CN216291124U

CN216291124U - Camera module and electronic equipment

Info

Publication number: CN216291124U
Application number: CN202122369466.7U
Authority: CN
Inventors: 刘燕妮
Original assignee: Jiangxi Jinghao Optical Co Ltd
Current assignee: Jiangxi Jinghao Optical Co Ltd
Priority date: 2021-09-28
Filing date: 2021-09-28
Publication date: 2022-04-12
Anticipated expiration: 2031-09-28

Abstract

The utility model discloses a camera module and electronic equipment, which comprise a first circuit board and a second circuit board, wherein the second circuit board is a rigid-flexible circuit board and comprises an outer frame plate, a flexible plate and at least one terminal; the first circuit board is laminated on the second circuit board, fixed with the terminal and electrically connected with the terminal, and the flexible board is opposite to the first circuit board; the circuit board assembly further comprises a support body, the support body is formed by extending the first mounting position and is fixedly connected with the second mounting position, or the support body is formed by extending the second mounting position and is fixedly connected with the first mounting position, or the support body extends from both the first mounting position and the second mounting position, and the support body of the first circuit board is connected with the support body of the second circuit board. The supporting body is used for lifting the distance between the first circuit board and the flexible board along the Z-axis direction, so that collision or friction is avoided.

Description

Camera module and electronic equipment

Technical Field

The utility model relates to the technical field of imaging devices, in particular to a camera module and electronic equipment.

Background

Photos shot by electronic equipment such as a mobile phone and the like in the shooting process sometimes become invalid, namely, the shot pictures are not clear enough, and double images or blurs occur. These situations are largely due to slight jitter occurring when the photographic subject is exposed, except for occasional defocus (i.e., the camera lens is not in focus properly). In general, such a very slight shaking phenomenon often occurs in a handheld condition, and thus, in recent years, there is a relatively large demand for developing an anti-shaking function.

The image sensor is arranged on the circuit board with the flexible connection part, so that the image sensor can move in an X-Y plane (in a direction perpendicular to the optical axis of the lens) along with the movable part in the circuit board relative to the fixed part of the circuit board under the action of the driving assembly, and the anti-shake effect of the chip can be realized. However, the stress of the flexible connection portion after deformation seriously affects the response speed of the movement of the image sensor, so that the flexible connection portion is mostly in a slender strip-shaped structure, and the wiring area is narrow and cannot meet the requirement.

How to reasonably reduce the wiring burden of the flexible connection portion to match the implementation of the chip anti-shake technology has become an urgent problem to be solved.

SUMMERY OF THE UTILITY MODEL

The utility model provides a camera module and electronic equipment, which can solve the problem that the distribution line area of a flexible part of the conventional chip anti-shake circuit board assembly is narrow and cannot meet the requirement.

In order to achieve the purpose, the utility model provides the following technical scheme:

the utility model provides a camera module and electronic equipment, which can solve the problem that the wiring space of a flexible part of an existing chip anti-shake circuit board is insufficient.

in a first aspect, a camera module is provided, which includes a first circuit board, a second circuit board, a first bracket, a second bracket, an OIS motor, a driver chip, an electrical connector, and an image sensor;

the second circuit board comprises an outer frame plate and a flexible plate; wherein the outer frame plate is a hard plate; the outer frame plate surrounds the periphery of the flexible plate and is electrically connected with the flexible plate, and the flexible plate can move relative to the outer frame plate;

the first circuit board and the second circuit board are arranged in a stacked mode, and the first circuit board and the flexible board are arranged oppositely and electrically connected;

the first circuit board comprises a first top surface at one side far away from the second circuit board, and the second circuit board comprises a second top surface facing to the side close to the first circuit board; at least part of the second top surface protrudes out of the first top surface along a direction parallel to the first top surface;

the first support covers the first top surface, and forms a first accommodating space with the first circuit board, and the image sensor is accommodated in the first accommodating space and arranged on the first top surface;

the second support covers the second top surface and forms a second accommodating space with the second circuit board, and the first support is accommodated in the second accommodating space;

the OIS motor is accommodated and supported between the first bracket and the second bracket;

the electric connecting piece is arranged on the second bracket and is connected with the outer frame plate and the OIS motor;

the driving chip is arranged on the second top surface, and the driving chip is electrically connected with the OIS motor through the electric connecting piece and controls the OIS motor. In the module of making a video recording that this application is shown, the driver chip of OIS motor sets up in the frame plate of second circuit board rather than first circuit board to directly realize being connected electrically with the OIS motor through the electricity connection, the effectual wiring burden that has shifted the flexonics, thereby solved the not enough problem in flexible part wiring space.

In some embodiments, the electrical connector is a conductive layer embedded in the second bracket.

Therefore, the second support can be regarded as a printed circuit board, the conducting layer is effectively protected, the conducting layer cannot be damaged due to factors such as collision or other misoperation in the processes of assembly or transportation, and the conducting layer is also more advantageous to be arranged in the second support body from the perspective of product appearance.

In some embodiments, the second top surface is provided with a first connecting point, and the first connecting point is located outside the second accommodating space;

the conducting layer is provided with a second connecting point on the outer side surface of the second bracket;

the first connection point and the second connection point are electrically connected to electrically connect the conductive layer and the outer frame plate.

Through the arrangement, the first connecting point and the second connecting point are exposed on the outer side surface of the camera module, so that the assembly difficulty is reduced. For example, the procedure of electrically connecting the first connection point and the second connection point may be arranged after the second bracket is covered on the outer frame plate, which is beneficial to reducing the assembly difficulty. For example, if a welding mode or a gold wire bonding process is used, the pollution to the components in the second accommodating space can be reduced, and the probability of interference between the operation process of the manipulator and other components of the camera module is greatly reduced.

In some embodiments, the electrical connector is a connecting piece attached to the surface of the second bracket.

The shape of the connecting piece can be flexibly designed according to the appearance of the second support, and the connecting piece can be well attached to the surface of the second support in a folding or bending mode, so that the difficulty of a manufacturing process can be effectively reduced.

the connecting piece is positioned on the outer surface of the second bracket, and a third connecting point is arranged at one end of the connecting piece close to the outer frame plate;

the first connection point and the third connection point are electrically connected so that the connection piece and the outer frame plate are electrically connected.

Through the setting, the first connecting point and the third connecting point are exposed on the outer side surface of the camera module, so that the assembly difficulty is reduced. For example, the procedure of electrically connecting the first connection point and the third connection point may be arranged after the second bracket is covered on the outer frame plate. The advantage of doing so is that if the welding mode is used, no pollution is caused to the components in the second accommodating space; if a gold wire bonding process is used, the probability of interference between the operation process of the manipulator and other parts of the camera module is greatly reduced.

In some embodiments, the driving chip is located on the second top surface and located in the second accommodating space.

