CN209184670U - Bracket, photosensory assembly and camera module - Google Patents
Bracket, photosensory assembly and camera module Download PDFInfo
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- CN209184670U CN209184670U CN201821850695.2U CN201821850695U CN209184670U CN 209184670 U CN209184670 U CN 209184670U CN 201821850695 U CN201821850695 U CN 201821850695U CN 209184670 U CN209184670 U CN 209184670U
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- bracket
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- wiring board
- electronic component
- avoid holes
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Abstract
The utility model relates to a kind of bracket, photosensory assembly and camera modules.Above-mentioned bracket is for accommodating the sensitive chip and electronic component being arranged in camera module in the circuit board, and support lens assembly, it is characterized in that, bracket includes opposite first end face and second end face, and first end face with wiring board for connecting, and second end face is for carrying lens assembly, bracket offers light hole and avoid holes through first end face and second end face, when branch is set up on wiring board, sensitive chip is located in light hole, and electronic component is located in avoid holes.Above-mentioned bracket, photosensory assembly and camera module make the whole height of bracket be not limited by electronic component height, can realize that camera module minimizes by reducing the whole height of bracket by the way that avoid holes accommodating electric element is arranged.
Description
Technical field
The utility model relates to picture pick-up device technical fields, more particularly to a kind of bracket, photosensory assembly and camera module.
Background technique
A kind of existing camera module, including wiring board, sensitive chip, electronic component, bracket and lens assembly, photosensitive core
Piece and electronic component are set on wiring board, and bracket includes around on wiring board and around the side of sensitive chip and electronic component
Wall, and the top plate of lens assembly is used to support set on side wall far from wiring board one end.
In the prior art, the general encapsulation completed by bracket to electronic component, namely electronic component is made to be located at top plate
Between wiring board, and in order to avoid in the installation process of subsequent top plate and lens assembly, or because top plate by self gravity shadow
Ring, with electronic component far from wiring board one end occur squeeze or collision, top plate usually with electronic component far from wiring board one
The one section of safe distance in end interval.
But the height of above-mentioned bracket can be limited to the height of electronic component, cause mirror support height larger, be unfavorable for imaging
The miniaturization of mould group.
Utility model content
Based on this, it is necessary to be limited to the height of electronic component for the bracket of the prior art, lead to lens assembly and branch
The problem of height of frame stationary plane is larger, is unfavorable for the miniaturization of camera module provides a kind of bracket, photosensory assembly and camera shooting mould
Group.
A kind of bracket for accommodating the sensitive chip and electronic component that are arranged in camera module in the circuit board, and supports
Lens assembly, the bracket include opposite first end face and second end face, and the first end face is used for and the wiring board
Connection, for carrying the lens assembly, the bracket is offered through the first end face and described the second end face
The light hole and avoid holes of biend, when the branch is set up on the wiring board, the sensitive chip is located at described logical
In unthreaded hole, the electronic component is located in the avoid holes.
When above-mentioned bracket is fixed in the circuit board, electronic component is placed in avoid holes, allows electronic component from evacuation
Hole is exposed, in the installation process of bracket and lens assembly, make bracket will not squeeze or impacting electron element far from wiring board one
End, also accordingly makes bracket whole height not to be severely limited to electronic component height；It is not made in electronic component with lens assembly
Under the premise of at assembling interference, the whole height of bracket can be reduced, convenient for the miniaturization of camera module.
The number of the avoid holes is multiple in one of the embodiments, and the number of the avoid holes and the electricity
The number of subcomponent is identical, and corresponds.Each avoid holes corresponds to an electronic component, avoids influencing second end face and mirror
The fixation of head assembly.
The edge of the second end face has stepped groove in one of the embodiments, and the stepped groove is located at described
The outside of avoid holes, the cascaded surface of the stepped groove is for carrying the lens assembly.Be arranged stepped groove so that second end face with
The stationary plane height of lens assembly further decreases, and minimizes convenient for camera module.
The edge of the second end face has stepped groove, the cascaded surface of the stepped groove in one of the embodiments,
Including connected first area and second area, the second area between the first area and the light hole,
The avoid holes are through the second area and the first end face, and the first area is for carrying the lens assembly.If
Stepped groove is set, so that the stationary plane of second end face and lens assembly height further decreases, is minimized convenient for camera module.
