CN103633102B - The modular structure of window type image sensing chip - Google Patents
The modular structure of window type image sensing chip Download PDFInfo
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- CN103633102B CN103633102B CN201210299889.9A CN201210299889A CN103633102B CN 103633102 B CN103633102 B CN 103633102B CN 201210299889 A CN201210299889 A CN 201210299889A CN 103633102 B CN103633102 B CN 103633102B
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Abstract
The invention discloses the modular structure of a kind of window type image sensing chip, including: a first substrate；One chip, is configured on first substrate, has one first engagement pad and a sensing region；One second substrate, is configured on first substrate, has a perforation structure and one second engagement pad, and its chips is placed in perforation structure, and the first engagement pad is electrically connected with the second engagement pad through a sealing wire；One lens mount, is configured on second substrate, and lens are positioned at the top of lens mount, and a transparency carrier is configured on lens mount or second substrate, wherein lens alignment transparency carrier and sensing region.
Description
Technical field
The present invention relates to a kind of semiconductor assembly structure, integrate lens mount and image sensor with fall particularly to one
The modular structure of the window type image sensing chip of low size of components.
Background technology
Semiconductor technology is fast-developing, and in traditional flip chip structure, stannum ball array is formed at the surface of crystal grain, through tradition
Tin cream by stannum ball cover screen making to form desired pattern.Encapsulation function includes heat radiation, signal transmission, power distribution, guarantor
Protecting, when chip is more complicated, traditional encapsulation such as leaded package, soft encapsulation, rigidity encapsulation, cannot to meet high density little
The demand of scale chips.Wafer level packaging is advanced packaging technology, and its crystal grain of mat lies in and manufactured on wafer and test,
And then mat cuts and separates and assemble in surface mount production line.Because Wafer level packaging utilizes whole wafer to make
For target, and non-used one chip or crystal grain, therefore before carrying out separable programming, encapsulate and test the most completing.Additionally,
Wafer-level packaging system so advanced techniques, therefore routing engages, crystal grain sticks together and the program of underfill can be omitted.Mat
Utilizing Wafer level packaging, the end-results size that can reduce cost and manufacturing time and wafer-level packaging can be equivalent to crystal grain
Size, so technology can meet the miniaturization demand of electronic installation.
Now the Flip Chip system for camera module carries out tie lines projection (stud with routing device on full wafer wafer
Bump) processing procedure, is replaced stannum ball by tie lines projection.
By Electronic Encapsulating Technology, CMOS field-effect transistor (CMOS) image sensor dice is made in CMOS
Among image sensor module.This module is applied in various electronic product, and needed for CMOS module
Encapsulation specification demands depends on the characteristic of this product.The tendency of the most nearest CMOS module, high electrical performance
Power, miniaturization, high density, low-power consumption, multi-functional, igh-speed wire-rod production line and reliability etc., be the miniaturization of electronic product
Typical characteristic.
In contrast to general CMOS chip, the CMOS physical environment in the past is feasible, so may quilt
Impurity pollutes；When its size is not qualified as important, the encapsulation of leadless chip carrier LCC kenel can be used.But,
Nearest market trend, it is desirable to thinning and the feature of simplification, such as camera cell phone, intelligent mobile phone, chip on board
(chip-on-board:COB), chip-on-film (chip-on-film:COF) or chip size packages (CSP) etc., the most generally
Ground is used.
In current composite packing structure, although can reduce the height of modular structure, but the machine of chip package
Equipment is prohibitively expensive and its volume production speed (Unit Per Hour) is the slowest.Therefore, its investment needs huge funds, and good
Rate is low and wayward.
According to the shortcoming of above known techniques, the present invention proposes the module of a kind of brand-new window type image sensing chip
Structure, it is not necessary to newly-increased cost of investment, and preferably process rate can be obtained.
Summary of the invention
In view of above-mentioned shortcoming, one of present invention purpose is that the module providing a kind of window type image sensing chip is tied
Structure, has relatively thin modular structure.
Another object of the present invention is to provide the window type image sensing chip of an integration lens mount and image sensor
Modular structure, it is possible to use standard identical TTL lens design, result is promoted yield, reliability and reduction module
Physical dimension.
Still a further object of the present invention is to provide and has good thermal efficiency (thermal performance), with low cost
And the modular structure of processing procedure easy window type image sensing chip.
