CN210325795U

CN210325795U - Optical scanning module

Info

Publication number: CN210325795U
Application number: CN201921377211.1U
Authority: CN
Inventors: 杨孝东
Original assignee: Azurewave Technology Shanghai Co ltd
Current assignee: Azurewave Technology Shanghai Co ltd
Priority date: 2019-08-22
Filing date: 2019-08-22
Publication date: 2020-04-14
Anticipated expiration: 2029-08-22

Abstract

The utility model provides an optical scanning module, which comprises an optical sensor, electronic components, a heat sink substrate, a heat conducting bracket and an optical lens which are connected in sequence from bottom to top, the lower plane of the heat conducting bracket is upwards provided with a groove, the heat sink substrate is also provided with a light-transmitting groove, the groove is communicated with the light transmission groove, the optical sensor is inversely welded on the upper plane of the groove through a solder ball, the optical sensor is also in contact connection with the heat sink substrate through a heat-conducting medium layer, the electronic component is arranged on the heat sink substrate, the electronic components are positioned in the orthographic projection area of the groove and are distributed with the optical sensor in a staggered way, the bonding pad of the heat conduction bracket is connected with the bonding pad circuit of the heat sink substrate, light passing through the optical lens passes through the light transmission groove and can be irradiated on the light sensor. The utility model discloses heat dispersion and reaction rate can be improved.

Description

Optical scanning module

Technical Field

The utility model relates to the field of photoelectric technology, in particular to optical scanning module.

Background

And the 3D optical scanning module and other optical scanning modules are used for face recognition, gesture recognition, three-dimensional reconstruction and 3D structured light scanning modeling. The 3D optical scanning module can be applied to mobile phones, tablet computers, notebook computers and desktop computers. Such as AR or VR applications for cell phones, etc. Referring to fig. 5, the 3D optical scanning module in the prior art includes a heat sink substrate 7, photodiodes 6 and 3D optical sensors 4 which are attached to the heat sink substrate 7 and are distributed in a staggered manner, a bracket 3 which is located on the heat sink substrate 7 and exposes the photodiodes 6 and the 3D optical sensors 4, and an optical filter 1 which is fixedly disposed above the bracket 3 through glue 2. Wherein the pins of the photodiode 6 and the 3D light sensor 4 on the heat sink substrate 7 are bonded on the bonding pad of the heat sink substrate 7 through the bonding wire 5, and the photodiode 6 and the 3D light sensor 4 are covered by the optical filter 1. The manufacturing method of the 3D optical scanning module in the prior art comprises the following steps:

referring to fig. 1 to 2, the photodiodes 6 and the 3D photosensors 4 are distributed in a staggered manner and attached to the heat sink substrate 7 by a thermal conductive adhesive. The photodiode 6 and the pins of the 3D photosensor 4 are bonded to the pads of the heat sink substrate 7 by the bonding wires 5. Wherein the heat sink substrate 7 is a Printed Circuit Board (PCBA) having electronic components.

Step two, referring to fig. 3 to 4, a bracket 3 is mounted on the heat sink substrate 7, and an area of the bracket 3 covering the photodiode 6 and the 3D optical sensor 4 is a hollow structure 31 to expose the photodiode 6 and the 3D optical sensor 4.

Referring to fig. 5, the optical filter 1 is disposed above the support 3, and the fixing glue 2 is disposed on the periphery of the optical filter 1 to fixedly connect the optical filter 1 and the support 3. Wherein the peripheral dimension of the optical filter 1 is smaller than that of the bracket 3, and the heat sink substrate 7 and the bracket 3 are both of a planar plate-shaped structure.

The 3D optical scanning module of above-mentioned structure because photodiode 6 and 3D optical sensor 4 all bind the fixed setting in heat sink base plate 7 of technology through the COB, because the longer characteristics of welding lead 5 that the COB bound lead wire, lead to 3D optical sensor 4's welding lead wire resistance too big, and then lead to 3D optical sensor 4's heat dispersion relatively poor. Because the 3D optical scanning module produces a large amount of heat energy when working, the impedance has been increased again to the heat energy to the reaction rate of 3D optical scanning module has been influenced. Therefore, it is an urgent technical problem to be solved by those skilled in the art to improve the heat dissipation performance and the response speed of the 3D optical scanning module.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a light scanning module to solve the poor and poor problem of reaction rate of heat dispersion.

