WO2021056961A1

WO2021056961A1 - Image sensing module

Info

Publication number: WO2021056961A1
Application number: PCT/CN2020/076754
Authority: WO
Inventors: 范成至; 周正三
Original assignee: 神盾股份有限公司
Priority date: 2019-09-23
Filing date: 2020-02-26
Publication date: 2021-04-01
Also published as: CN211555889U; CN111163254A; TW202114184A; WO2021056950A1; TWM596898U; TW202113949A; TWM597018U; CN211087275U; TW202113665A; CN111163255A; CN111261650A; CN110911434A; TWI715439B; TW202114190A; WO2021056960A1; TWM596975U; CN211184079U; TWM596974U; CN211089753U

Abstract

Provided is an image sensing module, comprising an image sensor chip, a microlens array, and an optical filter. The microlens array is configured on the image sensor chip. The optical filter is configured above the microlens array, and comprises a plastic substrate and an optical filter layer, wherein the optical filter layer is configured on the plastic substrate.

Description

Image sensor module

Technical field

The invention relates to a sensing module, and in particular to an image sensing module.

Background technique

With the advancement of optoelectronic technology, image sensing modules have developed vigorously, replacing the position of traditional photosensitive film. In order to solve the problem of overexposure in outdoor sunlight scenes, the image sensor module usually needs to be equipped with an infrared light cut filter to block the infrared light. When the image sensing module is used as an under-screen optical fingerprint sensing module to be disposed under the screen of the electronic device, it is also very important to install an infrared cut-off filter.

As the thickness of the portable electronic device becomes thinner, the thickness of the image sensor module also needs to be thinner. One method is to reduce the thickness of the glass substrate of the infrared cut filter (for example, reduce the thickness to 100 microns). However, the thinning of the glass substrate can easily cause the glass substrate to be brittle and break, which makes the manufacturing process of the subsequent module better. The rate drops.

Summary of the invention

The present invention is directed to an image sensing module, which can have a thinner thickness and has a higher process yield.

An embodiment of the present invention provides an image sensing module including an image sensor chip, a microlens array, and a filter. The micro lens array is arranged on the image sensor chip. The filter is disposed above the micro lens array and includes a plastic substrate and a filter layer, wherein the filter layer is disposed on the plastic substrate.

An embodiment of the present invention provides an image sensing module including an image sensor chip, a microlens array, and a filter. The micro lens array is arranged on the image sensor chip. The filter is arranged above the microlens array and includes a plastic substrate and two filter layers, wherein the two filter layers are respectively arranged on the upper surface and the lower surface of the plastic substrate.

In the image sensing module of the embodiment of the present invention, since the filter adopts a plastic substrate, the thickness of the filter is relatively thin and does not have the problem of fragility or breakage, so that the image sensor of the embodiment of the present invention The thickness of the module is reduced, and the process yield is improved.

Description of the drawings

The accompanying drawings are included for further understanding of the present invention, and the accompanying drawings are incorporated into this specification and constitute a part of this specification. The drawings illustrate embodiments of the present invention, and together with the description serve to explain the principles of the present invention.

FIG. 1 is a schematic cross-sectional view of an image sensor module according to an embodiment of the invention.

2 is a schematic cross-sectional view of an image sensor module according to another embodiment of the invention.

Attached icon number description

100: Image sensor module

110: bottom plate

120: Image sensor chip

122: conductive pad

130: Micro lens array

140: Spacer

150: filter

152: Plastic substrate

154: filter layer

160: Flexible printed circuit board

170: Chip Attachment Film

180: Bonding line

T1: Thickness

detailed description

Reference will now be made in detail to the exemplary embodiments of the present invention, and examples of the exemplary embodiments are illustrated in the accompanying drawings. Whenever possible, the same component symbols are used in the drawings and descriptions to indicate the same or similar parts.

FIG. 1 is a schematic cross-sectional view of an image sensor module according to an embodiment of the invention. Please refer to FIG. 1, the image sensor module 100 of this embodiment includes an image sensor chip 120, a microlens array 130 and a filter 150. The micro lens array 130 is disposed on the image sensor chip 120, and the filter 150 is disposed above the micro lens array 130. In one embodiment, the image sensor chip 120 is, for example, a complementary metal oxide semiconductor image sensor chip, a charge coupled device chip, or other appropriate image sensor chip. The microlens array 130 may have a plurality of microlenses arranged in an array and arranged on the image sensor chip 120. The filter 150 includes a plastic substrate 152 and a filter layer 154, wherein the filter layer 154 is disposed on the plastic substrate 152.

