CN110911434A - Image sensing module - Google Patents
Image sensing module Download PDFInfo
- Publication number
- CN110911434A CN110911434A CN201911394482.2A CN201911394482A CN110911434A CN 110911434 A CN110911434 A CN 110911434A CN 201911394482 A CN201911394482 A CN 201911394482A CN 110911434 A CN110911434 A CN 110911434A
- Authority
- CN
- China
- Prior art keywords
- sensing module
- image sensor
- image sensing
- substrate
- encapsulant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000008393 encapsulating agent Substances 0.000 claims abstract description 29
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 230000004888 barrier function Effects 0.000 claims 2
- 239000000084 colloidal system Substances 0.000 abstract description 2
- 238000004806 packaging method and process Methods 0.000 abstract description 2
- 230000003287 optical effect Effects 0.000 description 12
- 238000000034 method Methods 0.000 description 7
- 238000000465 moulding Methods 0.000 description 5
- 230000000903 blocking effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- LIMFPAAAIVQRRD-BCGVJQADSA-N N-[2-[(3S,4R)-3-fluoro-4-methoxypiperidin-1-yl]pyrimidin-4-yl]-8-[(2R,3S)-2-methyl-3-(methylsulfonylmethyl)azetidin-1-yl]-5-propan-2-ylisoquinolin-3-amine Chemical compound F[C@H]1CN(CC[C@H]1OC)C1=NC=CC(=N1)NC=1N=CC2=C(C=CC(=C2C=1)C(C)C)N1[C@@H]([C@H](C1)CS(=O)(=O)C)C LIMFPAAAIVQRRD-BCGVJQADSA-N 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
- Image Input (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
The invention provides an image sensing module, which comprises a substrate, an image sensor, a micro-lens array, a retaining wall and a packaging colloid. The image sensor is arranged on the substrate, the micro lens array is arranged on the upper surface of the image sensor, which is opposite to the substrate, and the retaining wall is arranged on the upper surface of the image sensor and surrounds the micro lens array. The encapsulant surrounds the image sensor and is blocked outside the retaining wall, wherein the micro lens array and the encapsulant are respectively located on the inner side and the outer side of the retaining wall.
Description
Technical Field
The present invention relates to a sensing module, and more particularly, to an image sensing module.
Background
As the functions of portable electronic devices (such as mobile phones, tablet computers or notebook computers) are diversified, the image sensing module for sensing images is an important component of the portable electronic devices. The image sensing module can be used for providing a photographing function and sensing a fingerprint image as a basis for fingerprint identification.
When manufacturing the image sensing module, an image sensor (e.g., an image sensing chip) is first attached to a substrate, then a bonding wire (bonding wire) is used to connect a pad on the image sensor to the pad of the substrate by a wire bonding process, and then an encapsulant is used to encapsulate the periphery of the image sensor and the bonding wire to protect the bonding wire, wherein the encapsulant encapsulation process can be a dispensing or molding (molding) method. However, this encapsulation process is prone to flash, and excessive encapsulant material contaminates the microlens array on the image sensor or destroys the optical properties of the microlens array during the molding process.
Disclosure of Invention
The present invention is directed to an image sensing module having good optical characteristics.
An embodiment of the invention provides an image sensing module, which includes a substrate, an image sensor, a micro-lens array, a retaining wall, and an encapsulant. The image sensor is arranged on the substrate, the micro lens array is arranged on an upper surface of the image sensor, which is opposite to the substrate, and the retaining wall is arranged on the upper surface of the image sensor and surrounds the micro lens array. The encapsulant surrounds the image sensor and is blocked outside the retaining wall, wherein the micro lens array and the encapsulant are respectively located on the inner side and the outer side of the retaining wall.
In an embodiment of the invention, the image sensing module further includes a bonding wire connecting the image sensor and the substrate and covered by the encapsulant, wherein the micro-lens array and the bonding wire are respectively located on the inner side and the outer side of the dam.
In an embodiment of the invention, the image sensing module further includes a filter spanning the retaining wall and located above the microlens array.
In an embodiment of the invention, the optical filter is further disposed on the encapsulant.
In an embodiment of the invention, the filter is an infrared cut filter.
In an embodiment of the invention, a thickness of the dam in a direction perpendicular to the upper surface is greater than a thickness of the microlens array in a direction perpendicular to the upper surface.
In an embodiment of the invention, the image sensing module further includes a die attach film disposed between the image sensor and the substrate.
