CN110784637B

CN110784637B - Camera module and electronic equipment

Info

Publication number: CN110784637B
Application number: CN201911143621.4A
Authority: CN
Inventors: 陈宇灏
Original assignee: Vivo Mobile Communication Hangzhou Co Ltd
Current assignee: Vivo Mobile Communication Hangzhou Co Ltd
Priority date: 2019-11-20
Filing date: 2019-11-20
Publication date: 2021-03-26
Anticipated expiration: 2039-11-20
Also published as: CN110784637A

Abstract

The embodiment of the invention provides a camera module, and belongs to the technical field of electronic equipment. When the camera module provided by the invention is used, the lens module is arranged on the base, the base is arranged on the first surface of the circuit board, the photosensitive chip is arranged on the first surface of the circuit board, the light receiving surface of the photosensitive chip faces the lens module, the boss is arranged on the inner wall of the base, the angle adjusting component is arranged on the boss, the infrared filter is arranged on the angle adjusting component, the infrared filter is positioned between the lens module and the photosensitive chip, and the circuit board is electrically connected with the angle adjusting component, so that after light rays pass through the lens module, the light rays continue to pass through the infrared filter, and then the light rays are converted into images by the photosensitive chip. When there is the contained angle between infrared filter and the sensitization chip, can supply power to the angular adjustment subassembly through the circuit board for the angular adjustment subassembly takes place to deform, can make the contained angle between infrared filter and the sensitization chip be less than the default.

Description

Camera module and electronic equipment

Technical Field

The present invention relates to the field of electronic devices, and in particular, to a camera module and an electronic device.

Background

With the continuous development of science and technology, electronic equipment has become a tool used by people in daily life. In the process of using the electronic equipment to take a picture, the camera module is required to be installed in the electronic equipment and is used for taking a picture.

In the related art, as shown in fig. 1, the camera module includes a lens module 11, an IR (infrared) filter 12, a holder 13, a sensor 14, and a circuit board 15. The lens module 11 is fixed on the base 13 by an AA (Active Alignment) process dispensing manner, the base 13 is disposed on the first surface of the circuit board 15, the photo sensor chip 14 is disposed on the first surface of the circuit board 15, and a light receiving surface of the photo sensor chip 14 faces the lens module 11. The inner wall of the base 13 is provided with a boss, the infrared filter 12 is arranged on the boss in a manner of dispensing thermosetting adhesive, and the infrared filter 12 is positioned between the lens module 11 and the photosensitive chip 14. After the light passes through the lens, the light can pass through the infrared filter, then the light irradiates on the photosensitive chip, and the photosensitive chip converts the light into an image and transmits the image to the circuit board.

Because the infrared filter is fixed on the boss on the base in a way of spot thermosetting adhesive, in the process that the infrared filter is attached to the boss on the base, the thickness of the adhesive contacting the lower surface of the infrared filter and the boss on the base may be uneven, and therefore, after the infrared filter is attached to the boss on the base, an included angle may exist between the surface of the infrared filter and the surface of the photosensitive chip. After there is the contained angle between the surface of infrared filter and the sensitization chip, can influence the conversion degree that the sensitization chip shifted the position image with light, finally influence the definition of shooing of camera module for user's physical examination is relatively poor.

Disclosure of Invention

In view of this, embodiments of the present invention provide a camera module and an electronic device to solve the problem of the resolution of the camera module due to the included angle between the infrared filter and the photosensitive chip.

In a first aspect, a camera module is provided, which includes a lens module, an infrared filter, a base, a photosensitive chip, a circuit board and an angle adjustment assembly;

the lens module is arranged on the base, the base is arranged on the first surface of the circuit board, the photosensitive chip is arranged on the first surface of the circuit board, and the light receiving surface of the photosensitive chip faces the lens module;

a boss is arranged on the inner wall of the base, the angle adjusting assembly is arranged on the boss, the infrared filter is arranged on the angle adjusting assembly, and the infrared filter is positioned between the lens module and the photosensitive chip;

the circuit board is electrically connected with the angle adjusting assembly, when the circuit board supplies power to the angle adjusting assembly, the angle adjusting assembly deforms, and the included angle between the infrared filter and the photosensitive chip is adjusted.

In a second aspect, an electronic device is provided, where the electronic device includes the camera module of any one of the above first aspects.

In a third aspect, a camera module control method is provided, which is applied to the camera module in any one of the first aspect, and the camera module control method includes:

detecting the target definition of the image converted by the photosensitive chip;

and if the target definition is smaller than the definition threshold value, controlling the circuit board to supply power to the angle adjusting assembly, so that the angle adjusting assembly deforms to adjust the included angle between the infrared filter and the photosensitive chip.

In a fourth aspect, an electronic device is provided, where the electronic device includes a processor, a memory, and a computer program stored in the memory and executable on the processor, and the computer program, when executed by the processor, implements the steps of the camera module control method according to any one of the third aspects.

In a fifth aspect, a computer-readable storage medium is provided, where a computer program is stored on the computer-readable storage medium, and when executed by a processor, the computer program implements the steps of the camera module control method according to any one of the third aspect.

