JP2013070270A - Solid state image pickup device and camera module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a solid state image pickup device which reduces an area where an image pickup device is mounted on a circuit board to achieve the downsizing, ensures the strength of the image pickup device against external force even when the height is reduced, is not easily affected by heat generation, and has resistance to noise, and to provide a camera module.SOLUTION: A solid state image pickup device 100 includes: an image pickup device 15 having a bonding pad region 13 where pads for external connection are disposed at the outer side of a light receiving region 11; and a wiring member which is disposed in at least an area between the light receiving region 11 and the bonding pad region 13 of the image pickup device 15 and has a first pad region 17 corresponding to the bonding pad region 13 and having pads disposed therein. The corresponding pads in the bonding pad region 13 of the image pickup device 15 and the first pad region of the wiring member 19 are connected through wire bonding.

Description

  The present invention relates to a solid-state imaging device and a camera module.

  In recent years, cellular phones, portable personal computers, and the like are often equipped with small camera modules. This type of camera module includes a solid-state imaging device in which an imaging element is mounted on a circuit board, and a lens holder that holds a lens on the imaging element (see, for example, Patent Documents 1 and 2). The imaging element and the circuit board of the solid-state imaging device are each provided with a pad area in which a plurality of pads are arranged, and both corresponding pads are connected by wire bonding.

JP 2002-135632 A JP 2010-103628 A

As shown in FIG. 9, in the general solid-state imaging device 71, when the imaging element 73 and the circuit board 75 are electrically connected, the bonding pad area 77 is located outside the mounting area of the imaging element 73 on the circuit board 75. Is provided. The pads in the bonding pad region 77 and the pads in the bonding pad region 79 on the image sensor 73 side are connected by wire bonding. For this reason, the width LB of the circuit board 75 is wider than the width LS of the image pickup element 73 in order to dispose the bonding pad region 77, and the substrate area is increased, which hinders downsizing.
In addition, due to the recent reduction in the height of the solid-state imaging device 71, the rigidity of the solid-state imaging device 71 itself may be reduced and may be easily deformed by an external force. Furthermore, since the heat capacity of the solid-state imaging device 71 is reduced due to the low profile, the imaging element 73 may be easily affected by self-heating.
The image sensor 73 is easily affected by noise generated from a power circuit such as a lens driving driver or power supply mounted on the circuit board 75. In order to reduce the influence of noise, it is effective to place the noise generation source and the image sensor 73 apart from each other, but it is difficult to increase the distance on the circuit board 75. Furthermore, the image sensor 73 and the circuit board 75 are becoming thinner due to the reduction in the height of the solid-state image pickup device 71, and this also makes it difficult to increase the distance.

  Therefore, the present invention reduces the mounting area of the image sensor on the circuit board to reduce the size, and can secure the strength against the external force of the image sensor even if the height is reduced, is not easily affected by heat generation, and is resistant to noise. An object is to provide a solid-state imaging device and a camera module.

The present invention has the following configuration.
(1) an imaging device having a bonding pad region in which pads for external connection are arranged outside the light receiving region;
A wiring member having at least a first pad region disposed between the light receiving region of the imaging element and the bonding pad region, and a pad corresponding to the bonding pad region is disposed;
A solid-state imaging device in which bonding pads in the imaging element and corresponding pads in the first pad region of the wiring member are connected by wire bonding.
(2) the solid-state imaging device according to (1);
An optical member that forms an optical image in a light receiving region of the imaging element;
Camera module with.

  According to the solid-state imaging device and the camera module of the present invention, it is possible to reduce the mounting area of the imaging element on the circuit board to reduce the size, and to secure the strength against the external force of the imaging element even if the height is reduced. In addition, it is difficult to be affected by heat generation and can be configured to be resistant to noise.

