CN103633102A - Modular structure of window-type image sensing chip - Google Patents
Modular structure of window-type image sensing chip Download PDFInfo
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- CN103633102A CN103633102A CN201210299889.9A CN201210299889A CN103633102A CN 103633102 A CN103633102 A CN 103633102A CN 201210299889 A CN201210299889 A CN 201210299889A CN 103633102 A CN103633102 A CN 103633102A
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Abstract
The invention discloses a modular structure of a window-type image sensor chip, the modular structure comprising a first substrate; a chip disposed on the first substrate and provided with a first contact pad and a sensing region; a second substrate disposed on the first substrate and provided with a perforated structure and a second contact pad, wherein the chip is disposed in the perforated structure and the first contact pad is electrically connected to the second contact pad through a welding wire; and a lens holder configured on the second substrate, with a lens located above the lens holder and a transparent substrate disposed on the lens holder or the second substrate, wherein the lens is directed to the transparent substrate and the sensing region.
Description
Technical field
The present invention relates to a kind of semiconductor assembly structure, particularly a kind of lens mount and image sensor integrated is to reduce the modular structure of the window type image sensing chip of size of components.
Background technology
Semiconductor technology is fast-developing, and in traditional flip chip structure, tin nodule number group is formed at the surface of crystal grain, see through traditional tin cream by tin ball cover screen making to form desired pattern.Encapsulation function comprises heat radiation, signal transmission, power distribution, protection etc., when chip more complicated, traditional encapsulation as leaded package, soft encapsulation, rigidity encapsulation, cannot meet the demand of high density small-size chips.Wafer level packaging is senior encapsulation technology, and its crystal grain of mat lies on wafer to be manufactured and test, and then mat cutting and separated for assembling in surface mount production line.Because Wafer level packaging utilizes whole wafer as target, but not utilize one chip or crystal grain, therefore, before carrying out separable programming, encapsulation and test complete all.In addition, wafer-level packaging is advanced techniques so, so the program that routing engages, crystal grain sticks together and fill bottom can be omitted.Mat utilizes Wafer level packaging, and the end-results size that can reduce cost and manufacturing time and wafer-level packaging can be equivalent to grain size, so technology can meet the microminiaturized demand of electronic installation.
Now the Flip Chip system for camera module carries out the processing procedure of tie lines projection (stud bump) on full wafer wafer with routing device, by tie lines projection, replaces tin ball.
By Electronic Encapsulating Technology, CMOS field-effect transistor (CMOS) image sensor dice is made among CMOS image sensor module.This module is applied in various electronic products, and the required encapsulation specification demands of CMOS image sensor module depends on the characteristic of this product.The tendency of especially nearest CMOS image sensor module, high electrical performance power, miniaturization, high density, low-power consumption, multi-functional, high speed signal is processed and reliability etc., is the characteristic feature of the miniaturization of electronic product.
In contrast to general CMOS chip, CMOS image sensor physical environment is in the past feasible, so may be by contaminating impurity; When its size is not considered to important, the encapsulation of leadless chip carrier LCC kenel can be used.Yet, in nearest market trend, require the feature of thinning and simplification, for example camera cell phone, intelligent mobile phone, chip on board (chip-on-board:COB), chip-on-film (chip-on-film:COF) or chip size packages (CSP) etc., be also used at large.
In current composite packing structure, though can reduce the height of modular structure, the machinery equipment of chip package is too expensive and its volume production speed (Unit Per Hour) is excessively slow.Therefore, its investment needs huge funds, and yield is low and wayward.
According to the shortcoming of above known techniques, the present invention proposes a kind of modular structure of brand-new window type image sensing chip, without newly-increased cost of investment, and can obtain preferably process rate.
Summary of the invention
In view of above-mentioned shortcoming, one of the present invention object is to provide a kind of modular structure of window type image sensing chip, has thinner modular structure.
Another object of the present invention is to provide the modular structure of the window type image sensing chip of an integration lens mount and image sensor, can utilize the TTL lens design that standard is identical, and result is promoted yield, reliability and reduces modular structure size.
Still a further object of the present invention is to provide the modular structure of have good thermal efficiency (thermal performance), the with low cost and easy window type image sensing chip of processing procedure.