The technical scheme provided by the invention at least has the following beneficial effects:

in the invention, the lens module is arranged on the base, the base is arranged on the first surface of the circuit board, the photosensitive chip is arranged on the first surface of the circuit board, the light receiving surface of the photosensitive chip faces the lens module, the boss is arranged on the inner wall of the base, the angle adjusting component is arranged on the boss, the infrared filter is arranged on the angle adjusting component, the infrared filter is positioned between the lens module and the photosensitive chip, and the circuit board is electrically connected with the angle adjusting component. When there is the contained angle between infrared filter and the sensitization chip, can supply power to the angular adjustment subassembly through the circuit board for the angular adjustment subassembly takes place deformation, takes place after deformation at the angular adjustment subassembly, adjusts the contained angle between infrared filter and the sensitization chip. That is, when the camera module provided by the invention is used, power can be supplied to the angle adjusting assembly through the circuit board to adjust the included angle between the infrared filter and the photosensitive chip, so that the included angle between the infrared filter and the photosensitive chip is smaller than a preset value, the shooting effect of the camera module can be improved, and the user experience is improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments of the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive labor.

Fig. 1 is a schematic view of a camera module according to the related art;

fig. 2 is a schematic view of a camera module according to an embodiment of the present invention;

fig. 3 is a schematic view of another camera module according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of a connecting assembly according to an embodiment of the present invention;

fig. 5 is a schematic view of another camera module according to an embodiment of the present invention;

FIG. 6 is a schematic structural diagram of an angle adjustment assembly according to an embodiment of the present invention;

FIG. 7 is a schematic structural diagram of another angle adjustment assembly provided in an embodiment of the present invention;

fig. 8 is a flowchart illustrating a camera module control method according to an embodiment of the present invention;

fig. 9 is a schematic diagram of a hardware structure of an electronic device according to an embodiment of the present invention.

Reference numerals:

11: a lens module; 12: an infrared filter; 13: a base; 14: a photosensitive chip; 15: a circuit board; 16: an angle adjustment assembly; 17: a connecting assembly; 161: a subassembly; 162: and a connection terminal.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Fig. 2 is a schematic view of a camera module according to an embodiment of the present invention. As shown in fig. 2, the camera module includes a lens module 11, an infrared filter 12, a base 13, a photo sensor chip 14, a circuit board 15 and an angle adjustment assembly 16.

The lens module 11 is disposed on the base 13, the base 13 is disposed on the first surface of the circuit board 15, the light sensing chip 14 is disposed on the first surface of the circuit board 15, and the light receiving surface of the light sensing chip 14 faces the lens module 11. The inner wall of the base 13 is provided with a boss, the angle adjusting assembly 16 is arranged on the boss, the infrared filter 12 is arranged on the angle adjusting assembly 16, and the infrared filter 12 is located between the lens module 11 and the photosensitive chip 14. The circuit board 15 is electrically connected with the angle adjusting assembly 16, and when the circuit board 15 supplies power to the angle adjusting assembly 16, the angle adjusting assembly 16 deforms, and an included angle between the infrared filter 12 and the photosensitive chip 14 is adjusted.

It should be noted that the lens module 11 may be disposed on the base 13 in the following manner: the lens module 11 is disposed on the base 13 by an AA (Active Alignment) process dispensing manner. Of course, the lens module 11 may also be disposed on the base 13 in other manners, and the embodiment of the invention is not limited herein.

The base 13 is disposed on the circuit board 15 in a manner of spot thermosetting adhesive, that is, the base 13 is adhered to the circuit board 15 by thermosetting adhesive. Of course, the base 13 may be disposed on the circuit board 15 in other manners, and the embodiment of the present invention is not limited herein.

The photosensitive chip 14 may be disposed on the first surface of the circuit board 15 in a manner that: the photosensitive chip 14 is disposed on the first surface of the circuit board 15 by conductive glue or conductive double-sided tape. The photo chip 14 may also be soldered to the first surface of the circuit. Of course, the photosensitive chip 14 may be disposed on the first surface of the circuit board 15 in other manners, and the embodiment of the present invention is not limited herein.

The setting mode of the angle adjustment assembly 16 on the boss and the setting mode of the infrared filter 12 on the angle adjustment assembly 16 can be both the mode of point thermosetting adhesive, that is, the angle adjustment assembly is bonded on the boss through thermosetting adhesive, and the infrared filter 12 is bonded on the angle adjustment assembly through thermosetting adhesive.

In addition, the deformation of the angle adjustment assembly 16 means that the angle adjustment assembly 16 extends and contracts along the optical path direction of the lens module 11. The optical path direction of the lens module 11 refers to the propagation direction of the light when the light passes through the lens module 11.

In the embodiment of the present invention, since the lens module 11 is disposed on the base 13, the base 13 is disposed on the first surface of the circuit board 15, the photosensitive chip 14 is disposed on the first surface of the circuit board 15, the light receiving surface of the photosensitive chip 14 faces the lens module 11, a boss is disposed on the inner wall of the base 13, the angle adjusting component 16 is disposed on the boss, the infrared filter 12 is disposed on the angle adjusting component 16, the infrared filter 12 is disposed between the lens module 11 and the photosensitive chip 14, and the circuit board 15 is electrically connected to the angle adjusting component 16, when the light passes through the lens module 11, the light continues to pass through the infrared filter 12, and then the light is converted into an image by the photosensitive chip 14. When an included angle exists between the infrared filter 12 and the photosensitive chip 14, the circuit board 15 can supply power to the angle adjusting assembly 16, so that the angle adjusting assembly 16 deforms, and after the angle adjusting assembly 16 deforms, the included angle between the infrared filter 12 and the photosensitive chip 14 is adjusted. That is, when the camera module provided by the invention is used, power can be supplied to the angle adjusting assembly through the circuit board to adjust the included angle between the infrared filter and the photosensitive chip, so that the included angle between the infrared filter and the photosensitive chip is smaller than a preset value, the shooting effect of the camera module can be improved, and the user experience is improved.