It is a figure for demonstrating embodiment of this invention, and is a schematic plan view of a solid-state imaging device. It is AA sectional drawing of FIG. It is BB sectional drawing of FIG. It is a schematic sectional drawing of a camera module. It is a schematic sectional drawing of a camera module. It is explanatory drawing which shows a mode that a light shielding member is arrange | positioned on an image pick-up element. It is a partial cross section figure of a solid-state imaging device which shows a mode that a plurality of pad fields were provided in a shading member, and performed bonding connection. FIG. 8 is an explanatory diagram illustrating an example of a pad arrangement in a plurality of rows of pad regions illustrated in FIG. 7. It is explanatory drawing which shows the connection state of the conventional common image pick-up element and a circuit board.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
The solid-state imaging device 100 of this configuration example includes an image input unit such as a mobile phone, a TV phone, a PC camera, a PDA (Personal Digital Assistants), an optical mouse, a door phone, a surveillance camera, a fingerprint recognition device, or a toy. Used as a camera module.

<First aspect>
FIG. 1 is a diagram for explaining an embodiment of the present invention, and is a schematic plan view of a solid-state imaging device, FIG. 2 is a cross-sectional view taken along line AA in FIG. 1, and FIG. is there.
As shown in FIG. 1, the solid-state imaging device 100 includes an imaging element 15 having a bonding pad area 13 for external connection outside the light receiving area 11, and at least between the light receiving area 11 and the bonding pad area 13 of the imaging element 15. And a circuit board 21 on which the imaging element 15 is surface-mounted. The light shielding member 19 includes a first pad region 17 corresponding to the bonding pad region 13 and a second pad region 31 disposed at a position different from the first pad region 17.

  As shown in FIGS. 2 and 3, in the solid-state imaging device 100, an imaging element 15 and a light shielding member 19 are stacked in this order on a circuit board 21. The light shielding member 19 is made of a material having a light shielding property and high thermal conductivity, and is also a wiring member provided with a wiring pattern for connecting the first pad region 17 and the second pad region 31. The light shielding member 19 is manufactured by molding, for example.

  The image sensor 15 has a rectangular shape in plan view, and has a bonding pad region 13 in which a plurality of pads 23 are arranged along at least one side of the image sensor 15. In the illustrated example, the pair of bonding pad regions 13 and 13 are provided on the short sides facing each other, but only one side may be provided, and one or two sides of the long side, or all sides may be provided. A configuration in which a bonding pad region is provided may be employed.

  The imaging element 15 is outside a light receiving region 11 for detecting light, a lens driving driver for driving a lens to be described later in the optical axis direction, a power circuit for power supply, and an analog circuit such as an amplifier circuit of the imaging unit. Is formed.

  The light shielding member 19 is formed from the entire circumference of the outer edge of the light receiving region 11 on the imaging element surface (upper surface) of the imaging element 15, and from the bottom part of the cylindrical part 25 and the cylindrical part 25 erected perpendicularly to the imaging element surface. And an annular flat portion 27 extending outward along the surface of the image sensor. The bottom part of the cylindrical part 25 and the flat part 27 are stuck on the surface of the imaging element without any gap.

  The peripheral edge of the flat portion 27 of the light shielding member 19 is rectangular. First pad regions 17 and 17 corresponding to the bonding pad regions 13 and 13 of the image sensor 15 are provided on the upper surface of the edge of the short side in the flat portion 27. The first pad region 17 is arranged in parallel to the bonding pad region 13.

  In the first pad area 17, a plurality of pads 29 corresponding to the pads 23 of the bonding pad area 13 are arranged, and the corresponding pads 23 and the pads 29 are connected by wire bonding.

  Further, the light shielding member 19 is provided with a second pad region 31 on the upper surface of the edge of one long side orthogonal to the short side where the first pad regions 17, 17 are arranged in the flat portion 27. In the second pad region 31, a plurality of pads 33 that are electrically connected to the pads of the first pad regions 17 and 17 via a wiring pattern (not shown) are arranged. Each of these pads 33 functions as a connection terminal for the input / output signals of the first pad regions 17 and 17.

  As shown in FIG. 3, the circuit board 21 has a third pad region 35 corresponding to the second pad region 31 outside the mounting region of the image sensor 15. The third pad region 35 and the second pad region 31 are arranged in parallel to each other.

  In the third pad area 35, a plurality of pads 37 corresponding to the pads 33 of the second pad area 31 are arranged, and the corresponding pads 33 and the pads 37 are connected by wire bonding. The pad 37 is connected to the wiring formed on the circuit board 21. As a result, the signal lines that are input to and output from the image sensor 15 are connected to the circuit board 21 via the first pad region 17, the second pad region 31, and the third pad region 35, and can be transmitted. Yes.