For reaching above-mentioned purpose, the present invention by the following technical solutions:
A kind of modular structure of window type image sensing chip, including: a first substrate；One chip, is configured at the first base
On plate, there is one first engagement pad and a sensing region；One second substrate, is configured on first substrate, has a perforation
Structure and one second engagement pad, its chips is placed in perforation structure, and the first engagement pad is electrically connected with second through a sealing wire
Engagement pad；One lens mount, is configured on second substrate, and lens are positioned on lens mount, wherein lens alignment sensing area
Territory.
The lens mount of above-mentioned modular structure includes a first half and a lower half, and lens configuration is in the first half, transparency carrier
It is positioned at lower half.Second substrate is attached on first substrate through a conductive layer, to be electrically connected with each other.Additionally, the first base
Plate is a printed circuit board (PCB) or flexible printed wiring board, and it has a wire.Chip is attached to the first base through an adhesion layer
On plate.
In another example, the upper surface of second substrate includes the region of two differing heights, wherein the second contact pulvilliform
Become on the relatively low surface area of height；In another example, transparency carrier is formed at the most of a relatively high upper
On region, surface.
In another example, above-mentioned modular structure also includes a protective layer, is formed at chip, second substrate and first substrate
On, protective layer can completely, part or do not cover sealing wire.
The above is in order to illustrate the purpose of the present invention, the technological means reaching this purpose and its advantage etc. produced
Deng.And the present invention can be from the narration of preferred embodiments below and to make reader be able to rear accompanying drawings and claim clear
Solve.
Accompanying drawing explanation
Said modules, and this creation further feature and advantage, by read embodiment content and graphic after, will
Become apparent from:
Fig. 1 is the schematic cross-section of composite packing structure.
Fig. 2 is the schematic cross-section of the modular structure of the window type image sensing chip according to the present invention.
Fig. 3 is the schematic cross-section of the modular structure of the window type image sensing chip according to one embodiment of the invention.
Fig. 4 is the cross section signal of the modular structure of the window type image sensing chip according to another embodiment of the present invention
Figure.
Fig. 5 is the cross section signal of the modular structure of the window type image sensing chip according to one more embodiment of the present invention
Figure.
Fig. 6 is the cross section signal of the modular structure of the window type image sensing chip according to another embodiment of the present invention
Figure.
Fig. 7 is the schematic cross-section of the modular structure of the window type image sensing chip according to one embodiment of the invention.
Primary clustering symbol description
100 composite packing structure 101,201 lens 102,202 transparency carriers
103 holder part 104,203 lens mount 105,206 chips
106,209,209a, 211 substrate 107 passive component 108,110 conductive layers
The modular structure of 109 printed circuit board (PCB) 111 heat dissipating layer 200 window type image sensing chips
203a lens mount first half 203b lens mount lower half 204,204a, 204b, 204c adhesion layer
205 sealing wire 206a sensing region 207,208 engagement pads
210 adhesion layers (glue) pattern 210a conductive layer 220 protective layer
Detailed description of the invention
Cooperation embodiment graphic is specified in down by the present invention with enclose.It should be appreciated that person is enforcement all in the present invention
Example only illustration is used, and is not used to limit.Therefore, in addition to the embodiment in literary composition, it is real that the present invention also can be widely used in other
Execute in example.And the present invention is not limited to any embodiment, should be with the claim enclosed and equivalent fields thereof depending on.
The present invention provides the modular structure of a kind of window type image sensing chip, and this structure can utilize chip direct package
(chip-on-board:COB) processing procedure completes.Chip direct package is a kind of mode of integrated antenna package, and it is by core
Sheet is directly attached on circuit board or substrate, after the packaging and testing step of chip can be transferred to circuit board assembling effectively
Carry out.
Fig. 1 is the sectional view of composite packing structure.As shown in the first figure, wherein composite packing structure 100 includes substrate
106, chip 105, passive component 107, lens mount 104, lens 101 and transparency carrier 102.Substrate 106 has and is formed at it
Interior groove structure is to receive chip 105 and conductive layer 108.Chip 105 and conductive layer 108 are formed under substrate 106, its
Middle conductive layer 108 is electrically connected with substrate 106 and the electric contact mat on chip 105.Lens mount 104 includes a holder part 103,
For fixing lens 101.At least one passive component 107 can be formed on (attachment) substrate 106 in lens mount 104.Thoroughly
Mirror 101 is formed at the top of lens mount 104.It addition, transparency carrier 102, within being optionally configured at lens mount 104,
And between lens 101 and chip 105.Lens mount 104 can utilize an adhesion layer to be attached on substrate 106.Additionally, flip
Encapsulating structure also includes a printed circuit board (PCB) 109.The printed circuit board (PCB) 109 extension area outside the substrate 106 of modular structure
Territory, has wire to be electrically connected with other electronic unit.Substrate 106 through a conductive layer 110 be attached to printed circuit board (PCB) 109 it
On, to be electrically connected with each other.Form a heat dissipating layer 111 between chip 105 and printed circuit board (PCB) 109 and be beneficial to heat radiation.