In the image sensing module according to the embodiment of the invention, since the blocking wall is adopted to block the encapsulant outside the blocking wall, the microlens array located in the blocking wall is not polluted by the material of the encapsulant, and has good optical characteristics.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and together with the description serve to explain the principles of the invention.
FIG. 1 is a schematic cross-sectional view of an image sensing module according to an embodiment of the invention;
fig. 2 is a schematic cross-sectional view of an image sensing module according to another embodiment of the invention.
Description of the reference numerals
100. 100 a: image sensing module
110: substrate
120: image sensor with a plurality of pixels
122: upper surface of
130: microlens array
140: retaining wall
150: packaging colloid
160: bonding wire
170: chip attaching film
180: optical filter
T1, T2: thickness of
Detailed Description
Reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings and the description to refer to the same or like parts.
Fig. 1 is a schematic cross-sectional view of an image sensing module according to an embodiment of the invention. Referring to fig. 1, an image sensing module 100 of the present embodiment includes a substrate 110, an image sensor 120, a microlens array 130, a dam 140, and an encapsulant 150. The image sensor 120 is disposed on the substrate 110. In the present embodiment, the substrate 110 is, for example, a circuit substrate, or a metal base plate and a Flexible Printed Circuit (FPC) disposed thereon. In the present embodiment, the image sensor 120 is, for example, a Complementary Metal Oxide Semiconductor (CMOS) sensor, a Charge Coupled Device (CCD), or other suitable image sensor, which may include an image sensing chip. In the present embodiment, the image sensor 120 may be attached to the substrate 110 by a Die Attach Film (DAF) 170, that is, the die attach film 170 is disposed between the image sensor 120 and the substrate 110.
The microlens array 130 is disposed on the upper surface 122 of the image sensor 120 opposite to the substrate 110, and the microlens array 130 is, for example, a plurality of microlenses arranged in an array and located in the sensing region of the image sensor 120. The retaining wall 140 is disposed on the upper surface 112 of the image sensor 120 and surrounds the microlens array 130. In the embodiment, the retaining wall 140 may be a rectangular frame surrounding the microlens array 130, but the invention is not limited thereto. In this embodiment, the encapsulant 150 is disposed on the substrate 110, surrounds the image sensor 120, and is blocked by the blocking wall 140. In other words, the microlens array 130 and the encapsulant 150 are respectively located inside and outside the retaining wall 140.
In addition, the image sensor module 100 may further include at least one bonding wire (bonding wire)160 electrically connecting the image sensor 100 and the substrate 110. In the present embodiment, the bonding wires 160 can electrically connect pads (not shown) on the upper surface 122 of the image sensor 100 and pads (not shown) on the substrate 110, so as to electrically connect the image sensor 100 and the substrate 110. In the present embodiment, the encapsulant 150 encapsulates the bonding wires 160, and the microlens array 130 and the bonding wires 160 are respectively located inside and outside the dam 140.
In the image sensing module 100 of the present embodiment, since the encapsulant 150 is blocked outside the dam 140, the microlens array 130 in the dam 140 is not contaminated by the material of the encapsulant 150, and thus has good optical characteristics.
In the present embodiment, taking the direction perpendicular to the upper surface 122 as an example, the thickness T1 of the retaining wall 140 is greater than the thickness T2 of the microlens array 130. That is, the dam 140 may be slightly higher than the microlens array 130. Therefore, when the molding compound 150 is molded by using a mold, the retaining wall 140 can abut against the mold, so that the microlens array 130 does not touch the mold, and thus the microlens array 130 is not crushed by the mold. In addition, the encapsulant 150 is blocked by the wall 140 during molding and does not flow to the microlens array 130, thereby avoiding the optical characteristics of the microlens array 130 from being impaired. Therefore, the image sensing module 100 of the present embodiment can have good optical characteristics.
In the present embodiment, the image sensing module 100 can be used as a sensing module of an in-screen optical fingerprint sensor, and can be disposed under a display panel (e.g., an organic light emitting diode display panel or a liquid crystal display panel) to sense a fingerprint of a finger pressed on the display panel. However, in other embodiments, the image sensing module 100 may also be included in a camera module to capture an image of the outside world, for example, a front camera or a rear camera of a portable electronic device (e.g., a mobile phone, a tablet computer, a notebook computer, etc.).