In order to achieve the above object, the present invention provides an optical scanning module, which comprises an optical sensor, an electronic component, and a heat sink substrate, a heat conducting bracket and an optical lens sequentially connected from bottom to top, the lower plane of the heat conducting bracket is upwards provided with a groove, the heat sink substrate is also provided with a light-transmitting groove, the groove is communicated with the light transmission groove, the optical sensor is inversely welded on the upper plane of the groove through a solder ball, the optical sensor is also in contact connection with the heat sink substrate through a heat-conducting medium layer, the electronic component is arranged on the heat sink substrate, the electronic components are positioned in the orthographic projection area of the groove and are distributed with the optical sensor in a staggered way, the bonding pad of the heat conduction bracket is connected with the bonding pad circuit of the heat sink substrate, light passing through the optical lens passes through the light transmission groove and can be irradiated on the light sensor.

Further, the utility model provides an optical scanning module, the upper surface of heat sink base plate is provided with the flat lower step face in surface and goes up the step face, it is located to go up the step face within the orthographic projection region of recess, light sensor pass through the heat-conducting medium layer contact connect in go up on the step face, electronic components sets up on lower step face. Furthermore, the utility model provides a light scanning module, optical lens is light filter or diffusion optical glass piece.

Further, the utility model provides an optical scanning module, electronic components's pin through the welding lead bind set up in on the heat sink base plate.

Further, the utility model provides an optical scanning module, electronic components is semiconductor device, resistance or electric capacity.

Further, the utility model provides an optical scanning module, light sensor includes infrared LED sensor or 3D light sensor.

Further, the utility model provides a light scanning module, heat conduction support and optical lens piece are through encircleing in the solid fixed glue of optical lens piece lateral wall and heat conduction support upper surface is connected.

Further, the utility model provides an optical scanning module, the pad of heat conduction support with the welding of heat sink base plate passes through conductive silver glue circuit connection.

Furthermore, in the optical scanning module provided by the present invention, the heat conducting support is a non-metal heat conducting support; and/or the heat sink substrate is a PCB or PCBA.

Compared with the prior art, the utility model provides a light scanning module, light sensor pass through the welding ball flip-chip and weld in the last plane of the recess of heat conduction support to make light sensor and heat conduction support be connected and needn't bind through longer welding lead, thereby overcome the welding lead overlength and the too big defect of welding lead resistance that bind in the COB technology. The utility model discloses a welding of solder ball and heat conduction support to the transmission distance of the IO port of light sensor and the transmission impedance of electric current have been shortened, thereby the reaction rate of optical scanning module has been improved. The utility model discloses a heat energy that light sensor during operation produced dispels the heat through the heat conduction support on the one hand, and on the other hand dispels the heat to the heat sink base plate through the heat-conducting medium layer, and the heat conduction support has increased the heat radiating area that light sensor during operation produced heat energy to improve the heat dispersion of optical scanning module, reduced light sensor's energy consumption, improved the reaction rate of optical scanning module. That is to say, the utility model discloses a light sensor dispels the heat openly through the heat sink base plate, and light sensor's the back dispels the heat through the heat conduction support, has improved light sensor's heat dispersion through the front and the dual radiating mode in the back to light sensor's reaction rate has been improved. The utility model discloses with COB technology optical sensor's the back only carries out radiating scheme to the heat sink base plate, has obvious heat dispersion. The utility model discloses a to the radiating mode of light sensor, reduced the temperature of light sensor during operation, improved the life of light sensor and optical scanning module.

