WO2021218115A1

WO2021218115A1 - Camera module and electronic device

Info

Publication number: WO2021218115A1
Application number: PCT/CN2020/128398
Authority: WO
Inventors: 李存英; 冉坤; 邵涛; 曹孝文; 罗振东
Original assignee: 荣耀终端有限公司
Priority date: 2020-04-30
Filing date: 2020-11-12
Publication date: 2021-11-04
Also published as: CN212211129U

Abstract

Disclosed in the present application are a camera module and an electronic device. The camera module comprises a circuit board, an image sensor, an electronic component, a lens base and a lens. The circuit board is provided with a first groove and a second groove, wherein an opening of the first groove is located on the top surface of the circuit board and an opening of the second groove is located on the bottom surface of the circuit board, the image sensor is mounted in the first groove, and the electronic component is mounted in the second groove. The lens base is fixed to the top surface of the circuit board, and the lens is mounted on an inner side of the lens base and used for converging light to the image sensor. The height of the camera module is small.

Description

Camera module and electronic equipment

This application claims the priority of a Chinese patent application filed with the Chinese Patent Office, the application number is 202020715071.0, and the application name is "Camera Module and Electronic Equipment" on April 30, 2020, the entire content of which is incorporated into this application by reference.

Technical field

The embodiments of the present application relate to the field of photographing technology, and in particular to a camera module and electronic equipment.

Background technique

In recent years, electronic devices have shown a development trend of being lighter and thinner, which puts more stringent requirements on the size of the camera module, which is one of the core components of electronic devices. The traditional camera module includes a circuit board, a holder, a lens base, and a lens. The holder is fixed above the circuit board, the lens base is fixed above the holder, and the lens is installed inside the lens base. Due to the physical height limitation of the support, lens base, lens and other components, it is difficult to reduce the height of the camera module, which is not conducive to the promotion and application of the camera module.

Utility model content

The present application provides a camera module and electronic equipment, the height of the camera module is small.

In the first aspect, the present application provides a camera module, which can be applied to electronic equipment. The camera module includes a circuit board, an image sensor, electronic components, a lens base and a lens. The circuit board has a first groove and a second groove, the opening of the first groove is located on the top surface of the circuit board, the opening of the second groove is located on the bottom surface of the circuit board, the image sensor is installed in the first groove, and the electronic components Installed in the second groove. The lens base is fixed on the top surface of the circuit board, the lens is installed on the inner side of the lens base, and the lens is used to converge light to the image sensor.

In this application, since the image sensor is installed in the first groove of the circuit board and the electronic components are installed in the second groove of the circuit board, the image sensor, electronic components and the circuit board jointly form an embedded cavity packaging structure . The camera module adopts a buried cavity packaging structure, which can cancel the support structure of the traditional camera module, so that the lens base is directly fixed on the top surface of the circuit board, thereby effectively reducing the height of the camera module and the height of the camera module Smaller size is conducive to thinner and lighter electronic equipment using the camera module, the camera module has a wider application range, and the competitiveness of the camera module is significantly improved.

In addition, the shoulder height of the camera module and the flange rear focus are also reduced. The camera module with a small shoulder height is less difficult to install when it is installed in an electronic device. The camera module with a smaller flange back focus can well support short back focus applications, making it easier for the camera module to design an ideal optical path, while obtaining higher image quality, and the design difficulty is lower. In addition, the camera module The larger field of view is conducive to the realization of wide-angle shooting.

In addition, because the camera module eliminates the support structure, the processing steps of the assembly process of the camera module are reduced, which improves the assembly efficiency and product yield.

In a possible implementation manner, the groove depth of the first groove is greater than the height of the image sensor. At this time, the image sensor is completely embedded in the circuit board, and the image sensor and the circuit board can reuse the thickness space of the camera module, which is beneficial to reduce the height of the camera module.

In a possible implementation, the circuit board further has a third groove, the third groove is arranged around the first groove, the third groove is connected to the first groove, and the opening of the third groove is located on the top surface of the circuit board . The groove depth of the third groove is smaller than the groove depth of the first groove, and the bottom wall of the third groove forms a stepped surface.

The circuit board includes a first pad located on the bottom wall of the third groove. The camera module further includes a connecting wire, one end of the connecting wire is welded with the image sensor, the other end is welded with the first pad, and the groove depth of the third groove is greater than or equal to the arc height of the connecting wire. The connecting wire includes an apex away from the bottom wall of the third groove, and the arc height of the connecting wire is the distance between the apex of the connecting wire and the bottom wall of the third groove. At this time, the image sensor and the connecting wires are completely embedded in the circuit board, and the height space of the camera module can be reused with the circuit board to reduce the height of the camera module.

In a possible implementation manner, the camera module further includes a filter, the filter is located between the connecting wire and the lens, and the filter is bonded to the connecting wire. Wherein, the camera module may also include a third adhesive layer. The third glue layer is bonded to the top of the connecting wire, and the filter is bonded to the top of the third glue layer. When the filter is installed, the third adhesive layer can be appropriately squeezed so that the filter is installed to a preset position, so as to improve the assembly accuracy of the camera module.

In this implementation, since the image sensor and the connecting wire are completely embedded in the circuit board, the filter placed on the connecting wire sinks closer to the circuit board than the traditional solution, so that the lens can sink with the filter, thereby The height of the camera module is reduced, and the flange back focus of the camera module is reduced, so that the camera module can better achieve short back focus applications.

In a possible implementation manner, the distance between the bottom surface of the filter and the bottom wall of the third groove is smaller than the groove depth of the third groove. At this time, the filter is partially embedded in the circuit board, and the filter can reuse the height space of the camera module with the circuit board to reduce the height of the camera module. In some other implementations, the distance between the top surface of the filter and the bottom wall of the third groove is less than or equal to the groove depth of the third groove. At this time, the filter is completely embedded in the circuit board. In some other implementation manners, the filter may also be located outside the third groove.

In a possible implementation, the circuit board further has a fourth groove, the fourth groove is arranged around the third groove, the fourth groove is connected to the third groove, and the opening of the fourth groove is located on the top surface of the circuit board . The groove depth of the fourth groove is smaller than that of the third groove, and the bottom wall of the fourth groove forms a stepped surface. The camera module further includes a filter, which is located between the image sensor and the lens, and is fixed on the bottom wall of the fourth groove.

In this implementation, the filter is partially embedded in the circuit board, which is beneficial to reduce the height of the camera module and the flange back focus. In addition, since the filter is fixed on the bottom wall of the fourth groove, the positioning of the filter is accurate during assembly, which is beneficial to improve the assembly accuracy and product yield of the camera module.

In some implementations, the filter covers the connecting wires, that is, the connecting wires are located under the filter. In other implementations, the connecting wire may be partially located in the space on both sides of the filter. For example, a gap is formed between two sides of the filter and the fourth groove of the circuit board, and the connecting wire part is located in the gap. At this time, the filter and the connecting wire can reuse part of the height space, which is beneficial to further reduce the height of the camera module.

In a possible implementation, the circuit board further has a third groove, the third groove is arranged around the first groove, the third groove is connected to the first groove, and the opening of the third groove is located on the top surface of the circuit board . The bottom wall of the third groove includes a first area, a second area, a third area, and a fourth area connected in sequence. The third area is arranged opposite to the first area, and the fourth area is arranged opposite to the second area.

