CN114755873B

CN114755873B - Image pickup module, optical adjustment method thereof and electronic equipment

Info

Publication number: CN114755873B
Application number: CN202011582764.8A
Authority: CN
Inventors: 涂洪德; 魏罕钢; 何艳宁; 李剑虹
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2020-12-28
Filing date: 2020-12-28
Publication date: 2023-10-24
Anticipated expiration: 2040-12-28
Also published as: CN114755873A

Abstract

The application relates to an image pickup module, an optical adjustment method thereof and electronic equipment. The camera shooting module is provided with a first driving device arranged on the lens assembly and a second driving device arranged on the photosensitive assembly, wherein the first driving device can drive the optical lens to move, and the second driving device can drive the photosensitive chip to move, and the first driving device and the second driving device are controlled in a combined way: the motion forms and the motion amplitudes of the optical lens and the photosensitive chip are distributed and determined through a control device, so that the first driving device and the second driving device cooperate with each other to drive the optical lens and the photosensitive chip to move, and the relative positions of the optical lens and the photosensitive chip are adjusted together. The solution provided by the application can effectively improve the imaging quality of the camera module and simultaneously realize miniaturization of the module structure.

Description

Image pickup module, optical adjustment method thereof and electronic equipment

Technical Field

The application relates to the technical field of optical imaging, in particular to an imaging module and a method for optical adjustment of the imaging module. The application also relates to electronic equipment comprising the camera module.

Background

For the camera module used in mobile electronic devices such as smart phones, in order to effectively improve the imaging quality of the camera module, a corresponding driving device is generally configured for a lens of the camera module, so as to realize focusing and anti-shake functions of the camera module in the shooting process. Meanwhile, in order to adapt to the design trend and user requirements of the current electronic equipment, miniaturization and lightening of the camera module are also main trends of technical development.

Along with the enhancement of the zooming capability of the camera module, the requirement on the anti-shake capability of the camera module is correspondingly improved, the basic principle of the existing camera module anti-shake mechanism is similar, in general, the driving device consists of a movable part and a fixed part, the element needing to be subjected to position adjustment is fixed with the movable part, and when the movable part moves relatively to the fixed part, the element fixed with the movable part can be driven to realize the position adjustment. In various driving structures, the driving force is provided in different manners, and some of the driving structures are realized by magnetic force action between a magnet and a coil, such as a common OIS driving motor and a common pan-tilt driving structure, and other driving structures are realized by action between charges, such as a MEMS driving device.

In addition, in order to achieve better shooting quality, the volume and weight of the constituent elements of the camera module (for example, in view of the number and size of the lenses) are correspondingly increased, so that there is a higher requirement for the driving device, and the driving device needs to provide a larger driving force, so that the volume of the constituent elements of the camera module is correspondingly increased, which obviously does not conform to the trend of miniaturization of the current module structure. On the other hand, the driving structure has more complex constituent elements, and the reliability is poor after other elements of the driving device and the module are assembled in the assembling process, and if collision or impact occurs, the driving structure is possibly damaged, namely, under the condition of no work, the movable part can relatively move relative to the fixed part under the action of external force, and the damage of internal components can be caused; the components inside the camera module are all precise components, and damage to any component may cause the overall function of the module to be reduced, and the shooting quality is impaired.

For the anti-shake device configured by the current mainstream camera module, the following two schemes are mostly adopted: firstly, a corresponding driving device, such as a ball motor or an SMA motor, is configured for the lens structure so as to realize image stabilization in the shooting process; secondly, the whole camera module is provided with a driving device, so that the whole structure of the driving module moves, and shake correction in the shooting process is realized. However, both schemes have corresponding defects, the former is used for configuring a corresponding driving structure for the lens, and along with the increase of the weight of the lens, a larger driving force is required to be provided, so that the structural design of the driving device is complicated, and meanwhile, the designed structural volume is increased, so that the miniaturization of the camera module is not facilitated; the latter wholly disposes drive arrangement for the module of making a video recording, and the weight of whole module is great, need dispose drive arrangement of corresponding volume for the holistic volume of module increases, does not accord with the trend of making a video recording the module equally.

In view of the above problems, it is desirable to provide a new camera module design to effectively solve the above part or most of the problems, so as to effectively improve the imaging quality of the camera module and achieve miniaturization of the module structure.

Disclosure of Invention

The invention aims to optimize a driving adjustment mechanism of a camera module, and provides the camera module, a method for optical adjustment of the camera module and electronic equipment comprising the camera module.

The basic idea of the invention comprises: in view of the fact that the imaging module needs to perform optical adjustment for the relative position between the lens assembly and the photosensitive assembly during imaging and shooting, particularly needs to realize focusing (AF) and/or anti-shake (OIS) functions, if an adjustment strategy for independently driving the lens structure or the whole driving module structure in the past is abandoned, the lens assembly (particularly an optical lens) and the photosensitive assembly (particularly a photosensitive chip) can be controlled to move under the action of a driving device in the structure/hardware level, and combined control is performed on the lens assembly and the photosensitive assembly in the control/software layer, so that the movement forms and movement amplitudes of the lens assembly and the photosensitive assembly are reasonably distributed, and the adjustment or correction target of the relative position can be more efficiently and rapidly achieved; meanwhile, through the double-drive mode, the workload of a driver in a single-drive mode is reduced, the structure and the performance of the two driving devices can be correspondingly optimized, matched and distributed, and meanwhile, the miniaturization design of the module structure can be considered.

According to a first aspect of the present invention, there is provided an image pickup module including:

a lens assembly including an optical lens having at least one optic; and

the photosensitive assembly comprises a circuit board unit and photosensitive chips attached to corresponding bearing parts of the circuit board unit;

here, the camera module has a first drive device disposed in the lens assembly and a second drive device disposed in the photosensitive assembly, the first drive device being capable of driving the optical lens to move, the second drive device being capable of driving the photosensitive chip to move, wherein the first drive device and the second drive device are jointly controlled: the motion forms and the motion amplitudes of the optical lens and the photosensitive chip are distributed and determined through a control device, so that the first driving device and the second driving device cooperate with each other to drive the optical lens and the photosensitive chip to move, and the relative positions of the optical lens and the photosensitive chip are adjusted together. Herein, the "movement pattern" includes translation and rotation in different directions, and may specifically refer to (but is not limited to): the image pickup module includes a movable member, i.e., an optical lens and/or a photosensitive chip, which moves in the direction of an optical axis of the optical lens, moves in a plane perpendicular to the optical axis, rotates in the plane perpendicular to the optical axis, and tilts about a straight line perpendicular to the optical axis. Accordingly, the "movement amplitude" refers to the magnitude of the translational distance and the rotational angle, such as the displacement of the optical lens or the photosensitive chip along the optical axis direction.

The said "distributing" and "determining" the movement patterns (including the movement direction and the movement amplitude) of the optical lens and the photosensitive chip are the results obtained by the control device according to the calculation of the lens assembly and the photosensitive assembly position parameter (which can be obtained by the known sensing element such as gyroscope, etc.), and then the said "making the first driving device and the second driving device cooperate to drive the optical lens and the photosensitive chip to move" may specifically refer to driving the optical lens and the photosensitive chip to move simultaneously (or synchronously), sequentially, alternately, etc., and may also include driving only one of the optical lens and the photosensitive chip to move under specific conditions.

In some embodiments, the first driving means is capable of driving the optical lens to translate in a plane perpendicular to the optical axis; and/or the second driving device can drive the photosensitive chip to translate in a plane perpendicular to the optical axis. In this way, the first driving device and the second driving device can be matched to act, and the optical lens and the photosensitive chip are correspondingly driven to move so as to execute the anti-shake function operation of the camera module.

