CN110911434A

CN110911434A - Image sensing module

Info

Publication number: CN110911434A
Application number: CN201911394482.2A
Authority: CN
Inventors: 范成至; 周正三
Original assignee: Egis Technology Inc
Current assignee: Egis Technology Inc
Priority date: 2019-09-23
Filing date: 2019-12-30
Publication date: 2020-03-24
Also published as: WO2021056960A1; CN211089753U; TWM597018U; TW202114184A; CN111163255A; CN211184079U; CN111163254A; TWM596975U; TW202113949A; WO2021056950A1; CN211555889U; CN111261650A; WO2021056961A1; TW202113665A; CN211087275U; TWM596974U; TWI715439B; TWM596898U; TW202114190A

Abstract

The invention provides an image sensing module, which comprises a substrate, an image sensor, a micro-lens array, a retaining wall and a packaging colloid. The image sensor is arranged on the substrate, the micro lens array is arranged on the upper surface of the image sensor, which is opposite to the substrate, and the retaining wall is arranged on the upper surface of the image sensor and surrounds the micro lens array. The encapsulant surrounds the image sensor and is blocked outside the retaining wall, wherein the micro lens array and the encapsulant are respectively located on the inner side and the outer side of the retaining wall.

Description

Image sensing module

Technical Field

The present invention relates to a sensing module, and more particularly, to an image sensing module.

Background

As the functions of portable electronic devices (such as mobile phones, tablet computers or notebook computers) are diversified, the image sensing module for sensing images is an important component of the portable electronic devices. The image sensing module can be used for providing a photographing function and sensing a fingerprint image as a basis for fingerprint identification.

When manufacturing the image sensing module, an image sensor (e.g., an image sensing chip) is first attached to a substrate, then a bonding wire (bonding wire) is used to connect a pad on the image sensor to the pad of the substrate by a wire bonding process, and then an encapsulant is used to encapsulate the periphery of the image sensor and the bonding wire to protect the bonding wire, wherein the encapsulant encapsulation process can be a dispensing or molding (molding) method. However, this encapsulation process is prone to flash, and excessive encapsulant material contaminates the microlens array on the image sensor or destroys the optical properties of the microlens array during the molding process.

Disclosure of Invention

The present invention is directed to an image sensing module having good optical characteristics.

An embodiment of the invention provides an image sensing module, which includes a substrate, an image sensor, a micro-lens array, a retaining wall, and an encapsulant. The image sensor is arranged on the substrate, the micro lens array is arranged on an upper surface of the image sensor, which is opposite to the substrate, and the retaining wall is arranged on the upper surface of the image sensor and surrounds the micro lens array. The encapsulant surrounds the image sensor and is blocked outside the retaining wall, wherein the micro lens array and the encapsulant are respectively located on the inner side and the outer side of the retaining wall.

In an embodiment of the invention, the image sensing module further includes a bonding wire connecting the image sensor and the substrate and covered by the encapsulant, wherein the micro-lens array and the bonding wire are respectively located on the inner side and the outer side of the dam.

In an embodiment of the invention, the image sensing module further includes a filter spanning the retaining wall and located above the microlens array.

In an embodiment of the invention, the optical filter is further disposed on the encapsulant.

In an embodiment of the invention, the filter is an infrared cut filter.

In an embodiment of the invention, a thickness of the dam in a direction perpendicular to the upper surface is greater than a thickness of the microlens array in a direction perpendicular to the upper surface.

In an embodiment of the invention, the image sensing module further includes a die attach film disposed between the image sensor and the substrate.

In the image sensing module according to the embodiment of the invention, since the blocking wall is adopted to block the encapsulant outside the blocking wall, the microlens array located in the blocking wall is not polluted by the material of the encapsulant, and has good optical characteristics.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and together with the description serve to explain the principles of the invention.

FIG. 1 is a schematic cross-sectional view of an image sensing module according to an embodiment of the invention;

fig. 2 is a schematic cross-sectional view of an image sensing module according to another embodiment of the invention.

Description of the reference numerals

100. 100 a: image sensing module

110: substrate

120: image sensor with a plurality of pixels

122: upper surface of

130: microlens array

140: retaining wall

150: packaging colloid

160: bonding wire

170: chip attaching film

180: optical filter

T1, T2: thickness of

Detailed Description

Reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings and the description to refer to the same or like parts.

Fig. 1 is a schematic cross-sectional view of an image sensing module according to an embodiment of the invention. Referring to fig. 1, an image sensing module 100 of the present embodiment includes a substrate 110, an image sensor 120, a microlens array 130, a dam 140, and an encapsulant 150. The image sensor 120 is disposed on the substrate 110. In the present embodiment, the substrate 110 is, for example, a circuit substrate, or a metal base plate and a Flexible Printed Circuit (FPC) disposed thereon. In the present embodiment, the image sensor 120 is, for example, a Complementary Metal Oxide Semiconductor (CMOS) sensor, a Charge Coupled Device (CCD), or other suitable image sensor, which may include an image sensing chip. In the present embodiment, the image sensor 120 may be attached to the substrate 110 by a Die Attach Film (DAF) 170, that is, the die attach film 170 is disposed between the image sensor 120 and the substrate 110.

