CN210629647U - Sensitization subassembly and have its module and electronic equipment of making a video recording - Google Patents
Sensitization subassembly and have its module and electronic equipment of making a video recording Download PDFInfo
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- CN210629647U CN210629647U CN201922180935.3U CN201922180935U CN210629647U CN 210629647 U CN210629647 U CN 210629647U CN 201922180935 U CN201922180935 U CN 201922180935U CN 210629647 U CN210629647 U CN 210629647U
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- ceramic substrate
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Abstract
The utility model discloses a photosensitive assembly and module and electronic equipment of making a video recording that have it, photosensitive assembly includes: the ceramic substrate is provided with a groove; the chip is arranged in the groove; a connector soldered to the first surface of the ceramic substrate. According to the utility model discloses a photosensitive assembly through setting up the connector on ceramic substrate, can save traditional flexible line way board to can reduce the ascending holistic size of face side of photosensitive assembly's perpendicular to base plate, can make photosensitive assembly's simple structure, and can simplify photosensitive assembly's mounting process, can reduce cost.
Description
Technical Field
The utility model belongs to the technical field of the technique of making a video recording and specifically relates to a photosensitive assembly and module and electronic equipment of making a video recording that have it are related to.
Background
With the rapid development of electronic information, electronic devices are becoming an indispensable part of people's lives. The camera module is a component with a camera function, and is widely applied to electronic products such as mobile phones, computers, watches and the like, and in recent years, with the development of electronic equipment towards miniaturization and ultra-thinness, higher requirements are put forward on the camera module.
In the related art, the packaging technology of the camera module mainly comprises an on-board packaging technology and an inverted technology, a flexible circuit board is generally required to be installed on the traditional inverted camera module, and the size of the flexible circuit board in the direction perpendicular to the substrate of the camera module can be increased by arranging the flexible circuit board. Meanwhile, the flexible circuit board needs to be connected by using an ACF (anisotropic conductive film) conductive adhesive, which results in a complex assembly process and high cost.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, an object of the present invention is to provide a photosensitive assembly, which effectively reduces the overall dimension of the photosensitive assembly perpendicular to the substrate in the direction of the surface, and has simple assembly process and low cost.
The utility model discloses still provide a module of making a video recording.
The utility model discloses still provide an electronic equipment.
According to the utility model discloses an electronic equipment and photosensitive assembly, include: the ceramic substrate is provided with a groove; the chip is arranged in the groove; a connector soldered to the first surface of the ceramic substrate.
From this, according to the utility model discloses a photosensitive assembly sets up the connector on ceramic substrate through adopting the welded mode, and the connector on the ceramic substrate directly carries out circuit signal with terminal equipment and is connected, can save traditional flexible line way board to can reduce photosensitive assembly's the ascending holistic size of a dimension of perpendicular to ceramic substrate side, can simplify photosensitive assembly's structure, and can simplify photosensitive assembly's mounting process, reduce cost.
In some examples of the present invention, the connector is fixed to the first surface of the ceramic substrate by surface mount process welding. The ceramic substrate structure that sets up like this is stable to can guarantee the stability of the work of photosensitive assembly.
In some examples of the present invention, the photosensitive assembly further comprises: the optical filter is arranged on the first surface of the ceramic substrate and covers the groove. The color of the photosensitive assembly can be adjusted by the optical filter, and the filtering effect of the photosensitive assembly is ensured.
In some examples of the invention, the optical filter is bonded to the first surface of the ceramic substrate. This arrangement makes it possible to more firmly dispose the optical filter on the ceramic substrate.
In some examples of the present invention, the photosensitive assembly further comprises: and the ceramic substrate and the chip are arranged in the shielding cover. The shielding cover can protect the ceramic substrate and the chip and can shield external radiation interference. The size of the whole of the photosensitive assembly perpendicular to the plate surface direction of the ceramic substrate can be reduced by the arrangement, so that the ultra-thinning and the miniaturization of the electronic equipment are realized.