Drawings

Fig. 1 is a schematic structural diagram of a conventional heat sink substrate;

FIG. 2 is a schematic structural diagram of a conventional electronic component and optical sensor mounting structure;

FIG. 3 is a schematic structural view of a prior art stent;

FIG. 4 is a schematic view of an assembly structure of a conventional bracket and a heat sink substrate;

FIG. 5 is a schematic cross-sectional view of a conventional optical scanning module;

fig. 6 to 7 are schematic views illustrating a connection structure between a solder ball and an optical sensor according to an embodiment of the present invention;

fig. 8 is a schematic cross-sectional view of a heat conductive bracket according to an embodiment of the present invention;

fig. 9 is a schematic cross-sectional view of a first assembly formed after an optical sensor and a thermally conductive holder according to an embodiment of the present invention are assembled;

fig. 10 is a schematic cross-sectional view of a second assembly formed after the optical lens of an embodiment of the invention is assembled with the first assembly;

fig. 11 is a schematic cross-sectional view of a heat sink substrate according to an embodiment of the present invention;

fig. 12 is a schematic cross-sectional view of an assembled electronic component and heat sink substrate according to an embodiment of the present invention;

fig. 13 is a schematic cross-sectional view of one side of an optical scanning module according to an embodiment of the present invention;

fig. 14 is a schematic cross-sectional view of another side of the optical scanning module according to an embodiment of the present invention;

fig. 15 is a schematic perspective view of an optical scanning module according to an embodiment of the present invention.

Prior art diagrams: 1. the device comprises an optical filter, 2, fixing glue, 3, a support, 31, a hollow structure, 4, an optical sensor, 5, a welding lead, 6, an electronic component, 7 and a heat sink substrate;

the utility model discloses the figure: 100. the optical scanning module comprises a light scanning module body 110, a heat sink substrate 110, a boss plane 112, a lower-level plane 120, a heat conduction support 121, a groove 122, a light transmission groove 130, an optical lens 140, an optical sensor 141, a solder ball 150, fixing glue 160, an electronic component 161, a welding lead 170 and a heat conduction medium layer.

Detailed Description

The present invention will be described in detail with reference to the accompanying drawings:

referring to fig. 6 to 15, an optical scanning module 100 provided in an embodiment of the present invention includes an optical sensor 140, an electronic component 160, and a heat sink substrate 110, a heat conducting support 120, and an optical lens 130 sequentially connected from bottom to top, a groove 121 is disposed upward on a lower plane of the heat conducting support 120, a light transmitting groove 122 is further disposed on the heat sink substrate 110, the groove 121 is communicated with the light transmitting groove 122, the optical sensor 140 is flip-chip bonded to an upper plane of the groove 121 through a solder ball 141, the optical sensor 140 is further in contact connection with the heat sink substrate 110 through a heat conducting medium layer 170, the electronic component 160 is disposed on the heat sink substrate 110, the electronic component 160 is located in a front projection area of the groove 121 and is distributed in a staggered manner with the optical sensor 140, a pad of the heat conducting support 120 is in circuit connection with a pad of the heat sink substrate 110, the light passing through the optical lens 130 can be irradiated onto the light sensor 140 through the light-transmitting groove 122.

Referring to fig. 13 to 15, in the light scanning module 100 according to the embodiment of the present invention, the heat conductive bracket 120 and the optical lens 130 are connected by the fixing glue 150 surrounding the sidewall of the optical lens 130 and the upper surface of the heat conductive bracket 120.

The embodiment of the utility model provides an optical scanning module 100, heat sink base plate 110 are Printed Circuit Board (printedcuiit Board, PCB) or have electronic components's PCB Board (Printed Circuit Board Assembly, PCBA). The base material of the heat sink substrate 110 may be ceramic, aluminum nitride, glass fiber epoxy board, bakelite board, plastic board, or other insulating materials commonly used in the art. The thermally conductive support 120 may be a non-metallic thermally conductive support such as ceramic, silicon gel, Polycarbonate (PC), and the like. The optical lens 130 is a filter or a diffusive optical glass sheet. The filter can be used for single-band filtering or multi-band filtering. The light sensor 140 may be an infrared LED sensor or may be a 3D light sensor. The solder balls 141 may be gold balls or solder balls. The fixing glue 150 may be a thermosetting glue, or an Ultraviolet (UV) thermosetting glue. The electronic component 160 may be a semiconductor device, a resistor, or a capacitor. The semiconductor device may be a single device such as a diode or a triode, for example, the electronic component 160 of the embodiment of the present invention may be a photodiode with a single structure. The semiconductor device may also be an integrated circuit chip. The embodiment of the utility model provides a specially adapted semiconductor device and light sensor's structural design.