  In the light shielding member 19, an electronic component 39 can be disposed on a part of the surface of the cylindrical portion 25 or the flat portion 27. As the electronic component 39, for example, an IC chip that performs division or integration of signal lines to the image sensor 15 or signal processing between the first pad region 17 and the second pad region 31, or various chip components And various parts.

  According to the solid-state imaging device 100 configured as described above, the light shielding member 19 is disposed between the light receiving region 11 and the bonding pad region 13 of the imaging element 15, and the first pad is placed on the light shielding member 19 that is inside the imaging element 15. By disposing the region 17, it is not necessary to dispose a pad on the outer circuit board 21 from the bonding pad region 13 of the image sensor 15. For this reason, the area of the circuit board 21 on which the imaging element 15 is mounted can be reduced to a size close to the imaging element 15, and the solid-state imaging device 100 can be downsized.

  Furthermore, if the electronic component 39 is mounted not on the circuit board 21 but on the surface of the light shielding member 19, the mounting area required for the circuit board 21 can be reduced, and the solid-state imaging device 100 can be further downsized. When the electronic component 39 includes a power circuit, it is desirable to dispose the electronic component 39 away from the image sensor 15. However, when the electronic component 39 is disposed on the circuit board 21, it is difficult to increase the distance between the imaging element 15 and the electronic component 39. Therefore, if the electronic component 39 is mounted on the light shielding member 19 as described above, the distance from the image sensor 15 can be easily obtained, and the influence of the power circuit can be easily reduced.

  In addition, by directly attaching the light shielding member 19 to the surface of the imaging element 15, the gap between the surface of the imaging element 15 and the light shielding member 19 can be completely filled. As a result, stray light can be prevented from entering the light receiving region 11 and the light shielding performance can be improved.

  Furthermore, the rigidity of the circuit board 21 is improved by fixing the light shielding member 19 having the cylindrical portion 25 erected from the flat portion 27 to the surface of the imaging element 15 by surface bonding. As a result, the solid-state imaging device 100 formed thin due to the low profile is not easily deformed by an external force, and has a high-strength configuration excellent in handling and durability.

  The light shielding member 19 is disposed in direct contact with the surface of the image sensor 15 serving as a heat source, and increases the contact area with the image sensor 15 and the heat capacity. For this reason, the heat generated by the image sensor 15 can be released to the outside of the image sensor 15 with high efficiency, and high heat dissipation is obtained. An area where heat is likely to be generated due to circuit operation exists particularly outside the light receiving area 11 of the image pickup element 15, but since the area that is likely to generate heat is covered with the flat portion 27 of the light shielding member 19, efficient heat dissipation. Can be done. That is, the light shielding member 19 reduces the temperature rise of the light receiving region 11 and prevents an increase in dark current due to heat generation of the image sensor 15.

Next, a camera module on which the solid-state imaging device 100 having the above configuration is mounted will be described.
FIG. 4 is a schematic cross-sectional view of the camera module.
The camera module 200 mainly includes a solid-state imaging device 100 and an optical member that forms an optical image on the light receiving region 11 of the imaging element 15. In the solid-state imaging device 100, a side wall 43 connected to the annular peripheral edge 21 a of the circuit board 21, and a cylindrical portion top surface 25 a of the light shielding member 19 that extends from the side wall toward the inside of the imaging element 15. A frame 41 in which a lid portion 45 that is in contact is formed integrally is attached. Each part of the solid-state imaging device 100 connected by wire bonding is sealed with a frame 41, a cylindrical part 25, and a circuit board 21.

  The lid portion 45 of the frame 41 has an opening hole 45 a for guiding light to the light receiving region 11 of the image sensor 15. An infrared cut glass 47 is bonded to the peripheral edge of the opening hole 45 a of the lid 45 so as to face the light receiving region 11, and the space 49 on the light receiving region 11 of the image sensor 15 is sealed.

  A lens holder 51 is fixed on the lid 45 of the frame 41, and the lens holder 51 supports a lens 53 that forms an image in the light receiving region 11 of the image sensor 15.