The circuit board includes a plurality of first pads, some of the first pads are located in the first area, and another part of the first pads are located in the third area. The camera module also includes a connecting wire. One end of the connecting wire is soldered to the image sensor, and the other end is soldered. The first pad. The camera module further includes a filter, the filter is located between the image sensor and the lens, one side of the filter is fixed to the second area, and the other side of the filter is fixed to the fourth area.

In this implementation, the filter can be deeply embedded in the circuit board, which is beneficial to reduce the height of the camera module and the flange back focus. Wherein, a gap is formed between two sides of the filter and the bottom wall of the third groove, and the connecting wire part is located in the gap. At this time, the filter and the connecting wire can reuse part of the height space, which is beneficial to further reduce the height of the camera module.

In a possible implementation manner, the camera module further includes a filter, and the filter is fixed on the top surface of the circuit board. For example, the bottom surface of the filter can be bonded to the top surface of the circuit board. At this time, the assembly and positioning accuracy of the filter and the circuit board is high, which is beneficial to improve the assembly accuracy of the camera module and the product yield.

In some implementations, the filter covers the connecting wires, that is, the connecting wires are located under the filter. In other implementations, the connecting wire may be partially located in the space on both sides of the filter. For example, a gap is formed between two sides of the filter and the top surface of the circuit board, and the connecting wire part is located in the gap. At this time, the filter and the connecting wire can reuse part of the height space, which is beneficial to further reduce the height of the camera module. In some other implementation manners, the optical filter and the connecting wire may also have other positional relationships.

In a possible implementation, the camera module further includes a first adhesive layer or a first solder layer. The first adhesive layer or the first solder layer is located between the lens base and the top surface of the circuit board, and is used for fixedly connecting the lens base and the circuit board. That is, the lens base is welded or bonded to the circuit board, and the connection between the lens base and the circuit board is simple, easy to implement, and low in cost.

In a possible implementation manner, the circuit board further has a fifth groove, and the opening of the fifth groove is located on the top surface of the circuit board. The circuit board includes a second pad located on the bottom wall of the fifth groove. The lens base is a motor, the lens base includes a motor pad, and the motor pad is soldered to a second pad. In the module assembly process of the camera module, the solder connection piece can be formed by laser welding, and the motor pad is fixedly connected by the solder connection piece and electrically connected to the second pad.

In a possible implementation manner, the flange back focus of the camera module is in the range of 0.4 mm to 0.8 mm. In this implementation method, the camera module uses the image sensor, electronic components, and circuit board to form a buried cavity packaging structure to eliminate the support structure, effectively reduce the flange back focus of the camera module, and make the camera module more compact. To achieve short rear focus applications well, the camera module can be used in thin and light electronic devices such as mobile phones.

In a possible implementation manner, the circuit board includes a laminated board body and a substrate, and the top surface of the substrate is fixedly connected to the bottom surface of the board body. The substrate is used to reinforce the board body, so that the circuit board has sufficient structural strength to better carry other devices and structures. Among them, the substrate can be made of stainless steel, copper, steel or ceramic materials. In some implementations, the substrate can also be used for heat conduction, so that the heat of the circuit board and the devices fixed on the circuit board can be quickly dissipated, so as to improve the reliability of the camera module.

In a possible implementation, the board has a through hole, the first groove includes the through hole of the board, the area where the top surface of the substrate faces the through hole of the board forms the bottom wall of the first groove, and the image sensor is fixed. Connect the bottom wall of the first groove. In this implementation manner, the processing difficulty of the first groove is relatively small, which is beneficial to improve the processing accuracy.

Wherein, the first groove may further include a through hole formed in the second adhesive layer or the second welding layer, and the through hole communicates with the through hole of the board. The image sensor can be fixedly connected to the bottom wall of the first groove through an adhesive layer (or a solder layer).

In some other implementations, when the thickness of the board body of the circuit board is large, a certain groove structure on the board body forms the first groove, and the groove depth of the groove structure is greater than or equal to the height of the image sensor. It can be welded to the bottom wall of the groove structure by flip-chip.

In a possible implementation manner, the groove depth of the second groove is greater than or equal to the height of the electronic component. For example, the sum of the depth of the recessed groove of the board, the thickness of the second adhesive layer (or the second solder layer), and the thickness of the substrate is greater than or equal to the height of the electronic component. At this time, the electronic components are completely embedded in the circuit board, and the electronic components and the circuit board can reuse the thickness space of the camera module, which is beneficial to reduce the height of the camera module. In addition, the circuit board can also protect the electronic components.

In a possible implementation manner, the circuit board includes a laminated board body and a substrate, and the top surface of the substrate is fixedly connected to the bottom surface of the board body. The plate body has a recessed groove, the substrate has a through hole communicating with the recessed groove, and the second groove includes a recessed groove of the plate body and a through hole of the substrate. Wherein, the second groove may further include a through hole formed in the second adhesive layer or the second solder layer, and the through hole communicates with the recessed groove of the board body and the through hole of the substrate.

In a possible implementation manner, the opening area of the through hole of the substrate is larger than the opening area of the recessed groove of the board. At this time, when the substrate and the board are fixed, a slight alignment deviation is allowed, so that the circuit board is less difficult to assemble. In addition, the through hole of the substrate also reserves an active space for the welding equipment, so that the external device can be more easily installed in the second groove and welded to the bottom wall of the recessed groove.

In another possible implementation manner, the opening area of the through hole of the substrate is equal to the opening area of the recessed groove of the board. The projection of the opening of the recessed groove of the board on the bottom surface of the substrate coincides with the opening of the through hole of the substrate.

In a possible implementation, the board has a through hole, the first groove includes the through hole of the board, the area where the top surface of the substrate faces the through hole of the board forms the bottom wall of the first groove, and the image sensor is fixed. Connect the bottom wall of the first groove.

In a possible implementation, the groove depth of the first groove is greater than the height of the image sensor; the circuit board also has a third groove, the third groove is arranged around the first groove, and the third groove is connected to the first groove , The opening of the third groove is located on the top surface of the circuit board, and the circuit board includes a first pad located on the bottom wall of the third groove; the camera module further includes a connecting wire, one end of the connecting wire is welded with the image sensor, and the other end is welded The first pad; the groove depth of the third groove is greater than or equal to the arc height of the connecting wire, the connecting wire includes a vertex away from the bottom wall of the third groove, and the arc height of the connecting wire is the vertex of the connecting wire and the third groove The distance between the bottom walls of the third groove; the groove depth of the third groove is less than the groove depth of the first groove, and the bottom wall of the third groove forms a stepped surface; the camera module further includes a filter, which is located on the connecting wire Between the lens and the lens, the filter is bonded to the connecting wire; the camera module also includes a third glue layer, the third glue layer is bonded to the top of the connecting wire, and the bottom surface of the filter is bonded to the third glue layer; The distance between the bottom surface and the bottom wall of the third groove is less than the groove depth of the third groove; the camera module further includes a first adhesive layer or a first solder layer, and the first adhesive layer or the first solder layer is located on the lens base Between it and the top surface of the circuit board, it is used to fixly connect the lens base and the circuit board; the circuit board also has a fifth groove, the opening of the fifth groove is located on the top surface of the circuit board, and the circuit board includes the fifth groove The second pad on the bottom wall of the camera; the lens base is a motor, the lens base includes a motor pad, and the motor pad is soldered to the second pad; the flange back focus of the camera module is in the range of 0.4 mm to 0.8 mm; the circuit The board includes a laminated board body and a substrate. The top surface of the substrate is fixedly connected to the bottom surface of the board body. The board body has a through hole. The first groove includes the through hole of the board body. The area of the hole forms the bottom wall of the first groove, and the image sensor is fixedly connected to the bottom wall of the first groove; the groove depth of the second groove is greater than or equal to the height of the electronic component; the board has a recessed groove, and the substrate has a connection The through hole of the recessed groove, the second groove includes the recessed groove of the board and the through hole of the substrate; the opening area of the through hole of the substrate is greater than or equal to the opening area of the recessed groove of the board.