Wherein the pad of the heat conductive bracket 120 may be located on the lower surface outside the groove 121 to be connected with the pad on the upper surface of the heat sink substrate 110 through the conductive adhesive, and the lower surface or the side surface of the heat sink substrate 110 has the pin pad from which the electronic component 160 and the optical sensor 140 are led out. At this time, the heat sink substrate 110 is a multi-layer PCBA board. The heatsink substrate 110 and its pad design are well known in the art and will not be described again. For example, the soldering of the pad of the thermally conductive holder 120 and the heat sink substrate 110 is electrically connected by a conductive paste such as a conductive silver paste.

The embodiment of the present invention further provides a manufacturing method of the above optical scanning module 100, including the following steps:

in step S1, referring to fig. 6 to 7, the solder ball 141 is soldered to the pad of the optical sensor 140 by a bumping process (stub bonding).

In step S2, referring to fig. 8 to 9, the optical sensor 140 is flip-chip bonded to the upper plane of the groove 121 of the heat conductive bracket 120 through the solder ball 141 by a flip-chip (Filp chip) process, so that the light-transmitting slot 122 intersects with the optical sensor 140 to form a first component. Wherein the flip chip process is a flip chip ultrasonic bonding process.

In step S3, referring to fig. 10, the optical lens 130 is adhered to the first component by the fixing glue 150 surrounding the sidewall of the optical lens 130 and the upper surface of the heat conductive bracket 120, so as to form a second component.

In step S4, referring to fig. 11 to 12, the pins of the electronic component 160 are bonded to the heat sink substrate 110 through the Chip On Board (COB) process by the bonding wires 161, so that the pins of the electronic component 160 are electrically connected to the pads of the heat sink substrate 110, thereby forming a third assembly. Wherein the bonding wire 161 may be a gold wire, a silver wire, a copper wire, an aluminum wire, or the like.

Step S5, referring to fig. 13 to 14, the second assembly is stacked and fixed on the third assembly, so that the electronic components 160 and the optical sensors 140 are distributed in a staggered manner, the electronic components 160 are disposed in the orthographic projection area of the groove 121, the optical sensors 140 are connected to the heat sink substrate 110 in a contact manner through the heat-conducting medium layer 170 such as silica gel, and the bonding pads of the heat-conducting support 120 are connected to the bonding pads of the heat sink substrate 110 in a circuit manner, thereby forming the optical scanning module 100.

The embodiment of the utility model provides a light scanning module 100 and manufacturing method thereof, light sensor 140 passes through the upper plane of solder ball 141 flip-chip bonding in the recess 121 of heat conduction support 120 to make light sensor 140 and heat conduction support 120 be connected and needn't bind through longer welding lead 161, thereby overcome the welding lead 161 overlength and the too big defect of welding lead 161 resistance that bind in the COB technology.

The embodiment of the utility model provides a light scanning module 100 and manufacturing method thereof is through the welding of solder ball 141 with heat conduction support 120 to the transmission distance of the IO port of light sensor 140 and the transmission impedance of electric current have been shortened, thereby the reaction rate of light scanning module 100 has been improved.

The embodiment of the utility model provides an optical scanning module 100 and manufacturing method thereof, the heat energy that light sensor 140 during operation produced dispels the heat through heat conduction support 120 on the one hand, on the other hand dispels the heat to heat sink base plate 110 through heat-conducting medium layer 170, heat conduction support 120 has increased the heat radiating area that light sensor 140 during operation produced heat energy, thereby improved optical scanning module 100's heat dispersion, reduced light sensor 140's energy consumption, improved optical scanning module 100's reaction rate. That is to say, the utility model discloses light sensor 140 dispels the heat through heat sink base plate 110 in the front, and light sensor 140's the back dispels the heat through heat conduction support 120, has improved light sensor 140's heat dispersion through the front and the dual radiating mode in the back to light sensor 140 to the reaction rate of light scanning template has been improved. The embodiment of the utility model provides an embodiment and COB technology light sensor 140's the back only carries out radiating scheme to heat sink substrate 110, has obvious heat dispersion.

The embodiment of the utility model provides a light scanning module 100 and manufacturing method thereof through the radiating mode to light sensor 140, has reduced the temperature of light sensor 140 during operation, has improved light sensor 140 and light scanning module 100's life.