In addition, in some embodiments, the angle adjustment element 16 may be a piezoelectric ceramic plate, and in this case, the deformation of the angle adjustment element 16, i.e., the deformation of the piezoelectric ceramic plate, is changed to extend and retract along the optical path direction of the lens module 11. It should be noted that, after the piezoelectric ceramic piece receives a voltage, the piezoelectric ceramic piece can deform and can be electrified along different directions, so that the piezoelectric ceramic piece deforms along different directions. In the embodiment of the present invention, since the infrared filter 12 is inclined along the optical path direction of the lens module 11, an included angle is generated between the infrared filter 12 and the photosensitive chip 14, so that the deformation of the piezoelectric ceramic piece is extended and contracted along the optical path direction of the lens module 11, during the deformation of the piezoelectric ceramic piece, the infrared filter 12 is subjected to the force of the piezoelectric ceramic, so that the infrared filter 12 moves along the optical path direction of the lens module 11, after the infrared filter 12 moves, the included angle between the infrared filter 12 and the photosensitive chip 14 changes, and by continuously adjusting the voltage, the included angle between the infrared filter 12 and the photosensitive chip 14 can be finally adjusted, so that the included angle is smaller than the preset value.

Of course, the angle adjustment assembly 16 may also be a memory alloy or the like. The material of the angle adjustment assembly 16 is not limited in the embodiments of the present invention.

In addition, to facilitate electrical connection between the angle adjustment assembly 16 and the circuit board 15, in some embodiments, as shown in fig. 3, the camera module may further include a connection assembly 17. A first end of the connecting member 17 is connected to the angle adjusting member 16, and a second end of the connecting member 17 is connected to the circuit board 15.

After the camera module includes the connection assembly 17, the angle adjustment assembly 16 may be directly connected to the circuit board 15 through the connection assembly 17, so as to electrically connect the angle adjustment assembly 16 to the circuit board 15. It should be noted that the angle adjustment assembly 16 may be made of an electrically conductive material. In addition, as shown in fig. 4, the connection assembly 17 may be a plurality of connection members.

In addition, after the camera module includes the connecting component 17, in order to facilitate the connecting component 17 to pass through the base 13 and connect with the angle adjusting component 16, in some embodiments, as shown in fig. 5, a through slot may be formed on the base 13, and one end of the connecting component 17 passes through the through slot and connects with the angle adjusting component 16.

It should be noted that, when the connecting component 17 is connected to the angle adjusting component 16 on the fixed base 13 in an incert molding manner, that is, one end of the connecting component 17 is attached to the edge of the fixed base 13 on the edge of the fixed base 13 along the optical path direction of the lens module 11, and the other end of the connecting component 17 passes through the through slot on the fixed base 13 and then is connected to the angle adjusting component 16. As shown in fig. 4, the connecting member 17 may be bent at this time.

In addition, the connection mode of the electrical connection between the angle adjusting assembly 16 and the circuit Board 15 may be BTB (Board To Board) connection or ITO (Indium tin oxide) conductive layer connection. It should be noted that, in the embodiment of the present invention, the BTB connection may connect the angle adjustment assembly with the circuit board 15 through the BTB connector, and may also connect the angle adjustment assembly with the circuit board 15 through a connection wire. In addition, in the embodiment of the present invention, the connection of the ITO conductive layer means that one end of the ITO conductive layer is connected to the angle adjustment assembly 16, and the other end of the ITO conductive layer is connected to the circuit board 15.

Of course, the connection manner of the electrical connection between the angle adjustment assembly 16 and the circuit board 15 may be other manners, and the embodiment of the invention is not limited herein.

In addition, when an included angle is generated between the infrared filter 12 and the photo sensor chip 14, different portions of the infrared filter 12 may be inclined, so that the infrared filter 12 and the photo sensor chip 14 generate an included angle. The angle adjustment assembly 16 is for adjusting an angle between the infrared filter 12 and the photo sensor chip 14, and therefore, in order to facilitate the adjustment of the angle between the infrared filter 12 and the photo sensor chip 14 by the angle adjustment assembly 16, in some embodiments, as shown in fig. 6, the angle adjustment assembly 16 may include a plurality of sub-assemblies 161, and different sub-assemblies 161 are insulated from each other.

When the angle adjustment assembly 16 includes a plurality of subassemblies 161, the plurality of subassemblies 161 may correspond to a plurality of locations in the edge of the infrared filter 12 after the infrared filter 12 is disposed on the angle adjustment assembly 16. When the infrared filter 12 is inclined, that is, the infrared filter 12 may be inclined at a position on the edge of the infrared filter 12, so that the whole infrared filter 12 is inclined, at this time, the deformation of the plurality of subassemblies 161 can be continuously adjusted, and the position of the edge of the infrared filter 12 in the optical path direction of the lens module 11 is continuously adjusted by adjusting the deformation of the plurality of subassemblies 161, so that the included angle between the infrared filter 12 and the photosensitive chip 14 is finally smaller than the preset value.

