CN107835354B - Be applied to electronic equipment's module of making a video recording and electronic equipment - Google Patents
Be applied to electronic equipment's module of making a video recording and electronic equipment Download PDFInfo
- Publication number
- CN107835354B CN107835354B CN201711352778.9A CN201711352778A CN107835354B CN 107835354 B CN107835354 B CN 107835354B CN 201711352778 A CN201711352778 A CN 201711352778A CN 107835354 B CN107835354 B CN 107835354B
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- circuit board
- optical lens
- camera module
- image sensor
- electronic equipment
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Abstract
The invention discloses a camera module applied to electronic equipment, which comprises an optical lens and a circuit board, wherein an image sensor is arranged on the surface of one side, facing the optical lens, of the circuit board, and bonding pads are distributed between the image sensor and the edge of the circuit board and are packaged by an insulating material; the side of the circuit board facing the optical lens is also provided with a reinforcing plate which is arranged along the edge of the circuit board and used for increasing the structural strength of the camera module, and the reinforcing plate is positioned on a packaging layer formed by an insulating material; and a component for realizing a preset function is arranged on the surface of one side of the circuit board, which is back to the optical lens. Compared with the prior art, the camera module circuit board can save the safe distance between the occupied width of components and parts and the pad and the components and between the width of the reinforcing plate and the pad and the reinforcing plate, thereby reducing the width or the length of the circuit board and reducing the length and the width of the camera module. The invention also discloses electronic equipment comprising the camera module.
Description
Technical Field
The present invention relates to the field of camera devices, and in particular, to a camera module applied to an electronic device. The invention also relates to an electronic device.
Background
With the development of electronic products and the continuous improvement of user experience requirements on the products, manufacturers optimize not only electronic device software but also hardware thereof, such as smart phones. And along with hardware upgrading in the electronic equipment, the overall arrangement of each inside device of equipment is more and more accurate, to the more and more limit of utilization of inner space, and the corresponding space of leaving for the module of making a video recording is more and more limited, consequently requires the size miniaturization more of the module of making a video recording.
Disclosure of Invention
In view of the above, an object of the present invention is to provide a camera module applied to an electronic device, which can reduce the length and width of the camera module compared with the prior art. The invention also provides electronic equipment.
In order to achieve the purpose, the invention provides the following technical scheme:
a camera module applied to electronic equipment comprises an optical lens and a circuit board, wherein an image sensor is arranged on the surface of one side, facing the optical lens, of the circuit board, the optical lens is used for guiding entering object light to enter the image sensor, and the image sensor is used for sensing light and converting the light into an electric signal;
the surface of one side, facing the optical lens, of the circuit board is also provided with bonding pads distributed between the image sensor and the edge of the circuit board, and the bonding pads are packaged through an insulating material;
a reinforcing plate which is arranged along the edge of the circuit board and used for increasing the structural strength of the camera module is further arranged on one side of the circuit board facing the optical lens, and the reinforcing plate is positioned on a packaging layer formed by an insulating material;
and an element for realizing a preset function is arranged on the surface of one side of the circuit board, which is back to the optical lens.
Optionally, on a side of the circuit board facing the optical lens, a surface of the encapsulation layer formed by an insulating material is parallel to a surface of the circuit board.
Optionally, the component is encapsulated on the surface of the circuit board by an insulating material.
Optionally, on a side of the circuit board facing away from the optical lens, a surface of the encapsulation layer formed by an insulating material is parallel to a surface of the circuit board.
Optionally, the component is packaged by a plastic packaging method, and the pad is packaged by the plastic packaging method.
Optionally, a plurality of the components are arranged on a surface of the circuit board, which is opposite to the optical lens, in an area close to the circuit board edge, and the plurality of the components are sequentially arranged along the direction of the circuit board edge.
Optionally, the circuit board dorsad optical lens one side is surperficial, is being close to the circuit board is provided with a plurality ofly along the region on one side of length direction component, and is a plurality of component is followed circuit board length direction arranges in proper order, is being close to the circuit board is provided with a plurality ofly along the region on length direction another side component, and is a plurality of component is followed circuit board length direction arranges in proper order.
Optionally, on a surface of the circuit board facing the optical lens, between the image sensor and the circuit board, a plurality of the pads are sequentially arranged along a length direction of the circuit board, and/or a plurality of the pads are sequentially arranged along a width direction of the circuit board.
Optionally, a plurality of pads sequentially arranged along the length direction of the circuit board are arranged between the image sensor and one side of the circuit board along the length direction;
a plurality of bonding pads which are sequentially arranged along the width direction of the circuit board are arranged between the image sensor and one side of the circuit board along the width direction;
and a plurality of bonding pads which are sequentially arranged along the width direction of the circuit board are arranged between the image sensor and the other side of the circuit board along the width direction.