In some embodiments, the first driving device is capable of driving the optical lens to move along the direction of the optical axis; and/or the second driving device can drive the photosensitive chip to move along the direction of the optical axis. In this way, the first driving device and the second driving device can be matched to act, and the optical lens and the photosensitive chip are correspondingly driven to move so as to execute focusing function operation of the image pickup module.

In this respect, according to an expedient embodiment, the optical lens and the light-sensing chip can be driven synchronously and moved in opposite directions. Therefore, the effect of improving the response speed of the camera module can be achieved, and focusing and/or anti-shake function operation can be rapidly completed.

According to the actual design condition and construction requirement of the camera module, the displacement of the optical lens and the displacement of the photosensitive chip can be the same or different. According to a preferred embodiment, the displacement of the optical lens is greater than the displacement of the photosensitive chip.

It is generally desirable that the displacement of the optical lens and the displacement of the photosensitive chip be maintained at a fixed ratio. A simpler control logic can thus be realized.

According to the actual design situation and construction requirement of the camera module, a proper control strategy can be selected for the first driving device and the second driving device. For example, in some embodiments, the optical lens and the light sensing chip can start moving at the same time until the light sensing chip moves by a predetermined displacement, after which the first driving means can drive the optical lens to continue moving in the same direction or in another direction.

In some embodiments, the first driving means is capable of driving the optical lens to rotate in a plane perpendicular to the optical axis; and/or the second driving device can drive the photosensitive chip to rotate in a plane perpendicular to the optical axis. In some embodiments, the first driving device can drive the optical lens to tilt by taking a straight line perpendicular to the optical axis as a rotating shaft; and/or the second driving device can drive the photosensitive chip to tilt by taking a straight line perpendicular to the optical axis as a rotating shaft. The corresponding optical adjustment action, especially the anti-shake function operation, can be realized, which has important significance for the movable or suspended support of the photosensitive chip and for some special lenses with directivity (such as lenses comprising free-form surface lenses, the optical characteristics of which have directivity).

As for the specific form and structure of the first driving means and the second driving means, it can be determined according to actual design and construction requirements. For example, in some embodiments, the first drive means is configured as a voice coil motor, a ball motor, or a MEMS driver; in some embodiments, the second drive device is configured as an SMA actuator.

In the camera module of the invention, aiming at focusing and anti-shake functions, according to corresponding driving structure and control strategy, the following can be set: driving the optical lens and the photosensitive chip by using a first driving device and a second driving device respectively to cooperatively execute focusing and anti-shake function operations (dual AF driving and dual OIS driving configuration); the optical lens is driven by the first driving device only to execute focusing function operation, and the optical lens and the photosensitive chip are driven by the first driving device and the second driving device respectively to execute anti-shake function operation (single AF driving and double OIS driving configuration) in a co-operation mode; the optical lens is driven only with the first driving means to perform a focusing function operation, and the photosensitive chip is driven only with the second driving means to perform an anti-shake function operation (single AF driving and single OIS driving configuration).

In some embodiments, it is desirable that the circuit board unit includes:

a circuit board main body on which electronic components and circuit wiring are provided; and

a connector through which an electronic component on the wiring board main body is electrically connected to an external device (for example, a power supply, a control element, etc.);

the circuit board main body comprises a hard board part and a soft board part, the hard board part comprises a bearing part for accommodating a photosensitive chip, at least one first section of the soft board part is connected with the connector, at least one second section of the soft board part is connected with a frame of the camera module or a shell component fixed relative to the frame, and the second section is provided with an assembly structure for forming a movable connection pair at least one joint part connected with the frame or the shell component.

The circuit board design is particularly suitable for giving the photosensitive chip a corresponding degree of freedom of movement and minimizing the movement resistance of the photosensitive chip, and particularly, the corresponding movement form (including movement direction) and movement amplitude of the photosensitive chip can be considered in view of the movement required to be realized when the camera module performs focusing and/or anti-shake function operation.

In this case, it is advantageous if the second section of the flexible sheet part has a reinforcement structure at least at the junction with the frame or the housing component. The reinforcing structure can be a local thickened part of the soft board part plate body or a reinforcing part additionally fixed on the soft board part plate body. Therefore, the circuit board can be firmly installed in the camera module.

It may be provided that the assembly structure for forming the articulating pair comprises: the support seat of the flexible suspension mechanism; or a hinge hole of a hinge mechanism; or T-shaped or L-shaped hanging holes of the guide groove sliding block type hanging buckle mechanism.

It is generally appropriate that the electronic components are disposed on the hard plate portion, disposed around the photosensitive chip.

Here, it is advantageous that the circuit board main body portion is in the form of an open box, the circuit board hard board portion forms a bottom wall of the box, the first section of the soft board portion protrudes from one side of the box and extends to the connector, and the second section of the soft board portion forms at least two side walls of the box. In this way, since the circuit board body forms a box-shaped member, the lens assembly (or the driving device thereof) can be at least partially directly accommodated and supported in the box structure formed by the circuit board body, thereby being beneficial to realizing a small and compact camera module structure as a whole.

In this case, the circuit board body is preferably made of a planar rigid-flex board blank, which is formed into a box-shaped circuit board body by hot-press molding.

Regarding the mounting and fixing of the wiring board itself in the camera module, it is conceivable to connect the wiring board to the frame of the camera module or a housing member fixed with respect to the frame.

In some embodiments, the fixing portion of the first driving device includes a motor housing at least partially accommodated in the box-shaped circuit board main body and connected as the housing member with the at least two side walls formed by the circuit board unit flexible board portion. The motor shell and the soft board part form a movable connection pair at least one joint part. According to one embodiment, the movable connection pair may be configured as a guide groove slider type hanging buckle mechanism, and includes a hook disposed on one side of the motor housing and a T-shaped or L-shaped hanging hole disposed on one side of the flexible board portion of the circuit board unit. In this way, at least a movement of the hard plate portion (or the photosensitive chip) of the circuit board unit in two directions can be achieved.

In other embodiments, the frame of the camera module has a hollow structure adapted to at least partially house the box-like circuit board body, and an inner side wall of the frame is adjacent to the at least two side walls formed by the circuit board unit flexible board portions. The inner side wall of the frame and the soft board part form a movable connection pair at least one joint part. According to one embodiment, the movable connection pair is configured as a guide groove sliding block type hanging buckle mechanism, and comprises a hook arranged on one side of the inner side wall of the frame and a T-shaped or L-shaped hanging hole arranged on one side of the soft board part of the circuit board unit. In this way, at least a movement of the hard plate portion (or the photosensitive chip) of the circuit board unit in two directions can be achieved.

In this case, a base is expediently provided at the bottom of the frame, which is designed as a base plate that mates with the bottom of the frame.

The invention can realize the high integration of the camera module structure and the assembly. In the case of closely coupled individual module components, more heat tends to be generated during use.

In this case, it is advantageous if the upper side and/or the lower side of the base plate has a heat dissipation structure at least in some areas and/or the inner side wall and/or the outer side wall of the frame has a heat dissipation structure at least in some areas. For example, the heat dissipation structure may be a concave-convex structure formed on the surface of the corresponding member in such a way as to increase the effective heat dissipation area.

In addition, it is advantageous if a heat transfer material is provided at the heat generating location inside the camera module, which heat transfer material is in contact with the base plate and/or with the frame.

In view of the miniaturized structural design of the camera module and the structural configuration of the driving device of the camera module, the heat dissipation measures have important significance.