For achieving the above object, the present invention by the following technical solutions:
A modular structure for window type image sensing chip, comprising: a first substrate; One chip, is disposed on first substrate, has one first contact pad and a sensing region; One second substrate, is disposed on first substrate, has a perforation structure and one second contact pad, and its chips is placed in perforation structure, and the first contact pad sees through a sealing wire and is electrically connected the second contact pad; One lens mount, is disposed on second substrate, and lens are positioned on lens mount, wherein lens alignment sensing region.
The lens mount of above-mentioned modular structure comprises a first half and a Lower Half, and lens configuration is in the first half, and transparency carrier is positioned at Lower Half.Second substrate sees through a conductive layer and is attached on first substrate, to be electrically connected each other.In addition, first substrate is a printed circuit board (PCB) or flexible printed wiring board, has a wire on it.Chip sees through an adhesion layer and is attached on first substrate.
In another example, on second substrate, surface comprises the region of two differing heights, and wherein the second contact pad is formed on highly relatively low surface area; In an example again, transparency carrier is formed on highly relatively high surface area.
In another example, above-mentioned modular structure also comprises a protective layer, is formed on chip, second substrate and first substrate, and protective layer can be completely, part or do not cover sealing wire.
The above in order to illustrating object of the present invention, reach this object technological means, with and the advantage that produces etc.And the present invention can and follow from the narration of following preferred embodiment accompanying drawing formula and claim reader is had a clear understanding of.
Accompanying drawing explanation
Said modules, and this creation further feature and advantage, by read execution mode content and graphic after, will be more obvious:
Fig. 1 is the schematic cross-section of composite packing structure.
Fig. 2 is according to the schematic cross-section of the modular structure of window type image sensing chip of the present invention.
Fig. 3 is according to the schematic cross-section of the modular structure of the window type image sensing chip of one embodiment of the invention.
Fig. 4 is the schematic cross-section of the modular structure of window type image sensing chip according to another embodiment of the present invention.
Fig. 5 is according to the schematic cross-section of the modular structure of the window type image sensing chip of an embodiment more of the present invention.
Fig. 6 is the schematic cross-section of the modular structure of window type image sensing chip according to still another embodiment of the invention.
Fig. 7 is according to the schematic cross-section of the modular structure of the window type image sensing chip of one embodiment of the invention.
Primary clustering symbol description
100 composite packing structure 101,201 lens 102,202 transparency carriers
103 holder part 104,203 lens mount 105,206 chips
106,209,209a, 211 substrate 107 passive component 108,110 conductive layers
The modular structure of 109 printed circuit board (PCB) 111 heat dissipating layer 200 window type image sensing chips
203a lens mount first half 203b lens mount Lower Half 204,204a, 204b, 204c adhesion layer
205 sealing wire 206a sensing region 207,208 contact pads
210 adhesion layers (glue) pattern 210a conductive layer, 220 protective layers
Embodiment
The present invention is by cooperation embodiment and graphic being specified in down of enclosing.Should the person of understanding be that in the present invention, all embodiment are only the use of illustration, not in order to restriction.Therefore the embodiment in literary composition, the present invention also can be widely used in other embodiment.And the present invention is not limited to any embodiment, should be with the claim of enclosing and equivalent fields thereof and determine.
The invention provides a kind of modular structure of window type image sensing chip, this structure can utilize the processing procedure of chip direct package (chip-on-board:COB) to complete.Chip direct package is a kind of mode of integrated antenna package, and it is that chip is directly attached on circuit board or substrate, can effectively the packaging and testing step of chip be transferred to circuit board assembling and carry out afterwards.
Fig. 1 is the sectional view of composite packing structure.As shown in the first figure, wherein composite packing structure 100 comprises substrate 106, chip 105, passive component 107, lens mount 104, lens 101 and transparency carrier 102.Substrate 106 has formation groove structure in the inner with receiving chip 105 and conductive layer 108.Chip 105 is formed under substrate 106 with conductive layer 108, the electric contact mat that wherein conductive layer 108 is electrically connected on substrate 106 and chip 105.Lens mount 104 comprises a holder part 103, for fixed lens 101.At least one passive component 107 can form on (adhering to) substrate 106 in lens mount 104.Lens 101 are formed at the top of lens mount 104.In addition, transparency carrier 102, within being optionally disposed at lens mount 104, and between lens 101 and chip 105.Lens mount 104 can utilize an adhesion layer to be attached on substrate 106.In addition, composite packing structure also comprises a printed circuit board (PCB) 109.The elongated area of printed circuit board (PCB) 109 outside the substrate 106 of modular structure, has wire to be electrically connected other electronic unit.Substrate 106 sees through a conductive layer 110 and is attached on printed circuit board (PCB) 109, to be electrically connected each other.109 of chip 105 and printed circuit board (PCB)s form a heat dissipating layer 111 and are beneficial to heat radiation.