The microlens array 130 is disposed on the upper surface 122 of the image sensor 120 opposite to the substrate 110, and the microlens array 130 is, for example, a plurality of microlenses arranged in an array and located in the sensing region of the image sensor 120. The retaining wall 140 is disposed on the upper surface 112 of the image sensor 120 and surrounds the microlens array 130. In the embodiment, the retaining wall 140 may be a rectangular frame surrounding the microlens array 130, but the invention is not limited thereto. In this embodiment, the encapsulant 150 is disposed on the substrate 110, surrounds the image sensor 120, and is blocked by the blocking wall 140. In other words, the microlens array 130 and the encapsulant 150 are respectively located inside and outside the retaining wall 140.

In addition, the image sensor module 100 may further include at least one bonding wire (bonding wire)160 electrically connecting the image sensor 100 and the substrate 110. In the present embodiment, the bonding wires 160 can electrically connect pads (not shown) on the upper surface 122 of the image sensor 100 and pads (not shown) on the substrate 110, so as to electrically connect the image sensor 100 and the substrate 110. In the present embodiment, the encapsulant 150 encapsulates the bonding wires 160, and the microlens array 130 and the bonding wires 160 are respectively located inside and outside the dam 140.

In the image sensing module 100 of the present embodiment, since the encapsulant 150 is blocked outside the dam 140, the microlens array 130 in the dam 140 is not contaminated by the material of the encapsulant 150, and thus has good optical characteristics.

In the present embodiment, taking the direction perpendicular to the upper surface 122 as an example, the thickness T1 of the retaining wall 140 is greater than the thickness T2 of the microlens array 130. That is, the dam 140 may be slightly higher than the microlens array 130. Therefore, when the molding compound 150 is molded by using a mold, the retaining wall 140 can abut against the mold, so that the microlens array 130 does not touch the mold, and thus the microlens array 130 is not crushed by the mold. In addition, the encapsulant 150 is blocked by the wall 140 during molding and does not flow to the microlens array 130, thereby avoiding the optical characteristics of the microlens array 130 from being impaired. Therefore, the image sensing module 100 of the present embodiment can have good optical characteristics.

In the present embodiment, the image sensing module 100 can be used as a sensing module of an in-screen optical fingerprint sensor, and can be disposed under a display panel (e.g., an organic light emitting diode display panel or a liquid crystal display panel) to sense a fingerprint of a finger pressed on the display panel. However, in other embodiments, the image sensing module 100 may also be included in a camera module to capture an image of the outside world, for example, a front camera or a rear camera of a portable electronic device (e.g., a mobile phone, a tablet computer, a notebook computer, etc.).

Fig. 2 is a schematic cross-sectional view of an image sensing module according to another embodiment of the invention. Referring to fig. 2, the image sensing module 100a of the present embodiment is similar to the image sensing module 100 of fig. 1, and the main differences between the two are as follows. The image sensor module 100a of the present embodiment further includes a filter 180, which spans over the retaining wall 140 and is located above the microlens array 130. In the embodiment, the filter 180 can be directly disposed on the encapsulant 150 because the retaining wall 140 is higher than the microlens array 130, and the filter 180 does not directly contact the microlens array 130. That is, the edge of the filter 180 may be located on the encapsulant 150, for example, the edge of the filter 180 is attached to the encapsulant 150. In the embodiment, the filter 180 is an infrared cut-off filter (ir cut-off filter), however, in other embodiments, the filter 180 may also be a filter for filtering out other infrared, visible or ultraviolet light bands.

In the image sensor module 100a of the present embodiment, since the optical filter 180 is already attached to the encapsulant 150, in a subsequent assembly process (for example, a process of assembling the image sensor module 100a under the display panel), the optical filter 180 can protect the microlens array 130 and the image sensor 120 from being artificially contaminated or damaged, thereby improving a production yield.

In summary, in the image sensor module according to the embodiment of the invention, since the encapsulant is blocked outside the retaining wall, the microlens array in the retaining wall is not contaminated by the material of the encapsulant, and thus the image sensor module can have good optical characteristics.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An image sensing module, comprising:

a substrate;

an image sensor disposed on the substrate;

a microlens array disposed on an upper surface of the image sensor facing away from the substrate;

a retaining wall disposed on the upper surface of the image sensor and surrounding the microlens array; and

and the packaging colloid surrounds the image sensor and is blocked outside the retaining wall, wherein the micro lens array and the packaging colloid are respectively positioned on the inner side and the outer side of the retaining wall.

2. The image sensing module of claim 1, further comprising a bonding wire connecting the image sensor and the substrate and covered by the encapsulant, wherein the microlens array and the bonding wire are respectively located on the inner side and the outer side of the dam.

3. The image sensing module of claim 1, further comprising a filter spanning the barrier wall and located above the microlens array.

4. The image sensing module of claim 3, wherein the filter is further disposed on the encapsulant.

5. The image sensing module of claim 3, wherein the filter is an infrared light cut filter.

6. The image sensing module of claim 1, wherein the thickness of the dam in a direction perpendicular to the upper surface is greater than the thickness of the microlens array in a direction perpendicular to the upper surface.

7. The image sensing module of claim 1, further comprising a die attach film disposed between the image sensor and the substrate.