Fig. 2 is a schematic cross-sectional view of an image sensing module according to another embodiment of the invention. Referring to fig. 2, the image sensing module 100a of the present embodiment is similar to the image sensing module 100 of fig. 1, and the main differences between the two are as follows. The image sensor module 100a of the present embodiment further includes a filter 180, which spans over the retaining wall 140 and is located above the microlens array 130. In the embodiment, the filter 180 can be directly disposed on the encapsulant 150 because the retaining wall 140 is higher than the microlens array 130, and the filter 180 does not directly contact the microlens array 130. That is, the edge of the filter 180 may be located on the encapsulant 150, for example, the edge of the filter 180 is attached to the encapsulant 150. In the embodiment, the filter 180 is an infrared cut-off filter (ir cut-off filter), however, in other embodiments, the filter 180 may also be a filter for filtering out other infrared, visible or ultraviolet light bands.
In the image sensor module 100a of the present embodiment, since the optical filter 180 is already attached to the encapsulant 150, in a subsequent assembly process (for example, a process of assembling the image sensor module 100a under the display panel), the optical filter 180 can protect the microlens array 130 and the image sensor 120 from being artificially contaminated or damaged, thereby improving a production yield.
In summary, in the image sensor module according to the embodiment of the invention, since the encapsulant is blocked outside the retaining wall, the microlens array in the retaining wall is not contaminated by the material of the encapsulant, and thus the image sensor module can have good optical characteristics.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (7)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US201962903949P | 2019-09-23 | 2019-09-23 | |
US62/903,949 | 2019-09-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN110911434A true CN110911434A (en) | 2020-03-24 |
Family
ID=69813875
Family Applications (8)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201911394482.2A Pending CN110911434A (en) | 2019-09-23 | 2019-12-30 | Image sensing module |
CN201922439764.1U Expired - Fee Related CN211555889U (en) | 2019-09-23 | 2019-12-30 | Image sensing module |
CN202010090144.6A Pending CN111261650A (en) | 2019-09-23 | 2020-02-13 | Method for manufacturing optical filter on image sensor wafer |
CN202020166065.4U Ceased CN211087275U (en) | 2019-09-23 | 2020-02-13 | Fingerprint Sensing Device |
CN202020212438.7U Expired - Fee Related CN211089753U (en) | 2019-09-23 | 2020-02-26 | Image sensing module |
CN202010119558.7A Pending CN111163254A (en) | 2019-09-23 | 2020-02-26 | Image sensing module |
CN202020212080.8U Expired - Fee Related CN211184079U (en) | 2019-09-23 | 2020-02-26 | Image sensing module |
CN202010119823.1A Pending CN111163255A (en) | 2019-09-23 | 2020-02-26 | Image sensing module |
Family Applications After (7)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201922439764.1U Expired - Fee Related CN211555889U (en) | 2019-09-23 | 2019-12-30 | Image sensing module |
CN202010090144.6A Pending CN111261650A (en) | 2019-09-23 | 2020-02-13 | Method for manufacturing optical filter on image sensor wafer |
CN202020166065.4U Ceased CN211087275U (en) | 2019-09-23 | 2020-02-13 | Fingerprint Sensing Device |
CN202020212438.7U Expired - Fee Related CN211089753U (en) | 2019-09-23 | 2020-02-26 | Image sensing module |
CN202010119558.7A Pending CN111163254A (en) | 2019-09-23 | 2020-02-26 | Image sensing module |
CN202020212080.8U Expired - Fee Related CN211184079U (en) | 2019-09-23 | 2020-02-26 | Image sensing module |
CN202010119823.1A Pending CN111163255A (en) | 2019-09-23 | 2020-02-26 | Image sensing module |
Country Status (3)
Country | Link |
---|---|
CN (8) | CN110911434A (en) |
TW (8) | TWM596974U (en) |