According to a second aspect of the present invention, there is provided a method for optical adjustment of an imaging module, comprising:

acquiring relative position parameters between a lens assembly and a photosensitive assembly of the camera module;

Generating a control signal and sending the control signal to a control system of the lens assembly and the photosensitive assembly;

driving at least the optical lens of the lens assembly to move according to the corresponding control signal by using the first driving device;

at least driving the photosensitive chip of the photosensitive assembly to move according to the corresponding control signal by utilizing the second driving device;

when a control signal is generated, the movement forms and movement amplitudes of the optical lens and the photosensitive chip are distributed and determined, and the first driving device and the second driving device are cooperatively controlled to drive the optical lens and the photosensitive chip to move so as to jointly adjust the relative positions between the lens assembly and the photosensitive assembly.

In particular, the method can be used for executing optical anti-shake adjustment on the camera module, wherein, a gyroscope component is utilized to acquire parameters of relative offset between a lens component and a photosensitive component of the camera module; the optical lens and the photosensitive chip are made movable at least in a plane perpendicular to the optical axis to jointly compensate for the relative offset between the optical lens and the photosensitive chip.

Particularly, the method can also be used for executing focusing adjustment on the camera module, wherein parameters of the relative distance between the lens component and the photosensitive component of the camera module are obtained, and parameter measurement and calculation are carried out according to shooting imaging requirements; the optical lens and the photosensitive chip can move at least along the direction of the optical axis so as to jointly adjust the relative distance between the optical lens and the photosensitive chip.

In the method of the present application, it is desirable to drive the optical lens and the photosensitive chip so that the displacements thereof are kept at a fixed ratio.

In the method according to the application, it can be provided that the optical lens and the light-sensitive chip are moved simultaneously until the light-sensitive chip has moved by a predetermined displacement, after which the first drive device still drives the optical lens to continue moving in the same direction or in the other direction in dependence on the corresponding control signal.

According to a third aspect of the present application, there is provided an electronic device comprising an imaging module as described above. The electronic device can be a portable device such as a smart phone, a tablet computer and the like.

It goes without saying that the features and advantages of the camera module provided according to the first aspect of the application are equally applicable to the method for optical adjustment of a camera module provided according to the second aspect of the application and to the electronic device provided according to the third aspect of the application.

Compared with the prior art, the technical scheme provided by the application can realize at least one of the following beneficial technical effects:

(1) Aiming at focusing and anti-shake functions of the camera module, flexible and efficient driving configuration can be realized, and higher design freedom is provided in the aspects of structure and control of the camera module;

(2) Regarding focusing and anti-shake functions of the camera module, various different control strategies and drive combinations can be selected according to actual needs and/or working states, for example, single AF drive+double OIS drive, single AF drive+single OIS drive and the like, so as to realize rapid and optimized action response, thereby effectively improving the shooting quality of the camera module;

(3) The miniaturization of the whole structure of the camera module can be realized by adopting proper driving device, circuit board and other related component designs.

Drawings

Some exemplary embodiments of the invention are shown in the drawings. The embodiments and figures disclosed herein are to be regarded as illustrative rather than restrictive. It is further noted that, for clarity of illustration, some of the details of construction in the drawings are not drawn to scale.

FIG. 1 is a schematic cross-sectional view of the internal components of a camera module;

FIG. 2 is a schematic cross-sectional view of a photosensitive assembly provided with a second driving device;

FIG. 3 is a schematic view of an SMA actuator as one embodiment of a second drive arrangement;

FIG. 4 is a schematic perspective view of a camera module;

FIG. 5 is an exploded view of the components of the camera module of FIG. 4;

FIG. 6 is a schematic view of the camera module of FIG. 4 in section, showing the components assembled together;

FIG. 7 is a schematic cross-sectional view showing details of various components of the camera module of FIG. 4;

FIG. 8 is a schematic perspective view of a lens assembly;

FIG. 9 is a schematic perspective view of a photosensitive assembly;

FIG. 10 is a schematic perspective view of the photosensitive assembly of FIG. 9 together with a base that has not yet been attached;

FIG. 11 is a schematic perspective view of a preassembled unit of the camera module formed by mounting the photosensitive assembly and base of FIG. 10 together with the camera module frame;

FIG. 12 is a schematic perspective view of a base;

FIG. 13 is a schematic perspective view of the camera module from another perspective, particularly showing the bottom surface thereof;

fig. 14 is a schematic block diagram of a method for camera module optical adjustment.

Detailed Description

The following description is presented to illustrate the invention and to enable those skilled in the art to practice the invention. The preferred embodiments in the following description are by way of example only and other obvious variations will occur to those skilled in the art. The basic principles of the invention defined in the following description may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention. It should also be noted that the features, structures, or characteristics described in connection with a particular embodiment are not necessarily limited to that particular embodiment, nor are they intended to be mutually exclusive with other embodiments, and that it is within the ability of one skilled in the art to implement different combinations of the features of the different embodiments.

The terms "first," "second," and the like in the description and in the claims, are used for distinguishing between different objects and not for describing a particular sequential order. Also, the terms "comprising," "including," and "having," as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, article, or apparatus that comprises a list of steps or elements is not limited to only those listed but may optionally include additional steps or elements not listed or inherent to such process, method, article, or apparatus. In the description of the present application, the terms "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are merely for convenience in describing the present application and simplifying the description, and do not mean that the corresponding device or element must have a specific orientation, be configured and operated in a specific orientation, and thus the above terms should not be construed as limiting the present application. In addition, the terms "a" or "an" should be understood as "at least one" or "one or more", i.e., in a certain embodiment, the number of a certain element may be one, and in another embodiment, the number of the element may be plural, that is, the term "a" should not be construed as limiting the number.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art and are to be specifically interpreted according to their context in the context of the related art description.

Generally, the camera module 100 includes a lens assembly 10 and a photosensitive assembly 20 (see fig. 1 and 4-7, for example), the lens assembly 10 includes an optical lens 11 and a driving device (see fig. 8 and 4-7, for example), and in general, the driving device is a motor, which is mainly used for realizing focusing and anti-shake effects in a shooting process.

The photosensitive assembly 20 generally includes a circuit board unit 22, a photosensitive chip 21, a holder and a color filter 30 (see, for example, fig. 2, 9 and 4-7), the chip is disposed on an upper surface of the circuit board structure, and is electrically connected to the circuit board through a wire bonding process, the holder is also disposed on the upper surface of the circuit board and accommodates the chip structure inside its holder structure, the color filter is disposed on the upper surface of the holder, and the holder, the circuit board and the color filter are combined to form a closed space, and the chip structure is disposed inside the closed space, so that, on one hand, the chip structure is protected, and, on the other hand, external dust is prevented from falling on the chip to avoid degradation of imaging quality.

The lens assembly is arranged above the photosensitive assembly, when external light enters the module through the lens structure, the light is subjected to stray light treatment through the color filter, then the position of the chip is reached to convert the light into an electric signal, and finally an imaged picture is output. In the shooting process, if the module is subjected to shaking, the sensor device detects the shaking and transmits information to the control center, the control center transmits the information to be compensated to the motor, and the motor drives the lens structure to correspondingly move so as to compensate the shaking of the shooting module, thereby effectively improving the imaging quality of the shooting module.

In addition, in order to effectively improve the imaging quality of the camera module, research on the structure of the lens is never stopped in the industry, and many manufacturers currently adopt an improvement scheme of replacing the plastic lens of the original lens with a glass lens. At the same time, however, the weight of the lens increases substantially. The motor driving device needs to drive the lens to move so as to realize the anti-shake and focusing functions, and along with the increase of the weight of the lens, the driving force of the motor must be correspondingly increased, so that the original driving structure needs to be improved, the driving device is complex in structure, the cost for improving the driving device is high, and meanwhile, the structural volume of the motor is increased, so that the driving device does not accord with the trend of thinning of the camera module.

To this end, the invention proposes a solution: the lens and the chip are respectively provided with a corresponding driving structure, so that the lens and the chip can be matched with each other in the shooting process to realize focusing and/or anti-shake functions.