The second figure is the sectional view of modular structure of the window type image sensing chip of integration lens mount according to the present invention and image sensor.As shown in Figure 2, wherein the modular structure 200 of window type image sensing chip is integrated lens mounts and image sensor and is become a modular structure with photosensitization, and it can be applied to the camera module of mobile phone or other portable electronic assembly.Wherein the modular structure 200 of window type image sensing chip comprises substrate 209 and 211, chip 206, the lens mount first half/Lower Half 203a/203b, lens 201 and transparency carrier 202.
On chip 206, surface is exposed in perforation structure completely, and sensing region 206a and contact pad (I/O pad) 208 is exposed to window area.In an example, the wire that chip 206 is electrically connected on substrate 211.For example, chip 206 is an image sensor, its upper surface there is a sensing region 206a and contact pad 208 formed thereon; Substrate 211 is a printed circuit board (PCB) or flexible printed wiring board.
Contact pad 207 on sealing wire 205 electric connection substrates 209 and the contact pad 208 on chip 206, it can utilize a sealing wire processing procedure to complete.
Lens mount (comprising first half 203a and Lower Half 203b) is attached on substrate 209, to form modular structure 200.Lens mount can be simple working of plastics or driving mechanism (actuator).In addition, lens mount can also be integrated the first half and Lower Half is same parts.Transparency carrier 202 directly forms (adhering to) on lens mount Lower Half 203b; Can first form an adhesion layer 204a on lens mount Lower Half 203b, transparency carrier 202 is attached on lens mount Lower Half 203b by adhesion layer 204a again.The substrate that transparency carrier 202 is for example formed by a glass substrate or other transparent material, is disposed on lens mount Lower Half 203b with rough aligning sensing region 206a; Lens mount Lower Half 203b has a perforation structure, makes transparency carrier 202 cover perforation structures, and can allow completely can crested through the light of transparency carrier 202, and directly arrives sensing region 206a.Transparency carrier 202 covers the perforation structure of lens mount Lower Half 203b, makes to form an enclosure space between sensing region 206a and transparency carrier 202, can reduce particle pollution with Lifting Modules block structured yield.Transparency carrier 202 can be identical with sensing region 206a area occupied or slightly larger than it.
Transparency carrier (glass substrate) 202 can be circular or square kenel.Transparency carrier 202 can optionally be coated with infrared coating, for example, be infrared filter, for filtering the light wave of a certain wave band of scioptics 201.In an example, transparency carrier 202 can be attached on the Lower Half 203b of lens mount by viscose.
Wherein lens 201 are fixed among the first half 203a of lens mount, see through the first half 203a of lens mount with support of lens 201.In addition, lens mount can also be fixed on substrate 209 with support of lens 201.Lens 201 can optionally be disposed at the top of lens mount.In the modular structure 200 of the present embodiment, within transparency carrier 202 is optionally disposed at lens mount, and between lens 201 and chip 206.In other words, the rough aligning transparency carrier 202 of lens 201 and chip 206, make light can be directly incident on sensing region 206a.
The size of substrate 211 is greater than the size of substrate 209, makes after the two sticks together, and substrate 211 is able to extend outside substrate 209.And lens mount is integrated a part and the image sensor 106 of transparency carrier 202, substrate 209, substrate 211, to form cube modular structure.Based on substrate 211, outside cube modular structure, extend, the wire seeing through on substrate 211 is able to the electric signal in modular structure 200 to be passed to other assembly outside structure.