An electronic device comprises the camera module.
According to the technical scheme, the camera module applied to the electronic equipment, provided by the invention, has the advantages that the components are arranged on the back surface of the circuit board, namely the surface of the circuit board, which is back to the optical lens, compared with the prior art, the components are prevented from being arranged on the surface, facing the optical lens, of the circuit board, the back surface of the circuit board is utilized, and the width occupied by the components and the safety distance between the bonding pad and the components can be saved for the circuit board. Furthermore, on the surface of the side, facing the optical lens, of the circuit board, the bonding pad is packaged by adopting an insulating material, so that the reinforcing plate can be manufactured on a packaging layer formed by the insulating material, and the width of the reinforcing plate and the safety distance between the bonding pad and the reinforcing plate can be further saved for the length and the width of the circuit board. Therefore, compared with the prior art, the camera module can reduce the width or the length of the circuit board and can reduce the length and the width of the camera module.
The electronic equipment provided by the invention can achieve the beneficial effects.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a front view of a camera module applied to an electronic device in the prior art;
FIG. 2 is a side view of the camera module of FIG. 1;
fig. 3 is a front view of a camera module applied to an electronic device according to an embodiment of the present invention;
FIG. 4 is a rear view of the camera module of FIG. 3;
fig. 5 is a side view of the camera module of fig. 3.
Detailed Description
In the prior art, referring to fig. 1 and fig. 2, a camera module applied to an electronic device includes an optical lens 10 and a circuit board 11, an image sensor 12, pads 13 distributed around the image sensor, components 14 distributed around the image sensor, and a stiffener 15 arranged along an edge of the circuit board are disposed on a surface of the circuit board 11 facing the optical lens 10, and the image sensor 12, the pads 13, the components 14, and the stiffener 15 are sequentially arranged along a width direction or a length direction of the circuit board.
Wherein a safety distance d is left between the image sensor 12 and the pad 13AA safety distance d is left between the bonding pad 13 and the component 14CWith a safety distance d between the component 14 and the reinforcing plate 15ETherefore, the distance between the circuit board of the camera module and the side of the circuit board from the image sensor is d ═ dA+dB+dC+dD+dE+dF，dBDenotes the width of the pad, dDRepresenting the width of the component, dFIndicating the thickness of the reinforcing plate.
In view of the above, the present invention provides a camera module applied to an electronic device, which can reduce the length and width of the camera module compared with the prior art.
The invention provides a camera module, which is applied to electronic equipment and comprises an optical lens and a circuit board, wherein an image sensor is arranged on the surface of one side, facing the optical lens, of the circuit board, the optical lens is used for guiding entering object light to enter the image sensor, and the image sensor is used for sensing light and converting the light into an electric signal.
And the surface of one side of the circuit board, which faces the optical lens, is also provided with bonding pads distributed between the image sensor and the edge of the circuit board, and the bonding pads are packaged by insulating materials.
The side, facing the optical lens, of the circuit board is also provided with a reinforcing plate which is arranged along the edge of the circuit board and used for increasing the structural strength of the camera module, and the reinforcing plate is located on a packaging layer formed by insulating materials.
And an element for realizing a preset function is arranged on the surface of one side of the circuit board, which is back to the optical lens.
According to the camera module, the components are arranged on the back surface of the circuit board, namely the surface of the circuit board, which faces away from the optical lens, compared with the prior art, the situation that the components are arranged on the surface, which faces towards the optical lens, of the circuit board is avoided, and the width occupied by the components and the safety distance between the bonding pad and the components can be saved for the circuit board by utilizing the back surface of the circuit board. Furthermore, on the surface of the side, facing the optical lens, of the circuit board, the bonding pad is packaged by adopting an insulating material, so that the reinforcing plate can be manufactured on a packaging layer formed by the insulating material, and the width of the reinforcing plate and the safety distance between the bonding pad and the reinforcing plate can be further saved for the length and the width of the circuit board.
Therefore, compared with the prior art, the camera module can reduce the width or the length of the circuit board and can reduce the length and the width of the camera module.
In order to make those skilled in the art better understand the technical solution of the present invention, the technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the drawings in the embodiment of the present invention, and it is obvious that the described embodiment is only a part of the embodiment of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Next, the present invention will be described in detail with reference to the drawings, wherein the cross-sectional views illustrating the structures are not enlarged in general scale for convenience of description when describing the embodiments of the present invention, and the drawings are only exemplary and should not be construed as limiting the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in the actual fabrication.