  According to the camera module 200 configured as described above, heat from the image sensor 15 is transmitted to the lid portion 45 of the frame 41 via the flat portion 27 and the cylindrical portion 25 of the light shielding member 19, and further from the lid portion 45 to the lens holder. 51 and the infrared cut glass 47 and the like. For this reason, the heat dissipation of the image sensor 15 is enhanced, and the influence of heat generation from the image sensor 15 can be suppressed to a low level. As a result, high-quality image information with less noise can be output from the image sensor 15.

<Second aspect>
Next, a configuration in which the light shielding member has a shielding function will be described.
FIG. 5 is a schematic cross-sectional view of the camera module in this configuration example. In the following description, the same members as those shown in FIG. 4 are denoted by the same reference numerals, and the description thereof is omitted.

  The lens holder 51 is provided with a motor (such as a voice coil motor) 55 for moving the lens 53 in the optical axis direction and adjusting the focus of the light receiving region 11 of the image sensor 15. The movable lens 53 is movable in the optical axis direction by driving a motor 55 fixed to the lens holder 51.

  In the case of the camera module having the above-described configuration, the wire bonding connection portion between the first pad region 17 and the bonding pad region 13 disposed immediately below the motor 55 is exposed to noise generated from the motor 55. Therefore, in the wire bonding connection portion, noise is easily superimposed on the input / output signal. In order to prevent this noise superposition, a wiring layer 57 for shielding is formed in the wire bonding connection portion.

  The wiring layer 57 is provided at least on the flat portion 27 of the light shielding member 19 facing the motor 55 and is formed below the first pad region 17. The wiring layer 57 includes wiring that is grounded at least in part. In other words, the wiring layer 57 has a configuration in which a shielding wiring is provided in a part of the wiring pattern that is conductive to the pad that is the connection terminal, and the wiring pattern that is conductive to the pad is temporarily grounded, so that the wiring layer 57 is signaled. Various configurations such as a configuration that selectively uses one of the transmission wiring function and the shield function, and a configuration in which the entire wiring layer 57 is a shield wiring dedicated to the shield can be adopted.

  In addition, by providing the light shielding member 19 with the wiring layer 57, an analog circuit particularly sensitive to noise of the image sensor 15 is shielded. As a result, insulation from the image sensor 15 is obtained, and noise is less likely to be superimposed on the output signal from the image sensor 15.

  In addition to the configuration in which the wiring layer 57 is provided on the flat portion 27 of the light shielding member 19, the wiring layer 59 may be provided on the outer wall surface of the cylindrical portion 25. In that case, a shielding effect is obtained also for the light receiving region 11 of the image sensor 15, and noise can be more reliably prevented from being superimposed on the output signal from the image sensor 15. Of course, the wiring layer 59 on the outer wall surface of the cylindrical portion 25 can adopt the various forms described above, such as a part of the wiring layer 59 of the flat portion 27, which is a shield wiring.

  According to this configuration example, even when a noise generating component such as the motor 55 is mounted on the camera module, the generated noise can be reliably shielded by the wiring layers 57 and 59 and does not affect the input / output signal. . Further, since the wiring layers 57 and 59 are not disposed on the inner peripheral surface of the cylindrical portion 25 of the light shielding member 19, the detection light in the light receiving region 11 is not reflected by the wiring layer, thereby impairing the optical performance of the camera module. There is nothing.

<Third Aspect>
Next, a configuration in which a positioning mark for aligning the light shielding member on the image sensor is provided on the image sensor.
The image sensor 15 and the light shielding member 19 are mounted on the circuit board 21 by a well-known mounter device (not shown). There are various types of mounter device mechanisms. For example, a board fixing portion for fixing a circuit board, a mounter head arranged on the circuit board, and a moving mechanism for moving the mounter head on the circuit board. Some have a controller for controlling each part. The controller holds the mounted component on the mounter head, and moves the mounted component held on the mounter head to the target mounting position on the circuit board by the moving mechanism. Then, the mounter head places the mounted component on the circuit board in accordance with an instruction from the controller. As a result, the mounted component is mounted at the target mounting position on the circuit board.

  In the mounter apparatus as described above, a camera is provided on the mounter head, and a positioning mark on the circuit board is detected by this camera, thereby aligning the circuit board and the mounter head.