To facilitate adjustment of the plurality of sub-assemblies 161 in the angle adjustment assembly 16, in some embodiments, as shown in fig. 6, a plurality of connection terminals 162 may be disposed on the angle adjustment assembly 16, a first end of each connection terminal 162 being electrically connected to one of the sub-assemblies 161 in the angle adjustment assembly 16, and a second end of each connection terminal 162 being used for connecting the circuit board 15.

As shown in fig. 7, a conductive wire may be disposed in each connection terminal, and each connection terminal is connected to the corresponding sub-assembly through the conductive wire.

When a plurality of connection terminals 162 are included on the angle adjustment assembly 16, power may be supplied to each connection terminal 162 such that each connection terminal 162 transmits electricity to a corresponding sub-assembly 161, causing deformation of the different sub-assemblies 161. By electrically connecting the first end of each connection terminal 162 with one sub-assembly 161, power can be supplied to different connection terminals 162, so that different positions of the edge of the infrared filter 12 are adjusted along the optical path of the lens module 11, and finally, the included angle between the infrared filter 12 and the photosensitive chip 14 is smaller than a preset value.

When the angle adjustment assembly 16 includes a plurality of connection terminals 162, in order to facilitate the connection between the connection assembly 17 and the plurality of connection terminals 162, at this time, the connection assembly 17 may include a plurality of connection pins, and the number of the through slots on the fixing base 13 may be greater than or equal to the number of the connection pins. A first end of each connection pin is connected to one of the connection terminals 162, and a second end of each connection pin passes through one of the through slots to be connected to the circuit board 15.

It should be noted that the connection manner of connecting the first end of each connection pin to one connection terminal 162 may be soldering, that is, connecting the first end of each connection pin to one connection terminal 162 by soldering. Specifically, the first end of each connection pin is soldered to the second end of one of the connection terminals 162. Of course, the connection mode of connecting the first end of each connection pin to one connection terminal 162 may be other modes, and the embodiment of the present invention is not limited herein.

The connection mode that the second end of each connection pin passes through one through groove to be connected with the circuit board 15 can refer to the connection mode that the first end of each connection pin is connected with one connection terminal 162, and is not described herein again.

In addition, in some embodiments, as shown in fig. 3, a groove is formed on the first surface of the boss, the groove is close to the inner wall of the base 13, the angle adjusting assembly 16 is disposed on the first surface in a region except the groove, the connection terminal 162 extends to the region where the groove is located, and the first end of the connection pin is welded to the connection terminal 162 in the region where the groove is located.

When the first surface of the boss is provided with the groove, after the first end of the connection pin is welded with the connection terminal 162, and the volume of the welding object is large, a part of the welding object can extend into the groove, so that the welding object is prevented from possibly influencing the angle adjustment assembly 16 due to the large volume.

When the camera module provided by the embodiment of the invention is used, the lens module is arranged on the base, the base is arranged on the first surface of the circuit board, the photosensitive chip is arranged on the first surface of the circuit board, the light receiving surface of the photosensitive chip faces the lens module, the boss is arranged on the inner wall of the base, the angle adjusting assembly comprises a plurality of subassemblies, and the subassemblies are welded with the connecting pins, so that the angle adjusting assembly is electrically connected with the circuit board. Because the infrared filter is arranged on the angle adjusting assembly, namely the infrared filter is arranged on the plurality of subassemblies, after the light rays pass through the lens module, the light rays continuously pass through the infrared filter, and then the light rays are converted into images by the photosensitive chip. When there is the contained angle between infrared filter and the sensitization chip, can supply power to the angular adjustment subassembly through the circuit board, can supply power to a plurality of connecting terminals respectively through a plurality of connecting pins promptly for a plurality of connecting terminals control the subassembly that corresponds respectively and take place deformation, finally make the contained angle between infrared filter and the sensitization chip be less than the default, and then can improve the shooting effect of camera module, improve user experience.

An embodiment of the present invention provides an electronic device, which includes the camera module provided in any one of the above embodiments.

It should be noted that, in the embodiment of the present invention, the electronic device includes, but is not limited to, a smart phone, a notebook computer, a smart watch, and the like.

Fig. 8 is a block diagram illustrating a method for controlling a camera module according to an embodiment of the present invention. As shown in fig. 8, the camera module control method includes:

step 801: and detecting the target definition of the image converted by the photosensitive chip.

When an included angle exists between the infrared filter and the photosensitive chip, in the process of adjusting the included angle between the infrared filter and the photosensitive chip, the infrared filter and the photosensitive chip need to be kept under the same shooting condition, and whether the included angle between the infrared filter and the photosensitive chip is well adjusted or not can be determined after adjustment, otherwise, under different shooting conditions, even if the included angle exists between the infrared filter and the photosensitive chip, whether the included angle between the infrared filter and the photosensitive chip is well adjusted or not can not be determined.

It should be noted that the preset shooting conditions may be in the same environment, and the time difference between different shooting moments is smaller than the time threshold.

Step 802: and if the definition of the target is less than the definition threshold value, the control circuit board supplies power to the angle adjusting assembly, so that the angle adjusting assembly deforms to adjust the included angle between the infrared filter and the photosensitive chip.

The definition threshold may be set by a user, or may be stored in the electronic device when the electronic device leaves a factory, which is not limited herein.