Referring to fig. 3, 4 and 5, fig. 3 is a front view of a camera module applied to an electronic device according to an embodiment of the present invention, fig. 4 is a rear view of the camera module shown in fig. 3, and fig. 5 is a side view of the camera module shown in fig. 3. As can be seen from the figure, the image pickup module includes an optical lens 20 and a circuit board 21, and an image sensor 22 is disposed on a surface of the circuit board 21 facing the optical lens 20.
The optical lens 20 is used to guide the incoming object light to be incident on the image sensor 22. In specific implementation, the optical lens 20 includes optical elements such as a lens or a diaphragm, which can adjust the propagation direction, the light flux amount, and the like of the entering light, so that the entering object light is converged to the image sensor, thereby ensuring that a clear image is obtained.
The image sensor 22 is used for sensing light and converting the light into an electrical signal to obtain an image. In practical implementation, the image sensor may be a CCD photosensitive element or a CMOS photosensitive element, but is not limited thereto, and may also be other types of image sensors, and all of them are within the protection scope of the present invention.
Referring to fig. 3, pads 23 are further disposed on a surface of the wiring board 21 facing the optical lens 20, the pads 23 being distributed between the image sensor 22 and the edges of the wiring board, and the pads 23 are used for electrical connection to conduct wiring. The pads 23 are encapsulated with an insulating material, and the pads 23 are encapsulated in the insulating material to form an encapsulation layer 26.
In practice, a safety distance d is left between the image sensor 22 and the bonding pad 23AWhile a certain packaging safety distance d is left between the bonding pad 23 and the edge of the circuit boardG。
Referring to fig. 3 and 5, a stiffener 25 is disposed along an edge of the wiring board 21 facing the optical lens 20, and the stiffener 25 is disposed on an encapsulation layer 26 formed of an insulating material. AddingThe reinforcing plate 25 is used for increasing the structural strength of the camera module, has a certain thickness, and is arranged along the edge of the circuit board along the reinforcing plate 25. This embodiment module of making a video recording, on the circuit board towards optical lens one side surface, adopt insulating material to encapsulate the pad for can make the reinforcing plate on the encapsulation layer that insulating material formed, compare with prior art, can save the width d of reinforcing plate to the length or the width of circuit boardFAnd a safety distance d between the bonding pad and the reinforcing plateEThus, the length or width of the wiring board can be reduced.
Referring to fig. 4, a component 24 is disposed on a surface of the circuit board 21 opposite to the optical lens 20, and the component 24 is used for implementing a predetermined function and is electrically connected to the internal circuit of the circuit board 21.
The component 24 is a component arranged on the circuit board of the camera module and used for implementing a preset function, and may be a capacitor for filtering, or a component used for implementing other functions, all within the protection scope of the present invention.
Therefore, in the camera module of the embodiment, the component is arranged on the back surface of the circuit board, namely the surface of the circuit board, which faces away from the optical lens, so that the back surface of the circuit board is utilized, compared with the prior art, the component is prevented from being arranged on the surface of the circuit board, which faces towards the optical lens, and the occupied width d of the component can be saved for the circuit boardDAnd a safety distance d between the pad and the componentCTherefore, the width or the length of the circuit board can be reduced, and the length and the width of the camera module can be reduced.
In practical implementation, referring to fig. 4, the component 24 may be encapsulated on the surface of the circuit board 21 by an insulating material, so that the component 24 is encapsulated in the insulating material to perform the functions of isolating and protecting the component. Preferably, the surface of the packaging layer 27 formed by an insulating material is parallel to the surface of the circuit board 21, so as to ensure the flatness of the packaging layer, facilitate the reduction of the occupation of the camera module on the space in the electronic equipment, and facilitate the spatial layout of each device in the electronic equipment.
Further preferably, in the specific implementation, on the side of the circuit board 21 facing the optical lens 20, the surface of the package layer 26 formed by the insulating material is parallel to the surface of the circuit board 21, so as to ensure the flatness of the package layer, which is beneficial to reducing the space occupied by the camera module in the electronic device, and is beneficial to the space layout of each device in the electronic device.
Preferably, the components can be packaged by a plastic packaging method, the bonding pads are packaged by the plastic packaging method, the plastic packaging method is to fill the flowing materials on the surface of the circuit board, and then the fluid materials are tightly pressed with the circuit board through high-pressure treatment, so that the components or the bonding pads are packaged, and the structural strength and the flatness of the camera module can be ensured by the plastic packaging method.
