CN114520858B - Optical anti-shake camera module - Google Patents

Optical anti-shake camera module Download PDF

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Publication number
CN114520858B
CN114520858B CN202011303700.XA CN202011303700A CN114520858B CN 114520858 B CN114520858 B CN 114520858B CN 202011303700 A CN202011303700 A CN 202011303700A CN 114520858 B CN114520858 B CN 114520858B
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China
Prior art keywords
driving
corner
lens
fixed end
camera module
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Active
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CN202011303700.XA
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CN114520858A (en
Inventor
吴湖
李剑虹
魏罕钢
刘佳
张琼
黄坚斌
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Ningbo Sunny Opotech Co Ltd
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Ningbo Sunny Opotech Co Ltd
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Application filed by Ningbo Sunny Opotech Co Ltd filed Critical Ningbo Sunny Opotech Co Ltd
Priority to CN202011303700.XA priority Critical patent/CN114520858B/en
Priority to US18/037,005 priority patent/US20240022816A1/en
Priority to CN202180069890.XA priority patent/CN116325774A/en
Priority to EP21893720.9A priority patent/EP4231623A4/en
Priority to PCT/CN2021/127326 priority patent/WO2022105572A1/en
Publication of CN114520858A publication Critical patent/CN114520858A/en
Application granted granted Critical
Publication of CN114520858B publication Critical patent/CN114520858B/en
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules
    • H04N23/68—Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Adjustment Of Camera Lenses (AREA)
  • Studio Devices (AREA)

Abstract

The application relates to an optical anti-shake camera module, which comprises: a lens; a photosensitive assembly having a photosensitive chip; a first driving part adapted to drive the lens to translate in x-axis and y-axis directions; and a second driving part including a second base part and a second movable part, and having four sides, wherein each side is provided with two SMA wires that are staggered with each other, and both ends of each SMA wire are respectively connected to one fixed end of the second base part and one fixed end of the second movable part; each fixed end is positioned at one corner area of the second base part or the second movable part; the photosensitive assembly is fixed on the second movable part, and the second movable part is suitable for driving the photosensitive chip to move on an xoy plane under the driving of the SMA wire; and the lens and the photosensitive chip are configured to be driven simultaneously and move in opposite directions. The application can improve the anti-shake travel and the anti-shake response speed of the camera module with smaller volume cost.

Description

Optical anti-shake camera module
Technical Field
The application relates to the technical field of camera equipment, in particular to an optical anti-shake camera module.
Background
With the increasing demands of consumers for mobile phones, the functions of mobile phone cameras (i.e. camera modules) are becoming more and more abundant, and the functions of portrait shooting, remote shooting, optical zooming, optical anti-shake and the like are integrated into cameras with limited volumes, and the functions of auto focusing, optical anti-shake, optical zooming and the like are often realized by means of optical actuators (sometimes also called motors).
Fig. 1 shows a typical prior art camera module with a motor. Referring to fig. 1, the image pickup module generally includes a lens 1, a motor mechanism 2 (which may be simply referred to as a motor), and a photosensitive assembly 3. In the photographing state, the light from the photographing object is focused on the photosensitive element 3a of the photosensitive assembly 3 through the lens 1. Structurally, the lens 1 is fixed to a motor carrier (specifically shown in fig. 1) of a motor, which is a movable member that normally moves the lens 1 in the optical axis direction by a driving element of the motor to realize a focusing function. For an image capturing module with an optical anti-shake (OIS) function, the motor often has a more complex structure. This is because the motor is required to drive the lens 1 to move in other degrees of freedom (for example, in a direction perpendicular to the optical axis) in addition to the lens to be driven in the optical axis direction to compensate for shake at the time of photographing. In general, the shake of the camera module includes translation (translation in x-axis and y-axis directions) and rotation (rotation in the xoy plane, whose rotation axis direction may be substantially the same as the optical axis) in a direction perpendicular to the optical axis, and tilt shake (rotation about x-axis and y-axis, which is also referred to as tilt shake in the field of camera modules). When the gyroscope (or other position sensing element) in the module detects shake in one direction, a command can be sent to enable the motor to drive the lens to move a distance in the opposite direction, so that shake of the lens is compensated. Generally speaking, the lens is only translated and/or rotated in a direction perpendicular to the optical axis to compensate for the shake of the camera module, because if the lens is rotated around the x and y axes, that is, if the anti-shake effect is achieved by tilt adjustment of the lens, the imaging quality of the module may be degraded, or even the imaging paste may be generated, which makes it difficult to achieve the basic imaging quality requirement.
However, as the imaging quality requirement of the camera module of the mobile phone is higher, the volume and weight of the lens are larger and larger, and the driving force requirement of the motor is also higher and higher. The volume of the camera module is also greatly limited by the current electronic equipment (such as a mobile phone), and the occupied volume of the motor is correspondingly increased along with the increase of the lens. In other words, in the trend of the lens toward larger volume and weight, the driving force provided by the motor is difficult to increase correspondingly. On the premise of limited driving force, the heavier the lens, the shorter the stroke of the motor capable of driving the lens to move, and the anti-shake capability is affected. On the other hand, the heavier the lens, the slower the motor can drive the lens to move, and the longer the lens reaches a predetermined compensation position, which also affects the anti-shake effect.
Therefore, a solution capable of improving the anti-shake stroke and the anti-shake response speed of the camera module is urgently needed.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a solution capable of improving the anti-shake stroke and the anti-shake response speed of an image pickup module.
In order to solve the above technical problems, the present invention provides an optical anti-shake camera module, which includes: a lens; a photosensitive assembly having a photosensitive chip; a first driving part adapted to mount the lens and drive the lens to translate in x-axis and y-axis directions; the second driving part comprises a second base part and a second movable part, the second base part and the second movable part are movably connected through an elastic connecting part, the second driving part is provided with four side surfaces, two mutually staggered SMA wires are arranged on each side surface, and two ends of each SMA wire are respectively connected with one fixed end of the second base part and one fixed end of the second movable part; each fixed end is positioned at one corner area of the second base part or the second movable part; the photosensitive assembly is fixed on the second movable part, and the second movable part is suitable for driving the photosensitive chip to move on an xoy plane under the driving of the SMA wire; and, the lens and the photosensitive chip are configured to be driven simultaneously and move in opposite directions; the x-axis and the y-axis are coordinate axes perpendicular to the optical axis of the camera module, the x-axis and the y-axis are perpendicular to each other, and the xoy plane is a plane formed by the x-axis and the y-axis.
The second driving part is provided with four corner areas, each corner area is provided with two fixed ends, and two ends of each SMA wire are respectively fixed and electrically connected with the fixed ends of two adjacent corner areas.
Wherein, in any one of the corner areas, the two fixed ends are arranged along the optical axis direction. In this case, the two staggered SMA wires are approximately in the xoz or yoz plane (the z-axis is the coordinate axis parallel to the optical axis), i.e. the two fixed ends of the corner area are vertically arranged (e.g. one fixed end is directly above the other fixed end). The z-axis is the coordinate axis parallel to the optical axis. The interleaving of two SMA wires means: the projections of the two SMA wires in the xoz plane or the yoz plane are intersected, but the two SMA wires are not in direct contact, so that the position adjustment accuracy is prevented from being reduced due to mutual interference when the two SMA wires shrink.
Wherein four of the fixed ends of any adjacent two of the corner regions are all located in a plane parallel to the xoy plane. For example, in any one of the corner areas, one fixed end is located outside the other fixed end. Here, the outer side refers to the side facing away from the photosensitive center of the photosensitive chip, and the inner side refers to the side facing toward the photosensitive center of the photosensitive chip.
Wherein the two fixed ends of each corner region comprise a class a fixed end and a class B fixed end, wherein the class a fixed end and the class B fixed end are at different heights; the A-type fixed ends of the two corner areas positioned at opposite angles are positioned at the same height, and the B-type fixed ends of the two corner areas positioned at opposite angles are also positioned at the same height; two SMA wires are arranged on each side face of the second driving part, wherein two ends of each SMA wire are respectively connected with one A-type fixed end and one B-type fixed end located in the adjacent corner area, so that the two SMA wires are mutually staggered.
Wherein, four said class A fixed ends of four said corner areas are at the same height; and four of the class B fixing ends of four of the corner regions are at the same height.
Wherein the four corner regions include a first corner, a second corner, a third corner, and a fourth corner, wherein the first corner and the third corner are located on one diagonal of the second driving part, and the second corner and the fourth corner are located on the other diagonal of the second driving part; the second movable part extends outwards at the first angle and the third angle to form a first extension part and a third extension part; the first epitaxial part is provided with a first A fixed end and a first B fixed end which are positioned at different heights, and the third epitaxial part is provided with a third A fixed end and a third B fixed end which are positioned at different heights; a second A fixed end and a second B fixed end which are positioned at different heights are arranged at the second angular position of the second foundation part; a fourth A fixed end and a fourth B fixed end which are positioned at different heights are arranged at the fourth angle position of the second foundation part; the first A fixed end, the second A fixed end, the third A fixed end and the fourth A fixed end all belong to the A-type fixed ends; the first B fixed end, the second B fixed end, the third B fixed end and the fourth B fixed end all belong to the B-type fixed ends.
The second movable part is further provided with a notch at the second corner and the fourth corner respectively so as to avoid the fixed end arranged on the second base part.
Wherein the A-type fixing end and the B-type fixing end positioned at the same corner area are arranged in a stacked manner, and are isolated by insulating materials.
The second movable part is further suitable for driving the photosensitive chip to move in the direction of rotating around the z axis under the driving of the SMA wire; wherein the z-axis is a coordinate axis parallel to the optical axis.
The second movable part is further suitable for driving the photosensitive chip to move in the direction of translating along the z-axis under the driving of the SMA wire; wherein the z-axis is a coordinate axis parallel to the optical axis.
Wherein the four corner regions include a first corner, a second corner, a third corner, and a fourth corner, wherein the first corner and the third corner are located on a first diagonal of the second driving part, and the second corner and the fourth corner are located on a second diagonal of the second driving part; the second movable part extends outwards at the first angle and the third angle to form a first extension part and a third extension part; two fixed ends of the first corner of the second driving part are arranged on the first extension part, and two fixed ends of the third corner of the second driving part are arranged on the third extension part; two fixed ends of the second corner of the second driving part are arranged at a second corner of the second basic part, and two fixed ends of the fourth corner of the second driving part are arranged at a fourth corner of the second basic part; for each side surface of the second driving part, the two mutually staggered SMA wires arranged on the side surface are fixed and electrically connected to the four fixed ends of the two corner areas positioned on the side surface; wherein a translational component of the photosensitive chip in the direction of the first diagonal or the direction of the second diagonal is generated by driving two pairs of SMA wires of the intersecting two sides of the second driving part to contract; the movement direction of the photosensitive chip on the xoy plane is opposite to the movement direction of the lens by the combination of the translation component of the direction of the first diagonal line and the translation component of the direction of the second diagonal line.
Wherein, through driving two pairs of mutually staggered SMA lines of two opposite sides of the second driving part shrink, the rotation of the photosensitive chip in the Rz direction is generated, the Rz direction is the direction rotating around the z axis, and the z axis is the coordinate axis parallel to the optical axis.
Wherein a rotation component of the photosensitive chip in an Rx or Ry direction is generated by driving a single SMA wire of a single side of the second driving part to contract; where the Rx direction is the direction of rotation about the x-axis and the Ry direction is the direction of rotation about the y-axis.
Wherein, the translation of the photosensitive chip in the z-axis direction is generated by driving the first group of SMA wires and the second group of SMA wires of the second driving part to shrink; and, the translation direction of the photosensitive chip in the z-axis direction is opposite to the translation direction of the lens in the z-axis direction, and the z-axis is a coordinate axis parallel to the optical axis; wherein the first group of SMA wires are two SMA wires with a first common fixed end, and the two SMA wires are respectively positioned at two intersecting sides of the second driving part; the second group of SMA wires are the other two SMA wires with a second common fixed end, and the other two SMA wires are positioned on the other two intersecting side surfaces of the second driving part; and the first public fixed end and the second public fixed end are one of the eight fixed ends of the second driving part, and the first public fixed end and the second public fixed end are positioned at the same height.