In addition, in the case that the angle adjustment assembly includes a plurality of sub-assemblies, and different sub-assemblies are insulated from each other, in some embodiments, the implementation manner of step 802 may be: the circulation control circuit board is respectively electrified to at least one of the subassemblies, so that the angle adjusting assembly deforms to adjust the included angle between the infrared filter and the photosensitive chip to be smaller than a preset value.

In some embodiments, the implementation manner that the circulation control circuit board respectively energizes at least one of the subassemblies, so that the angle adjustment assembly deforms to adjust an included angle between the infrared filter and the photosensitive chip to be smaller than a preset value may be: determining a power supply voltage according to a difference value between the target definition and the definition threshold value under the condition that the target definition is smaller than the definition threshold value; wherein, the power supply voltage and the deformation degree of the angle adjusting component are in a direct proportion relation. The circulation control circuit board supplies power to at least one subassembly in the subassemblies respectively according to the power supply voltage, so that the angle adjusting assembly deforms to adjust the included angle between the infrared filter and the photosensitive chip to be smaller than a preset value.

Wherein, according to the difference between the target definition and the definition threshold, the implementation manner of determining the supply voltage may be: and determining the deformation degree of the angle adjusting component according to the difference value between the target definition and the definition threshold value. And determining the power supply voltage according to the deformation degree of the angle adjusting component.

Wherein, according to the difference between the target definition and the definition threshold, the implementation manner of determining the deformation degree of the angle adjustment assembly may be: and obtaining a corresponding relation between the difference value between the target definition and the definition threshold value and the deformation degree of the angle adjusting assembly, and searching the deformation degree of the angle adjusting assembly corresponding to the difference value between the target definition and the definition threshold value in the corresponding relation according to the difference value between the target definition and the definition threshold value.

Wherein, the corresponding relation between the difference between the target definition and the definition threshold value and the deformation degree of the angle adjusting component can be as follows: the difference between each object definition and the definition threshold corresponds to a deformation degree.

In addition, according to the deformation degree of the angle adjustment assembly, the implementation mode of determining the power supply voltage may be: and acquiring the corresponding relation between the deformation degree of the angle adjusting assembly and the power supply voltage, and searching the power supply voltage corresponding to the deformation degree of the angle adjusting assembly in the corresponding relation according to the deformation degree of the angle adjusting assembly.

Wherein, the corresponding relation between the deformation degree and the power supply voltage can be as follows: each degree of deformation corresponds to a supply voltage.

In addition, the circulation control circuit board supplies power to at least one subassembly in the subassemblies respectively according to the power supply voltage, so that the angle adjustment assembly deforms to adjust the included angle between the infrared filter and the photosensitive chip to be smaller than a preset value, and the realization mode can be as follows: and sending a first control instruction to the circuit board, wherein the first control instruction is used for indicating the circuit board to supply power to a first sub-assembly of the angle adjusting assembly so as to deform the first sub-assembly of the angle adjusting assembly, and the first sub-assembly is any one of a plurality of sub-assemblies in the angle adjusting assembly. And after sending a first control instruction to the circuit board, detecting the target definition of the image converted by the photosensitive chip, and if the detected target definition of the image converted by the photosensitive chip is greater than or equal to a definition threshold value, keeping the voltage of the control circuit board for supplying power to the first sub-assembly of the angle adjusting assembly unchanged so as to keep the deformation amount of the angle adjusting assembly unchanged.

It should be noted that, when the target definition of the image converted by the photosensitive chip is greater than or equal to the definition threshold, it indicates that the included angle between the infrared filter and the photosensitive chip is smaller than the preset value.

After the first control instruction is sent to the circuit board, the target definition of the image converted by the photosensitive chip is detected again, if the target definition of the image converted by the photosensitive chip detected again is smaller than a definition threshold value, a second control instruction is sent to the circuit board, the second control instruction is used for indicating the circuit board to supply power to a second sub-assembly of the angle adjusting assembly so that the second sub-assembly of the angle adjusting assembly deforms, and the second sub-assembly of the angle adjusting assembly is any one of a plurality of sub-assemblies of the angle adjusting assembly except the first sub-assembly.

And after sending a second control instruction to the circuit board, executing the operation of detecting the target definition of the image converted by the photosensitive chip, and if the target definition of the image converted by the photosensitive chip is smaller than a definition threshold value, executing the operation of sending the control instruction to the circuit board until the target definition of the image converted by the photosensitive chip is detected to be larger than or equal to the definition threshold value, namely until the included angle between the infrared filter and the photosensitive chip is smaller than a preset value.

For example, the angle adjustment assembly comprises 4 subassemblies, namely a subassembly A, a subassembly B, a subassembly C and a subassembly D, after power is supplied to the subassembly A, the subassembly A deforms, an included angle between the infrared filter and the photosensitive chip is adjusted, then the target definition of an image converted by the photosensitive chip is detected, and if the target definition is smaller than a definition threshold value, power is supplied to the subassembly B. And the subassembly B deforms, an included angle between the infrared filter and the photosensitive chip is adjusted, then the target definition of the image converted by the photosensitive chip is detected, and if the target definition is greater than or equal to a definition threshold value, the power supply voltage is kept unchanged, and the subassembly B is continuously supplied with power. If the target definition is smaller than the definition threshold, power is supplied to the subassembly C, the processes are circulated until the target definition of the detected image converted by the photosensitive chip is larger than or equal to the definition threshold after power is supplied, namely, until the included angle between the infrared filter and the photosensitive chip is smaller than a preset value.