In some examples of the invention, the shielding cover comprises: the shielding cover comprises a bottom plate and a plurality of side plates, wherein the side plates extend in the direction away from the bottom plate and are sequentially connected, and one side of the bottom plate is provided with an open end of the shielding cover. The ceramic substrate can be effectively limited in the shielding cover by arranging the plurality of side plates, and the side plate on one side of the bottle shielding cover with a complex processing technology can be omitted, so that the structure of the photosensitive assembly can be simplified.
In some examples of the present invention, the second surface of the ceramic substrate corresponds to the bottom plate, and the first surface protrudes from the side plate to be away from the edge of the bottom plate, and the second surface of the ceramic substrate is a surface away from the lens and back to the first surface. The arrangement can avoid the interference, thereby improving the stability of the photosensitive assembly.
In some examples of the invention, the chip is mounted in the recess by a flip-chip process. The photosensitive assembly adopting the flip-chip process has a compact structure and high reliability.
According to the utility model discloses a module of making a video recording, include photosensitive assembly and camera lens, the camera lens bond in ceramic substrate's first surface. The photosensitive assembly arranged in this way can reduce the overall size in the plate surface direction of the vertical ceramic substrate, the structure of the photosensitive assembly is simple, the mounting process of the photosensitive assembly is simplified, and the cost is reduced.
According to the utility model discloses an electronic equipment, include the module of making a video recording. The camera module can effectively realize the ultra-thinning and miniaturization of the electronic equipment.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic structural diagram of a photosensitive assembly according to an embodiment of the present invention;
fig. 2 is an exploded view of the photosensitive assembly according to the embodiment of the present invention.
Reference numerals:
a photosensitive member 100; a camera module 200;
a ceramic substrate 10; a groove 11; a first surface 12;
a chip 30; a connector 40; an optical filter 50;
a shield cover 60; a base plate 61; side plates 62; an open end 63;
and a lens 110.
Detailed Description
Embodiments of the present invention are described in detail below, and the embodiments described with reference to the drawings are exemplary.
A photosensitive assembly 100 according to an embodiment of the present invention is described below with reference to fig. 1 to 2.
As shown in fig. 1-2, a photosensitive assembly 100 according to an embodiment of the present invention includes a ceramic substrate 10, a chip 30, and a connector 40. The ceramic substrate 10 has high thermal conductivity and high insulation properties, and is highly reliable. The ceramic substrate 10 is provided with a groove 11, and the groove 11 is used for placing the chip 30. The chip 30 is disposed in the recess 11, and the chip 30 is used for converting an optical signal into an electrical signal.
Further, referring to fig. 1 and 2, the connector 40 is soldered to the first surface 12 of the ceramic substrate 10. The first surface 12 is a horizontal surface of the ceramic substrate 10 away from the chip 30. The connector 40 and the ceramic substrate 10 connected by the soldering process are more simple in structure. The photosensitive assembly 100 is in circuit signal connection with a terminal device through the connector 40 on the ceramic substrate 10, the connector 40 can effectively transmit an electric signal, and the connector 40 arranged in this way can omit a traditional flexible circuit board, so that the overall size of the photosensitive assembly 100 in the direction perpendicular to the plate surface of the ceramic substrate 10 can be reduced, the structure of the photosensitive assembly 100 can be simplified, the photosensitive assembly 100 can be compact in structure, and ultra-thinning of an electronic device can be realized.
According to some embodiments of the present invention, the connector 40 may be soldered to the first surface 12 of the ceramic substrate 10 by a surface mount process. The photosensitive assembly 100 using the surface mount process may have the characteristics of high reliability, small volume, and light weight.
Optionally, with reference to fig. 2, the photosensitive assembly 100 further includes a filter 50, and the filter 50 covers the groove 11. The filter 50 is an optical device for selecting a desired wavelength band of radiation. The filter 50 can adjust the color of the photosensitive assembly 100. The filter 50 may be disposed on the first surface 12 of the ceramic substrate 10.