Through the arrangement, the driving chip can be protected by the second support, and damage to the driving chip caused by improper operation in the assembling process is prevented.

In some embodiments, the first circuit board further comprises a first mounting surface, the first mounting surface being disposed opposite to the first top surface; the second circuit board further comprises a terminal, and the terminal comprises a second mounting surface facing the first mounting surface; the camera module further comprises a support body, and the support body is fixedly connected between the first mounting surface and the second mounting surface; the first circuit board is electrically connected to the flexible board through the terminal.

The terminal does the flexbile plate with the connection of first circuit board provides suitable interface, through support physical stamina lifting flexbile plate and first circuit board between the interval prevents that the flexbile plate from removing the in-process and bumping because of the deformation of Z direction and first circuit board.

In some embodiments, the support is a shim or a solid glue.

By adding the gasket or the solid glue, the distance between the first board and the flexible board can be further lifted, and the flexible board is prevented from colliding with the first circuit board due to overlarge deformation in the Z direction in the moving process; in addition, the gasket can be regarded as a reinforcement, which can improve the structural stability; when the solid glue is conductive glue, the first circuit board can be electrically connected with the terminal, so that the first circuit board is electrically connected with the second circuit board.

In some embodiments, the support body includes a boss extending from the first mounting surface to the second mounting surface, or the boss extends from the second mounting surface to the first mounting surface, or both the first mounting surface and the second mounting surface are provided with the boss and extend in opposite directions.

Through increasing the boss, can further lift the interval between first circuit board and the flexible board, prevent that the flexible board from removing the in-process because of the deformation volume of Z direction is too big and bumping with first circuit board. The boss is first circuit board or the extension of terminal, can integrated into one piece, and manufacturing process and assembly process are all comparatively simple, can effectual improvement production efficiency. In addition, the boss can increase the local thickness of first circuit board or terminal, and then improve structural stability. Moreover, the boss can be flexibly designed on the first mounting surface or the second mounting surface, and is beneficial to avoiding other elements. The first installation surface and the second installation surface are respectively provided with a boss, and the problem that the first circuit board or the second circuit board is locally too thick to cause difficulty in molding can be avoided.

In a second aspect, an electronic device is provided, which includes a housing and the camera module of the first aspect, wherein the camera module is disposed in the housing.

Compared with the prior art, the electronic equipment has the same advantages as the camera module, and is not repeated herein.

Drawings

In order to more clearly illustrate the technical solution in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below.

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 2 is a cross-sectional view of the first embodiment of the camera module of fig. 1 taken along the Y-axis through the optical axis of the lens.

Fig. 3 is an exploded view of the camera module shown in fig. 2.

Fig. 4 is a top view of the circuit board assembly and a portion of the electronic components shown in fig. 2 taken along the Z-axis.

Fig. 5 is a plan view of the second circuit board of fig. 2 in the Z-axis direction.

Fig. 6a is a cross-sectional view of a circuit board assembly in a second embodiment of the camera module of fig. 1.

Fig. 6b is an exploded view of the circuit board assembly of fig. 6 a.

Fig. 7a is a cross-sectional view of a circuit board assembly in a third embodiment of the camera module of fig. 1.

Fig. 7b is an exploded view of the circuit board assembly of fig. 7 a.

Fig. 8a is a cross-sectional view of a circuit board assembly in a fourth embodiment of the camera module of fig. 1.

Fig. 8b is an exploded view of the circuit board assembly of fig. 8 a.

Fig. 9a is a cross-sectional view of a circuit board assembly in a fifth embodiment of the camera module of fig. 1.

Fig. 9b is an exploded view of the circuit board assembly of fig. 9 a.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

It will be understood that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. As used herein, the terms "left", "right", "upper", "lower", and the like are for illustrative purposes only and do not represent the only embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model.

It should be noted that the terms "top," "bottom," and the like, as used herein, are used with reference to the orientation of FIG. 2, and do not indicate or imply that the referenced device or element must have a particular orientation, configuration, and operation in a particular orientation, and therefore should not be considered limiting of the present application.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an electronic device 100 according to an embodiment of the present disclosure. The electronic device 100 may be an electronic product with a camera function, such as a mobile phone, a tablet computer, a notebook computer, a car machine, a point of sale terminal (POS machine for short), or a wearable device. Wherein, the wearable device can be smart band, smart watch, Augmented Reality (AR) glasses, virtual reality technology (VR) glasses, etc. In the embodiment of the present application, the electronic device 100 is a mobile phone as an example.

For convenience of description, the width direction of the electronic device 100 is defined as an X-axis direction, the length direction of the electronic device 100 is defined as a Y-axis direction, the thickness direction of the electronic device 100 is defined as a Z-axis direction, and the X-axis direction, the Y-axis direction, and the Z-axis direction are perpendicular to each other.

In this embodiment, the electronic device 100 includes a housing 10, a display module 20, a camera module 30, and an image processor 40.

The case 10 includes a bezel 11 and a rear cover 12, and the rear cover 12 is fixed to one side of the bezel 11. The frame 11 and the rear cover 12 may be fixed to each other by assembling, or may be integrally formed structural members. The display module 20 is mounted on one side of the casing 10 opposite to the rear cover 12; that is, the display module 20 and the rear cover 12 are fixed to opposite sides of the bezel 11, respectively. The display module 20 has a light-transmitting area 201, and light outside the electronic device 100 can enter the electronic device 100 through the light-transmitting area 201.

The camera module 30 and the image processor 40 are mounted inside the housing 10 below or at the top of the display module. The inside of the casing 10 is the inside of the electronic device 100. The camera module 30 is located below the display module and collects light outside the electronic device 100 through the light-transmitting area 201, and forms corresponding image data. The image processor 40 is electrically connected to the camera module 30, and the image processor 40 is configured to obtain image data from the camera module 30 and process the image data. The image data processed by the image processor 40 may be displayed on the display module 20, stored in the memory of the electronic device 100, or stored in the cloud via the electronic device 100.

In the electronic apparatus 100 shown in this embodiment, the camera module 30 is located on a side of the electronic apparatus 100 close to the display module 20, and is used as a front camera module of the electronic apparatus 100. In other embodiments, the camera module 30 may also be located on a side of the electronic device 100 away from the display module 20, and used as a rear camera module of the electronic device 100. At this time, the rear cover 12 is provided with a camera hole, and the camera module 30 collects light outside the electronic device 100 through the camera hole of the rear cover 12. In other words, the camera module 30 can be used as a front camera module of the electronic device 100, and can also be used as a rear camera module of the electronic device 100. Alternatively, the electronic apparatus 100 may include a plurality of (two or more) camera modules 30, at least one camera module 30 serving as a front camera module of the electronic apparatus 100, and at least one camera module 30 serving as a rear camera module of the electronic apparatus 100.