In addition, the circulation control circuit board supplies power to at least one subassembly in the subassemblies respectively according to the power supply voltage, and the angle adjustment subassembly takes place to be deformed, adjusts the contained angle between infrared filter and the sensitization chip to make this contained angle be less than the realization mode of default still can be: and sending a first control instruction to the circuit board, wherein the first control instruction is used for indicating the circuit board to supply power to the angle adjustment assembly and the plurality of sub-assemblies corresponding to the first control instruction so as to deform the plurality of sub-assemblies. After the first control instruction is sent to the circuit board, the target definition of the image converted by the photosensitive chip is detected, and if the target definition of the detected image converted by the photosensitive chip is larger than or equal to a definition threshold value, the voltage of the control circuit board for supplying power to a plurality of sub-assemblies corresponding to the first control instruction in the angle adjusting assembly is unchanged, so that the deformation amount of the angle adjusting assembly is unchanged.

And if the target definition of the detected image converted by the photosensitive chip is smaller than the definition threshold, sending a second control instruction to the circuit board, wherein the second control instruction is used for indicating the circuit board to supply power to the angle adjustment assembly and a plurality of sub-assemblies corresponding to the second control instruction so as to deform the plurality of sub-assemblies. And then detecting the target definition of the image converted by the photosensitive chip. And circulating the processes until the target definition of the detected image converted by the photosensitive chip is greater than or equal to the target definition, namely, until the included angle between the infrared filter and the photosensitive chip is less than a preset value.

For example, the angle adjusting assembly comprises 4 subassemblies which are a subassembly E, a subassembly F, a subassembly G and a subassembly H respectively, a first control instruction is sent to the circuit board, the first control instruction corresponds to the subassembly E and the subassembly F, the circuit board supplies power to the subassembly E and the subassembly F, then the subassembly E and the subassembly F deform, and an included angle between the infrared filter and the photosensitive chip is adjusted. Detecting the target definition of the image converted by the photosensitive chip, if the target definition is greater than or equal to the definition threshold, maintaining the voltage, and continuously supplying power to the subassembly E and the subassembly F. And if the definition of the target is smaller than the definition threshold value, sending a second control instruction to the circuit board, wherein the second control instruction corresponds to the subassembly G and the subassembly F, the circuit board supplies power to the subassembly G and the subassembly F, and the included angle between the infrared filter and the photosensitive chip is adjusted after the subassembly G and the subassembly F are deformed. At this time, the target definition of the image converted by the photosensitive chip is detected again, and if the target definition is greater than or equal to the definition threshold, the voltage is kept unchanged, and power is continuously supplied to the subassembly G and the subassembly H. And if the target definition is smaller than the definition threshold value, sending a third control instruction to the circuit board. The above processes are circulated until the target definition of the detected image converted by the photosensitive chip is greater than or equal to the target definition, namely, the included angle between the infrared filter and the photosensitive chip is less than the preset value.

In the embodiment of the invention, the target definition of the image converted by the photosensitive chip is detected. If the target definition is smaller than the definition threshold value, the control circuit board supplies power to the angle adjusting assembly, the angle adjusting assembly deforms, and the included angle between the infrared filter and the photosensitive chip is adjusted, so that the included angle is smaller than the preset value, the shooting effect of the camera module can be improved, and the user experience is improved.

Fig. 9 is a schematic diagram of a hardware structure of an electronic device according to an embodiment of the present invention. As shown in fig. 9, the electronic device 900 includes, but is not limited to: a radio frequency unit 901, a network module 902, an audio output unit 903, an input unit 904, a sensor 905, a display unit 906, a user input unit 907, an interface unit 908, a memory 909, a processor 910, and a power supply 911. Those skilled in the art will appreciate that the electronic device configuration shown in fig. 9 does not constitute a limitation of the electronic device, and that the electronic device may include more or fewer components than shown, or some components may be combined, or a different arrangement of components. In the embodiment of the present invention, the electronic device includes, but is not limited to, a mobile phone, a tablet computer, a notebook computer, a palm computer, a vehicle-mounted terminal, a wearable device, a pedometer, and the like.

And the processor 910 is configured to detect a target definition of the image converted by the photosensitive chip, and if the target definition is smaller than a definition threshold, the control circuit board supplies power to the angle adjustment assembly, so that the angle adjustment assembly deforms, and an included angle between the infrared filter and the photosensitive chip is adjusted.

Because the target definition of the image converted by the photosensitive chip is detected, if the target definition is smaller than the definition threshold value, the control circuit board supplies power to the angle adjusting assembly, the angle adjusting assembly deforms, and the included angle between the infrared filter and the photosensitive chip is adjusted so as to enable the included angle to be smaller than the preset value, therefore, the shooting effect of the camera module can be improved, and the user experience is improved.

It should be understood that, in the embodiment of the present invention, the radio frequency unit 901 may be used for receiving and sending signals during a message transmission and reception process or a call process, and specifically, after receiving downlink data from a base station, the downlink data is processed by the processor 910; in addition, the uplink data is transmitted to the base station. Generally, the radio frequency unit 901 includes, but is not limited to, an antenna, at least one amplifier, a transceiver, a coupler, a low noise amplifier, a duplexer, and the like. In addition, the radio frequency unit 901 can also communicate with a network and other devices through a wireless communication system.

The electronic device provides wireless broadband internet access to the user via the network module 902, such as assisting the user in sending and receiving e-mails, browsing web pages, and accessing streaming media.