In a second aspect, the present application also provides an electronic device including an image processor and any one of the above-mentioned camera modules, the image processor is in communication connection with the camera module, and the image processor is used to obtain image data from the camera module, and Process image data.

In this application, since the camera module adopts an embedded cavity packaging structure, the support structure of the traditional camera module can be eliminated, so that the lens base is directly fixed on the top surface of the circuit board, thereby effectively reducing the height of the camera module , The height of the camera module is small, so it is conducive to the realization of light and thin electronic equipment.

In addition, due to the small shoulder height of the camera module, the camera module is easier to install in the electronic device, which can alleviate the tight space requirements inside the electronic device. Since the flange of the camera module has a small rear focus, the electronic device can achieve wide-angle shooting through the camera module, which improves the user's shooting experience.

Description of the drawings

FIG. 1 is a schematic diagram of the structure of an electronic device provided by an embodiment of the present application in some embodiments;

FIG. 2 is a schematic structural diagram of the camera module shown in FIG. 1 in some embodiments;

3 is a schematic diagram of a partially exploded structure of the camera module shown in FIG. 2;

Fig. 4 is a schematic structural view of the camera module shown in Fig. 2 taken along A-A;

Fig. 5 is a schematic structural diagram of the camera module shown in Fig. 2 at another angle;

FIG. 6 is a schematic diagram of the structure of the circuit board shown in FIG. 3;

Fig. 7 is a schematic structural view of the circuit board shown in Fig. 6 taken along B-B;

FIG. 8 is a schematic structural diagram of the circuit board shown in FIG. 6 at another angle;

FIG. 9 is an enlarged schematic diagram of the structure at C of the camera module shown in FIG. 4;

10 is a schematic diagram of the internal structure of the camera module shown in FIG. 1 in other embodiments;

FIG. 11 is a schematic diagram of the structure of the circuit board of the camera module shown in FIG. 10;

FIG. 12 is a schematic diagram of a part of the structure of the camera module shown in FIG. 10;

FIG. 13 is a schematic diagram of the internal structure of the camera module shown in FIG. 1 in still other embodiments;

14 is a schematic diagram of the structure of the circuit board of the camera module shown in FIG. 13;

FIG. 15 is a schematic diagram of the internal structure of the camera module shown in FIG. 1 in still other embodiments.

Detailed ways

The embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application.

Please refer to FIG. 1, which is a schematic structural diagram of an electronic device 100 in some embodiments according to an embodiment of the present application. The electronic device 100 may be an electronic product such as a mobile phone, a tablet, a notebook computer, a car machine, a wearable device, and a point of sales terminal (POS terminal for short). The wearable device may be a smart bracelet, a smart watch, augmented reality (AR) glasses, virtual reality (VR) glasses, etc. In the embodiment of the present application, the electronic device 100 is a mobile phone as an example for description.

In some embodiments, the electronic device 100 includes a housing 10, a camera module 20 and an image processor 30. The camera module 20 and the image processor 30 are installed inside the housing 10. The camera module 20 can collect light outside the electronic device 100 and form corresponding image data. The image processor 30 is in communication connection with the camera module 20, and the image processor 30 is used to obtain image data from the camera module 20 and process the image data.

In some embodiments, the electronic device 100 may further include a display module 40. The housing 10 may include a frame 101 and a back cover 102, and the back cover 102 and the display module 40 are respectively fixed on both sides of the frame 101. Wherein, the frame 101 and the back cover 102 may be fixed to each other by assembly, or may be integrally formed structural parts.

Exemplarily, the display module 40 is provided with a light-transmitting area 401, the camera module 20 collects light external to the electronic device 100 through the light-transmitting area 401 of the display module 40, and the camera module 20 is used as a front camera of the electronic device 100 Module. In some other embodiments, the rear cover 102 is provided with a camera hole, the camera module 20 collects light outside the electronic device 100 through the camera hole of the rear cover 102, and the camera module 20 is used as a rear camera module of the electronic device 100. In other words, the camera module 20 can be used as a rear camera module of the electronic device 100, and can also be used as a front camera module of the electronic device 100, which is not strictly limited in the embodiment of the present application.

Please refer to FIGS. 2 to 4 together. FIG. 2 is a schematic structural diagram of the camera module 20 shown in FIG. 1 in some embodiments. FIG. 3 is a partial exploded structural diagram of the camera module 20 shown in FIG. FIG. 2 shows a schematic structural diagram of the camera module 20 taken along AA. Among them, for the convenience of the following description, in FIG. 2, the width direction of the camera module 20 is defined as the X direction, the length direction Y of the camera module 20 is defined as the Y direction, and the height direction of the camera module 20 is defined as the Z direction. The height direction Z of the module 20 is perpendicular to the length direction Y of the camera module 20 and the width direction X of the camera module 20.

In some embodiments, the camera module 20 includes a circuit board 1, an image sensor 2, a lens base 3, a lens 4 and a filter 5. The circuit board 1 includes a top surface 11 and a bottom surface 12 opposite to each other. The top surface 11 and the bottom surface 12 of the circuit board 1 may be substantially perpendicular to the height direction Z of the camera module 20. The circuit board 1 has a first groove 13, and the opening of the first groove 13 is located on the top surface 11 of the circuit board 1. The image sensor 2 is installed in the first groove 13. That is, the image sensor 2 can be fixed to the circuit board 1 from the top side of the circuit board 1. The image sensor 2 can be fixed to the circuit board 1 during the module assembly process of the camera module 20. It is understandable that the terms "top", "bottom" and other orientations involved in this application are described with reference to the orientation of the attached drawings, and do not indicate or imply that the device or element referred to must have a specific orientation. , It is constructed and operated in a specific orientation, so it cannot be understood as a limitation of this application.

The lens base 3 is fixed on the top surface 11 of the circuit board 1. Exemplarily, the lens base 3 may be fixed to the circuit board 1 by bonding. For example, the camera module 20 may further include a first adhesive layer 6 located between the lens base 3 and the top surface 11 of the circuit board 1 and used for fixedly connecting the lens base 3 and the circuit board 1. In some other embodiments, the lens base 3 can also be fixed to the circuit board 1 by welding. For example, the camera module 20 may further include a first solder layer, which is located between the lens base 3 and the top surface 11 of the circuit board 1 and is used for fixedly connecting the lens base 3 and the circuit board 1. That is, the lens base 3 can be welded or bonded to the circuit board 1, and the connection between the lens base 3 and the circuit board 1 is simple, easy to implement, and low in cost.