Wherein the first driving part includes a first base part and a first movable part, and the second base part is fixed to the first base part.
Wherein the first base portion is located at the periphery of the first movable portion; the second foundation portion comprises a foundation portion side wall and a base, the bottom surface of the foundation portion side wall is connected with the base, and the top surface of the foundation portion side wall is connected with the first foundation portion.
The edge area of the bottom surface of the first foundation portion forms a step-shaped notch, and the side wall of the foundation portion can extend upwards and extend into the step-shaped notch and is connected with the first foundation portion.
The second movable part comprises a movable part main body which is in a flat plate shape and is provided with a light transmission hole in the center; an outer edge region of the bottom surface of the movable portion main body extends downward to form a movable portion side wall.
The photosensitive assembly comprises a photosensitive chip, a circuit board, a lens seat and an optical filter; the light sensing chip is arranged on the upper surface of the circuit board, the lens seat is arranged on the upper surface of the circuit board and surrounds the light sensing chip, and the optical filter is arranged on the lens seat; the bottom surface of the side wall of the movable part is adhered to the upper surface of the circuit board of the photosensitive assembly; an accommodating cavity is formed among the inner side surface of the side wall of the movable part, the bottom surface of the movable part main body, the upper surface of the circuit board and the outer side surface of the mirror base, and an electronic element is arranged in the accommodating cavity.
The edge area of the inner side of the movable part main body is provided with a step-shaped notch facing to the object side so as to avoid part of the structure of the optical lens.
The second base part is fixed on the first driving part and comprises a base part side wall, the base part side wall surrounds the second movable part, and a gap for accommodating the SMA wire is reserved between the base part side wall and the second movable part.
The light sensing assembly comprises a suspension type circuit board, the suspension type circuit board comprises a rigid circuit board main body and a flexible connecting belt, the connecting belt is led out from a first side face and a second side face of the circuit board main body and is bent upwards to form a bent part, the top of the bent part extends along the periphery of the light sensing assembly in the horizontal direction, the connecting belt surrounds the periphery of the first side face, the second side face and the third side face of the light sensing assembly, the connecting belts on the first side face and the second side face are respectively provided with at least one suspension part, and the suspension parts are fixed on the second base part of the second driving part or are fixed with the second base part through intermediaries; the photosensitive assembly is provided with a first side face and a second side face which are consistent with the main body of the circuit board in position, the first side face and the second side face are oppositely arranged, and the third side face is intersected with the first side face and the second side face.
The second base part or the intermediary object is provided with a hook, and the hook hooks the hanging hole.
Wherein, a part section of the connecting belt is attached with a rigid substrate for reinforcement to form the suspension part.
The suspension type circuit board is made of a soft and hard combined board, wherein the circuit board main body and the suspension portion are formed by hard board portions of the soft and hard combined board, and the bending portion and the connecting band section connected between the suspension portions are formed by soft board portions of the soft and hard combined board.
The connecting belt comprises a third connecting belt and a fourth connecting belt, wherein the third connecting belt is led out from the first side surface of the circuit board main body, is bent upwards to form a bending part, then extends along the first side surface of the photosensitive assembly, is bent in the horizontal direction at a corner and continues to extend along the third side surface; the fourth connecting belt is led out from the second side surface of the circuit board main body, is bent upwards to form the other bending part, then extends along the second side surface of the photosensitive assembly, is bent horizontally at a corner and continues to extend along the third side surface; the third connecting band and the fourth connecting band are engaged at the third side face and are conducted with each other.
The camera module further comprises a first connecting belt electrically connected with the first driving part, wherein the first connecting belt is led out from the top area of the first driving part, then is bent downwards, and is connected with the third connecting belt or the fourth connecting belt at the third side face and is conducted.
The camera module further comprises a shell, wherein the inner side surface of the shell is provided with an accommodating groove for accommodating the joint part of the third side surface; wherein the joint is a joint where the first connecting strap, the third connecting strap, and the fourth connecting strap are joined to each other; glue is filled into the accommodating groove so as to fix the first connecting belt, the third connecting belt and the fourth connecting belt on the shell.
The connecting belt positioned on the third side face is also connected with a fifth connecting belt, and the fifth connecting belt is provided with a connector for external connection; the suspension type circuit board is also provided with a fixing part for fixing the fifth connecting belt.
Determining a lens moving distance b for driving the lens to move by the first driving module and a photosensitive chip moving distance c for driving the photosensitive chip to move by the second driving module according to the detected inclined shaking angle a of the camera module; the lens moving distance b, the photosensitive chip moving distance c and the image space focal length f of the camera module satisfy the following conditions: a=arctan (b/f) +arctan (c/f).
The driving structure further comprises a driving logic module, wherein the driving logic module is used for keeping the ratio of the lens moving distance b to the photosensitive chip moving distance c at a preset fixed ratio.
The driving structure further comprises a driving logic module, which is provided with an anti-shake threshold K, wherein the driving logic module is used for keeping the ratio of the lens moving distance b to the photosensitive chip moving distance c at a preset fixed ratio when the inclined shake angle a is smaller than or equal to the anti-shake threshold K, and enabling the photosensitive chip moving distance c to reach the maximum value c of the moving stroke when the inclined shake angle a is larger than the anti-shake threshold K max The lens movement distance b is according to the relation b=tan (a/f) -c max And (5) calculating to obtain the product.
The preset fixed proportion of the lens moving distance and the photosensitive chip moving distance is set according to the weight of the lens, the driving force of the first driving part, the weight of the photosensitive chip or the photosensitive assembly and the driving force of the second driving part, so that the time for the lens and the photosensitive chip to move to respective anti-shake target positions is consistent.
Compared with the prior art, the application has at least one of the following technical effects:
1. The application can improve the anti-shake travel of the camera module, thereby compensating for larger shake of the camera module.
2. The application can improve the anti-shake response speed of the camera module.
3. The optical anti-shake camera module has the advantage of compact structure, and is particularly suitable for miniaturized camera modules.
4. In some embodiments of the present application, the setting may be performed according to factors such as the weight of the lens, the driving force of the first driving portion, the weight of the photosensitive chip (or photosensitive assembly), and the driving force of the second driving portion, so that the time for the lens and the photosensitive chip to move to the respective anti-shake target positions is substantially consistent, thereby obtaining a better anti-shake effect.
5. In some embodiments of the present application, the adjustment of the photosensitive chip in multiple degrees of freedom may be achieved in a smaller space by arranging staggered SMA wires on four sides of the second driving portion.
6. In some embodiments of the present application, the translational component of the photosensitive chip in the direction of the first diagonal or the direction of the second diagonal may be generated by driving the two pairs of SMA wires of the intersecting two sides of the second driving part to contract; the movement direction of the photosensitive chip on the xoy plane is opposite to the movement direction of the lens by the combination of the translation component of the direction of the first diagonal line and the translation component of the direction of the second diagonal line. The design can improve the anti-shake travel and the anti-shake response speed of the camera module with smaller space cost.
7. In some embodiments of the present application, in the second driving part, in any one of the corner areas, the two fixing ends are arranged along the optical axis direction, and this arrangement can effectively use the space of the photosensitive assembly in the height direction (z-axis direction), so that the height of the camera module is not increased; meanwhile, the space in the X-axis and y-axis directions of the camera module can be saved, so that the transverse size of the camera module is reduced.
8. In some embodiments of the present application, the adhesive used for bonding the first base portion and the second base portion is disposed between the step-shaped notch of the first base portion and the top surface of the side wall of the base portion extending into the notch, so as to prevent the problem of the imaging stain of the imaging module caused by the overflow of the AA adhesive.
Drawings
FIG. 1 illustrates a typical prior art camera module with a motor;
FIG. 2 is a schematic cross-sectional view of an image capturing module with anti-shake features according to an embodiment of the present application;
FIG. 3 is a schematic cross-sectional view of an image capturing module with anti-shake function according to another embodiment of the present application;
FIG. 4 is a schematic diagram showing the relationship between the moving distance of the lens and the photosensitive chip and the inclination angle of the module under four different conditions in the application;
FIG. 5 illustrates a schematic cross-sectional view of an imaging module in one embodiment of the application;
FIG. 6 is a schematic cross-sectional view of an image capturing module according to another embodiment of the present application;
FIG. 7 is a schematic cross-sectional view of a camera module according to still another embodiment of the present application;
FIG. 8 is a schematic cross-sectional view of an image capturing module according to still another embodiment of the present application;
FIG. 9a is a schematic perspective view of an imaging module according to an embodiment of the present application;
FIG. 9b illustrates a schematic cross-sectional view of an imaging module in one embodiment of the application;
FIG. 10a is a schematic perspective view of an image capturing module according to another embodiment of the present application;
FIG. 10b is a schematic cross-sectional view of an image capturing module according to another embodiment of the present application;
fig. 11a shows a schematic perspective view of the second driving part shown in fig. 10a and 10 b;
FIG. 11b shows an exploded perspective view of FIG. 11 a;
FIG. 12 illustrates a schematic connection of SMA wires of a second drive portion in one embodiment of the present application;
FIG. 13 is a perspective view of a second drive section and photosensitive assembly according to an embodiment of the present application;
FIG. 14 illustrates an exploded view of a second drive section and photosensitive assembly in one embodiment of the present application;
FIG. 15 is a schematic perspective view of a photosensitive assembly and a suspension circuit board used therein according to an embodiment of the present application;
FIG. 16a is a schematic front view of a suspension board according to an embodiment of the present application after deployment;
FIG. 16b illustrates a back schematic view of a suspension board in one embodiment of the application after deployment;
fig. 17a shows a schematic front view of a suspension board according to another embodiment of the application after being unfolded;
FIG. 17b is a schematic rear view of a suspension board in one embodiment of the application after deployment;
FIG. 18 is an exploded perspective view of a suspension-based camera module according to one embodiment of the present application;
fig. 19 is a schematic perspective view of a camera module with a housing based on a suspension board in an embodiment of the application.
Detailed Description
For a better understanding of the application, various aspects of the application will be described in more detail with reference to the accompanying drawings. It should be understood that the detailed description is merely illustrative of exemplary embodiments of the application and is not intended to limit the scope of the application in any way. Like reference numerals refer to like elements throughout the specification. The expression "and/or" includes any and all combinations of one or more of the associated listed items.
It should be noted that in this specification, the expressions first, second, etc. are only used to distinguish one feature from another feature, and do not represent any limitation of the feature. Accordingly, a first body discussed below may also be referred to as a second body without departing from the teachings of the present application.
In the drawings, the thickness, size and shape of the object have been slightly exaggerated for convenience of explanation. The figures are merely examples and are not drawn to scale.
It will be further understood that the terms "comprises," "comprising," "includes," "including," "having," "containing," and/or "including," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. Furthermore, when a statement such as "at least one of the following" appears after a list of features that are listed, the entire listed feature is modified instead of modifying a separate element in the list. Furthermore, when describing embodiments of the present application, the use of "may" means "one or more embodiments of the present application. Also, the term "exemplary" is intended to refer to an example or illustration.
As used herein, the terms "substantially," "about," and the like are used as terms of a table approximation, not as terms of a table level, and are intended to illustrate inherent deviations in measured or calculated values that would be recognized by one of ordinary skill in the art.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other.
The application is further described below with reference to the drawings and specific embodiments.