When the circuit board is specifically implemented, a plurality of components can be arranged on the surface of one side, back to the optical lens, of the circuit board in an area close to the edge of the circuit board, and the plurality of components are sequentially arranged along the direction of the edge of the circuit board, so that the arrangement and layout of the components on the circuit board are more regular, and the circuit board is convenient for the design of an electric circuit of the circuit board.
Specifically, in the camera module according to this embodiment, referring to fig. 4, on a surface of the circuit board 21 on a side away from the optical lens 20, a plurality of components 24 are disposed in a region near one side of the circuit board 21 in the length direction, the plurality of components 24 are sequentially arranged in the length direction of the circuit board 21, a plurality of components 24 are disposed in a region near the other side of the circuit board 21 in the length direction, and the plurality of components 24 are sequentially arranged in the length direction of the circuit board.
The image sensor is arranged between the circuit boards, the plurality of bonding pads are sequentially arranged along the length direction of the circuit board, and/or the plurality of bonding pads are sequentially arranged along the width direction of the circuit board, so that the arrangement and the layout of the bonding pads on the circuit board are more regular, and the design of an electric circuit of the circuit board is facilitated.
Specifically, in the camera module provided in this embodiment, referring to fig. 3, a plurality of pads 23 sequentially arranged along the length direction of the circuit board are disposed between the image sensor 22 and one side of the circuit board 21 along the length direction; a plurality of pads 23 arranged in sequence in the width direction of the wiring board 21 are provided between the image sensor 22 and one side of the wiring board 21 in the width direction; between the image sensor 22 and the other side of the wiring board 21 in the width direction, a plurality of pads 23 are provided which are arranged in order in the width direction of the wiring board 21. In the camera module of the embodiment, the elements on the circuit board are compactly arranged, so that the camera module is more miniaturized.
In practical implementation, the circuit board 21 may be a flexible circuit board, a hard circuit board, or a rigid-flexible circuit board, and all of them are within the protection scope of the present invention.
In a concrete example, the length of side of the circuit board of the traditional camera module is 8.00mm, after the camera module is improved by adopting the embodiment, the length is 7.20mm, the width is 5.50mm, the height of the improved camera module is increased (about increased by 0.2-0.3mm) compared with that of the traditional camera module, but the length and the width can be saved by 1.0-2.0mm, and the camera module can effectively reduce the length and the width.
Correspondingly, the embodiment of the invention also provides electronic equipment which comprises the camera module. This embodiment electronic equipment adopts above-mentioned module of making a video recording, the module of making a video recording with components and parts setting on the circuit board back is the circuit board optical lens one side surface dorsad promptly, compares with prior art, has avoided setting components and parts on the circuit board towards optical lens one side, has utilized the circuit board back, can save the shared width of components and parts and the safe distance between pad and the components and parts to the circuit board. Furthermore, on the surface of the side, facing the optical lens, of the circuit board, the bonding pad is packaged by adopting an insulating material, so that the reinforcing plate can be manufactured on a packaging layer formed by the insulating material, and the width of the reinforcing plate and the safety distance between the bonding pad and the reinforcing plate can be further saved for the length and the width of the circuit board. Therefore, compared with the prior art, the camera module of the electronic equipment can reduce the width or the length of the circuit board, and can reduce the length and the width of the camera module.
The present invention provides a camera module applied to an electronic device and an electronic device. The principles and embodiments of the present invention are explained herein using specific examples, which are presented only to assist in understanding the method and its core concepts. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.
Claims (8)
1. A camera module applied to electronic equipment comprises an optical lens and a circuit board, wherein an image sensor is arranged on the surface of one side, facing the optical lens, of the circuit board, the optical lens is used for guiding entering object light to enter the image sensor, and the image sensor is used for sensing light and converting the light into an electric signal;
the surface of one side, facing the optical lens, of the circuit board is also provided with bonding pads distributed between the image sensor and the edge of the circuit board, and the bonding pads are packaged by an insulating material;
a reinforcing plate which is arranged along the edge of the circuit board and used for increasing the structural strength of the camera module is further arranged on one side of the circuit board facing the optical lens, and the reinforcing plate is positioned on a packaging layer formed by an insulating material;
arranging a component for realizing a preset function on the surface of one side of the circuit board, which is back to the optical lens;
a plurality of components are arranged on the surface of one side, back to the optical lens, of the circuit board in an area close to the circuit board edge, and the components are sequentially arranged along the direction of the circuit board edge;
the circuit board dorsad optical lens one side is surperficial on, is being close to the circuit board is provided with a plurality ofly along the region on one side of length direction component, it is a plurality of component is followed circuit board length direction arranges in proper order, is being close to the region of circuit board along length direction another side is provided with a plurality of component, it is a plurality of component is followed circuit board length direction arranges in proper order.