It should be noted that the position of the camera module 30 in fig. 1 in the electronic device 100 is only an optional example, that is, the optical axis of the camera module 30 is parallel to the Z axis. In other embodiments, the optical axis direction of the camera module 30 may also be perpendicular to the Z-axis, which is not specifically limited in this application.

The camera module provided by the embodiment of the application comprises a first circuit board, a second circuit board, a first support, a second support, an OIS motor, a driving chip, an electric connecting piece and an image sensor;

the first circuit board comprises a first top surface at one side far away from the second circuit board, and the second circuit board comprises a second top surface facing the first circuit board; at least part of the second top surface protrudes out of the first top surface along the direction parallel to the first top surface;

the driving chip is arranged on the second top surface, and the driving chip is electrically connected with the OIS motor through the electric connecting piece and controls the OIS motor.

In the camera module shown in this application, the driver chip of OIS motor sets up in the frame plate of second circuit board rather than first circuit board to be driver chip and OIS motor through electric connector and realize being connected electrically, the effectual wiring burden that has shifted the flexonics, thereby solved the not enough problem in flexible part wiring space.

The following describes the image capturing module according to the present application in detail with reference to the accompanying drawings.

Referring to fig. 2 and 3, fig. 2 is a cross-sectional view of the camera module of fig. 1 taken along the Y-axis through the optical axis of the lens according to the first embodiment, and fig. 3 is an exploded view of the camera module 30 shown in fig. 2.

The camera module 30 includes a circuit board assembly including first and

second circuit boards

31 and 32, an Image sensor 33, a first holder 34a, a second holder 34b, an Optical filter 35, an OIS (Optical Image Stabilization) motor 36a, an auto-focus motor 36b, a driving chip 37, a lens 38, and a support 39.

The second circuit board 32 is a rigid-flex circuit board, and includes an outer frame plate 32a, a flexible plate 32b, and a terminal 32 c. The first circuit board 31 includes a first mounting surface, and the first mounting surface is provided with a first mounting position M1. The terminal 32c includes a second mounting surface facing the first mounting surface, and the second mounting surface is provided with a second mounting position M2 corresponding to the first mounting position.

The terminal 32c is disposed at an edge of the flexible board 32b, and the terminal 32c is electrically connected to the flexible board 32 b; the outer frame plate 32a is disposed around the periphery of the combination of the flexible board 32b and the terminal 32c, and the outer frame plate 32a is electrically connected to the flexible board 32 b.

The circuit board assembly further comprises a supporting body 39, the supporting body 39 is formed by extending the first mounting position M1 and is fixedly connected with the second mounting position M2, or the supporting body 39 is formed by extending the second mounting position M2 and is fixedly connected with the first mounting position M1, or the first mounting position M1 and the second mounting position M2 are both extended with the supporting body 39, and the supporting body 39 of the first circuit board 31 and the supporting body 39 of the second circuit board 32 are connected with each other.

The first circuit board 31 is laminated on the second circuit board 32, the first mounting surface is opposite to the second mounting surface, the first circuit board 31 is fixed to and electrically connected with the terminal 32c, the flexible board 32b is opposite to the first circuit board 31, and the support 39 forms a gap between the first circuit board 31 and the flexible board 32 b.

The image sensor 33 is mounted on the first circuit board 31; the first bracket 34a is disposed on a side of the first circuit board 31 opposite to the first mounting surface; the second bracket 34b is disposed on the outer frame plate 32a and on the same side as the second mounting surface, the second bracket 34b is covered on the first bracket 34a, and the OIS motor 36a is located between the first bracket 34a and the second bracket 34b and supports the first bracket 34a by the second bracket 34 b; the lens 38 is disposed on a side of the second holder 34b away from the image sensor 33.

When the circuit board assembly is used for a camera module 30, the first circuit board 31 and the second circuit board 32 are stacked to help reduce the occupied space and thus facilitate miniaturization of the camera module, the first circuit board can be used for carrying an image sensor 33 and providing power and transmitting data, the second circuit board 32 provides power and transmitting data for the first circuit board 31 through a flexible board 32b and allows the image sensor 33 to move relative to the outer frame plate 32a along with the first circuit board 31 so as to realize a chip anti-shake function.

The flexible board 32b has a small deformation resistance to facilitate the movement of the image sensor 33, the terminal 32c provides a suitable interface for the connection between the first circuit board 31 and the flexible board 32b, and the outer frame plate 32a has a certain strength to provide a basic frame support for the camera module 30.

The supporting body 39 is used for lifting the distance between the first circuit board 31 and the flexible board 32 along the Z-axis direction, so that sufficient space is provided for the deformation of the flexible board 32b, and the first circuit board 31 is prevented from being touched by the deformation process of the flexible board 32b, thereby avoiding the friction between the flexible board 32b and the first circuit board 31 and the adverse conditions that the flexible board 32b pushes the first circuit board 31 to incline and the like. In addition, the supporting body 39 can be flexibly arranged at the first mounting position M1 or the second mounting position M2, and can meet various design requirements.

Specifically, referring to fig. 3 to 5, fig. 3 is an exploded view of the camera module 30 shown in fig. 2, fig. 4 is a top view of the circuit board assembly and a portion of the electronic components shown in fig. 2 along the Z-axis direction, and fig. 5 is a top view of the second circuit board shown in fig. 2 along the Z-axis direction.

The first circuit board 31 is an integrated hard circuit board, and can be used for disposing pads and electronic components, and includes a first top surface 311 and a first bottom surface 312, which are disposed opposite to each other. First top surface 311 and first bottom surface 312 are both parallel to the X-Y plane (and may also be substantially parallel to the X-Y plane, i.e., allowing for some deviation). That is, the first top surface 311 and the first bottom surface 312 of the first circuit board 31 are both perpendicular to the Z-axis direction (may also be substantially perpendicular to the Z-axis direction, i.e., a slight deviation is allowed).

In this embodiment, the first top surface 311 is provided with a first pad P1, a second pad P2 and an image sensor 33, the first pad P1 is electrically connected to the image sensor 33, the first pad P1 is electrically connected to the second pad P2, and the second pad P2 provides a suitable interface for electrically connecting the first circuit board 31 and the second circuit board 32. The image sensor 33 transmits an electrical signal through the circuit board assembly and obtains a power supply.

Specifically, the image sensor 33 is installed in the middle area of the first top surface 311, and both the first top surface 311 and the image sensor 33 are approximately square and each side of the first top surface 311 and the image sensor 33 is correspondingly arranged; the first bonding pads P1 are multiple and arranged near the two opposite side edges of the image sensor 33, and the first bonding pads P1 are electrically connected with the image sensor 33 through a gold wire bonding process; the second pads P2 are provided along the opposite edges of the first top surface 311 and on the same side as the first pads P1. This helps to reduce the distance between the first pad P1 and the second pad P2, and reduce the wiring distance between the first pad P1 and the second pad P2 on the first circuit board 311, i.e. reduce the resistance, save materials, and improve the stability of the electrical connection.