Fig. 2 is a schematic cross-sectional view of an image capturing module with anti-shake function according to an embodiment of the present application. Referring to fig. 2, in the present embodiment, the image capturing module includes a lens 10, a photosensitive assembly 20, a first driving portion 30, and a second driving portion 40. Wherein the photosensitive assembly 20 includes a photosensitive chip 21. The first driving part 30 is configured to drive the lens 10 to move in both x and y directions, and the second driving part 40 is configured to drive the photosensitive chip 21 to move in both x and y directions. In this embodiment, the x and y directions are perpendicular to each other and are parallel to the photosensitive surface of the photosensitive element 20. The z direction is parallel to the normal direction of the photosensitive surface. For ease of understanding, a three-dimensional rectangular coordinate system constructed based on the x, y, z directions is also shown in fig. 2. In this embodiment, the control module drives the lens 10 and the photosensitive chip 21 to move in opposite directions at the same time, so as to realize optical anti-shake of the image capturing module. Specifically, the lens 1 and the photosensitive chip 21 are configured to be driven simultaneously and move in opposite directions, for example, the lens 10 is driven to move in the positive x-axis direction, and the photosensitive chip 21 is driven to move in the negative x-axis direction; the lens 10 is driven to move toward the positive y-axis direction, and the photosensitive chip 21 is driven to move toward the negative y-axis direction; or the lens 10 is driven to move in the x-axis and the y-axis while the photosensitive chip 21 is driven to move in the x-axis and the y-axis in the opposite direction to the movement of the lens 10, in other words, when the movement in the x-axis and the y-axis is required to be simultaneously performed, the direction of the displacement vector of the lens 10 and the direction of the displacement vector of the photosensitive chip 21 are opposite in the xoy plane. The camera module generally includes a position sensor for detecting shake of the camera module or a terminal device (i.e., an electronic device, such as a mobile phone, on which the camera module is mounted). When the shake is detected, the position sensor sends a signal to the image pickup module, and the lens 10 and the photosensitive chip 21 are driven to move correspondingly to compensate the shake, so that the purpose of optical shake prevention is achieved. In this embodiment, the lens 10 and the photosensitive chip 21 are configured to move simultaneously, and the movement directions of the lens 10 and the photosensitive chip 21 are opposite, so that a faster response can be achieved, and a better anti-shake effect is achieved. In addition, the anti-shake angle range of the camera module is limited by the suspension system and the driving system, and a relatively large compensation angle range cannot be achieved. In addition, in the present embodiment, by driving the lens 10 or the photosensitive chip 21 to move in opposite directions at the same time, a larger relative movement stroke (for convenience of description, the relative movement stroke may be simply referred to as an anti-shake stroke) is provided between the lens 10 and the photosensitive chip 21 than in the case of driving only the lens 10. In particular, due to the increase of the anti-shake stroke, the embodiment also has a better compensation effect on the tilting shake of the camera module. Further, the moving direction of the anti-shake movement of the present embodiment may be defined in the xoy plane, and the optical axis of the lens 10 or the photosensitive chip 21 does not need to be tilted, so that the problem of image sticking caused by the anti-shake movement is avoided.
Further, in another embodiment of the present application, the photosensitive chip 21 may be further driven by the second driving part 40 to rotate in the xoy plane, so as to implement compensation for shake in the rotation direction of the camera module.
Further, still referring to fig. 2, in one embodiment of the present application, the image capturing module includes a first driving section 30, a lens 10, a second driving section 40, and a photosensitive assembly 20. The lens 10 is mounted on the first driving unit 30. The first driving part 30 may have a cylindrical first motor carrier, which may be a movable part of the first driving part, and the lens is mounted on an inner side surface of the first motor carrier. The first driving part also has a stationary part, or called base part. In this embodiment, the base portion may be implemented as a motor housing. The motor housing may include a base and a cover. The base is provided with a light-passing hole. The movable part is movably connected with the base part. The driving element may be a coil magnet combination, which may be mounted between the movable part and the base part. For example, may be mounted between the first motor carrier and the motor housing. In fact, the first driving part in the present embodiment may directly adopt a common structure of the optical anti-shake motor in the prior art. Further, in the present embodiment, the second driving part 40 may be supported and fixed on the bottom surface of the first driving part 30. The second driving part 40 may also include a base part and a movable part. Wherein the base portion is directly connected with the first driving portion. The movable part is arranged below the base part and is movably connected with the base part. The photosensitive assembly 20 comprises a circuit board 23, a photosensitive chip 21 mounted on the surface of the circuit board, and a lens base 22 surrounding the photosensitive chip 21. The bottom of the lens base 22 may be mounted on the surface of the circuit board 23, and the top surface thereof may be fixed to the movable portion of the second driving portion 40. The center of the lens base 22 has a light-transmitting hole, and a light filter 24 is mounted on the lens base 22 (the light filter 24 can also be regarded as a component of the photosensitive assembly 20). The photosensitive assembly 20 can translate in the x and y directions or rotate in the xoy plane relative to the base portion under the driving of the movable portion of the second driving portion 40. For convenience of description, the base portion of the first driving portion 30 is sometimes referred to herein as a first base portion, the base portion of the second driving portion 40 is referred to as a second base portion, the movable portion of the first driving portion 30 is referred to as a first movable portion, and the movable portion of the second driving portion 40 is referred to as a second movable portion.
Fig. 3 is a schematic cross-sectional view of an image capturing module with anti-shake function according to another embodiment of the present application. In this embodiment, the image capturing module includes a first driving portion 30, a lens 10, a second driving portion 40, and a photosensitive assembly 20. The lens 10 is mounted on the first driving unit 30. The structure and assembly of the first driving part 30 and the lens 10 may be identical to those of the previous embodiment shown in fig. 2, and will not be described again. This embodiment differs from the previous embodiment in that: the second driving part 40 is located inside the photosensitive assembly 20. In this embodiment, the photosensitive assembly 20 includes a circuit board 23, a lens base 22, an optical filter 24, and a photosensitive chip 21. The bottom of the lens base 22 may be mounted on the surface of the circuit board 23, and the top surface thereof may be fixed to the base portion of the first driving portion 30. The center of the lens base 22 has a light-transmitting hole, and a light filter 24 is mounted on the lens base 22. The lens base 22, the optical filter 24 and the circuit board 23 can form a cavity, and the photosensitive chip 21 is located in the cavity 25. In this embodiment, the second driving portion 40 may also be located in the cavity 25. Specifically, the base portion of the second driving portion 40 may be mounted on the surface of the circuit board 23, and the movable portion of the second driving portion 40 may be movably connected to the base portion. The photosensitive chip 21 is mounted on the surface of the movable portion. In this way, the photosensitive chip 21 can translate in the x and y directions or rotate in the xoy plane relative to the base portion under the drive of the movable portion of the second driving portion 40.
The above describes, in connection with two embodiments, different structural implementations of the second driving part of the camera module according to the present application. The method for compensating the inclination shake of the camera module is further introduced based on the design thought of the application.
Fig. 4 is a schematic diagram showing the relationship between the moving distance of the lens and the photosensitive chip and the inclination angle of the module under four different conditions in the present application. In the figure, the position A represents the combination of the moving distance of the lens and the photosensitive chip for compensating the shake angle a of the camera module. As shown in fig. 4, the lens moving distance is b, the moving distance of the photosensitive chip (hereinafter sometimes simply referred to as chip) is c, and the lens or chip moving distance can be equivalent to the angle of the image plane deviating from the optical axis at the time of optical imaging. Specifically, when the translational distance of the lens in the xoy plane is b, an arithmetic relationship is formed between the image plane offset angle α1 and the image distance, the image distance is different at different shooting distances, and the image distance is replaced by the focal length of the image side for the convenience of calculation and expression. Specifically, the relationship between the image plane offset angle α1 and the focal length f of the lens is: tan (α1) =b/f, when the translation distance of the photosensitive chip in the xoy plane is c, the relationship between the image plane offset angle α2 and the focal length f of the lens image space is: tan (α2) =c/f. In this embodiment, the moving directions of the lens and the photosensitive chip are opposite, so the calculation mode of the comprehensive compensation angle a of the camera module is as follows: a=α1+α2=arctan (b/f) +arctan (c/f). In one embodiment, the moving distance of the lens and the photosensitive chip may be set to be the same, i.e., b=c. In another embodiment, the distance the lens moves from the photosensitive chip may be set to be unequal, for example, the distance the lens moves may be greater than the distance the photosensitive chip moves, i.e., b > c. In this embodiment, the second driving portion may select a smaller-sized driver (such as a mems driver, etc., and the movable stroke of such a driver is also relatively small), so as to help the overall miniaturization of the camera module.
Further, in one embodiment of the present application, the ratio of the lens moving distance to the moving distance of the photosensitive chip is optionally set to maintain a fixed ratio, for example, b/c=6:4, b/c=7:3, or b/c=5:5, and the distance between the lens and the moving distance of the photosensitive chip is maintained at the preset ratio no matter what the compensation value (e.g. the integrated compensation angle a) of the shake of the camera module is, which is beneficial to the uniformity of the compensation effect of the camera module in the compensable range and the design difficulty of the driving logic module of the anti-shake system of the camera module is also beneficial to be reduced.
Further, in the configuration in which the lens movement distance and the photosensitive chip movement distance are subjected to anti-shake movement based on a fixed ratio, since the movable range of the photosensitive chip is small, sometimes the shake of the image pickup module may exceed the maximum movement stroke of the photosensitive chip. Thus, in one embodiment of the application, an anti-shake threshold may be set, e.g., forWhen the shake angle a to be compensated is smaller than or equal to the anti-shake threshold K, the lens moving distance b and the photosensitive chip moving distance c are kept in a fixed proportion, and the fixed proportion can be preset, for example, b/c=6:4, b/c=7:3, or b/c=5:5. When the actually calculated shake angle a is greater than the anti-shake threshold K, the moving distance c of the photosensitive chip takes the maximum value of the moving travel, namely the maximum travel c of the photosensitive chip max And lens shift distance b=tan (a/f) -c max . In other words, when the shake angle to be compensated by the camera module is above the anti-shake threshold K, the lens is moved to a maximum value corresponding to the moving distance of the photosensitive chip (i.e. the maximum stroke c of the photosensitive chip max ) After the position of (2), the first driving part can drive the lens to move continuously until the lens moving distance b=tan (a/f) -c max . At the same time, the photosensitive chip moves synchronously to the maximum value c of the moving distance of the photosensitive chip max And then remain stationary.
Further, in another embodiment of the present application, the maximum travel b of the lens movement is in the xoy plane max The corresponding anti-shake angle (the anti-shake angle refers to the angle of inclined shake of the camera module) can be smaller than the maximum stroke c of the photosensitive chip max The corresponding anti-shake angle. Under the design, the anti-shake system of the camera module can have a faster response speed. In high-end lenses, the lenses often have a large number of lenses, for example, the number of lenses in the rear-end main camera lens in the current smart phone can reach 8 lenses, and in order to further improve imaging quality, glass lenses are used in some lenses, which all result in a large lens weight. When the driving force is not significantly increased, the speed at which the driving device drives the lens to move will decrease. The weight of the photosensitive chip or the photosensitive component is relatively light, and the preset position can be reached by a small driving force. Therefore, in the scheme of the embodiment, the advantage that the photosensitive chip or the photosensitive assembly is relatively close in weight and relatively fast in moving speed can be better utilized, and the response speed of the anti-shake system of the camera module is effectively improved.
Further, in another embodiment of the present application, the fixed ratio of the lens moving distance to the moving distance of the photosensitive chip may be set according to factors such as the weight of the lens, the driving force of the first driving portion, the weight of the photosensitive chip (or photosensitive assembly), the driving force of the second driving portion, and the like, and the proper fixed ratio may be set, so that the time for the lens and the photosensitive chip to move to the respective anti-shake target positions may be substantially consistent, thereby obtaining a better anti-shake effect. Specifically, the weight of the lens and the driving force of the first driving part may substantially determine the moving speed of the lens, and the weight of the photosensitive chip (or the photosensitive assembly) and the driving force of the second driving part may substantially determine the moving speed of the photosensitive chip, when the moving speed of the lens is smaller than the moving speed of the photosensitive chip (for example, when the weight of the lens is larger), the moving distance of the photosensitive chip may occupy a larger proportion when the fixed proportion is set, so that the characteristic of the moving speed of the photosensitive chip is higher may be utilized, so that the photosensitive chip moves a longer distance, and the time for the lens and the photosensitive chip to move to respective anti-shake target positions is substantially consistent.