Based on this, the present invention provides an image capturing module, as shown in fig. 1, which includes: a lens assembly 10 comprising an optical lens 11 having at least one optic; and a photosensitive assembly 20 including a wiring board unit 22 and photosensitive chips 21 attached to respective carrying portions of the wiring board unit; here, the image capturing module includes a first driving device D10 disposed on the lens assembly 10 and a second driving device D20 disposed on the photosensitive assembly 20, wherein the first driving device is capable of driving the optical lens to move, and the second driving device is capable of driving the photosensitive chip to move, and the first driving device D10 and the second driving device D20 are jointly controlled: the motion forms and the motion amplitudes of the optical lens and the photosensitive chip are distributed and determined through a control device, so that the first driving device and the second driving device cooperate with each other to drive the optical lens and the photosensitive chip to move, and the relative positions of the optical lens and the photosensitive chip are adjusted together.

Herein, the "movement pattern" includes translation and rotation in different directions, and may specifically refer to (but is not limited to): the image pickup module includes a movable member, i.e., an optical lens and/or a photosensitive chip, which moves in the direction of an optical axis of the optical lens, moves in a plane perpendicular to the optical axis, rotates in the plane perpendicular to the optical axis, and tilts about a straight line perpendicular to the optical axis. For example, according to the spatial coordinate system shown in fig. 5, the optical axis is defined as extending in the Z-direction, and thus, the above-described motion pattern may define six degrees of freedom: x (translational shift in ±x direction in the xoy plane), Y (translational shift in ±y direction in the xoy plane), Z (translational shift in ±z direction), r (rotation in the xoy plane), v (tilt about the X axis), w (tilt about the Y axis). Accordingly, the "movement amplitude" refers to the magnitude of the translational distance and the rotational angle, such as the displacement of the optical lens or the photosensitive chip along the optical axis direction.

In some embodiments, the first driving device D10 can drive the optical lens 11 to translate (i.e. move about the x, y degrees of freedom) in a plane perpendicular to the optical axis (xoy plane); and/or the second driving device D20 can drive the photosensitive chip 21 to translate in a plane (xoy plane) perpendicular to the optical axis (i.e. the motion about the above-mentioned x, y degrees of freedom). In this way, the first driving device and the second driving device can be matched to act, and the optical lens and the photosensitive chip are correspondingly driven to move so as to execute the anti-shake function operation of the camera module.

In some embodiments, the first driving device D10 is capable of driving the optical lens 11 to move along the direction of the optical axis (Z direction) (i.e. the motion about the Z degree of freedom); and/or the second driving device D20 can drive the photosensitive chip 21 to move along the direction of the optical axis (Z direction) (i.e., the movement about the Z degree of freedom). In this way, the first driving device and the second driving device can be matched to act, and the optical lens and the photosensitive chip are correspondingly driven to move so as to execute focusing function operation of the image pickup module.

According to the actual design condition and construction requirement of the camera module, the displacement of the optical lens and the displacement of the photosensitive chip can be the same or different. According to a preferred embodiment, the displacement of the optical lens is larger than the displacement of the photosensitive chip, and accordingly, the second driving device can be a smaller driving structure.

In some embodiments, the first driving device D10 can drive the optical lens 11 to rotate in a plane (xoy plane) perpendicular to the optical axis (i.e. the motion about the above-mentioned r degrees of freedom); and/or the second driving device D20 can drive the photosensitive chip 21 to rotate in a plane (xoy plane) perpendicular to the optical axis (i.e., the motion about the above-mentioned r degrees of freedom). In some embodiments, the first driving device D10 can drive the optical lens 11 to tilt about a straight line perpendicular to the optical axis (i.e. the motion about the v and w degrees of freedom); and/or, the second driving device D20 can drive the photosensitive chip 21 to tilt about a line perpendicular to the optical axis (i.e. the motion about the v and w degrees of freedom). The corresponding optical adjustment action, especially the anti-shake function operation, can be realized, which has important significance for the movable or suspended support of the photosensitive chip and for some special lenses with directivity (such as lenses comprising free-form surface lenses, the optical characteristics of which have directivity).

As for the specific form and structure of the first driving means and the second driving means, it can be determined according to actual design and construction requirements. For example, in some embodiments, the first drive device D10 is configured as a voice coil motor, a ball motor, or a MEMS driver; in some embodiments, the second drive device D20 is configured as an SMA actuator.

The first driving means may be a conventional voice coil motor, a ball motor or a MEMS driver, and the basic principle and structure thereof will not be described herein.

Fig. 2 shows a photosensitive assembly configured with a second driving device.

Fig. 3 is a schematic view of an SMA actuator as an embodiment of the second drive arrangement D20, the drive member D20-3 of which may comprise at least one SMA (shape memory alloy) wire D20-31 and a corresponding elastic return element D20-32, the specific construction and operation of which will be further explained below by way of example.

In order to give the photosensitive chip a corresponding degree of freedom of movement and minimize the movement resistance thereof, especially in view of the movement of the photosensitive chip required to be achieved when the camera module is operated for focusing and/or anti-shake functions, the corresponding movement pattern (including movement direction) and movement amplitude thereof should be considered, and the invention accordingly provides a particularly suitable circuit board design.

Specifically, in some embodiments, as shown in fig. 2 and 9, the circuit board unit 22 includes:

a wiring board main body 220 on which an electronic component 222 and a circuit wiring are provided; and

a connector 221 through which an electronic component on the circuit board main body is electrically connected to an external device (for example, a power supply, a control element, etc.);

the circuit board main body 220 includes a hard board portion 2201 and a soft board portion 2202, the hard board portion 2201 includes the bearing portion for accommodating the photosensitive chip 21, at least one first section 2202-1 of the soft board portion 2202 is connected to the connector 221, at least one second section 2202-2 of the soft board portion 2202 is connected to a frame of the camera module or to a housing member fixed relative to the frame, wherein the second section has an assembling structure J1-1 for forming an articulating pair at least one joint O1, O2, O3 connected to the frame or the housing member.

It is generally suitable that the electronic components 222 are disposed on the hard plate portion 2201, disposed around the photosensitive chip.

It should be appreciated that the circuit wiring (not shown in the drawings) is used to realize power supply connection, signal connection, etc. between the photo chip and the electronic component, between different electronic components, between the photo chip and/or the electronic component and the external device, and thus, corresponding connection wires are provided at least partially on or in the hard board portion and the soft board portion of the circuit board main body (including the first section and the second section thereof).

As shown in fig. 2, the second driving device D20 may be disposed on the lower side of the circuit board structure, particularly on the periphery of the bottom surface of the hard board portion of the circuit board, so as to drive the whole structure of the photosensitive assembly including the photosensitive chip 21 to move, thereby realizing the position adjustment. In practice, the circuit board structure includes a hard circuit board (formed by the hard board portion 2201) and a soft circuit board (formed by the soft board portion 2202), wherein one end of the soft circuit board is connected to the hard circuit board, and the other end of the soft circuit board is connected to an external power supply device through the intermediary of the connector 221, so as to realize the supply of current in the working process of the camera module. If the traditional direct connection structure is adopted between the hard circuit board and the soft circuit board, the hard circuit board end can drive the chip to move under the action of the driving force in the moving process of the chip structure, and one end of the soft circuit board connected with the external power supply device is fixed, in the process, the soft circuit board can generate larger resistance to the movement of the hard circuit board, and the accuracy of chip adjustment is affected. In order to improve the anti-shake precision, aiming at the problem and realizing the driving function of the scheme, the invention provides a unique soft and hard board combination mode, namely, a roundabout structure form is adopted between a hard circuit board and a soft circuit board, so that the problem of resistance of the soft circuit board to the hard circuit board can be solved, and the stability of the integral structure of the camera module can be effectively ensured.

In this regard, as shown in fig. 9, the circuit board main body 220 is in the shape of an open box, the hard board portion 2201 forms a bottom wall of the box, the first section 2202-1 of the soft board portion protrudes from one side of the box and extends to the connector 221, and the second section 2202-2 of the soft board portion forms at least two side walls of the box (see the orientation indicated by a, b, and c in the figure). Conveniently, the circuit board main body is made of a planar soft and hard combined board blank, and the soft and hard combined board blank is formed into the box-shaped circuit board main body through hot press molding.

In this case, it is advantageous if the second section 2202-2 of the flexible plate part 2202 has a reinforcing structure at least at its junction O1, O2, O3 with the frame or the housing component. The reinforcing structure can be a local thickened part of the soft board part plate body or a reinforcing part additionally fixed on the soft board part plate body. Therefore, the circuit board can be firmly installed in the camera module, and the formed box-shaped structure cannot be easily deformed.

On the other hand, since the circuit board main body 220 forms a box-like member, the lens assembly 10 (or the driving device thereof) can be directly accommodated and supported in the circuit board main body at least in part, thereby being advantageous in achieving a small and compact camera module structure as a whole.

Thus, according to the preferred embodiment of the photosensitive assembly shown in fig. 9, a flexible circuit board is disposed around the hard circuit board so as to surround the hard circuit board, the chip and color filter structures are accommodated in the space formed by the flexible circuit board, and a connecting buckle for connecting with a fixing member is further provided on the flexible circuit board so as to ensure the stability of the overall structure of the module. Wherein, at the box body lateral wall department with c instruction, utilize fixed plate structure to fix the soft circuit board of two sides together to keep its fixed of shape, when fixing between the soft circuit board of two sides, can adopt different modes: if it is directly glued through glue, perhaps in order to further promote its fixed strength, can fix both through the welding mode, for example be provided with the solder joint on one side, the opposite side corresponds the position and is provided with the welding hole, welds after fixing the position between the two for can fix between the two.

Referring to fig. 8 and 9, in some embodiments, the fixing portion of the first driving device D10 includes a motor housing at least partially received in the box-shaped circuit board body 220 and connected as the housing member with the at least two side walls (see the orientations indicated by a, b in the drawings) formed by the circuit board unit flexible board portion. The motor shell and the soft board part form a movable connection pair at least one joint part O1 and O2. According to one embodiment, the movable connection pair may be configured as a guide groove slider type hanging buckle mechanism, and includes a hook (indicated by J1-2 in fig. 8) provided on one side of the motor housing and a T-shaped or L-shaped hanging hole (indicated by J1-1 in fig. 8) provided on one side of the flexible board portion of the circuit board unit. The hanger may be configured to: comprising a guide post projecting from the surface of the motor housing and a locating post at an angle (preferably perpendicular) to the guide post. In this way, at least a movement of the hard plate portion (or the photosensitive chip) of the circuit board unit in two directions can be achieved. On the other hand, the side wall formed by the soft board part is connected with the motor shell, and can also play a role of keeping the shape of the box body. It should be noted that the outline and the dimension of the box-shaped circuit board main body are preferably adapted to the outline of the motor housing so as to be capable of accommodating the motor housing therein, and meanwhile, the box-shaped circuit board main body is also beneficial to keeping the shape of the box-shaped circuit board main body stable.

Fig. 4 shows a schematic perspective view of the camera module 100; FIG. 5 is an exploded view of the components of the camera module of FIG. 4; FIG. 6 is a schematic view of the camera module of FIG. 4 in section, showing the components assembled together: the lens assembly 10, the photosensitive assembly 20, the color filter 30 (which may be fixedly disposed to the photosensitive assembly, which together form a unit), the frame 40, and the base 50. Fig. 7 is a schematic cross-sectional view showing details of each component of the camera module shown in fig. 4.

As for the arrangement of the second drive device D20 in the camera module 100 or the photosensitive assembly 20, in addition to being arranged on the underside of the circuit-board structure as shown in fig. 2, it is also conceivable to arrange on the periphery or on the upper side of the circuit-board structure, as long as corresponding light-passing holes are provided and matched to the associated components in terms of structural design. For example, the second driving device D20 (including the fixed portion D20-1, the movable portion D20-2, and the driving member D20-3) shown in FIG. 7 is disposed on the peripheral side of the circuit-board structure.

Regarding the mounting and fixing of the wiring board itself in the camera module, it is also conceivable to connect the wiring board to the frame 40 of the camera module. In other embodiments, the frame 40 of the camera module has a hollow structure adapted to at least partially house the box-shaped circuit board body 220 (see, for example, fig. 5), and the inner side walls of the frame are connected to the at least two side walls (see, for example, the orientations indicated by a, b, and c in fig. 9) formed by the flexible board portion of the circuit board unit.

Similar to the connection of the circuit board unit and the motor housing of the first driving device described above, the inner side wall of the frame and the flexible board portion form a movable connection pair at least one joint. Similarly, according to one embodiment, the movable connection pair is configured as a guide groove slider type hanging buckle mechanism, and comprises a hook arranged on one side of the inner side wall of the frame and a T-shaped or L-shaped hanging hole arranged on one side of the soft board part of the circuit board unit. In this way, at least a movement of the hard plate portion (or the photosensitive chip) of the circuit board unit in two directions can be achieved. It should be noted that the outline and dimensions of the box-shaped circuit board body are preferably adapted to the inner contour of the module frame so as to be able to be accommodated in the frame, while also being beneficial to keeping the box-shaped circuit board body itself stable in shape.

In this case, a base 50 is expediently provided at the bottom of the frame 40, which base is designed as a base plate (see fig. 10, 11, 12 and 13) which mates with the bottom of the frame. The frame 40 and the base 50 may be fixedly coupled together by a snap-fit mechanism, as an example, fig. 12 shows a snap-fit aperture J2-2 provided on one side of the base 50, and fig. 13 shows a snap-fit projection J2-1 provided on one side of the frame 40.

Fig. 11 is a schematic perspective view showing a preassembled unit U of the camera module, which is formed by mounting the photosensitive assembly 20 and the base 50 shown in fig. 10 together with the camera module frame 40.

In this case, it is advantageous if the upper side and/or the lower side of the base plate has a heat dissipation structure at least in some areas and/or the inner side wall and/or the outer side wall of the frame has a heat dissipation structure at least in some areas. For example, the heat dissipation structure may be a concave-convex structure formed on the surface of the corresponding member (as shown in fig. 12 and 13, having concave-convex structures on the upper side 501 and the lower side 502 of the bottom plate), in such a way that the effective heat dissipation area is increased. In addition, a heat transfer material may be provided at a heat generating portion inside the image pickup module, the heat transfer material being in contact with the bottom plate and/or the frame. In view of the miniaturized structural design of the camera module and the structural configuration of the driving device of the camera module, the heat dissipation measures have important significance.

Accordingly, the present invention provides a method for optical adjustment of an image capturing module, comprising:

when a control signal is generated, the movement forms and movement amplitudes of the optical lens and the photosensitive chip are distributed and determined, and the first driving device and the second driving device are cooperatively controlled to drive the optical lens and the photosensitive chip to move so as to jointly adjust the relative positions between the lens assembly and the photosensitive assembly and achieve the optimal imaging position.

Fig. 14 shows a schematic block diagram of the method. Wherein, the position parameter a of the lens component and the photosensitive component can be obtained by a sensing element S such as a gyroscope ₀ The control device C calculates, distributes and determines the movement forms of the optical lens and the photosensitive chip, and the first driving device D10 and the second driving device D20 cooperate to drive the optical lens of the lens assembly 10 and the photosensitive chip of the photosensitive assembly 20 to move. In this process, the (variable) relative position parameter a of the lens assembly and the photosensitive assembly can also be adjusted more precisely _c Feedback to the control device via the sensing element or directly to the control device.