Second figure is the mould of the window type image sensing chip of the integration lens mount according to the present invention and image sensor
The sectional view of block structure.As in figure 2 it is shown, wherein the modular structure 200 of window type image sensing chip integrates lens mount and shadow
Become a modular structure with photosensitization as sensor, its can apply to mobile phone or other portable electronic assembly it
Camera module.Wherein the modular structure 200 of window type image sensing chip includes on substrate 209 and 211, chip 206, lens mount
Half portion/lower half 203a/203b, lens 201 and transparency carrier 202.
The upper surface of chip 206 is exposed in perforation structure completely, and sensing region 206a is naked with engagement pad (I/O pad) 208
It is exposed to window area.In an example, chip 206 is electrically connected with the wire on substrate 211.For example, chip 206 is a shadow
As sensor, its upper surface has a sensing region 206a and engagement pad 208 is formed thereon；Substrate 211 is a printing electricity
Road plate or flexible printed wiring board.
Engagement pad 208 in engagement pad 207 that sealing wire 205 is electrically connected with on substrate 209 and chip 206, it is permissible
A sealing wire processing procedure is utilized to complete.
Lens mount (including first half 203a and lower half 203b) is attached on substrate 209, to form modular structure
200.Lens mount can be simple working of plastics or drive mechanism (actuator).Additionally, lens mount can also integrate the first half with
Lower half is same parts.Transparency carrier 202 directly forms (attachment) on the 203b of lens mount lower half；One can be initially formed
Adhesion layer 204a is on the 203b of lens mount lower half, and transparency carrier 202 is attached under lens mount by adhesion layer 204a again
On half 203b.The substrate that a transparency carrier 202 for example, glass substrate or other transparent material are formed, is configured at lens
With rough alignment sensing region 206a on the 203b of frame lower half；Lens mount lower half 203b has a perforation structure so that thoroughly
Bright substrate 202 covers perforation structure, can allow the light through transparency carrier 202 completely will not be shielded, and directly arrives sensing
Region 206a.Transparency carrier 202 covers the perforation structure of lens mount lower half 203b so that sensing region 206a and transparency carrier
A closing space is formed, it is possible to reduce particle pollution is with Lifting Modules block structured yield between 202.Transparency carrier 202 can be with
Sensing region 206a occupied area is identical or slightly larger.
Transparency carrier (glass substrate) 202 can be circular or square kenel.Transparency carrier 202 can optionally be coated with
Infrared coating, for example, infrared filter, for the light wave of a certain wave band being filtered through lens 201.At an example
In, transparency carrier 202 can be attached to by viscose on the lower half 203b of lens mount.
Wherein lens 201 are fixed among the first half 203a of lens mount, through lens mount first half 203a with support
Lens 201.Additionally, lens mount can also be fixed on substrate 209 to support lens 201.Lens 201 can optionally configure
The top in lens mount.In the modular structure 200 of the present embodiment, transparency carrier 202 is optionally configured at lens mount
Within, and between lens 201 and chip 206.In other words, lens 201 rough alignment transparency carrier 202 and chip 206 so that
Light can be directly incident on sensing region 206a.
Substrate 209 is attached on substrate 211 by conductive layer 210a.Wire on substrate 209 is passed through conduction
Layer 210a and be electrically connected with the wire on substrate 211.In one of present invention embodiment, the material of conductive layer 210a includes conduction
Glue or conducting film, can pass through a printing, coating or other processing procedure to form a pattern on substrate.Conductive material layer 210a can
To be selectively formed on substrate 211.For an embodiment, substrate 209 has the perforation structure being formed within, with
Receive or accommodate chip 206 and be configured among perforation structure.Perforation structure runs through upper surface and the lower surface of substrate 209.
Generally through-hole structure is positioned at the mid portion of substrate 209.The size of substrate 209 is big compared with the size of chip 206.At the present embodiment
In, based in substrate 209, there is perforation structure, be equivalent to substrate 209 and open a window area.Additionally, the upper surface of substrate 209
Form an engagement pad 207.In addition chip 206 can be directed through adhesion layer 210 and is attached on substrate 211.Adhesion layer 210 with
Conductive layer 210a can utilize identical or differ material, be connected or be not attached to, and adhesion layer 210 can utilize single processing procedure/material
Made by material or multiple processing procedure/material.There is no the region of overlapping between substrate 209 and chip 206, therefore integral module structure it
Highly become is less.