It is to be understood that the use of gold wire for electrical connection in the present invention is merely an exemplary expression and is not intended to limit the present application, and copper wire, aluminum wire, silver wire, and other materials may be used instead. The same is understood hereinafter with respect to the description of the gold wires. Here, the gold wire bonding may be understood as a Wire Bonding (WB) process, and the wire bonding process may also be referred to as a pressure welding process, a binding process, a bonding process, or a wire bonding process. The description of "gold wire bonding" is hereinafter understood in the same way.

The second circuit board 32 is a rigid-flex board, and includes an outer frame plate 32a, a flexible plate 32b, and a terminal 32 c. The outer frame plate 32a and the terminal 32c are electrically connected by a flexible plate 32b, and the terminal 32c is movable in a direction parallel to the X-Y plane with respect to the outer frame plate 32 a. Note that the above description does not exclude the case where the terminal 32c is movable in the Z-axis direction with respect to the outer frame plate 32 a.

The terminals 32c are located on opposite sides of the flexible board 32b, and the two terminals 32c are electrically connected to the flexible board 32 b. The outer frame plate 32a is disposed around the periphery of the combined body of the flexible plate 32b and the terminal 32c, and the outer frame plate 32a is electrically connected to the flexible plate 32 b.

In this embodiment, the outer frame plate 32a includes a second top surface 321a and a second bottom surface 322a that are disposed opposite to each other, and may be used to dispose a pad, an electronic component, a wiring, and the like; second top surface 321a and second bottom surface 322a are both parallel to the X-Y plane (and may also be substantially parallel to the X-Y plane, i.e., allowing for some deviation). That is, the second top surface 321a and the second bottom surface 322a of the second circuit board 32 are both perpendicular to the Z-axis direction (may also be substantially perpendicular to the Z-axis direction, i.e., a slight deviation is allowed).

Specifically, the outer frame plate 32a is a substantially closed hollow frame, which ensures a certain structural stability, and the hollow portion of the outer frame plate 32a is used to accommodate the flexible plate 32b and the terminal 32c, and also to leave a certain space for movement of the flexible plate 32b and the terminal 32 c. The outer frame plate 32a may be a non-closed box or a shape other than a box, as long as a certain structural strength is ensured, and the first circuit board 31 is allowed to be electrically connected to the flexible board 32b through the terminal 32c and to move relative to the outer frame plate 32a, which is not particularly limited herein.

The flexible board 32b is a flexible circuit board with a belt-like structure, and is spirally distributed on the whole and is substantially swastika-shaped. Such a configuration allows the strip-like structure of the flexible board 32b to have a large length in the extending direction, and can reduce the amount of deformation per unit length of the strip-like structure of the flexible board 32b without changing the total offset amount of the terminal 32c, thereby reducing the resistance and facilitating the movement of the terminal 32c in the X-Y direction and the Y direction in the X-Y plane.

In this embodiment, four strip structures extend from the middle of the flexible board 32b, and the end portions of the four strip structures correspond to the inner side walls of the outer frame board 32a one-to-one, wherein two end portions are symmetrically arranged about the center of the flexible board 32b, and are respectively fixed and electrically connected to the opposite inner side walls of the outer frame board 32a, and the other two end portions are respectively connected to one terminal 32c, so that the stress condition of the flexible board 32b tends to be balanced and is not easy to incline.

It should be noted that the shape of the spiral distribution of the flexible board 32b is not exclusive, and it should be an embodiment of the present invention as long as the outer frame board 32a can be connected to the terminal 32c through the flexible board 32b and the terminal 32c is allowed to move in a plane parallel to the X-Y plane relative to the outer frame board 32 a. In addition, the flexible board 32b has a certain structural strength, and can maintain a basic form without being subjected to an external force.

In this embodiment, the terminal 32c is a flat plate structure, and includes a third top surface 321c and a third bottom surface 322c that are disposed opposite to each other, so that the terminal 32c can have a sufficient surface area for disposing a circuit board, and the thickness of the camera module 30 can be reduced; third top surface 321c and second bottom surface 322c are both parallel to the X-Y plane (and may also be substantially parallel to the X-Y plane, i.e., allowing for some deviation). That is, the third top surface 321c and the third bottom surface 322c of the terminal 32c are perpendicular to the Z-axis direction (may also be substantially perpendicular to the Z-axis direction, i.e., a slight deviation is allowed).

Specifically, the terminals 32c are substantially linear and long strips, and the number of the terminals is two, and the extending directions of the terminals are parallel to each other and also parallel to the corresponding extending direction of the frame of the outer frame plate 32 a. With the arrangement, the terminal 32c is adapted to the shape of the outer frame plate 32a, so that the possibility of mutual interference of the components is reduced, the space utilization rate of the hollow part of the outer frame plate 32a is improved, and the long strip shape can ensure that the terminal 32c has a sufficient contact area when being combined with other components, thereby being beneficial to improving the structural stability. It should be noted that the above description of the number and form of the terminals 32c is only an example, and not an exclusive choice, and other forms of the terminals 32c should also fall within the protection scope of the present application.

It should be noted that the first top surface 311, the second top surface 321a and the third top surface 321c are oriented in the same direction, and the first bottom surface 312, the second top surface 321a and the third top surface 321c are oriented in the same direction.

When the first circuit board 31 and the second circuit board 32 are assembled, the first bottom surface 312 is disposed to be overlapped toward the second top surface 321 a. The first circuit board 31 is mounted on the terminal 32c, and the terminal 32c is fixed to the first bottom surface 311 and electrically connected to the first circuit board 31.

Specifically, the two terminals 32c are respectively located on two opposite sides of the first circuit board 31, the extending direction of the terminals 32c is parallel to the edge of the first circuit board 31, the third top surface 321c is partially staggered from the first bottom surface 312, that is, the third top surface 321c protrudes from the first bottom surface 312 along a direction parallel to the X-Y plane, the protruding portion of the third top surface 321c is used for disposing the third pad P3, and the second pad P2 and the third pad P3 are located on the same side. So set up, reduced the interval between second pad P2 and the third pad P3 greatly, utilized gold thread bonding process with both the effectual gold thread length that has reduced when electrically connecting, improved structural connection stability promptly, saved the material again.

The first circuit board 31 is laminated on the second circuit board 32 and fixed and electrically connected to the two terminals 32c, and the flexible board 32b is disposed opposite to the first circuit board 31. The thickness of the flexible board 32b in the Z direction is smaller than that of the outer frame board 32a in the Z direction, which can both reduce the thickness of the flexible board 32b in the Z axis direction and provide a certain gap between the flexible board 32b and the first circuit board 31. The gap provides a space for accommodating deformation of the flexible board 32c in the Z-axis direction when the flexible board 32c moves in a plane parallel to the X-Y plane, thereby avoiding spatial interference of the flexible board 32c with the first circuit board 31 or other components.