The light hole is close to the side of the stepped groove in one of the embodiments,.Bracket lateral dimension is reduced, just
It is minimized in camera module.
The bracket further includes annular slab in one of the embodiments, the lateral wall of the annular slab and the light passing
The inner wall in hole connects, for carrying the optical filter of the camera module.It is fixed convenient for optical filter.
A kind of photosensory assembly, comprising:
Wiring board；
Sensitive chip is set on the wiring board；
Electronic component, the periphery on the wiring board and positioned at the sensitive chip；And
The first end face of above-mentioned bracket, the bracket is set on the wiring board, and the sensitive chip is located at the light passing
In hole, the electronic component is located in the avoid holes.By above-mentioned bracket, a lower height of photosensory assembly is formed, convenient for taking the photograph
As mould group minimizes.
Spacing between the second end face and the wiring board in one of the embodiments, is less than or equal to multiple
The maximum height of the relatively described wiring board in the electronic component.So that lens assembly and the stationary plane of second end face are lower than electronics
Element maximum height.
The bracket further includes annular slab in one of the embodiments, the lateral wall of the annular slab and the light passing
The inner wall in hole connects；
The photosensory assembly further includes optical filter, and the optical filter is set to the annular slab close to the surface of the wiring board
Above or on surface of the annular slab far from the wiring board.Keep optical filter corresponding with sensitive chip, extraneous light passes through
It is incident on sensitive chip after optical filter.
A kind of camera module, comprising:
Above-mentioned photosensory assembly；And
Lens assembly, in the second end face of the bracket；
Wherein, in the region that the lateral wall that the avoid holes are located at the lens assembly determines.By above-mentioned photosensory assembly,
Make the reduction of the stationary plane height of lens assembly and bracket, and the encapsulation to electronic component is further completed by lens assembly, just
Camera module is minimized in being formed.
Above-mentioned bracket, photosensory assembly and camera module make the whole high of bracket by the way that avoid holes accommodating electric element is arranged
Degree is not limited by the height of electronic component, can realize camera module miniaturization by the whole height of reduction bracket.
Detailed description of the invention
Fig. 1 is the diagrammatic cross-section for the camera module that an embodiment of the present invention provides；
Fig. 2 is the diagrammatic cross-section of the photosensory assembly of camera module shown in Fig. 1；
Fig. 3 is the diagrammatic cross-section of the photosensory assembly of another embodiment of the use of the new type；
Fig. 4 is enlarged diagram at a in Fig. 2；
Fig. 5 is the schematic top plan view of photosensory assembly shown in Fig. 2.
Specific embodiment
To keep the above objects, features, and advantages of the utility model more obvious and easy to understand, with reference to the accompanying drawing to this
The specific embodiment of utility model is described in detail.Many details are explained in the following description in order to abundant
Understand the utility model.But the utility model can be implemented with being much different from other way described herein, this field
Technical staff can do similar improvement without prejudice to the utility model connotation, therefore the utility model is not by following public affairs
The limitation for the specific implementation opened.
In detail shown in ginseng Fig. 1 and Fig. 2, a kind of camera module provided by the utility model, including photosensory assembly 10 and lens group
Part 20, lens assembly 20 are arranged on the photosensitive path of photosensory assembly 10.Photosensory assembly 10 includes wiring board 100, sensitive chip
200, electronic component 300, bracket 400 and optical filter 500, sensitive chip 200, electronic component 300 and bracket 400 are set to route
On plate 100, and sensitive chip 200, electronic component 300 are accommodated in bracket 400, and optical filter 500 is set on bracket 400, and
On the photosensitive path of sensitive chip 200.
Further, photosensory assembly 10 further includes connecting lead wire 600, and the opposite both ends of connecting lead wire 600 are separately connected sense
The edge and wiring board 100 of optical chip 200, so that sensitive chip 200 is electrically connected with the realization of wiring board 100.Electronic component 300 is
It is multiple, and it is respectively arranged at the periphery of sensitive chip 200.
Specifically, in the present embodiment, sensitive chip 200 is square, for the visual angle shown in Fig. 2 and Fig. 4, more connections
Lead 250 is arranged in two column, is located at the left and right sides of sensitive chip 200, and connect with wiring board 100 and sensitive chip 200
It connects.Multiple electronic components 300 are arranged in two column, and are located at the left and right sides of sensitive chip 200, and are located at connecting lead wire
250 outside.Multiple electronic components 300 have different height because of size heterogeneity, in two electronic components that Fig. 2 is illustrated
In 300, the height of the electronic component 300 in left side is less than the electronic component 300 on right side.
Further, bracket 400 includes opposite first end face 410 and second end face 420, first end face 410 and route
Plate 100 is connected and fixed, and second end face 420 carries lens assembly 20.Bracket 400 is offered respectively through first end face 410 and
The light hole 430 and avoid holes 440 of biend 420, sensitive chip 200 and electronic component 300 be located at light hole 430 and
In avoid holes 440, and avoid holes 440 are located at the lateral wall 21 of lens assembly 20 and enclose in the region set.
Specifically, first end face 410 is fixed on wiring board 100 by adhesive layer (not shown), and lens assembly 20 passes through
Adhesive layer (not shown) is fixed in second end face 420.
Further, the number of avoid holes 440 is multiple and identical as the number of electronic component 300, so that avoid holes
440 correspond with electronic component 300.In some other embodiment, multiple electronic components 300 can also be located at same keep away
It allows in hole 440.
Further, in detail shown in ginseng Fig. 4, the spacing between second end face 420 and wiring board 100 is h1, multiple electronics members
The height of part 300 is not exactly the same, and the height of some electronic components 300 is larger, and the height of some electronic components 300 is smaller,
In, height spacing of the maximum one end of electronic component 300 far from wiring board 100 away from wiring board 100 is h2, in the present embodiment
In, h1Numerical value be equal to h2Numerical value, namely using 100 place plane of wiring board as the plane of reference, the height of second end face 420 is equal to
Maximum height in electronic component 300, to prevent electronic component 300 from stretching out in while reducing the height of bracket 400 and keep away
It allows hole 440, causes assembling to interfere with lens assembly 20.
In some other embodiment, h1Numerical value might be less that h2Numerical value namely second end face 420 height it is small
Maximum height in electronic component 300, so that the whole height of bracket 400 is further decreased, convenient for the small-sized of camera module
Change.
Further, in detail shown in ginseng Fig. 2 and Fig. 5,420 edge of second end face has stepped groove 450, stepped groove 450
Cascaded surface includes connected first area 451 and second area 452, and second area 452 is located at first area 451 and light hole
Between 430, avoid holes 440 run through second area 452 and first end face 410.First area 451 is for carrying lens assembly 20.
Further, in the present embodiment, light hole 430 is in close proximity to the side 458 of stepped groove 450, to reduce bracket
400 lateral dimensions minimize convenient for camera module.
It is understood that avoid holes 440 are not limited to do not influencing lens assembly 20 through second area 452
Under the premise of fixing with first area 451, avoid holes 440 can also run through first area 451 and first end face 410, Huo Zhetong
When through first area 451 and second area 452 and first end face 410.
In some other embodiment, stepped groove 450 can be located at the outside of avoid holes 440, and lens assembly 20 is directly solid
It is scheduled on the cascaded surface 455 of stepped groove 450.
Bracket 400 further includes annular slab 460, and side wall and 430 inner wall of light hole of annular slab 460 are connected and fixed, to be used for
Carry optical filter 500.In the present embodiment, optical filter 500 is fixed on the one end of annular slab 460 far from wiring board 100.Such as Fig. 3
Shown, in some other embodiment, optical filter 500 can also be fixed on annular slab 460 adjacent to one end of wiring board 100.
Extraneous light is incident on sensitive chip 200 after passing through optical filter 500 using light hole 430.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But it cannot be understood as the limitations to utility model patent range.It should be pointed out that for the common skill of this field
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The protection scope of the utility model.Therefore, the scope of protection shall be subject to the appended claims for the utility model patent.