Referring to fig. 11 to 14, in the optical scanning module 100 and the manufacturing method thereof according to the embodiment of the present invention, the upper surface of the heat sink substrate 110 is provided with a lower step surface 112 and an upper step surface 111, which are flat surfaces, that is, the upper surface of the heat sink substrate 110 is a step surface, the upper step surface 111 is located in an orthographic projection area of the groove 121, the optical sensor 140 is connected to the upper step surface 111 through a heat conducting medium layer 170, and the electronic component 160 may be disposed on the lower step surface 112 or the upper step surface 111. The lower step surface 112 and the upper step surface 111 of the heat sink substrate 110 are designed to enable the optical sensor 140 and the electronic component 160 to be distributed on different step surfaces so as to be distributed in a staggered manner, and to enable the optical sensor 140 and the electronic component 160 to be distributed on different step surfaces during operation, so that mutual influence of heat generated during operation of the optical sensor 140 and the electronic component 160 is avoided, and the service life of the optical scanning module 100 is prolonged. In addition, the upper step surface 111 of the heat sink substrate 110 can be embedded or extended into the groove 121 of the heat conducting bracket 120, so that the structure of the optical scanning module is more compact and the volume is smaller. In addition, the groove 121 of the heat conducting bracket 120 can enclose the electronic component 160 and the optical sensor 140, and protect the electronic component 160 and the optical sensor 140.

The utility model discloses a COB technology with electronic components 160 and optical sensor 140's chip flip-chip ultrasonic bonding process novelty's combination get together to obtain like this optical scanning module 100 of closed assembly structure. The defects of heat dissipation and wire groups of a COB process during packaging of the optical sensor are overcome through the chip flip-chip ultrasonic welding process, the on-resistance of the optical sensor is reduced, and the optical sensor is subjected to dual heat dissipation through the heat conduction support and the heat sink substrate, so that the heat dissipation performance and the reaction speed of the optical scanning module are improved.

The present invention is not limited to the above embodiments, and various changes and decorations made in the claims of the present invention are all within the protection scope of the present invention.

Claims

1. An optical scanning module is characterized by comprising an optical sensor, an electronic component, a heat sink substrate, a heat conducting bracket and an optical lens which are sequentially connected from bottom to top, the lower plane of the heat conducting bracket is upwards provided with a groove, the heat sink substrate is also provided with a light-transmitting groove, the groove is communicated with the light transmission groove, the optical sensor is inversely welded on the upper plane of the groove through a solder ball, the optical sensor is also in contact connection with the heat sink substrate through a heat-conducting medium layer, the electronic component is arranged on the heat sink substrate, the electronic components are positioned in the orthographic projection area of the groove and are distributed with the optical sensor in a staggered way, the bonding pad of the heat conduction bracket is connected with the bonding pad circuit of the heat sink substrate, light passing through the optical lens passes through the light transmission groove and can be irradiated on the light sensor.

2. The optical scanning module of claim 1, wherein the top surface of the heat sink substrate is provided with a lower step surface and an upper step surface, the upper step surface is located within the orthographic projection area of the groove, the optical sensor is connected to the upper step surface in a contact manner through a heat conducting medium layer, and the electronic component is arranged on the lower step surface.

3. The light scanning module of claim 1, wherein the optical lens is a filter or a diffusive optical glass.

4. The optical scanning module of claim 1, wherein the pins of the electronic component are mounted on the heat sink substrate by wire bonding.

5. The optical scanning module of claim 1, wherein the electronic component is a semiconductor device, a resistor, or a capacitor.

6. The light scanning module of claim 1, wherein the light sensor comprises an infrared LED sensor or a 3D light sensor.

7. The optical scanning module of claim 1, wherein the thermally conductive frame and the optic are coupled by a securing adhesive around the optic sidewall and the upper surface of the thermally conductive frame.

8. The optical scanning module of claim 1, wherein the soldering of the pads of the thermally conductive bracket to the submount substrate is via a conductive silver paste circuit.

9. The optical scanning module of claim 1, wherein said thermally conductive mount is a non-metallic thermally conductive mount; and/or the heat sink substrate is a PCB or PCBA.