Further, in another embodiment of the present application, the first driving part may employ a driving element having a large driving force, and a suspension system having a large stroke. For example, the first driving portion may be driven by an SMA (shape memory alloy) element. Compared with the traditional coil magnet combination, the SMA element can provide larger driving force with smaller occupied space, so that the first driving part can be designed more compactly, and the miniaturization of the camera module is facilitated.
Further, fig. 5 shows a schematic cross-sectional view of an image capturing module according to an embodiment of the present application. Referring to fig. 5, in the present embodiment, a base portion of the second driving portion 40 is fixed with a base portion (not specifically shown in fig. 5) of the first driving portion 30. The lens 10 may be mounted to a movable part (e.g., a first motor carrier, not specifically shown in fig. 5) of the first driving part 30. The photosensitive assembly 20 includes a circuit board 23, a photosensitive chip 21, a lens base 22, an optical filter 24, and the like. The photosensitive assembly 20 may be mounted to the movable portion 42 of the second driving portion 40. Specifically, the bottom surface of the moving portion 42 may bear against the top surface of the lens holder 22 of the photosensitive assembly 20. In the second driving portion 40, the second base portion 41 and the second movable portion 42 may be elastically connected by a suspension system. In this embodiment, the suspension system allows the second movable portion 42 to translate in the xoy plane with respect to the second base portion 41. Alternatively, the suspension system may be a ball system, which has the advantage that: in the z direction, the second movable portion 42 and the second base portion 41 are brought into contact by balls, the second movable portion 42 moves only in the xoy plane, and movement in the optical axis direction can be prevented by the balls between the second movable portion 42 and the second base portion 41, thereby avoiding an influence on focusing of the camera module.
Alternatively, in another embodiment, the suspension system may comprise a resilient element (e.g. a spring) by which the fixed and movable parts are connected, which allows translation of the movable part relative to the base part in the xoy plane but prevents movement of the movable part relative to the base part outside the xoy plane. The advantage of providing an elastic element compared to a ball system is: the elastic element can provide an initial force between the base part and the movable part, and the initial force can control the moving distance of the movable part or keep the position of the movable part by matching with the driving force of the driving element, so that the position of the movable part can be controlled without additionally providing a driving element for providing conjugate driving force. If a ball system is employed, the movable portion is free to move in the xoy direction relative to the base portion in the case where the driving element does not provide driving force, and therefore it is often necessary to provide at least a pair of driving forces in opposition to each other to control the holding of the movable portion in its initial position.
Further, still referring to fig. 5, in one embodiment of the present application, anti-shake may be achieved by driving the entire photosensitive assembly 20 to move. Meanwhile, the circuit board 23, the photosensitive chip 21, the lens seat 22 and the optical filter 24 are packaged into a whole, the circuit board 23, the lens seat 22 and the optical filter 24 form a closed space, the photosensitive chip 21 is accommodated in the closed space, the sealing performance of the photosensitive assembly 20 is improved, and the imaging of the photosensitive chip 21 in the process of making or using the camera module is not influenced by dust.
In this embodiment, still referring to fig. 5, in an embodiment of the present application, the back surface of the circuit board may directly bear against the terminal device (i.e. the electronic device on which the camera module is mounted, such as a mobile phone), and specifically, the back surface of the circuit board 23 may bear against the motherboard or other bearing member 90 of the terminal device. Although in the present embodiment, the second movable portion 42 is connected to the photosensitive assembly 20 and the second base portion 41 is connected to the first driving portion 30, it is understood that the movement of the second movable portion 42 and the second base portion 41 is opposite. In anti-shake movement, the movement direction is opposite: the direction of movement of the movable part of the first driving part relative to the base part thereof is opposite to the direction of movement of the movable part of the second driving part relative to the base part thereof.
Further, fig. 6 is a schematic cross-sectional view of an image capturing module according to another embodiment of the present application. Referring to fig. 6, in the present embodiment, a rear case 49 is added below the second driving part 40, and the rear case 49 is connected to the second base part 41 of the second driving part 40, and forms a receiving cavity in which the second movable part 42 of the second driving part 40 and the photosensitive member 20 are received. Referring to fig. 6, a gap 49a may be provided between the photosensitive member 20 and the bottom of the rear case 49. That is, the photosensitive assembly 20 is suspended, and the photosensitive assembly 20 is connected to only the second movable portion 42 of the second driving portion 40. In this embodiment, the rear housing 49 is directly supported against the terminal device. Since the rear case 49 connects the terminal device and the second driving part 40 and the base part of the first driving part 30, the movable parts of the first driving part 30 and the second driving part 40 simultaneously drive the lens 10 and the photosensitive member 20 to move in opposite directions, respectively, with the terminal device as a reference during the anti-shake process. Further, in the present embodiment, the second movable portion 42 of the second driving portion 40 is directly adhered to the upper end surface of the photosensitive assembly 20, so that the optical filter 24 is separated from the external space, and therefore, the chips generated by friction or collision of the second movable portion 42 during the movement relative to the second base portion 41 are prevented from directly falling onto the surface of the optical filter 24.
Fig. 7 is a schematic cross-sectional view of an image capturing module according to still another embodiment of the present application. Referring to fig. 7, in the present embodiment, the first driving part 30 is implemented to be adapted to drive the lens 10 to move in the optical axis direction to realize the focusing function, while also being adapted to drive the lens 10 to move in the xoy plane to realize the anti-shake function. Optionally, the first driving portion 30 includes at least two carriers, namely a first carrier 31 and a second carrier 32, the lens 10 is supported by the first carrier 31, a suspension system is disposed between the first carrier 31 and the second carrier 32, and a suspension system is disposed between the second carrier 32 and a housing 33 of the first driving portion 30. The suspension system between the first carrier 31 and the second carrier 32 (i.e., the first suspension system) in this embodiment is configured as a ball system, and the suspension system between the second carrier 32 and the housing 33 (i.e., the second suspension system) is a suspension system based on elastic elements (e.g., spring plates). In the present embodiment, the second suspension system is provided outside the first suspension system, the first suspension system allows the lens 10 and the first carrier 31 to translate in the xoy plane to realize the anti-shake function, and the second suspension system allows the lens 10, the first carrier 31, and the second carrier 32 to integrally move in the optical axis direction to realize the focusing function. Alternatively, in another embodiment, the second suspension system may also be arranged inside the first suspension system. In another variant embodiment, the second suspension system may also be arranged below the first suspension system. In this embodiment, the suspension system is a system in which two members are movably connected, and the degree of freedom (i.e., the moving direction) of relative movement of the two members is limited. These two articulating components may be referred to as a base portion and a movable portion, respectively. Typically, the suspension system is used in conjunction with a drive element (e.g., an SMA element or coil magnet combination). Wherein a driving force is provided by the driving element, under which driving force the movable part is moved relative to the base part in a movement direction defined by the suspension system.
Further, fig. 8 is a schematic cross-sectional view of an image capturing module according to still another embodiment of the present application. Referring to fig. 8, the movable portion of the second driving portion 40 of the present embodiment may be provided with a downward extending arm 42a, and the extending arm 42a is adhered to the circuit board 23 of the photosensitive assembly 20. The extension arm 42a may be provided with an FPC board 42b, and the FPC board 42b may be directly soldered to the circuit board 23, thereby electrically conducting the driving element mounted on the movable portion and the circuit board 23. The embodiment can avoid the glue water flowing onto the optical filter when the photosensitive assembly 20 is adhered to the movable part, thereby influencing imaging. In addition, in the present embodiment, the upper end surface (i.e. the top end) of the photosensitive member 20 and the second driving portion 40 have a gap, so that the color filter can be prevented from being scratched or broken.
Further, in some embodiments of the application, SMA elements may be employed to provide a driving force to the second drive portion, thereby effecting controlled movement of the second movable portion relative to the second base portion. Generally speaking, SMA elements may provide a greater driving force with a smaller footprint. The second driving part of the SMA drive will be described below with reference to the accompanying drawings and an embodiment based on eight SMA wires.
Fig. 9a shows a schematic perspective view of an imaging module in a cut-away view according to an embodiment of the application. Referring to fig. 9a, in the present embodiment, the center of the first driving part has a receiving hole 30a adapted to the outer side surface of the optical lens 10 so that the optical lens 10 is mounted in the receiving hole 30 a. The second driving part 40 is located below the first driving part 30. The second driving part 40 includes a second base part 41 and a second movable part 42. In this embodiment, the second base portion 41 may be a ring-shaped frame structure. Specifically, the frame structure may be constituted by an annular base side wall 41a, and the base side wall 41a may surround the second movable portion 42. The top surface of the base portion sidewall 41a may be bonded to the first driving portion 30 by the second adhesive 23b to fix the second driving portion 40 to the first driving portion 30. Note that fig. 9a only shows the overall shape of the first driving part 30, and the first base part and the first movable part are not shown. Generally, the first base portion is located at the periphery of the first movable portion. In this embodiment, the edge region of the bottom surface of the first driving part (i.e., the edge region of the bottom surface of the first base part) may form the stepped notch 33, and the base side wall 41a of the second base part 41 may extend upward and into the stepped notch 33. This design may provide increased structural strength to the second base portion 41 for more reliable mounting of the SMA wire and its suspended second movable portion 42 and photosensitive assembly 20. Further, this design also improves the connection rigidity of the second base portion 41 and the first drive portion 30, so that the movement of the second movable portion 42 is more stable and the accuracy is higher. Further, fig. 9b shows a schematic cross-sectional view of an imaging module according to an embodiment of the application. Referring to fig. 9a and 9b in combination, in the present embodiment, the bottom surface of the second movable portion 42 may be bonded to the circuit board 23 of the photosensitive assembly 20 by the first adhesive material 23a, so as to fix the photosensitive assembly 20 and the second movable portion 42 together. The outer side surface of the second movable portion 42 has a clearance from the inner side surface of the second base portion 41 (i.e., the inner side surface of the base portion side wall 41 a), which clearance can be used for accommodating the SMA wire 48 and for accommodating the elastic piece 47 supporting the second movable portion. Specifically, the second base portion 41 and the second movable portion 42 may be movably connected by a spring piece 47 (the spring piece may be replaced by another elastic connecting portion). And the SMA wire may be connected between the second base portion 41 and the second movable portion 42 and provide a driving force for movement of the second movable portion 42.
Further still referring to fig. 9b, in one embodiment of the present application, the second movable portion 42 may include a movable portion body 42a, and the movable portion body 42a is substantially flat plate-shaped and has a through hole (i.e., a light passing hole) at the center thereof so as to pass light for imaging. The outer edge region of the bottom surface of the movable portion main body 42a extends downward to form a movable portion side wall 42b, and the bottom surface of the movable portion side wall 42b is bonded to the upper surface of the wiring board 23. An accommodating chamber is formed between the inner side surface of the movable portion side wall 42b, the bottom surface of the movable portion main body 42a, the upper surface of the wiring board 23, and the outer side surface of the lens holder 22, and can be used for disposing the electronic component 29. The electronic component 29 comprises a resistor, a capacitor, etc. These electronic components 29 may together with wiring in the wiring board 23 constitute a wiring board circuit.
Further, still referring to fig. 9b, in one embodiment of the present application, the inner edge of the movable part body has a step-shaped notch 43 so as to avoid the optical lens 10, so that the optical lens 10 can have a larger movement range (i.e. a larger focusing stroke or an anti-shake stroke).
