematic structural diagram of a mobile terminal device 900 according to other embodiments of the present application, where the mobile terminal device 900 may be a mobile phone, a tablet computer, a notebook computer, a wearable device, etc., and the embodiment of the present application illustrates a mobile phone as an example. The structure of the mobile terminal device 900 may generally include an RF circuit 910, a memory 920, an input unit 930, a display unit 940 (i.e., the display panel 40 in the above embodiment), a sensor 950, an audio circuit 960, a wifi module 970, a processor 980, a power source 990, and the like. Wherein, the RF circuit 910, the memory 920, the input unit 930, the display unit 940, the sensor 950, the audio circuit 960, and the wifi module 970 are respectively connected to the processor 980; power source 990 is used to provide power to the entire mobile terminal device 900.

Specifically, RF circuitry 910 is used to send and receive signals; memory 920 is used to store data instruction information; the input unit 930 is used for inputting information, and may specifically include a touch panel 931 and other input devices 932 such as operation keys; the display unit 940 may include a display panel 941 (i.e., the display panel 40 in the above embodiment), etc.; the sensor 950 includes an infrared sensor, a laser sensor, etc., for detecting a user proximity signal, a distance signal, etc.; a speaker 961 and a microphone 962 are coupled to the processor 980 by an audio circuit 960 for receiving and transmitting audio signals; the wifi module 970 is configured to receive and transmit wifi signals, and the processor 980 is configured to process data information of the mobile terminal device. For related technical features of the display panel, please refer to the related description of the embodiments of the display panel, which will not be described in detail herein.

It should be noted that the terms "comprising" and "having," as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those listed steps or elements but may alternatively include other steps or elements not listed or inherent to such process, method, article, or apparatus.

The foregoing description is only of embodiments of the present application, and is not intended to limit the scope of the patent application, and all equivalent structures or equivalent processes using the descriptions and the contents of the present application or other related technical fields are included in the scope of the patent application.

Claims

1. The utility model provides a backlight unit which characterized in that, backlight unit includes:

the light guide plate comprises a light incident surface and a light emergent surface;

the light source is arranged on one side of the light incident surface;

the light homogenizing component is arranged on the light emitting surface of the light guide plate;

the circuit board is arranged on the light source and is arranged at intervals with the light homogenizing component;

the second colloid is arranged between the circuit board and the light guide plate;

the first shading piece is arranged on the light emergent surface of the light guide plate; one end of the first shading piece is arranged between the light guide plate and the light homogenizing component, and the other end of the first shading piece is arranged at intervals with the circuit board;

a second light shielding member disposed between the first light shielding member and the circuit board and filling a gap between the first light shielding member and the circuit board; the second shading piece covers the circuit board and one side of the second colloid, which is close to the light homogenizing component, so that one side of the circuit board, which is close to the light homogenizing component, is connected with the light guide plate through the second shading piece, so that the bonding width of the second colloid, which bonds the circuit board and the light guide plate, is reduced, and one side of the second shading piece, which is close to the light homogenizing component, is lapped on the first shading piece, so that light emitted by the light source is prevented from leaking from a gap between the light homogenizing component and the circuit board.

2. A backlight module according to claim 1, wherein the first light shielding member is a black ink layer formed by a printing or spraying process, or the first light shielding member is a black film.

3. The backlight module according to claim 1, wherein the second light shielding member and the light homogenizing component are arranged at intervals, and one side of the second light shielding member, which faces away from the light homogenizing component, covers the circuit board and one side of the second colloid, which is close to the light homogenizing component.

4. A backlight module according to claim 3, wherein the second light shielding member is a black sealant formed by a dispensing process.

5. A backlight module according to any one of claims 2-4, further comprising a light shielding tape, wherein the light shielding tape is disposed on a side of the circuit board facing away from the light source and is overlapped on a side of the light homogenizing component facing away from the light guide plate.

6. An electronic device, the electronic device comprising:

a backlight module according to any one of claims 1-5;

the display panel is laminated with the backlight module;

wherein, display panel locates even optical subassembly deviates from the one side of light guide plate.