Further, the filter 50 is bonded to the first surface 12 of the ceramic substrate 10. Alternatively, the optical filter 50 is fixedly attached to the first surface 12 of the ceramic substrate 10 by glue, so that the optical filter 50 bonded by the glue is more stable.
In some embodiments of the present invention, as shown in fig. 1-2, the photosensitive assembly 100 further includes a shielding cover 60, and the ceramic substrate 10 and the chip 30 are mounted in the shielding cover 60. The shield cover 60 may protect the ceramic substrate 10 and the chip 30 and may shield external radiation interference. Since the conventional photosensitive assembly requires the flexible circuit board to be placed in the shielding cover, the structure of the photosensitive assembly is complicated by such an arrangement. The present invention is directed to a method for manufacturing a semiconductor device, in which a conventional flexible printed circuit board is omitted by providing a connector 40 on a ceramic substrate 10, thereby reducing the distance between the ceramic substrate 10 and a shield cover 60, simplifying the structure of a photosensitive assembly 100, and effectively realizing ultra-thinning and miniaturization of an electronic device.
Specifically, as shown in fig. 2, the shield cover 60 includes a bottom plate 61 and a plurality of side plates 62, the plurality of side plates 62 extend in a direction away from the bottom plate 61 and are sequentially connected, and an open end 63 of the shield cover 60 is left at one side of the bottom plate 61. Referring to fig. 2, the bottom plate 61 of the shield cover 60, i.e., the bottom of the photosensitive assembly 100, bonds the other components of the mounted photosensitive assembly 100 to the bottom plate 61 by glue. The plurality of side plates 62 extend in a direction away from the bottom plate 61 in a direction perpendicular to the bottom plate 61 of the ceramic substrate, and the plurality of bottom plates are connected in series.
In some embodiments of the present invention, referring to fig. 2, the plurality of side plates 62 may be three. Traditional shield cover is generally equipped with four curb plates of connecting in order on the bottom plate, four curb plates of connecting in order can form one with the bottom plate and hold the chamber, and flexible line way board generally comprises main part and tip, and flexible line way board's main part is held in holding the chamber, and flexible line way board's tip stretches out in holding the chamber, and one of them curb plate of shield cover still need be equipped with the clearance position of keeping away for flexible line way board's tip setting to lead to the complicated and processing step who has increased the shield cover of structure of shield cover. In the present invention, the stability of the photosensitive assembly 100 can be ensured by providing the three side plates 62. This arrangement can simplify the structure of the photosensitive assembly 100 and can ensure the stability of the photosensitive assembly 100.
As shown in fig. 2, a second surface (not shown) of the ceramic substrate 10 corresponds to the bottom plate 61, and the first surface 12 protrudes from an edge of the side plate 62 away from the bottom plate 61, the second surface of the ceramic substrate 10 being a surface opposite to the first surface 12. That is, the second surface of the ceramic substrate 10 is bonded to the base plate 61. The ceramic substrate 10 and the three side plates 62 may have gaps, so that the mutual interference between the ceramic substrate and the three side plates can be avoided, and the stability of the photosensitive assembly 100 can be further improved.
Further, the chip 30 is mounted in the recess 11 by a flip-chip process. The flip-chip process has the characteristics of compact structure, small packaging volume, high reliability and the like. The photosensitive assembly 100 thus configured is compact.
According to the utility model discloses module 200 of making a video recording, including photosensitive assembly 100 and camera lens 110. Referring to fig. 1 and 2, a lens 110 may be adhered to the first surface 12 of the ceramic substrate 10. The connector 40 and the lens 110 are spaced apart from each other on the first surface 12 of the ceramic substrate 10. Optionally, the lens 110 is adhesively fixed to the first surface 12 of the ceramic substrate 10 by glue, so that the bonded lens 110 is more stable.