WO (3) | WO2021056950A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI760823B (en) * | 2020-04-24 | 2022-04-11 | 神盾股份有限公司 | Fingerprint sensing module and electronic device |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110911434A (en) * | 2019-09-23 | 2020-03-24 | 神盾股份有限公司 | Image sensing module |
CN111627948B (en) * | 2020-06-05 | 2023-04-28 | 中国电子科技集团公司第四十四研究所 | A CCD structure with an on-chip filter |
TWI733533B (en) * | 2020-07-23 | 2021-07-11 | 眾福科技股份有限公司 | Display device and transparent cover thereof |
TWI781653B (en) * | 2020-11-03 | 2022-10-21 | 神盾股份有限公司 | Electronic device and fingerprint image correction method |
TWI799943B (en) * | 2021-08-12 | 2023-04-21 | 致伸科技股份有限公司 | Lens module and manufacturing method used therein |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1430286A (en) * | 2001-12-27 | 2003-07-16 | 精工爱普生株式会社 | Optical module, circuit board and its electronic machine |
CN101425470A (en) * | 2007-10-30 | 2009-05-06 | 育霈科技股份有限公司 | Method for forming image sensor protective layer |
CN103928481A (en) * | 2014-03-26 | 2014-07-16 | 清华大学 | An image sensor packaging structure and packaging method |
TWM550909U (en) * | 2017-07-10 | 2017-10-21 | Kingpak Tech Inc | Packaging structure of image sensor |
CN110120397A (en) * | 2018-02-05 | 2019-08-13 | 上海珏芯光电科技有限公司 | Image device, camera module and manufacturing method |
CN211555889U (en) * | 2019-09-23 | 2020-09-22 | 神盾股份有限公司 | Image sensing module |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6784409B2 (en) * | 2000-03-28 | 2004-08-31 | Canon Kabushiki Kaisha | Electronic device with encapsulant of photo-set resin and production process of same |
JP2004064272A (en) * | 2002-07-26 | 2004-02-26 | West Electric Co Ltd | Camera module |
TWI222178B (en) * | 2003-11-12 | 2004-10-11 | United Microelectronics Corp | Manufacturing method of image sensor device |
CN100459140C (en) * | 2004-06-15 | 2009-02-04 | 富士胶片株式会社 | Solid-state imaging device and manufacturing method thereof, and camera module |
US7329856B2 (en) * | 2004-08-24 | 2008-02-12 | Micron Technology, Inc. | Image sensor having integrated infrared-filtering optical device and related method |
DE102006004802B4 (en) * | 2006-01-23 | 2008-09-25 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Image acquisition system and method for producing at least one image capture system |
CN101039381B (en) * | 2006-03-17 | 2011-03-30 | 鸿富锦精密工业(深圳)有限公司 | Image sensing module and manufacturing method thereof |
JP4950542B2 (en) * | 2006-04-07 | 2012-06-13 | 岩手東芝エレクトロニクス株式会社 | Solid-state imaging device and manufacturing method thereof |
US7732844B2 (en) * | 2006-11-03 | 2010-06-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Crosstalk improvement through P on N structure for image sensor |
US7528420B2 (en) * | 2007-05-23 | 2009-05-05 | Visera Technologies Company Limited | Image sensing devices and methods for fabricating the same |
US9231012B2 (en) * | 2007-08-01 | 2016-01-05 | Visera Technologies Company Limited | Image sensor package |
JP5162607B2 (en) * | 2010-02-10 | 2013-03-13 | 株式会社AAC Technologies Japan R&D Center | Assembling the camera module |
KR20110137700A (en) * | 2010-06-17 | 2011-12-23 | 삼성전자주식회사 | Optical device and imaging device using optical device |
TW201210006A (en) * | 2010-08-25 | 2012-03-01 | Pixart Imaging Inc | Image sensing device |
US8598672B2 (en) * | 2011-01-26 | 2013-12-03 | Maxim Integrated Products, Inc | Light sensor having IR cut interference filter with color filter integrated on-chip |
US20120293474A1 (en) * | 2011-05-18 | 2012-11-22 | Intersil Americas Inc. | Systems and methods for facilitating lift-off processes |
CN103633102B (en) * | 2012-08-21 | 2016-12-28 | 光宝电子(广州)有限公司 | Module structure of window type image sensing chip |
CN103367382B (en) * | 2013-07-23 | 2016-03-09 | 格科微电子(上海)有限公司 | A kind of wafer-level packaging method of image sensor chip |
TWI725449B (en) * | 2014-06-18 | 2021-04-21 | 美商唯亞威方案公司 | Metal-dielectric optical filter, sensor device, and fabrication method |
US9699393B2 (en) * | 2014-06-26 | 2017-07-04 | Semiconductor Components Industries, Llc | Imaging systems for infrared and visible imaging with patterned infrared cutoff filters |