In particular, the method can be used for executing optical anti-shake adjustment on the camera module, wherein, a gyroscope component is utilized to acquire parameters of relative offset between a lens component and a photosensitive component of the camera module; the optical lens and the photosensitive chip are made movable at least in a plane perpendicular to the optical axis to jointly compensate for the relative offset between the optical lens and the photosensitive chip. In this case, it is preferable, for example, to move (translate and/or rotate) the optical lens and the photosensitive chip simultaneously in a plane perpendicular to the optical axis in opposite directions, so that a rapid optical anti-shake adjustment can be achieved.

Particularly, the method can also be used for executing focusing adjustment on the camera module, wherein parameters of the relative distance between the lens component and the photosensitive component of the camera module are obtained, and parameter measurement and calculation are carried out according to shooting imaging requirements; the optical lens and the photosensitive chip can move at least along the direction of the optical axis so as to jointly adjust the relative distance between the optical lens and the photosensitive chip. In this case, for example, the optical lens and the photosensitive chip can be moved simultaneously in the direction of the optical axis, and the directions of movement of the two are opposite, so that a rapid focusing adjustment can be achieved.

In the method of the present invention, it is desirable to drive the optical lens and the photosensitive chip so that the displacements thereof are kept at a fixed ratio.

In the method according to the invention, it can be provided that the optical lens and the light-sensitive chip are moved simultaneously until the light-sensitive chip has moved by a predetermined displacement, after which the first drive device still drives the optical lens to continue moving in the same direction or in the other direction in dependence on the corresponding control signal.

In addition, the invention also provides electronic equipment, which comprises the camera module 100. The electronic device can be a portable device such as a smart phone, a tablet computer and the like.

For an SMA actuator, one non-limiting example is now further described with reference to fig. 3:

the main driving principle of the SMA structure is as follows: the gyroscope senses the deflection, the SMA wires D20-31 are electrified to correct (the current magnitude influences the shrinkage of the memory alloy), and after correction is finished, the built-in springs (namely the elastic reset elements D20-32 in figure 3) reset the base to the original point. The structure comprises a fixed part and a movable part, wherein an SMA wire is connected between the movable part and the fixed part, and when the SMA wire is electrified, the SMA wire can correspondingly shrink or stretch based on a preset program so as to drive the movable part to move relative to the fixed part. As shown in fig. 3, four SMA wires D20 to 31 are provided around the driving device to provide driving force for movement of the movable portion, a stationary point F is provided on the base (which forms the fixed portion), and the movable point M is fixed to a portion of the circuit board (which forms the movable portion). Wherein, four SMA wires mutually support, realize the adjustment of movable part in the position of horizontal direction.

In this example, the adjustment in the 4 directions (+X, -X, +Y, -Y) is controlled by the contraction of four SMA wires, each of which contracts between a movable point and a stationary point, and finally the adjustment in the horizontal direction is achieved. The movable part of the driving device is connected with the hard circuit board of the photosensitive assembly, and when the movable part of the driving device drives the hard circuit board to move, the adjustment of the chip position can be realized. In order to enhance the flatness of the connection between the photosensitive assembly and the movable part of the driving device, a reinforcing plate, such as a steel plate structure, can be arranged at the bottom of the hard circuit board, so that the flatness between the circuit board and the driving device can be ensured, and the accumulated tolerance between the assembly is reduced.

In this case, the fixing portion of the driving device is connected to the base structure, which may be a type of circuit board, i.e. a circuit for supplying power to the driving device is arranged inside the base structure, so as to supply current during the operation of the driving device. When the circuit is designed, the circuit of the chip work and the circuit of the driving structure work are designed separately, so that the current supply in the shooting process can be ensured, and the quick work response can be realized by the cooperation of the circuit and the circuit. In the driving device, the movable point is fixed with the hard circuit board of the photosensitive assembly, when corresponding current is introduced into the SMA wire, the SMA wire is deformed, so that the movable point connected with the SMA wire is driven to move, the position of the chip is moved, and the anti-shake correction of the module in the shooting process is realized.

In this example, the surface of the movable part structure of the driving device can be fixedly connected with the back of the circuit board of the driving assembly, so that in order to ensure the reliability of the fixing between the movable part structure and the back of the hard circuit board, the larger the bonding area of the movable part is, the more firm the bonding between the movable part structure and the photosensitive assembly (or the photosensitive chip bearing part) is, and in this way, the reliability of the work of the camera module can be ensured.

In the camera module provided by the application, aiming at focusing and anti-shake functions, according to a corresponding driving structure and a control strategy, the camera module can be set: driving the optical lens and the photosensitive chip by using a first driving device and a second driving device respectively to cooperatively execute focusing and anti-shake function operations (dual AF driving and dual OIS driving configuration); the optical lens is driven by the first driving device only to execute focusing function operation, and the optical lens and the photosensitive chip are driven by the first driving device and the second driving device respectively to execute anti-shake function operation (single AF driving and double OIS driving configuration) in a co-operation mode; the optical lens is driven only with the first driving means to perform a focusing function operation, and the photosensitive chip is driven only with the second driving means to perform an anti-shake function operation (single AF driving and single OIS driving configuration).

For the camera module, on the basis of the design principle proposed by the present application, a non-limiting example will now be described:

the camera shooting module comprises a lens assembly, a photosensitive assembly, a first driving device and a second driving device. Still referring to the spatial coordinate system shown in fig. 5, the first driving device is configured to drive the lens to move in both x and y directions, the second driving device is configured to drive the photosensitive chip to move in both x and y directions, and further, the photosensitive chip can also be driven by the second driving device to rotate in the xoy plane. The optical anti-shake of the camera module is realized by driving the movement of the lens and the photosensitive chip. The lens and the photosensitive chip are configured to be driven simultaneously and move in opposite directions, e.g., the lens is driven to move in the positive x-axis direction while the photosensitive chip is driven to move in the negative x-axis direction; the lens is driven to move towards the positive direction of the y axis, and the photosensitive chip is driven to move towards the negative direction of the y axis; or the lens is driven to move in the x-axis and the y-axis, and the photosensitive chip is driven to move in the x-axis and the y-axis towards the direction opposite to the lens.

The camera module generally comprises a position sensor, and when the sensor detects that the camera module or the terminal generates shake, signals are sent to the control device to drive the lens and the photosensitive chip to move so as to compensate the shake, so that the purpose of optical shake prevention is achieved. In this example, through driving the camera lens and the sensitization chip remove simultaneously, and camera lens and sensitization chip remove simultaneously, can realize faster response, anti-shake effect is better. In addition, the anti-shake adjustment angle (the angle is generally expressed as the relative displacement between the lens and the photosensitive chip) range of the camera module is limited by the suspension system and the driving system, and a relatively large compensation angle range cannot be achieved. Moreover, in the conventional anti-shake system, the lens or the photosensitive chip is only translated in the x and y directions, and the compensation effect is poor when the camera module or the electronic device terminal tilts and shakes (rotates around the x axis and tilts around the y axis), if the lens or the photosensitive chip is required to move a large distance in the aspect of tilting and shaking, the lens or the photosensitive chip is driven to move in opposite directions at the same time, and the anti-shake system also has a good compensation effect on tilting and shaking.