The lens 4 is installed inside the lens base 3. The lens 4 is used to converge the light to the image sensor 2. That is, the lens 4 can condense the external light, and project the collected external light to the image sensor 2 to form a corresponding light image on the image sensor 2. The lens 4 may include a lens barrel and a lens group fixed inside the lens barrel. The image sensor 2 is located on the image side of the lens group, and the image side of the last lens of the lens group faces the image sensor 2. Exemplarily, the number of lenses in the lens group may be 5 to 10, for example, 7 or 8 lenses. Among them, the lens base 3 is a motor. Exemplarily, the motor may be an auto focus motor, and the auto focus motor can drive the lens group to move in a direction parallel to the optical axis of the lens 4. Alternatively, the motor may be an optical anti-shake motor, which can drive the lens group to move on a plane perpendicular to the optical axis of the lens 4, or drive the lens group to flip to tilt relative to the optical axis of the lens 4. Alternatively, the motor may be an auto focus and optical image stabilization motor. Exemplarily, the motor may be a voice coil motor (VCM), or a memory alloy motor or the like. This application does not strictly limit the specific function and type of the motor. In some other embodiments, the lens base 3 may also be a bracket structure. At this time, the camera module 20 is a fixed focus module. In some other embodiments, the camera module 20 can also omit the lens base 3, and the lens barrel of the lens 4 is fixed on the top surface 11 of the circuit board 1.

The filter 5 is located between the image sensor 2 and the lens 4. The filter 5 may be blue glass (BG) for filtering infrared rays. After the external light passes through the lens 4 and the filter 5, an image is formed on the imaging surface of the image sensor 2.

Please refer to FIG. 4 and FIG. 5 together. FIG. 5 is a schematic structural diagram of the camera module 20 shown in FIG. 2 at another angle.

In some embodiments, the circuit board 1 further has a second groove 14, and the opening of the second groove 14 is located on the bottom surface 12 of the circuit board 1. The camera module 20 further includes an electronic component 7, and the electronic component 7 is installed in the second groove 14. The electronic component 7 can be fixed to the circuit board 1 from the bottom side of the circuit board 1. The electronic components 7 may include one or more of chips, resistors, capacitors, and inductors. One or more electronic components 7 can be installed in the same second groove 14. The number of electronic components 7 is not determined by this application. , Type and specific installation location are strictly limited. The electronic components 7 and the circuit board 1 together form a circuit board 1 assembly.

In the traditional camera module, the electronic components are usually protruding on the top surface of the circuit board, the support of the camera module is fixed on the top surface of the circuit board, and the lens base of the camera module is fixed above the support. The support of the camera module has a certain height to form a cavity inside it for accommodating electronic components. Therefore, the height of the camera module includes at least the height of the lens base, the height of the support, and the height of the circuit board. As a result, the height of the camera module is relatively large, which is difficult to apply to thin and light electronic devices, and is not conducive to promotion and application. In addition, the setting of the support will also cause the flange of the camera module to have a large back focus, which cannot support short back focus applications.

In this embodiment, since the image sensor 2 is installed in the first groove 13 of the circuit board 1, and the electronic component 7 is installed in the second groove 14 of the circuit board 1, the image sensor 2, the electronic component 7 and the circuit board 1 Together, an embedded cavity package (ECP) is formed. The embedded cavity packaging structure may also be referred to as a half-embedment of chip and cavity package.

The camera module 20 adopts an embedded cavity packaging structure, which can eliminate the support structure of the traditional camera module 20, so that the lens base 3 is directly fixed on the top surface 11 of the circuit board 1, thereby effectively reducing the height of the camera module 20 , The height of the camera module 20 is small, which is conducive to the thinner and lighter electronic device 100 using the camera module 20, the camera module 20 has a wider application range, and the competitiveness of the camera module 20 is significantly improved.

In addition, the shoulder height and flange rear focus of the camera module 20 are also reduced. Wherein, as shown in FIG. 4, the height H1 of the camera module 20 refers to the distance between the top surface of the lens 4 and the bottom surface 12 of the circuit board 1 when the lens 4 is infinitely focused. The shoulder height H2 of the camera module 20 refers to the distance from the top surface of the lens base 3 to the bottom surface 12 of the circuit board 1. The flange back focus H3 of the camera module 20 refers to the distance between the bayonet plane of the lens 4 and the imaging surface of the image sensor 2 when the lens 4 is infinitely focused. When the camera module 20 with a small shoulder height is installed in the electronic device 100, the installation difficulty is small. The camera module 20 with a smaller flange back focus can well support short back focus applications, making it easier for the camera module 20 to design an ideal optical path, while obtaining higher imaging quality, and lower design difficulty. In addition, the camera The viewing angle of the module 20 is relatively large, which is beneficial for realizing wide-angle shooting.

In addition, since the camera module 20 eliminates the support structure, the processing steps of the assembly process of the camera module 20 are reduced, which improves the assembly efficiency and product yield.

Please refer to FIGS. 6 and 7 together. FIG. 6 is a schematic structural diagram of the circuit board 1 shown in FIG. 3, and FIG. 7 is a structural schematic diagram of the circuit board 1 shown in FIG.

In some embodiments, the circuit board 1 includes a board body 1a and a substrate 1b. The top surface of the substrate 1b is fixedly connected to the bottom surface of the board body 1a. The top surface 11 of the circuit board 1 is formed on the top surface of the board body 1a, and the bottom surface 12 of the circuit board 1 is formed on the bottom surface of the substrate 1b. The substrate 1b is used to reinforce the board body 1a, so that the circuit board 1 has sufficient structural strength to better carry other devices and structures. For example, the substrate 1b can be made of stainless steel, copper, steel, or ceramic materials. In some embodiments, the substrate 1 b can also be used for heat conduction, so that the heat of the circuit board 1 and the devices fixed on the circuit board 1 can be quickly dissipated, so as to improve the reliability of the camera module 20.

Exemplarily, the circuit board 1 may further include a second adhesive layer 1c. The second glue layer 1c is located between the substrate 1b and the board 1a. The top surface of the substrate 1b is bonded to the second glue layer 1c, and the second glue layer 1c is bonded to the bottom surface of the board 1a. The substrate 1b and the board 1a They are fixed to each other by bonding. Wherein, the second adhesive layer 1c may be conductive adhesive or non-conductive adhesive. In some other embodiments, the substrate 1b can also be fixed to the board 1a by welding. For example, the circuit board 1 may further include a second solder layer, which is located between the substrate 1b and the board body 1a, and is used for fixedly connecting the substrate 1b and the board body 1a.

Among them, the circuit board 1 may be a flexible and hard combined circuit board. For example, as shown in FIG. 6, the board body 1a includes a first rigid board portion 111, a soft board portion 112, and a second rigid board portion 113 arranged in sequence. The surface area of the first rigid board portion 111 is larger than that of the second rigid board portion. For the board surface area of the portion 113, the first rigid board portion 111 and the second rigid board portion 113 are rigid boards, and the soft board portion 112 is a flexible board, which is easier to bend than a rigid board. The substrate 1b is fixed to the first rigid board portion 111, and the top surface of the first rigid board portion 111 away from the substrate 1b is the top surface 11 of the circuit board 1 in this embodiment. The circuit board 1 may further include a reinforcing plate 1 d fixed to the second rigid board portion 113. Alternatively, the board body 1a is a flexible board, and the board body 1a includes a first area, a second area, and a third area arranged in sequence, and the area of the first area is larger than the area of the third area. The substrate 1b is fixed to the first area, and the top surface of the first area away from the substrate 1b is the top surface 11 of the circuit board 1 in this embodiment. The circuit board 1 may also include a reinforcing plate fixed to the second area.