CN104954651B (en) * | 2015-06-17 | 2018-10-02 | 南昌欧菲光电技术有限公司 | Camera module, manufacturing method thereof, and electronic product |
US10038026B2 (en) * | 2015-06-25 | 2018-07-31 | Taiwan Semiconductor Manufacturing Co., Ltd. | Bond pad structure for bonding improvement |
KR102472566B1 (en) * | 2015-12-01 | 2022-12-01 | 삼성전자주식회사 | Semiconductor package |
US9906706B2 (en) * | 2015-12-23 | 2018-02-27 | Visera Technologies Company Limited | Image sensor and imaging device |
CN107591419B (en) * | 2016-07-07 | 2019-09-17 | 艾普特佩克股份有限公司 | Optical sensor package module and camera model |
CN108696672A (en) * | 2017-04-07 | 2018-10-23 | 宁波舜宇光电信息有限公司 | Camera module based on infrared absorption structure and its application |
CN107071253A (en) * | 2017-05-27 | 2017-08-18 | 深圳奥比中光科技有限公司 | The light-field camera of compact conformation |
US10763296B2 (en) * | 2017-11-22 | 2020-09-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Biometric sensor and methods thereof |
CN109246348B (en) * | 2018-11-05 | 2021-10-19 | 中芯集成电路(宁波)有限公司 | Lens module, packaging method thereof and electronic equipment |
-
2019
- 2019-12-30 CN CN201911394482.2A patent/CN110911434A/en active Pending
- 2019-12-30 TW TW108217417U patent/TWM596974U/en not_active IP Right Cessation
- 2019-12-30 CN CN201922439764.1U patent/CN211555889U/en not_active Expired - Fee Related
- 2019-12-30 TW TW108148306A patent/TW202114184A/en unknown
-
2020
- 2020-02-13 TW TW109104442A patent/TWI715439B/en not_active IP Right Cessation
- 2020-02-13 CN CN202010090144.6A patent/CN111261650A/en active Pending
- 2020-02-13 TW TW109201551U patent/TWM596898U/en not_active IP Right Cessation
- 2020-02-13 CN CN202020166065.4U patent/CN211087275U/en not_active Ceased
- 2020-02-13 WO PCT/CN2020/075046 patent/WO2021056950A1/en active Application Filing
- 2020-02-26 TW TW109202106U patent/TWM596975U/en not_active IP Right Cessation
- 2020-02-26 CN CN202020212438.7U patent/CN211089753U/en not_active Expired - Fee Related
- 2020-02-26 TW TW109106136A patent/TW202114190A/en unknown
- 2020-02-26 CN CN202010119558.7A patent/CN111163254A/en active Pending
- 2020-02-26 TW TW109106137A patent/TW202113665A/en unknown
- 2020-02-26 CN CN202020212080.8U patent/CN211184079U/en not_active Expired - Fee Related
- 2020-02-26 WO PCT/CN2020/076733 patent/WO2021056960A1/en active Application Filing
- 2020-02-26 TW TW109202107U patent/TWM597018U/en not_active IP Right Cessation
- 2020-02-26 CN CN202010119823.1A patent/CN111163255A/en active Pending
- 2020-02-26 WO PCT/CN2020/076754 patent/WO2021056961A1/en active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1430286A (en) * | 2001-12-27 | 2003-07-16 | 精工爱普生株式会社 | Optical module, circuit board and its electronic machine |
CN101425470A (en) * | 2007-10-30 | 2009-05-06 | 育霈科技股份有限公司 | Method for forming image sensor protective layer |
CN103928481A (en) * | 2014-03-26 | 2014-07-16 | 清华大学 | An image sensor packaging structure and packaging method |
TWM550909U (en) * | 2017-07-10 | 2017-10-21 | Kingpak Tech Inc | Packaging structure of image sensor |
CN110120397A (en) * | 2018-02-05 | 2019-08-13 | 上海珏芯光电科技有限公司 | Image device, camera module and manufacturing method |
CN211555889U (en) * | 2019-09-23 | 2020-09-22 | 神盾股份有限公司 | Image sensing module |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI760823B (en) * | 2020-04-24 | 2022-04-11 | 神盾股份有限公司 | Fingerprint sensing module and electronic device |
Also Published As
Publication number | Publication date |
---|---|
CN211555889U (en) | 2020-09-22 |
TW202114184A (en) | 2021-04-01 |
CN111163255A (en) | 2020-05-15 |
TWI715439B (en) | 2021-01-01 |
CN211184079U (en) | 2020-08-04 |
WO2021056961A1 (en) | 2021-04-01 |
WO2021056950A1 (en) | 2021-04-01 |
TWM596898U (en) | 2020-06-11 |
TWM597018U (en) | 2020-06-11 |
CN211087275U (en) | 2020-07-24 |
CN111163254A (en) | 2020-05-15 |
TW202114190A (en) | 2021-04-01 |
CN111261650A (en) | 2020-06-09 |
WO2021056960A1 (en) | 2021-04-01 |
TW202113949A (en) | 2021-04-01 |
TWM596975U (en) | 2020-06-11 |
TWM596974U (en) | 2020-06-11 |
CN211089753U (en) | 2020-07-24 |
TW202113665A (en) | 2021-04-01 |
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