The audio output unit 903 may convert audio data received by the radio frequency unit 901 or the network module 902 or stored in the memory 909 into an audio signal and output as sound. Also, the audio output unit 903 may provide audio output related to a specific function performed by the electronic device 900 (e.g., a call signal reception sound, a message reception sound, etc.). The audio output unit 903 includes a speaker, a buzzer, a receiver, and the like.

The input unit 904 is used to receive audio or video signals. The input Unit 904 may include a Graphics Processing Unit (GPU) 9041 and a microphone 9042, and the Graphics processor 9041 processes image data of a still picture or video obtained by an image capturing device (such as a camera) in a video capture mode or an image capture mode. The processed image frames may be displayed on the display unit 906. The image frames processed by the graphic processor 9041 may be stored in the memory 909 (or other storage medium) or transmitted via the radio frequency unit 901 or the network module 902. The microphone 9042 can receive sounds and can process such sounds into audio data. The processed audio data may be converted into a format output transmittable to a mobile communication base station via the radio frequency unit 901 in case of the phone call mode.

The electronic device 900 also includes at least one sensor 905, such as light sensors, motion sensors, and other sensors. Specifically, the light sensor includes an ambient light sensor and a proximity sensor, wherein the ambient light sensor may adjust the brightness of the display panel 9061 according to the brightness of ambient light, and the proximity sensor may turn off the display panel 9061 and/or the backlight when the electronic device 900 is moved to the ear. As one type of motion sensor, an accelerometer sensor can detect the magnitude of acceleration in each direction (generally three axes), detect the magnitude and direction of gravity when stationary, and can be used to identify the posture of an electronic device (such as horizontal and vertical screen switching, related games, magnetometer posture calibration), and vibration identification related functions (such as pedometer, tapping); the sensors 905 may also include a fingerprint sensor, a pressure sensor, an iris sensor, a molecular sensor, a gyroscope, a barometer, a hygrometer, a thermometer, an infrared sensor, etc., which are not described in detail herein.

The display unit 906 is used to display information input by the user or information provided to the user. The Display unit 906 may include a Display panel 9061, and the Display panel 9061 may be configured in the form of a Liquid Crystal Display (LCD), an Organic Light-Emitting Diode (OLED), or the like.

The user input unit 907 may be used to receive input numeric or character information and generate key signal inputs related to user settings and function control of the electronic device. Specifically, the user input unit 907 includes a touch panel 9071 and other input devices 9072. The touch panel 9071, also referred to as a touch screen, may collect touch operations by a user on or near the touch panel 9071 (e.g., operations by a user on or near the touch panel 9071 using a finger, a stylus, or any other suitable object or accessory). The touch panel 9071 may include two parts, a touch detection device and a touch controller. The touch detection device detects the touch direction of a user, detects a signal brought by touch operation and transmits the signal to the touch controller; the touch controller receives touch information from the touch sensing device, converts the touch information into touch point coordinates, sends the touch point coordinates to the processor 910, receives a command from the processor 910, and executes the command. In addition, the touch panel 9071 may be implemented by using various types such as a resistive type, a capacitive type, an infrared ray, and a surface acoustic wave. The user input unit 907 may include other input devices 9072 in addition to the touch panel 9071. Specifically, the other input devices 9072 may include, but are not limited to, a physical keyboard, function keys (such as a volume control key, a switch key, and the like), a track ball, a mouse, and a joystick, which are not described herein again.

Further, the touch panel 9071 may be overlaid on the display panel 9061, and when the touch panel 9071 detects a touch operation on or near the touch panel 9071, the touch panel is transmitted to the processor 910 to determine the type of the touch event, and then the processor 910 provides a corresponding visual output on the display panel 9061 according to the type of the touch event. Although in fig. 9, the touch panel 9071 and the display panel 9061 are two independent components to implement the input and output functions of the electronic device, in some embodiments, the touch panel 9071 and the display panel 9061 may be integrated to implement the input and output functions of the electronic device, which is not limited herein.

The interface unit 908 is an interface for connecting an external device to the electronic apparatus 900. For example, the external device may include a wired or wireless headset port, an external power supply (or battery charger) port, a wired or wireless data port, a memory card port, a port for connecting a device having an identification module, an audio input/output (I/O) port, a video I/O port, an earphone port, and the like. The interface unit 908 may be used to receive input from external devices (e.g., data information, power, etc.) and transmit the received input to one or more elements within the electronic device 900 or may be used to transmit data between the electronic device 900 and external devices.

The memory 909 may be used to store software programs as well as various data. The memory 909 may mainly include a storage program area and a storage data area, wherein the storage program area may store an operating system, an application program required for at least one function (such as a sound playing function, an image playing function, etc.), and the like; the storage data area may store data (such as audio data, a phonebook, etc.) created according to the use of the cellular phone, and the like. Further, the memory 909 may include high-speed random access memory, and may also include non-volatile memory, such as at least one magnetic disk storage device, flash memory device, or other volatile solid-state storage device.

The processor 910 is a control center of the electronic device, connects various parts of the entire electronic device using various interfaces and lines, and performs various functions of the electronic device and processes data by running or executing software programs and/or modules stored in the memory 909 and calling data stored in the memory 909, thereby performing overall monitoring of the electronic device. Processor 910 may include one or more processing units; preferably, the processor 910 may integrate an application processor, which mainly handles operating systems, user interfaces, application programs, etc., and a modem processor, which mainly handles wireless communications. It is to be appreciated that the modem processor described above may not be integrated into processor 910.

