CN208874642U - A kind of mould group of camera - Google Patents
A kind of mould group of camera Download PDFInfo
- Publication number
- CN208874642U CN208874642U CN201821682214.1U CN201821682214U CN208874642U CN 208874642 U CN208874642 U CN 208874642U CN 201821682214 U CN201821682214 U CN 201821682214U CN 208874642 U CN208874642 U CN 208874642U
- Authority
- CN
- China
- Prior art keywords
- image sensor
- sensor chip
- printed circuit
- circuit board
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The utility model discloses a kind of mould groups of camera, including printed circuit board, image sensor chip, frame, barrel assembly and optical filter, printed circuit board is equipped with recess hole, the both ends of printed circuit back recess hole are equipped with board pads, image sensor chip is placed in recess hole, image sensor chip is externally provided with position-arresting disk, position-arresting disk and recess hole and image sensor chip are closely coupled, photosensitive element is equipped among image sensor chip, the both ends at the photosensitive element back side are equipped with pad, conducting wire is additionally provided between printed circuit board and image sensor chip, conducting wire connects board pads and pad, frame is glued at printed circuit board surface, barrel assembly is embedded in framework upper, supporting plate is equipped among frame, supporting plate lower part gluing optical filter.The utility model is compact-sized, substantially reduces the distance between each component of camera, keeps camera module smaller thinner.
Description
Technical field
The utility model relates to shoot equipment technical field, the mould group of especially a kind of camera.
Background technique
With being constantly progressive for science and technology, more and more electronic equipments with image collecting function are widely answered
In daily life and work.As mobile phone shields under background comprehensively, mobile phone side frame has disappeared, up and down
Frame can become smaller or even disappear, this just minimizes camera module and proposes requirements at the higher level.But the camera of the prior art
Mould group includes wiring board, and the front of wiring board is equipped with image sensor, other electronics are then arranged around image sensor
Component, in this way, making the horizontal area of camera module larger, so that the whole of camera module occupies volume
It is larger.
Utility model content
The purpose of this utility model provides a kind of mould group of camera, solve one in above-mentioned prior art problem or
It is multiple.
In order to solve the above technical problems, the technical solution of the present invention is as follows: a kind of mould group of camera, including printed circuit
Plate, image sensor chip, frame, barrel assembly and optical filter, printed circuit board are equipped with recess hole, printed circuit back
The both ends of recess hole are equipped with board pads, and image sensor chip is placed in recess hole, and image sensor chip peripheral hardware is limited
Position disk, position-arresting disk and recess hole and image sensor chip are closely coupled, and photosensitive element, figure are equipped among image sensor chip
As the sensor chip back side both ends be equipped with pad, conducting wire, conducting wire are additionally provided between printed circuit board and image sensor chip
Board pads and pad are connected, frame is glued at printed circuit board surface, and barrel assembly is embedded in framework upper, sets among frame
There is supporting plate, barrel assembly, supporting plate lower part gluing optical filter are held in supporting plate top.
Specifically, the thickness of image sensor chip is less than the thickness of printed circuit board, the thickness of position-arresting disk is greater than image
The thickness of sensor chip and the thickness for being less than printed circuit board.
The utility model has the beneficial effects that camera module is designed more compact as far as possible by the utility model, make to take the photograph
The distance of picture each component joint is other in the micron-scale, so that camera module is smaller thinner.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of the mould group of camera of the utility model.
Figure label: 1- printed circuit board, 11- board pads, 12- recess hole, 2- image sensor chip, 21- weldering
Disk, 22- photosensitive element, 3- conducting wire, 4- position-arresting disk, 5- frame, 51- supporting plate, 6- barrel assembly, 7- optical filter.
Specific embodiment
With reference to the accompanying drawings of the specification, the utility model is described in more detail.
A kind of mould group of camera as shown in Figure 1, including printed circuit board 1, image sensor chip 2, frame 5, mirror
Cartridge module 6 and optical filter 7, printed circuit board 1 are equipped with recess hole 12, and 1 back side of printed circuit board is located at the both ends of recess hole 12
Equipped with board pads 11, image sensor chip 2 is placed in recess hole 12, and image sensor chip 2 is externally provided with position-arresting disk 4,
Position-arresting disk 4 and recess hole 12 and image sensor chip 2 are closely coupled, and photosensitive element 22 is equipped among image sensor chip 2,
The both ends at 2 back side of image sensor chip are equipped with pad 21, are additionally provided with and lead between printed circuit board 1 and image sensor chip 2
Line 3, conducting wire 3 connect board pads 11 and pad 21, and frame 5 is glued at 1 surface of printed circuit board, and barrel assembly 6 is embedded in frame
5 top of frame is equipped with supporting plate 51 among frame 5, and barrel assembly 6,51 lower part gluing optical filter 7 of supporting plate are held in 51 top of supporting plate.
Specifically, the thickness of image sensor chip 2 is less than the thickness of printed circuit board 1, the thickness of position-arresting disk 4 is greater than figure
Thickness as sensor chip 2 and the thickness less than printed circuit board 1.