  In this configuration example, the imaging device 15 and the light shielding member 19 are mounted on the circuit board 21 in this order by the mounter device as described above. At that time, when the light shielding member 19 is mounted on the image sensor surface of the image sensor 15, positioning is performed by using a positioning mark provided on the image sensor surface.

  FIG. 6 is an explanatory diagram showing a state in which the light shielding member is arranged on the image sensor. Positioning marks 61 and 61 are provided on the surface of the image sensor 15 of the image sensor 15 mounted on the circuit board 21. As the positioning marks 61, 61, a well-known mark such as a pattern recognizable by a color filter of the camera or a wiring pattern can be used.

  The positioning marks 61, 61 are marks representing the reference position of the image sensor 15 itself. A pair of marks are provided at diagonal positions outside the mounting region 63 of the light shielding member 19 on the surface of the image sensor of the image sensor 15. When mounting the light shielding member 19 on the surface of the image sensor 15 that has been mounted on the circuit board 21, the positioning marks 61 and 61 are recognized by the camera of the mounter head, and the controller determines the target mounting position of the light shielding member 19. decide. Then, the controller moves the mounter head to the target mounting position, and mounts the light shielding member 19 at the target mounting position on the surface of the image sensor.

  According to this configuration, even if the reference position information for mounting the light shielding member 19 is not obtained from the circuit board 21 because the mounting area of the image sensor 15 is reduced, the surface of the image sensor 15 of the image sensor 15 is not affected. By adding reference position information (positioning mark), the light shielding member 19 can be mounted on the circuit board 21. Further, by using the positioning mark provided on the surface of the image sensor, the influence of the mounting position error of the image sensor 15 that occurs when the reference position information is provided on the circuit board 21 does not occur in principle, and the high accuracy. Can be implemented. Since the positioning mark is provided outside the light receiving region 11 of the image sensor 15, there is no influence on the optical performance.

<Fourth aspect>
Next, a description will be given of a configuration in which the first pad region formed on the light shielding member is a plurality of pad regions, and the pad region of each column and the bonding pad region of the imaging element are connected by wire bonding.

FIG. 7 is a partial cross-sectional view of a solid-state imaging device schematically showing a state in which a plurality of pad regions are provided on a light shielding member and bonding connection is performed, and FIG. 8 is a diagram of pad arrangement in the plurality of pad regions shown in FIG. It is explanatory drawing which shows an example.
In the present configuration example, the first pad region 17 includes three pad regions 17A, 17B, and 17C. The pads in the pad areas 17A, 17B, and 17C are wire-bonded to the pads 23 in the bonding pad area 13 of the image sensor 15, respectively.

  According to the above configuration, the bonding pitch P of each pad region 17A, 17B, 17C is larger than the bonding pitch P0 in the bonding pad region 13 of the image sensor 15. For this reason, the positional accuracy at the time of wire bonding connection on the first pad region 17 side can be rough, and the mounting cost can be reduced. Even when the length of the first pad region 17 is shorter than the length of the bonding pad region 13 due to the size restriction of the light shielding member 19, the bonding pitch P can be set wide. The arrangement of the pads 29 shown in FIG. 8 is an example, and the arrangement of the pads is not limited to this.

As described above, the present invention is not limited to the above-described embodiments, and those skilled in the art can make changes and applications based on combinations of the configurations of the embodiments, descriptions in the specification, and well-known techniques. This is also the scope of the present invention, and is included in the scope of seeking protection.
For example, the first pad region 17 is not limited to the configuration provided in the flat portion 27 of the light shielding member 19, and may be provided on another member provided on the imaging device surface of the imaging device 15. Further, instead of wire bonding connection from the second pad region 31 to the third pad region 35 of the circuit board 21, the first pad region 17 and the circuit board 21 may be connected by a flexible substrate.