Further, fig. 10a is a schematic perspective view of an image capturing module according to another embodiment of the present application. Fig. 10b shows a schematic cross-sectional view of an image capturing module according to another embodiment of the present application. Referring to fig. 10a and 10b in combination, in this embodiment, the second base portion includes a base portion sidewall 41a and a base 41b. The base 41b is substantially flat, and the center of the flat base 41b has a through hole to avoid the imaging optical path. In this embodiment, the base 41b may be located above the second movable portion 42. The base 41b and the base side wall 41a may be integrally formed. The base portion side wall 41a may surround the second movable portion 42. The top surface of the base portion sidewall 41a may be bonded to the first base portion to fix the second driving portion 40 and the first driving portion 30 together.
Further, fig. 11a shows a schematic perspective view of the second driving part shown in fig. 10a and 10 b. Fig. 11 is a schematic diagram showing the second movable portion 42 turned upside down, and is disposed above the base 41b, so that the detailed structure of the second movable portion can be more easily observed. In fig. 10a and 10b, the second movable portion 42 is located below the base 41b. Fig. 11b shows an exploded perspective view of fig. 11 a. Fig. 12 shows a schematic connection of SMA wires of the second driving part in an embodiment of the application. Referring to fig. 11a, 11b and 12, in one embodiment of the present application, the second driving part 40 includes eight SMA wires 48, and the eight SMA wires 48 may be fixed to eight fixed ends located at the second base part 41 and the second movable part 42, respectively. Specifically, the second driving portion 40 has a substantially rectangular outer contour in a plan view, and four corner regions of the rectangular outer contour may be referred to as a first corner 51, a second corner 52, a third corner 53, and a fourth corner 54, respectively. Wherein the first corner 51 and the third corner 53 are located on one diagonal AX1 and the second corner 52 and the fourth corner 53 are located on the other diagonal AX2 (see fig. 12 in combination). In this embodiment, the movable portion main body 42a of the second movable portion 42 may extend outwardly at the first corner 51 and the third corner 53, respectively, to form a first extension 51a and a third extension 53a. The first extension portion 51a may be provided with a first a-fixing end 1a and a first B-fixing end 1B, where the first B-fixing end 1B may be mounted or formed on an upper surface of the first extension portion 51a (formed in an integrally formed manner, which will not be described later), the first a-fixing end 1a may be located above the first B-fixing end 1B, and the first a-fixing end 1a and the first B-fixing end 1B may be isolated by an insulating material to prevent a short circuit of a circuit for driving the SMA wire to operate. Similarly, the third extension portion 53a may be provided with a third a-fixing end 3a and a third B-fixing end 3B, wherein the third B-fixing end 3B may be mounted or formed on an upper surface of the third extension portion 53a, the third a-fixing end 3a may be located above the third B-fixing end 3B, and the third a-fixing end 3a and the third B-fixing end 3B may be separated by an insulating material to prevent a short circuit of a circuit for driving the SMA wire to operate. Further, the movable part body 42a may further be provided with a notch at the positions of the second corner 52 and the fourth corner 54 to avoid the functional structure of the second base part 41 at the second corner 52 and the fourth corner 54. Here, the functional structures of the second base portion 41 at the second corner 52 and the fourth corner 54 mean the second a-fixed end 2a, the second B-fixed end 2B, the fourth a-fixed end 4a, and the fourth B-fixed end 4B located in the second base portion 41. Specifically, a second a-fixing end 2a and a second B-fixing end 2B may be provided at the position of the second corner 52 of the second base 41, wherein the second B-fixing end 2B may be mounted or formed on the upper surface of the second corner 52 region of the base 41B, the second a-fixing end 2a may be located above the second B-fixing end 2B, and the second a-fixing end 2a and the second B-fixing end 2B may be separated by an insulating material. The fourth a-fixing end 4a and the fourth B-fixing end 4B may be provided at the positions of the fourth corners 54 of the second base part 41, wherein the fourth B-fixing end 4B may be mounted or formed on the upper surface of the fourth corner 54 region of the base 41B, the fourth a-fixing end 4a may be located above the fourth B-fixing end 4B, and the fourth a-fixing end 4a and the fourth B-fixing end 4B may be separated by an insulating material. Note that in this natural section, the upper and lower are based on fig. 11a, 11b and 12, which are inverted, that is, the lower is the object. Whereas in fig. 10a and 10b the two directions above and below are to be interchanged, i.e. in fig. 10a and 10b the above is the object side. Further, in this embodiment, eight SMA wires are respectively fixed between the above eight fixed ends. The first A fixed end is connected to the fourth B fixed end through an SMA wire, and the SMA wire is marked as a 1a-4B wire for convenience of description; the first B fixed end is connected to the fourth A fixed end through an SMA wire, and for convenience of description, the SMA wire is denoted as a 1B-4a wire; the first A fixed end is connected to the second B fixed end through an SMA wire, and the SMA wire is marked as a 1a-2B wire for convenience of description; the first B fixed end is connected to the second A fixed end through an SMA wire, and for convenience of description, the SMA wire is denoted as a 1B-2a wire; the second A fixed end is connected to the third B fixed end through an SMA wire, and for convenience of description, the SMA wire is denoted as a 2a-3B wire; the second B fixed end is connected to the third A fixed end through an SMA wire, and for convenience of description, the SMA wire is denoted as a 2B-3a wire; the third A fixed end is connected to the fourth B fixed end through an SMA wire, and for convenience of description, the SMA wire is denoted as a 3a-4B wire; the third B-fixed end is connected to the fourth A-fixed end by an SMA wire, which is denoted as 3B-4a wire for ease of description. In fig. 11a, 11b and 12, only two SMA wires, namely 1a-4b wires and 1b-4a wires, are shown to avoid obscuring. All eight SMA wires are shown in fig. 12. Referring to fig. 11 and 12, in the present embodiment, two staggered SMA wires are disposed on each of four sides of the second driving part, and by selectively applying electric current to all or part of the SMA wires, all or part of the SMA wires can be contracted, thereby driving the second movable part to move in a set degree of freedom.
In particular, the manner in which the second movable portion is driven to move may include translational drive in the xoy plane, rz degree of freedom drive, tilt drive (i.e., rx and Ry degree of freedom drive), and z-axis translational drive. In this embodiment, the fixing ends located at four corners are both mechanically connected fixing ends of the SMA wires and electrically connected connecting terminals of the SMA wires. SMA is an english abbreviation of shape memory alloy, and after the electric current is passed through the SMA wire, the SMA wire can shrink under the effect of shape memory alloy effect, and then plays the effect of driving the second movable part to move. The larger the amount of current passed, the greater the amount of contraction of the SMA wire. The current flowing through the SMA wire may also be referred to as the drive current of the SMA wire. Based on the driving principle, the following description will be made on the four driving modes respectively.
Translational drive in the xoy plane: when the lines 1a-2b and 1b-2a shrink synchronously (the shrinkage amounts of the lines may be the same) and the lines 1a-4b and 1b-4a shrink synchronously (the shrinkage amounts of the lines may be the same), the second movable portion 42 may be driven to translate along the first diagonal AX1 on the xoy plane; when the 1a-2b and 1b-2a lines are contracted synchronously (the contraction amounts may be the same) and the 2a-3b and 2b-3a lines are contracted synchronously (the contraction amounts may be the same), the second movable portion 42 may be driven to translate along the second diagonal AX2 on the xoy plane. In this embodiment, the first diagonal AX1 and the second diagonal AX2 may be translated to be perpendicular to each other, so that the direction of the first diagonal AX1 and the direction of the second diagonal AX2 form two components of the displacement vector on the xoy plane, and by controlling the magnitudes of the two components, the displacement vector in any direction on the xoy plane may be constructed. When the first driving part drives the lens to translate in the x-axis and y-axis directions, the x-axis component and the y-axis component of the translational motion determine the moving direction of the lens in the xoy plane, which will be referred to as a first direction for convenience of description. By controlling the magnitudes of the components of the photosensitive chip in the direction of the first diagonal AX1 and the direction of the second diagonal AX2, the component can be configured as a vector in a second direction opposite to the first direction, so that the photosensitive chip can move in a direction opposite to the lens translation direction (i.e., the second direction) on the xoy plane.
It should be noted that, in the present application, the SMA wire combination driving for realizing the translational driving of the photosensitive chip on the xoy plane is not limited to the above driving manner. For example, translation in the direction of the first diagonal AX1 may also be achieved by driving the simultaneous contraction of the lines 2a-3b and 2b-3a (which may be the same amount) and the simultaneous contraction of the lines 3a-4b and 4a-3b (which may be the same amount); translation in the direction of the second diagonal AX2 is achieved by simultaneous contraction of lines 1a-4b and 1b-4a (both contraction amounts may be the same) and simultaneous contraction of lines 3a-4b and 4a-3b (both contraction amounts may be the same). In summary, when four SMA wires on two adjacent sides of the second driving part shrink synchronously, a translation in one diagonal direction is achieved. Meanwhile, the translation in two diagonal directions is driven, and displacement vectors in any direction on the xoy plane can be constructed through different linear combinations of translation amounts in the two diagonal directions, so that the moving direction of the photosensitive chip on the xoy plane is opposite to the moving direction of the lens on the xoy plane.
Rz degree of freedom drive: the 1a-2b and 1b-2a wires are synchronously contracted (the contraction amounts thereof may be the same), and the 3a-4b and 3b-4a wires are synchronously contracted (the contraction amounts thereof may be the same), the second movable portion may be driven to rotate in the xoy plane with respect to the second base portion, i.e., rotate about the z axis, while the other four wires are driven, i.e., the 2a-3b and 2b-3a wires are synchronously contracted (the contraction amounts thereof may be the same), and the 1a-4b and 1b-4a wires are synchronously contracted (the contraction amounts thereof may be the same), the movable portion may be driven to rotate about the z axis in opposite directions with respect to the second base portion. For example, assuming that the second movable portion rotates clockwise about the z-axis with respect to the second base portion when the previous group of SMA wires is energized, the second movable portion rotates counterclockwise about the z-axis with respect to the second base portion when the next group of SMA wires is energized. The former group of SMA wires refers to 1a-2b wires, 1b-2a wires, 3a-4b wires and 3b-4a wires, while the latter group of SMA wires refers to 1a-4b wires, 1b-4a wires, 2a-3b wires and 2b-3a wires.
Tilt drive: the tilt drive may also be referred to as tilt drive, i.e. drive in two rotational degrees of freedom, rx and Ry. When the lines 1a-2b are energized and contracted, the second movable portion may rotate in the Ry direction, i.e., about the y-axis, relative to the second base portion. When the lines 1a-4b are energized and contracted, the second movable portion may rotate in the Rx direction with respect to the second base portion, i.e., about the x axis. The 1a-2b wires and the 1a-4b wires can be simultaneously electrified and contracted, and the contraction amounts of the 1a-2b wires and the 1a-4b wires can be the same or different. By applying currents of different magnitudes, the amounts of contraction of the lines 1a-2b and 1a-4b can be changed, so that the displacement vector of the second movable portion (i.e., the displacement vector of the photo-sensing chip) has Rx and Ry components of different magnitudes. In this embodiment, the inclination driving of the second driving portion may be performed by SMA wire combination driving to adjust the inclination angle (tilt) of the photosensitive chip, so as to compensate the image plane inclination of the camera module, and further improve the imaging quality.
z-axis translational drive: when the four sma wires of the 1a-2b wire, the 1a-4b wire, the 2b-3a wire and the 3a-4b wire are contracted simultaneously and the contraction amount is the same, the second movable part can be driven to translate relative to the second base part in the z-axis direction, and the translation of the second movable part in the z-axis direction can be combined with the translation freedom degree of the first driving part in the z-axis direction, so that the focusing speed of the camera module is improved and the focusing range is enlarged. Specifically, during focusing, the first driving part can drive the optical lens to move along the z-axis, and the second driving part can drive the photosensitive assembly to move along the z-axis in a direction opposite to the direction of lens movement, so that the focusing speed is increased, and on the other hand, the moving stroke of the relative movement of the optical lens and the photosensitive chip in the z-axis direction can be increased, so that the focusing range of the camera module is enlarged.