In this embodiment, the first mounting surface is a first bottom surface 312, and the second mounting surface is a third top surface 321 c. In the Z-axis direction, there is an overlapping region between the first bottom surface 312 and the third top surface 321c, the overlapping region is a first mounting position M1 at a position corresponding to the first bottom surface 312, the overlapping region is a second mounting position M2 at a position corresponding to the third top surface 321c, and the support 39 is disposed between the first mounting position M1 and the second mounting position M2. The supporting body 39 is solid and has a certain rigidity, and is mainly used for lifting the distance between the first circuit board 31 and the flexible board 32 b. When the flexible board 32b deforms in the Z-axis direction, the support 39 is provided to prevent the flexible board 32b from colliding or rubbing with the first circuit board 31, thereby protecting the circuit board assembly.

In other embodiments, the first mounting position M1 and the second mounting position M2 may be at any position on the first mounting surface, and the specific form may be set according to the number and corresponding position of the terminals 32c, as long as the first circuit board 31 and the second circuit board 32 can be maintained in circuit connection and can be relatively displaced.

In the present embodiment, the supporting body 39 has two free ends, one of which faces and is bonded to the correspondingly disposed first mounting location M1 and the other of which faces and is bonded to the correspondingly disposed second mounting location M2. So that the first circuit board 31 and the terminals 32c are fixed to each other by adhesion. For example, the supporting body 39 may be a rigid gasket, the gasket is of a substantially flat plate type structure, the top surface and the bottom surface of the gasket are both free ends, and the shape of the gasket is adapted to the first mounting position M1 and the second mounting position M2, respectively, and the two free ends can be fixed to the first mounting position M1 and the second mounting position M2 by glue, so as to fixedly connect the supporting body 39 to the first circuit board 31 and the terminals 32 c. By adding the rigid spacer, the distance between the first circuit board 31 and the flexible board 32b can be increased, and the flexible board 32b is prevented from interfering with other components due to the deformation in the Z direction when the flexible board 32b moves in a plane parallel to the X-Y plane. In addition, the gasket can also be regarded as a reinforcing means, which can increase the structural stability. It should be noted that the number of the rigid pads may be flexibly set, the distance between the first circuit board 31 and the flexible board 32c may be directly adjusted by adjusting the thickness and the stacking number of the rigid pads, and the number of the free ends on both sides of the supporting body 39 may also be multiple, which is not limited herein.

In other embodiments, the support 39 may also be an anisotropic conductive adhesive, the second pad P2 may be disposed at the first mounting location M1 (not shown), and the third pad P3 may be disposed at the second mounting location M2 (not shown), that is, the second pad P2 and the third pad P3 are electrically connected and fixed to each other through the support 39, so as to avoid using a gold wire, and avoid the gold wire from breaking due to movement, vibration, collision, or other factors.

The first bracket 34a is mounted to the top side of the first circuit board 31. In this embodiment, the first bracket 34a is mounted on the first top surface 311 of the first circuit board 31. Specifically, the first bracket 34a is mounted on an edge region of the first top surface 311 and covers the top of the image sensor 33. Illustratively, the first bracket 34a may be mounted to the first top surface 311 of the first circuit board 31 by means of adhesion.

It should be noted that, the first bracket 34a is mounted on the edge region of the first top surface 311, which means that at least most of the first bracket 34a is located near the edge of the first circuit board 31, and at least a part of the region of the first top surface 311 protrudes from the first bracket 34a in a direction parallel to the X-Y plane. The second pads P2 are disposed on the protruded portion of the first top surface 311, so that the second pads P2 are exposed outside the first frame 34a, and the second pads P2 and the third pads P3 are electrically connected by gold wire bonding.

The first bracket 34a includes a fourth top surface 341a facing away from the first circuit board 31. The first support 34a has a first light passing hole 349a, and an opening of the first light passing hole 349a is located on the fourth top surface 341a of the first support 34 a.

Specifically, the opening of the first light passing hole 349a is located in the middle region of the fourth top surface 341a, and the first light passing hole 349a is recessed from the fourth top surface 341a of the first support 34a toward the direction of the first circuit board 31 and penetrates through the first support 34a along the Z-axis direction. Wherein the first light passing hole 349a corresponds to the image sensor 33. Note that, the fact that the first light passing hole 349a corresponds to the image sensor 33 means that: the first light passing hole 349a overlaps with the image sensor 33 partially or entirely in the projection of the first circuit board 31 in the optical axis direction to ensure that the image sensor 33 can receive the light entering the inside of the first support 34a from the first light passing hole 349 a. The same is understood in the following description about "corresponding to".

In addition, the first clear aperture 349a is a closed aperture (i.e., the first clear aperture 349a has the entire first aperture wall 348 a). First aperture wall 348a may be relatively perpendicular or relatively inclined to fourth top surface 341a of first shelf 34 a. Specifically, the first hole wall 348a partially protrudes to form the first supporting portion 342 a. The first supporting portion 342a is a continuous closed ring. In other embodiments, the first supporting portion 342a may be a discontinuous ring. It should be understood that the shape of the first supporting portion 342a may be a square ring, a circular ring, or a ring with other shapes, which is not specifically limited in this application.

The filter 35 is mounted on the first support 34a and covers the first light passing hole 349 a. The filter 35 is accommodated in the first light passing hole 349a and corresponds to the image sensor 33. The external light is filtered by the filter 35 and received by the image sensor 33, and the image sensor 33 converts the light to form an image.

Specifically, the filter 35 is mounted on the top surface of the first supporting portion 342a in the first light passing hole 349 a. For example, the optical filter 35 may be fixed to the top surface of the first supporting portion 342a by adhesion. The filter 35 includes, but is not limited to, an infrared cut filter or a full transmittance spectrum filter.

It should be noted that the fact that the filter 35 covers the first light passing hole 349a means that the filter 35 covers the narrowest position of the first light passing hole 349a, and external light can enter the first support 34a only through the filter 35. In other embodiments, the filter 35 may also be partially accommodated in the first light passing hole 349a, or the filter 35 covers an opening of the first light passing hole 349 a.

Therefore, the first circuit board 31, the first bracket 34a and the optical filter 35 are fixed to each other to form a "box", that is, the first circuit board 31, the first bracket 34a and the optical filter 35 form a closed space, so that dust can be prevented from falling onto the photosensitive surface of the image sensor 33, which helps to maintain high imaging quality of the camera module 30. It should be noted that, similarly to the case of the first circuit board 31, the "box" is also capable of moving relative to the outer frame plate 32a, and the specific case is not described in detail here.