In some embodiments, as shown in FIGS. 6 and 7, the plate body 1 a has a through hole 131, and the first groove 13 includes the through hole 131 of the plate body 1 a. The second adhesive layer 1c (or the second solder layer) has a through hole 132 that communicates with the through hole 131 of the board 1a. In the embodiment of the present application, two spaces are "connected", which means that the two spaces are connected and communicated. The first groove 13 further includes a through hole 132 of the second adhesive layer 1c (or the second solder layer). The area where the top surface of the substrate 1b faces the through hole 131 of the board 1a forms the bottom wall 133 of the first groove 13. In this embodiment, the processing difficulty of the first groove 13 is relatively small, which is beneficial to improve the processing accuracy. In some other embodiments, the first groove 13 includes a groove formed on the plate body 1a. In some other embodiments, the first groove 13 includes a through hole formed in the plate body 1a, a through hole formed in the second adhesive layer 1c, and a groove formed in the substrate 1b.

In some embodiments, as shown in FIGS. 6 and 7, the circuit board 1 may further have a third groove 15, the third groove 15 is arranged around the first groove 13, and the third groove 15 is connected to the first groove 13. , The opening of the third groove 15 is located on the top surface 11 of the circuit board 1. At this time, the third groove 15 is an annular groove, and the first groove 13 is located inside the third groove 15. The groove depth of the third groove 15 is smaller than the groove depth of the first groove 13, and the bottom wall 151 of the third groove 15 forms a stepped surface. The groove depth of the first groove 13 refers to the depth dimension of the first groove 13 in the vertical direction of the top surface 11 of the circuit board 1 (that is, the height direction Z of the camera module 20). The groove depth of the third groove 15 refers to the depth dimension of the third groove 15 in the vertical direction of the top surface 11 of the circuit board 1 (that is, the height direction Z of the camera module 20).

The circuit board 1 includes a first pad 16 located on the bottom wall 151 of the third groove 15. The third groove 15 and the first pad 16 are formed on the board body 1 a of the circuit board 1. The number of the first pads 16 is plural.

In some embodiments, as shown in FIGS. 6 and 7, the circuit board 1 may also have a fifth groove 17, the opening of the fifth groove 17 is located on the top surface 11 of the circuit board 1, and the circuit board 1 includes a fifth groove The second land 18 of the bottom wall 171 of the groove 17. The fifth groove 17 and the second pad 18 are formed on the board body 1 a of the circuit board 1. The number of the second pad 18 is plural.

Please refer to FIGS. 7 and 8 together. FIG. 8 is a schematic diagram of the structure of the circuit board 1 shown in FIG. 6 from another angle.

In some embodiments, the plate body 1a has a recessed groove 141, the substrate 1b has a through hole 142 communicating with the recessed groove 141, and the second groove 14 includes a recessed groove 141 of the plate body 1a and a through hole 142 of the substrate 1b. Exemplarily, the second groove 14 further includes a through hole 143 formed in the second adhesive layer 1c, and the through hole 143 of the second adhesive layer 1c communicates with the recessed groove 141 of the plate body 1a and the through hole 142 of the substrate 1b. Wherein, the number of the second groove 14 may be one or more. When the number of the second grooves 14 is multiple, the opening shapes of the multiple second grooves 14 may be the same or different, which is not strictly limited in this application.

In some embodiments, the opening area of the through hole 142 of the substrate 1b is equal to the opening area of the recessed groove 141 of the board 1a. The projection of the opening of the recessed groove 141 of the plate 1a on the bottom surface of the substrate 1b coincides with the opening of the through hole 142 of the substrate 1b. In other embodiments, the opening area of the through hole 142 of the substrate 1b is larger than the opening area of the recessed groove 141 of the board 1a. At this time, when the substrate 1b and the board body 1a are fixed, a slight alignment deviation is allowed, so that the circuit board 1 is less difficult to assemble. In addition, the through hole 142 of the substrate 1b also reserves an active space for the welding equipment, so that external devices can be more easily installed in the second groove 14 and welded to the bottom wall of the recessed groove 141. For example, the opening of the recessed groove 141 of the plate body 1a is rectangular, the through hole 142 of the substrate 1b is rectangular, and the opening of the through hole 142 of the substrate 1b is 0.2 mm to 0.3 mm wider than the opening of the recessed groove 141 of the plate 1a. Mm, that is, the opening side length of the through hole 142 of the substrate 1b is 0.4 mm to 0.6 mm wider than the opening side length of the recessed groove 141 of the plate body 1a.

Please refer to FIGS. 3 and 9 together. FIG. 9 is an enlarged schematic diagram of the structure at C of the camera module 20 shown in FIG. 4.

In some embodiments, the groove depth of the first groove 13 of the circuit board 1 is greater than the height of the image sensor 2. The height of the image sensor 2 refers to the size of the image sensor 2 in the height direction Z of the camera module 20. At this time, the image sensor 2 is completely embedded in the circuit board 1, and the image sensor 2 and the circuit board 1 can reuse the thickness space of the camera module 20, which is beneficial to reduce the height of the camera module 20. Exemplarily, the image sensor 2 may be fixedly connected to the bottom wall 133 of the first groove 13 through an adhesive layer 21 (or a solder layer). When a partial area of the top surface of the substrate 1b forms the bottom wall 133 of the first groove 13, the image sensor 2 is fixed on the top surface of the substrate 1b.

In some embodiments, the camera module 20 further includes a connecting wire 8, one end of the connecting wire 8 is welded with the image sensor 2, and the other end is welded with the first pad 16. Among them, the connecting wire 8 can be made of gold, copper, aluminum and other materials. The connecting wire 8 can be soldered to the interface 22 of the image sensor 2, and the interface 22 of the image sensor 2 can be a pad. The image sensor 2 is connected to the board body 1a of the circuit board 1 through a connecting wire 8 to be electrically connected to the circuit board 1. The connecting wire 8 is formed by a wire bonding (WB) process, and the wire bonding process may also be referred to as a pressure welding process, a bonding process, a bonding process or a wire bonding process. Wherein, the first pad 16 may form a surface treatment layer by electroless nickel electroless palladium immersion gold (ENEPIG) technology. At this time, the surface treatment layer of the first pad 16 makes the wire bonding process of connecting the wire 8 and the first pad 16 easier to implement, and the yield rate is higher.

In some embodiments, as shown in FIG. 9, the depth of the third groove 15 is greater than or equal to the arc height H4 of the connecting wire 8. The connecting wire 8 includes an apex 81 away from the bottom wall 151 of the third groove 15, and the arc height H4 of the connecting wire 8 is the distance between the apex 81 of the connecting wire 8 and the bottom wall 151 of the third groove 15. At this time, the image sensor 2 and the connecting wire 8 are completely embedded in the circuit board 1, and the height space of the camera module 20 can be reused with the circuit board 1 to reduce the height of the camera module 20.

In some other embodiments, when the board body 1a of the circuit board 1 has a large thickness, a certain groove structure on the board body 1a forms the first groove 13, and the groove depth of the groove structure (in the camera module 20 The dimension in the height direction Z) is greater than or equal to the height of the image sensor 2, and the image sensor 2 can be welded to the bottom wall of the groove structure by flip chip. At this time, the board body 1a of the circuit board 1 may not be provided with the third groove 15 and the camera module 20 may not be provided with the connecting wire 8.