Implementations of translational drives, rz degree of freedom drives, tilt drives (i.e., rx and Ry degree of freedom drives), and z-axis translational drives in the xoy plane are described above in connection with one particular embodiment. It should be noted that the implementation of the present application is not limited to the above-described embodiments. More generally, in some embodiments of the application, the second driving part has a substantially rectangular shape, and four corner regions thereof include a first corner, a second corner, a third corner, and a fourth corner, wherein the first corner and the third corner are located on a first diagonal of the second driving part, and the second corner and the fourth corner are located on a second diagonal of the second driving part. The second movable portion extends outwardly at the first corner and the third corner position, respectively, forming a first extension and a third extension. The two fixed ends of the first corner of the second driving part are arranged on the first extension part, and the two fixed ends of the third corner of the second driving part are arranged on the third extension part. The two fixed ends of the second angle of the second driving part are arranged at the second angle of the second basic part, and the two fixed ends of the fourth angle of the second driving part are arranged at the fourth angle of the second basic part. For each side surface of the second driving part, the two SMA wires which are arranged on the side surface and are staggered with each other are fixed and electrically connected to the four fixed ends of the two corner areas on the side surface.
Wherein in some embodiments, for a degree of freedom of movement of translation in an xoy plane, a translational component of the photosensitive chip in the direction of the first diagonal or the direction of the second diagonal may be generated by driving two pairs of the mutually staggered SMA wires of the intersecting two sides of the second driving part to contract; the movement direction of the photosensitive chip on the xoy plane is opposite to the movement direction of the lens by the combination of the translation component of the direction of the first diagonal line and the translation component of the direction of the second diagonal line. By grouping the two intersecting sides into one group, four groups can be generalized, and two pairs (four in total) of the SMA wires of any one group of sides shrink, or a translational component of the photosensitive chip in the direction of the first diagonal line can be generated, or a translational component of the photosensitive chip in the direction of the second diagonal line can be generated. All mutually staggered SMA wires of at least two groups of sides generating translation components in different diagonal directions are contracted (contraction amounts corresponding to the different translation components may be different), i.e. the translation components in the direction of the first diagonal and the translation components in the direction of the second diagonal may be combined into a translation direction of any angle of the photosensitive chip on the xoy plane.
Further, in some embodiments, for Rz degree of freedom driving, rotation of the photosensitive chip in an Rz direction, which is a direction of rotation about a z-axis, which is a coordinate axis parallel to the optical axis, may be generated by driving two pairs of the mutually staggered SMA wires on opposite sides of the second driving portion to contract.
Further, in some embodiments, the tilting drive may generate a rotational component of the photosensitive chip in the Rx or Ry direction by driving a single SMA wire of a single side of the second driving part to contract; where the Rx direction is the direction of rotation about the x-axis and the Ry direction is the direction of rotation about the y-axis.
Further, in some embodiments, for translational actuation in the z-axis direction, translation of the photosensitive chip in the z-axis direction may be generated by actuating contraction of the first and second groups of SMA wires of the second actuation portion; and, the translation direction of the photosensitive chip in the z-axis direction is opposite to the translation direction of the lens in the z-axis direction, and the z-axis is a coordinate axis parallel to the optical axis; wherein the first group of SMA wires are two SMA wires with a first common fixed end, and the two SMA wires are respectively positioned at two intersecting sides of the second driving part; the second group of SMA wires are the other two SMA wires with a second common fixed end, and the other two SMA wires are positioned on the other two intersecting side surfaces of the second driving part; and the first public fixed end and the second public fixed end are one of the eight fixed ends of the second driving part, and the first public fixed end and the second public fixed end are positioned at the same height.
It should be noted that when tilt adjustment is not required, the four type a fixing ends described above may be at different heights, and the four type B fixing ends may be at different heights. For example, when the second driving portion only needs to perform translation in the xoy plane, it is only necessary that two type a fixing ends on the same diagonal be at the same height and two type B fixing ends on the same diagonal be at the same height. Specifically, the class A fixed ends of the first angle and the third angle are at the same height, and the class A fixed ends of the second angle and the fourth angle are at the same height. The two class a fixed ends of adjacent corner areas (i.e., two corner areas not on the same diagonal) may not be on the same height, and the two class B fixed ends of adjacent corner areas (i.e., two corner areas not on the same diagonal) may not be on the same height.
Note that, in the above embodiment, the eight fixed ends are each set as follows: in any one of the corner regions, the two fixed ends are arranged along the optical axis direction. In this case, the two staggered SMA wires are approximately in the xoz or yoz plane (the z-axis is the coordinate axis parallel to the optical axis), i.e. the two fixed ends of the corner area are vertically arranged (e.g. one fixed end is directly above the other fixed end). Herein, two SMA wires are staggered to refer to: the projections of the two SMA wires on the xoz plane or the yoz plane are crossed, but the two SMA wires are not in direct contact (slightly staggered and can be prevented from being in direct contact) in actual manufacturing, so that the reduction of the accuracy of position adjustment caused by mutual interference when the two SMA wires shrink is avoided.
Wherein four of the fixed ends of any adjacent two of the corner regions are all located in a plane parallel to the xoy plane. For example, in any one of the corner areas, one fixed end is located outside the other fixed end. Here, the outer side refers to the side facing away from the photosensitive center of the photosensitive chip, and the inner side refers to the side facing toward the photosensitive center of the photosensitive chip. ). The arrangement mode can effectively utilize the space of the photosensitive assembly in the height direction (z-axis direction), so that the height of the camera module is not increased. Meanwhile, the space in the X-axis and y-axis directions of the camera module can be saved, so that the transverse size of the camera module is reduced. That is, the photosensitive chip is adjustable in a plurality of degrees of freedom of movement at a small cost of volume. However, it should be noted that the arrangement of the eight fixed ends in the present application is not limited thereto. In other embodiments of the present application, the eight fixed ends may also be arranged as follows: four of the fixed ends of any adjacent two of the corner regions are all located in a plane parallel to the xoy plane.
In some embodiments of the present application, the lens and the first driving part may be assembled into a first assembly, the photosensitive member and the second driving part may be assembled into a second assembly, and then the first assembly and the second assembly may be bonded based on an active calibration process (AA process).
Further, in one embodiment of the application, the glue material bonded in the AA process may be arranged between the second base part and the first base part. Specifically, referring to fig. 9a and 9b in combination, in the present embodiment, a stepped notch 33 may be formed in an edge region of the bottom surface of the first driving part (i.e., an edge region of the bottom surface of the first base part), and the base part sidewall 41a of the second base part 41 may extend upward and into the stepped notch 33. A glue material that adheres the first combination and the second combination may be disposed between the stepped notch 33 and the top surface of the base portion side wall 41 a. This design helps prevent the AA glue from spilling over and contaminating the imaging light path (the AA process may require a larger amount of glue for bonding, and thus there may be a risk of spilling over the glue dispensing location), thereby preventing the problem of smearing of the image taken by the camera module.
Further, in one embodiment of the present application, the second base part may include a base 41b and a base part sidewall 41a, and the second movable part 42 may be located under the base (refer to fig. 10a and 10 b). Under this design, when adopting AA technology to bond first assembly and second assembly, the sensitization subassembly 20 that second movable part 42 was installed in second movable part 42 can be protected by base 41b to help preventing AA glue material from spilling over and polluting the imaging light path, and then prevent the problem that the module of making a video recording took a photograph and appear the stain. In addition, in the present embodiment, the adhesive material for adhering the first assembly (the first base portion) and the second assembly (the second base portion) may also be disposed between the step-shaped notch 33 and the top surface of the base portion sidewall 41a, so as to further prevent the problem of the photographing stain of the photographing module caused by the overflow of the AA adhesive material.
Further, in some embodiments of the present application, the eight fixing ends for mounting eight SMA wires may be mounted on a surface of the base, or may be mounted on an inner side surface of the sidewall of the base.
Further, in the camera module, the circuit board of the photosensitive assembly generally includes a rigid circuit board body and a flexible connection strap, one end of which is connected to the circuit board body, and the other end of which is connected to and conducts with a motherboard or other member of the electronic device through a connector. In the prior art, the flexible connecting belt of the photosensitive assembly is usually led out from the side surface of the main body of the circuit board, and the flexible connecting belt is approximately parallel to the surface of the column body of the circuit board. In this arrangement, the flexible connection strip may generate a large resistance to the movement of the circuit board main body, which may increase the force required to drive the circuit board main body to move, resulting in insufficient stroke of anti-shake compensation and a decrease in response speed. Also, the resistance caused by the connection belt is irregular, which makes it difficult for the second driving portion to compensate for the resistance, possibly causing a decrease in the accuracy of the anti-shake compensation. Therefore, the present embodiment provides a suspended circuit board as the circuit board of the photosensitive assembly adapted to the second driving portion, which is designed to help overcome the above-mentioned drawbacks caused by the connection belt.
Fig. 13 is a perspective view showing an assembled second driving part and photosensitive assembly according to an embodiment of the present application. Fig. 14 shows an exploded view of the second driving part and the photosensitive member in one embodiment of the present application. Fig. 15 is a schematic perspective view of a photosensitive assembly and a suspension circuit board used in the photosensitive assembly according to an embodiment of the present application. Referring to fig. 13, 14 and 15, in the image capturing module of the embodiment, the photosensitive assembly 20 is connected to the second movable portion 42 of the second driving portion 40, so that the circuit board main body 71 can move in the xoy plane under the driving of the second movable portion 42. The wiring board 23 of the present embodiment is designed as a suspension structure. Specifically, the circuit board 23 includes a rigid circuit board body 71 and a flexible connection strap 72, and the connection strap 72 may include a third connection strap 72a and a fourth connection strap 72b, and the third connection strap 72a and the fourth connection strap 72b may be respectively led out from two opposite sides (for convenience of description, the two opposite sides may be referred to as a first side 74a and a second side 74 b) of the circuit board body 71 and bent upward. The third and fourth connection bands 72a and 72b after bending may form hanging parts 75, respectively. The suspension 75 may be connected to the base portion of the second driving portion 40 (or the first driving portion 30) to form a suspension structure. The suspension structure allows the base portion to suspend the circuit board main body 71 and its surface-mounted components (i.e., suspend the photosensitive assembly 20) by the bent portion 73 of the flexible connection strap 72. Specifically, in one example, the suspension portion 75 may have a through hole (suspension hole 75 a), and the second base portion 41 of the second driving portion 40 may have a corresponding hook 75b, and the hook 75b hooks the through hole of the suspension portion 75 to connect the suspension portion 75. In the prior art, the connecting belt and the circuit board main body are usually in the same plane, and deflection of the connecting belt on the same plane relative to the circuit board main body can generate larger resistance. In the present embodiment, the connecting strip 72 and the circuit board body 71 are provided with a bending portion 73 formed by bending upwards, and the resistance of the connecting strip 72 on the xoy plane (which can be regarded as a horizontal plane) relative to the circuit board body 71 is relatively small.