As shown in Figure 3, be another embodiment of the modular structure of the present invention's window type image sensing chip.In the present embodiment, on substrate 209a, surface comprises the region of two differing heights, wherein contact pad 207 is formed on highly relatively low surface area, so that the rough height that is equivalent to the contact pad 208 of chip 206 of the height of the contact pad 207 of substrate 209a; And adhesion layer 204b is formed on highly relatively high surface area, so that the Lower Half 203b of lens mount sticks together surf zone on substrate 209a.The similar Fig. 2 of other structure division, omits detailed description.
As shown in Figure 4, be the embodiment again of the modular structure of the present invention's window type image sensing chip.Similarly, in the present embodiment, on substrate 209a, surface comprises the region of two differing heights, and wherein contact pad 207 is formed on highly relatively low surface area; And adhesion layer 204 is formed on highly relatively high surface area, so that lens mount 203 sticks together surf zone on substrate 209a around.In addition, transparency carrier 202 directly forms (adhering to) on the highly relatively high surface area of substrate 209a; Can first form an adhesion layer 204c on surface area, then transparency carrier 202 is by adhesion layer 204c and attached to it.In other words, within transparency carrier 202 is formed at lens mount 203 but not on it (as embodiment above).The similar Fig. 3 of other structure division, omits its detailed description.
As shown in Figure 5, be the another embodiment of the modular structure of the present invention's window type image sensing chip.In the present embodiment, the modular structure of the similar Fig. 2 of modular structure.The modular structure 200 of the present embodiment also comprises that a protective layer 220 is formed on chip 206, substrate 209 and support plate, and it can be completely, partly or do not cover sealing wire 205; And insert the gap between chip 206 and substrate 209, and exposed sensing region 206a.The material of protective layer 220 is for example a glue (glue).
As shown in Figure 6, be one of the modular structure of the present invention's window type image sensing chip embodiment.In the present embodiment, similar Fig. 5, unique difference is in the region that on substrate 209a wherein surface comprises two differing heights, and structure division, in narration above, therefore omits detailed description.
As shown in Figure 7, be the embodiment again of the modular structure of the present invention's window type image sensing chip.Similarly, in the present embodiment, on substrate 209a, surface comprises the region of two differing heights, and wherein contact pad 207 is formed on highly relatively low surface area; And adhesion layer 204 is formed on highly relatively high surface area, so that lens mount 203 sticks together surf zone on substrate 209a around.Transparency carrier 202 directly forms (adhering to) on the highly relatively high surface area of substrate 209a.Similarly, within transparency carrier 202 is formed at lens mount 203 but not on it (as embodiment above).Similar the 6th figure of other structure division, omits its detailed description.
In one of the present invention embodiment, substrate 209 is a printed circuit board (PCB), its material can be organic substrate, for example, have epoxide resin type FR5 or FR4 (the glass-fiber-fabric epoxy resin), Twin horse Come vinegar Asia amine-San Dan Miscellaneous benzene Trees fat (BT:Bismaleimide Triazine) of default perforate.In addition, glass, pottery and silicon can also be as the materials of substrate 209.
The present invention's advantage comprises: there is thinner modular structure, utilizes at present easily and more cheap sealing wire processing procedure, and good thermal efficiency, with low cost and processing procedure is simple and easy, easily make multi-chip package.
The above; be only the specific embodiment of the present invention, but protection scope of the present invention is not limited to this, is anyly familiar with those skilled in the art in the technical scope that the present invention discloses; can expect easily changing or replacing, within all should being encompassed in protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection range of described claim.
Claims (15)
1. a modular structure for window type image sensing chip, is characterized in that comprising:
One first substrate;
One chip, is disposed on first substrate, has one first contact pad and a sensing region;
One second substrate, is disposed on first substrate, has a perforation structure and one second contact pad, and its chips is placed in perforation structure, and the first contact pad sees through a sealing wire and is electrically connected the second contact pad; And
One lens mount, is disposed on second substrate, and lens are positioned at the top of lens mount, wherein lens alignment sensing region.
2. the modular structure of window type image sensing chip as claimed in claim 1, is characterized in that described first substrate sees through a conductive layer and is attached on second substrate.
3. the modular structure of window type image sensing chip as claimed in claim 1, characterized by further comprising a protective layer, be formed on chip, second substrate and first substrate, protective layer completely, part or do not cover sealing wire.