In some embodiments, as shown in FIG. 9, the filter 5 is located between the connecting wire 8 and the lens 4. Exemplarily, the filter 5 is bonded to the connecting wire 8. For example, the camera module 20 further includes a third adhesive layer 9. The third glue layer 9 is bonded to the top of the connecting wire 8, and the filter 5 is bonded to the top of the third glue layer 9. When the filter 5 is installed, the third adhesive layer 9 can be appropriately squeezed so that the filter 5 is installed to a preset position, so as to improve the assembly accuracy of the camera module 20. In this embodiment, since the image sensor 2 and the connecting wire 8 are completely embedded in the circuit board 1, the filter 5 laid on the connecting wire 8 sinks toward the circuit board 1 relative to the conventional solution, so that the lens 4 can follow The filter 5 sinks, thereby reducing the height of the camera module 20 and reducing the flange back focus of the camera module 20, so that the camera module 20 can better realize the short back focus application.

Exemplarily, the distance between the bottom surface 51 of the filter 5 and the bottom wall 151 of the third groove 15 is smaller than the groove depth of the third groove 15. At this time, the filter 5 is partially embedded in the circuit board 1, and the filter 5 can reuse the height space of the camera module 20 with the circuit board 1 to reduce the height of the camera module 20. In some other embodiments, the distance between the top surface of the filter 5 and the bottom wall 151 of the third groove 15 is less than or equal to the groove depth of the third groove 15. At this time, the filter 5 is completely embedded in the circuit board 1. In some other embodiments, the filter 5 may also be located outside the third groove 15.

In some embodiments, as shown in FIG. 9, the lens base 3 and the circuit board 1 are fixedly connected through the first adhesive layer 6 (or the first solder layer). The lens base 3 is a motor, and the lens base 3 includes a motor pad 31. The motor pad 31 is soldered to the second pad 18 of the circuit board 1. In the module assembly process of the camera module 20, the solder connection member 33 may be formed by laser welding, and the motor pad 31 is fixedly connected and electrically connected to the second pad 18 through the solder connection member 33.

In some embodiments, as shown in FIGS. 5 and 9, the groove depth of the second groove 14 is greater than or equal to the height of the electronic component 7. The groove depth of the second groove 14 refers to the depth dimension of the second groove 14 in the vertical direction of the top surface 11 of the circuit board 1 (that is, the height direction Z of the camera module 20). The height of the electronic component 7 refers to the size of the electronic component 7 in the height direction Z of the camera module 20. For example, the sum of the depth of the recessed groove 141 of the board 1a, the thickness of the second adhesive layer 1c (or the second solder layer), and the thickness of the substrate 1b is greater than or equal to the height of the electronic component 7. The groove depth of the recessed groove 141 refers to the depth dimension of the recessed groove 141 in the vertical direction of the top surface 11 of the circuit board 1 (that is, the height direction Z of the camera module 20).

In this embodiment, the electronic components 7 are completely embedded in the circuit board 1, and the electronic components 7 and the circuit board 1 can reuse the thickness space of the camera module 20, which is beneficial to reduce the height of the camera module 20. In addition, the circuit board 1 can also protect the electronic components 7.

It is understandable that the depth and opening shape of the second groove 14 are designed to match the height of the electronic component 7, and the depth and opening shape of the different second groove 14 are designed according to the height of the electronic component 7 contained therein. The design can have different depths and opening shapes.

In some other embodiments, the depth of the second groove 14 may also be less than the height of the electronic component 7. At this time, the camera module 20 may also be provided with a housing, which is sleeved outside other components of the camera module 20 (the circuit board 1 may partially extend out of the housing) to protect other components of the camera module 20.

In some embodiments, as shown in FIGS. 4 and 9, the flange back focus H3 of the camera module 20 is in the range of 0.4 mm to 0.8 mm. For example, the flange back focus can be 0.4 mm, 0.5 mm, 0.6 mm, 0.72 mm, etc. The flange back focus of a conventional camera module is usually greater than 0.9 mm. In this embodiment, the camera module 20 forms an embedded cavity package structure by using the image sensor 2, the electronic components 7 and the circuit board 1 together to eliminate the support. The structure effectively reduces the flange back focus of the camera module 20, so that the camera module 20 can better realize short back focus applications, and the camera module 20 can be used in thin and light electronic devices 100 such as mobile phones.

Exemplarily, the substrate 1b of the circuit board 1 is made of a metal material, and the thickness may be in the range of 0.15 mm to 0.3 mm. The board body 1a of the circuit board 1 may include 4 to 8 conductive layers, and the thickness of the board body 1a may be in the range of 0.3 mm to 0.6 mm. The depth of the first groove 13 may be in the range of 0.1 mm to 0.2 mm. The opening area of the first groove 13 is larger than the area of the image sensor 2. The opening of the first groove 13 is larger than the image sensor 2 by 0.15±0.05 mm on one side, that is, the side length of the opening of the first groove 13 is longer than that of the image sensor 2. The side length is 0.3±0.1 mm. The depth of the third groove 15 may be in the range of 0.1 mm to 0.2 mm, which is greater than the arc height of the connecting wire 8 (approximately in the range of 0.07 mm to 0.12 mm). The thickness of the filter 5 is in the range of 0.1 mm to 0.2 mm. The filter 5 sinks above the connecting wire 8. The depth of the second groove 14 may be in the range of 0.1 mm to 0.2 mm.

In a conventional camera module, the camera module includes 7 lenses, the flange back focus is about 0.9 mm, the height is about 7.2 mm, and the shoulder height is about 4.9 mm. In this embodiment, the image sensor 2, the electronic components 7 and the circuit board 1 jointly form a buried cavity packaging structure, the lens base 3 is fixed on the top surface 11 of the circuit board 1, and the filter 5 sinks to the connection Above the wire 8, the height of the camera module 20 can be reduced to 6.9 mm, a reduction of about 0.3 mm, the shoulder height can be reduced to 4.33 mm, a reduction of about 0.5 mm, and the flange back focus can be reduced to 0.5 mm, a reduction of about 0.4 mm.

In some other embodiments, the camera module 20 of the present application can reduce the module height by about 0.35 mm and the shoulder height by at least 0.7 mm by adjusting the size of the circuit board 1, the lens base 3 and other components, so as to improve the module’s performance. Product competitiveness.

Please refer to FIGS. 10 to 12 together. FIG. 10 is a schematic diagram of the internal structure of the camera module 20 shown in FIG. 1 in other embodiments, and FIG. 11 is a schematic diagram of the circuit board 1 of the camera module 20 shown in FIG. 10 12 is a schematic diagram of a part of the structure of the camera module 20 shown in FIG. 10. The camera module 20 of this embodiment includes most of the technical features of the camera module 20 of the foregoing embodiment. The differences between the two are mainly described below, and most of the same contents of the two will not be repeated.

In some embodiments, as shown in FIG. 10, the image sensor 2 of the camera module 20 is fixed to the circuit board 1 and is completely embedded in the circuit board 1. The filter 5 is located between the image sensor 2 and the lens 4. The filter 5 is fixed to the circuit board 1 and is at least partially embedded in the circuit board 1.