Further, in one embodiment of the present application, the third and fourth connection bands 72a and 72b may extend along the circumference of the circuit board main body 71 and the photosensitive assembly 20 such that the connection band 72 surrounds the photosensitive assembly on at least three sides. And, the third connection strap 72a and the fourth connection strap 72b are connected to each other and electrically connected. Wherein the photosensitive member 20 has a first side 74a and a second side 74b which are positioned in conformity with the wiring board main body 71. The first side 74a and the second side 74b are disposed opposite (i.e., do not intersect) and the third side 74c of the photosensitive assembly 20 intersects both the first side 74a and the second side 74b. The connecting band 72 may be looped around the first side 74a, the second side 74b, and the third side 74c of the photosensitive assembly 20. The third connecting band 72a is led out from the first side 74a of the circuit board main body 71 and is bent upward to form the bending portion 73, then extends along the first side 74a of the photosensitive member 20, is bent in the horizontal direction at the corner, and continues to extend along the third side 74c. The fourth connecting strip 72b is led out from the second side 74b of the circuit board main body 71 and is bent upwards to form another bending part 73, then extends along the second side 74b of the photosensitive assembly 20, is bent horizontally at a corner, and continues to extend along the third side 74c. The third 72a and fourth 72b connecting strips may be joined and electrically conductive to each other at the third side 74c, thereby forming a complete connecting strip 72. The three connection strap sections at the first, second and third sides 74a, 74b and 74c may have at least one hanging portion 75, respectively, each of the hanging portions 75 having at least one through hole so as to be connected with the base portion of the second driving portion 40 (or the first driving portion 30). In this embodiment, the suspension portion 75 can suspend the circuit board body 71 by the bending portions 73 located at opposite sides of the circuit board body 71, so that the bending portions 73 and the connecting strap 72 can bend and deform when the circuit board body 71 is driven to move by the second driving portion 40, thereby satisfying the movement stroke of the circuit board body 71.
Further, in one embodiment of the present application, the suspension 73 of the three connecting band sections at the first, second and third sides 74a, 74b, 74c may be reinforced by a rigid substrate. For example, a rigid substrate may be attached to a partial region of the flexible connection tape to form the suspension 73. While other areas of the flexible connecting band remain flexible so as to be capable of bending and deforming and meet the movement stroke of the circuit board main body 71.
Further, in one embodiment of the present application, the connection strap section located on the third side 74c may have a rigid hanging portion 75c, and the hanging portion 75c may lead out a fifth connection strap 76, and the fifth connection strap 76 may be used to connect to a motherboard of an electronic device (e.g., a mobile phone).
Further, in another embodiment of the present application, the suspension part may be connected to an external bracket (not shown) which is directly or indirectly fixed to the base part of the second driving part. In the present application, the suspension portion may be fixed to the base portion of the second driving portion through another intermediary. Wherein the intermediary may be directly or indirectly fixed to the base part of the second driving part. The intermediate has hooks thereon to hook the suspension portion, or the intermediate is adhered to the suspension portion. The intermediate may be an outer bracket, a base portion of the first driving portion, or another intermediate.
Further, in another embodiment of the present application, the hanging portion may not have the through hole. In this embodiment, the suspension part may be fixed to the base part of the second driving part (or to the base part of the first driving part or the outer bracket) by means of adhesion. Further, in another embodiment of the present application, the third connection strap and the fourth connection strap may be a rigid-flex board, wherein a portion forming the suspension portion may be a rigid board, and both a portion connecting the suspension portion and the bending portion formed by bending upward may be a flexible board. Since the suspension portion is directly formed by the hard plate, the suspension portion in the embodiment can be reinforced without attaching the rigid substrate.
Further, in an embodiment of the present application, the circuit board main body, the third connection strap and the fourth connection strap may be formed of a single integrated soft and hard combined board.
Further, still referring to fig. 13, 14 and 15, in one embodiment of the present application, the circuit board may further have a fixing portion 76a for fixing the fifth connection strap 76, which is designed to prevent the circuit board main body 71, the third connection strap 72a and the fourth connection strap 72b from being affected by external factors.
Further, fig. 16a shows a schematic front view of a suspension board according to an embodiment of the present application after being unfolded; fig. 16b shows a schematic back view of a suspension board in an embodiment of the application after deployment. Referring to fig. 16a and 16b, in the present embodiment, the circuit board 23 may be formed of a rigid-flex board. Wherein the sections of the third connecting strip 72a and the fourth connecting strip 72b on the third side 74c can be snapped together by means of connectors 78, 79 (see fig. 15 in combination), so that the third connecting strip 72a and the fourth connecting strip 72b are fixedly connected and further electrically connected. Circuits are provided in the third connecting strip 72a and the fourth connecting strip 72b to lead out the wires in the circuit board main body 71, and then the wires are connected to an external circuit through the fifth connecting strip 76 and the connector 77 thereof. Since the third connecting band 72a and the fourth connecting band 72b can each draw out a part of the wiring by the corresponding bent portion 73 formed by the upward bending, the wiring required to be drawn out of each bent portion 73 can be reduced, so that the width of each bent portion 73 can be reduced, thereby further reducing the resistance of the flexible connecting band 72 to the movement of the wiring board main body 71, and further reducing the driving force required to be supplied by the second driving portion 40. It should be noted that, in other embodiments of the present application, the circuit of the circuit board main body may be led out through only one of the bending portions (for example, the bending portion of the third connecting strip that is bent upward or the bending portion of the fourth connecting strip that is bent upward).
Further, fig. 17a shows a front view of a suspension board according to another embodiment of the present application after being unfolded, and fig. 17b shows a back view of the suspension board according to one embodiment of the present application after being unfolded. Referring to fig. 17a and 17b, the photosensitive assembly 20 includes a suspension type wiring board including a rigid wiring board body 71 and a flexible connection strap 72, the connection strap 72 is led out from a first side 74a and a second side 74b of the wiring board body 71 and bent upward to form a bent portion, a top of the bent portion extends along a circumference of the photosensitive assembly 20 in a horizontal direction such that the connection strap 72 surrounds the first side 74a, the second side 74b and the third side 74c of the photosensitive assembly 20, and the connection straps at the first side 74a and the second side 74b each have at least one hanging portion 75, the hanging portion 75 being fixed to the second base portion 41 of the second driving portion 40 or fixed to the second base portion 41 through an intermediary; wherein the photosensitive member 20 has a first side 74a and a second side 74b in correspondence with the position of the wiring board main body 71, the first side 74a and the second side 74b are arranged opposite to each other, and the third side 74c intersects both the first side 74a and the second side 74b. The hanging portion 75 has a hanging hole 75a, and the second base portion 41 or the intermediary has a hook that hooks the hanging hole 75a. The rigid substrate is attached to a part of the connecting band to reinforce, so as to form the suspension portion (in a deformed embodiment, the suspension circuit board may be made of a soft and hard combined board, wherein the circuit board main body and the suspension portion are formed by a hard board portion of the soft and hard combined board, and the bending portion and the connecting band section connected between the suspension portions are formed by a soft board portion of the soft and hard combined board). Unlike the previous embodiment, in the present embodiment, the third side surface 74c is not provided with a hanging portion, that is, the hanging portion 75 and the hanging hole 75a are provided only on the first side surface 74a and the second side surface 74b. Alternatively, in the present embodiment, the connection strap of the third side surface 74c is fixed to the second base portion 41 (or fixed to the second base portion 41 via an intermediary) by an adhesive. Specifically, in the present embodiment, the connection strap may include a third connection strap 72a and a fourth connection strap 72b, wherein the third connection strap 72a is led out from the first side 74a of the circuit board main body 71 and is bent upward to form one bent portion 73, then extends along the first side 74a of the photosensitive member 20, is bent in a horizontal direction at a corner, and continues to extend along the third side 74 c; the fourth connecting strip 72b is led out from the second side 74b of the circuit board main body 71 and is bent upwards to form another bent part, then extends along the second side 74b of the photosensitive assembly 20, is bent horizontally at a corner and continues to extend along the third side 74 c; the third 72a and fourth 72b connector strips are joined and electrically conductive to each other at the third side 74c (bonding and electrical conductive may be achieved by a male-female connector snap fit or by welding). Further, fig. 18 is an exploded perspective view of an image capturing module based on a suspension circuit board according to an embodiment of the present application. Fig. 19 is a schematic perspective view of a camera module with a housing based on a suspension board in an embodiment of the application. Referring to fig. 17a, 17b, 18 and 19 in combination, in this embodiment, the camera module further includes a first connection strap 84 electrically connected to the first driving portion, and the first connection strap 84 is led out from a top region of the first driving portion, and then bent downward and is engaged with and conducted with the third connection strap 72a or the fourth connection strap 72b at the third side 74 c. The camera module further comprises a housing 81 and a module base 80, wherein the inner side surface of the housing 81 is provided with a containing groove 82 for containing the joint part of the third side surface 74 c; wherein the joint portion is a joint portion 83 where the first connection strap, the third connection strap 72a, and the fourth connection strap 72b are joined to each other; the receiving groove 82 is filled with glue to fix the first, third and fourth connection bands 72a and 72b to the housing 81. The module base 80 and the housing 81 may be snapped together to enclose the first optical drive assembly 85 and the second optical drive assembly 86 inside the base 80 and the housing 81 (see fig. 18 and 19). Further, the connecting strap on the third side 74c is further connected to a fifth connecting strap 76, and the fifth connecting strap 76 has a connector 77 for external connection; the suspension board may further have a fixing portion 76a for fixing the fifth connection strap 76. The first optical driving assembly 85 includes a first driving part and an optical lens, and the optical lens is installed in a first movable part of the first driving part. The second optical driving assembly 86 includes a second driving part and a photosensitive assembly fixed to a second movable part of the second driving part.
In the assembly, the first driving part and the optical lens may be assembled into the first optical driving assembly 85, and the second driving part and the photosensitive assembly may be assembled into the second optical driving assembly 86. Then, the relative positions of the optical lens and the photosensitive chip are adjusted through an active calibration process, and then the first driving part (the first basic part) and the second driving part (the second basic part) are bonded through glue. Then, the bonded first optical driving assembly 85 and second optical driving assembly 86 are assembled in the through hole of the module housing 81 from bottom to top, and then the module base 80 is attached to the module housing 81; finally, glue is poured into the accommodating groove 82 of the housing to fix the first optical driving component 85, the second optical driving component 86 and the module housing 81. Meanwhile, glue may be poured into the accommodating groove 82, so that the joint portion of the first connecting strap 84, the third connecting strap 72a, and the fourth connecting strap 72b may be fixed to the module housing 81, the first base portion, or the second base portion.
Finally, it should be noted that the above embodiments are only for illustrating the technical solution of the present invention and are not limiting. Although the present invention has been described in detail with reference to the embodiments, it should be understood by those skilled in the art that modifications and equivalents may be made thereto without departing from the spirit and scope of the present invention, which is intended to be covered by the appended claims.

Claims (27)

1. An optical anti-shake camera module, comprising:
a lens;
a photosensitive assembly having a photosensitive chip;
a first driving part adapted to mount the lens and drive the lens to translate in x-axis and y-axis directions, the first driving part including a first base part and a first movable part; and
the second driving part comprises a second base part and a second movable part, the second base part comprises a flat base, the second movable part is flat, the base of the second base part and the second movable part are arranged in parallel, and the second base part and the second movable part are movably connected through an elastic connecting part; the second driving part is provided with four side surfaces, and each side surface is provided with two mutually staggered SMA wires;
the photosensitive assembly is fixed on the second movable part, and the second movable part is suitable for driving the photosensitive chip to move on an xoy plane under the driving of the SMA wire; and, the lens and the photosensitive chip are configured to be driven simultaneously and move in opposite directions; the x-axis and the y-axis are coordinate axes perpendicular to the optical axis of the camera module, the x-axis and the y-axis are perpendicular to each other, and the xoy plane is a plane formed by the x-axis and the y-axis;
Wherein the second base portion is fixed to the first base portion;
two corner areas of the surface of the base of the second base part facing the second movable part, which are diagonally opposite to each other, are provided with base part connecting columns, wherein the base part connecting columns comprise an A-type fixed end and a B-type fixed end which are arranged in a vertically stacked manner, and an insulating material layer for separating the A-type fixed end and the B-type fixed end;
two corner areas of the second movable part which are opposite to each other are provided with extension parts, each extension part is provided with a movable part connecting column, and each movable part connecting column comprises an A-type fixed end and a B-type fixed end which are arranged in a vertically stacked way, and an insulating material layer for separating the A-type fixed end and the B-type fixed end; the axes of the base part connecting column and the movable part connecting column are perpendicular to the xoy plane;
during assembly, the positions of the two movable part connecting columns and the two base part connecting columns are staggered, so that one connecting column is respectively arranged in four corner areas of the assembled second driving part, and the connecting columns are the base part or the movable part connecting columns; and the four class A fixed ends of the four corner areas are positioned at the same height; and four of the class B fixing ends of the four corner regions are at the same height; and two ends of each SMA wire are respectively connected with one A-type fixed end and one B-type fixed end positioned adjacent to the corner area, so that the two SMA wires are mutually staggered.