The second bracket 34b is mounted to the top side of the second circuit board 32. In this embodiment, the second bracket 34b is mounted to the second top surface 321a of the outer frame plate 32 a. Specifically, the second bracket 34b is mounted on an edge region of the second top surface 321a and covers the first bracket 34 a. Illustratively, the second bracket 34b may be mounted to the second top surface 321a of the outer frame plate 32a by bonding.

It should be noted that, the second support 34b is mounted on the edge region of the second top surface 321a, which means that at least most of the second support 34b is located near the edge of the outer frame plate 32a, and at least a partial region of the second top surface 321a protrudes from the second support 34b in the direction parallel to the X-Y plane, that is, the second circuit board 32 is at least partially staggered from the second support 34 b. The protruding portion of the second top surface 321a is provided with a first connection point, and the first connection point is provided with a fourth pad P4, so that the fourth pad P4 can be ensured to be exposed outside the second support 34b, that is, after the second support 34b is installed on the second top surface 321a, although most of the second circuit board 32 is covered by the second support 34b, the outer frame plate 32a can still be allowed to be electrically connected with the outside through the fourth pad P4, which helps to reduce the manufacturing difficulty and simplify the process flow, and is helpful to improve the quality of the product.

The second bracket 34b includes a fifth top surface 341b facing away from the second circuit board 32. The second support 34b has a second light passing hole 349b, and the opening of the second light passing hole 349b is located on the fifth top surface 341b of the second support 34 b. Specifically, the opening of the second light passing hole 349b is located in the middle area of the fifth top surface 341b, and the second light passing hole 349b is recessed from the fifth top surface 341b of the second support 34b toward the second circuit board 32 and penetrates through the second support 34b along the Z-axis direction. Wherein the second through hole 349b corresponds to the image sensor 33.

In addition, the second clearance aperture 349b is a closed aperture (i.e., the second clearance aperture 349b has an integral second aperture wall 348 b). The second aperture wall 348b can be perpendicular or oblique relative to the fifth top surface 341b of the second leg 34 b. Specifically, the second hole wall 348b partially protrudes to form the second supporting portion 342 b. The second supporting portion 342b is a continuous closed ring. In other embodiments, the second supporting portion 342b may be a discontinuous ring. It should be understood that the second supporting portion 342b may be square ring-shaped, circular ring-shaped, or other ring-shaped, and the present application is not limited thereto.

An OIS motor 36a is further disposed between the first support 34a and the second support 34b, and is at least used for driving the "box" to move in a direction parallel to the X-Y plane, so as to implement the chip anti-shake function. Specifically, the OIS motor 36a is fixed between the fourth top surface 341a of the first bracket 34a and the bottom side of the second supporting portion 342b, supports the "box" on the bottom side of the second supporting portion 342b, and can drive the "box" to move in a direction parallel to the X-Y plane by means of the second supporting portion 342 b. It should be noted that the term "support" means to control the "case" to be suspended between the second circuit board 32 and the second support 34a in the Z direction and to allow the "case" to move at least in a direction parallel to the X-Y plane, as will be understood from the description of "support" later.

It should be understood that the configuration of the OIS motor 36a is not exclusive. In this embodiment, the OIS motor 36a is an integrated structure, and it should be noted that the integrated structure is understood that the OIS motor 36a exists as an integral component between the fourth top surface 341a of the first bracket 34a and the bottom surface of the second supporting portion 342b, and the integration is favorable for reducing the assembly difficulty. Further, the OIS motor 36a may also be integrated with the second bracket 34b, so that the assembly process of the second bracket 34b and the OIS motor 36a may be omitted, that is, the production efficiency is improved, and the occurrence of poor assembly caused by improper operation is also avoided.

The OIS motor 36a may also be a split structure, and it should be noted that the split structure may be understood that the OIS motor 36a has a plurality of components, which are located at different positions between the first support 34a and the second support 34b, and are spaced apart from each other.

For example, the second holder 34 and the "case" may be "supported" by a suspension wire, and the magnet may be provided on the circumferential side of the "case" and the coil may be provided near the inner wall of the second holder 34, so that the driving function in the direction parallel to the X-Y plane may be realized by ampere force, wherein the positions of the magnet and the coil may be interchanged (not shown). Alternatively, the OIS motor may be replaced by a ceramic motor or another transverse driving component such as a Shape Memory Alloy (SMA), and the suspension wires may be replaced by a spring, a silicon chip, a thin film or another supporting component. In short, as long as the transverse driving function can be achieved, the details are not detailed and are not limited.

In order to facilitate control and power supply of the OIS motor 36a, the outer frame plate 32a is further provided with a driving chip 37, and the driving chip 37 is electrically connected with the outer frame plate 32a and used for controlling the OIS motor 36 a; electrical connections (not shown) connect the OIS motor 36a to the outer frame plate 32a for maintaining the OIS motor 36a in electrical communication with the outer frame plate 32 a. This arrangement has an advantage that no signal transmission between the OIS motor 36a and the driver chip 37 or between the driver chip 37 and the outside of the camera module 30 is required to pass through the flexible board 32b, which helps to relieve the wiring pressure of the flexible board 32 b.

It should be noted that, in order to facilitate the "box" to move in the direction parallel to the X-Y plane, the flexible board 32b is configured as a belt-shaped structure, so that the resistance can be reduced, and the narrower width of the belt-shaped structure can further reduce the resistance, but this results in a very limited area of the flexible board 32b available for arranging the wiring circuit, and it is difficult to satisfy the electrical connection requirement between the first circuit board 31 and the second circuit board 32. Assuming that the driving chip 37 is disposed on the first circuit board 31, the terminals 32c and the flexible board 32b require additional wiring, which is difficult to achieve at present, and excessively dense wiring arrangement has a great obstacle in both design and manufacture.

In summary, by directly providing the driver chip 37 for controlling the OIS motor 36a on the outer frame 32a, the part of the wiring that should be provided on the flexible board 32b can be omitted or replaced by the wiring on the outer frame 32a, so that the wiring length can be greatly shortened and the situation of insufficient wiring space of the flexible board 32b can be avoided.

In some embodiments, the driving chip 37 is disposed on the second top surface 321a of the outer frame plate 32a and located inside the second hole wall 348b, so that the driving chip 37 is protected by the outer frame plate 32 a. In other embodiments, the driving chip 37 may also be located outside the second hole wall 348b, so that the mounting order of the driving chip 37 and the second bracket 34b can be arranged, which is helpful to improve the flexibility of the assembly process. For example, the number of the driving chips 37 may be multiple, and the driving chips 37 may be respectively disposed on the inner side and the outer side of the second hole wall 348b, which is determined according to the actual situation and is not limited herein.

In some embodiments, the electrical connection is a conductive layer (not shown) embedded in the second support 34b, the conductive layer having a connection point on the outer surface of the second support 34b and a fifth pad P5 connected thereto, one end of the conductive layer being connected to the OIS motor 36a and the other end of the conductive layer being connected to the fifth pad P5.