2. The camera module applied to electronic equipment according to claim 1, wherein a surface of an encapsulation layer formed of an insulating material is parallel to a surface of the wiring board on a side of the wiring board facing the optical lens.
3. The camera module applied to the electronic equipment according to claim 1, wherein the component is encapsulated on the surface of the circuit board through an insulating material.
4. The camera module applied to electronic equipment according to claim 3, wherein a surface of the encapsulation layer formed of the insulating material is parallel to a surface of the circuit board on a side of the circuit board facing away from the optical lens.
5. The camera module applied to the electronic device according to claim 3, wherein the component is encapsulated by a plastic packaging method, and the pad is encapsulated by a plastic packaging method.
6. The camera module applied to the electronic equipment according to claim 1, wherein a plurality of the pads are sequentially arranged along a length direction of the circuit board and/or a plurality of the pads are sequentially arranged along a width direction of the circuit board between the image sensor and the edge of the circuit board on a surface of the circuit board facing the optical lens.
7. The camera module of claim 6, wherein a plurality of pads are disposed between the image sensor and one side of the circuit board along the length direction, the pads being sequentially arranged along the length direction of the circuit board;
a plurality of bonding pads which are sequentially arranged along the width direction of the circuit board are arranged between the image sensor and one side of the circuit board along the width direction;
and a plurality of bonding pads which are sequentially arranged along the width direction of the circuit board are arranged between the image sensor and the other side of the circuit board along the width direction.
8. An electronic device comprising the camera module of any one of claims 1-7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711352778.9A CN107835354B (en) | 2017-12-15 | 2017-12-15 | Be applied to electronic equipment's module of making a video recording and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711352778.9A CN107835354B (en) | 2017-12-15 | 2017-12-15 | Be applied to electronic equipment's module of making a video recording and electronic equipment |
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| CN107835354A CN107835354A (en) | 2018-03-23 |
| CN107835354B true CN107835354B (en) | 2020-12-18 |
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| CN201711352778.9A Active CN107835354B (en) | 2017-12-15 | 2017-12-15 | Be applied to electronic equipment's module of making a video recording and electronic equipment |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108683829B (en) * | 2018-05-29 | 2021-04-20 | 奇酷互联网络科技（深圳）有限公司 | Camera module, mainboard and mobile terminal |
| CN113114919A (en) * | 2021-05-19 | 2021-07-13 | 江西晶浩光学有限公司 | Circuit board assembly, camera module and electronic equipment |
| CN114173471B (en) * | 2021-11-18 | 2023-09-22 | 信利光电股份有限公司 | Circuit board for improving thrust of camera module and camera module |
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| CN101277584A (en) * | 2007-03-27 | 2008-10-01 | 鸿富锦精密工业（深圳）有限公司 | Circuit board |
| JP2013070270A (en) * | 2011-09-22 | 2013-04-18 | Fujifilm Corp | Solid state image pickup device and camera module |
| CN205430409U (en) * | 2016-03-07 | 2016-08-03 | 宁波舜宇光电信息有限公司 | Pick -up module |
| CN205490820U (en) * | 2015-12-30 | 2016-08-17 | 南昌欧菲光电技术有限公司 | Camera module and circuit board thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0034796B1 (en) * | 1980-02-22 | 1987-09-16 | Kabushiki Kaisha Toshiba | Liquid crystal display device |
| US7702226B1 (en) * | 2006-07-20 | 2010-04-20 | Siimpel Corporation | Board mounted hermetically sealed optical device enclosure and manufacturing methods therefor |
| CN112217969B (en) * | 2016-04-07 | 2022-10-21 | 宁波舜宇光电信息有限公司 | Photosensitive device with reinforced circuit board, array camera module and manufacturing method thereof |
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- 2017-12-15 CN CN201711352778.9A patent/CN107835354B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1396763A (en) * | 2001-07-11 | 2003-02-12 | M·D·I株式会社 | Solid camera device and its manufacture method |
| CN101277584A (en) * | 2007-03-27 | 2008-10-01 | 鸿富锦精密工业（深圳）有限公司 | Circuit board |
| JP2013070270A (en) * | 2011-09-22 | 2013-04-18 | Fujifilm Corp | Solid state image pickup device and camera module |
| CN205490820U (en) * | 2015-12-30 | 2016-08-17 | 南昌欧菲光电技术有限公司 | Camera module and circuit board thereof |
| CN205430409U (en) * | 2016-03-07 | 2016-08-03 | 宁波舜宇光电信息有限公司 | Pick -up module |
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