Pad 21 on pad 11 and image sensor chip 2 on printed circuit board 1 is set to the back side by the utility model,
Shorten the distance between each component in front, meanwhile, image sensor chip 2 is built in printed circuit board 1 in the utility model
In recess hole 12, so that manufactured camera module is smaller thinner.
The protection scope of the present invention is defined by the appended claims and their equivalents.The above is only this
The preferred embodiment of utility model, it is noted that those skilled in the art, created not departing from the utility model
Under the premise of design, some similar deformation and improvement can be made, these also should be regarded as the protection scope of the utility model
Within.
Claims (2)
1. a kind of mould group of camera, it is characterised in that: including printed circuit board (1), image sensor chip (2), frame
(5), barrel assembly (6) and optical filter (7), the printed circuit board (1) are equipped with recess hole (12), the printed circuit board
(1) both ends that the back side is located at the recess hole (12) are equipped with board pads (11), and described image sensor chip (2) is placed in
In the recess hole (12), described image sensor chip (2) is externally provided with position-arresting disk (4), the position-arresting disk (4) and the groove
Hole (12) and image sensor chip (2) are closely coupled, are equipped with photosensitive element (22) among described image sensor chip (2),
The both ends at described image sensor chip (2) back side are equipped with pad (21), the printed circuit board (1) and described image sensor
It is additionally provided between chip (2) conducting wire (3), the conducting wire (3) connects the board pads (11) and pad (21), the frame
(5) it is glued at the printed circuit board (1) surface, the barrel assembly (6) is embedded in frame (5) top, the frame (5)
Centre is equipped with supporting plate (51), and supporting plate (51) top is held the barrel assembly (6), described in supporting plate (51) the lower part gluing
Optical filter (7).
2. a kind of mould group of camera according to claim 1, it is characterised in that: described image sensor chip (2)
Thickness is less than the thickness of the printed circuit board (1), and the thickness of the position-arresting disk (4) is greater than described image sensor chip (2)
Thickness and be less than the printed circuit board (1) thickness.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201821682214.1U CN208874642U (en) | 2018-10-17 | 2018-10-17 | A kind of mould group of camera |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201821682214.1U CN208874642U (en) | 2018-10-17 | 2018-10-17 | A kind of mould group of camera |
Publications (1)
Publication Number | Publication Date |
---|---|
CN208874642U true CN208874642U (en) | 2019-05-17 |
Family
ID=66470342
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201821682214.1U Active CN208874642U (en) | 2018-10-17 | 2018-10-17 | A kind of mould group of camera |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN208874642U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021027906A1 (en) * | 2019-08-14 | 2021-02-18 | 欧菲光集团股份有限公司 | Base, camera module and electronic device |
WO2021027905A1 (en) * | 2019-08-14 | 2021-02-18 | 欧菲光集团股份有限公司 | Base, camera module, and electronic device |
-
2018
- 2018-10-17 CN CN201821682214.1U patent/CN208874642U/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021027906A1 (en) * | 2019-08-14 | 2021-02-18 | 欧菲光集团股份有限公司 | Base, camera module and electronic device |
WO2021027905A1 (en) * | 2019-08-14 | 2021-02-18 | 欧菲光集团股份有限公司 | Base, camera module, and electronic device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN208874638U (en) | A kind of mobile phone camera module group | |
US7539412B2 (en) | Camera module with first and second image sensor chips, holders and lens | |
CN206878952U (en) | A kind of camera module and mobile terminal | |
US20120044411A1 (en) | Camera module and method for assembling the same | |
CN208874642U (en) | A kind of mould group of camera | |
CN108174080B (en) | camera module and mobile terminal | |
KR20190016119A (en) | Flexible Foldable Display Screen and Manufacturing Method Thereof | |
CN102572229A (en) | Camera module | |
CN109525769A (en) | Camera module and mobile terminal | |
US20090273698A1 (en) | Image-sensing chip package module for reducing its whole thickness | |
CN105450914A (en) | Camera module, electrical bracket and circuit setting method thereof | |
CN209118664U (en) | Flexible screen assembly and electronic equipment | |
CN201947361U (en) | User terminal equipment with protective shield camera and camera thereof | |
CN208353465U (en) | A kind of miniaturization camera module structure | |
CN103780803A (en) | Image capturing module | |
CN208874641U (en) | A kind of camera module | |
EP3664140A1 (en) | Image capturing module and portable electronic device | |
CN203554557U (en) | An electronic device | |
CN111666783A (en) | Substrate structure, sensor module, electronic device and mounting method | |
CN207340011U (en) | A kind of dual camera module of anti-dropout | |
CN105516557B (en) | Camera module, electric bracket and conduction method thereof | |
US8078050B2 (en) | Camera module and assembling method thereof | |
US10965855B2 (en) | Lens module | |
KR100613419B1 (en) | Image Sensor Module and the product method thereof | |
CN210041981U (en) | Camera module and terminal equipment |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant |