CN111163255A

CN111163255A - Image sensing module

Info

Publication number: CN111163255A
Application number: CN202010119823.1A
Authority: CN
Inventors: 范成至; 周正三
Original assignee: Egis Technology Inc
Current assignee: Egis Technology Inc
Priority date: 2019-09-23
Filing date: 2020-02-26
Publication date: 2020-05-15
Also published as: CN211087275U; CN110911434A; WO2021056960A1; TW202113665A; TWM596974U; TW202113949A; TWI715439B; CN211184079U; CN111163254A; TWM596898U; TWM596975U; WO2021056950A1; CN211555889U; TW202114190A; WO2021056961A1; CN111261650A; TWM597018U; CN211089753U; TW202114184A

Abstract

The invention provides an image sensing module, which comprises an image sensor chip, a micro-lens array and an optical filter. The micro lens array is configured on the image sensor chip. The optical filter is arranged above the micro lens array and comprises a plastic substrate and a filter layer, wherein the filter layer is arranged on the plastic substrate.

Description

Image sensing module

Technical Field

The present invention relates to a sensing module, and more particularly, to an image sensing module.

Background

With the progress of the photoelectric technology, the image sensing module has been developed rapidly to replace the traditional photosensitive film. In order to solve the problem of overexposure easily caused in outdoor sunlight scenes, an infrared light cut-off filter is usually added to the image sensing module to block infrared light. When the image sensing module is configured below the screen of the electronic device to serve as an in-screen optical fingerprint sensing module, it is also important to add an infrared cut-off filter.

As the thickness of the portable electronic device is thinner, the thickness of the image sensing module is also thinner. One approach is to reduce the thickness of the glass substrate of the ir cut filter (for example, to 100 μm), but the reduction of the thickness of the glass substrate is likely to cause the glass substrate to be brittle and broken, and further reduce the process yield of the back-end module.

Disclosure of Invention

The invention is directed to an image sensing module, which can have a thinner thickness and a higher process yield.

An embodiment of the invention provides an image sensing module, which includes an image sensor chip, a micro lens array and a filter. The micro lens array is configured on the image sensor chip. The optical filter is arranged above the micro lens array and comprises a plastic substrate and a filter layer, wherein the filter layer is arranged on the plastic substrate.

An embodiment of the invention provides an image sensing module, which includes an image sensor chip, a micro lens array and a filter. The micro lens array is configured on the image sensor chip. The optical filter is arranged above the micro lens array and comprises a plastic substrate and two filter layers, wherein the two filter layers are respectively arranged on the upper surface and the lower surface of the plastic substrate.

In the image sensing module of the embodiment of the invention, the filter adopts the plastic substrate, so that the thickness of the filter is thinner and the problems of brittleness and breakage are avoided, further the thickness of the image sensing module of the embodiment of the invention is reduced, and the process yield is improved.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and together with the description serve to explain the principles of the invention.

Fig. 1 is a schematic cross-sectional view of an image sensor module according to an embodiment of the invention.

Fig. 2 is a schematic cross-sectional view of an image sensor module according to another embodiment of the invention.

Description of the reference numerals

100: image sensing module

110: base plate

120: image sensor chip

122: conductive pad

130: microlens array

140: spacer member

150: optical filter

152: plastic substrate

154: filter layer

160: flexible printed circuit board

170: chip attaching film

180: bonding wire

T1: thickness of

Detailed Description

Reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings and the description to refer to the same or like parts.

Fig. 1 is a schematic cross-sectional view of an image sensor module according to an embodiment of the invention. Referring to fig. 1, the image sensing module 100 of the present embodiment includes an image sensor chip 120, a micro lens array 130, and a filter 150. The microlens array 130 is disposed on the image sensor chip 120, and the filter 150 is disposed above the microlens array 130. In one embodiment, the image sensor chip 120 is, for example, a complementary metal oxide semiconductor image sensor chip (cmos image sensor chip), a charge coupled device chip (charged coupled device chip), or other suitable image sensor chip. The microlens array 130 may have a plurality of microlenses arranged in an array and disposed on the image sensor chip 120. The optical filter 150 includes a plastic substrate 152 and a filter layer 154, wherein the filter layer 154 is disposed on the plastic substrate 152.

In the present embodiment, the image sensor module 100 further includes a base plate 110, a flexible printed circuit 160 and a spacer 140. The image sensor chip 120 and the flexible printed circuit board 160 are disposed on the base plate 110, and the spacer 140 is disposed on the flexible printed circuit board 160, wherein the filter 150 is disposed on the flexible printed circuit board 160 through the spacer 140 so as to be disposed above the microlens array 130. In the present embodiment, the flexible printed circuit board 160 is disposed around the image sensor chip 120. In one embodiment, the image sensor chip 120 may be attached to the base plate 110 by a die attach film (die attach film) 170.

In addition, in the embodiment, the image sensor chip 120 has at least one conductive pad 122, and the image sensing module 100 includes at least one bonding wire 180, and the bonding wire 180 electrically connects the conductive pad 122 and the flexible printed circuit board 160, so that the image sensor chip 120 and the flexible printed circuit board 160 are electrically connected to each other. In one embodiment, the bonding wires 180 and the conductive pads 122 are located between the microlens array 130 and the spacers 240.

In the image sensor module 100 of the present embodiment, since the filter 150 employs the plastic substrate 152, the thickness of the filter 150 is thin and there is no problem of brittleness and cracking, so that the thickness of the image sensor module 100 of the present embodiment is reduced and the process yield is improved.

In the embodiment, the filter layer 154 is disposed on the upper surface of the plastic substrate 152, however, in other embodiments, the filter layer 154 may be disposed on the lower surface of the plastic substrate 152, or both the upper surface and the lower surface of the plastic substrate 152 are disposed with the filter layer 154, as shown in fig. 2. In addition, in the present embodiment, the filter layer 154 is a multi-layer film made by utilizing the principle of thin film interference, for example, and can filter infrared light. That is, the filter layer 154 is, for example, an infrared light cut filter layer, and the filter 150 is, for example, an infrared light cut filter. In the present embodiment, the thickness T1 of the plastic substrate 152 is in the range of 50 micrometers to 150 micrometers, preferably in the range of 60 micrometers to 100 micrometers. That is, even if the thickness T1 of the plastic substrate 152 is designed to be thin, the glass substrate is not brittle or breakable, so that the thickness of the image sensor module 100 can be effectively reduced and the process yield can be improved.

In summary, in the image sensor module according to the embodiment of the invention, since the filter uses the plastic substrate, the thickness of the filter is thin and the filter is not brittle or easily broken, so that the thickness of the image sensor module according to the embodiment of the invention is reduced and the process yield is improved.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An image sensing module, comprising:

an image sensor chip;

a microlens array disposed on the image sensor chip; and

an optical filter disposed above the microlens array and including:

a plastic substrate; and

and the filter layer is configured on the plastic substrate.

2. The image sensing module of claim 1, wherein a thickness of the plastic substrate is in a range of 50 to 150 microns.

3. The image sensor module of claim 1, further comprising a bonding wire electrically connecting the image sensor chip and the flexible printed circuit board.

4. The image sensing module of claim 3, further comprising:

a chassis, wherein the image sensor chip is disposed on the chassis, and the flexible printed circuit board is disposed on the chassis; and

a spacer disposed on the flexible printed circuit board, wherein the filter is disposed on the flexible printed circuit board by the spacer to be disposed above the microlens array.

5. The image sensor module of claim 4, wherein the image sensor chip has a conductive pad, and the bonding wire electrically connects the conductive pad and the flexible printed circuit board.

6. The image sensing module of claim 5, wherein the bonding wires and the conductive pads are located between the microlens array and the spacers.

7. The image sensor module of claim 1, wherein the filter layer is an infrared cut filter layer.

8. An image sensing module, comprising:

an image sensor chip;

a microlens array disposed on the image sensor chip; and

an optical filter disposed above the microlens array and including:

a plastic substrate; and

and the two filter layers are respectively arranged on the upper surface and the lower surface of the plastic substrate.

9. The image sensing module of claim 8, wherein the thickness of the plastic substrate is in a range of 50 to 150 microns.

10. The image sensor module of claim 8, further comprising a bonding wire electrically connecting the image sensor chip and the flexible printed circuit board.

11. The image sensing module of claim 10, further comprising:

12. The image sensor module of claim 11, wherein the image sensor chip has a conductive pad, and the bonding wire electrically connects the conductive pad and the flexible printed circuit board.

13. The image sensing module of claim 12, wherein the bonding wires and the conductive pads are located between the microlens array and the spacers.

14. The image sensor module of claim 8, wherein the two filter layers are infrared light cut filter layers.