As shown in FIG. 11, the circuit board 1 includes a first groove 13 and a third groove 15. The opening of the first groove 13 is located on the top surface 11 of the circuit board 1. The third groove 15 is arranged around the first groove 13, the third groove 15 is connected to the first groove 13, and the opening of the third groove 15 is located on the top surface 11 of the circuit board 1. The bottom wall 151 of the third groove 15 includes a first area 1511, a second area 1512, a third area 1513, and a fourth area 1514 connected in sequence. The third area 1513 and the first area 1511 are disposed opposite to each other, and the fourth area 1514 is connected to the The second area 1512 is relatively disposed. In other words, the first area 1511 is formed on one side of the bottom wall 151, and the third area 1513 is formed on the other side of the bottom wall 151 relative to the first area 1511. The second area 1512 is formed on one side of the bottom wall 151, and the fourth area 1514 is formed on the other side of the bottom wall 151 relative to the second area 1512.

The circuit board 1 includes a plurality of first pads 16, a part of the first pads 16 of the plurality of first pads 16 is located in the first area 1511 and the other part of the first pads 16 is located in the third area 1513. In some other embodiments, the first pads 16 may also be all arranged in the first area 1511 or the third area 1513.

As shown in FIGS. 11 and 12, the image sensor 2 is installed in the first groove 13 of the circuit board 1. The camera module 20 further includes a connecting wire 8, one end of the connecting wire 8 is welded with the image sensor 2, and the other end is welded with the first pad 16. The connecting wire 8 can be welded to the interface 22 of the image sensor 2. One side of the filter 5 is fixed to the second area 1512, and the other side of the filter 5 is fixed to the fourth area 1514. For example, areas on both sides of the bottom surface of the filter 5 are respectively fixedly connected to the second area 1512 and the fourth area 1514 of the bottom wall 151 of the third groove 15. In some other embodiments, the side surfaces on both sides of the filter 5 may also form a step structure, and the second area 1512 and the fourth area 1514 are fixedly connected by the step surface of the step structure. The embodiment of the present application does not strictly limit the specific connection structure of the filter 5 and the second region 1512 and the fourth region 1514.

In this embodiment, the filter 5 can be deeply embedded in the circuit board 1, which is beneficial to reduce the height of the camera module 20 and the flange back focus. Wherein, a gap is formed between two sides of the filter 5 and the bottom wall 151 of the third groove 15, and the connecting wire 8 is partially located in the gap. At this time, the filter 5 and the connecting wire 8 can reuse part of the height space, which is beneficial to further reduce the height of the camera module 20.

Please refer to FIGS. 13 to 14 together. FIG. 13 is a schematic diagram of the internal structure of the camera module 20 shown in FIG. 1 in some other embodiments, and FIG. 14 is a schematic diagram of the circuit board 1 of the camera module 20 shown in FIG. 13 . The camera module 20 of this embodiment includes most of the technical features of the camera module 20 of the foregoing embodiment. The differences between the two are mainly described below, and most of the same contents of the two will not be repeated.

In some embodiments, as shown in FIG. 13, the image sensor 2 of the camera module 20 is fixed to the circuit board 1 and is completely embedded in the circuit board 1. The filter 5 is located between the image sensor 2 and the lens 4. The filter 5 is fixed to the circuit board 1 and is at least partially embedded in the circuit board 1.

As shown in FIG. 14, the circuit board 1 has a first groove 13, a third groove 15 and a fourth groove 19. The opening of the first groove 13 is located on the top surface 11 of the circuit board 1. The third groove 15 is arranged around the first groove 13, the third groove 15 is connected to the first groove 13, and the opening of the third groove 15 is located on the top surface 11 of the circuit board 1. The groove depth of the third groove 15 is smaller than the groove depth of the first groove 13, and the bottom wall 151 of the third groove 15 forms a stepped surface. The first pad 16 of the circuit board 1 is located on the bottom wall 151 of the third groove 15. The fourth groove 19 is arranged around the third groove 15, the fourth groove 19 is connected to the third groove 15, and the opening of the fourth groove 19 is located on the top surface 11 of the circuit board 1. The groove depth of the fourth groove 19 is smaller than the groove depth of the third groove 15, and the bottom wall 191 of the fourth groove 19 forms a stepped surface. The groove depth of the fourth groove 19 refers to the depth dimension of the fourth groove 19 in the vertical direction of the top surface 11 of the circuit board 1 (that is, the height direction Z of the camera module 20).

As shown in FIG. 13 and FIG. 14, the image sensor 2 is installed in the first groove 13 of the circuit board 1. The camera module 20 further includes a connecting wire 8, one end of the connecting wire 8 is welded with the image sensor 2, and the other end is welded with the first pad 16. The connecting wire 8 can be welded to the interface 22 of the image sensor 2. The filter 5 is fixed to the bottom wall 191 of the fourth groove 19. For example, the bottom surface 51 of the filter 5 can be bonded to the bottom wall 191 of the fourth groove 19.

In this embodiment, the filter 5 is partially embedded in the circuit board 1, which is beneficial to reduce the height of the camera module 20 and the rear focus of the flange. Moreover, since the filter 5 is fixed to the bottom wall 191 of the fourth groove 19, the positioning of the filter 5 during assembly is accurate, which is beneficial to improve the assembly accuracy and product yield of the camera module 20.

In some embodiments, the filter 5 covers the connecting wire 8, that is, the connecting wire 8 is located under the filter 5. In other embodiments, the connecting wire 8 may be partially located in the space on both sides of the filter 5. For example, a gap is formed between two sides of the filter 5 and the fourth groove 19 of the circuit board 1, and the connecting wire 8 is partially located in the gap. At this time, the filter 5 and the connecting wire 8 can reuse part of the height space, which is beneficial to further reduce the height of the camera module 20.

Please refer to FIG. 15, which is a schematic diagram of the internal structure of the camera module 20 shown in FIG. 1 in still other embodiments. The camera module 20 of this embodiment includes most of the technical features of the camera module 20 of the foregoing embodiment. The differences between the two are mainly described below, and most of the same contents of the two will not be repeated.

In some embodiments, the image sensor 2 of the camera module 20 is mounted on the circuit board 1 and is completely embedded in the circuit board 1. The filter 5 is located between the image sensor 2 and the lens 4. The filter 5 is fixed on the top surface 11 of the circuit board 1. For example, the bottom surface 51 of the filter 5 may be bonded to the top surface 11 of the circuit board 1. At this time, the assembly and positioning accuracy of the filter 5 and the circuit board 1 is high, which is beneficial to improve the assembly accuracy of the camera module 20 and the product yield.

In some embodiments, the filter 5 covers the connecting wire 8, that is, the connecting wire 8 is located under the filter 5. In other embodiments, the connecting wire 8 may be partially located in the space on both sides of the filter 5. For example, a gap is formed between two sides of the filter 5 and the top surface 11 of the circuit board 1, and the connecting wire 8 is partially located in the gap. At this time, the filter 5 and the connecting wire 8 can reuse part of the height space, which is beneficial to further reduce the height of the camera module 20. In some other embodiments, the optical filter 5 and the connecting wire 8 may also have other positional relationships.

In the embodiments of the present application, the camera module adopts an embedded cavity packaging structure, which can eliminate the support structure of the traditional camera module, so that the lens base is directly fixed on the top surface of the circuit board, thereby effectively reducing the cost of the camera module. Height, the height of the camera module is small, which is conducive to the thinner and lighter electronic equipment using the camera module, the application range of the camera module is wider, and the competitiveness of the camera module is significantly improved.