The utility model discloses a main packaging technology is for welding connector 40 and electronic component on ceramic substrate 10's first surface 12 earlier, again with the chip 30 flip-chip in ceramic substrate 10's recess 11, then with glue fixed mounting on ceramic substrate 10 for light filter 50, again with camera lens 110 through glue fixed mounting on ceramic substrate 10 equally, the subassembly that will have installed at last passes through glue and bonds on being located the shield cover 60 of bottommost.
According to the utility model discloses an electronic equipment, including the module of making a video recording 200 of above-mentioned embodiment.
In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, are not to be construed as limiting the present invention.
In the description of the present invention, "the first feature" and "the second feature" may include one or more of the features.
In the description of the present invention, "a plurality" means two or more.
In the description of the present invention, the first feature "on" or "under" the second feature may include the first and second features being in direct contact, and may also include the first and second features being in contact with each other not directly but through another feature therebetween.
In the description of the invention, the first feature being "on", "above" and "above" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. A photosensitive assembly, comprising:
the ceramic substrate is provided with a groove;
the chip is arranged in the groove;
a connector soldered to the first surface of the ceramic substrate.
2. A photosensitive assembly according to claim 1, wherein the connector is soldered to the first surface of the ceramic substrate by a surface mount process.
3. A photosensitive assembly according to claim 1, further comprising: the optical filter is arranged on the first surface of the ceramic substrate and covers the groove.
4. A photosensitive assembly according to claim 3, wherein the filter is bonded to the first surface of the ceramic substrate.
5. A photosensitive assembly according to claim 1, further comprising: and the ceramic substrate and the chip are arranged in the shielding cover.
6. A photosensitive assembly according to claim 5, wherein the shield cover includes: the shielding cover comprises a bottom plate and a plurality of side plates, wherein the side plates extend in the direction away from the bottom plate and are sequentially connected, and one side of the bottom plate is provided with an open end of the shielding cover.
7. The photosensitive assembly of claim 6, wherein the second surface of the ceramic substrate corresponds to the bottom plate, the first surface protrudes from the edge of the side plate away from the bottom plate, and the second surface of the ceramic substrate is a surface opposite to the first surface.
8. A photosensitive assembly according to claim 1, wherein the chip is mounted in the recess by a flip-chip process.
9. The utility model provides a module of making a video recording which characterized in that includes:
the photosensitive assembly of any one of claims 1-8;
and the lens is adhered to the first surface of the ceramic substrate.
10. An electronic device comprising the camera module of claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922180935.3U CN210629647U (en) | 2019-12-06 | 2019-12-06 | Sensitization subassembly and have its module and electronic equipment of making a video recording |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922180935.3U CN210629647U (en) | 2019-12-06 | 2019-12-06 | Sensitization subassembly and have its module and electronic equipment of making a video recording |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210629647U true CN210629647U (en) | 2020-05-26 |
Family
ID=70763882
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922180935.3U Active CN210629647U (en) | 2019-12-06 | 2019-12-06 | Sensitization subassembly and have its module and electronic equipment of making a video recording |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210629647U (en) |
-
2019
- 2019-12-06 CN CN201922180935.3U patent/CN210629647U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
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| CP03 | Change of name, title or address |
Address after: 330000 no.1404 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: Jiangxi Jingrun optics Co.,Ltd. Address before: 330000 Photoelectric Industrial Park to the East of College Sixth Road and South of Tianxiang Avenue, Nanchang High-tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee before: Nanchang Oufei Jingrun Technology Co.,Ltd. |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210622 Address after: 510000 Shenzhou Road, science and Technology Town, Guangzhou high tech Industrial Development Zone, Guangdong 7 Patentee after: Guangzhou delta Imaging Technology Co.,Ltd. Address before: 330000 no.1404 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee before: Jiangxi Jingrun optics Co.,Ltd. |