The size of substrate 211 is more than the size of substrate 209 so that after the two sticks together, substrate 211 is able to substrate 209
Outside extend.And lens mount integrates transparency carrier 202, substrate 209, a part for substrate 211 and image sensor 106, with
Form cube modular structure.Extend outside cube modular structure based on substrate 211, obtain through the wire on substrate 211
With other assembly that the electric signal in modular structure 200 is transferred to outside structure.
As it is shown on figure 3, be another embodiment of the modular structure of the window type image sensing chip of the present invention.In this enforcement
In example, the upper surface of substrate 209a includes the region of two differing heights, and wherein engagement pad 207 is formed at the most relatively low
On surface area, so that the rough engagement pad 208 being equivalent to chip 206 of the height of the engagement pad 207 of substrate 209a
Highly；And adhesion layer 204b is formed on the most of a relatively high surface area, so that the lower half 203b of lens mount
Stick together the surface area of substrate 209a.Other structure division is similar to Fig. 2, omits detailed description.
As shown in Figure 4, for the another embodiment of modular structure of window type image sensing chip of the present invention.Similarly,
In the present embodiment, the upper surface of substrate 209a includes the region of two differing heights, and wherein engagement pad 207 is formed at height phase
On relatively low surface area；And adhesion layer 204 is formed on the most of a relatively high surface area, so that thoroughly
Mirror holder 203 around sticks together the surface area of substrate 209a.Additionally, transparency carrier 202 directly forms (attachment) in substrate
On the most of a relatively high surface area of 209a；An adhesion layer 204c can be initially formed on surface area, so
Rear transparency carrier 202 is attached to it by adhesion layer 204c.In other words, within transparency carrier 202 is formed at lens mount 203
Rather than on it (embodiment as above).Other structure division is similar to Fig. 3, omits it and describes in detail.
As it is shown in figure 5, be the another embodiment of the modular structure of the window type image sensing chip of the present invention.In this enforcement
In example, modular structure is similar to the modular structure of Fig. 2.The modular structure 200 of the present embodiment also includes that a protective layer 220 is formed at core
On sheet 206, substrate 209 and support plate, it can completely, partly or do not cover sealing wire 205；And insert chip 206 and base
Gap between plate 209, and exposed sensing region 206a.The material of protective layer 220 for example, one glue (glue).
As shown in Figure 6, for one of the modular structure of the window type image sensing chip embodiment of the present invention.At the present embodiment
In, similar Fig. 5, it is that the upper surface of wherein substrate 209a includes the region of two differing heights, structure division at unique difference
In above describing, therefore omit detailed description.
As it is shown in fig. 7, be the another embodiment of the modular structure of the window type image sensing chip of the present invention.Similarly,
In the present embodiment, the upper surface of substrate 209a includes the region of two differing heights, and wherein engagement pad 207 is formed at height phase
On relatively low surface area；And adhesion layer 204 is formed on the most of a relatively high surface area, so that thoroughly
Mirror holder 203 around sticks together the surface area of substrate 209a.Transparency carrier 202 directly forms (attachment) in the height of substrate 209a
Spend on of a relatively high surface area.Similarly, within transparency carrier 202 is formed at lens mount 203 rather than (as front on it
The embodiment in face).Other structure division is similar to the 6th figure, omits it and describes in detail.
In one of present invention embodiment, substrate 209 is a printed circuit board (PCB), and its material can be organic substrate, such as, have
Have epoxide resin type FR5 or FR4 (glass-fiber-fabric epoxy resin) of default perforate, vinegar amine-three pyridine fat (BT:
Bismaleimide Triazine).Additionally, glass, pottery and silicon can also be as the materials of substrate 209.
The advantage of the present invention includes: have relatively thin modular structure, utilizes the easiest and relatively inexpensive sealing wire processing procedure,
Good thermal efficiency, with low cost and processing procedure is simple, easily makes multi-chip package.
The above, the only detailed description of the invention of the present invention, but protection scope of the present invention is not limited thereto, and any
Those familiar with the art, in the technical scope that the invention discloses, can readily occur in change or replace, should contain
Cover within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with described scope of the claims.