Specifically, the conductive layer is integrated (embedded) inside the second support 34b, that is, the second support 34b may also be understood as a special-shaped printed circuit board, which has a better protection effect on the conductive layer and a better appearance, for example, and can be better connected to the OIS motor 36a integrated on the second support 34 b. The outer side surface of the second hole wall 348b is provided with a second connection point, the second connection point is provided with a fifth pad P5, the fourth pad P4 is adjacent to the fifth pad P5 and can be directly fixed and electrically connected in a welding mode, the arrangement process is simple, the structure is stable, gold threads are not needed, and the manufacturing cost is remarkably reduced.

In other embodiments, the electrical connection member may be formed by a connection piece surface-attached to the outer side surface of the second bracket 34 b. The connecting piece may be a flexible circuit sheet or a metal sheet or the like. One end, close to the outer frame plate, of the connecting sheet is provided with a third connecting point, the third connecting point is provided with a fifth bonding pad P5, and the fourth bonding pad P4 is close to the fifth bonding pad P5 and is electrically connected through soldering. The shape of the connecting piece can be flexibly designed according to the appearance of the second support 34b, the connecting piece can be well attached to the surface of the second support 34b in a folding or bending mode, the difficulty of a manufacturing process can be effectively reduced, and the production yield of parts can be improved.

For example, the electrical connection element may also be a conductive trace etched on the outer surface of the second bracket 34b, and any way that the OIS motor and the fifth pad P5 can be electrically connected based on the second bracket 34b shall fall within the scope of the present application, and is not limited herein.

It should be noted that there are a plurality of the fourth pads P4 and the fifth pads P5, but they may correspond to each other, or one pad may correspond to a plurality of pads, which is determined by the design requirements and is not limited herein. In addition, the fourth pad P4 and the fifth pad P5 may also be electrically connected by a gold wire bonding process or other processes, which may be optional, and the present application is not limited thereto.

The fifth top surface 341b of the second bracket 34a is provided with an auto-focus motor 36b, and the auto-focus motor 36b is internally provided with a lens 38, wherein the auto-focus motor 36b is used for driving the lens 38 to move in a direction parallel to the Z axis to realize a focusing function, and the lens 38 is used for taking and imaging images on the light-sensing surface of the image sensor 33. The autofocus motor 36b may be a voice coil motor, and the autofocus motor 36b may also be another driving device with a longitudinal driving function, which is not limited herein. The lens 38, the filter 35, and the image sensor 33 are sequentially arranged along the optical axis, and the light enters from the lens 38 and then sequentially reaches the filter 35 and the image sensor 33.

The camera module 30 may also include a connector 50. The connector 50 is electrically connected to the second circuit board 32 for communicating the camera module 30 with the electronic device 100, and the connector 50 may be disposed on a side where the driving chip 37 is located, so as to shorten the line length and facilitate reducing the manufacturing process and the production cost. It should be noted that the connector 50 may also be disposed on any side of the second circuit board 32, which depends on the design requirement and is not limited herein.

The camera module 30 may further include a stiffener 60. The reinforcing plate 60 may be disposed on the second bottom surface 322a of the outer frame plate 32a, and the second bottom surface 322a covered by the reinforcing plate 60 includes a hollow portion of the outer frame plate 32a, which is mainly used to increase the structural strength and avoid the deformation of the outer frame plate 32a due to the hollow portion. In addition, the reinforcing plate 60 covers the hollow portion of the outer frame plate 32a to prevent dust from flying into the camera module 30, so that the service life of the camera module is prolonged, and the probability of dust entering the lens 38 is reduced.

In order to avoid contact and friction, the reinforcing plate 60 is spaced apart from the flexible plate 32b and the terminals 32c in the Z direction, so that the flexible plate 32b and the terminals 32c can move freely in the X-Y direction without being hindered by the reinforcing plate 60.

Referring to fig. 6a and 6b, fig. 6a is a cross-sectional view of a circuit board assembly in a second embodiment of the camera module of fig. 1, and fig. 6b is an exploded view of the circuit board assembly of fig. 6 a.

The camera module 30 according to the second embodiment of the present invention is substantially the same as the camera module 30 according to the first embodiment of the present invention, except that the supporting body 39 is a part of the circuit board assembly. Specifically, the first mounting position M1 of the first bottom surface 312 extends toward the second mounting position M2 to form the supporting body 39. The support body 39 is in the form of a boss with only one free end, which is adhesively secured to the second mounting location M2 by glue.

The support 39 is integrated with the first circuit board 31, so that on one hand, the number of assembly parts can be reduced, and the process flow is simplified; on the other hand, the complexity of the shape of the terminal 32c can be avoided from increasing, which is helpful to improve the production yield of the second circuit board 32. In addition, the supporting body 39 is disposed on the first circuit board 31, so that the local thickness of the first circuit board can be increased, the structural stability of the first circuit board can be improved, and the thick circuit board body is more friendly to the arrangement of the conductive circuits. When the first circuit board is provided with the component, the support body can prevent the component from generating unnecessary collision due to misoperation.

Referring to fig. 7a and 7b, fig. 7a is a cross-sectional view of a circuit board assembly in a third embodiment of the camera module of fig. 1, and fig. 7b is an exploded view of the circuit board assembly of fig. 7 a.

The camera module 30 according to the third embodiment of the present invention is substantially the same as the camera module 30 according to the first embodiment of the present invention, except that the supporting body 39 is a part of the circuit board assembly. Specifically, the second mounting position M2 of the second top surface 321c extends toward the first mounting position M1 to form the supporting body 39. The support body 39 is in the form of a boss with only one free end, which is adhesively secured to the first mounting location M1 by glue.

The support 39 is integrated with the terminal 32c, so that on one hand, the number of assembly parts can be reduced, and the process flow is simplified; on the other hand, the complexity of the shape of the first circuit board 31 can be avoided from increasing, which is helpful to improve the production yield of the first circuit board 31. In addition, the supporting body 39 is disposed on the terminal 32c, so that the local thickness of the terminal 32c can be increased, the structural stability of the terminal 32c can be improved, and the thick circuit board body is more friendly to the arrangement of the conductive circuits. When the terminal 32c is provided with a component, the support 39 can prevent unnecessary collision due to an operation error.

Referring to fig. 8a and 8b, fig. 8a is a cross-sectional view of a circuit board assembly in a fourth embodiment of the camera module of fig. 1, and fig. 8b is an exploded view of the circuit board assembly of fig. 8 a.

The camera module 30 according to the fourth embodiment of the present invention is substantially the same as the camera module 30 according to the first embodiment of the present invention, except that the supporting body 39 is a part of the circuit board assembly. Specifically, the supporting body 39 includes a first supporting body 39a and a second supporting body 39b, the first mounting position M1 of the first bottom surface 312 extends to the second mounting position M2 to form the first supporting body 39a, and the second mounting position M2 of the second top surface 321c extends to the first mounting position M1 to form the second supporting body 39 b. The first support body 39a and the second support body 39b are both boss-shaped and have only one free end, and the two free ends are connected with each other and directly bonded and fixed by glue bonding.