In one embodiment, the lens and the light-sensing chip may be driven to move the same angular distance in opposite directions. Of course, the distance between the lens and the photosensitive chip may be set to be unequal, for example, the distance between the lens and the photosensitive chip is greater than the distance between the lens and the photosensitive chip, and in this case, the second driving device may select a smaller driver (such as MEMS, etc., usually with a smaller compensation angle range), which is beneficial to the miniaturization of the whole camera module. It can be further set that the ratio of the lens moving distance to the photosensitive chip moving distance is set to be kept in a fixed ratio, for example, 6:4, or 7:3, or 5:5, so that uniformity of the compensation effect can be realized in a compensable value range, and design difficulty of driving logic of the anti-shake system of the camera module can be reduced. As an alternative scheme, when the shake angle to be compensated by the camera module is below a certain preset value, the distance between the lens and the photosensitive chip is kept in a fixed proportion; if the shake angle to be compensated by the camera module is above the preset value, the first driving device drives the lens to move continuously after the common movement adjustment is executed, and the photosensitive chip is kept still, because the photosensitive chip may have reached the maximum movement distance.

In this example, the lens and the light-sensing chip are both arranged to move in a plane perpendicular to the optical axis, i.e. to translate along the x-axis and the y-axis. When the shake occurs, the camera module translates or rotates in the exposure time, so that the image surface shifts in the plane of the photosensitive chip, and the image is blurred. When the anti-shake system detects shake, the lens and/or the photosensitive chip are driven to translate, and the movement of the image surface on the photosensitive chip is compensated.

In another embodiment, the maximum angle (displacement) of the lens driven can be smaller than the maximum angle (displacement) of the photosensitive chip driven. If the lens is driven to achieve the anti-shake effect, the anti-shake system of the camera module has a high response speed. However, in high-end lenses, the lenses usually have a large number of lenses, for example, in some mobile terminals at present, the rear-end main shooting can achieve 8 lenses, and in addition, some lenses can even use glass lenses in order to improve imaging quality, which can result in large weight of the lenses, so that a driving device needs a large force when driving the lenses to move, a longer time is required for driving the lenses to reach a preset anti-shake position, and a photosensitive chip or a photosensitive assembly comprising a circuit board and the photosensitive chip is relatively light in weight and is relatively easy to drive the lenses to move to reach the preset position. Under the condition, the moving angle of the lens is smaller than the moving angle of the photosensitive chip, so that the response speed of the anti-shake system of the camera module can be improved. Moreover, because the lens is heavier, the moving distance of the lens is smaller than the moving distance of the chip, the lens and the chip can simultaneously start to move and simultaneously reach the designated position during anti-shake, thereby having better anti-shake effect. Furthermore, it should be noted that the conventional OIS module requires a larger angular movement of the lens to implement anti-shake, and accordingly, a driving component capable of providing a larger driving force and a larger-stroke suspension system are required, and in the present application, by reducing the angle of driving the lens movement, the selectable range of the first driving device is increased, for example, a coil magnet pair may be selected to drive; in addition, by reducing the angle of lens movement, the first driving device can be designed more compactly, which is beneficial to miniaturization of the camera module.

For the assembly structure of the second driving device in the photosensitive assembly, and the assembly manner of the entire camera module, a non-limiting example will be described below:

in this example, the second driving device D20 is disposed between the circuit board of the photosensitive assembly 20 and the base 50, various electronic components are disposed on the circuit board of the photosensitive assembly, and an extension portion is disposed on a side edge of the base 50, which can be used to accommodate the soft circuit board of the photosensitive assembly therein, and the connector is connected with an external power supply device to supply current during the chip operation. The photosensitive component part comprises a hard circuit board, a chip and the like, the color filter 30 can be fixedly arranged on the photosensitive component, the photosensitive component and the chip form a whole together, the chip can be adhered on the upper surface of the hard circuit board, and the chip is conducted with the circuit board by utilizing an electric wire. The molding process can be used for molding the wires for connecting the chip and the circuit board inside, and the molding seat is shaped into a structure suitable for mounting the color filters, so that the height of the module is reduced, the weight of the module is reduced, the shooting function of the shooting module can be realized, and the miniaturization of the module structure can be effectively realized.

In order to ensure the stability of the assembled camera module, the soft connecting belt after hot press molding needs to fix the structure of the soft connecting belt so that the soft connecting belt cannot deform in the subsequent working process.

As an example, fig. 11 shows the semi-finished structure of the camera module (preassembled unit U), where a frame 40 is added and combined, the frame can limit the flexible circuit board inside, it has a shape of the flexible circuit board after being hot-pressed, the inside of the frame is a hollow structure, the bottom is matched with the reserved bottom of the base, and the preset fastening structures on the three elements of the frame, the base and the flexible circuit board are mutually matched, and the flexible circuit board is fixed on the side edge inside the frame through the fastening on the base, thereby guaranteeing the stability of the whole structure. Wherein, each component is assembled according to the mode, after the second driving device is assembled on the photosensitive assembly, the second driving device is fixed in the frame, and then the semi-finished product structure of the camera module is formed.

The lens component is at least partially accommodated in the semi-finished product of the camera module in an assembled state, glue can be distributed in gaps between the lens component and the side edges of the frame by using a glue dispensing process, and then the lens component and the semi-finished product of the camera module are mutually fixed, so that a compact camera module structure is finally obtained.

The soft and hard circuit board setting mode, the color filter mounting mode and the fixed frame setting mode adopted in the embodiment are all beneficial to reducing the height size of the module, so that each part is highly integrated, and the miniaturization of the whole structure of the camera module is realized.

The solution for heat dissipation of the camera module is further described below:

according to some embodiments of the present invention, after the camera module is assembled, in order to ensure the stability of the overall structure of the camera module, the main structure of the camera module is accommodated in the housing structure, the camera module itself belongs to a precisely assembled electronic device, and therefore, the requirements on heat dissipation are relatively high, particularly, the heat in the miniaturized camera module structure can have a great influence on the performance of the camera module itself, and in order to effectively solve the problem, the present invention provides corresponding improvement measures for the structure of the camera module.

Specifically, the base fixed with the frame is set to be a plate (as shown in fig. 12) with a concave-convex structure surface, and in this way, the heat dissipation area of the base is increased, and the heat in the base can be conducted to the outside of the module structure more quickly, so that the shooting environment of the shooting module is stable. In addition to the configuration shown in the drawings, the base may be provided as a member having other uneven surfaces, such as a circular protrusion structure, while other modifications may be made to the base surface to increase the heat dissipation area thereof without guaranteeing that the movement of the photosensitive assembly is not affected.

By way of example, fig. 13 shows an embodiment of the assembly of the above-described base with a modular structure, wherein two opposite sides of the base are provided with receptacles capable of cooperating with corresponding structures on the modular frame to secure the base and frame together, while also protecting the internal structure and elements of the module; the base is provided with extension parts matched with the module frame structure on the two opposite sides of the base, and is used for packaging the module structure inside the base, so that the whole structure of the module is stable after assembly.

Besides the concave-convex surface heat dissipation structure arranged on the base, similar heat dissipation measures such as concave-convex surface structures can be arranged on other structures in the module, such as the positions of the inner side of the frame and the adjacent position of the soft board, so that the heat dissipation area of the module is increased and the heat dissipation in the module is accelerated. For example, the heat generated by the camera module can be transferred to the frame by using the heat transfer material, the concave-convex surface is arranged on the inner side of the frame, and the heat dissipation area of the inner side of the frame is increased, so that the heat generated in the module is conducted to the outside of the module, the heat dissipation speed is further increased, and the working environment in the module is ensured. If the heat transfer material is used to transfer the heat on the circuit board to the external frame, the heat transfer material may be disposed at a position of the combination of the soft board and the hard board, where one end of the heat transfer material contacts the circuit board and the other end contacts the external frame, and the specific heat transfer material is not limited in this application. Further, it is also conceivable to apply heat dissipation measures by adding a heat conductive gel to the heat generating portion or attaching a heat sink to the heat generating portion.