As described above, the following items are disclosed in this specification.
(1) an imaging device having a bonding pad region in which pads for external connection are arranged outside the light receiving region;
A wiring member having at least a first pad region disposed between the light receiving region of the imaging element and the bonding pad region, and a pad corresponding to the bonding pad region is disposed;
A solid-state imaging device in which bonding pads in the imaging element and corresponding pads in the first pad region of the wiring member are connected by wire bonding.
According to this solid-state imaging device, since the bonding pad region of the image sensor and the first pad region of the wiring member disposed inside the image sensor are connected by wire bonding, wire bonding is performed toward the outside of the image sensor. There is no need. For this reason, the input / output signals of the image sensor can be taken out within the element region of the image sensor, the solid-state imaging device can be miniaturized, and the mounting area can be reduced. Further, by disposing the wiring member between the light receiving region and the bonding pad region of the image sensor, the heat dissipation of heat generated from the image sensor can be improved. Furthermore, by attaching a wiring member to the image sensor, the rigidity of the image sensor can be improved, deformation due to external force can be suppressed, and the strength can be increased.

(2) The solid-state imaging device according to (1),
A solid-state imaging device in which the wiring member is formed on the entire circumference surrounding the light receiving region.
According to this solid-state imaging device, since the wiring member is formed on the entire circumference surrounding the light receiving region, the contact area between the wiring member and the imaging element is increased, and rigidity and heat dissipation can be improved.

(3) The solid-state imaging device according to (1) or (2),
A circuit board on which the image sensor is mounted;
The wiring member has a second pad region arranged at a position different from the first pad region, and a pad functioning as a connection terminal for an input / output signal of the first pad region, A solid-state imaging device in which a pad in a second pad region is electrically connected to the circuit board.
According to this solid-state imaging device, since the input / output signal of the imaging element is transmitted to the circuit board via the pad of the second pad region arranged at a position different from the first pad region, The degree of freedom of arrangement of the second pad area is increased. As a result, a space-efficient arrangement pattern can be obtained, and the solid-state imaging device can be further miniaturized.

(4) The solid-state imaging device according to (3),
The circuit board has a third pad region in which pads corresponding to the pads of the second pad region are disposed;
A solid-state imaging device in which pads corresponding to the second pad region and the third pad region are connected by wire bonding.
According to this solid-state imaging device, the image sensor and the circuit board can be connected at low cost with little design change.

(5) The solid-state imaging device according to any one of (1) to (4),
The solid-state imaging device, wherein the wiring member is a light shielding member for shielding the light receiving region.
According to this solid-state imaging device, the light shielding member is provided outside the light receiving area of the image sensor, and it is possible to prevent light incident outside the light receiving area from entering the light receiving area as stray light.

(6) The solid-state imaging device according to (5),
The wiring member has a cylindrical portion erected perpendicularly to the imaging element surface from the entire outer periphery of the light receiving region on the imaging element surface of the imaging element;
A flat portion extending outward from the bottom of the cylindrical portion along the surface of the imaging element;
A solid-state imaging device.
According to this solid-state imaging device, the cylindrical portion surrounding the light receiving area prevents unnecessary light from entering the light receiving area, thereby improving the light shielding property of the image sensor.

(7) The solid-state imaging device according to (6),
The solid-state imaging device in which the first pad region is provided in a flat portion of the wiring member.
According to this solid-state imaging device, the first pad region is provided in the flat portion, whereby the wire bonding connection can be easily performed, and the manufacturing cost can be reduced.

(8) The solid-state imaging device according to (6) or (7),
A wiring pattern connected to the pad of the first pad region is formed on the flat portion of the wiring member,
A solid-state imaging device in which the wiring pattern has a shielding function.
According to this solid-state imaging device, the insulation from the light receiving region is improved by the wiring pattern, and a reliable shielding effect can be obtained against a noise-sensitive portion such as an analog circuit included in the imaging element. In addition, the light receiving area of the image pickup device is not affected by the light reflection of the wiring pattern, and good optical characteristics can be obtained.

(9) The solid-state imaging device according to any one of (1) to (8),
A solid-state imaging device in which an electronic component is mounted on the wiring member.
According to this solid-state imaging device, by mounting the electronic component on the wiring member, it is possible to reduce the required mounting area of the electronic component on the circuit board or the like.

(10) The solid-state imaging device according to any one of (1) to (9),
An imaging apparatus in which a positioning mark is provided on a surface of the imaging element of the imaging element.
According to this solid-state imaging device, the wiring member can be accurately positioned with respect to the imaging device. For this reason, the relative position between the light receiving region and the wiring member is accurate and the optical characteristics are improved, and the relative position between the first pad region on the wiring member and the bonding pad region on the image sensor is accurately connected. Process accuracy can be improved.