Claims (10)
1. a kind of bracket for accommodating the sensitive chip and electronic component that are arranged in camera module in the circuit board, and is supported and is taken the photograph
As the lens assembly of mould group, which is characterized in that the bracket includes opposite first end face and second end face, the first end
Face with the wiring board for connecting, and for carrying the lens assembly, the bracket is offered through institute the second end face
The light hole and avoid holes for stating first end face Yu the second end face, it is described when the branch is set up on the wiring board
Sensitive chip is located in the light hole, and the electronic component is located in the avoid holes.
2. bracket according to claim 1, which is characterized in that the number of the avoid holes is multiple, and avoid holes
Number it is identical as the number of the electronic component, and correspond.
3. bracket according to claim 1, which is characterized in that the edge of the second end face has stepped groove, described
Stepped groove is located at the outside of the avoid holes, and the cascaded surface of the stepped groove is for carrying the lens assembly.
4. bracket according to claim 1, which is characterized in that the edge of the second end face has stepped groove, described
The cascaded surface of stepped groove includes connected first area and second area, and the second area is located at the first area and institute
It states between light hole, the avoid holes run through the second area and the first end face, and the first area is for carrying institute
State lens assembly.
5. bracket according to claim 4, which is characterized in that the light hole is close to the side of the stepped groove.
6. bracket according to claim 1, which is characterized in that the bracket further includes annular slab, outside the annular slab
Side wall is connect with the inner wall of the light hole, for carrying the optical filter of the camera module.
7. a kind of photosensory assembly characterized by comprising
Wiring board；
Sensitive chip is set on the wiring board；
Electronic component, the periphery on the wiring board and positioned at the sensitive chip；And
The first end face of bracket according to any one of claims 1 to 5, the bracket is set on the wiring board, the sense
Optical chip is located in the light hole, and the electronic component is located in the avoid holes.
8. photosensory assembly according to claim 7, which is characterized in that between the second end face and the wiring board
Away from less than or equal to the maximum height of the relatively described wiring board in multiple electronic components.
9. photosensory assembly according to claim 7, which is characterized in that the bracket further includes annular slab, the annular slab
Lateral wall connect with the inner wall of the light hole；
The photosensory assembly further includes optical filter, the optical filter be set to the annular slab on the surface of the wiring board or
On surface of the annular slab far from the wiring board.
10. a kind of camera module characterized by comprising
The photosensory assembly as described in any one of claim 7-9；And
Lens assembly, in the second end face of the bracket；
Wherein, the lateral wall that the avoid holes are located at the lens assembly encloses in the region set.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821850695.2U CN209184670U (en) | 2018-11-09 | 2018-11-09 | Bracket, photosensory assembly and camera module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821850695.2U CN209184670U (en) | 2018-11-09 | 2018-11-09 | Bracket, photosensory assembly and camera module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209184670U true CN209184670U (en) | 2019-07-30 |
Family
ID=67363823
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821850695.2U Active CN209184670U (en) | 2018-11-09 | 2018-11-09 | Bracket, photosensory assembly and camera module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209184670U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111711719A (en) * | 2020-07-03 | 2020-09-25 | Oppo（重庆）智能科技有限公司 | Camera assembly and electronic equipment |
| WO2021196493A1 (en) * | 2020-04-01 | 2021-10-07 | 南昌欧菲光电技术有限公司 | Light filtering assembly, camera module and electronic device |
-
2018
- 2018-11-09 CN CN201821850695.2U patent/CN209184670U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021196493A1 (en) * | 2020-04-01 | 2021-10-07 | 南昌欧菲光电技术有限公司 | Light filtering assembly, camera module and electronic device |
| CN111711719A (en) * | 2020-07-03 | 2020-09-25 | Oppo（重庆）智能科技有限公司 | Camera assembly and electronic equipment |
| CN111711719B (en) * | 2020-07-03 | 2021-10-15 | Oppo（重庆）智能科技有限公司 | Camera assembly and electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210622 Address after: 330096 no.1404, Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: Jiangxi Jinghao optics Co.,Ltd. Address before: 330013 Nanchang, Jiangxi economic and Technological Development Zone, east of lilac Road, north of Longtan canal. Patentee before: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. |
|
| TR01 | Transfer of patent right |