The above description is only the specific implementation of this application, but the protection scope of this application is not limited to this. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed in this application. Covered within the protection scope of the present application; the embodiments of the present application and the features in the embodiments can be combined with each other if there is no conflict. Therefore, the protection scope of this application shall be subject to the protection scope of the claims.

Claims

A camera module, which is characterized by comprising a circuit board, an image sensor, electronic components, a lens base and a lens, the circuit board has a first groove and a second groove, the opening of the first groove Located on the top surface of the circuit board, the opening of the second groove is located on the bottom surface of the circuit board, the image sensor is installed in the first groove, and the electronic components are installed in the second groove A groove, the lens base is fixed on the top surface of the circuit board, the lens is installed on the inner side of the lens base, and the lens is used for converging light to the image sensor.
The camera module of claim 1, wherein the depth of the first groove is greater than the height of the image sensor.
The camera module according to claim 2, wherein the circuit board further has a third groove, the third groove is arranged around the first groove, and the third groove communicates with the A first groove, the opening of the third groove is located on the top surface of the circuit board, and the circuit board includes a first pad located on the bottom wall of the third groove;

The camera module further includes a connecting wire, one end of the connecting wire is welded to the image sensor, the other end is welded to the first pad, and the depth of the third groove is greater than or equal to the arc of the connecting wire The connecting wire includes an apex away from the bottom wall of the third groove, and the arc height of the connecting wire is the distance between the apex of the connecting wire and the bottom wall of the third groove.
The camera module according to claim 3, wherein the camera module further comprises a filter, the filter is located between the connecting wire and the lens, and the filter is bonded The connecting wire.
4. The camera module of claim 4, wherein the distance between the bottom surface of the filter and the bottom wall of the third groove is smaller than the groove depth of the third groove.
The camera module of claim 3, wherein the circuit board further has a fourth groove, the fourth groove is disposed around the third groove, and the fourth groove communicates with the A third groove, the opening of the fourth groove is located on the top surface of the circuit board;

The camera module further includes a filter, the filter is located between the image sensor and the lens, and the filter is fixed to the bottom wall of the fourth groove.
The camera module according to claim 2, wherein the circuit board further has a third groove, the third groove is arranged around the first groove, and the third groove communicates with the The first groove, the opening of the third groove is located on the top surface of the circuit board, and the bottom wall of the third groove includes a first area, a second area, a third area, and a fourth area connected in sequence , The third area is arranged opposite to the first area, and the fourth area is arranged opposite to the second area;

The circuit board includes a plurality of first pads, some of the first pads are located in the first area, and another portion of the first pads are located in the third area, and the camera module further includes a connecting wire , One end of the connecting wire is welded to the image sensor, and the other end is welded to the first pad;

The camera module further includes a filter, the filter is located between the image sensor and the lens, one side of the filter is fixed to the second area, and the filter is The other side is fixed to the fourth area.
4. The camera module of claim 2, wherein the camera module further comprises a filter, and the filter is fixed on the top surface of the circuit board.
The camera module of claim 1, wherein the camera module further comprises a first adhesive layer or a first solder layer, and the first adhesive layer or the first solder layer is located between the lens base and the lens base. Between the top surfaces of the circuit board, the lens base and the circuit board are fixedly connected.
The camera module according to claim 9, wherein the circuit board further has a fifth groove, the opening of the fifth groove is located on the top surface of the circuit board, and the circuit board includes The second pad on the bottom wall of the fifth groove;

The lens base is a motor, the lens base includes a motor pad, and the motor pad is soldered to the second pad.
The camera module according to any one of claims 1 to 10, wherein the flange back focus of the camera module is in the range of 0.4 mm to 0.8 mm.
The camera module according to any one of claims 1 to 10, wherein the circuit board comprises a laminated board and a substrate, and the top surface of the substrate is fixedly connected to the bottom surface of the board. The board has a through hole, the first groove includes a through hole of the board, and the area where the top surface of the substrate faces the through hole of the board forms the bottom of the first groove. The image sensor is fixedly connected to the bottom wall of the first groove.
The camera module according to any one of claims 1 to 10, wherein the depth of the second groove is greater than or equal to the height of the electronic component.
The camera module according to claim 13, wherein the circuit board comprises a laminated board and a substrate, the top surface of the substrate is fixedly connected to the bottom surface of the board, and the board has A recessed groove, the substrate has a through hole communicating with the recessed groove, and the second groove includes a recessed groove of the plate body and a through hole of the substrate.
The camera module according to claim 14, wherein the opening area of the through hole of the substrate is greater than or equal to the opening area of the recessed groove of the board.
The camera module according to claim 14 or 15, wherein the board has a through hole, the first groove includes the through hole of the board, and the top surface of the substrate faces the The area of the through hole of the board forms the bottom wall of the first groove, and the image sensor is fixedly connected to the bottom wall of the first groove.
The camera module according to claim 1, wherein the groove depth of the first groove is greater than the height of the image sensor; the circuit board further has a third groove surrounded by the third groove The first groove is arranged, the third groove is connected to the first groove, the opening of the third groove is located on the top surface of the circuit board, and the circuit board includes The first pad on the bottom wall of the groove; the camera module further includes a connecting wire, one end of the connecting wire is soldered to the image sensor, and the other end is soldered to the first pad, and the groove of the third groove The depth is greater than or equal to the arc height of the connecting wire, the connecting wire includes an apex away from the bottom wall of the third groove, and the arc height of the connecting wire is the apex of the connecting wire and the third concave The distance between the bottom walls of the grooves; the groove depth of the third groove is smaller than that of the first groove, and the bottom wall of the third groove forms a stepped surface; the camera module further includes a filter, the filter The optical sheet is located between the connecting wire and the lens, and the filter is bonded to the connecting wire; the camera module further includes a third adhesive layer, and the third adhesive layer is bonded to the connecting wire The bottom surface of the filter is bonded to the third adhesive layer; the distance between the bottom surface of the filter and the bottom wall of the third groove is less than the depth of the third groove The camera module also includes a first adhesive layer or a first solder layer, the first adhesive layer or the first solder layer is located between the lens base and the top surface of the circuit board for fixed connection The lens base and the circuit board; the circuit board further has a fifth groove, the opening of the fifth groove is located on the top surface of the circuit board, the circuit board includes the fifth recess The second pad on the bottom wall of the groove; the lens base is a motor, the lens base includes a motor pad, and the motor pad is soldered to the second pad; the rear flange of the camera module The focal length is in the range of 0.4 mm to 0.8 mm; the circuit board includes a laminated board body and a substrate, the top surface of the substrate is fixedly connected to the bottom surface of the board body; the board body has a through hole, the The first groove includes a through hole of the board, the area where the top surface of the substrate faces the through hole of the board forms a bottom wall of the first groove, and the image sensor is fixedly connected to the first groove. The bottom wall of a groove; the depth of the second groove is greater than or equal to the height of the electronic component; the board has a recessed groove, the substrate has a through hole communicating with the recessed groove, so The second groove includes a recessed groove of the board and a through hole of the substrate; an opening area of the through hole of the substrate is greater than or equal to an opening area of the recessed groove of the board.
An electronic device, characterized by comprising an image processor and the camera module according to any one of claims 1 to 17, wherein the image processor is in communication connection with the camera module, and the image processor is used for Obtain image data from the camera module, and process the image data.