4. the modular structure of window type image sensing chip as claimed in claim 1, it is characterized in that described first substrate is a printed circuit board (PCB) or a flexible printed wiring board, second substrate is a printed circuit board (PCB), its material comprises glass-fiber-fabric epoxide resin type, bismaleimides-triazine resin, glass, silicon or pottery, has its wire separately on printed circuit board (PCB) and flexible printed wiring board.
5. the modular structure of window type image sensing chip as claimed in claim 1, the upper surface that it is characterized in that described second substrate comprises the region of two differing heights, wherein the second contact pad is formed on highly relatively low surface area.
6. the modular structure of window type image sensing chip as claimed in claim 5, characterized by further comprising a protective layer, is formed on chip, second substrate and first substrate, and protective layer can be completely, part or do not cover sealing wire.
7. the modular structure of window type image sensing chip as claimed in claim 5, characterized by further comprising a transparency carrier and is formed on highly relatively high surface area.
8. the modular structure of window type image sensing chip as claimed in claim 7, characterized by further comprising a protective layer, is formed on chip, second substrate and first substrate, and protective layer can be completely, part or do not cover sealing wire.
9. the modular structure of window type image sensing chip as claimed in claim 1, characterized by further comprising a transparency carrier, is disposed on lens mount or second substrate, wherein lens alignment transparency carrier and sensing region.
10. the modular structure of window type image sensing chip as claimed in claim 9, is characterized in that described first substrate sees through a conductive layer and is attached on second substrate.
The modular structure of 11. window type image sensing chips as claimed in claim 9, characterized by further comprising a protective layer, be formed on chip, second substrate and first substrate, protective layer completely, part or do not cover sealing wire.
The modular structure of 12. window type image sensing chips as claimed in claim 9, it is characterized in that described first substrate is a printed circuit board (PCB) or a flexible printed wiring board, described second substrate is a printed circuit board (PCB), its material comprises glass-fiber-fabric epoxide resin type, bismaleimides-triazine resin, glass, silicon or pottery, has its wire separately on printed circuit board (PCB) and flexible printed wiring board.
The modular structure of 13. window type image sensing chips as claimed in claim 9, the upper surface that it is characterized in that described second substrate comprises the region of two differing heights, wherein the second contact pad is formed on highly relatively low surface area.
The modular structure of 14. window type image sensing chips as claimed in claim 13, is characterized in that described transparency carrier is formed on highly relatively high surface area.
The modular structure of 15. window type image sensing chips as claimed in claim 13, characterized by further comprising a protective layer, be formed on chip, second substrate and first substrate, protective layer completely, part or do not cover sealing wire.
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| CN201210299889.9A CN103633102B (en) | 2012-08-21 | 2012-08-21 | The modular structure of window type image sensing chip |
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| CN201210299889.9A CN103633102B (en) | 2012-08-21 | 2012-08-21 | The modular structure of window type image sensing chip |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111163255A (en) * | 2019-09-23 | 2020-05-15 | 神盾股份有限公司 | Image sensing module |
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| CN1433081A (en) * | 2002-01-18 | 2003-07-30 | 胜开科技股份有限公司 | Image sensor and its packaging method |
| US20070064317A1 (en) * | 2005-09-22 | 2007-03-22 | Po-Hung Chen | Image sensor package structure |
| US20070096280A1 (en) * | 2005-11-01 | 2007-05-03 | Tu Hsiu W | Image sensor module structure and a method for manufacturing the same |
| US7282788B2 (en) * | 2005-09-14 | 2007-10-16 | Sigurd Microelectronics Corp. | Image sensing chip package structure |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1433081A (en) * | 2002-01-18 | 2003-07-30 | 胜开科技股份有限公司 | Image sensor and its packaging method |
| US7282788B2 (en) * | 2005-09-14 | 2007-10-16 | Sigurd Microelectronics Corp. | Image sensing chip package structure |
| US20070064317A1 (en) * | 2005-09-22 | 2007-03-22 | Po-Hung Chen | Image sensor package structure |
| US20070096280A1 (en) * | 2005-11-01 | 2007-05-03 | Tu Hsiu W | Image sensor module structure and a method for manufacturing the same |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111163255A (en) * | 2019-09-23 | 2020-05-15 | 神盾股份有限公司 | Image sensing module |
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