So set up, can increase first circuit board 31 or terminal 32c local thickness improves structural stability and reduces the wiring degree of difficulty, can also with the support body 39 whole thickness rational distribution in Z axle direction in first circuit board 31 or terminal 32c avoids first circuit board 31 or terminal 32c is local too thick, leads to the shaping degree of difficulty to increase, influences the product precision. When the first circuit board 31 or the terminals 32c are provided with components, the first support 39a or the second support 39b can prevent unnecessary collision due to operation failure.

Referring to fig. 9a and 9b, fig. 9a is a cross-sectional view of a circuit board assembly in a fifth embodiment of the camera module of fig. 1, and fig. 9b is an exploded view of the circuit board assembly of fig. 9 a.

The camera module 30 according to the fifth embodiment of the present invention is substantially the same as the camera module 30 according to the second embodiment of the present invention, except that the first circuit board 31 in the circuit board assembly is a split structure, and includes a first reinforcing plate 31a and a first circuit board body 31 b.

The first reinforcing plate 31a includes a first reinforcing top surface 311a and a first reinforcing bottom surface 312a, which are disposed opposite to each other, the first reinforcing bottom surface 312a faces the second circuit board 32, a third mounting position M3 is disposed in the middle of the first reinforcing top surface 311a, and the third mounting position M3 is used for placing the image sensor 33; the first reinforcing top surface 311a is provided with a fourth mounting position M4, the fourth mounting position M4 is disposed around the third mounting position M3, and is formed by the first reinforcing top surface 311a being recessed toward the first reinforcing bottom surface 312a, and the first circuit board body 31b is embedded in the fourth mounting position M4.

The first circuit board body 31b includes a first top surface 311b and a first bottom surface 312b, the first bottom surface 312b is attached to the bottom of the recess of the fourth mounting position P1, and the first top surface 311b is provided with a first pad P1 and a second pad P2.

Specifically, the first reinforcing plate 31a is a square metal plate, the third mounting position P3 is square, and each side of the third mounting position P3 is disposed corresponding to each edge of the first reinforcing top surface 311a and is located in the middle of the first reinforcing plate top surface 311 a; the remaining portion of the first reinforcing plate top surface 311a except for the third mounting location P3 is recessed toward the first reinforcing plate top surface 311a to form an annular groove forming a fourth mounting location P4 disposed around the third mounting location P3.

The first circuit board body 31b is shaped to fit into the annular groove corresponding to the fourth mounting position P4, and the thickness of the first circuit board body 31b in the Z-axis direction is approximately equal to the sum of the depth of the annular groove in the Z-axis direction and the thickness of the image sensor 33 in the Z-axis direction, so that the first top surface 311b is approximately flush with the image sensor 33 in the Z-axis direction.

With this configuration, the third mounting position P3 can be adapted to the shape of the image sensor 33, and the position of the image sensor 33 on the first circuit board 31 can be adapted to the overall shape of the first circuit board 31, which is beneficial to fully utilize the space and to arrange the conductive traces. When the gold wire bonding process is used for realizing the electrical connection between the first circuit board body 31b and the image sensor 33, the two are flushed, which is beneficial to reducing the height difference of the bonding position, avoiding the occurrence of bad conditions such as wire breakage and the like, reducing the working distance of an assembling machine, avoiding the operation of large-range floating of a manipulator and reducing the complexity of the assembling process.

In the fifth embodiment, the first mounting surface is the first reinforcing bottom surface 312a, and the supporting body 39 extends from the first reinforcing bottom surface 312a of the first reinforcing plate 31a to the second mounting position M2, so that when the circuit board assembly is used in the camera module 30, the design flexibility of the split structure is higher than that of the integrated structure, and the first reinforcing plate 31a can improve the structural strength of the first circuit board 31.

When the supporting body 39 is disposed on the first mounting surface, the reinforcing plate, which is generally made of metal, can be formed at one time by stamping or the like, so that the manufacturing difficulty is significantly reduced. It should be noted that, the thickness of the first circuit board body 31b has a lower limit, and the thickness of the first circuit board body and the first reinforcing plate 31a are directly stacked to be larger, which is not beneficial to the thin design of the camera module 30, and the first circuit board body is disposed in the recess while the overall structural strength is ensured, which is beneficial to reducing the overall thickness of the first circuit board. In addition, the thickness of the image sensor is generally thin, and the image sensor is arranged at the third mounting position and is approximately flush with the first circuit board body in the Z-axis direction, so that the image sensor and the first circuit board body are beneficial to processes such as gold wire bonding and the like to realize electric connection.

The arrangement of the support 39 in the fifth embodiment is not exclusive, and reference may be made to the four embodiments described above, which will not be described in detail herein.

The above description is only a part of the examples and embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present application, and all the changes or substitutions should be covered within the scope of the present application; the embodiments and features of the embodiments of the present application may be combined with each other without conflict. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A camera module is characterized by comprising a first circuit board, a second circuit board, a first bracket, a second bracket, an OIS motor, a driving chip, an electric connecting piece and an image sensor;

the first circuit board comprises a first top surface far away from one side of the second circuit board, and the second circuit board comprises a second top surface close to the first circuit board; at least part of the second top surface protrudes out of the first top surface along a direction parallel to the first top surface;

2. The camera module of claim 1, wherein the electrical connector is a conductive layer embedded within the second bracket.

3. The camera module according to claim 2, wherein the second top surface is provided with a first connecting point, and the first connecting point is located outside the second accommodating space;

4. The camera module of claim 1, wherein the electrical connector is a tab attached to a surface of the second frame.

5. The camera module according to claim 4, wherein the second top surface is provided with a first connecting point, and the first connecting point is located outside the second accommodating space;

6. The camera module according to claim 1, wherein the driving chip is located on the second top surface and located in the second accommodating space.

7. The camera module of claim 1, wherein the first circuit board further comprises a first mounting surface, the first mounting surface being disposed opposite the first top surface; the second circuit board further comprises a terminal, and the terminal comprises a second mounting surface facing the first mounting surface; the camera module further comprises a support body, and the support body is fixedly connected between the first mounting surface and the second mounting surface; the first circuit board is electrically connected to the flexible board through the terminal.

8. The camera module of claim 7, wherein the support is a gasket or a solid state adhesive.

9. The camera module of claim 7, wherein the support body comprises a boss extending from the first mounting surface to the second mounting surface, or the boss extends from the second mounting surface to the first mounting surface, or both the first mounting surface and the second mounting surface are provided with the boss and extend in opposite directions.

10. An electronic device comprising a housing and the camera module of any of claims 1-9, the camera module disposed within the housing.