Claims (13)
1. the modular structure of a window type image sensing chip, it is characterised in that including:
One first substrate；
One chip, is configured on first substrate, has one first engagement pad and a sensing region；
One second substrate, is configured on first substrate, has a perforation structure and one second engagement pad, and its chips is placed in wears
In pore structure, the first engagement pad is electrically connected with the second engagement pad through a sealing wire, the upper surface bag of wherein said second substrate
Including the region of two differing heights, the second engagement pad is formed on the most relatively low surface area；And
One lens mount, is configured on second substrate, and lens are positioned at the top of lens mount, wherein lens alignment sensing region.
2. the modular structure of window type image sensing chip as claimed in claim 1, it is characterised in that described first substrate is saturating
Cross a conductive layer to be attached on second substrate.
3. the modular structure of window type image sensing chip as claimed in claim 1, it is characterised in that also include a protective layer,
Be formed on chip, second substrate and first substrate, protective layer completely, part or do not cover sealing wire.
4. the modular structure of window type image sensing chip as claimed in claim 1, it is characterised in that described first substrate is
One flexible printed wiring board, second substrate is a printed circuit board (PCB), and described printed circuit board (PCB) material includes glass-fiber-fabric epoxy resin
Type, BMI-triazine resin, glass, silicon and pottery one of them, described first substrate and described second substrate
On there is its respective wire.
5. the modular structure of window type image sensing chip as claimed in claim 1, it is characterised in that also include a protective layer,
Be formed on chip, second substrate and first substrate, protective layer completely, part or do not cover sealing wire.
6. the modular structure of window type image sensing chip as claimed in claim 1, it is characterised in that also include a transparent base
Plate is formed on the most of a relatively high surface area.
7. the modular structure of window type image sensing chip as claimed in claim 6, it is characterised in that also include a protective layer,
Be formed on chip, second substrate and first substrate, protective layer completely, part or do not cover sealing wire.
8. the modular structure of window type image sensing chip as claimed in claim 1, it is characterised in that also include a transparent base
Plate, is configured on lens mount or second substrate, wherein lens alignment transparency carrier and sensing region.
9. the modular structure of window type image sensing chip as claimed in claim 8, it is characterised in that described first substrate is saturating
Cross a conductive layer to be attached on second substrate.
10. the modular structure of window type image sensing chip as claimed in claim 8, it is characterised in that also include a protection
Layer, is formed on chip, second substrate and first substrate, protective layer completely, part or do not cover sealing wire.
The modular structure of 11. window type image sensing chips as claimed in claim 8, it is characterised in that described first substrate is
One flexible printed wiring board, described second substrate is a printed circuit board (PCB), and described printed circuit board (PCB) material includes glass-fiber-fabric epoxy
Resin type, BMI-triazine resin, glass, silicon and pottery one of them, described first substrate and described second
There is on substrate its respective wire.
The modular structure of 12. window type image sensing chips as claimed in claim 8, it is characterised in that described transparency carrier shape
Become on the of a relatively high surface area of height.
The modular structure of 13. window type image sensing chips as claimed in claim 8, it is characterised in that also include a protection
Layer, is formed on chip, second substrate and first substrate, protective layer completely, part or do not cover sealing wire.
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| CN201210299889.9A CN103633102B (en) | 2012-08-21 | 2012-08-21 | The modular structure of window type image sensing chip |
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| CN201210299889.9A CN103633102B (en) | 2012-08-21 | 2012-08-21 | The modular structure of window type image sensing chip |
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| CN103633102A CN103633102A (en) | 2014-03-12 |
| CN103633102B true CN103633102B (en) | 2016-12-28 |
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| CN110911434A (en) * | 2019-09-23 | 2020-03-24 | 神盾股份有限公司 | Image sensing module |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1433081A (en) * | 2002-01-18 | 2003-07-30 | 胜开科技股份有限公司 | Image sensor and its packaging method |
| US7282788B2 (en) * | 2005-09-14 | 2007-10-16 | Sigurd Microelectronics Corp. | Image sensing chip package structure |
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| US20070064317A1 (en) * | 2005-09-22 | 2007-03-22 | Po-Hung Chen | Image sensor package structure |
| US20070096280A1 (en) * | 2005-11-01 | 2007-05-03 | Tu Hsiu W | Image sensor module structure and a method for manufacturing the same |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1433081A (en) * | 2002-01-18 | 2003-07-30 | 胜开科技股份有限公司 | Image sensor and its packaging method |
| US7282788B2 (en) * | 2005-09-14 | 2007-10-16 | Sigurd Microelectronics Corp. | Image sensing chip package structure |
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