(11) The solid-state imaging device according to any one of (1) to (10),
An imaging apparatus in which the first pad region is composed of a plurality of pad regions arranged in parallel to the bonding pad region, and the pad regions in each column and corresponding pads in the bonding pad region are connected by wire bonding.
According to this solid-state imaging device, even when the length of the first pad region is shorter than the length of the bonding pad region, the pitch interval between the individual pads serving as connection points can be set widely without being reduced. For this reason, the connecting process does not require high processing accuracy, and the mounting cost can be reduced.

(12) The solid-state imaging device according to any one of (1) to (11);
An optical member that forms an optical image in a light receiving region of the imaging element;
Camera module with.
According to this camera module, the configuration is excellent in rigidity, heat dissipation, and light shielding properties, and the mounting area can be reduced.

DESCRIPTION OF SYMBOLS 11 Light reception area | region 13 Bonding pad area | region 15 Image pick-up element 17 1st pad area | region 19 Light-shielding member (wiring member)
DESCRIPTION OF SYMBOLS 21 Circuit board 23 Pad 25 Cylindrical part 27 Flat part 29 Pad 31 2nd pad area | region 33 Pad 35 3rd pad area | region 37 Pad 39 Electronic component 43 Side wall part 45 Cover part 53 Lens 55 Motor 57 Wiring layer 59 Wiring layer 61 Positioning mark 63 Mounting area 100 Solid-state imaging device 200 Camera module

Claims (12)

An imaging element having a bonding pad area in which pads for external connection are arranged outside the light receiving area;
A wiring member having at least a first pad region disposed between the light receiving region of the imaging element and the bonding pad region, and a pad corresponding to the bonding pad region is disposed;
A solid-state imaging device in which bonding pads in the imaging element and corresponding pads in the first pad region of the wiring member are connected by wire bonding. The solid-state imaging device according to claim 1,
A solid-state imaging device in which the wiring member is formed on the entire circumference surrounding the light receiving region. The solid-state imaging device according to claim 1 or 2,
A circuit board on which the image sensor is mounted;
The wiring member has a second pad region arranged at a position different from the first pad region, and a pad functioning as a connection terminal for an input / output signal of the first pad region, A solid-state imaging device in which a pad in a second pad region is electrically connected to the circuit board. The solid-state imaging device according to claim 3,
The circuit board has a third pad region in which pads corresponding to the pads of the second pad region are disposed;
A solid-state imaging device in which pads corresponding to the second pad region and the third pad region are connected by wire bonding. The solid-state imaging device according to any one of claims 1 to 4,
The solid-state imaging device, wherein the wiring member is a light shielding member for shielding the light receiving region. The solid-state imaging device according to claim 5,
The wiring member has a cylindrical portion erected perpendicularly to the imaging element surface from the entire outer periphery of the light receiving region on the imaging element surface of the imaging element;
A flat portion extending outward from the bottom of the cylindrical portion along the surface of the imaging element;
A solid-state imaging device. The solid-state imaging device according to claim 6,
The solid-state imaging device in which the first pad region is provided in a flat portion of the wiring member. The solid-state imaging device according to claim 6 or 7,
A wiring pattern connected to the pad of the first pad region is formed on the flat portion of the wiring member,
A solid-state imaging device in which the wiring pattern has a shielding function. A solid-state imaging device according to any one of claims 1 to 8,
A solid-state imaging device in which an electronic component is mounted on the wiring member. The solid-state imaging device according to any one of claims 1 to 9,
An imaging apparatus in which a positioning mark is provided on a surface of the imaging element of the imaging element. The solid-state imaging device according to any one of claims 1 to 10,
An imaging apparatus in which the first pad region is composed of a plurality of pad regions arranged in parallel to the bonding pad region, and the pad regions in each column and corresponding pads in the bonding pad region are connected by wire bonding. A solid-state imaging device according to any one of claims 1 to 11,
An optical member that forms an optical image in a light receiving region of the imaging element;
Camera module with.

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