Although exemplary embodiments of the present application have been described above, it will be understood by those skilled in the art that various changes and modifications may be made to the exemplary embodiments of the present application without departing from the spirit and scope of the application, and all such changes and modifications are intended to be included within the scope of the present application.

The above description is only illustrative of the preferred embodiments of the present application and of the principles of the technology employed. It will be appreciated by persons skilled in the art that the scope of the application referred to in the present application is not limited to the specific combinations of the technical features described above, but also covers other technical features formed by any combination of the technical features described above or their equivalents without departing from the inventive concept. Such as the above-mentioned features and the technical features disclosed in the present application (but not limited to) having similar functions are replaced with each other.

Claims

1. A camera module, comprising:

a lens assembly including an optical lens having at least one optic; and

The camera module is characterized by comprising a first driving device arranged on the lens assembly and a second driving device arranged on the photosensitive assembly, wherein the first driving device can drive the optical lens to move, and the second driving device can drive the photosensitive chip to move, and the first driving device and the second driving device are controlled in a combined way: the motion forms and the motion amplitudes of the optical lens and the photosensitive chip are distributed and determined through a control device, so that the first driving device and the second driving device cooperate with each other to drive the optical lens and the photosensitive chip to move, and the relative positions of the optical lens and the photosensitive chip are adjusted together;

the circuit board unit includes:

a connector through which an electronic component on the wiring board main body is electrically connected to an external device;

the circuit board main body comprises a hard board part and a soft board part, the hard board part comprises the bearing part for accommodating the photosensitive chip, at least one first section of the soft board part is connected with the connector, at least one second section of the soft board part is connected with a frame of the camera module or a shell component fixed relative to the frame, and the second section is provided with an assembling structure for forming an active connection pair at least one joint part connected with the frame or the shell component;

And, the circuit board main body is in an open box body shape, the hard board part forms the bottom wall of the box body, the first section of the soft board part protrudes from one side of the box body and extends to the connector, and the second section of the soft board part forms at least two side walls of the box body.

2. The camera module of claim 1, wherein the first driving device is capable of driving the optical lens to translate in a plane perpendicular to an optical axis; and/or the second driving device can drive the photosensitive chip to translate in a plane perpendicular to the optical axis.

3. The image capturing module of claim 1, wherein the first driving device is capable of driving the optical lens to move along a direction of an optical axis; and/or the second driving device can drive the photosensitive chip to move along the direction of the optical axis.

4. A camera module according to claim 2 or 3, wherein the optical lens and the light sensing chip are synchronously driven and move in opposite directions.

5. The camera module of claim 4, wherein the displacement of the optical lens is greater than the displacement of the photosensitive chip.

6. The camera module of claim 4, wherein the displacement of the optical lens and the displacement of the photosensitive chip are maintained at a fixed ratio.

7. A camera module according to any one of claims 1 to 3, wherein the optical lens and the light sensing chip are capable of moving simultaneously until the light sensing chip has moved by a predetermined displacement, after which the first driving means is capable of driving the optical lens to continue moving in the same direction or in the other direction.

8. A camera module according to any one of claims 1 to 3, wherein the first driving means is capable of driving the optical lens to rotate in a plane perpendicular to the optical axis; and/or the second driving device can drive the photosensitive chip to rotate in a plane perpendicular to the optical axis.

9. A camera module according to any one of claims 1 to 3, wherein the first driving means is capable of driving the optical lens to tilt about a straight line perpendicular to the optical axis; and/or the second driving device can drive the photosensitive chip to tilt by taking a straight line perpendicular to the optical axis as a rotating shaft.

10. A camera module according to any one of claims 1 to 3, wherein the first drive means is configured as a voice coil motor, a ball motor or a MEMS actuator.

11. A camera module according to any one of claims 1 to 3, wherein the second drive means is configured as an SMA actuator.

12. A camera module according to any one of claims 1 to 3, wherein the second section of the flexible board portion has a reinforcing structure at least at a junction thereof with the frame or the housing member.

13. The camera module of claim 12, wherein the reinforcement structure is a locally thickened portion of the soft board portion plate or is a reinforcement additionally secured to the soft board portion plate.

14. A camera module according to any one of claims 1 to 3, wherein the mounting structure for forming the articulating pair comprises:

the support seat of the flexible suspension mechanism; or (b)

A hinge hole of the hinge mechanism; or (b)

T-shaped or L-shaped hanging holes of the guide groove sliding block type hanging and buckling mechanism.

15. A camera module according to any one of claims 1 to 3, wherein the electronic components are disposed on the hard plate portion, arranged around the photosensitive chip.

16. A camera module according to any one of claims 1 to 3, wherein the circuit board body is made of a planar rigid-flex board blank, which is formed into a box-like circuit board body by thermo-compression molding.

17. A camera module according to any one of claims 1 to 3, wherein the fixing portion of the first driving means includes a motor housing which is at least partially accommodated in the box-like wiring board main body and is connected as the housing member with the at least two side walls formed by the wiring board unit flexible board portion.

18. The camera module of claim 17, wherein the motor housing and the flexible board portion form a swing joint pair at least one joint.

19. The camera module of claim 18, wherein the movable connection pair is configured as a guide groove slider type hanging buckle mechanism, and includes a hook provided on one side of the motor housing and a T-shaped or L-shaped hanging hole provided on one side of the flexible board portion of the circuit board unit.

20. The camera module of claim 1, wherein the frame of the camera module has a hollow structure adapted to at least partially house the box-like circuit board body, and wherein an inner side wall of the frame is connected to the at least two side walls formed by the circuit board unit flexible board portion.

21. The camera module of claim 20, wherein the inner side wall of the frame and the flexible board portion form a movable connection pair at least one joint.

22. The camera module of claim 21, wherein the movable connection pair is configured as a guide groove slider type hanging buckle mechanism, and comprises a hook arranged on one side of the inner side wall of the frame and a T-shaped or L-shaped hanging hole arranged on one side of the flexible board part of the circuit board unit.

23. The camera module of claim 21, wherein a base is provided at the bottom of the frame, the base configured as a floor that mates with the bottom of the frame.

24. The camera module of claim 23, wherein the upper and/or lower side of the base plate has a heat dissipating structure at least at a partial surface and/or the inner and/or outer side walls of the frame have a heat dissipating structure at least at a partial surface.

25. Camera module according to claim 23 or 24, characterized in that a heat transfer material is provided at the heat generating location inside the camera module, which heat transfer material is in contact with the base plate and/or with the frame.

26. A method for optical adjustment of the camera module of any of claims 1 to 25, comprising:

27. The method of claim 26, wherein the method is used to perform an optical anti-shake adjustment of the camera module, wherein the gyroscope assembly is used to obtain parameters of the relative offset between the lens assembly and the photosensitive assembly of the camera module; the optical lens and the photosensitive chip are made movable at least in a plane perpendicular to the optical axis to jointly compensate for the relative offset between the optical lens and the photosensitive chip.

28. The method of claim 26, wherein the method is used for performing focusing adjustment of the camera module, wherein parameters of a relative distance between a lens assembly and a photosensitive assembly of the camera module are obtained and parameter measurement is performed according to shooting imaging requirements; the optical lens and the photosensitive chip can move at least along the direction of the optical axis so as to jointly adjust the relative distance between the optical lens and the photosensitive chip.

29. A method as claimed in claim 27 or 28, wherein the optical lens and the photo-sensing chip are driven with a fixed ratio of displacement.

30. A method according to claim 27 or 28, wherein the optical lens and the light-sensing chip are caused to start moving simultaneously until the light-sensing chip has moved by a predetermined displacement, after which the first driving means still drives the optical lens to continue moving in the same direction or in the other direction in dependence on the respective control signal.

31. An electronic device comprising the camera module of any one of claims 1 to 25.