2. The optical anti-shake camera module according to claim 1, wherein the four corner regions include a first corner, a second corner, a third corner, and a fourth corner, wherein the first corner and the third corner are located on one diagonal of the second driving section, and the second corner and the fourth corner are located on the other diagonal of the second driving section; the second movable part extends outwards at the first angle and the third angle to form a first extension part and a third extension part; the first epitaxial part is provided with a first A fixed end and a first B fixed end which are positioned at different heights, and the third epitaxial part is provided with a third A fixed end and a third B fixed end which are positioned at different heights;
a second A fixed end and a second B fixed end which are positioned at different heights are arranged at the second angular position of the second foundation part; a fourth A fixed end and a fourth B fixed end which are positioned at different heights are arranged at the fourth angle position of the second foundation part;
the first A fixed end, the second A fixed end, the third A fixed end and the fourth A fixed end all belong to the A-type fixed ends; the first B fixed end, the second B fixed end, the third B fixed end and the fourth B fixed end all belong to the B-type fixed ends.
3. The optical anti-shake imaging module according to claim 2, wherein the second movable portion further has notches at the second corner and the fourth corner, respectively, to avoid the fixed end provided at the second base portion.
4. The optical anti-shake camera module according to claim 2, wherein the second movable part is further adapted to drive the photosensitive chip to move in a direction of rotating around a z-axis under the drive of the SMA wire; wherein the z-axis is a coordinate axis parallel to the optical axis.
5. The optical anti-shake camera module according to claim 2, wherein the second movable part is further adapted to drive the photosensitive chip to move in a direction along the translation of the z-axis under the drive of the SMA wire; wherein the z-axis is a coordinate axis parallel to the optical axis.
6. The optical anti-shake camera module of claim 1, wherein the four corner regions include a first corner, a second corner, a third corner, and a fourth corner, wherein the first corner and the third corner are located on a first diagonal of the second driving portion, and the second corner and the fourth corner are located on a second diagonal of the second driving portion;
The second movable part extends outwards at the first angle and the third angle to form a first extension part and a third extension part;
two fixed ends of the first corner of the second driving part are arranged on the first extension part, and two fixed ends of the third corner of the second driving part are arranged on the third extension part;
two fixed ends of the second corner of the second driving part are arranged at a second corner of the second basic part, and two fixed ends of the fourth corner of the second driving part are arranged at a fourth corner of the second basic part;
for each side surface of the second driving part, the two mutually staggered SMA wires arranged on the side surface are fixed and electrically connected to the four fixed ends of the two corner areas positioned on the side surface;
wherein a translational component of the photosensitive chip in the direction of the first diagonal or the direction of the second diagonal is generated by driving two pairs of SMA wires of the intersecting two sides of the second driving part to contract; the movement direction of the photosensitive chip on the xoy plane is opposite to the movement direction of the lens by the combination of the translation component of the direction of the first diagonal line and the translation component of the direction of the second diagonal line.
7. The optical anti-shake camera module according to claim 6, wherein rotation of the photosensitive chip in an Rz direction, which is a direction of rotation around a z-axis, which is a coordinate axis parallel to the optical axis, is generated by driving two pairs of SMA wires of opposite sides of the second driving portion to contract.
8. The optical anti-shake camera module according to claim 6, wherein a rotation component of the photosensitive chip in the Rx or Ry direction is generated by shrinking a single SMA wire driving a single side of the second driving portion; where the Rx direction is the direction of rotation about the x-axis and the Ry direction is the direction of rotation about the y-axis.
9. The optical anti-shake camera module of claim 6, wherein translation of the photosensitive chip in the z-axis direction is generated by driving the first and second groups of SMA wires of the second drive portion to contract; and, the translation direction of the photosensitive chip in the z-axis direction is opposite to the translation direction of the lens in the z-axis direction, and the z-axis is a coordinate axis parallel to the optical axis;
wherein the first group of SMA wires are two SMA wires with a first common fixed end, and the two SMA wires are respectively positioned at two intersecting sides of the second driving part; the second group of SMA wires are the other two SMA wires with a second common fixed end, and the other two SMA wires are positioned on the other two intersecting side surfaces of the second driving part; and the first public fixed end and the second public fixed end are one of the eight fixed ends of the second driving part, and the first public fixed end and the second public fixed end are positioned at the same height.
10. The optical anti-shake camera module according to claim 1, wherein the first base portion is located at a periphery of the first movable portion; the second foundation portion comprises a foundation portion side wall and a base, the bottom surface of the foundation portion side wall is connected with the base, and the top surface of the foundation portion side wall is connected with the first foundation portion.
11. The optical anti-shake camera module according to claim 10, wherein a stepped notch is formed in an edge region of the bottom surface of the first base portion, and the base portion side wall extends upward and into the stepped notch and is connected to the first base portion.
12. The optical anti-shake camera module according to claim 1, wherein the second movable portion includes a movable portion body having a flat plate shape and a light-passing hole in the center thereof; an outer edge region of the bottom surface of the movable portion main body extends downward to form a movable portion side wall.
13. The optical anti-shake camera module according to claim 12, wherein the photosensitive assembly comprises the photosensitive chip, a circuit board, a lens base and an optical filter; the light sensing chip is arranged on the upper surface of the circuit board, the lens seat is arranged on the upper surface of the circuit board and surrounds the light sensing chip, and the optical filter is arranged on the lens seat;
The bottom surface of the side wall of the movable part is adhered to the upper surface of the circuit board of the photosensitive assembly; an accommodating cavity is formed among the inner side surface of the side wall of the movable part, the bottom surface of the movable part main body, the upper surface of the circuit board and the outer side surface of the mirror base, and an electronic element is arranged in the accommodating cavity.
14. The optical anti-shake imaging module according to claim 12, wherein an edge region of the inner side of the movable portion main body has a step-shaped notch facing the object side to avoid a part of the structure of the lens.
15. The optical anti-shake camera module according to claim 1, wherein the second base portion is fixed to the first driving portion, the second base portion includes a base portion side wall that surrounds the second movable portion, and a gap for accommodating the SMA wire is provided between the base portion side wall and the second movable portion.
16. The optical anti-shake camera module according to claim 1, wherein the photosensitive assembly includes a suspension-type wiring board including a rigid wiring board main body and a flexible connection strap led out from a first side face and a second side face of the wiring board main body and bent upward to form a bent portion, a top of the bent portion extending along a peripheral edge of the photosensitive assembly in a horizontal direction such that the connection strap surrounds first, second, and third side faces of the photosensitive assembly, and the connection straps at the first and second side faces each have at least one suspension portion fixed to the second base portion of the second driving portion or fixed to the second base portion through an intermediary; the photosensitive assembly is provided with a first side face and a second side face which are consistent with the main body of the circuit board in position, the first side face and the second side face are oppositely arranged, and the third side face is intersected with the first side face and the second side face.
17. The optical anti-shake camera module of claim 16, wherein the suspension has a suspension hole, and the second base portion or the interposer has a hook that hooks the suspension hole.
18. The optical anti-shake camera module according to claim 16, wherein a portion of the connection strap is reinforced by attaching to a rigid substrate to form the suspension.
19. The optical anti-shake camera module according to claim 16, wherein the suspension type circuit board is made of a rigid-flex board, wherein the circuit board main body and the suspension portion are formed of a rigid-flex board portion, and the bending portion and the connection band section connected between the suspension portions are formed of a flexible-flex board portion of the rigid-flex board.
20. The optical anti-shake camera module according to claim 19, wherein the connection strap includes a third connection strap and a fourth connection strap, the third connection strap being led out from the first side of the circuit board main body and bent upward to form one of the bent portions, then extending along the first side of the photosensitive assembly, and being bent in a horizontal direction at a corner and continuing to extend along the third side; the fourth connecting belt is led out from the second side surface of the circuit board main body, is bent upwards to form the other bending part, then extends along the second side surface of the photosensitive assembly, is bent horizontally at a corner and continues to extend along the third side surface; the third connecting band and the fourth connecting band are engaged at the third side face and are conducted with each other.
21. The optical anti-shake camera module of claim 20, further comprising a first connecting strap electrically connected to the first drive section, the first connecting strap leading from a top region of the first drive section, then bending downward and engaging and conducting with the third connecting strap or the fourth connecting strap at the third side.
22. The optical anti-shake camera module of claim 21, further comprising a housing having an inner side with a receiving slot for receiving the engagement portion of the third side; wherein the joint is a joint where the first connecting strap, the third connecting strap, and the fourth connecting strap are joined to each other; glue is filled into the accommodating groove so as to fix the first connecting belt, the third connecting belt and the fourth connecting belt on the shell.
23. The optical anti-shake camera module according to claim 20, wherein the connecting strap on the third side is further connected to a fifth connecting strap, and the fifth connecting strap has a connector for external connection; the suspension type circuit board is also provided with a fixing part for fixing the fifth connecting belt.
24. The optical anti-shake camera module according to claim 1, wherein a lens movement distance b by which the first driving section drives the lens to move and a photosensitive chip movement distance c by which the second driving section drives the photosensitive chip to move are determined according to the detected tilt shake angle a of the camera module; the lens moving distance b, the photosensitive chip moving distance c and the image space focal length f of the camera module satisfy the following conditions: a=arctan (b/f) +arctan (c/f).
25. The optical anti-shake camera module according to claim 24, wherein the driving structure further comprises a driving logic module for maintaining a ratio of the lens moving distance b to the photosensitive chip moving distance c at a predetermined fixed ratio.
26. The optical anti-shake camera module according to claim 24, wherein the driving structure further comprises a driving logic module having an anti-shake threshold K, the driving logic module being configured to maintain a ratio of the lens moving distance b to the photosensitive chip moving distance c at a predetermined fixed ratio when the tilt shake angle a is less than or equal to the anti-shake threshold K, and to make the photosensitive chip moving distance c reach a maximum value c of a moving stroke thereof when the tilt shake angle a is greater than the anti-shake threshold K max The lens movement distance b is according to the relation b=tan (a/f) -c max Calculated to obtain。
27. The optical anti-shake imaging module according to claim 25 or 26, wherein the preset fixed ratio of the lens movement distance and the photosensitive chip movement distance is set according to the weight of the lens, the driving force of the first driving portion, the weight of the photosensitive chip or photosensitive assembly, and the driving force of the second driving portion so that the times at which the lens and the photosensitive chip move to the respective anti-shake target positions coincide.
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CN202011303700.XA CN114520858B (en) 2020-11-19 2020-11-19 Optical anti-shake camera module
US18/037,005 US20240022816A1 (en) 2020-11-19 2021-10-29 Optical image stabilization camera module
CN202180069890.XA CN116325774A (en) 2020-11-19 2021-10-29 Optical anti-shake camera module
EP21893720.9A EP4231623A4 (en) 2020-11-19 2021-10-29 Optical anti-shake camera module
PCT/CN2021/127326 WO2022105572A1 (en) 2020-11-19 2021-10-29 Optical anti-shake camera module

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WO2024057043A1 (en) * 2022-09-16 2024-03-21 Cambridge Mechatronics Limited Actuator assembly
WO2024098220A1 (en) * 2022-11-07 2024-05-16 北京小米移动软件有限公司 Anti-shake mechanism, camera module and portable terminal

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