In this embodiment, the image sensor module 100 further includes a bottom plate 110, a flexible printed circuit board 160 and a spacer 140. The image sensor chip 120 and the flexible printed circuit board 160 are both arranged on the bottom plate 110, the spacer 140 is arranged on the flexible printed circuit board 160, and the filter 150 is arranged on the flexible printed circuit board 160 through the spacer 140 to configure Above the micro lens array 130. In this embodiment, the flexible printed circuit board 160 is disposed around the image sensor chip 120. In one embodiment, the image sensor chip 120 can be attached to the bottom plate 110 by a die attach film 170.

In addition, in this embodiment, the image sensor chip 120 has at least one conductive pad 122, and the image sensor module 100 includes at least one bonding wire 180, which electrically connects the conductive pad 122 and the flexible printed circuit board 160, So that the image sensor chip 120 and the flexible printed circuit board 160 are electrically connected to each other. In one embodiment, the bonding wire 180 and the conductive pad 122 are located between the micro lens array 130 and the spacer 240.

In the image sensor module 100 of this embodiment, since the filter 150 adopts the plastic substrate 152, the thickness of the filter 150 is relatively thin and there is no problem of fragility or breakage, so that the image sensor of this embodiment The thickness of the module 100 is reduced, and the process yield is improved.

In this embodiment, the filter layer 154 is disposed on the upper surface of the plastic substrate 152. However, in other embodiments, the filter layer 154 may also be disposed on the lower surface of the plastic substrate 152, or the plastic substrate A filter layer 154 is disposed on both the upper surface and the lower surface of 152, as shown in FIG. 2. In addition, in this embodiment, the filter layer 154 is, for example, a multilayer film made using the principle of thin film interference, which can filter infrared light. In other words, the filter layer 154 is, for example, an infrared light cut filter layer, and the filter 150 is, for example, an infrared light cut filter. In this embodiment, the thickness T1 of the plastic substrate 152 is in the range of 50 micrometers to 150 micrometers, preferably in the range of 60 micrometers to 100 micrometers. In other words, even if the thickness T1 of the plastic substrate 152 is designed to be thin, the glass substrate will not be brittle and easy to break, and the thickness of the image sensor module 100 can be effectively reduced and the process yield can be improved.

To sum up, in the image sensing module of the embodiment of the present invention, since the filter adopts a plastic substrate, the thickness of the filter is relatively thin and there is no problem of fragility or breakage, thereby enabling the implementation of the present invention. The thickness of the image sensor module of the example is reduced, and the process yield is improved.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: The technical solutions recorded in the foregoing embodiments can still be modified, or some or all of the technical features can be equivalently replaced; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the technical solutions of the embodiments of the present invention. range.

Claims

An image sensing module, characterized in that it comprises:

Image sensor chip;

The micro lens array is configured on the image sensor chip; and

The filter is disposed above the micro lens array and includes:

Plastic substrate; and

The filter layer is arranged on the plastic substrate.
The image sensor module of claim 1, wherein the thickness of the plastic substrate falls within a range of 50 micrometers to 150 micrometers.
3. The image sensor module of claim 1, further comprising a bonding wire for electrically connecting the image sensor chip and the flexible printed circuit board.
4. The image sensing module of claim 3, further comprising:

A bottom plate, wherein the image sensor chip is disposed on the bottom plate, and the flexible printed circuit board is disposed on the bottom plate; and

The spacer is arranged on the flexible printed circuit board, wherein the filter is arranged on the flexible printed circuit board through the spacer so as to be arranged above the micro lens array.
4. The image sensor module of claim 4, wherein the image sensor chip has conductive pads, and the bonding wires are electrically connected to the conductive pads and the flexible printed circuit board.
5. The image sensor module of claim 5, wherein the bonding wire and the conductive pad are located between the micro lens array and the spacer.
The image sensor module of claim 1, wherein the filter layer is an infrared cut filter layer.
An image sensing module, characterized in that it comprises:

Image sensor chip;

The micro lens array is configured on the image sensor chip; and

The filter is disposed above the micro lens array and includes:

Plastic substrate; and

Two filter layers are respectively arranged on the upper surface and the lower surface of the plastic substrate.
8. The image sensor module of claim 8, wherein the thickness of the plastic substrate falls within a range of 50 micrometers to 150 micrometers.
8. The image sensor module of claim 8, further comprising a bonding wire to electrically connect the image sensor chip and the flexible printed circuit board.
10. The image sensing module of claim 10, further comprising:

A bottom plate, wherein the image sensor chip is disposed on the bottom plate, and the flexible printed circuit board is disposed on the bottom plate; and

The spacer is arranged on the flexible printed circuit board, wherein the filter is arranged on the flexible printed circuit board through the spacer so as to be arranged above the micro lens array.
11. The image sensor module of claim 11, wherein the image sensor chip has conductive pads, and the bonding wires are electrically connected to the conductive pads and the flexible printed circuit board.
The image sensor module of claim 12, wherein the bonding wire and the conductive pad are located between the micro lens array and the spacer.
8. The image sensor module of claim 8, wherein the two filter layers are infrared light cut filter layers.