The electronic device 900 may further include a power supply 911 (e.g., a battery) for supplying power to various components, and preferably, the power supply 911 may be logically connected to the processor 910 through a power management system, so as to manage charging, discharging, and power consumption management functions through the power management system.

In addition, the electronic device 900 includes some functional modules that are not shown, and thus are not described in detail herein.

Preferably, an embodiment of the present invention further provides an electronic device, where the electronic device includes a processor, a memory, and a computer program stored in the memory and capable of running on the processor, and when the computer program is executed by the processor, the computer program implements each process of the above-mentioned camera module control method embodiment, and can achieve the same technical effect, and in order to avoid repetition, details are not described here again.

An embodiment of the present invention further provides a computer-readable storage medium, where a computer program is stored on the computer-readable storage medium, and when the computer program is executed by a processor, the computer program implements each process of the camera module control method embodiment, and can achieve the same technical effect, and in order to avoid repetition, the computer program is not described herein again. The computer-readable storage medium may be a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk.

It should be noted that, in the present specification, the embodiments are all described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments may be referred to each other.

While preferred embodiments of the present invention have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the embodiments of the invention.

Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in the process, method, article, or terminal equipment comprising the element.

The technical solutions provided by the present invention are described in detail above, and the principle and the implementation of the present invention are explained in this document by applying specific examples, and the descriptions of the above examples are only used to help understanding the method and the core idea of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.

Claims

1. A camera module is characterized by comprising a lens module, an infrared filter, a base, a photosensitive chip, a circuit board and an angle adjusting assembly;

the circuit board is electrically connected with the angle adjusting assembly, when the circuit board supplies power to the angle adjusting assembly, the angle adjusting assembly deforms, and an included angle between the infrared filter and the photosensitive chip is adjusted; the deformation of the angle adjusting component means that the angle adjusting component stretches along the light path direction of the lens module, and the light path direction of the lens module means the transmission direction of light when the light passes through the lens module.

2. The camera module according to claim 1, wherein the angle adjustment component is a piezoelectric ceramic plate, and the deformation of the piezoelectric ceramic plate is telescopic along the optical path direction of the lens module.

3. The camera module of claim 1, further comprising a connection assembly;

the first end of coupling assembling with the angle adjustment subassembly is connected, coupling assembling's second end with the circuit board is connected.

4. The camera module according to claim 3, wherein the base has a through slot, and one end of the connecting member passes through the through slot to connect with the angle adjusting member.

5. The camera module of claim 1, wherein the angular adjustment assembly includes a plurality of sub-assemblies, different sub-assemblies being insulated from one another.

6. The camera module of claim 5, wherein a plurality of connection terminals are disposed on the angle adjustment assembly, a first end of each connection terminal is electrically connected to one of the sub-assemblies in the angle adjustment assembly, and a second end of each connection terminal is used for connecting the circuit board.

7. The camera module according to claim 4, wherein the connecting member is a plurality of connecting pins, and the number of the through slots is greater than or equal to the number of the connecting pins;

the first end of each connecting pin is connected with one connecting terminal, and the second end of each connecting pin penetrates through one through groove to be connected with the circuit board.

8. The camera module according to claim 7, wherein a groove is formed on the first surface of the boss, and the groove is close to the inner wall of the base; the angle adjusting assembly is arranged in an area on the first surface except the groove, the connecting terminal extends to the area where the groove is located, and the first end of the connecting pin is welded with the connecting terminal in the area where the groove is located.

9. An electronic device, characterized in that the electronic device comprises the camera module of any one of claims 1-8.

10. A camera module control method is applied to any one of 1-8, and comprises the following steps:

11. The camera module control method according to claim 10, wherein when the angle adjustment assembly includes a plurality of subassemblies, and different subassemblies are insulated from each other, the circuit board is controlled to supply power to the angle adjustment assembly, so that the angle adjustment assembly deforms to adjust an included angle between the infrared filter and the photosensitive chip, and the method includes:

and circularly controlling the circuit board to electrify at least one of the subassemblies respectively, so that the angle adjusting assembly deforms to adjust the included angle between the infrared filter and the photosensitive chip to be smaller than a preset value.

12. The camera module control method of claim 11, wherein the cyclically controlling the circuit board to respectively energize at least one of the plurality of subassemblies such that the angle adjustment assembly deforms to adjust an included angle between the infrared filter and the photosensitive chip to be less than a predetermined value comprises:

determining a supply voltage according to a difference between the target definition and a definition threshold value when the target definition is smaller than the definition threshold value; the power supply voltage and the deformation degree of the angle adjusting component are in a direct proportion relation;

and circularly controlling the circuit board to respectively supply power to at least one subassembly in the subassemblies according to the power supply voltage, so that the angle adjusting assembly deforms to adjust the included angle between the infrared filter and the photosensitive chip to be smaller than a preset value.

13. An electronic device, characterized in that the electronic device comprises a processor, a memory and a computer program stored on the memory and executable on the processor, the computer program, when executed by the processor, implementing the steps of the camera module control method according to any one of claims 10-12.

14. A computer-readable storage medium, on which a computer program is stored which, when being executed by a processor, carries out the steps of the camera module control method according to any one of claims 10 to 12.